JP2006190570A - Display device and manufacturing method of the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a display device capable of restraining deterioration of a display element and improving display performance, and provide a manufacturing method of the same. <P>SOLUTION: The display device is formed by arranging a display element 40 composed of a first electrode 60 arranged at every pixels PX, an organic active layer 64 arranged on the first electrode 60, a second electrode 66 having a structure of laminating a plurality of conductive layers CL arranged so as to cover the organic active layer 64 of respective pixels PX, on a wiring board 120. On the second electrode 66, at least two conductive layers CL are made to contact with each other at a non-display part ND, and a buffer layer BL is arranged between at least two conductive layers CL at a display part D in the pixel PX. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a display device and a method for manufacturing the display device, and more particularly to a method for manufacturing a display device including a plurality of self-luminous display elements.

  In recent years, organic electroluminescence (EL) display devices have attracted attention as flat display devices. Since this organic EL display device is a self-luminous display element, it has a wide viewing angle, can be thinned without requiring a backlight, has low power consumption, and has a high response speed. Have.

  Because of these characteristics, organic EL display devices are attracting attention as potential candidates for next-generation flat display devices that can replace liquid crystal display devices. Such an organic EL display device includes an array substrate in which organic EL elements each having an organic active layer containing an organic compound having a light emitting function sandwiched between an anode and a cathode are arranged in a matrix.

When the organic EL element is exposed to moisture or oxygen contained in the outside air, its light emission characteristics are rapidly deteriorated. For this reason, a technique has been proposed in which the main surface on which the organic EL elements on the array substrate are arranged is shielded from the outside air. Various such techniques have been proposed. For example, a film sealing technique in which an organic film and an inorganic film are alternately stacked on an electrode arranged on the surface side of an organic EL element is disclosed. (For example, refer nonpatent literature 1).
Yuji Yanagi, “Compatible with mass production of thin, large and flexible substrates”, Flat Panel Display 2003, Nikkei Business Publications, December 27, 2002, p. 264-270

  On the other hand, in the so-called top emission method in which EL light emission is taken out from the side of the upper electrode (that is, the electrode formed in the process after the organic active layer) disposed on the organic active layer, it has a light transmission property for forming the upper electrode. The sheet resistance of the conductive material is relatively high. In particular, in the manufacturing process of an organic EL element, in order to suppress damage to the organic active layer as much as possible, the upper electrode formed after the organic active layer needs to be formed with low power and without a high temperature process. is there. For this reason, the sheet resistance of the upper electrode cannot be sufficiently reduced.

  For this reason, in the upper electrode common to all the pixels fed from several feeding parts, a desired potential cannot be obtained due to a voltage drop as the distance from the feeding part increases. There is a possibility that a difference in luminance occurs and display quality is deteriorated.

  The present invention has been made in view of the above-described problems, and an object of the present invention is to provide a display device and a display device manufacturing method capable of suppressing the deterioration of the display element and improving the display performance. It is to provide.

A display device according to a first aspect of the present invention includes:
A first electrode arranged for each pixel;
A photoactive layer disposed on the first electrode;
A display device comprising a display element having a structure in which a plurality of conductive layers arranged so as to cover the photoactive layer of each pixel are laminated and having a light-transmitting second electrode on a substrate. And
The second electrode is characterized in that at least two conductive layers are in contact with each other in a non-display portion between adjacent pixels, and a buffer layer is provided between at least two conductive layers in the display portion in the pixel. .

The manufacturing method of the display device according to the second aspect of the present invention is as follows:
Forming a first electrode for each pixel;
Forming a photoactive layer on the first electrode;
Forming a second electrode that covers the photoactive layer of each pixel, and
The step of forming the second electrode includes:
Forming a first conductive layer in contact with the photoactive layer in a display portion in a pixel and covering a non-display portion between adjacent pixels;
Forming a buffer layer on the first conductive layer in the display section;
Forming a second conductive layer in contact with the first conductive layer in the non-display portion and covering the buffer layer in the display portion.

A method of manufacturing a display device according to the third aspect of the present invention is as follows.
A method of manufacturing a display device having a display area constituted by matrix-like pixels,
Forming a first electrode for each pixel;
Forming a partition for separating each pixel;
Forming a photoactive layer on the first electrode;
Forming a second electrode that covers the photoactive layer of each pixel, and
The step of forming the second electrode includes:
Forming a first conductive layer in the display area;
Forming a buffer layer on the first conductive layer inside the partition wall; and
Forming a second conductive layer which contacts the first conductive layer on the partition and covers the buffer layer.

A display device according to a fourth aspect of the present invention provides:
A display device having a display area composed of matrix-like pixels,
A self-luminous display element constituting the display portion of each pixel;
A plurality of conductive layers that seals the entire display area and is in contact with a non-display portion of the display area;
A buffer layer disposed between the conductive layers in the display unit;
It is provided with.

  According to the present invention, it is possible to provide a display device and a display device manufacturing method capable of suppressing the deterioration of the display element and improving the display performance.

  Hereinafter, a display device and a method of manufacturing the display device according to an embodiment of the present invention will be described with reference to the drawings. In this embodiment, a self-luminous display device such as an organic EL (electroluminescence) display device will be described as an example of the display device.

  As shown in FIGS. 1 and 2, the organic EL display device 1 includes an array substrate 100 having a display area 102 for displaying an image. The display area 102 of the array substrate 100 is composed of a plurality of pixels PX (R, G, B) arranged in a matrix.

  Further, the array substrate 100 has a plurality of scanning lines Ym (m = 1, 2,...) Arranged along the row direction of the pixels PX (that is, the Y direction in FIG. 1) and a direction substantially orthogonal to the scanning lines Ym. In other words, a plurality of signal lines Xn (n = 1, 2,...) Arranged along (the X direction in FIG. 1) and a power supply line for supplying power to the first electrode 60 side of the organic EL element 40. P.

  Furthermore, the array substrate 100 has a scanning line driving circuit 107 that supplies a scanning signal to each of the scanning lines Ym and a signal that supplies a video signal to each of the signal lines Xn in the peripheral area 104 along the outer periphery of the display area 102. A line driving circuit 108. All the scanning lines Ym are connected to the scanning line driving circuit 107. All signal lines Xn are connected to the signal line driving circuit 108.

  Each pixel PX (R, G, B) includes a pixel circuit and a self-luminous display element that is driven and controlled by the pixel circuit, and constitutes a display unit. The pixel circuit electrically separates an on pixel and an off pixel and has a function of holding a video signal to the on pixel, and a display element based on a video signal supplied via the pixel switch 10. The driving transistor 20 supplies a desired driving current, and the storage capacitor element 30 holds the gate-source potential of the driving transistor 20 for a predetermined period. The pixel switch 10 and the driving transistor 20 are constituted by, for example, thin film transistors, and here, polysilicon is used for a semiconductor layer.

  The display element is composed of organic EL elements 40 (R, G, B) which are self-luminous elements. That is, the red pixel PXR includes an organic EL element 40R that mainly emits light corresponding to the red wavelength. The green pixel PXG includes an organic EL element 40G that mainly emits light corresponding to the green wavelength. The blue pixel PXB includes an organic EL element 40B that mainly emits light corresponding to the blue wavelength.

  The various organic EL elements 40 (R, G, B) have basically the same configuration, and the first electrode 60 arranged in an independent island shape for each pixel PX, and the photoactivity arranged on the first electrode 60. An organic active layer 64 as a layer and a second electrode 66 common to all the pixels PX arranged to cover the organic active layer 64 of each pixel PX. In the pixel PX, a region where the organic EL element 40 is disposed, that is, a region where the organic active layer 64 is held between the first electrode 60 and the second electrode 66 functions as a display unit.

  Here, the pixel switch 10 is disposed in the vicinity of the intersection between the scanning line Ym and the signal line Xn. The pixel switch 10 has a gate electrode connected to the scanning line Ym, a source electrode connected to the signal line Xn, and a drain electrode connected to one electrode constituting the storage capacitor 30 and the gate electrode of the drive transistor 20. The source electrode of the drive transistor 20 is connected to the other electrode constituting the storage capacitor element 30 and the power supply line P, and the drain electrode is connected to the first electrode 60 of the organic EL element 40.

  As shown in FIG. 2, the array substrate 100 includes a plurality of organic EL elements 40 disposed on the wiring substrate 120. Note that the wiring substrate 120 is formed on an insulating support substrate such as a glass substrate or a plastic sheet, the pixel switch 10, the driving transistor 20, the storage capacitor element 30, the scanning line driving circuit 107, the signal line driving circuit 108, and various wirings (scanning). Line, signal line, power supply line, etc.).

  The first electrode 60 constituting the organic EL element 40 is disposed on an insulating film (for example, a planarizing layer) on the surface of the wiring substrate 120 and functions as an anode.

  The organic active layer 62 includes at least a light emitting layer. The organic active layer 62 may include a hole transport layer formed in common for each color as a layer other than the light emitting layer, and may have a two-layer structure laminated with a light emitting layer formed in each color pixel. , A hole injection layer, a blocking layer, an electron transport layer, an electron injection layer, a buffer layer, and the like, or a layer in which these are functionally combined may be included. In the organic active layer 62, the light emitting layer may be an organic material, and layers other than the light emitting layer may be an inorganic material or an organic material. The light emitting layer is formed of an organic compound having a light emitting function of emitting red, green, or blue light.

  The second electrode 66 is disposed on the organic active layer 64 in common with each organic EL element 40. The second electrode 66 is made of a metal material having an electron injection function, such as Ca (calcium), Al (aluminum), Ba (barium), Ag (silver), Yb (ytterbium), and ITO (Indium Tin Oxide: It is formed of a light-transmitting metal material such as indium tin oxide (IZO) or IZO (indium zinc oxide) and functions as a cathode.

  In addition, the array substrate 100 includes a partition wall 70 disposed in a non-display portion between at least adjacent pixels PX (R, G, B) in the display area 102. The partition wall 70 is preferably formed so as to separate each color pixel, that is, to separate adjacent organic EL elements 40. Here, the partition wall 70 is arranged in a lattice shape along the periphery of each first electrode 60. The partition wall that exposes one electrode 60 is formed to have a rectangular opening. The partition wall 70 is made of a resin material.

  A protective member 200 is disposed on the main surface side of the array substrate 100 having the organic EL element 40 having such a configuration, and the organic EL element is protected and hermetically sealed. The protective member 200 is a glass substrate or a plastic sheet. In the case of a configuration in which the surface of the organic EL element is protected in a sufficiently airtight state, this protective member may be omitted.

  Incidentally, the second electrode 66 of the organic EL element 40 is a solid film formed over at least the entire display area 102 and hermetically seals the organic active layer 64 of each pixel PX. That is, the second electrode 66 functions as a sealing film that shields the display area 102 from the outside air.

  More specifically, the second electrode 66 is a stacked body in which a plurality of conductive layers CL are stacked. At least two conductive layers CL are in contact with each other in the non-display portion ND between adjacent pixels PX, and the pixel PX In the display portion D, a buffer layer BL is provided between at least two conductive layers CL.

  In the example illustrated in FIG. 2, the second electrode 66 includes four conductive layers CL1, CL2, CL3, and CL4 disposed over the entire display area 102. The second electrode 66 includes three buffer layers BL1, BL2, and BL3 disposed corresponding to the display unit D. A partition wall 70 is disposed in the non-display portion ND around the display portion D.

  That is, the first buffer layer BL1 is disposed between the first conductive layer CL1 and the second conductive layer CL2 in the display portion D, and the first conductive layer CL1 and the second conductive layer CL2 are not connected to the non-display portion ND. It contacts on the partition wall 70 in FIG. Similarly, the second buffer layer BL2 is disposed between the second conductive layer CL2 and the third conductive layer CL3 in the display portion D, and the second conductive layer CL2 and the third conductive layer CL3 are not included in the non-display portion. It contacts on the partition 70 in ND. Further, the third buffer layer BL3 is disposed between the third conductive layer CL3 and the fourth conductive layer CL4, and the third conductive layer CL3 and the fourth conductive layer CL4 are on the partition 70 in the non-display portion ND. In contact.

  Each buffer layer BL includes, for example, various organic materials such as carbon nitride such as CNx: H, fluorocarbon such as CFx, and acrylic resins such as hydrogenated dicyclopentadienyl diacrylate. It is made of various resin materials. Here, as a material for forming these buffer layers BL, a material that is applied in a relatively low-viscosity liquid state and is cured in a state where at least one of the buffer layers absorbs unevenness of the lower layer is selected. Is desirable. Thereby, the unevenness of the substrate surface can be flattened, and the occurrence of defects such as pinholes in each conductive layer CL constituting the second electrode 662 can be suppressed.

  Each conductive layer CL is formed of a metal material that functions as a cathode and has a barrier function. Here, the conductive layer CL is formed of a metal oxide material such as ITO or IZO as described above.

  Each buffer layer BL is formed by selecting a technique capable of forming a film while avoiding the non-display portion ND (that is, corresponding to the display portion D) such as inkjet printing, offset printing, and vapor deposition through a mask. Is desirable. Each conductive layer CL can be formed by a technique such as sputtering or plasma CVD.

  With such a configuration, it is possible to prevent moisture and oxygen from entering the organic EL element 40 and to suppress deterioration of the organic EL element 40. Therefore, good display performance can be maintained over a long period of time.

  In addition, even when a material having a relatively large sheet resistance (for example, a light-transmitting metal oxide) is selected as a material for forming the second electrode 66, the second electrode 66 is formed in the non-display portion ND. Since the plurality of conductive layers CL constituting the electrode 66 are in contact with each other, they are electrically conducted, and the sheet resistance of the second electrode 66 can be greatly reduced. Thereby, the voltage drop in the part away from the electric power feeding part can be suppressed, the brightness | luminance difference within a screen can be reduced, and display performance can be improved.

  As shown in FIG. 2, in the configuration in which each conductive layer CL contacts on the partition wall 70, the height 70H of the partition wall 70 from the substrate main surface 120A is set higher than the height 40H of the organic EL element 40. It is desirable. Here, the height 40H of the organic EL element 40 is the sum of all the film thicknesses of the first electrode 60, the organic active layer 64, and the second electrode 66.

  That is, it is desirable that the height 70H of the partition wall 70 is such that the top 70T is not buried by each buffer layer BL. That is, when each buffer layer BL is formed, the top 70T of the partition wall 70 protrudes from the surface of the buffer layer BL, so that when the conductive layer CL covering the buffer layer BL is formed as a solid film, each conductive layer CL Contacts on the partition wall 70. The sheet resistance of the second electrode 66 can be reduced as the area where the conductive layers CL are in contact with each other and the number of layers in contact are larger. Therefore, it is desirable that the height 70H of the partition wall 70 is set such that the top 70T is not buried by the uppermost buffer layer BL (the third buffer layer BL3 in the example shown in FIG. 2).

  As described above, the four conductive layers CL constituting the second electrode 66 are in contact with each other along the lattice-shaped partition wall 70, so that the sheet resistance of the second electrode 66 can be sufficiently reduced. When the second electrode 66 is composed of a single conductive layer, the sheet resistance of the second electrode 66 is 50Ω / □, whereas according to this configuration, the sheet resistance of the second electrode 66 is 15Ω / □. It was □.

  Next, another configuration example will be described.

  The partition 70 disposed in the non-display portion ND may be a stacked body of a plurality of layers. That is, in the example shown in FIG. 3, the partition wall 70 includes a first partition wall portion 71 disposed on the main surface 120 </ b> A of the wiring substrate 120 and a second partition wall portion 72 disposed on the first partition wall portion 71. It is comprised as a laminated body. The respective conductive layers CL constituting the second electrode 66 are in contact with each other on the second partition wall portion 72 in the non-display portion ND.

  According to such a configuration, even when the partition wall 70 having a relatively high height is formed, a sufficient area of the display unit D in the pixel PX can be ensured. That is, when an attempt is made to form a partition wall 70 having a high height so as to surround the first electrode 60, the bottom, that is, the area in contact with the first electrode 60 and the substrate main surface 120A is enlarged. For this reason, the exposed area of the first electrode 60 is reduced, and the area functioning as the display unit D is reduced.

  On the other hand, according to this configuration, first, the first partition wall 71 patterned to ensure a sufficient exposed area of the first electrode 60 is formed. Subsequently, a second partition wall 72 patterned to have a desired height is formed on the first partition wall 71. Thereby, the expansion of the bottom of the partition wall 70 can be suppressed, and the partition wall 70 that can ensure the conduction of the conductive layers CL of the second electrode 66 without reducing the area of the display portion D can be formed. In the example shown in FIG. 3, the partition wall 70 is a two-layer laminate, but may be a laminate pair of three or more layers.

  Further, the partition wall 70 may be configured with a portion mainly having a function of separating each pixel and a portion mainly having a function of ensuring the conduction of each conductive layer CL of the second electrode 66. . That is, in the example shown in FIG. 3, the first partition wall 71 surrounds the periphery of the first electrode 60 so as to mainly separate each pixel, and at least the film thickness of the first electrode 60 and the organic active layer 64. It is formed to have a height 71H that is higher than the sum. Further, the second partition wall portion 72 is formed to have a height 72H such that the sum 70H with the height 71H of the first partition wall portion 71 is higher than the height 40H of the organic EL element 40.

  At this time, as shown in FIG. 4, the second partition wall 72 may be disposed so as to surround the first electrode 60 in the same manner as the first partition wall 71. In FIG. 4, the second electrode 66 is omitted for simplification. In such a configuration, the conductive layers CL of the second electrode 66 are in contact with each other around the first electrode 60 (for example, in a lattice pattern), so that a sufficient contact area between the conductive layers is ensured. As in the case of the configuration shown in FIG. 2, the sheet resistance of the second electrode 66 can be reduced.

  Further, since the second partition wall portion 72 does not need to have a function of separating each pixel, it may be arranged as a columnar body on the first partition wall portion 71 as shown in FIG. In FIG. 5, the second electrode 66 is omitted for simplification. In the case of such a configuration, each conductive layer CL of the second electrode 66 is in contact with at least the second partition wall portion 72, so that the second electrode 66 is more than the case where the second electrode 66 is configured by a single conductive layer. 66 sheet resistance can be reduced. According to the configuration shown in FIG. 5, the sheet resistance of the second electrode 66 was 20Ω / □. Further, according to such a configuration, when the protection member 200 is required on the main surface side of the array substrate 100, the protection member 200 can be directly supported by the partition wall 70 including the second partition wall portion 72. is there.

  Next, a method for manufacturing the display device having the above-described configuration will be described. Here, in order to simplify the description, a method for manufacturing a display device including the second electrode having the multilayer structure shown in FIG. 2 will be described.

  First, a wiring substrate 120 having a display area 102 made up of matrix pixels is prepared by repeating processes such as formation of a metal film and an insulating film and patterning. Then, as shown in FIG. 6A, the first electrode 60 is formed for each pixel in the display area 102 on the wiring substrate 120. About the formation method of this 1st electrode 60, generally you may form by the photolithography process and may form by the mask sputtering method through the mask which has the pattern of a 1st electrode.

  Subsequently, as shown in FIG. 6B, a partition wall 70 for separating each pixel is formed. That is, after patterning by a general photolithography process using a photosensitive resin material such as an acrylic type positive tone resist, a baking process is performed at 220 ° C. for 30 minutes. Thereby, a grid-like partition wall 70 surrounding each pixel is formed.

  Subsequently, as shown in FIG. 6C, an organic active layer 64 including a hole buffer layer and the like in addition to the light emitting layer is formed on the first electrode 60 in each pixel. As the organic active layer 64, when a polymer material is selected, it can be applied by an ink jet method. Further, when a low molecular material is selected as the organic active layer 64, it can be formed by a vapor deposition method through a mask having a pixel pattern.

  Subsequently, a second electrode 66 having a multilayer structure that covers the organic active layer 64 of each pixel PX in the display area 102 is formed.

  First, as illustrated in FIG. 6D, a metal material that functions as a conductive layer is formed over the entire display area 102. Thereby, the first conductive layer CL1 that contacts the organic active layer 64 and covers the non-display portion ND is formed. After that, as shown in FIG. 6E, a resin material is formed corresponding to the display portion D of each pixel PX, and the first buffer layer BL1 is formed on the first conductive layer CL1 inside the partition wall 70. . Then, as shown in FIG. 6F, a metal material that functions as a conductive layer is formed again over the entire display area 102. Thus, the second conductive layer CL2 that contacts the first conductive layer CL1 in the non-display portion ND (on the partition wall 70) and covers the first buffer layer BL1 in the display portion D is formed.

  Similarly, after forming the second buffer layer BL2 on the second conductive layer CL2, the third conductive layer CL3 covering the second buffer layer BL2 is formed, and further, the third buffer layer is formed on the third conductive layer CL3. After forming BL2, a fourth conductive layer CL4 that covers the third buffer layer BL3 is formed. Thereby, the first to fourth conductive layers are in contact with each other in the non-display portion ND, and the second electrode 66 having a multilayer structure in which the buffer layer is interposed between the two conductive layers in the display portion D is formed.

  On the other hand, in order to protect the display area 102 on the array substrate 100, an ultraviolet curable sealant is applied along the outer periphery of the protective member 200, and the array is placed in an inert gas atmosphere such as nitrogen gas or argon gas. The substrate 100 and the protective member 200 are bonded together. As a result, the organic EL element 40 is sealed in the sealed space of the inert gas atmosphere in addition to being sealed by the second electrode 66 having a multilayer structure that constitutes the organic EL element 40. Thereafter, the sealing material is cured by irradiating with ultraviolet rays.

  In the color display type active matrix organic EL display device thus formed, uniform light emission luminance was obtained with respect to the same drive current, and good display performance was realized. In addition, it was confirmed that the brightness half-life is longer than that of the conventional method, and sufficient performance as a product can be maintained over a long period.

  Note that the present invention is not limited to the above-described embodiment as it is, and can be embodied by modifying the constituent elements without departing from the spirit of the invention in the stage of implementation. Further, various inventions can be formed by appropriately combining a plurality of constituent elements disclosed in the embodiment. For example, some components may be deleted from all the components shown in the embodiment. Furthermore, you may combine suitably the component covering different embodiment.

  For example, in the above-described embodiment, the second electrode (cathode) constituting the organic EL element has a multilayer structure having a plurality of conductive layers, and a sealing structure in which a buffer layer is disposed between these conductive layers. If the first electrode (anode) constituting the organic EL element is arranged on the surface side of the array substrate, the first electrode has a multilayer structure having a plurality of conductive layers and is sealed. A stop structure may be formed.

FIG. 1 is a diagram schematically showing a configuration of an organic EL display device according to an embodiment of the present invention. FIG. 2 is a cross-sectional view schematically showing the structure of the organic EL element in the display area on the array substrate of the organic EL display device shown in FIG. FIG. 3 is a cross-sectional view schematically showing another structure of the organic EL element in the display area on the array substrate of the organic EL display device shown in FIG. FIG. 4 is a perspective view schematically showing a structural example of a partition wall made of the laminate shown in FIG. FIG. 5 is a perspective view schematically showing another structural example of the partition wall made of the laminate shown in FIG. FIG. 6A is a diagram for explaining a manufacturing process for forming the organic EL display device, and shows a process of forming the first electrode. FIG. 6B is a diagram for explaining a manufacturing process for forming the organic EL display device, and shows a process of forming a partition. FIG. 6C is a diagram for explaining a manufacturing process for forming the organic EL display device, and shows a process for forming the organic active layer. FIG. 6D is a diagram for explaining a manufacturing process for forming the organic EL display device, and is a diagram illustrating a process of forming the first conductive layer of the second electrode. FIG. 6E is a diagram for explaining a manufacturing process for forming the organic EL display device, and is a diagram illustrating a process of forming the first buffer layer of the second electrode. FIG. 6F is a diagram for explaining a manufacturing process for forming the organic EL display device, and is a diagram illustrating a process of forming the second conductive layer of the second electrode.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Organic EL display apparatus, 10 ... Pixel switch, 20 ... Drive transistor, 30 ... Storage capacitor element, 40 ... Organic EL element, 60 ... 1st electrode, 64 ... Organic active layer, 66 ... 2nd electrode, 70 ... Partition , 71 ... 1st partition part, 72 ... 2nd partition part, 100 ... Array substrate, 102 ... Display area, 120 ... Wiring board, PX ... Pixel, D ... Display part, ND ... Non-display part, CL ... Conductive layer, BL ... Buffer layer

Claims (14)

A first electrode arranged for each pixel;
A photoactive layer disposed on the first electrode;
A display device comprising a display element having a structure in which a plurality of conductive layers arranged so as to cover the photoactive layer of each pixel are laminated and having a light-transmitting second electrode on a substrate. And
The second electrode is characterized in that at least two conductive layers are in contact with each other in a non-display portion between adjacent pixels, and a buffer layer is provided between at least two conductive layers in the display portion in the pixel. Display device. Furthermore, a partition that is arranged in the non-display portion and separates each pixel is provided,
The display device according to claim 1, wherein at least two conductive layers of the second electrode are disposed so as to be in contact with each other on the partition wall.   The display device according to claim 2, wherein a height of the partition wall from a substrate main surface is higher than a height of the display element.   The said partition is a laminated body of the 1st partition part arrange | positioned on the main surface of a board | substrate, and the 2nd partition part arrange | positioned on this 1st partition part. Display device. Further, a partition wall disposed in the non-display portion and separating each pixel,
A columnar body disposed on the partition;
The display device according to claim 1, wherein at least two conductive layers of the second electrode are disposed so as to contact each other on the columnar body.   The display device according to claim 5, wherein heights of the partition walls and the columnar bodies from a substrate main surface are higher than a height of the display element.   The display device according to claim 1, further comprising a pixel circuit that is arranged for each pixel and controls driving of the display element. Furthermore, a protective member for protecting the main surface side of the substrate including the display element is provided,
The display device according to claim 3, wherein the protection member is supported by the partition wall or the columnar body. Forming a first electrode for each pixel;
Forming a photoactive layer on the first electrode;
Forming a second electrode that covers the photoactive layer of each pixel, and
The step of forming the second electrode includes:
Forming a first conductive layer in contact with the photoactive layer in a display portion in a pixel and covering a non-display portion between adjacent pixels;
Forming a buffer layer on the first conductive layer in the display section;
And a step of forming a second conductive layer in contact with the first conductive layer in the non-display portion and covering the buffer layer in the display portion.   The method for manufacturing a display device according to claim 9, wherein the buffer layer is formed by an inkjet method. A method of manufacturing a display device having a display area constituted by matrix-like pixels,
Forming a first electrode for each pixel;
Forming a partition for separating each pixel;
Forming a photoactive layer on the first electrode;
Forming a second electrode that covers the photoactive layer of each pixel, and
The step of forming the second electrode includes:
Forming a first conductive layer in the display area;
Forming a buffer layer on the first conductive layer inside the partition wall; and
And a step of forming a second conductive layer that contacts the first conductive layer on the partition and covers the buffer layer. A display device having a display area composed of matrix-like pixels,
A self-luminous display element constituting the display portion of each pixel;
A plurality of conductive layers that seals the entire display area and is in contact with a non-display portion of the display area;
A buffer layer disposed between the conductive layers in the display unit;
A display device comprising:   The display device according to claim 12, wherein at least one of the conductive layers is a cathode or an anode of the display element.   The display device according to claim 12, further comprising: a partition wall disposed in a non-display portion between adjacent display elements in the display area and separating each pixel.

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