JP2006054602A - Package for electronic part and piezo-electric oscillation device using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a package structure for an electronic part and a piezo-electric oscillation device using the package which stabilize loading of a piezo-electric oscillation plate, maintain good characteristic, and can correspond to a microminiature size. <P>SOLUTION: A surface-mounting crystal oscillator includes a ceramic package (package for the electronic part) 1 having a recess opened at an upper part, an AT-cut crystal oscillation plate of a piezo-electric oscillation plate 2 contained in the package, and a lid 3 connected to the opening of the package. In the container in the ceramic package, an auxiliary supporter 14 is formed at the other end of the long side direction of the opposite side in which electrode pads 12, 13 are formed. An integrated circuit element 4 and the piezo-electric oscillation plate 2 are stored in the container 10, and covered with the lid. A first metal layer and a second metal layer are melted and hardened, and hermetically sealed. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a package for an electronic component used in an electronic device or the like, and more particularly to a package configuration with improved electromechanical connection performance when an electronic component element is mounted and a piezoelectric vibration device using the package.

  Examples of electronic components that require hermetic sealing include piezoelectric vibration devices such as crystal resonators, crystal filters, and crystal oscillators. Each of these products is hermetically sealed in order to form a metal thin film electrode on the surface of the crystal diaphragm and protect the metal thin film electrode from the outside air.

  Due to the demand for surface mounting of components, these piezoelectric vibration devices are increasingly housed in ceramic packages (electronic component packages) and are housed inside to accommodate ultra-miniaturization. A configuration in which the piezoelectric diaphragm is cantilevered is generally used.

  In such a cantilever support, the electrode pad of the package and the electrode formed on the piezoelectric vibration plate are conductively bonded by a conductive bonding material. In order to perform the bonding stably, the piezoelectric vibration plate is attached to the other end side. It is also conceivable to form an auxiliary support.

  Japanese Patent Laid-Open No. 2001-237665 (Patent Document 1) discloses a configuration in which an auxiliary support portion (pillow portion) is provided on the other end side in a surface-mount piezoelectric vibrator. In such a configuration, the other end portion can be placed on the auxiliary support portion at the time of conductive bonding, and an effect of suppressing the inclination of the piezoelectric diaphragm can be obtained. However, since the auxiliary support portion is disposed at the central portion in the short side direction of the package, the excitation of the piezoelectric diaphragm may be adversely affected. That is, for example, an AT-cut quartz diaphragm is generally used as the piezoelectric diaphragm, but it is known from the electrode configuration and vibration distribution that the vibration energy is larger in the central portion of the piezoelectric diaphragm. Therefore, even at the end portion of the piezoelectric diaphragm, vibration energy is relatively large in the central portion in the short side direction, and there is a risk of characteristic deterioration when the portion comes into contact with the auxiliary support portion.

  In addition, there is a concern that the strength of the package will decrease as the package becomes smaller and thinner, but this strengthening measure is also necessary.

  By the way, the structure having such an auxiliary support part is also considered in the piezoelectric oscillator. For example, in Japanese Patent Application Laid-Open No. 2001-217476 (Patent Document 2), an IC chip is accommodated in a base part, and is electrically conductively bonded by wire bonding. A piezoelectric diaphragm is disposed on the IC chip and cantilevered. It is a configuration. Auxiliary support portions (pillow portions) are formed at both ends in the short side direction at a position corresponding to the other end of the piezoelectric diaphragm.

In such a configuration, the above-described operation and effect of the auxiliary support portion can be obtained. However, the presence of a plurality of auxiliary support portions may adversely affect the vibration of the piezoelectric diaphragm, and the IC chip. This may adversely affect the conductive bonding. That is, as disclosed in Patent Document 2, bonding is also performed between the auxiliary support portions by wire bonding. However, when the size of the package is reduced, the bonding tool comes into contact with the auxiliary support portion or the inner wall of the package. In some cases, desired wire bonding cannot be performed.
JP 2001-237665 A JP 2001-217476 A

  The present invention has been made in view of the above points, and an object of the present invention is to stabilize the mounting of the piezoelectric diaphragm, maintain good characteristics, and cope with ultra-small size. An object of the present invention is to provide a package configuration for an electronic component and a piezoelectric vibration device using the package.

  In order to achieve the above object, the present invention can be realized by the following configuration.

  That is, as shown in claim 1, a rectangular housing portion that houses a rectangular piezoelectric diaphragm with a bottom, and an electrode that is provided in the housing portion and that is electrically conductively joined in a cantilevered state at one end of the piezoelectric diaphragm An electronic component package comprising: a pad; an auxiliary support portion that supports the other end of the piezoelectric diaphragm; and a bank portion that is formed around the storage portion and is hermetically joined to a lid. The portion is formed at one end in the short side direction of the storage portion and in contact with the inner corner of the bank portion, and has a polygonal shape or a partial circular shape in plan view.

The auxiliary support portion is configured to be in contact with a corner portion on the inner side of the package, and may be, for example, a triangle or a polygon having a shape larger than that, or may be a partial circle shape such as a quarter circle. Further, the plane size of the auxiliary support portion needs to be determined in consideration of the function of supporting the other end of the piezoelectric diaphragm at the time of manufacture and the degree of adverse influence on the vibration of the piezoelectric diaphragm. Of course, since the size of the piezoelectric diaphragm or the size of the excitation electrode to be mounted is related to the vibration region, this point needs to be considered. Note that the auxiliary support portion side of the piezoelectric diaphragm generally does not come into contact with the auxiliary support portion due to shrinkage of the bonding material after bonding by the conductive bonding material, but in some cases, it comes into contact or comes into contact with an external impact. Sometimes.

  According to the first aspect, the auxiliary support portion is formed at one end in the short side direction of the storage portion and in contact with the inner corner portion of the bank portion, whereby the strength of the package can be increased. Further, since the auxiliary support portion has a polygonal shape or a partial circular shape when seen in a plan view, the contact area can be reduced even if the auxiliary support portion comes into contact with the auxiliary support portion, and the vibration (drive) of the piezoelectric diaphragm is hardly adversely affected.

  According to a second aspect of the present invention, there is provided a rectangular storage portion for storing a rectangular piezoelectric diaphragm with a bottom, and an electrode pad that is provided in the storage portion and electrically conductively joins one end of the piezoelectric vibration plate in a cantilever support state. And an auxiliary support part for supporting and supporting the other end of the piezoelectric diaphragm, and a bank part formed around the storage part and hermetically joined to a lid, wherein the auxiliary support part Is formed in contact with the inner corner of the bank portion at both ends in the short side direction of the storage portion, and is characterized by a triangular shape in plan view, a partial circular shape, or a bowl shape having a cut portion.

  According to claim 2, the auxiliary support portion is formed at both ends in the short side direction of the storage portion and in contact with the inner corner portion of the bank portion, so that the auxiliary support portion exhibits a bracing function. In addition, the package strength can be increased. In addition, the auxiliary support portion is triangular or partially circular when viewed in plan, or has a saddle shape having a cut-out portion, so that the contact area can be reduced even if it comes in contact with it, and vibration (drive) of the piezoelectric diaphragm ) Will not be adversely affected. In particular, excitation electrodes are formed on the front and back sides of the piezoelectric diaphragm, but depending on the required characteristics, the excitation electrode may have a size expanded to the vicinity of the outer periphery of the piezoelectric diaphragm. According to the present claim, even in such a case, the auxiliary support portion corresponds to only the corner portion of the piezoelectric diaphragm, and does not reach the excitation electrode portion. As a result, it is possible to eliminate the adverse effect of the auxiliary support portion on the vibration of the piezoelectric diaphragm.

  The present invention also discloses a configuration in which an integrated circuit element and other electronic component elements are stored in a package in addition to a piezoelectric diaphragm. That is, as shown in claim 3, in the electronic component package according to claim 1 or 2, the integrated circuit element is mounted between the electrode pad and the auxiliary support portion and below the piezoelectric diaphragm mounting region. In this configuration, an area is provided.

  When the above configuration is applied to the electronic component package according to the first aspect, a rectangular storage portion for storing a rectangular piezoelectric diaphragm with a bottom is provided, and one end of the piezoelectric diaphragm provided in the storage portion is cantilevered. An electronic component package comprising: an electrode pad that is conductively bonded in a support state; an auxiliary support portion that supports the other end of the piezoelectric diaphragm; and a bank portion that is formed around the storage portion. The support portion is formed at one end in the short side direction of the storage portion and in contact with the inner corner portion of the bank portion, has a polygonal shape or a partial circular shape in plan view, and further between the electrode pad and the auxiliary support portion. Thus, an area for mounting the integrated circuit element is provided below the piezoelectric diaphragm mounting area.

  The auxiliary support portion is configured to be in contact with a corner portion on the inner side of the package, and may be, for example, a triangle or a polygon having a shape larger than that, or may be a partial circle shape such as a quarter circle. Further, the plane size of the auxiliary support portion needs to be determined in consideration of the function of supporting the other end of the piezoelectric diaphragm at the time of manufacture and the degree of adverse influence on the vibration of the piezoelectric diaphragm. Of course, since the size of the piezoelectric diaphragm or the size of the excitation electrode to be mounted is related to the vibration region, it is necessary to consider this point.

  According to such a configuration, the auxiliary support portion is formed at one end in the short side direction of the storage portion and in contact with the inner corner portion of the bank portion, thereby increasing the strength of the package. . Further, since the holding support portion is polygonal or partial circular when viewed in plan, even if it comes in contact with this, it is difficult to adversely affect the vibration (drive) of the piezoelectric diaphragm. Furthermore, a package for a composite component such as a piezoelectric oscillator can be obtained by providing an area for mounting an integrated circuit element below the piezoelectric diaphragm.

  When the above configuration is applied to the electronic component package according to claim 2, a rectangular storage portion for storing a rectangular piezoelectric diaphragm having a bottom is provided, and one end of the piezoelectric vibration plate provided in the storage portion is separated. A package having an electrode pad that is conductively bonded in a holding support state, an auxiliary support portion that supports the other end of the piezoelectric diaphragm, and a bank formed around the storage portion, and hermetically sealing the package A package for an electronic component having a lid, wherein the auxiliary support portion is formed at both ends in the short side direction of the storage portion and in contact with an inner corner of the bank portion, and has a triangular shape or a partial circular shape in plan view or It has a bowl shape having a cut-out portion, and further has a configuration in which an area for mounting an integrated circuit element is provided between the electrode pad and the auxiliary support portion and below the piezoelectric vibration plate mounting area.

  According to such a configuration, the auxiliary support portion is formed at both ends in the short side direction of the storage portion and in contact with the inner corner portion of the bank portion, so that the auxiliary support portion functions as a brace. Demonstrate and increase package strength. In addition, since the auxiliary support portion has a triangular shape, a partial circular shape, or a saddle shape having a cut-out portion when seen in a plan view, even if the auxiliary support portion comes into contact therewith, it is difficult to adversely affect the vibration (drive) of the piezoelectric diaphragm. In particular, excitation electrodes are formed on the front and back sides of the piezoelectric diaphragm, but depending on the required characteristics, the excitation electrode may have a size expanded to the vicinity of the outer periphery of the piezoelectric diaphragm. According to the present claim, even in such a case, the auxiliary support portion corresponds to only the corner portion of the piezoelectric diaphragm, and does not reach the excitation electrode portion. As a result, it is possible to eliminate the adverse effect of the auxiliary support portion on the vibration of the piezoelectric diaphragm. Further, by providing a region for mounting the integrated circuit element below the piezoelectric diaphragm, a composite component such as a piezoelectric oscillator can be obtained.

  In the configuration of claim 3, as shown in claim 4, at least a connection pad with the integrated circuit element may be formed between the long-side end portion or the auxiliary support portion of the storage portion adjacent to the auxiliary support portion. .

According to the present invention, it is possible to obtain a relatively wide space between the end portions in the long side direction of the storage portion adjacent to the auxiliary support portion and between the auxiliary support portions. By providing a connection pad with the integrated circuit element in the space, the connection pad formation region can be widened, and the bonding tool contacts the side wall of the bank portion or the side wall of the auxiliary support portion at the time of wire bonding. Thus, the desired electrical connection can be performed. In addition, the number of connection pads formed can be increased.

The present invention also discloses a piezoelectric vibration device using the above-described electronic component package. According to a fifth aspect of the present invention, there is provided a piezoelectric vibration device characterized in that a rectangular piezoelectric vibration plate in which an excitation electrode is formed in the electronic component package according to the first or second aspect is conductively bonded to the electrode pad.

According to the fifth aspect of the present invention, the strength of the package can be improved by the auxiliary support portion, and a piezoelectric vibration device corresponding to a reduction in size and thickness can be obtained. Further, desired characteristics can be obtained without hindering the vibration of the mounted piezoelectric diaphragm, and further, the piezoelectric diaphragm can be stably conductively joined by the auxiliary support portion in terms of manufacturing.

According to a sixth aspect of the present invention, the rectangular piezoelectric diaphragm having the excitation electrode formed on the electronic component package according to the third or fourth aspect is conductively joined to the electrode pad, and an integrated circuit element is mounted below the piezoelectric diaphragm. This is a piezoelectric vibration device characterized by the above.

According to the sixth aspect of the present invention, the strength of the package can be improved by the auxiliary support portion, and a piezoelectric vibration device corresponding to a reduction in size and thickness can be obtained. Further, desired characteristics can be obtained without hindering the vibration of the mounted piezoelectric diaphragm, and further, the piezoelectric diaphragm can be stably conductively joined by the auxiliary support portion in terms of manufacturing. In addition, the mounting area of the integrated circuit element can be widened, and the productivity and reliability during mounting work are improved.

According to a seventh aspect of the present invention, the rectangular piezoelectric diaphragm having the excitation electrode formed on the electronic component package according to the fourth aspect is conductively joined to the electrode pad, and an integrated circuit element is mounted below the piezoelectric diaphragm. The piezoelectric vibration device is characterized in that the integrated circuit element and the connection pad are conductively bonded by a bonding wire.

According to the seventh aspect of the present invention, the strength of the package can be improved by the auxiliary support portion, and a piezoelectric vibration device corresponding to a reduction in size and thickness can be obtained. Further, desired characteristics can be obtained without hindering the vibration of the mounted piezoelectric diaphragm, and further, the piezoelectric diaphragm can be stably conductively joined by the auxiliary support portion in terms of manufacturing. Further, a connection pad forming region with the integrated circuit element can be widened, and an accident such as contact of the bonding tool with the side wall of the bank portion or the side wall of the auxiliary support portion at the time of wire bonding is eliminated. Bonding can be performed. Moreover, it can respond to the miniaturization of the package.

  According to the present invention, it is possible to stabilize the mounting of the piezoelectric diaphragm due to the presence and shape of the auxiliary support portion and to maintain good characteristics. Further, since the package strength can be improved, it is possible to obtain a package configuration for an electronic component that can cope with ultra-small and ultra-thin and a piezoelectric vibration device using the package.

Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.
A first embodiment of the present invention will be described with reference to FIGS. 1 and 2 by taking a surface-mount crystal oscillator as an example. FIG. 1 is an exploded perspective view showing the present embodiment, and FIG. 2 is a plan view showing a state where an integrated circuit element is housed in a ceramic package. A surface-mount type crystal oscillator includes a ceramic package (electronic component package) 1 having a recess with an upper opening, an AT-cut type crystal diaphragm that is a piezoelectric diaphragm 2 housed in the package, and an opening of the package. And a lid 3 joined to the portion.

  The ceramic package 1 is a rectangular parallelepiped as a whole, and has a configuration in which a ceramic such as alumina and a conductive material such as tungsten are appropriately laminated, and has a concave storage portion 10 when viewed in cross section. The storage unit 10 includes an upper storage unit 10a and a lower storage unit 10b, in which the piezoelectric diaphragm 2 and the integrated circuit element 4 are stored. A bank portion 11 is formed around the storage section, and the top surface of the bank portion 11 is flat, and a circumferential first metal layer 11a is formed on the bank portion. The upper surface of the first metal layer 11a is also formed to be flat, and the metal film layers are formed in the order of tungsten, nickel, and gold. Tungsten is integrally formed during ceramic firing by metallization technology, and nickel and gold layers are formed by plating technology.

  Castellations C1, C2, C3, C4 extending in the vertical direction are formed at the four corners of the outer periphery of the ceramic package. The castellation has a configuration in which arc-shaped cutouts are formed in the vertical direction, and is necessary when cutting small pieces from a wafer in which a large number of ceramic packages are integrally formed.

  The first metal layer 11a is electrically led to an external connection electrode (not shown) formed on the lower surface of the ceramic package by a conductive via B that vertically connects the corner portion of the ceramic package. Yes. By connecting the external lead electrode to the ground, a metal lid, which will be described later, is grounded through the metal layer 11a and the conductive via B, and an electromagnetic shielding effect of the electronic component can be obtained. As described above, the conductive via B can be formed by a known ceramic lamination technique.

  In the ceramic package 1, the lower storage portion 10 b for storing the integrated circuit element 4 is formed on the bottom surface as described above, and the upper storage portion 10 a above the upper storage portion 10 a has electrode pads 12, 13 at one end in the long side direction. Are formed side by side in the short side direction. These electrode pads 12 and 13 are formed close to the inside of the ceramic package, and each electrode pad is led out as an input / output terminal to an external connection electrode formed on the lower surface of the ceramic package on the opposite surface by a conductive via (not shown). It is.

  Further, in the storage portion in the ceramic package, an auxiliary support portion 14 is formed at the other end in the long side, which is the opposite side to which the electrode pads 12 and 13 are formed. The auxiliary support portion 14 is made of an insulating material such as alumina, has a rectangular shape when seen in a plan view, and is formed at one end in the short side direction of the package (housing portion). In the present embodiment, the heights of the electrode pads 12 and 13 and the auxiliary support portion 14 are set to be substantially the same. In addition, the auxiliary support portion may employ the same conductive material as the electrode pad. In addition, it is preferable that the said auxiliary | assistant support part 14 is biased to the end of a short side direction as much as possible, and is made into a small size to such an extent that the function of the auxiliary | assistant support at the time of conductive joining is not impaired.

  Between the electrode pads 12 and 13 and the lower storage portion 10b, a plurality of connection pads 15a for the integrated circuit element 4 are formed side by side, and also in the other end region in the short side direction of the upper storage portion adjacent to the auxiliary support portion 14. A plurality of connection pads 15b are formed side by side.

  The ceramic package having such a structure is formed using a known ceramic lamination technique or metallization technique, and the electrode pad and the connection pad are formed of a nickel plating layer on the upper surface of the metallization layer made of tungsten or the like, similar to the formation of the metal layer 11a described above. In this configuration, each gold plating layer is formed.

  The integrated circuit element 4 mounted in the lower housing part is a one-chip integrated circuit element that constitutes an oscillation circuit together with the piezoelectric diaphragm 2, and a plurality of connection terminals 41 are formed on the upper surface thereof. The integrated circuit element 4 employs a bare chip in the present embodiment, and is die-bonded to the lower housing portion 10b with a resin material. Then, the plurality of connection terminals 41 of the integrated circuit element and the plurality of connection pads 15a and 15b formed in the package are respectively connected by wire bonding technology.

  A piezoelectric diaphragm 2 is mounted above the integrated circuit element 4 with a predetermined interval. The piezoelectric diaphragm 2 is a rectangular AT-cut quartz diaphragm. A pair of rectangular excitation electrodes 21 and 22 facing the front and back surfaces of the piezoelectric diaphragm 2 and connecting electrodes 21b and 22b that lead the excitation electrodes to the outer periphery of the quartz diaphragm. And lead electrodes 21a and 22a formed on the short side in the long side direction of the crystal diaphragm. The numbers 22, 22b and 22a are not shown. Each of these electrodes can be formed by thin film forming means such as vacuum deposition.

  For joining the piezoelectric diaphragm and the package, for example, an appropriate amount of a conductive bonding material (not shown) is supplied to the upper surfaces of the electrode pads 12 and 13 by a dispenser or the like, and then the piezoelectric diaphragm 2 and the electrode pads 12 and 13 are auxiliary supported. Mounted between the sections 14. As a result, the extraction electrodes 21a and 22a of the piezoelectric diaphragm and the electrode pads 12 and 13 are electrically and mechanically connected. However, if necessary, the conductive bonding material (not shown) is again attached to the extraction electrode portion of the mounted piezoelectric diaphragm. May be applied by overcoating. The conductive bonding material is in the form of a paste, and examples thereof include a silicone-based conductive resin adhesive containing metal fine pieces such as silver filler. In addition to the silicone-based adhesive, for example, urethane-based, imide-based, polyimide-based An epoxy-based conductive resin adhesive can be used.

  The lid 3 for hermetically sealing the ceramic package has a flat plate configuration having a rectangular shape in plan view. The lid 3 has a configuration in which a metal brazing material is formed as a second metal layer (not shown) on a core material (not shown) made of Kovar. More specifically, for example, a nickel layer and a Kovar core material are formed from the upper surface. , A copper layer and a silver brazing layer in that order, and the silver brazing layer as the second metal layer is joined to the first metal layer of the ceramic package. The external shape of the lid in plan view is substantially the same as or slightly smaller than the external shape of the ceramic package.

  The integrated circuit element 4 and the piezoelectric diaphragm 2 are housed in the housing part 10 of the ceramic package 1 and covered with the lid, and the first metal layer and the second metal layer are melt-cured, and hermetically sealed. Do. In the present embodiment, hermetic sealing is performed by seam welding, and the silver brazing that is the second metal layer formed on the lid is melt-cured to perform hermetic sealing.

  The present invention is not limited to the above embodiment, and various configurations can be employed for the auxiliary support portion, for example. FIG. 3 is a plan view showing a second embodiment according to the present invention, and a surface-mounted crystal oscillator will be described as an example. Since the basic configuration is the same as that of the first embodiment, the same reference numerals are used for the same components, and a part of the description is omitted.

  In the present embodiment, the auxiliary support portion 16 has a triangular shape as viewed from above, and two sides thereof are formed in contact with one corner portion inside the package. As a result, the formation region of the connection pad 15b that is conductively bonded to the connection terminal 41 of the integrated circuit element 4 is widened, and the wire bonding can be reliably performed without the bonding tool interfering with the side wall of the package or the side wall of the auxiliary support portion. it can.

  Also, when the piezoelectric diaphragm 2 is mounted between the electrode pads 12 and 13 and the auxiliary support portion 16 and conductively bonded to the electrode pads 12 and 13 with a conductive bonding material, the tip portion of the piezoelectric diaphragm is a triangular auxiliary support portion. As a result, reliable auxiliary support can be performed, and the auxiliary support portion can be made to face in the vertical direction while avoiding the electrode formation region and the vibration region of the piezoelectric diaphragm, so that fluctuations in characteristics can be suppressed.

A third embodiment of the present invention will be described with reference to a plan view shown in FIG. 4, taking a surface-mounted crystal oscillator as an example. Since the basic configuration is the same as that of the first embodiment, the same reference numerals are used for the same components, and a part of the description is omitted.

In the present embodiment, the integrated circuit element 42 is connected by face-down bonding that directly bonds to a connection pad formed on the bottom surface of the package. Therefore, the connection pads for wire bonding are not provided as in the above-described embodiments. Further, the auxiliary support portion 17 is formed in contact with one corner portion inside the package, and has a ¼ circular shape when seen in a plan view. As a result, a space for mounting the integrated circuit element 42 can be provided, and even when the integrated circuit element 42 is face-down bonded with the bonding tool, the bonding tool does not interfere with the side wall of the package or the side wall of the auxiliary support portion, and the wire bonding is surely performed. It can be performed. In addition, since there is room in the mounting space, it is possible to widen the distance between the connection pads 43 for face-down bonding, and it is possible to expect an improvement in yield during manufacturing, and it is possible to easily check the state of the connection pads visually.

  Further, when the piezoelectric diaphragm 2 is mounted between the electrode pads 12 and 13 and the auxiliary support portion 17 and conductive bonding is performed using the electrode pads 12 and 13 with the conductive bonding material, reliable auxiliary support can be performed and the electrode of the piezoelectric diaphragm is formed. Since the auxiliary support part 17 can be opposed to avoid the region and the vibration region, the characteristic variation can be suppressed.

A fourth embodiment according to the present invention will be described by taking a surface-mounted crystal oscillator as an example, together with a plan view shown in FIG. 5 and a cross-sectional view taken along line AA of FIG. Since the basic configuration is the same as that of the first embodiment, the same reference numerals are used for the same components, and a part of the description is omitted.

  In the present embodiment, the two auxiliary support portions 18 are formed in contact with two corner portions opposed to each other in the short side direction inside the package, and both auxiliary support portions have a triangular shape when viewed in plan. Such a shape can improve the strength of the package by the function of bracing, and can widen the space between the auxiliary support portions by the shape. Therefore, the formation region of the connection pad 15b that is conductively bonded to the connection terminal 41 of the integrated circuit element 4 is widened, and wire bonding can be reliably performed without the bonding tool interfering with the side wall of the package or the side wall of the auxiliary support portion. it can.

  In addition, when the piezoelectric diaphragm 2 is mounted between the electrode pads 12 and 13 and the auxiliary support portion 18 and conductive bonding is performed using the electrode pads 12 and 13 with the conductive bonding material, reliable auxiliary support can be performed and electrode formation of the piezoelectric diaphragm is performed. Since the auxiliary support portions can be opposed to each other while avoiding the region and the vibration region, the characteristic variation can be suppressed.

A fifth embodiment of the present invention will be described with reference to a plan view shown in FIG. 7, taking a surface-mounted crystal oscillator as an example. Since the basic configuration is the same as that of the first embodiment, the same reference numerals are used for the same components, and a part of the description is omitted.

  In the present embodiment, the auxiliary support portion 19 is formed in contact with two corners facing the short side direction inside the package, and both auxiliary support portions have a bowl shape when viewed in a plane, and the cut portion 191 is formed. have. Such a shape can improve the strength of the package and can substantially widen the interval between the auxiliary support portions due to the presence of the cut portion. Therefore, the formation region of the connection pad 15b that is conductively bonded to the connection terminal 41 of the integrated circuit element 4 is widened, and wire bonding can be reliably performed without the bonding tool interfering with the side wall of the package or the side wall of the auxiliary support portion. it can.

  In addition, when the piezoelectric diaphragm 2 is mounted between the electrode pads 12 and 13 and the auxiliary support portion 19 and conductive bonding is performed using the electrode pads 12 and 13 with the conductive bonding material, reliable auxiliary support can be performed and the electrode of the piezoelectric diaphragm is formed. Since the auxiliary support portions can be opposed to each other while avoiding the region and the vibration region, the characteristic variation can be suppressed.

A sixth embodiment of the present invention will be described with reference to a plan view shown in FIG. 8, taking a surface-mounted crystal resonator as an example. The surface-mount type crystal resonator includes a ceramic package (electronic component package) 5 having a recess with an upper opening, a piezoelectric diaphragm 6 made of an AT-cut crystal diaphragm housed in the package, and not shown. Comprises a lid joined to the opening of the package.

  The ceramic package 5 is a rectangular parallelepiped as a whole, and has a configuration in which a ceramic such as alumina and a conductive material are appropriately stacked, and has a concave storage portion 50 when viewed in cross section. An embankment is formed around the storage portion, the upper surface of the embankment is flat, and a circumferential first metal layer 51a is formed on the embankment. The upper surface of the first metal layer 51a is also formed to be flat, and a metal film layer is formed in the order of tungsten, nickel, and gold. Tungsten is integrally formed during ceramic firing by metallization technology, and nickel and gold layers are formed by plating technology.

  Castellations C1, C2, C3, C4 extending in the vertical direction are formed at the four corners of the outer periphery of the ceramic package. The castellation has a configuration in which arc-shaped cutouts are formed in the vertical direction, and is necessary when cutting small pieces from a wafer in which a large number of ceramic packages are integrally formed.

  The first metal layer 51a is electrically led to an external connection electrode (not shown) formed on the lower surface of the ceramic package by a conductive via B that vertically connects the corner portion of the ceramic package. Yes. By connecting the external lead electrode to the ground, a metal lid, which will be described later, is grounded through the metal layer 11a and the conductive via B, and an electromagnetic shielding effect of the electronic component can be obtained. As described above, the conductive via B can be formed by a known ceramic lamination technique. Note that a conductive path may be formed in the castellation instead of the conductive via, and thereby the conduction between the metal layer 51a and the external connection electrode may be achieved.

  In the storage unit 50, electrode pads 52 and 53 are formed side by side in the short side direction at one end in the long side direction of the package. These electrode pads 52 and 53 are formed close to the inside of the ceramic package, and each electrode pad is drawn out as an input / output terminal to an external connection electrode formed on the lower surface of the ceramic package on the opposite surface by a conductive via (not shown). It is.

  In the ceramic package, two auxiliary support portions 54 are formed at the other end in the long side, which is the opposite surface on which the electrode pads are formed. The auxiliary support portion 54 is made of an insulating material such as alumina and is formed to face both ends in the package short side direction. Each of the auxiliary support portions 54 has a triangular shape in which two sides are in contact with corner portions inside the package. In the present embodiment, the heights of the electrode pads 52 and 53 and the auxiliary support portion 54 are set to be substantially the same, but either of them may be set higher. The auxiliary support portion 54 can also employ the same conductive material as the electrode pads 52 and 53. In addition, it is preferable that the said auxiliary | assistant support part 54 is as small as possible in the grade which does not impair the function of the auxiliary | assistant support at the time of conductive joining.

  The ceramic package having such a structure is formed by using a known ceramic lamination technique or metallization technique, and the electrode pad is formed of a nickel plating layer or a gold plating layer on the upper surface of the metallization layer made of tungsten or the like, similar to the formation of the metal layer 11a described above. In this configuration, each layer is formed.

The piezoelectric diaphragm 6 (indicated by a dotted line) that is conductively bonded to the electrode pad is a rectangular AT-cut quartz diaphragm, and a pair of rectangular excitation electrodes 61 and 62 facing the front and back surfaces of the piezoelectric diaphragm 6 and the excitation electrode. A connection electrode drawn out to the outer periphery of the crystal diaphragm and an extraction electrode formed on the short side in the long side direction of the crystal diaphragm are formed. The number 62 is not shown. Each of these electrodes can be formed by thin film forming means such as vacuum deposition.

  For joining the piezoelectric diaphragm and the package, for example, an appropriate amount of conductive bonding material S (shown by dotted lines) is supplied to the electrode pads 52 and 53 by a dispenser, and then the piezoelectric diaphragm 5 is joined to the electrode pads 52 and 53 and the auxiliary support portion. Install between 54. As a result, the extraction electrode of the piezoelectric diaphragm and the electrode pads 52 and 53 are electrically and mechanically connected. However, if necessary, the conductive bonding material S can be applied again to the extraction electrode portion of the mounted piezoelectric diaphragm. Good. The conductive bonding material is in the form of a paste, and examples thereof include a silicone-based conductive resin adhesive containing metal fine pieces such as silver filler. In addition to the silicone-based adhesive, for example, urethane-based, imide-based, polyimide-based An epoxy-based conductive resin adhesive can be used.

The piezoelectric diaphragm 6 is housed in the housing part 50 of the ceramic package 5 and hermetically sealed with the lid. In this embodiment, hermetic sealing is performed by seam welding, and the silver solder formed on the lid is melt-cured to perform hermetic sealing.

  In addition, an example was shown in which a metal layer was formed on the upper part of the bank and hermetically sealed with a lid, but a metal frame for hermetic sealing was formed on the upper part of the bank and hermetically sealed using the metal frame. Seam welding for performing soldering may be applied, or brazing by atmospheric heating using a soft brazing material may be performed. Furthermore, an energy beam such as an electron beam or a laser beam may be used as a heat source, or hermetic sealing with an insulating material such as resin or glass may be applied.

  In the examples of the above embodiments, a surface mount type crystal oscillator or crystal resonator using an AT-cut crystal diaphragm is illustrated, but a tuning fork type crystal diaphragm, a crystal filter element, a crystal diaphragm, and the like. The electronic element may be stored in a package. In addition, the piezoelectric diaphragm may be made of other piezoelectric materials such as a piezoelectric ceramic diaphragm, and may be applied to other electronic component elements, and is not limited to the example of the above embodiment.

  It can be applied to mass production of electronic components including crystal oscillators and crystal resonators.

The disassembled perspective view of the open state of the crystal unit according to the first embodiment. Plan view of ceramic package The top view which shows 2nd Embodiment. The top view which shows 3rd Embodiment. The top view which shows 4th Embodiment. AA sectional drawing of FIG. The top view which shows 5th Embodiment. The top view which shows 6th Embodiment.

Explanation of symbols

1, 5 Ceramic package 11, 51 Embankment
11a, 51a Metal layer 12, 13, 52, 53 Electrode pad
2 Piezoelectric diaphragm (AT-cut quartz diaphragm)
3 Lids 14, 16, 17, 18, 19, 54 Auxiliary support

Claims (7)

A rectangular storage part for storing a rectangular piezoelectric diaphragm with a bottom, an electrode pad provided in the storage part and electrically conductively joined in a cantilevered state at one end of the piezoelectric diaphragm, and the other end of the piezoelectric diaphragm An electronic component package comprising: an auxiliary support portion for supporting and supporting; and a bank portion formed around the storage portion and hermetically bonded to the lid,
The package for an electronic component, wherein the auxiliary support part is formed at one end in the short side direction of the storage part and in contact with an inner corner of the bank part, and has a polygonal shape or a partial circular shape in plan view. A rectangular storage part for storing a rectangular piezoelectric diaphragm with a bottom, an electrode pad provided in the storage part and electrically conductively joined in a cantilevered state at one end of the piezoelectric diaphragm, and the other end of the piezoelectric diaphragm An electronic component package comprising: an auxiliary support portion for supporting and supporting; and a bank portion formed around the storage portion and hermetically bonded to the lid,
The auxiliary support part is formed in contact with the inner corner of the bank portion at both ends in the short side direction of the storage part, and has a triangular shape in plan view, a partial circular shape, or a bowl shape having a cut-out part Electronic component package. 3. The electronic component package according to claim 1, wherein a region for mounting an integrated circuit element is provided between the electrode pad and the auxiliary support portion and below the piezoelectric diaphragm mounting region. 4. The electronic component package according to claim 3, wherein at least a connection pad with the integrated circuit element is formed between an end portion in the long side direction of the storage portion adjacent to the auxiliary support portion or between the auxiliary support portions. 3. A piezoelectric vibration device comprising: a package for an electronic component according to claim 1; and a rectangular piezoelectric vibration plate on which excitation electrodes are formed. 5. The electronic component package according to claim 3, wherein a rectangular piezoelectric diaphragm having an excitation electrode formed thereon is conductively joined to the electrode pad, and an integrated circuit element is mounted below the piezoelectric diaphragm. Piezoelectric vibration device. The electronic component package according to claim 4, wherein a rectangular piezoelectric diaphragm having an excitation electrode formed thereon is conductively joined to the electrode pad, and an integrated circuit element is mounted below the piezoelectric diaphragm, A piezoelectric vibration device, wherein the connection pad is conductively bonded with a bonding wire.

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