JP2006012444A - Ceramic heater, heating apparatus, and image forming apparatus - Google Patents

Ceramic heater, heating apparatus, and image forming apparatus Download PDF

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JP2006012444A
JP2006012444A JP2004183633A JP2004183633A JP2006012444A JP 2006012444 A JP2006012444 A JP 2006012444A JP 2004183633 A JP2004183633 A JP 2004183633A JP 2004183633 A JP2004183633 A JP 2004183633A JP 2006012444 A JP2006012444 A JP 2006012444A
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substrate
resistance heating
ceramic heater
wiring pattern
heating element
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Kentaro Kimura
健太郎 木村
Takaaki Karibe
孝明 苅部
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Toshiba Lighting and Technology Corp
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Harison Toshiba Lighting Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To realize a ceramic heater capable of attaining a temperature distribution further uniform in the longitudinal direction of the heat generated by serially connected resistance heaters of PTC. <P>SOLUTION: The resistance heaters 16 and 17 having positive temperature coefficients are formed with a predetermined longitudinal space on a ceramic-made lengthy flat substrate 11. One short-hand directional end of the resistance heater 16 is connected to a wiring pattern 14 in an electrically connected state on the substrate 11. One short-hand directional end of the resistance heater 17 is connected to a wiring pattern 15 in an electrically connected state on the substrate. The other short-hand directional end of the resistance heater 16 is electrically connected to a wiring pattern 18 on the substrate 11. The other short-hand directional end of the resistance heater 17 is electrically connected to a wiring pattern 19 on the substrate 11. The longitudinal other ends of the wiring patterns 14 and 15 one-side ends of which are opened are connected to an electrode 12. The longitudinal other ends of the wiring patterns 18 and 19 one-side ends of which are opened are electrically connected to an electrode 13. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

この発明は、情報機器、家電製品や製造設備等に用いられる薄型の面状セラミックヒータ、このセラミックヒータを実装したプリンタ、複写機、ファクシミリ等の加熱装置、この加熱装置を用いた画像処理装置に関する。   The present invention relates to a thin sheet ceramic heater used for information equipment, home appliances, manufacturing facilities, etc., a heating device such as a printer, a copying machine, a facsimile machine, etc. mounted with the ceramic heater, and an image processing device using the heating device. .

従来のセラミック等の基板を用いたヒータは、長尺状基板の長手方向両側に沿って形成された電極間に、複数の正の温度係数(PTC:Positive Temperature Coefficient)を有する抵抗発熱体を並列に形成するとともに、抵抗発熱体の異なる領域による温度変化を少なくするために、基板の長手方向両側に形成された電極の異なる一端から電力を供給している。(例えば、特許文献1)
特開平5−29067号公報(第3、4頁、図1〜3)
In a conventional heater using a ceramic substrate, a resistance heating element having a plurality of positive temperature coefficients (PTCs) is arranged in parallel between electrodes formed along both longitudinal sides of a long substrate. In order to reduce the temperature change due to different regions of the resistance heating element, power is supplied from different ends of the electrodes formed on both sides in the longitudinal direction of the substrate. (For example, Patent Document 1)
JP-A-5-29067 (3rd and 4th pages, FIGS. 1 to 3)

上記した特許文献1の技術は、抵抗発熱体にかかる電力供給を同条件とすることで、異なる場所での温度変化を少なくしている。しかし、並列接続された発熱抵抗体相互の間隙では温度がやや低く基板の長手方向では抵抗発熱体が発する熱に温度ムラが発生する、という問題があった。   The technique of the above-mentioned patent document 1 reduces the temperature change in a different place by making the electric power supply concerning a resistance heating element into the same conditions. However, there is a problem in that the temperature between the heating resistors connected in parallel is slightly low, and temperature unevenness occurs in the heat generated by the resistance heating device in the longitudinal direction of the substrate.

この発明の目的は、並列接続されたPTCの抵抗発熱体が発する熱を長手方向により均一な温度分布が得られるセラミックヒータ、このセラミックヒータを用いた加熱装置、この加熱装置を用いた画像処理装置を提供することにある。   SUMMARY OF THE INVENTION An object of the present invention is to provide a ceramic heater capable of obtaining a uniform temperature distribution in the longitudinal direction of the heat generated by the PTC resistance heating elements connected in parallel, a heating device using the ceramic heater, and an image processing device using the heating device. Is to provide.

上記した課題を解決するために、この発明のセラミックヒータは、耐熱・絶縁性材料で形成される長尺平板状の絶縁性基板と、前記基板面上の長手方向に所定の間隔を置いて形成された正の温度係数を有する第1および第2の抵抗発熱体と、前記第1の抵抗発熱体の短手方向の一端と電気的に接続した状態で前記基板上に形成された第1の配線パタンと、前記第2の抵抗発熱体の短手方向の一端と電気的に接続した状態で前記基板上に形成された第2の配線パタンと、前記第1の抵抗発熱体の短手方向の他端に接続して前記基板上に形成した第3の配線パタンと、前記第2の抵抗発熱体の短手方向の他端に接続して前記基板上に形成した第4の配線パタンと、一端が開放された前記第1および第2の配線パタンの長手方向の他端にそれぞれ接続される第1の電極と、一端が開放された前記第3および第4の配線パタンの長手方向の他端にそれぞれ接続される第2の電極と、を具備したことを特徴とする。   In order to solve the above-described problems, a ceramic heater according to the present invention is formed by a long flat plate-like insulating substrate formed of a heat-resistant / insulating material and a predetermined interval in the longitudinal direction on the substrate surface. A first resistance heating element having a positive temperature coefficient and a first resistance heating element formed on the substrate in a state of being electrically connected to one end in a short direction of the first resistance heating element. A wiring pattern, a second wiring pattern formed on the substrate in a state of being electrically connected to one end in a short direction of the second resistance heating element, and a short direction of the first resistance heating element A third wiring pattern formed on the substrate connected to the other end of the second wiring pattern, and a fourth wiring pattern formed on the substrate connected to the other end of the second resistance heating element in the short direction. , One end of each of the first and second wiring patterns open at one end is connected to the other end in the longitudinal direction. A first electrode which is characterized in that the one end is provided with a second electrode respectively connected to the other longitudinal end of said opened third and fourth wiring pattern.

この発明によれば、PTC抵抗発熱体を用いながら長手方向により均一な温度分布を実現することが可能となる。   According to this invention, it is possible to achieve a more uniform temperature distribution in the longitudinal direction while using the PTC resistance heating element.

以下、この発明の実施例について、図面を参照しながら詳細に説明する。   Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

図1は、この発明のセラミックヒータに関する一実施例について説明するための正面図、図2は図1のx−x’断面図である。
図1において、11は厚み0.5mm〜1.0mm程度のアルミナ(Al)等のセラミック、ガラスセラミックまたは耐熱複合材料で形成された平板状のセラミック基板である。12,13はそれぞれ銀(Ag)系等を主体とする良導電体膜を基板11の両端に固着して形成された給電用の電極である。14は基板11の長手方向に沿って延びた配線パタン、15は基板11の長手方向に沿って配線パタン14と間隔をおいて延びた配線パタンである。16,17は、主にチタン酸バリウム(BaTiO)に希土類金属酸化物を加えたPTCの発熱体ペーストを、配線パタン14,15との間に基板11の長手方向に所定の間隔で印刷し、その後焼成して形成した抵抗発熱体である。
FIG. 1 is a front view for explaining an embodiment of the ceramic heater of the present invention, and FIG. 2 is a sectional view taken along line xx ′ of FIG.
In FIG. 1, reference numeral 11 denotes a flat ceramic substrate formed of a ceramic such as alumina (Al 2 O 3 ) having a thickness of about 0.5 mm to 1.0 mm, a glass ceramic, or a heat resistant composite material. Reference numerals 12 and 13 denote power supply electrodes formed by fixing a good conductor film mainly composed of silver (Ag) or the like to both ends of the substrate 11. Reference numeral 14 denotes a wiring pattern extending along the longitudinal direction of the substrate 11, and reference numeral 15 denotes a wiring pattern extending along the longitudinal direction of the substrate 11 at a distance from the wiring pattern 14. Nos. 16 and 17 are printed with a PTC heating element paste in which rare earth metal oxide is mainly added to barium titanate (BaTiO 3 ) between the wiring patterns 14 and 15 at a predetermined interval in the longitudinal direction of the substrate 11. Thereafter, the resistance heating element is formed by firing.

抵抗発熱体16の短手方向の一端は、配線パタン14と一部が多層された状態で配線パタン14に、抵抗発熱体17の短手方向の一端は、配線パタン15と一部が多層された状態で配線パタン15にそれぞれ基板11上に電気的に接続された状態で形成する。18,19は、例えば配線パタン14,15と同材料と工程で形成された配線パタンである。配線パタン18は抵抗発熱体16の短手方向の他端と、配線パタン19は抵抗発熱体17の短手方向の他端とをそれぞれ一部が多層された状態でそれぞれ基板11上に電気的に接続された状態で形成される。   One end of the resistance heating element 16 in the short direction is formed on the wiring pattern 14 in a state of being partly multilayered with the wiring pattern 14, and one end in the short direction of the resistance heating element 17 is formed on the wiring pattern 15 in part. In this state, the wiring patterns 15 are formed so as to be electrically connected to the substrate 11. Reference numerals 18 and 19 denote wiring patterns formed by the same material and process as the wiring patterns 14 and 15, for example. The wiring pattern 18 is electrically connected to the substrate 11 in a state where a part of the other end in the short direction of the resistance heating element 16 and the other end of the resistance heating element 17 in the short direction are respectively multilayered. It is formed in a connected state.

配線パタン14,15の長手方向の一端は、基板11上に固着形成された接続パタン20を介して電極12に接続し、長手方向の他端は開放する。配線パタン18,19の長手方向の一端は基板11上に固着形成された接続パタン21を介して電極13に接続し、長手方向の他端は開放する。   One end in the longitudinal direction of the wiring patterns 14 and 15 is connected to the electrode 12 via a connection pattern 20 fixedly formed on the substrate 11, and the other end in the longitudinal direction is opened. One end in the longitudinal direction of the wiring patterns 18 and 19 is connected to the electrode 13 via a connection pattern 21 fixedly formed on the substrate 11, and the other end in the longitudinal direction is opened.

22は、図1のx−x’断面の図2にも示すように、電極12,13および基板11の一部を除いた、抵抗発熱体16,17、配線パタン14,15,18,19を含む基板11を覆うように形成されたガラス層厚が20μm〜100μm程度で熱伝導率が、例えば2W/m・K以上のガラス質のオーバーコート層である。   22 shows resistance heating elements 16 and 17 and wiring patterns 14, 15, 18, and 19 excluding a part of the electrodes 12 and 13 and the substrate 11 as shown in FIG. 2 of the xx ′ cross section of FIG. A glassy overcoat layer having a glass layer thickness of about 20 μm to 100 μm and a thermal conductivity of, for example, 2 W / m · K or more is formed so as to cover the substrate 11 including the substrate.

以上の構成により板状のセラミックヒータ100が構成される。なお、オーバーコート層22の厚みに関しては、選定する材料の伝熱特性や装置内での耐久性等を考慮して決めるものであり、特に定義されるものではない。   The plate-shaped ceramic heater 100 is comprised by the above structure. The thickness of the overcoat layer 22 is determined in consideration of the heat transfer characteristics of the material to be selected, durability in the apparatus, and the like, and is not particularly defined.

このように、抵抗発熱体16,17は基板11の長手方向に2本形成されるとともに、電極12,13に対して並列接続されている。電極12,13に電力が供給されると、配線パタン14,18間の抵抗発熱体16、配線パタン15,19間の抵抗発熱体17にそれぞれ電流が流れ、抵抗発熱体16,17が発熱される。基板11の長手方向に幅広の抵抗発熱体16,17は、間隔の狭い対応の配線パタン14と18および15,19間にそれぞれ配置されていることから、抵抗発熱体16,17の特定箇所に異常があっても幅が大きいことから発熱への影響を極力抑え、均一な温度分布を得ることが可能となる。また、間隔の狭い対応の配線パタン間の抵抗発熱体が配置されていることから、素早い温度の立ち上がりを得ることができる。   As described above, two resistance heating elements 16 and 17 are formed in the longitudinal direction of the substrate 11 and are connected in parallel to the electrodes 12 and 13. When power is supplied to the electrodes 12 and 13, current flows through the resistance heating element 16 between the wiring patterns 14 and 18 and the resistance heating element 17 between the wiring patterns 15 and 19, respectively, and the resistance heating elements 16 and 17 generate heat. The Since the resistance heating elements 16 and 17 which are wide in the longitudinal direction of the substrate 11 are arranged between the corresponding wiring patterns 14 and 18 and 15 and 19 having a narrow interval, respectively, the resistance heating elements 16 and 17 are arranged at specific positions of the resistance heating elements 16 and 17. Even if there is an abnormality, since the width is large, it is possible to suppress the influence on heat generation as much as possible and obtain a uniform temperature distribution. In addition, since the resistance heating elements are arranged between the corresponding wiring patterns with a narrow interval, a quick rise in temperature can be obtained.

また、並列接続された抵抗発熱体16,17は、正の温度係数を有することから温度の上昇にともない抵抗も増加するが、並列接続されていることから、その抵抗値は小さくなり電流が流れにくくなることから、温度差による影響を抑えることができ、温度分布の均一化に寄与する。   In addition, the resistance heating elements 16 and 17 connected in parallel have a positive temperature coefficient, so that the resistance increases as the temperature rises. However, since the resistance heating elements 16 and 17 are connected in parallel, the resistance value decreases and current flows. Since it becomes difficult, the influence by a temperature difference can be suppressed and it contributes to uniform temperature distribution.

図3は、この発明のセラミックヒータに関する他の実施例について説明するための正面図、図4は図3のy−y’断面図である。この実施例は、配線パタン18,19を一体形成した配線パタン31の部分の構成が図1と異なり、同一構成部分には同一の符号を付してその説明は省略する。   FIG. 3 is a front view for explaining another embodiment of the ceramic heater according to the present invention, and FIG. 4 is a sectional view taken along the line y-y 'in FIG. In this embodiment, the configuration of the wiring pattern 31 in which the wiring patterns 18 and 19 are integrally formed is different from that in FIG. 1, and the same components are denoted by the same reference numerals and the description thereof is omitted.

すなわち、抵抗発熱体16,17は基板11の長手方向に2本形成されるとともに、電極12,13に対して並列接続されている。電極12,13に電力が供給されると、配線パタン14と31間の抵抗発熱体16、配線パタン15と31間の抵抗発熱体17にそれぞれ電流が流れ、抵抗発熱体16,17がそれぞれ発熱される。   That is, two resistance heating elements 16 and 17 are formed in the longitudinal direction of the substrate 11 and are connected in parallel to the electrodes 12 and 13. When electric power is supplied to the electrodes 12 and 13, current flows through the resistance heating element 16 between the wiring patterns 14 and 31, and the resistance heating element 17 between the wiring patterns 15 and 31, respectively, and the resistance heating elements 16 and 17 generate heat. Is done.

この実施例は、並列接続による発熱抵抗体16,17の持つ上記した効果に加え、電極13に接続される配線パタン31を一体化したため、基板11の短手方向の寸法を短くすることが可能となる。   In this embodiment, since the wiring pattern 31 connected to the electrode 13 is integrated in addition to the above-described effects of the heating resistors 16 and 17 by the parallel connection, it is possible to shorten the short dimension of the substrate 11. It becomes.

図5は、この発明のもう一つの他の実施例について説明するための図4に相当する断面図である。この実施例は抵抗発熱体16,17を一体化した抵抗発熱体167とするとともに配線パタン14,15,31の下側に配置した点が図3の実施例と異なり同一の構成部分には同一の符号を付して説明する。   FIG. 5 is a sectional view corresponding to FIG. 4 for explaining another embodiment of the present invention. This embodiment differs from the embodiment of FIG. 3 in that the same components are the same as the resistance heating element 167 in which the resistance heating elements 16 and 17 are integrated and arranged below the wiring patterns 14, 15 and 31. This will be described with reference numerals.

この実施例では、一体の発熱抵抗体167を配線パタン14と31および15と31との間に配置したことから、ほぼ同一の条件で形成できるばかりか、配線パタン14,15,31のほぼ全面が発熱抵抗体167に接触されていることから配線パタン14,15,31と抵抗発熱体167との接続条件も製品によるばらつきを抑えることができる。また、並列接続の関係にある配線パタン14と31および15と31との間のそれぞれの発熱抵抗体167の抵抗値もより同条件下にし易いものとなる。   In this embodiment, since the integral heating resistor 167 is disposed between the wiring patterns 14 and 31 and 15 and 31, it can be formed under substantially the same conditions, and almost the entire surface of the wiring patterns 14, 15, and 31. Is in contact with the heat generating resistor 167, the connection conditions between the wiring patterns 14, 15, 31 and the resistance heat generating member 167 can also suppress variations due to products. In addition, the resistance values of the respective heating resistors 167 between the wiring patterns 14 and 31 and 15 and 31 which are in a parallel connection relationship are more easily set under the same conditions.

上記した構成のセラミックヒータ100は、加熱装置に組み込まれ、例えば図6に示す回路構成により通電され発熱温度が調整される。すなわち、商用電源51を温度制御回路52の制御端子に接続されたソリッドステートリレー53を介してセラミックヒータ100の電極12,13に通電されると、直列接続された抵抗発熱体16,17に電流が流れて発熱する。抵抗発熱体16,17の発熱により基板11も温度上昇する。この熱は、基板11の裏面側に取着されたサーミスタ54の感温部に伝わり、感温部の抵抗値を変化させる。サーミスタ54の抵抗値の変化を、図1の基板11の裏面側に形成された配線導体を介して出力させ、これを温度制御回路52に入力して設定温度にあるか否かを判定する。温度が設定温度より低い場合はソリッドステートリレー53にオン信号を出力し、設定温度より高い場合はソリッドステートリレー53にオフ信号を出力する。   The ceramic heater 100 having the above-described configuration is incorporated in a heating device, and is energized by, for example, a circuit configuration illustrated in FIG. That is, when the commercial power supply 51 is energized to the electrodes 12 and 13 of the ceramic heater 100 via the solid state relay 53 connected to the control terminal of the temperature control circuit 52, the current flows to the resistance heating elements 16 and 17 connected in series. Flows and generates heat. The temperature of the substrate 11 also rises due to heat generated by the resistance heating elements 16 and 17. This heat is transmitted to the temperature sensing part of the thermistor 54 attached to the back side of the substrate 11 and changes the resistance value of the temperature sensing part. A change in the resistance value of the thermistor 54 is output via a wiring conductor formed on the back side of the substrate 11 in FIG. 1, and this is input to the temperature control circuit 52 to determine whether the temperature is at the set temperature. When the temperature is lower than the set temperature, an ON signal is output to the solid state relay 53, and when the temperature is higher than the set temperature, an OFF signal is output to the solid state relay 53.

このように、抵抗発熱体16,17に加える電力を制御することによって、抵抗発熱体16,17を温度調整する。なお、温度制御回路52はソリッドステートリレー53のオン・オフ制御について述べたが、他にパルス幅変調制御方式等による温度調整でも構わない。   Thus, the temperature of the resistance heating elements 16 and 17 is adjusted by controlling the power applied to the resistance heating elements 16 and 17. Although the temperature control circuit 52 has been described with respect to the ON / OFF control of the solid state relay 53, temperature adjustment by a pulse width modulation control method or the like may be used.

そして、セラミックヒータ100は電極12,13に電力が供給されると抵抗発熱体16,17にそれぞれ電流が流れ、抵抗発熱体16,17は長手方向にほぼ均一の発熱温度分布を呈することになる。この実施例では、例えば抵抗発熱体16,17の抵抗値を25Ωとし、100Vの電圧を印加することにより4Aの電流が流れ、400Wの発熱量を得ることが可能となる。   In the ceramic heater 100, when electric power is supplied to the electrodes 12 and 13, current flows through the resistance heating elements 16 and 17, respectively, and the resistance heating elements 16 and 17 exhibit a substantially uniform heating temperature distribution in the longitudinal direction. . In this embodiment, for example, when the resistance value of the resistance heating elements 16 and 17 is 25Ω and a voltage of 100 V is applied, a current of 4 A flows and a heating value of 400 W can be obtained.

通常は、上述したように基板11の裏面側に設けたサーミスタ54がセラミックヒータ100の温度を検出して温度制御回路52を通じてソリッドステートリレー53をオン・オフ制御し所定の温度に制御している。   Normally, as described above, the thermistor 54 provided on the back side of the substrate 11 detects the temperature of the ceramic heater 100 and controls the solid state relay 53 on / off through the temperature control circuit 52 to control it to a predetermined temperature. .

次に、図7を参照し、上記したセラミックヒータの実施例を定着装置200に実装した場合の、この発明の加熱装置の一実施例について説明する。図中セラミックヒータ100については、図1、図2と同じであり、同一部分には同一の符号を付してその説明は省略する。   Next, with reference to FIG. 7, an embodiment of the heating device of the present invention when the embodiment of the ceramic heater described above is mounted on the fixing device 200 will be described. The ceramic heater 100 in the figure is the same as that in FIGS. 1 and 2, and the same portions are denoted by the same reference numerals and description thereof is omitted.

図7において、201は回転軸202で回転自在に回転される加圧ローラで、その表面に耐熱性弾性材料たとえばシリコーンゴム層203が嵌合してある。加圧ローラ201の回転軸202と対向してセラミックヒータ100が並置して図示しない基台内に取り付けられている。   In FIG. 7, reference numeral 201 denotes a pressure roller which is rotated by a rotating shaft 202, and a heat resistant elastic material such as a silicone rubber layer 203 is fitted on the surface thereof. The ceramic heater 100 is juxtaposed with the rotating shaft 202 of the pressure roller 201 and attached to a base (not shown).

セラミックヒータ100の周囲にはポリイミド樹脂等の耐熱性のシートからなるエンドレスのロール状の定着フィルム204が循環自在に巻装されており、抵抗発熱体16,17を介した基板11真上のオーバーコート層21の表面は、この定着フィルム204を介して加圧ローラ201のシリコーンゴム層203と弾接している。   Around the ceramic heater 100, an endless roll-shaped fixing film 204 made of a heat-resistant sheet such as polyimide resin is circulated so as to circulate freely, and over the substrate 11 via the resistance heating elements 16 and 17 is overlaid. The surface of the coat layer 21 is in elastic contact with the silicone rubber layer 203 of the pressure roller 201 via the fixing film 204.

定着装置200においてセラミックヒータ100は電極12,13に接触したりん青銅板等に銀メッキを施した弾性が付与された図示しないコネクタを通じて通電され、発熱した抵抗発熱体16,17のオーバーコート層21上に設けられた定着フィルム204面とシリコーンゴム層203との間で、トナー像T1がまず定着フィルム204を介してセラミックヒータ100により加熱溶融され、少なくともその表面部は融点を大きく上回り完全に軟化溶融する。この後、加圧ローラ201の用紙排出側では複写用紙Pがセラミックヒータ100から離れ、トナー像T2は自然放熱して再び冷却固化し、定着フィルム204も複写用紙Pから離反される。   In the fixing device 200, the ceramic heater 100 is energized through a connector (not shown) in which a phosphor bronze plate or the like in contact with the electrodes 12 and 13 is subjected to elasticity by silver plating. The toner image T1 is first heated and melted by the ceramic heater 100 via the fixing film 204 between the surface of the fixing film 204 provided above and the silicone rubber layer 203, and at least the surface portion greatly exceeds the melting point and is completely softened. Melt. Thereafter, on the paper discharge side of the pressure roller 201, the copy paper P is separated from the ceramic heater 100, the toner image T2 is naturally radiated and cooled and solidified again, and the fixing film 204 is also separated from the copy paper P.

このように、トナー像T1は一旦完全に軟化溶融された後、加圧ローラ201の用紙排出側で再び冷却されることから、トナー像T2の凝縮力は非常に大きくなものとなっている。   As described above, the toner image T1 is once completely softened and melted and then cooled again on the paper discharge side of the pressure roller 201, so that the condensing force of the toner image T2 is very large.

この定着装置200では、図1に示す並列接続された抵抗発熱体16,17が正の温度係数を有することから温度の上昇にともない抵抗も増加するが、抵抗発熱体16,17全体の抵抗値は小さくなり電流が流れにくくなることから、温度差による影響を抑えることができ、温度分布の均一化に寄与する。これにより定着ムラや不良を改善することが可能となる。   In the fixing device 200, since the resistance heating elements 16 and 17 connected in parallel shown in FIG. 1 have a positive temperature coefficient, the resistance increases as the temperature rises. However, the resistance value of the resistance heating elements 16 and 17 as a whole is increased. Since the current becomes smaller and current does not flow easily, the influence of the temperature difference can be suppressed, which contributes to uniform temperature distribution. As a result, fixing unevenness and defects can be improved.

次に、図8を参照して、この発明に係るセラミックヒータ、このセラミックヒータを用いた加熱装置を搭載した複写機を例とした、この発明の画像形成装置について説明する。図中、加熱装置200の部分は、上記した説明と同じであり、同一部分には同一の符号を付し、その説明は省略する。   Next, with reference to FIG. 8, an image forming apparatus according to the present invention will be described, taking as an example a copying machine equipped with a ceramic heater according to the present invention and a heating device using the ceramic heater. In the figure, the part of the heating device 200 is the same as described above, and the same reference numerals are given to the same parts, and the description thereof is omitted.

図8において、301は複写機300の筐体、302は筐体301の上面に設けられたガラス等の透明部材からなる原稿載置台で、矢印Y方向に往復動作させて原稿P1を走査する。   In FIG. 8, 301 is a casing of the copying machine 300, 302 is a document placing table made of a transparent member such as glass provided on the upper surface of the casing 301, and scans the document P1 by reciprocating in the arrow Y direction.

筐体301内の上方向には光照射用のランプと反射鏡とからなる照明装置302が設けられており、この照明装置302により照射された原稿P1からの反射光源が短焦点小径結像素子アレイ303によって感光ドラム304上スリット露光される。なお、この感光ドラム304は矢印方向に回転する。   An illuminating device 302 including a light irradiation lamp and a reflecting mirror is provided in the upper direction in the housing 301, and a reflected light source from the document P1 irradiated by the illuminating device 302 is a short focus small diameter imaging element. A slit exposure is performed on the photosensitive drum 304 by the array 303. The photosensitive drum 304 rotates in the direction of the arrow.

また、305は帯電器で、例えば酸化亜鉛感光層あるいは有機半導体感光層が被覆された感光ドラム304上に一様に帯電を行う。この帯電器305により帯電された感光ドラム304には、結像素子アレイ303によって画像露光が行われた静電画像が形成される。この静電画像は、現像器306による加熱で軟化溶融する樹脂等からなるトナーを用いて顕像化される。   Reference numeral 305 denotes a charger that uniformly charges, for example, a photosensitive drum 304 coated with a zinc oxide photosensitive layer or an organic semiconductor photosensitive layer. An electrostatic image subjected to image exposure by the imaging element array 303 is formed on the photosensitive drum 304 charged by the charger 305. This electrostatic image is visualized using toner made of a resin that softens and melts when heated by the developing device 306.

カセット307内に収納されている複写用紙Pは、給送ローラ308と感光ドラム304上の画像と同期するタイミングをとって上下方向で圧接して回転される対の搬送ローラ309によって、感光ドラム304上に送り込まれる。そして、転写放電器310によって感光ドラム304上に形成されているトナー像は複写用紙P上に転写される。   The copy paper P stored in the cassette 307 is rotated by a pair of conveying rollers 309 that are rotated in pressure contact with each other in synchronization with the feeding roller 308 and the image on the photosensitive drum 304. Sent to the top. The toner image formed on the photosensitive drum 304 is transferred onto the copy paper P by the transfer discharger 310.

この後、感光ドラム304上から離れた用紙Pは、搬送ガイド311によって加熱装置200に導かれて加熱定着処理された後に、トレイ312内に排出される。なお、トナー像が転写された後、感光ドラム304上の残留トナーはクリーナ313を用いて除去される。   Thereafter, the paper P that is separated from the photosensitive drum 304 is guided to the heating device 200 by the conveyance guide 311 and subjected to a heat fixing process, and then discharged into the tray 312. After the toner image is transferred, residual toner on the photosensitive drum 304 is removed using a cleaner 313.

定着装置200は複写用紙Pの移動方向と直交する方向に、この複写機300が複写できる最大判用紙の幅(長さ)に合わせた有効長、すなわち最大判用紙の幅(長さ)より長い抵抗発熱体16,17を延在させてセラミックヒータ100の加圧ローラ201が設けられている。   The fixing device 200 is longer in the direction orthogonal to the moving direction of the copy paper P than the effective length corresponding to the width (length) of the maximum format paper that can be copied by the copier 300, that is, longer than the width (length) of the maximum format paper. The pressure roller 201 of the ceramic heater 100 is provided by extending the resistance heating elements 16 and 17.

そして、セラミックヒータ100と加圧ローラ201との間を送られる用紙P上の未定着トナー像T1は、抵抗発熱体16,17の熱を受け溶融して複写用紙P面上に文字、英数字、記号、図面等の複写像を現出させる。   The unfixed toner image T1 on the paper P sent between the ceramic heater 100 and the pressure roller 201 is melted by the heat of the resistance heating elements 16 and 17 and is printed on the surface of the copy paper P with characters and alphanumeric characters. A copy image such as a symbol or a drawing is displayed.

このような、複写機300は複写機等における定着ムラや不良を防止できることから、複写用紙の無駄の防止に寄与することが可能となる。   Since the copying machine 300 can prevent fixing unevenness and defects in the copying machine and the like, it can contribute to prevention of waste of copying paper.

なお、この発明は上記した実施例に限定されるものではない。例えば、オーバーコート層材は相対する定着フィルムの材質やその他条件によって変える必要があるため特定はできないが、定着フィルムが樹脂の場合、オーバーコート層はガラスや定着フィルムが金属の場合、オーバーコート層は樹脂を組み合わせるのが望ましい。この樹脂としては一般的に摺動性に優れるとされる材料である、ポリアミド(PA)、ポリアセタール(POM)、ポリテトラフルオロエチレン(PTFE)、およびポリフェニレンサルファイド、エラストマー系、ポリオレフィン系、フッ素等が考えられる。基本的にはどれを使用しても良いが、耐熱性から弾性に富むPI(ポリイミド)、PAI(ポリアミドイミド)等のイミド系が好ましいが、硬度が低すぎると樹脂被膜の方が削れてしまうため、例えば3H以上の硬度は必要である。   The present invention is not limited to the above-described embodiments. For example, the overcoat layer material cannot be specified because it needs to be changed depending on the material of the opposing fixing film and other conditions. However, when the fixing film is a resin, the overcoat layer is an overcoat layer when glass or the fixing film is a metal. It is desirable to combine resins. As this resin, polyamide (PA), polyacetal (POM), polytetrafluoroethylene (PTFE), polyphenylene sulfide, elastomers, polyolefins, fluorine, etc., which are generally considered to be excellent in slidability, are used. Conceivable. Basically, any of these may be used, but imides such as PI (polyimide) and PAI (polyamideimide), which are heat-resistant and elastic, are preferred, but if the hardness is too low, the resin coating will be scraped off. Therefore, for example, a hardness of 3H or more is necessary.

セラミックヒータの用途としては、複写機等の画像形成装置の定着用に用いたが、これに限らず、家庭用の電気製品、業務用や実験用の精密機器や化学反応用の機器等に装着して加熱や保温の熱源としても使用可能である。   Ceramic heaters are used for fixing image forming devices such as copiers, but are not limited to this, and are installed in household electrical products, precision instruments for business use and experiments, and chemical reaction equipment. Thus, it can also be used as a heat source for heating and heat insulation.

この発明のセラミックヒータに関する一実施例について説明するための正面図。The front view for demonstrating one Example regarding the ceramic heater of this invention. 図1のx−x’断面図。X-x 'sectional drawing of FIG. 図1に用いる温度調整について説明するための回路構成図。The circuit block diagram for demonstrating the temperature adjustment used for FIG. この発明のセラミックヒータに関する他の実施例について説明するための正面図。The front view for demonstrating the other Example regarding the ceramic heater of this invention. 図4のy−y’断面図。FIG. 5 is a cross-sectional view taken along the line y-y ′ in FIG. 4. この発明のもう一つの他の実施例について説明するための断面図。Sectional drawing for demonstrating another Example of this invention. この発明の加熱装置に関する一実施例について説明するための説明図。Explanatory drawing for demonstrating one Example regarding the heating apparatus of this invention. この発明の画像形成装置に関する一実施例について説明するための説明図。BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an explanatory diagram for explaining an embodiment relating to an image forming apparatus of the present invention;

符号の説明Explanation of symbols

11 基板
12,13 電極
14,15,18,19 配線パタン
16,17 抵抗発熱体
20,21 接続パタン
22 オーバーコート層
100 セラミックヒータ
200 定着装置
204 定着フィルム
300 複写機
11 Substrate 12, 13 Electrode 14, 15, 18, 19 Wiring pattern 16, 17 Resistance heating element 20, 21 Connection pattern 22 Overcoat layer 100 Ceramic heater 200 Fixing device 204 Fixing film 300 Copying machine

Claims (5)

耐熱・絶縁性材料で形成される長尺平板状の絶縁性基板と、
前記基板面上の長手方向に所定の間隔を置いて形成された正の温度係数を有する第1および第2の抵抗発熱体と、
前記第1の抵抗発熱体の短手方向の一端と電気的に接続した状態で前記基板上に形成された第1の配線パタンと、
前記第2の抵抗発熱体の短手方向の一端と電気的に接続した状態で前記基板上に形成された第2の配線パタンと、
前記第1の抵抗発熱体の短手方向の他端に接続して前記基板上に形成した第3の配線パタンと、
前記第2の抵抗発熱体の短手方向の他端に接続して前記基板上に形成した第4の配線パタンと、
一端が開放された前記第1および第2の配線パタンの長手方向の他端にそれぞれ接続される第1の電極と、
一端が開放された前記第3および第4の配線パタンの長手方向の他端にそれぞれ接続される第2の電極と、を具備したことを特徴とするセラミックヒータ。
A long plate-like insulating substrate formed of a heat-resistant and insulating material;
First and second resistance heating elements having positive temperature coefficients formed at predetermined intervals in the longitudinal direction on the substrate surface;
A first wiring pattern formed on the substrate in a state of being electrically connected to one end of the first resistance heating element in the short direction;
A second wiring pattern formed on the substrate in a state of being electrically connected to one end of the second resistance heating element in the lateral direction;
A third wiring pattern formed on the substrate connected to the other end in the short direction of the first resistance heating element;
A fourth wiring pattern formed on the substrate connected to the other end in the short direction of the second resistance heating element;
A first electrode connected to the other end in the longitudinal direction of the first and second wiring patterns with one end open;
And a second electrode connected to the other end in the longitudinal direction of the third and fourth wiring patterns, each having an open end, and a ceramic heater.
前記第3および第4の配線パタンを一体成形したことを特徴とする請求項1記載のセラミックヒータ。   The ceramic heater according to claim 1, wherein the third and fourth wiring patterns are integrally formed. 前記第1および第2の抵抗発熱体を一体形成し、一体形成された該第1および第2の抵抗発熱体に前記第1〜第4の配線パタンを形成したことを特徴とする請求項1または2記載のセラミックヒータ。   2. The first and second resistance heating elements are integrally formed, and the first and fourth wiring patterns are formed in the integrally formed first and second resistance heating elements. Or the ceramic heater of 2. 加熱ローラと、
前記加熱ローラに対向配置された抵抗発熱体が圧接された請求項1〜3いずれかに記載のセラミックヒータと、
前記セラミックヒータと前記加熱ローラとの間を移動可能に設けられた定着フィルムとを具備したことを特徴とする加熱装置。
A heating roller;
The ceramic heater according to any one of claims 1 to 3, wherein a resistance heating element disposed to face the heating roller is pressed.
A heating apparatus comprising a fixing film movably provided between the ceramic heater and the heating roller.
媒体に形成された静電潜像にトナーを付着させてこのトナーを用紙に転写して所定の画像を形成する手段と、
画像が形成された用紙を加圧ローラにより定着フィルムを介して定着用のヒータに圧接しながら通過させることによって、トナーを定着するようにした請求項4記載の定着装置とを具備したことを特徴とする画像処理装置。
Means for attaching a toner to an electrostatic latent image formed on a medium and transferring the toner to a sheet to form a predetermined image;
5. The fixing device according to claim 4, wherein the toner is fixed by passing the paper on which the image is formed through a fixing film through a fixing film while being pressed against a fixing heater. An image processing apparatus.
JP2004183633A 2004-06-22 2004-06-22 Ceramic heater, heating apparatus, and image forming apparatus Pending JP2006012444A (en)

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US8126383B2 (en) * 2008-03-31 2012-02-28 Sharp Kabushiki Kaisha Fixing apparatus having an enhanced planar heat generating body, and image forming apparatus including the same
CN101561654B (en) * 2008-04-18 2011-06-15 夏普株式会社 Fixing device and image forming apparatus including the same
JP2010049864A (en) * 2008-08-20 2010-03-04 Rohm Co Ltd Heater
JP2011016334A (en) * 2009-07-10 2011-01-27 Hideo Taniguchi Heating head, heater using the same, and heating method
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JP2016006499A (en) * 2014-05-26 2016-01-14 キヤノン株式会社 Heater and image heating apparatus including the same
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