JP2006261646A - Mounting condition determining method, mounting condition determining apparatus and part mounting machine - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To determine a mounting condition so that the condition approximates to a reference value of a parameter concerning power consumption. <P>SOLUTION: The mounting condition determining method for determining a mounting condition of a facility for mounting components on a substrate includes a reference value acquiring step of acquiring a reference value of a parameter concerning power consumption required for mounting the components; an actual value acquiring step for acquiring the value of the parameter on the basis of an actual mounting condition; and a mounting condition determining step for determining a new mounting condition on the basis of a result of comparing the reference value with the actual value. The parameter concerning the power consumption is a production time. The reference value acquiring step acquires a target production time permissible for the production of a mounting substrate. The actual value acquiring step acquires an actual production time in actually producing a mounting substrate on the basis of the number of used beams which is the mounting condition. The mounting condition determining step determines the number of used beams so that the acquired actual production time may not exceed the target production time. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a mounting condition determination method for equipment for mounting components on a board, and more particularly to a mounting condition determination method applied to a component mounting machine including a plurality of beams to which mounting heads are attached.

  Conventionally, in a component mounter that mounts electronic components that correspond to the shortening of the life cycle of digital products on a printed circuit board or other substrate, the throughput is improved from board loading to mounting board mounting with components mounted. In order to achieve this, a plurality of beams may be provided on one component mounter.

  In this way, if a plurality of beams are provided in one component mounter, the wasteful space generated by arranging a large number of component mounters can be omitted. Since the electronic components can be mounted on one substrate in cooperation with each other, it is possible to eliminate the wasted time and produce the mounting substrate more efficiently and quickly.

A component mounter equipped with multiple beams like this further optimizes the arrangement order of component cassettes and component tapes for supplying components mounted on the component mounter, and optimizes the component mounting order and the distribution of components to each beam. Thus, throughput is improved by avoiding unnecessary time as much as possible (see, for example, Patent Document 1).
JP 2002-50900 A

  However, in an actual manufacturing site, the production amount (order received) of the mounting board is not constant, and when the production amount is small, there is a case where it is not necessary to fully operate the component mounting machine. However, such a case is usually dealt with by fully operating the component mounting machine to produce all of the ordered mounting boards, and then stopping the component mounting machine and performing production adjustment.

  In this way, if a time during which the component mounting machine is not operated occurs, the power for that time is not consumed and the power consumption of the whole factory is reduced, but the power consumption required for one board is the component. Since the mounting machine is in full operation, nothing changes. In addition, the operator usually has to be resident during the time when the component mounter is not in operation, and there are some factory facilities that need to be kept in operation, so simply stopping the component mounter reduces the cost of a single board. The effect is not expected.

  In addition, it is thought that it is possible to reduce the power consumption of a single board by slowly operating the component mounting machine to produce the mounting board, but it is possible to reduce the mounting speed by simply reducing the operating speed of the component mounting machine. In relation to board production, it may take time to produce more than necessary and may not be in time for delivery, and it is not easy to adjust the reduction in operating speed.

  In view of the above problems, the inventors of the present application have found that reducing the number of beams used in a component mounter is particularly effective in reducing power consumption. As a result of further research, the present invention has been completed. It came. That is, in order to solve the above-mentioned problems, the present invention uses the time margin generated due to the change in the order quantity, etc., and effectively reduces the power consumption for one board while reducing the number of mounting boards required before delivery. The purpose is to provide a method for determining mounting conditions that can be secured.

  In order to achieve the above object, a mounting condition determining method according to the present invention is a mounting condition determining method for determining a mounting condition of equipment for mounting a component on a board, and includes a parameter for power consumption required for mounting the component. A reference value acquisition step for acquiring a reference value, an actual value acquisition step for acquiring the value of the parameter based on a current mounting condition, and an implementation for determining a new mounting condition based on a result of comparing the reference value and the actual value Including a condition determining step, wherein the parameter related to the power consumption is a production time, the reference value obtaining step obtains a target production time allowed for the production of the mounting board, and the actual value obtaining step comprises the mounting The condition is the number of used beams, and the actual production time for actual production of the mounting board is acquired based on the number of used beams, and the mounting condition determining step Production time and determines the use number of beams so as not to exceed the target production time.

  This makes it possible to determine the number of beams that approaches a reference value of a parameter related to power consumption, and to effectively reduce power consumption and reduce costs.

  In addition, it is possible to suppress the power consumption of the component mounting machine by reducing the number of beams used while satisfying time constraints such as delivery time.

  Furthermore, a fastest mounting condition determining step for determining mounting conditions based on conditions for using all beams, a fastest production time calculating step for calculating the fastest production time based on the fastest mounting conditions, the target production time, and the fastest production And a used beam number acquisition step of acquiring the number of beams to be used based on time.

  Thereby, since the number of used beams can be estimated in advance, the time required to obtain the final mounting conditions can be shortened.

  Further, it may include a used beam receiving step for receiving selection of which beam to use and a used beam number acquiring step for acquiring the number of used beams from the received used beam.

  This makes it possible to select a beam to be used artificially. For example, by using only the beam existing on one side with respect to the transport direction, it becomes easy to access the component supply unit corresponding to the beam to be used. It is possible to reflect the ease of operator's work in determining the mounting conditions.

  Furthermore, a mounting condition may be determined by adding a condition that the beam on one side is used with priority in the substrate transport direction.

  This increases the possibility of shortening the actual production time obtained from the determined mounting conditions rather than simply reducing the number of beams used at random, which can further reduce the number of beams used. Sexuality increases. As a result, it becomes possible to increase the power consumption suppression effect.

  Furthermore, it is desirable to include a power cut-off step of cutting off power supplied to the beam determined not to be used.

  As a result, not only the beam to be used is determined, but also the power supplied to the unused beam can be reliably cut off, so that the power consumption can be reliably suppressed.

  Furthermore, a power cut-off step of cutting off the power supplied to the sub-equipment having a beam determined not to be used may be included.

  As a result, not only the beam to be used is determined, but also the power supplied to the sub-equipment corresponding to the beam that is not used can be reliably cut off, so that the power consumption can be more reliably suppressed.

  In order to achieve the above object, a mounting condition determining method according to the present invention is a mounting condition determining method for determining a mounting condition for a facility for mounting a component on a board, and reduces power consumption required for mounting the component. A reference value acquisition step for acquiring a reference value of the parameter concerned, an actual value acquisition step for acquiring the value of the parameter based on the current mounting condition, and a new mounting condition based on a result of comparing the reference value and the actual value. A mounting condition determining step to determine, wherein the parameter relating to the power consumption is a production time of the entire mounting line, and the reference value acquiring step is a target production time allowed for the production of the mounting board in the mounting line. The actual value acquisition step uses the mounting conditions as the number of facilities on the mounting line, and the actual production time for actual production of the mounting board based on the number of facilities. Tokushi, the mounting condition determining step is characterized by actual production time that is acquired and a using facility number determining step of determining a number of facilities so as not to exceed the target production time.

  As a result, it is possible to suppress power consumption of the entire mounting line by reducing the number of facilities used in the mounting line while satisfying time constraints such as delivery time.

  In order to achieve the above object, a mounting condition determining method according to the present invention is a mounting condition determining method for determining a mounting condition for a facility for mounting a component on a board, and reduces power consumption required for mounting the component. A reference value acquisition step for acquiring a reference value of the parameter concerned, an actual value acquisition step for acquiring the value of the parameter based on the current mounting condition, and a new mounting condition based on a result of comparing the reference value and the actual value. A mounting condition determining step to determine, wherein the parameter related to the power consumption is a production time, and further, a mounting completion detecting step for detecting that mounting of all components to be mounted has been completed as mounting completion, and mounting completion And a power cut-off step of cutting off power supplied to the beam when the subsequent production standby time exceeds a reference value.

  As a result, even when a sudden production delay occurs due to an accident of any of the devices incorporated in the mounting line, it is possible to suppress power consumption by cutting off the power supplied to the beam.

  The above object can be achieved not only as such a mounting condition determining method, but also as a mounting condition determining device that determines a mounting condition by the method and a component mounting machine including the device. Further, the mounting condition determination method can be realized as a program and a storage medium for storing the program, and a production method for producing a production board using the method, a production apparatus, a program, and a memory for storing the program It can also be realized as a medium.

  According to the present invention, the power consumption of the component mounter can be suppressed by limiting the number of beams used while satisfying the limitation of producing a predetermined number of boards by a predetermined time limit.

(Embodiment 1)
Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 is an external view showing a configuration of the entire mounting line 2010 according to the embodiment of the present invention.

  The mounting line 2010 is a production line for mounting electronic components while sending the substrate 120 from upstream to downstream, and a plurality of component mounting machines 2100 and 2200 as equipment for mounting components on the substrate, At the start, etc., mounting conditions such as the number of beams to be used and mounting order of electronic components are determined based on various databases, and the obtained NC (Numeric Control) data is downloaded to the component mounting machines 2100 and 2200 for setting and control. And a mounting condition determining device 2300.

  The component mounting machine 2100 includes two component supply units 2115 each having an arrangement of component cassettes 2114 for storing component tapes, and a plurality of suction nozzles (hereinafter referred to as “suction nozzles”) that can suck electronic components from these component cassettes 2114 and mount them on the substrate 120. , Simply referred to as a “nozzle”), a two-dimensional or three-dimensional inspection of a suction state of a component 2 attached to the multi-mounting head 2112 and a beam 2113 to which the multi-mounting head 2112 is attached. And a tray supply unit 2117 for supplying tray components. The tray supply unit 2117 and the like can be arbitrarily attached and detached.

  Here, the “component tape” is actually a plurality of components of the same component type arranged on a tape (carrier tape) and supplied in a state of being wound around a reel (supply reel) or the like. The It is mainly used to supply a relatively small size component called a chip component to a component mounter.

  Specifically, the component mounter 2100 is a mounter having the functions of both a component mounter called a high-speed mounter and a component mounter called a multi-function mounter. A high-speed mounting machine is a facility characterized by high productivity that mainly mounts electronic parts of □ 10 mm or less at a speed of about 0.1 seconds per point. A multi-function mounting machine is a large model of □ 10 mm or more. It is equipment for mounting electronic parts, odd-shaped parts such as switches and connectors, and IC parts such as QFP (Quad Flat Package) and BGA (Ball Grid Array).

  In other words, the component mounting machine 2100 is designed to be able to mount almost all kinds of electronic components (from 0.4 mm × 0.2 mm chip resistor to 200 mm connector as components to be mounted) A mounting line can be configured by arranging a required number of the component mounting machines 2100.

  Since the configuration of component mounter 2200 is the same as that of component mounter 2100, detailed description thereof will not be repeated.

FIG. 2 is a plan view showing the main configuration of the component mounter 2100.
The component mounter 2100 includes sub-equipment arranged in the substrate transfer direction (X-axis direction) inside, and further includes sub-equipment in the front-rear direction (Y-axis direction) of the component mounter 2100. , A total of four sub-equipment 2110a, 2110b, 2120a, 2120b are provided. The sub-equipment (2110a and 2110b, 2120a and 2120b) arranged side by side in the X-axis direction is independent from each other, and different mounting operations can be performed at the same time. On the other hand, the sub-equipment (2110a and 2120a, 2110b and 2120b) arranged facing each other in the front-rear direction (Y-axis direction) cooperates with each other to perform a mounting operation on one board.

  Each sub-equipment 2110a, 2110b, 2120a, 2120b has a beam 2113, a multi-mounting head 2112, a component supply unit 2115, and a beam motor for driving the beam for each of the sub-equipment 2110a, 2110b, 2120a, 2120b. Not shown). Although a head motor for driving the multi-mounting head 2112 is also provided, the head motor is not shown. Although not shown in the figure, a component recognition camera 2116 for inspecting the suction state of the component sucked by the multi-mounting head 2112 two-dimensionally or three-dimensionally and a replacement nozzle are held. Each sub-equipment is equipped with equipment such as a nozzle station that can perform all kinds of mounting work. In addition, the component mounter 2100 is provided with a pair of rails 2121 for transporting the substrate 120 between the front and rear sub-equipment.

  Note that the component recognition camera 2116, the tray supply unit 2117, and the like are not directly related to the present invention and are not shown in the drawing.

  The beam 2113 is a rigid body extending in the X-axis direction and moves on a track (not shown) provided in the Y-axis direction (perpendicular to the conveyance direction of the substrate 120) while being parallel to the X-axis direction. And can be driven by the beam motor described above. Further, the multi mounting head 2112 attached to the beam 2113 can be moved along the beam 2113, that is, in the X-axis direction. The multi mounting head 2112 can be moved freely within the XY plane by moving the multi mounting head 2112 in the X-axis direction. The beam 2113 is provided with a plurality of motors such as a beam motor (not shown) for driving them, and electric power is supplied to these motors and the like via the beam 2113.

  FIG. 3 is a schematic diagram showing the positional relationship between the multi mounting head 2112 and the component cassette 2114.

  The multi-mounting head 2112 can mount a plurality of suction nozzles 2112a to 2112b, and electronic components corresponding to the maximum number of suction nozzles 2112 are simultaneously mounted from each of the component cassettes 2114 (by one up and down movement). Can be adsorbed.

  The multi-mounting head 2112 can move along the beam 2113, and this movement is driven by a motor (not shown). Further, the vertical movement when the electronic component is sucked and held or when the held electronic component is mounted on the substrate 120 is also driven by the motor.

FIG. 4 is a block diagram illustrating a functional configuration of the mounting condition determining apparatus 2300.
The mounting condition determining apparatus 2300 shown in the figure determines new mounting conditions based on the result of comparing the reference value and the actual value for the parameters related to power consumption under various restrictions based on the specifications of the component mounter 2100. A power consumption suppression unit 2210, a calculation control unit 2301, a display unit 2302, an input unit 2303, a memory unit 2304, a program storage unit 2305 storing a power consumption suppression program, a communication I / F 2306, and a database unit 2307.

  Here, the “mounting conditions” indicate all conditions related to the mounting of electronic components, such as the mounting order of electronic components, the moving speed (acceleration) of the multi-mounting head 2112 that has attracted the electronic components, and whether or not each beam 2113 is used. Yes.

  The power consumption suppression unit 2210 is realized by executing the power consumption suppression program according to the present embodiment, and functions as a simulator of the component mounter 2100. Details will be described later.

  The arithmetic control unit 2301 is a CPU (Central Processing Unit), a numerical processor, or the like, and controls each component according to an instruction from the user.

  In addition, the arithmetic control unit 2301 creates a part library and the like, and stores it in the database unit 2307.

  The display unit 2302 is a CRT, LCD, or the like, and the input unit 2303 is a keyboard, mouse, touch panel, or the like. These are used to input control data for the component mounter 2100 in addition to the target production time, the number of circuit boards to be produced during the production time, the beam to be used, etc. while interacting with an operator or the like. .

The memory unit 2304 is a RAM or the like that provides a work area for the arithmetic control unit 2301.
The program storage unit 2305 is a hard disk or the like that stores various determination programs that implement the functions of the mounting condition determination device 2300.

  The communication I / F unit 2306 is a processing unit that transmits the data created by the power consumption suppression unit 2210 to the component mounter 2100 and receives various data transmitted from the mounting line 2010.

  The database unit 2307 is a hard disk or the like that stores data determined in advance, such as a component library used for determination processing by the mounting condition determination apparatus 2300, mounting order generated by the determination, and the like.

FIG. 5 is a block diagram illustrating in detail the functional configuration of the power consumption suppression unit 2210.
The power consumption suppression unit 2210 shown in the figure is a processing unit that determines the optimal number of used beams based on various pieces of acquired information, and further performs processing for determining other mounting conditions using the determined used beam as a constraint. Part. The power consumption suppression unit 2210 includes a target production time acquisition unit 2211, a used beam number acquisition unit 2212, a mounting condition determination unit 2213, an actual production time calculation unit 2214, and a used beam determination unit 2215.

  The target production time acquisition unit 2211 is a processing unit that is a reference value for production time, which is a parameter related to power consumption, and acquires target production time at which all of the predetermined circuit boards must be produced. The target production time is a time longer than the time required when the total number of circuit boards is produced in the maximum performance state of the component mounting machine 2100. The target production time is comprehensively derived from the number of orders for circuit boards, the number of days of factory operation, and the like.

  The used beam number acquisition unit 2212 is a processing unit that acquires the number of used beams as an initial value for determining mounting conditions. For example, the operator selects a beam to be used arbitrarily based on a screen as shown in FIG. The number of used beams obtained by doing this, and the number of beams calculated from the fastest production time and the target production time calculated based on the maximum performance of the component mounting machine 2100 are obtained.

  The mounting condition determination unit 2213 is a processing unit that determines the mounting order of electronic components and the arrangement order of the component cassettes 2114 in the component supply unit 2115 according to a known method based on the number of beams obtained from the used beam number acquisition unit 2212 and the like. .

  Based on the mounting conditions determined by the mounting condition determination unit 2213, the actual production time calculation unit 2214 simulates the component mounting operation in the component mounter 2100, and calculates the actual production time as the actual value of the circuit board. Part.

  The used beam determination unit 2215 compares the target production time obtained from the target production time acquisition unit 2211 with the actual production time obtained from the actual production time calculation unit 2214, and minimizes the actual production time not exceeding the target production time. It is a processing part which determines the number of beams.

Next, the operation of the power consumption suppression unit 2210 configured as described above will be described.
FIG. 7 is a flowchart showing a processing procedure of the mounting condition determining apparatus 2300, particularly the power consumption suppressing unit 2210.

  First, the operator (operator) selects the delivery date designation mode using the input unit 2303, the display unit 2302, and the like (S701). When the delivery date designation mode is selected, a screen as shown in FIG. 6 is displayed on the display unit 2302. Then, using this screen, the operator inputs a delivery date (designated production completion time), an operation time per day of the mounting line, the number of boards to be produced by the delivery date, etc. (S702).

Next, the operator inputs an unused beam based on the screen (FIG. 6) (S703).
A screen (FIG. 6) reflecting the input result is displayed on the display unit 2302 (S704).

  Next, the mounting condition determining unit 2213 determines the mounting conditions with the number of beams selected on the screen (FIG. 6) and the arrangement of the beams as constraints (S705).

  The actual production time calculation unit 2214 calculates the actual production time based on the determined mounting condition (S706).

  The used beam determining unit 2215 determines whether or not the calculated actual production time exceeds the target production time (S707), and if not (S707: N), the mounting condition including the number of currently used beams is held. Further, the number of beams to be used is decreased by 1, and this value is returned to the used beam number acquisition unit 2212 (S708). On the other hand, if it exceeds (S707: Y), it is confirmed whether or not the mounting conditions including the number of used beams previously held are held (S709). If there is no mounting conditions to be held (S709: N). The number of beams is increased by 1, and this value is returned to the used beam number acquisition unit 2212 (S710).

  The above process is repeated, and if the actual production time exceeds the target production time and there is a mounting condition to be held (S709: Y), the condition is determined as the final mounting condition (S711).

  Next, a screen as shown in FIG. 8 is displayed, and it is accepted whether or not to perform production in the power saving mode determined by decreasing the number of beams (S712).

  When the power saving mode is adopted (S712: Y), the power supplied to the unused beam is cut off (S713).

  The mounting condition held last is transmitted to the component mounter 2100 via the communication I / F unit 306, and a signal for stopping the supply of power is transmitted to each unused beam (S714).

  When the power saving mode is not adopted (S712: N), the determination using all beams is made according to a normal method, and the mounting condition is transmitted.

  In the present embodiment, the initial beam can be arbitrarily selected. However, the initial beam may be set to a minimum value and the number of beams may be increased until the target time is reached.

  If the component mounter 2100 actually mounts electronic components on the board based on the above apparatus configuration and the mounting conditions obtained by these operations, the beam 2113 that uses all the circuit boards that have been ordered while keeping the delivery date. Can be produced in a reduced state, and power consumption can be effectively suppressed.

  The electric power supplied to the beam 2113 is supplied not only to the electric power of the motor that moves the beam itself in the Y-axis direction, but also to the motor that drives the multi mounting head 2112 that travels along the beam 2113, illumination, and the like. The interruption of the electric power has a great effect of suppressing the power consumption.

  In addition, even if the circuit board production is the same, the power consumption is reduced, so that the power used per circuit board can be reduced.

  Furthermore, the life of the component mounting machine 2100 can be extended. In other words, if there is a time margin in production, this time will be used effectively, and several beams will be put into a dormant state, thereby suppressing the increase in the total operating time of this beam and replacing the beam replacement parts. The frequency can be lowered. Therefore, the product life of the component mounter 2100 can be extended by rotating the beam that is not used each time this margin time occurs.

  As described above, it is possible to suppress power consumption by the embodiment according to the present invention, and finally it is possible to effectively reduce the cost of the circuit board, and also consider the environment through energy saving. Is something that can be done.

  In addition, although the said embodiment demonstrated based on the aspect in which the power consumption suppression part 2210 was integrated in the mounting condition determination apparatus 2300 which manages the mounting line 2010, this invention is not necessarily limited to the said embodiment. For example, it may be incorporated inside the component mounter 2100.

  In the above embodiment, the case where the power supplied to the beam 2113 is cut off has been described as an example. However, the power supplied to the sub-equipment 2110a, 2110b, 2120a, 2120b including the beam 2113 may be cut off. In this case, the possibility of further reducing power consumption increases.

  Moreover, although the said embodiment determined the number of beams used in order to attain power saving, this invention is not limited to this. For example, in order to save power in the entire component mounting line, the number of facilities to be used may be determined in a mounting line including facilities including a component mounting machine. Further, in the description of the above embodiment, if the component mounter is a mounting line and the beam is an equipment such as a component mounter provided in the mounting line, the description of the embodiment can be substituted.

(Embodiment 2)
Next, another embodiment according to the present invention will be described. Since the apparatus configuration is the same as that of the above embodiment, the description thereof is omitted, and the drawings used in the above embodiment are referred to by reference numerals as appropriate.

  FIG. 9 is a flowchart showing a processing procedure of the mounting condition determining apparatus 2300, particularly the power consumption suppressing unit 2210.

  First, using the screen (FIG. 6) shown on the input unit 2303 and the display unit 2302, the operator (operator) inputs the delivery date, the operating time per day of the mounting line, the number of boards produced by the delivery date, and the like. (S2901).

  The target production time acquisition unit 2211 calculates a target production time that is a time for producing the necessary number of substrates from the data (S2902).

  Next, the mounting condition determination unit 2213 determines the mounting conditions so that the circuit board can be produced at the highest speed using all the beams held by the component mounting machine 2100 (S2903).

  The actual production time calculation unit 2214 calculates the fastest actual production time of the circuit board based on the determined mounting condition (S2904).

  The used beam number acquisition unit 2212 determines the number of used beams as an initial value from the ratio between the target production time and the fastest production time (S2905). For example, the result obtained by dividing the fastest production time by the target production time is multiplied by 4 which is the total number of beams, and an integer obtained by rounding down the decimal point of the obtained numerical value is determined as the number of beams.

  Next, it is set that beams are used by the number of beams determined in order from the sub-equipment 110 on the front side of the component mounting machine 2100, and the situation is displayed on the screen as shown in FIG. 10 (S2906). Thus, by preferentially selecting the beam arranged on one side with respect to the transport direction of the substrate 120, an improvement in throughput can be expected. This is because the beams arranged in the X-axis direction (conveying direction) can be independently mounted on different substrates 120 without being influenced by each other, so that the other beam stops working while one beam is working. There is no need to wait. On the other hand, because the beams arranged in the Y-axis direction perform the mounting operation in cooperation with one substrate 120, waste of waiting for the operation of one beam by another beam occurs.

  Next, the operator who confirms the screen determines the position of the beam to be used at this stage, for example, because the rear sub-equipment 2120 is easier to set up the component cassette 2114 than the front sub-equipment 2110. It is also possible to change.

  If the operator determines that there is no problem with the displayed contents, the mounting condition determination unit 2213 determines the mounting conditions by using the reduced number of beams and the arrangement of the beams as constraints (S2907).

  The actual production time calculation unit 2214 calculates the actual production time based on the determined mounting condition (S2908).

  The used beam determining unit 2215 determines whether the calculated actual production time exceeds the target production time (S2909), and if it exceeds (S2909: Y), the used beam number acquiring unit increases the number of beams by one. This value is returned to 2212 (S2910).

  On the other hand, if not exceeded (S2909: N), the mounting conditions including the current number of used beams are determined (S2911).

  Finally, the mounting conditions are transmitted to the component mounting machine 2100 via the communication I / F unit 2306, and a signal for stopping the supply of power is transmitted to each unused beam (S2912).

The effect of the mounting conditions obtained by the above operation is the same as the effect of the above embodiment.
Furthermore, in this embodiment, the minimum number of beams used is calculated in advance by a simple method, so that the number of steps can be reduced and the mounting conditions can be obtained more comfortably.

(Modification)
Furthermore, in order to enhance the energy saving effect, after determining the mounting conditions including the number of beams, the mounting conditions may be further changed and determined.

  For example, when a beam to be used across a plurality of component mounters 2100 is selected as shown in FIG. 10, the number of component mounters 2100 to be operated is reduced by consolidating the beams to be used as shown in FIG. Also good.

  If the beams facing each other are used in this way, it is necessary to alternately mount components on one board 120, and the actual production time is extended. However, even if the actual production time is extended, the power of one component mounter 2100 can be turned off if it falls within the target production time, so that the energy saving effect can be further enhanced.

  Furthermore, when the number of beams is aggregated, it is desirable to balance the number of tasks between the beams.

  Specifically, as shown in FIG. 15, when the number of tasks on the front side (Front) of the opposite beam is 8 times and the number of tasks on the rear side (Rear) is 10 times as a result of collecting the beams, It is desirable to balance the tasks by setting the number of tasks to nine.

  In this way, in the case of 8 times on the front side and 10 times on the back side, the front beam can be alternately mounted up to 8 times, but from the 9th time, the front beam is stopped and only the back side is 2 times. The waste of mounting can be eliminated, and the mounting time of the component mounter 2100 as a whole can be shortened. Therefore, the idle time can be used to further reduce power consumption, such as reducing acceleration.

  Furthermore, as shown in FIG. 16, task balance in a plurality of component mounters 2100 may be considered. That is, as shown in FIG. 16A, when the tasks of each beam are disjoint, tasks are exchanged between a plurality of component mounters 2100 so that the tasks are aligned before and after the beam as shown in FIG. 16B. It doesn't matter. Furthermore, as shown in FIG. 16C, task balance may be considered in all of the plurality of component mounters 2100.

  By doing so, it becomes possible to improve the throughput of the entire component mounting line and generate idle time. Therefore, it is possible to further reduce power consumption by using idle time.

(Embodiment 3)
Next, another embodiment according to the present invention will be described. Since the apparatus configuration is the same as that of the above embodiment, the description thereof is omitted, and the drawings used in the above embodiment are referred to by reference numerals as appropriate.

FIG. 11 is a block diagram schematically showing a mounting line.
As shown in the figure, the mounting line 2010 includes four component mounting machines 2100, and includes a solder printer 3101 and an adhesive applicator 3102 necessary for the previous process, and a reflow device 3103 required for the subsequent process. It has.

  The mounting condition determination device 2300 can determine not only the mounting conditions of each component mounting machine 2100 but also the mounting conditions by comprehensively determining the mounting conditions of the four component mounting machines 2100. Yes. The mounting condition determining apparatus 2300 includes a mounting line monitoring unit 3200 that monitors the operation state of each device that can be provided in the mounting line 2010.

FIG. 12 is a block diagram showing the functional configuration of the mounting line monitoring unit 3200 in detail.
As shown in the figure, the mounting line monitoring unit 3200 includes a mounting completion detection unit 3201 and a production standby detection unit 3202.

  The mounting completion detection unit 3201 is a processing unit that detects that all components to be mounted have been mounted, that is, the mounting process of the corresponding substrate 120 for each component mounting machine 2100 has been completed.

  The production standby detection unit 3202 is a processing unit that detects a production standby state in which any of the component mounting machines 2100 has not been newly produced for a predetermined time (for example, 10 seconds). Specifically, by detecting the timing of loading and unloading of each component mounting machine 2100, production standby is detected based on this timing.

  Next, the power consumption suppression operation of the mounting line 2010 configured as described above will be described.

  FIG. 13 is a sequence diagram illustrating a processing procedure between the component mounter 2100 and the mounting line monitoring unit 3200 included in the mounting condition determination device 2300 when production standby occurs in the mounting line 2010.

  First, some trouble has occurred in any of the devices in the mounting line 2010 (for example, the adhesive applicator 3102), but each component mounting machine 2100 still has a board 120 to be produced, And so on. Therefore, for the component mounting machine 2100 in which no defect has occurred, the component is mounted on the board 120 that has already been carried in regardless of the defect occurrence (S1301).

  When all the electronic components scheduled on the board 120 that has been carried into the component mounter 2100 are mounted, the component mounter 2100 transmits a production completion signal to the mounting condition determination device 2300 (S1302).

  The mounting completion detection unit 1201 of the mounting line monitoring unit 3200 stands by until a production completion signal is received (S1303: N). If the production completion signal is received (S1303: Y), the component mounting that has issued the signal is mounted. Time counting is started for the machine 2100 (S1304).

  If at least one of the carry-in signal or the carry-out signal does not arrive from the same component mounter 2100 even after 10 seconds from the start of time counting (S1305: N), the mounting line monitoring unit 3200 displays the corresponding component mounter 2100. In order to cut off the power supplied to all the beams, a full power cut-off signal is transmitted to the component mounter 2100 (S1306). Here, if a malfunction occurs upstream from the component mounter in question and production is on standby, no carry-in signal arrives, and if a malfunction occurs downstream, a carry-out signal arrives. Will not.

  The corresponding component mounter 2100 refers to a component mounter 2100 that has not transmitted at least one of a carry-in signal or a carry-out signal within a predetermined time.

  As described above, by monitoring the production standby of the mounting line 2010 and cutting off the power supplied to the beam if the standby occurs, the power consumption can be effectively suppressed even if a sudden accident occurs. it can.

  In this embodiment, the mounting line monitoring unit 3200 is provided in the mounting condition determining apparatus 2300. However, the present invention is not limited to this, and the mounting line monitoring unit 3200 is provided in each component mounting machine 2100. Alternatively, it may be possible to detect a production standby due to a failure occurring upstream or downstream of itself and to cut off the power supplied to the beam.

  The present invention can be applied to a component mounter that mounts components on a substrate, and in particular, can be applied to a component mounter having a plurality of beams.

It is an external view which shows the structure of the whole mounting line concerning embodiment of this invention. It is a top view which shows the main structures inside a component mounting machine. It is a perspective view which shows typically the positional relationship of a multi mounting head and a component cassette. It is a block diagram which shows the functional structure of a mounting condition determination apparatus. It is a block diagram which shows the functional structure of a power consumption control part in detail. It is a figure which shows the example of an input screen. It is a flowchart which shows the process sequence of a mounting condition determination apparatus, especially a power consumption control part. It is a figure which shows the example of a screen of whether to apply power saving mode. It is a flowchart which shows the process sequence of the mounting condition determination apparatus concerning other embodiment, especially a power consumption control part. It is a figure which shows the example of a display screen of the beam used tentatively determined. It is a block diagram which shows a mounting line. It is a block diagram which shows the functional structure of a mounting line monitoring part. It is a sequence diagram which shows the exchange of a component mounting machine and a mounting line monitoring part. It is a figure which shows the state which concentrated the used beam. It is a figure which shows an example of a task balance. It is a figure which shows the other example of a task balance.

Explanation of symbols

2010 mounting line 120 substrate 2100 component mounting machine 2110 front sub-equipment 2112 multi-mounting head 2113 beam 2114 component cassette 2116 camera 2117 tray supply unit 2120 rear sub-equipment 2115 supply unit 2121 rail 2300 optimization device 2210 power consumption suppression unit 2211 target production time Acquisition unit 2212 Use beam number acquisition unit 2213 Mounting condition optimization unit 2214 Actual production time calculation unit 2215 Use beam number determination unit 2301 Operation control unit 2302 Display unit 2303 Input unit 2304 Memory unit 2305 Program storage unit 2306 Communication I / F
2307 Database unit 3101 Solder printer 3102 Adhesive applicator 3103 Reflow device 3200 Mounting line monitoring unit 3201 Mounting completion detection unit 3202 Production delay detection unit

Claims (13)

A mounting condition determination method for determining a mounting condition for a component mounter including a plurality of beams to which a mounting head for mounting a component is mounted,
A target production time acquisition step for acquiring a target production time allowed for production of a mounting board on which components are mounted;
An actual production time acquisition step for determining the mounting conditions based on the number of beams used, and acquiring an actual production time when the mounting substrate is actually produced under the mounting conditions;
A mounting condition determining method, comprising: a mounting condition determining step for determining the number of beams used so that the acquired actual production time does not exceed the target production time. The mounting condition determination method further includes:
The fastest mounting condition determination step for determining mounting conditions based on the conditions for using all beams,
A fastest production time calculating step for calculating a fastest production time based on the fastest mounting conditions;
The mounting condition determination method according to claim 1, further comprising: a used beam number acquisition step of acquiring a beam number to be used based on the target production time and the fastest production time. The mounting condition determination method further includes:
Use beam reception step for receiving selection of which beam to use,
The mounting condition determining method according to claim 1, further comprising: a used beam number acquiring step of acquiring a used beam number from the accepted used beam.   The mounting condition determining method according to claim 1, wherein the mounting condition determining step further includes determining a mounting condition by adding a condition for preferentially using a beam on one side with respect to a substrate transport direction. . The mounting condition determination method further includes:
The mounting condition determining method according to claim 1, further comprising a power cutoff step of cutting off power supplied to the beam determined not to be used. The mounting condition determination method further includes:
The mounting condition determination method according to claim 1, further comprising a power cutoff step of cutting off power supplied to the sub-equipment including the beam that is determined not to be used. A mounting condition determination method for a mounting line including a plurality of equipment including a component mounting machine for mounting components,
A target production time acquisition step for acquiring a target production time allowed for the production of the mounting board in the mounting line;
An actual production time acquisition step for determining the mounting conditions based on the number of facilities used, and acquiring an actual production time when the mounting substrate is actually manufactured under the mounting conditions;
And a mounting condition determining step for determining the number of equipment used so that the acquired actual production time does not exceed the target production time. A mounting condition determination method for determining a mounting condition for a mounting line including a plurality of component mounting machines including a beam to which a mounting head for mounting a component is mounted,
A mounting completion detection step for detecting that mounting of all components to be mounted is completed,
And a power cut-off step of cutting off power supplied to the beam when a production standby time after completion of mounting exceeds a reference value.   The method for suppressing power consumption according to claim 8, wherein the production standby time in the power cut-off step is a time until a new board is carried in after completion of mounting.   The method for suppressing power consumption according to claim 8, wherein the production standby time in the power cut-off step is a time until the mounting board is unloaded after completion of mounting. A mounting condition determination device that determines mounting conditions for a component mounter including a plurality of beams to which mounting heads for mounting components are mounted,
Target production time acquisition means for acquiring a target production time allowed for production of a mounting board on which components are mounted;
An actual production time acquisition means for determining the mounting conditions based on the number of beams used and acquiring an actual production time when the mounting substrate is actually produced under the mounting conditions;
A mounting condition determining device comprising mounting condition determining means for determining the number of beams used so that the acquired actual production time does not exceed the target production time. A component mounter for mounting components on a board,
Target production time acquisition means for acquiring a target production time allowed for production of a mounting board on which components are mounted;
An actual production time acquisition means for determining the mounting conditions based on the number of beams used and acquiring an actual production time when the mounting substrate is actually produced under the mounting conditions;
A component mounting machine comprising mounting condition determining means for determining the number of beams used so that the acquired actual production time does not exceed the target production time. A mounting condition determination program for determining a mounting condition for a component mounter equipped with a plurality of beams to which a mounting head for mounting a component is mounted,
A target production time acquisition step for acquiring a target production time allowed for production of a mounting board on which components are mounted;
An actual production time acquisition step for determining the mounting conditions based on the number of beams used, and acquiring an actual production time when the mounting substrate is actually produced under the mounting conditions;
A mounting condition determining program that causes a computer to execute a mounting condition determining step for determining the number of beams used so that the acquired actual production time does not exceed the target production time.

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