JP2006003868A - Optical waveguide device and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical waveguide device having the high degree of freedom in terms of design such as the forming position of an optical path changing part and restraining the leakage of light and scattering loss, and its manufacturing method. <P>SOLUTION: The manufacturing method for the optical waveguide device is a method for manufacturing the optical waveguide device 100 equipped with a base part 3, a lower clad part 21 arranged on the base part 3, a core part 1 layered on the lower clad part 21 and propagating light, an upper clad part 22 arranged on the core part 1, the optical path changing parts 41 and 42 formed on the base part 3 and changing the optical path of the light propagated through the core part, and includes a core part forming unhardened film disposing stage for disposing a core part forming unhardened film on a layered body equipped with the base part 3, and the lower clad part 21 and the optical path changing parts 41 and 42 formed on the base part 3, a core part forming stage for forming the core part 1, and an upper clad part forming stage for forming the upper clad part 22. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an optical waveguide device and a manufacturing method thereof. More specifically, the present invention relates to an optical waveguide device that has a high degree of freedom in design, such as a formation position of an optical path conversion portion, and that suppresses the occurrence of light leakage and scattering loss, and a method for manufacturing the same.

  In the information processing field, the information communication field, and the like, the amount of data to be handled is increasing, and it is predicted that the data amount will increase in the future. Accordingly, the communication speed is required to increase. For this reason, it is desired to shift to processing using an optical signal having a processing speed higher than that of an electrical signal. In particular, in recent years, not only signal transmission paths with long transmission distances typified by optical communication cables and dedicated devices associated therewith, but also short signal transmission paths such as connections of boards and electronic components in general-purpose electronic equipment, The transition from electrical transmission media to optical transmission media is being considered. In this new information processing and information communication, an optical waveguide device formed of an organic material is attracting attention because it is excellent in material properties such as processability and flexibility, and in terms of cost.

  Usually, an optical waveguide includes a core part through which light propagates, a clad part that confines light in the core part, and an optical path conversion part. Of these, the optical path conversion unit is a part that converts the optical path of the propagating light, and is an important part in which the loss and accuracy of light propagation are greatly affected by the accuracy. As a method for forming this optical path changing portion, a method for forming the optical path changing portion by cutting out a part of the core portion by dicing (see, for example, Patent Document 1), on the optical axis of the optical exit port of the core portion. (For example, see Patent Document 2), a method for placing an optical path conversion component at a desired position, and then embedding it in a core portion using a spin coating method (for example, see Patent Documents 3 and 4). .) Etc. are known.

Japanese Patent Laid-Open No. 10-300961 JP 2002-082244 A Japanese Patent Application Laid-Open No. 2003-50329 (page 7, FIG. 7, etc.) Japanese Patent Laid-Open No. 2002-107561 (page 4, FIG. 3, etc.)

The method of Patent Document 1 is simple because no other member such as an optical path conversion component is used. However, it is difficult to dice only one portion of a desired optical path changing portion in the core portion. That is, usually, the substrate having the core portion must be diced so as to cross a straight line, and the degree of freedom of the formation position of the optical path changing portion is greatly limited. For this reason, it is difficult to achieve higher density and higher integration than the conventional electric circuit as described above.
Further, the method of Patent Document 2 is excellent in that the mirror can be arranged at a desired position and the degree of freedom of the formation position of the optical path conversion portion is high. However, since there is a gap between the optical exit port and the mirror, there is light leakage. In particular, when the number of optical path conversion units increases, the loss may not be negligible.
Furthermore, in the methods of Patent Documents 3 and 4 described above, the core portion and the like are raised and formed on the optical path conversion component because the spin coating method is used. For this reason, it is necessary to provide a polishing process. However, it is difficult to polish an organic material, and it is necessary to cure before polishing, which limits the freedom of the process. Furthermore, there is a problem that it is difficult to control the shape of the core near the optical path changing part. That is, for example, in Patent Document 3, the lower clad portion formed by spin coating substantially covers the optical path conversion component, and the optical path is changed in the intended direction even if the core portion is formed on the lower clad portion. May cause problems such as difficulty.

  The present invention has been made in view of the above circumstances, and it is an object of the present invention to provide an optical waveguide device having a high degree of freedom in design such as a formation position of an optical path changing portion and suppressing leakage and scattering loss, and a method for manufacturing the same. And

The present invention is as follows.
(1) a base, a lower clad disposed on the base, a core that is laminated on the lower clad and transmits light, an upper clad disposed on the core, and the base An optical waveguide device manufacturing method comprising: an optical path conversion unit configured to convert an optical path of light propagating through the core unit; and the base, the lower cladding unit formed on the base, and A laminated body comprising the above optical path changing unit [hereinafter also referred to as “laminated body (i)”. On the top, an uncured film for forming a core part for disposing an uncured film for forming a core part, a core part forming process for forming the core part, and an upper clad part forming for forming the upper clad part And a process for producing an optical waveguide device.
(2) a base, a lower clad disposed on the base, a core that is laminated on the lower clad and propagates light, an upper clad disposed on the core, and the base An optical path conversion unit configured to convert an optical path of light propagating through the core unit, the base unit, and the lower cladding unit formed on the base unit. A laminated body comprising an uncured lower clad part and an optical path changing part [hereinafter also referred to as “laminated body (ii)”. On the top, an uncured film for forming a core part for disposing an uncured film for forming a core part, a core part forming process for forming the core part, and an upper clad part forming for forming the upper clad part And a process for producing an optical waveguide device.
(3) In the core part-forming uncured film disposing step, the uppermost part of the optical path converting part is flush with the upper surface of the core part-forming uncured film, or the uppermost part of the optical path changing part The method for producing an optical waveguide device according to (1) or (2), wherein the uncured film for forming a core part is disposed such that the uncured film for core part formation protrudes from the upper surface of the uncured film for core part formation.
(4) The manufacturing process of the optical waveguide device according to any one of (1) to (3), wherein the uncured film forming process for forming a core part includes a pressing process for pressing the uncured film for forming a core part. Method.
(5) The said crimping | compression-bonding process is a manufacturing method of the optical waveguide device as described in said (4) performed using the lamination method.
(6) The method for manufacturing an optical waveguide device according to (4), wherein the crimping step is performed using a pressing method.
(7) The method for manufacturing an optical waveguide device according to any one of (4) to (6), wherein the pressure bonding is performed by applying pressure at 0.1 to 2.4 MPa at a temperature of 20 to 130 ° C.
(8) The method for producing an optical waveguide device according to any one of (1) to (7), wherein the viscosity of the uncured film for forming a core part at a temperature of 20 ° C. is 10 Pa · s or more.
(9) a base, a lower clad disposed on the base, a core that is laminated on the lower clad and transmits light, an upper clad disposed on the core, and the base And an optical path conversion unit that converts the optical path of the light that has propagated through the core part, and the optical path conversion part is formed on the base part on the surface of which the optical path conversion part is formed. An uncured composite disposing step of disposing an uncured composite composed of an uncured lower clad serving as a lower clad and an uncured core serving as the core, and a core forming the core An optical waveguide device manufacturing method comprising: a forming step; and an upper clad portion forming step for forming the upper clad portion.
(10) An optical waveguide device obtained by the manufacturing method according to any one of (1) to (9).

According to the method for manufacturing an optical waveguide device of the present invention, the core portion is formed by pasting a film prepared in advance with a predetermined thickness instead of pouring a liquid material by a method such as spin coating. The part can be formed with a substantially constant thickness. As a result, an optical waveguide device in which light leakage and scattering loss are suppressed can be easily manufactured. In addition, since the degree of freedom in designing the formation position of the optical path conversion section is high, it is possible to design an optical path with a high degree of freedom, and it is possible to easily achieve high density and high integration.
In addition, the uncured film for forming the core part is formed so that the uppermost part of the optical path changing part is flush with the upper surface of the uncured film for forming the core part or so as to protrude from the upper surface of the uncured film for forming the core part. When arranged, an optical waveguide device in which the occurrence of light leakage and scattering loss is more reliably suppressed can be easily manufactured.
Furthermore, when the uncured film for forming the core part is disposed by a specific method, the material resin can be applied to a predetermined position without exuding from the film prepared in advance, so that the thickness is kept constant. it can.
Moreover, when the viscosity of the uncured film for forming a core part at a temperature of 20 ° C. is 10 Pa · s or more, it is easy to produce a film, and the thickness can be made particularly uniform.
According to another method of manufacturing an optical waveguide device of the present invention, the core portion and the lower clad portion can be efficiently formed, and the core portion can be formed with a substantially constant thickness. It is possible to easily manufacture an optical waveguide device in which the occurrence of this is suppressed.
Since the optical waveguide device of the present invention is manufactured by each of the manufacturing methods described above, the occurrence of light leakage and scattering loss is sufficiently suppressed, and can be widely used in the fields of optical communication, electric and electronics, and the like.
In addition, when the uppermost part of the optical path changing unit is formed so as to be flush with the upper surface of the core part or projecting from the upper surface of the core part, light leakage and scattering loss are more reliably generated. It becomes a suppressed optical waveguide device.

The present invention will be described in detail below.
[1] Optical waveguide device The optical waveguide device of the present invention is obtained by a method of manufacturing each optical waveguide device described later, and is laminated on a base, a lower clad portion disposed on the base, and a lower clad portion. And a core part that propagates light, an upper clad part disposed on the core part, and an optical path conversion part that is formed on the base part and converts the optical path of the light propagated through the core part. Features.

The material constituting the “base” is not particularly limited, and examples thereof include organic materials, inorganic materials, and composite materials using both.
The organic material is not particularly limited. For example, epoxy resin, BT (bismaleimide / triazine) resin, polyimide resin, phenol resin, xylene resin, thermosetting PPE (polyphenylene ether) resin, LCP ( Liquid crystal polymer), BCB (benzocyclobutene), polynorbornene and the like. These organic materials may be used alone or in combination of two or more. In addition, various rubbers and the like can be used in the base portion for the purpose of, for example, improving the strength.
Further, when an organic material is used, a glass cloth, a glass nonwoven fabric, a resin (polyamide, etc.) cloth, a resin (polyamide, etc.) nonwoven fabric, a resin (polyamide, etc.) film, PTFE (polytetrafluoro) as a core material inside the base portion. For example, a fluororesin-based core material and a metal foil having a three-dimensional network structure formed of ethylene may be used.

  The inorganic material is not particularly limited. For example, alumina, quartz, titania, zirconia, garnite, titanate (magnesium titanate, calcium titanate, strontium titanate, barium titanate etc.), mullite, cordierite, Examples thereof include ceramic materials such as stellite, wollastonite, anorthite, enstatite, diopsite, akermanite, gelenite, and spinel. Furthermore, crystalline or non-crystalline glass-based materials can be mentioned. Examples of the component constituting the glass material include Si, Al, Na, K, Mg, Ca, B, Pb, and Zn. Specific examples include aluminosilicate glass and aluminoborosilicate glass. These ceramic materials and glass materials may be used alone or in combination. When used in combination, a ceramic material can be contained in the glass material as a filler. These inorganic materials may be used alone or in combination of two or more.

The “core part” is a part through which light propagates, and is composed of a photo-curing resin in which a photopolymerizable composition described below is cured at least by irradiation with light. Or it forms using a non-hardened composite body provided with the unhardened core part mentioned later.
Examples of the photocurable resin include epoxy resins, acrylic resins, fluororesins, polyimide resins, bismaleimide resins, polyphenylene resins, polyphenylene ether resins, phenol resins, silicone resins, urethane resins, Examples include polyester resins, phenoxy resins, and polyolefin resins. In addition, each halogenated resin in which at least a part of hydrogen atoms included in each of these resins is substituted with a halogen atom (F, Cl, Br, etc.), and at least a part of hydrogen atoms included in these resins are deuterium atoms. Examples include substituted deuterated resins. Only one kind of these resins may be used, or two or more kinds may be used in combination. Of these, epoxy resins and acrylic resins are preferable. When the core part is made of an epoxy resin, the optical waveguide device is particularly excellent in heat resistance, insulation, chemical resistance and water resistance. Further, when the core portion is made of an acrylic resin, the optical waveguide device is particularly excellent in photosensitivity and transparency.

The planar shape of the core part is not particularly limited, and may be linear or curved. Furthermore, you may have a branch.
Further, the cross-sectional shape (cross-section with respect to the light propagation direction) is not particularly limited, and may be a quadrangle (such as a square or a rectangle) or a circle. Moreover, it can also be made into polygons other than a rectangle, and cross-sectional shape which is not perfect circles like an ellipse etc. may be sufficient.

  The refractive index of the core part may be a substantially uniform refractive index or may have different parts regardless of the type of resin constituting the core part and the number of types. . Note that the core portion has a portion with a different refractive index, for example, when the refractive index at the center of the core portion is maximum and the refractive index decreases as it approaches the cladding portion. Further, the refractive index may be different or the same between different types of resins, and even a resin derived from the same monomer changes depending on the degree of polymerization. Therefore, the uniform refractive index portion and the different refractive index portion may be obtained from the same kind of resin or from different kinds of resins.

  The light transmission characteristics of the core portion are not particularly limited, and any light such as infrared rays (including near infrared rays), visible rays, and ultraviolet rays can be transmitted. Especially, it is preferable that it is what can permeate | transmit a near infrared ray (0.7-25 micrometers) especially, and it is more preferable that it is a thing suitable for transmission of a near infrared ray (0.7-2 micrometers).

  The “lower cladding part” and the “upper cladding part” are parts constituting the cladding part, respectively. The clad portion is a portion surrounding the core portion, and is a portion capable of reflecting light propagating in the core portion at the interface with the core portion. For example, the clad portion can obtain this effect by making the refractive index smaller (usually 0.2% or more) than the core portion. The lower clad part and the upper clad part may have the same refractive index or different ones.

The lower clad portion and the upper clad portion are formed before the uncured film for forming the core portion is disposed in the optical waveguide device obtained by the optical waveguide device manufacturing method (i) described later. The clad portion that has been formed is the lower clad portion, and the clad portion formed after the uncured film is disposed is the upper clad portion. Further, in the optical waveguide device obtained by the optical waveguide device manufacturing method (ii) described later, the uncured cladding portion formed before the uncured film for forming the core portion is disposed is cured later. What is formed is a lower clad portion, and a clad portion formed after the uncured film is disposed is an upper clad portion. Further, in the optical waveguide device obtained by the optical waveguide device manufacturing method (iii) described later, the uncured clad portion constituting the uncured composite is cured, which is the lower clad portion. The clad formed after the uncured composite is disposed is the upper clad.
Therefore, for example, a portion disposed below the lower end surface (one surface facing the lower cladding portion) of the core portion is a lower cladding portion, and a portion disposed above the lower end surface of the core portion is an upper cladding. Part. In addition, in the optical waveguide device manufacturing method (iii) described later, in an optical waveguide device obtained using an uncured composite having an uncured core portion to which a core pattern is provided, the upper end surface of the core portion A portion disposed below (one surface facing the upper cladding portion) can be a lower cladding portion, and a portion disposed above the upper end surface of the core portion can be an upper cladding portion.

  Moreover, each of these lower clad part and upper clad part may be formed in steps for every predetermined part. That is, for example, the upper clad part is composed of an intermediate clad part formed so as to fill each core pattern to the height of the core part, and an uppermost clad part formed on the upper surface of the core part and the intermediate clad. May be.

The material which comprises this lower clad part and upper clad part is not specifically limited. An inorganic material may be used for each of these clad parts, but processing is easy, and it is easier to match the thermal expansion coefficient with the photopolymerizable composition that is cured to form the core part. Therefore, an organic material is usually used. As this organic material, each resin etc. which were mentioned as said photocuring resin can be used.
Moreover, the core part and each clad part may consist of the same material, and may consist of a different material. Further, the lower clad part and the upper clad part may be made of the same material or different materials. Further, for example, when the upper clad part is composed of the intermediate clad part and the uppermost clad part as described above, these may be made of the same material or may be made of different materials. Good. That is, each clad part may be formed from one material or two or more materials.
Moreover, the shape (cross-sectional shape etc.) of a lower clad part and an upper clad part is not specifically limited.

The “optical path changing part” is a part that is formed on the base part and reflects light propagating in the core part. By having this optical path conversion unit, it is possible to efficiently convert the optical path while preventing light leakage. Only one optical path conversion unit may be arranged in the optical waveguide device, or two or more optical path conversion units may be arranged. Note that “on the base” means above the base, and the optical path changing portion may be disposed on the surface of the base as shown in FIGS. 3 to 5 (see FIG. 3), or on the surface of the lower cladding portion. May be arranged (see FIG. 4), or may be arranged so as to be partially buried in the lower cladding part (see FIG. 5).
The shape of the optical path conversion unit is not particularly limited as long as the optical path can be converted. Examples of this shape include shapes such as a triangular prism and a quadrangular prism such as a quadrangular prism having an inclined reflecting surface. One optical path conversion unit may have one reflecting surface or two or more reflecting surfaces. When an optical path changing unit having two or more reflecting surfaces is used, higher density and higher integration can be achieved. Further, the direction of the optical path conversion by the optical path conversion component is not limited. For example, the optical path conversion in the core or the optical path conversion to the outside of the core may be used.

Furthermore, the optical path conversion unit may be formed of any material as long as it has a surface capable of reflecting light, but is preferably formed of a material having high reflectivity such as metal. Of these, gold, silver, copper, rhodium, nickel and the like are preferable. These may use only 1 type and may use 2 or more types together.
The method of forming the optical path changing portion is not particularly limited. For example, after pressing a metal lump on the base or lower clad, the metal lump is formed into a predetermined shape using a stamping jig. Can also be obtained.
In addition, the optical path conversion unit can be formed by arranging optical path conversion parts molded in a predetermined shape in a predetermined position. The manufacturing method of the optical path conversion component is not particularly limited. For example, the optical path conversion part can be obtained by peeling the substrate after forming the optical path conversion portion on the surface of the peelable substrate or the like by the same method as described above. Further, it can be produced by a general metal working method such as casting / forging.
Furthermore, when the optical path conversion component is disposed, the optical path conversion component may or may not be bonded to the base, the lower clad, the mark provided on the surface, and the like. When joining, when the lower clad part is in an uncured state, the joining force resulting from the curing may be used, pressure bonding may be performed, a bonding agent may be used, and a thermosonic method, etc. May be joined together.

  In the optical waveguide device of the present invention, it is preferable that the uppermost portion of the optical path changing portion is formed so as to be flush with the upper surface of the core portion or protrude from the upper surface of the core portion. In this case, an optical waveguide device in which the occurrence of light leakage and scattering loss is sufficiently suppressed is obtained.

The optical waveguide device of the present invention can include other parts in addition to the base part, the lower clad part, the core part, the upper clad part, and the optical path changing part.
As said other part, optical components, such as a light emitting element and a light receiving element, etc. are mentioned. Furthermore, various electronic parts etc. are mentioned.

As said light emitting element, a surface emitting laser (Vertical Cavity Surface Emitting Laser; VCSEL), a light emitting diode (Light Emitting Diode; LED), a semiconductor laser diode (Laser Diode; LD) etc. are mentioned, for example. These may use only 1 type and may use 2 or more types together.
Examples of the light receiving element include a pin photodiode (pin PD) and an avalanche photodiode (APD). These may use only 1 type and may use 2 or more types together. The light emitting element and the light receiving element may be integrated.
Furthermore, examples of electronic components include various active components (such as integrated circuit elements and transistors), passive components (such as capacitors, capacitors, and inductors), conversion components (such as filters and transformers), and connection components. These may use only 1 type and may use 2 or more types together.
The method for mounting these optical components and electronic components is not particularly limited, and may be wire bonding and / or flip chip bonding.

  The optical waveguide device can further include a conductor portion. In particular, when an optical element such as the light emitting element and the light receiving element is provided, it is preferable to include a conductor portion. By providing the conductor portion, the optical element can be electrically connected to another electronic component, and the optical waveguide structure, the optical element, the electronic component, and the like can be handled as an integrated object. Further, by providing the conductor portion in the present optical waveguide device, the connection distance between the optical element and the electronic component can be kept short, and the responsiveness can be improved. Furthermore, this contributes to miniaturization of the optical waveguide device itself.

The type of the conductor portion is not particularly limited, and examples thereof include normal wiring, through-hole conductors, via conductors, wiring patterns that function as resistors, wiring patterns that function as inductors, wiring patterns that function as capacitors, lands, and the like. There are no particular restrictions on the location of these conductors, but they can be placed in the cladding, the surface of the cladding, the base, or the like. Furthermore, the material which comprises a conductor part is not specifically limited, For example, gold | metal | money, silver, copper, platinum, nickel, chromium, titanium, aluminum, tungsten, molybdenum etc. can be used. These may use only 1 type and may use 2 or more types together.
The method for forming the conductor portion is not particularly limited. For example, sputtering, ion plating, vapor deposition (including CVD and PVD), vapor deposition and plating, and patterning such as photolithography. Can be obtained in combination with the law.

[2] Manufacturing method of optical waveguide device (i)
An optical waveguide device manufacturing method according to the present invention includes a base, a lower clad disposed on the base, a core that is laminated on the lower clad and transmits light, and an upper clad disposed on the core. And an optical path conversion unit that converts an optical path of light that has been propagated through the core and is formed on the base, and a method for manufacturing an optical waveguide device, the base and the base formed on the base An uncured film forming step for forming a core part on a laminate (i) including a lower clad part and the optical path changing part, and a core for forming the core part. A portion forming step and an upper clad portion forming step for forming the upper clad portion.

In the “core part forming uncured film disposing step”, the core part forming uncured film is disposed on the laminate (i) described later.
The “uncured film for forming a core part” is a film made of a photopolymerizable composition, and has substantially no fluidity. “Substantially no fluidity” means that the formed molding state can be maintained. Specifically, the core part-forming uncured film preferably has a viscosity at 20 ° C. of 10 Pa · s or more, more preferably 50 Pa · s or more, and still more preferably 200 Pa · s or more. When this viscosity is 10 Pa · s or more, even if there is some stickiness, the film can be easily operated by itself.

This photopolymerizable composition is polymerized by irradiation with predetermined light such as ultraviolet rays, infrared rays, near infrared rays and the like (“polymerization” includes “copolymerization” and “homopolymerization”, the same applies hereinafter). It means that polymerization has proceeded. ”) A composition that is cured to become a photocured resin. In addition, the concept of the photo-curing resin in the present invention includes, as long as it can be cured by irradiation with a predetermined light, generally referred to as a thermosetting polymer (“polymer” includes “copolymer” and “ Including homopolymers. The same shall apply hereinafter) and thermoplastic polymers. Further, the presence or absence of a three-dimensional structure in the resin is not limited.
Although the component contained in this photopolymerizable composition is not specifically limited, Usually, a photopolymerizable compound and a photopolymerization initiator are contained.
Examples of the photopolymerizable compound include an epoxy compound, an acrylic compound, a fluorine compound, an imide compound, a bismaleimide compound, a phenylene compound, a phenylene ether compound, a phenol compound, a silicone compound, and a urethane compound. Examples thereof include compounds, ester compounds, phenoxy compounds and olefin compounds. These compounds may use only 1 type and may use 2 or more types together. Among these, acrylic compounds and epoxy compounds are preferable. When the photopolymerizable composition contains an epoxy compound, an optical waveguide excellent in heat resistance, insulation, chemical resistance and water resistance can be obtained, and when it contains an acrylic compound, it is photosensitive and transparent. This is because an excellent optical waveguide can be obtained.

The said epoxy-type compound says the compound which can superpose | polymerize by having an epoxy group. This epoxy compound is not particularly limited, and may be, for example, an oligomer, a monomer, or a mixture thereof. The monomer (in the oligomer, the monomer before oligomerization) and the oligomer may be bifunctional, polyfunctional, or a mixture thereof. Furthermore, as these monomers and oligomers, deuterates in which some or all of the hydrogen atoms are substituted with deuterium atoms can be used. In addition, a halide in which some or all of the hydrogen atoms are substituted with halogen atoms can be used. Furthermore, it may or may not have a silicone chain in the molecule.
Specifically, examples of the bifunctional epoxy compound include a glycidyl ether type, a glycidyl amine type, a glycidyl ester type, an alicyclic type (such as an epoxy compound having a cyclohexene oxide structure), and the like. Among these, examples of the glycidyl ether type include various bisphenol types, biphenyl types, naphthalene types, and fluorene types. Among these, examples of the bisphenol type include bisphenol A type, bisphenol F type, hydrogenated bisphenol type, bisphenol AF type, and bisphenol S type. Examples of the glycidylamine type include hydantoin type, aniline type, and toluidine type.
On the other hand, examples of the polyfunctional epoxy compound include glycidyl ether type and glycidyl amine type. Among these, examples of the glycidyl ether type include a phenol novolak type, a cresol novolak type, a diphenylpropane type, a trishydroxyphenylmethane type, and a tetraphenylolethane type. Examples of the glycidylamine type include aminophenol type, tetraglycidyldiaminidiphenylmethane type, triglycidyl isocyanurate type, and 1,3-bis (N, N-diglycidylaminomethyl) cyclohexane type.
These glycidyl ether type epoxy compounds include monovalent aliphatic alcohols, polyhydric aliphatic alcohols, monovalent aromatic alcohols and polyvalent aromatic alcohols, glycidyl ether types derived from monohydric phenols and polyhydric phenols. Epoxy compounds are included. Examples of the aromatic ring constituting each aromatic alcohol include a benzene ring, a naphthalene ring, and an anthracene ring.
A compound in which some or all of the hydrogen atoms of each of these epoxy compounds are substituted with deuterium atoms and / or halogen atoms is exemplified.

Examples of the acrylic compound include monovalent to polyvalent (meth) acrylate monomers and oligomers, compounds obtained by esterifying an alcohol with a carboxylic acid having an unsaturated bond such as acrylic acid or methacrylic acid, and derivatives thereof. It is done. Furthermore, the compound (for example, epoxy acrylate etc.) which added these acrylic compounds to the one part or all part epoxy group which an epoxy oligomer has is mentioned.
Further, among these photopolymerizable compounds, a photopolymerizable composition having substantially no fluidity can be easily obtained by using a solid material as a main component at room temperature. At this time, blending of various commercially available materials and the like is adjusted according to desired characteristics.

Examples of the photopolymerization initiator include a photoacid generator and a photoradical generator. These photopolymerization initiators are appropriately selected according to the type of the photopolymerizable compound.
The photoacid generator refers to a compound capable of generating an acid upon irradiation with light and / or irradiation with light to a photosensitizer described later. Examples of the photoacid generator include an ionic acid generator and a nonionic acid generator. Examples of ionic acid generators include Lewis acid generators (various diazonium salts such as aryldiazonium salts), Bronsted acid generators [various onium salts (iodonium salts such as diaryliodonium salts, triarylsulfonium salts, alkyldiaryls). Sulfonium salts such as sulfonium salts, selenium salts such as diaryl selenium salts, etc.)]. Examples of nonionic acid generators include sulfonic acid generators (such as sulfonic acid esters), carboxylic acid generators (such as carboxylic acid esters), and amide derivatives. These photoacid generators may be used alone or in combination of two or more.
When the photopolymerizable compound is an epoxy compound, it is preferable to use a photoacid generator as a photopolymerization initiator.

The photo radical generator refers to a compound capable of generating radicals by light irradiation and / or a compound capable of generating radicals due to light irradiation to a photosensitizer described later. The photo radical generator is not particularly limited, and examples thereof include organic boron complexes, s-triazine compounds, hexaarylbiimidazole compounds, titanocene compounds, carbonyl compounds, azo compounds, and organic peroxides. This photo radical generator may use only 1 type and may use 2 or more types together.
In addition, when the photopolymerizable compound is an acrylic compound, it is preferable to use a photoradical generator as a photopolymerization initiator.

  The mass ratio of the photopolymerizable compound to the photopolymerization initiator (photopolymerizable compound / photopolymerization initiator) is not particularly limited, but is preferably 100 / 0.05 to 100/10, more preferably. Is 100 / 0.1 to 100/5, more preferably 100 / 0.2 to 100/4. When this mass ratio is 100 / 0.05 to 100/10, an optical waveguide device that is superior in heat resistance, insulation, chemical resistance, and water resistance can be obtained by sufficiently proceeding the polymerization reaction.

  Further, the photopolymerizable composition can contain a photosensitizer according to the type of light irradiated when it is cured. The photosensitizer has a sensitizing action on the irradiated light and can assist the photopolymerization initiator. This photosensitizer is effective when it is difficult to obtain sufficient photosensitivity to the irradiated light with only a photopolymerization initiator or the like.

The photopolymerizable composition may further contain a thermosetting agent in order to improve the physical properties after curing. Examples of the thermosetting agent include a thermal acid generator and a thermal radical generator. These thermosetting agents are appropriately selected according to the type of the photopolymerizable composition.
Examples of the thermal acid generator, an aromatic sulfonium salt compounds (as a counter anion, for example, SbF ₆ ^- and PF ₆ ^-, etc.), as thiophene compound salt (counter anion, for example, SbF ₆ ^- and PF ₆ ^- ), Pyridine-based compounds, soluble organic acids (eg, trifluoroacetic acid and paratoluenesulfonic acid), and Lewis acids (eg, boron trifluoride monoethylamine, boron trifluoride benzylamine, boron tetrafluoride) Acid salts, etc.). Specifically, SI-100L, SI-80L, SI-60L, SI-110L and SI-180L manufactured by Sanshin Chemical Co., Ltd., Adeka Opton CP-66 and CP-77 manufactured by Asahi Denka Co., Ltd., Nippon Soda CI-2639 and CI-2624 manufactured by Corporation, BSP (2-tribromomethylsulfonylpyridine), BMPS (α, α, α-tribromomethylphenylsulfone) manufactured by Sumitomo Seika Co., Ltd. and the like can be mentioned. In addition, when the said photopolymerizable composition contains an epoxy-type compound, it is preferable to use a thermal acid generator at least as a thermosetting agent.
Examples of the thermal radical generator include various organic peroxides (such as benzoyl peroxide). In addition, when the said photopolymerizable composition contains an acryl-type compound, it is preferable to use a thermal radical generator at least as a thermosetting agent.

  The mass ratio between the photopolymerizable composition and the thermosetting agent (photopolymerizable composition / thermosetting agent) is not particularly limited, but is preferably 100 / 0.05 to 100/10, more preferably. Is 100 / 0.1 to 100/5, more preferably 100 / 0.2 to 100/4. When this mass ratio is 100 / 0.05 to 100/10, the polymerization reaction by heating sufficiently proceeds to form a core portion with a more uniform cured state.

The uncured film for forming the core part may be a single film or a laminate including a peelable support and / or a peelable surface protective film. In addition, when providing both a support body and a surface protection film, one is formed in the one surface of the uncured film for core part formation, and the other is formed in the other surface of the uncured film for core part formation. Specifically, as shown in FIG. 6, those having a peelable support 51 and a peelable surface protective film 52 on the surface of the uncured film 10 are exemplified.
When the support is provided, it is preferable because the operability at the time of disposing the uncured film for forming the core part is improved. Moreover, when providing the said surface protective film, since the storage property of the uncured film for core part formation improves, it is preferable.
The support is not particularly limited as long as it can be peeled off from the uncured film for forming the core part. For example, polyester such as polyethylene terephthalate (PET), polyethylene, polypropylene, polyamide, polyvinyl chloride, polyvinylidene chloride, Examples thereof include resin films and resin sheets such as polyvinyl alcohol, polycarbonate, polystyrene, polyacrylonitrile copolymer, ethylene / vinyl acetate copolymer, and ethylene / vinyl alcohol copolymer.
In addition, the surface protective film may be any film as long as it can be peeled off from the uncured film for forming a core part, similarly to the support, and examples thereof include the same structure as the support.
In addition, the shape of a support body and a surface protection film is not specifically limited, According to a use, it can be set as a predetermined shape, respectively.

  Moreover, the thickness of the uncured film for forming the core part can be appropriately adjusted according to the use, and is not particularly limited. For example, it is preferably 150 μm or less, more preferably 20 to 80 μm, and still more preferably. 40-60 μm. In particular, it is often adjusted to about 50 μm according to the diameter of the multimode optical fiber.

The method for producing the core part-forming uncured film is not particularly limited. For example, the photopolymerizable composition and a solvent are mixed and dissolved to prepare a mixed solution, and then the obtained mixed solution is prepared. It can manufacture by coating on the said support body or the said surface protection film. Furthermore, you may provide the drying process for removing a solvent as needed.
The solvent is not particularly limited as long as it can dissolve the raw material into a uniform solution. For example, ketone solvents such as methyl ethyl ketone, methyl isobutyl ketone and acetone, alcohol solvents such as methanol, ethanol and n-butanol, xylene, Examples thereof include aromatic solvents such as toluene and benzene, aliphatic hydrocarbon solvents such as hexane and pentane, phenol solvents such as phenol and cresol, and ether solvents such as diethyl ether and methoxytoluene.
The blending amount of the solvent is not particularly limited, but is preferably 40 to 90% by mass, more preferably 60 to 85% by mass when the total of the photopolymerizable composition and the solvent is 100% by mass. is there.
A method for coating the mixed solution on the support or the surface protective film is not particularly limited, but a casting method is preferably used. In this case, there is little raw material loss and productivity can be improved.
In addition, when a drying process is provided, for example, drying means such as heat drying and reduced pressure drying can be used. In addition, each drying condition is suitably adjusted according to the component to contain.

The “laminated body (i)” includes a base, a lower clad formed on the base, and an optical path changing unit formed on the base and / or the lower clad. The above description can be applied to the base, the lower cladding, and the optical path changing unit as they are.
The method for producing the laminate (i) is not particularly limited. For example, (1) the lower clad part-forming composition is applied or the lower clad part-forming uncured film is disposed on the base surface, A method obtained by embedding a part of an optical path conversion component prepared in advance to form an optical path conversion section, and then curing by irradiation with predetermined light and / or heating to form a lower cladding section (2) A lower clad part-forming composition is applied on the surface of the base or an uncured film for lower clad part formation is disposed, and then cured by irradiation with predetermined light and / or heating to form a lower clad part. And then forming an optical path changing part on the lower clad part, (3) forming an optical path changing part on the surface of the base, and then applying or applying a lower clad part forming composition. Disposed the head portion uncured film for forming, then, and a method of obtaining by forming a lower clad portion is cured by light irradiation and / or heating of the predetermined light, and the like.
In each of these methods, it is more preferable to use an uncured film for forming the lower clad part from the viewpoint that an optical waveguide device in which the occurrence of light leakage and scattering loss is suppressed can be manufactured more reliably and the productivity is excellent. .
When manufacturing this laminate (i), the lower clad part is formed so that the upper side of the optical path changing part necessarily protrudes from the upper surface of the lower clad part.

In particular, when the laminate (i) is produced by the method of (2) above, and the lower clad part forming composition or the lower clad part forming uncured film is cured by light irradiation to form the lower clad part. When forming
An uncured lower clad portion forming step of forming the uncured lower clad portion 20 by applying the lower clad portion forming composition on the surface of the base or disposing an uncured film for forming the lower clad portion (see step 21 in FIG. 13). )When,
After the uncured lower clad portion forming step, the optical path changing portion recess for forming the optical path changing portion recess 211 in the uncured lower clad portion 20, which is a recess in which the optical path changing portion is to be disposed using photolithography. Forming step (see step 22 in FIG. 13);
After the optical path changing portion recess forming step, the optical path changing portion forming step (see step 23 in FIG. 13) for forming the optical path changing portion 41 in the optical path changing portion recess 211 is used to form the laminate (i). Can be manufactured.
The optical waveguide device manufactured by this method has a high conversion efficiency in the optical path conversion section because the optical path conversion section and the core section are connected in direct contact. Further, the optical path conversion component can be particularly stably arranged.

Of the above steps, the optical path changing portion recess forming step (see step 22 in FIG. 13) uses an uncured lower cladding using a photomask in which the portion where the optical path changing portion recess 211 is to be formed is shielded from light. An exposure step of exposing the portion, and a development step of developing after the exposure step to obtain the concave portion 211 for the optical path conversion portion. In the exposure step, positioning can be performed using the positioning reference 91.
Furthermore, in the optical path conversion section forming step (see step 23 in FIG. 13), the method for forming the optical path conversion section is not particularly limited, and may be formed on the spot. An optical path conversion component formed in advance may be used as the optical path conversion section. You may arrange | position and form in the recessed part for use. Among these, in-situ formation refers to pressing a metal block on the optical path changing portion recess 211 formed in the lower clad 21 and then forming the metal block into a predetermined shape using a pressing jig. And a method of forming the optical path changing unit 41. Also in this optical path conversion part formation process, positioning can be performed using the positioning reference 91.

The lower clad part forming composition used in each of the above methods includes a clad part forming polymerizable compound and a polymerization initiator, and is cured by light irradiation and / or heating with a predetermined light. It becomes a cured resin. The polymerizable compound for forming the cladding part is not particularly limited, and for example, the same compound as the photopolymerizable compound in the above-described uncured film for forming the core part can be used. Moreover, the said polymerization initiator is not specifically limited, For example, the thing similar to the photoinitiator and / or thermosetting agent in the above-mentioned uncured film for core formation can be used.
Moreover, the coating method of the said composition for lower clad part formation is not specifically limited, For example, it applies by using various printing methods, such as a doctor blade method, a spin coat method, a spray method, a curtain coat method, and a roll coat method. be able to.

  Moreover, when forming the said laminated body (i), it is not necessary to harden a lower clad part completely, and when forming the core part mentioned later, you may advance hardening further. Furthermore, after the formation of the upper clad portion, a curing process described later may be further provided to further advance the curing.

  The uncured film for forming the lower clad part is a film made of the composition for forming the lower clad part, and has substantially no fluidity. “Substantially no fluidity” means that the formed molding state can be maintained. Specifically, the lower clad part forming uncured film preferably has a viscosity at a temperature of 20 ° C. of 10 Pa · s or more, preferably 50 Pa · s or more, and more preferably 200 Pa · s or more. When this viscosity is 10 Pa · s or more, even if there is some stickiness, the film can be easily operated by itself.

The uncured film for forming the lower clad part may be a single film or a laminate including a peelable support and / or a peelable surface protective film. When both the support and the surface protective film are provided, one is formed on one surface of the lower clad portion forming uncured film and the other is formed on the other surface of the lower clad portion forming uncured film.
When the support is provided, it is preferable because the operability at the time of disposing the uncured film for forming the lower clad part is improved. Moreover, when the said surface protection film is provided, since the storage property of the uncured film for lower clad part formation improves, it is preferable. In addition, as the said support body and surface protection film, the thing similar to the support body and surface protection film in the above-mentioned uncured film for core part formation can be used.
Moreover, the arrangement | positioning method of this uncured film for lower clad part formation is not specifically limited, For example, it can arrange | position by the method similar to the uncured film for core part formation mentioned later.

  Furthermore, the conditions for embedding the optical path conversion component in the case of producing the laminate (i) by the method (1) using an uncured film for forming the lower clad part is not particularly limited. For example, it can be carried out in an atmosphere at a temperature of 30 to 120 ° C. (especially 50 to 100 ° C.), and the optical path conversion component is 2.4 MPa or less (particularly 1.0 MPa or less, further 0.01 to 0.5 MPa). It can be performed by pressing with a pressure of. Further, it can be embedded with the weight of the optical path conversion component itself.

The method for disposing the core part-forming uncured film is not particularly limited, but the core part forming uncured film disposing step may include a pressure-bonding step of pressing the uncured film onto the laminate (i). preferable.
In this crimping step, the core part-forming uncured film can be crimped using, for example, a laminating method. The laminating method is a method of pressing a film by rolling a roll from one side of the support to the other side. When this method is used, it is possible to reduce the entrainment of bubbles because pressure can be applied while extruding air. Furthermore, pressure bonding of the uncured film for forming the core part can also be performed using a press method. The press method is a method in which the entire film is simultaneously crimped using, for example, a rubber plate or a metal plate over the entire film to be attached. When this method is used, since the whole film can be pressure-bonded at once, the whole uniformity can be maintained.
The pressure-bonding conditions can be adjusted as appropriate, and are not particularly limited. For example, it is preferably performed by applying pressure at a temperature of 20 to 130 ° C. The temperature at this time is more preferably 40 to 100 ° C, and further preferably 50 to 80 ° C. The pressure during the pressurization is preferably 0.1 to 2.4 MPa, more preferably 0.3 to 1.0 MPa, and still more preferably 0.4 to 0.8 MPa. Moreover, it is preferable that pressurization time is 3 to 120 second, More preferably, it is 5 to 80 second, More preferably, it is 10 to 40 second. In addition, the film may be heated in advance when the pressure is applied.

  In the core part forming uncured film disposing step, the uppermost part of the optical path changing part is flush with the upper surface of the core part forming uncured film, or the uppermost part of the optical part changing part is the core. It is preferable that the uncured film for forming a core part is disposed so as to protrude from the upper surface of the uncured film for part forming. In this case, it is possible to obtain an optical waveguide device in which the occurrence of light leakage and scattering loss is sufficiently suppressed.

In the “core part forming step”, a core part having an arbitrary pattern shape is usually formed by photolithography.
The photolithography method is to expose a desired core part pattern on the uncured film using predetermined light (appropriately selected according to the photopolymerizable composition constituting the uncured film for forming the core part), It refers to a method comprising a step of curing a desired portion of the photopolymerizable composition constituting the film and then removing the portion that has not been irradiated with the light and has not been cured.
Specifically, this step will be described. The uncured film is irradiated with predetermined light through a photomask on which a predetermined pattern is formed, and only a portion irradiated with light through the photomask pattern is cured. Then, the core part patterned by the predetermined shape is formed on a laminated body by removing the part which has not hardened using a developing agent.
Thus, since a core part is formed using the film which does not have fluidity substantially, a core part with substantially fixed thickness can be formed. Furthermore, the core part having an accurate pattern can be formed without causing the core part to be deformed.

  Moreover, in this core part formation process, it is not necessary to harden a core part completely, and when forming the upper clad part mentioned later, you may advance hardening further. Furthermore, after the formation of the upper clad portion, a curing process described later may be further provided to further advance the curing.

In the “upper clad portion forming step”, an upper clad portion is formed on the core portion and the lower clad portion.
The method for producing the upper clad part is not particularly limited.For example, the upper clad part forming composition is applied to the core part and the laminate (i) surface, or an uncured film for forming the upper clad part is disposed. Then, it can obtain by making it harden | cure by light irradiation of predetermined light and / or a heating. Especially, it is preferable to use the uncured film for upper clad part formation from a viewpoint of being excellent in productivity.
The composition for forming an upper clad part includes the polymerizable compound for forming a clad part and the polymerization initiator, and is cured by light irradiation and / or heating of predetermined light, and a cured resin Become. About the coating method of this composition for upper clad part formation, the coating method similar to the said composition for lower clad part formation can be used.
Moreover, about the said uncured film for upper clad part formation, the thing similar to the said uncured film for lower clad part formation can be used.

  Further, in the upper clad portion forming step, it is not necessary to completely cure the upper clad portion, and a curing step may be further provided after this step to further advance the curing.

  Furthermore, in the method for manufacturing an optical waveguide device according to the present invention, it is preferable that a collective curing step is provided after the upper cladding portion forming step. In this collective curing step, curing of each part can be further advanced by photocuring by light irradiation and / or heat curing by heating, and any one of the lower cladding part, the core part, and the upper cladding part Even when a part of the optical waveguide device is not completely cured, it is possible to obtain an optical waveguide device in which each portion is in a uniform cured state.

  Further, in the method for manufacturing an optical waveguide device of the present invention, in addition to the above steps, a step of disposing other parts such as the optical component, the electronic component such as a light emitting element and a light receiving element, and the conductor portion. The process etc. which arrange | position can be provided.

[3] Optical waveguide device manufacturing method (ii)
According to another method of manufacturing an optical waveguide device of the present invention, a base, a lower clad part disposed on the base, a core part laminated on the lower clad part and propagating light, and disposed on the core part A method of manufacturing an optical waveguide device, comprising: an upper cladding portion; and an optical path conversion portion that is formed on the base portion and converts an optical path of light that has propagated through the core portion, and is formed on the base portion and the base portion. An uncured film forming step for forming a core part on a laminate (ii) including an uncured lower clad part and an optical path changing part to be the lower clad part; And a core part forming step for forming the core part, and an upper clad part forming step for forming the upper clad part.

  In the “core part forming uncured film disposing step”, the core part forming uncured film is disposed on the laminate (ii) described later. For the uncured film for forming the core part, the description in [2] can be applied as it is.

The “laminated body (ii)” includes a base, an uncured lower clad portion to be a lower clad portion formed on the base, and an optical path changing portion formed on the base and / or the uncured lower clad portion. It is to be prepared. In addition, about each said base and the said optical path change part, said each description is applicable as it is.
The uncured lower clad portion is cured to become the lower clad portion. Examples of the uncured lower clad part include (1) those formed by applying the lower clad part forming composition, and (2) those formed by the uncured film for forming the lower clad part. It is done. Among these, the uncured lower clad part is the uncured lower part of the above (2) from the viewpoint that the optical waveguide device in which the occurrence of light leakage and scattering loss is suppressed can be more reliably manufactured and the productivity is excellent. A cladding part is preferred.

The method for producing the laminate (ii) is not particularly limited. For example, (1) an uncured film for forming the lower cladding part is disposed on the surface of the base or the composition for forming the lower cladding part is applied, A method obtained by forming an uncured lower clad part and then embedding a part of the optical path conversion part from above the uncured lower clad part to form an optical path conversion part, (2) an optical path conversion part on the surface of the base To form an optical path conversion part, and then to obtain an uncured lower cladding part by disposing an uncured film for forming a lower cladding part or applying a composition for forming a lower cladding part Etc.
In each of these methods, it is more preferable to use an uncured film for forming the lower clad part from the viewpoint that an optical waveguide device in which the occurrence of light leakage and scattering loss is suppressed can be manufactured more reliably and the productivity is excellent. .
In manufacturing the laminate (ii), the uncured lower clad part is formed so that the upper side of the optical path changing part always protrudes from the upper surface of the uncured lower clad part.
In addition, when the laminate (ii) is manufactured by the method of (1) above using an uncured film for forming a lower clad part, the conditions for embedding the optical path conversion component are the above [1]. The explanation in can be applied as it is.

The method for disposing the uncured film for forming the core part is not particularly limited, but the disposing film uncured film for forming the core part includes a crimping step of crimping the uncured film on the laminate (ii). preferable. About this uncured film formation process for core formation, and a crimping | compression-bonding process, each description in said [2] is applicable as it is.
In addition, when the uncured film for forming the core part is disposed and the shape of the uncured lower clad part is impaired, the shape of the uncured lower clad part is usually maintained even when the film is disposed. After the curing is progressed to such an extent that it is not damaged, the uncured film for forming the core part is disposed. The process of completely curing the uncured lower clad part to form the lower clad part may be performed in a core part forming process described later or an upper clad part forming process described later. Furthermore, a curing step may be further provided after the upper cladding portion forming step.

  In the “core part forming step”, a core part having an arbitrary pattern shape is usually formed. The description in [2] above can be applied as it is to the core part forming step.

  In the “upper clad portion forming step”, an upper clad portion is formed on the core portion and the lower clad portion. The description in [2] above can be applied as it is to the upper cladding part forming step.

  Furthermore, in another method for manufacturing an optical waveguide device of the present invention, in addition to the above steps, a step of disposing other parts such as the optical component such as a light emitting element and a light receiving element, the electronic component, and the conductor. The process etc. which arrange | position a part can be provided.

[4] Optical waveguide device manufacturing method (iii)
According to another method of manufacturing an optical waveguide device of the present invention, a base, a lower clad part disposed on the base, a core part laminated on the lower clad part and propagating light, and disposed on the core part A method of manufacturing an optical waveguide device comprising an upper clad portion and an optical path conversion portion that is formed on a base portion and converts an optical path of light propagated through a core portion, and the optical path conversion portion is formed on the surface An uncured composite disposing step of disposing an uncured composite comprising an uncured lower clad portion serving as the lower clad portion and an uncured core portion serving as the core portion on the base, and A method of manufacturing an optical waveguide device, comprising: a core portion forming step for forming a core portion; and an upper clad portion forming step for forming the upper clad portion.

  The “base having an optical path conversion portion formed on the surface” can be obtained, for example, by disposing the optical path conversion component on the base. Also, a metal wire is supplied into a capillary provided in the wire bonding apparatus, the tip of the metal wire is made into a lump and pressed against the surface of the base, and then the lump of metal is predetermined using a pressing jig. It can also be obtained by molding into a shape.

In the “uncured composite disposing step”, the uncured composite is disposed on the base.
The “uncured composite” includes an uncured lower clad portion serving as a lower clad portion and an uncured core portion serving as a core portion, and has substantially no fluidity. Note that “substantially no fluidity” means that the applied molding state can be maintained. Specifically, the uncured composite preferably has a viscosity at a temperature of 20 ° C. of 10 Pa · s or more, more preferably 50 Pa · s or more, and further preferably 200 Pa · s or more. When this viscosity is 10 Pa · s or more, even if there is some stickiness, it can be easily operated alone.
Further, the shapes of the uncured lower clad part and the uncured core part constituting the uncured composite are not particularly limited. Furthermore, a predetermined core part pattern may be given to the uncured core part.
The uncured composite may be a single body or may include a peelable support and / or a peelable surface protective film. When both the support and the surface protective film are provided, one is formed on one surface of the uncured composite and the other is formed on the other surface of the uncured composite. As a specific example of such an uncured composite, for example, as shown in FIG. 7, a support that can be peeled off from the surface of an uncured composite composed of an uncured core portion 11 and an uncured lower clad portion. A body 51 and a peelable surface protective film 52, as shown in FIG. 8, on the surface of an uncured composite composed of an uncured core section 11 provided with a core pattern and an uncured lower clad section. The thing provided with the peelable support body 51 and the peelable surface protection film 52 is mentioned.
When the support is provided, it is preferable because the operability at the time of disposing the uncured composite is improved. Moreover, when providing the said surface protection film, since the storage property of an unhardened composite improves, it is preferable. In addition, as the said support body and surface protection film, the thing similar to the support body and surface protection film in the above-mentioned uncured film for core part formation can be used.

  The method for producing the uncured core part is not particularly limited. For example, (1) coating the photopolymerizable composition or disposing the uncured film for forming the core part on a peelable support. To form an uncured core portion, and then apply the lower clad portion forming composition on the uncured core portion or dispose the uncured film for forming the lower clad portion on the uncured core portion. (2) Forming an uncured core part by coating the photopolymerizable composition or disposing the uncured film for core part formation on a peelable support, Then, a predetermined core part pattern is applied by a photolithography method, and then the lower clad part forming composition is applied to the uncured core part to which the core part pattern is applied or the lower clad part forming uncoated The method and the like which can form an uncured lower cladding portion by disposing the films. In the method (2), when the core pattern is applied, the degree of curing is adjusted to such an extent that it can be disposed on the base where the optical path conversion unit is formed.

  Moreover, the arrangement | positioning method of this unhardened composite body is not specifically limited, For example, it can arrange | position by the method similar to the said uncured film for core part formation.

In the “core part forming step”, a core part having an arbitrary pattern shape is usually formed. The description in [2] above can be applied as it is to the core part forming step. In addition, when using an unhardened composite body provided with the uncured core part provided with the core part pattern, the core part is formed by irradiating predetermined light in this step.
The formation of the lower clad part may be performed together with the formation of the core part, may be performed after the core part is formed, or may be performed in an upper clad part forming process described later. Furthermore, a curing step may be further provided after the upper cladding portion forming step.

  In the “upper clad portion forming step”, an upper clad portion is formed on the core portion and the lower clad portion. The description in [2] above can be applied as it is to the upper cladding part forming step.

  Furthermore, in another method for manufacturing an optical waveguide device of the present invention, in addition to the above steps, a step of disposing other parts such as the optical component such as a light emitting element and a light receiving element, the electronic component, and the conductor. The process etc. which arrange | position a part can be provided.

Hereinafter, the present invention will be specifically described with reference to examples and drawings.
[1] Optical Waveguide Device FIG. 1 is a diagram schematically showing a cross section of an example of an optical waveguide device of the present invention. Moreover, FIG. 2 is a figure which shows typically the AA cross section in FIG. The optical waveguide device 100 includes a base (multilayer ceramic wiring substrate) 3, a lower clad part 21, a core part 1, an upper clad part 22, optical path changing parts 41 and 42, optical elements 61 and 62, and conductor parts 81 and 82. Etc.

  The core unit 1 is optically path-converted by the optical path converters 41 and 42. Moreover, the core part 1 is comprised from the epoxy-type resin. On the other hand, the upper clad part 22 and the lower clad part 21 are made of an epoxy resin having a refractive index smaller than that of the core part 1.

  The base part (multilayer ceramic wiring board) 3 has conductor parts (not shown) such as via holes and through-holes for interlayer connection, and alumina-based sintered material, and these conductor parts are made of alumina-based sintered material. Insulated by binder. A lower cladding portion 21 and the like are provided on one surface side of the base portion 3, and a plurality of connection terminals (conductor portions 82) are provided on the other surface side. This optical waveguide device can be mounted on a printed wiring or the like (not shown) using this connection terminal.

  Further, the optical path conversion unit includes triangular optical path conversion units 41 and 42 made of gold and having inclined surfaces of about 45 ° facing each other. These optical path conversion units 41 and 42 are arranged on one surface of the base 3. Further, the uppermost portions of the optical path changing portions 41 and 42 are formed so as to be flush with the upper surface of the core portion 1 or protrude from the upper surface of the core portion 1.

  Furthermore, as conductor portions, a conductor portion 81 for connecting the light emitting element 61 and the light receiving element 62 to an electric circuit (not shown), and a conductor portion which is a connection terminal for mounting the optical waveguide device on a printed wiring board (not shown). 82. The conductor portions 81 and 82 are made of gold, silver, copper, solder, aluminum, nickel, an alloy thereof, or the like.

As optical elements, a VCSEL that is a light emitting element 61 and a photodiode that is a light receiving element 62 are provided. The light emitting element 61 can emit predetermined light such as ultraviolet rays and near infrared rays, and the light receiving element 62 can detect these lights. The light emitting element 61 includes a light emitting portion, and is mounted with the light emitting portion facing downward. On the other hand, the light receiving element 62 includes a light receiving portion, and is mounted with the light receiving portion facing downward. Each optical element is bonded via a conductor portion 81 formed on the surface of the upper clad portion 22.
Each of these optical elements receives an electrical signal from an external circuit (not shown) and is converted into an optical signal by the light emitting element 61. Light emitted as an optical signal from the light emitting element 61 is transmitted through the core portion 1 to receive the light. Light is received at 62. The optical signal received by the light receiving element 62 is converted into an electric signal by the light receiving element 62 and transmitted to an external circuit (not shown).

[2] Manufacturing method of optical waveguide device (i)
A method for manufacturing an example of the optical waveguide device described in [1] above will be described below. In the following description of the manufacturing method, for convenience, each part will be described using the reference numerals of the optical waveguide device after manufacturing.
(1) Base 3
As the base 3, a pre-sintered multilayer ceramic wiring board was prepared. The configuration of the multilayer ceramic wiring board is as described in [1] above.

(2) Formation of optical path conversion pads 411 and 421 and positioning reference pad 91 A dry film (plating resist) is attached to one surface of the base 3, and the areas other than forming the pad by exposure and development are protected with a dry film. Thereafter, gold plating was performed, and finally the dry film (plating resist) was peeled off to form the optical path conversion unit pads 411 and 421 and the positioning reference pad 91 (see step 1 in FIG. 9). In addition, a transfer film in which a thin film made of gold that becomes the positioning reference pad 91 and the optical path conversion unit pads 411 and 421 for forming the optical path conversion unit is releasably held on the surface of the release sheet is prepared. It is also possible to transfer the transfer film to the surface of the multilayer ceramic wiring substrate.

(3) Formation of laminate (i) Epoxy compound [alicyclic epoxy compound (manufactured by Daicel Chemical Industries, Ltd., product name “EHPE3150”) 99.5% by mass and polymerization initiator (acid generator, Asahi Denka Kogyo Co., Ltd.) Co., Ltd., product name “SP172”) 0.5 mass%] and a composition for forming a clad part and a solvent (methyl ethyl ketone) are mixed and dissolved to prepare a mixed solution (solid content: 78%). Thereafter, the obtained mixed solution was applied on a support (PET film, thickness: 38 μm) by a casting method (gap; 130 μm), and then dried by heating to remove the solvent, thereby providing the support. An uncured film for forming the lower cladding part was formed.
The uncured film for forming a clad part provided with this support is placed on the base 3, and only the uncured film for forming the lower clad part is pressure-bonded under conditions of a temperature of 40 to 50 ° C. and a pressure of 0.5 MPa, It dried on the conditions of 120 degreeC x 30 minutes, and formed the unhardened lower clad part.
After that, a triangular prism-shaped optical path conversion component having an inclined surface of approximately 45 ° formed in advance is accurately arranged above the optical path conversion unit pads 411 and 421 based on the coordinates of the positioning reference 91 using the image means. And placed on the uncured lower cladding. Subsequently, the optical path conversion component was embedded in the uncured lower clad portion by utilizing the fact that the optical path conversion component was submerged by its own weight by heating to 120 ° C.
Next, exposure (exposure amount: 2000 mJ / cm ² , light source: ultraviolet lamp, exposure time: about 7 minutes) and heating (temperature: 120 ° C. × 30 minutes) are performed to cure to form the lower clad part 21, and the base 3 And the laminated body (i) provided with the lower clad part 21 and the optical path conversion parts 41 and 42 was obtained (refer process 2 in FIG. 9).

(4) Arrangement of uncured film for core formation (uncured film arrangement process for core formation)
Epoxy compound [Aromatic epoxy compound (Japan Epoxy Resin Co., Ltd., product name “Epicoat 1001”) 44.5% by mass, alicyclic epoxy compound (Daicel Chemical Industries, Ltd., product name “EHPE3150”) 0 mass%] and a polymerization initiator (acid generator, manufactured by Asahi Denka Kogyo Co., Ltd., product name “SP172”) 0.5 mass% and a solvent (methyl ethyl ketone) are mixed and dissolved. To prepare a mixed solution (solid content: 78%), and then apply the obtained mixed solution on a support (PET film, thickness: 38 μm) by a casting method (gap; 130 μm), The core part-forming uncured film 10 provided with a support was formed by drying by heating and removing the solvent.
The core-forming uncured film 10 provided with this support is placed on the lower clad part 21 and the optical path changing parts 41 and 42 of the laminate (i) formed in (3) above, and the temperature is 40 to 50 ° C. Only the uncured film 10 for forming the core part was placed on the lower clad part 21 by a laminating method under a pressure of 0.5 MPa and dried under the condition of a temperature of 120 ° C. × 30 minutes (see step 3 in FIG. 9). .

(5) Formation of core part 1 (core part formation process)
A photomask 7 on which a predetermined pattern (line width; about 50 μm) is formed is placed on the uncured film 10 for core formation, and exposure (exposure amount: 500 mJ / cm ² , light source; ultraviolet lamp, exposure time; About 2 minutes) and postbaked at a temperature of 120 ° C. for 30 minutes. Next, development was performed using 2-methoxyethanol (30 seconds × 1 time) and washed with isopropyl alcohol (IPA) to form the core portion 1 (see step 4 in FIG. 10).

(6) Formation of upper clad portion 22 (upper clad portion forming step)
The same composition as the cladding portion forming composition used in (3) above was applied onto the lower cladding portion 21 and the core portion 1 by spin coating. Thereafter, exposure (exposure amount: 2000 mJ / cm ² , light source: ultraviolet lamp, exposure time: about 7 minutes) and post-baking (temperature: 120 ° C. × 30 minutes) were performed and cured to form the upper clad portion 22 (FIG. 10). Step 5). In addition, this upper clad part can also be formed using the uncured film for clad part formation (uncured film for upper clad part formation) similar to that used in (3) of [2] above.

(7) Batch curing step Batch curing is performed by heating the optical waveguide structure obtained up to (6) above at a temperature of 150 × 1 hour. The entire optical waveguide structure was completely cured.

(8) Formation of conductor part 81 and positioning reference pad 92 A dry film (plating resist) is applied to the surface of the upper clad part 22, and the parts other than the pad formed by exposure and development are protected with a dry film, and then gold plated Finally, the conductive film 81 and the positioning reference pad 92 were formed by peeling off the dry film (plating resist) (see step 6 in FIG. 10). In addition, a transfer film in which a thin film made of gold that becomes the conductor portion 81 and the positioning reference pad 92 is releasably held on the surface of the release sheet is prepared. It is also possible to transfer and form the transfer film on the surface of the upper clad portion 22 at a position determined based on the position.

(9) Mounting of the light emitting element 61 and the light receiving element 62 (light emitting element arranging step)
Similarly to the above, based on the positioning reference 92 using the image means, the light emitting element 61 is accurately placed on the conductor portion 81 at the target position, and the conductor portion is formed by solder provided in advance on one surface of the light emitting element 61. 81. Similarly, on the basis of the positioning reference 92, the light receiving element 62 was mounted and similarly connected by soldering to obtain the optical waveguide device 100 of the present invention (see step 7 in FIG. 10). The difference in refractive index (core portion-cladding portion) between the obtained core portion 1 and each of the clad portions 21 and 22 is 1.9% for 850 nm near-infrared light and 2 for the 589 nm Na-D line. 0.0%.

[3] Optical waveguide device manufacturing method (ii)
Another example of the manufacturing method of the optical waveguide device described in the above [1] will be described below. In the following description of the manufacturing method, for convenience, each part will be described using the reference numerals of the optical waveguide device after manufacturing.
(1) Base 3
As the base 3, a pre-sintered multilayer ceramic wiring board was prepared. The configuration of the multilayer ceramic wiring board is as described in [1] above.

(2) Formation of optical path conversion pads 411 and 421 and positioning reference pad 91 A dry film (plating resist) is attached to one surface of the base 3, and the areas other than forming the pad by exposure and development are protected with a dry film. Thereafter, gold plating was performed, and finally the dry film (plating resist) was peeled off to form the optical path conversion unit pads 411 and 421 and the positioning reference pad 91. In addition, a transfer film in which a thin film made of gold that becomes the positioning reference pad 91 and the optical path conversion unit pads 411 and 421 for forming the optical path conversion unit is releasably held on the surface of the release sheet is prepared. It is also possible to transfer the transfer film to the surface of the multilayer ceramic wiring substrate.
After that, after pressing a metal block (metal; gold) against the optical path conversion part pad 411, the metal block is formed using a pressing jig, and the triangular column shape having an inclined surface of approximately 45 ° is formed. An optical path conversion unit 41 was formed. Similarly, on the optical path conversion unit pad 421, a triangular prism-shaped optical path conversion unit 42 having an inclined surface of approximately 45 ° facing the optical path conversion unit 41 was formed (see step 1 in FIG. 11).

(3) Disposition of uncured composite (uncured composite disposition step)
Epoxy compound [alicyclic epoxy compound (manufactured by Daicel Chemical Industries, Ltd., product name “EHPE3150”) 99.5% by mass and polymerization initiator (acid generator, manufactured by Asahi Denka Kogyo Co., Ltd., product name “SP172”) 0 .5% by mass] and a solvent (methyl ethyl ketone) are mixed and dissolved to prepare a mixed solution (solid content: 75%). The film-like uncured core portion 11 provided with the support obtained by the same method as in (4) of [2] is coated by a casting method (gap; 130 μm), then dried by heating, and the solvent is removed. By removing, a film-like uncured composite including the uncured lower clad portion 20 and the uncured core portion 11 was formed.
This uncured composite is placed on the base 3 on which the optical path changing parts 41 and 42 formed in (2) above are formed, and on the base 3 under conditions of a temperature of 60 to 80 ° C. and a pressure of 0.5 MPa. It arrange | positioned by the laminating method and dried on the conditions of the temperature of 120 degreeC x 30 minutes. (See step 2 in FIG. 11).

(4) Formation of core part 1 and lower clad part 21 (core part formation process and lower clad part formation process)
A photomask 7 on which a predetermined pattern (line width; about 50 μm) is formed is placed on the uncured core portion 11 of the uncured composite, and exposure (exposure amount: 500 mJ / cm ²⁾ , light source: ultraviolet lamp, exposure Time; about 2 minutes) and post-baked at a temperature of 120 ° C. for 30 minutes. Next, development was performed using 2-methoxyethanol (30 seconds × 1 time), and washing was performed with isopropyl alcohol (IPA) to form the core portion 1 and the uncured lower clad portion 20 to the clad portion 21 simultaneously. (See step 3 in FIG. 12).

(5) Formation of upper clad portion 22 (upper clad portion forming step)
The same composition as the cladding portion forming composition used in (3) above was applied onto the lower cladding portion 21 and the core portion 1 by spin coating. Thereafter, exposure (exposure amount: 2000 mJ / cm ² , light source: ultraviolet lamp, exposure time: about 7 minutes) and post-baking (temperature: 120 ° C. × 30 minutes) were performed and cured to form the upper clad portion 22 (FIG. 12). Step 4). In addition, this upper clad part can also be formed using the uncured film for clad part formation (uncured film for upper clad part formation) similar to what was used by said (3).

(6) Batch curing step Batch curing is performed by heating the optical waveguide structure obtained up to (5) above at a temperature of 150 × 1 hour. The entire optical waveguide structure was completely cured.

(7) Formation of conductor portion 81 and positioning reference pad 92 After applying a dry film (plating resist) on the surface of upper clad portion 22 and protecting the portion other than forming the pad by exposure and development with dry film, gold plating Finally, the conductive film 81 and the positioning reference pad 92 were formed by peeling off the dry film (plating resist) (see step 5 in FIG. 12). In addition, a transfer film in which a thin film made of gold that becomes the conductor portion 81 and the positioning reference pad 92 is releasably held on the surface of the release sheet is prepared. It is also possible to transfer and form the transfer film on the surface of the upper clad portion 22 at a position determined based on the position.

(8) Mounting of the light emitting element 61 and the light receiving element 62 (light emitting element arranging step)
Similarly to the above, based on the positioning reference 92 using the image means, the light emitting element 61 is accurately placed on the conductor portion 81 at the target position, and the conductor portion is formed by solder provided in advance on one surface of the light emitting element 61. 81. Similarly, on the basis of the positioning reference 92, the light receiving element 62 was placed and similarly connected by soldering to obtain the optical waveguide device 100 of the present invention (see step 6 in FIG. 12). The difference in refractive index (core portion-cladding portion) between the obtained core portion 1 and each of the clad portions 21 and 22 is 1.9% for 850 nm near-infrared light and 2 for the 589 nm Na-D line. 0.0%.

[4] Optical waveguide device manufacturing method (iii)
An example in which the production method described in [2] above is different from the method for forming the laminate (i) will be described below. In the following description of the manufacturing method, for convenience, each part will be described using the reference numerals of the optical waveguide device after manufacturing.
(1) Base 3
The same base 3 as [2] (1) above was prepared.
(2) Formation of optical path conversion unit pads 411 and 421 and positioning reference pad 91 Optical path conversion unit pads 411 and 421 and positioning reference pad 91 were formed in the same manner as in [2] (2) above.

(3) Formation of laminate (i) (see FIG. 13)
Epoxy compound [alicyclic epoxy compound (manufactured by Daicel Chemical Industries, Ltd., product name “EHPE3150”) 99.5% by mass and polymerization initiator (acid generator, manufactured by Asahi Denka Kogyo Co., Ltd., product name “SP172”) 0 .5 mass%] and a composition for forming a cladding part and a solvent (methyl ethyl ketone) are mixed and dissolved to prepare a mixed solution (solid content: 78%), and then the obtained mixed solution is used as a support. An uncured film for forming a lower clad part provided with a support by coating on a PET film (thickness: 38 μm) by a casting method (gap: 130 μm) and then drying by heating to remove the solvent. Formed. The uncured film for forming a clad part provided with this support is placed on the base 3, and only the uncured film for forming the lower clad part is pressure-bonded under conditions of a temperature of 70 to 90 ° C. and a pressure of 0.5 MPa, It dried on the conditions of 100 degreeC x 30 minutes, and formed the unhardened lower clad part (process 21 of FIG. 13).

Next, a photomask is placed in close contact with the obtained uncured lower clad portion, and exposure (exposure amount: 1000 mJ / cm ² , light source: ultraviolet lamp, exposure time: about 4 minutes) is performed, and a temperature of 70 Post-baking was performed at a temperature of 30 ° C. for 30 minutes. Thereafter, development was performed using 2-methoxyethanol (30 seconds × 1 time), and the substrate was washed with isopropyl alcohol (IPA) to form a recess 211 for the optical path conversion unit (step 22 in FIG. 13).

  Thereafter, the triangular path-shaped optical path conversion parts 41 and 42 having an inclined surface of approximately 45 ° formed in advance are accurately placed above the optical path conversion unit pads 411 and 421 based on the coordinates of the positioning reference 91 using the image means. It positioned so that it might be arrange | positioned, and it mounted in the recessed part for optical path conversion parts (process 23 of FIG. 13).

(4) Arrangement of uncured film for core formation (uncured film arrangement process for core formation)
In the same manner as in the above [2] (4), an uncured film 10 for forming a core part was disposed. At this time, the uncured film for forming the core part is filled in the gap between the lower cladding part 21 and the optical path changing parts 41 and 42 in order to have flexibility. (Step 3 in FIG. 13)

  Thereafter, in the same manner as [2] (5) to (9), the core portion 1 is formed, the upper clad portion 22 is formed, a collective curing process is performed, and the conductor portion 81 and the positioning reference pad 92 are further formed. Then, the light emitting element 61 and the light receiving element 62 were mounted (Step 7 in FIG. 13), and the optical waveguide device 101 of the present invention was obtained.

[5] Production of Comparative Optical Waveguide Device (1) Base The same base as [2] (1) above was prepared.
(2) Formation of optical path conversion part pad and positioning reference pad The optical path conversion part pad and positioning reference pad were formed in the same manner as in [2] and (2) above.
(3) Formation of the optical path conversion unit A triangular prism-shaped optical path conversion part having a pre-formed inclined surface of approximately 45 ° is accurately positioned above the optical path conversion unit pad based on the positioning reference coordinates using the image means. Positioned and placed so as to be placed. Next, the optical path conversion component was stabilized by fixing with an adhesive.

(4) Formation of lower clad portion Epoxy compound [alicyclic epoxy compound (manufactured by Daicel Chemical Industries, Ltd., product name “EHPE3150”) 99.5% by mass and polymerization initiator (acid generator, Asahi Denka Kogyo Co., Ltd.) Manufactured, product name “SP172”) 0.5% by mass] and a solvent (methyl ethyl ketone) are mixed and dissolved to prepare a mixed solution (solid content: 78%). The obtained mixed solution was applied on a substrate to a thickness of 50 μm by spin coating. Next, exposure (exposure amount: 2000 mJ / cm ² , light source: ultraviolet lamp, exposure time: about 7 minutes) was performed, and further post-baking was performed at a temperature of 120 ° C. for 30 minutes to form a lower clad portion.

(5) Formation of core portion Epoxy compound [aromatic epoxy compound (Japan Epoxy Resin Co., Ltd., product name “Epicoat 1001”) 44.5% by mass, alicyclic epoxy compound (Daicel Chemical Industries, Ltd., Product name “EHPE3150”) 55.0 mass%] and a polymerization initiator (acid generator, manufactured by Asahi Denka Kogyo Co., Ltd., product name “SP172”) 0.5 mass%, and a solvent (methyl ethyl ketone) Were mixed and dissolved to prepare a mixed solution (solid content: 78%), and then the obtained mixed solution was applied on the lower clad part to a thickness of 50 μm by a spin coating method. A photomask is spaced apart above the obtained uncured core part, and exposure (exposure amount: 500 mJ / cm ² , light source: ultraviolet lamp, exposure time: about 2 minutes) is performed, and the temperature is 120 ° C. × 30. Post-baking was performed under the condition of minutes. Thereafter, development was performed using 2-methoxyethanol (30 seconds × once), and the core portion was formed by washing with isopropyl alcohol (IPA).

(6) Formation of upper clad part The upper clad part was formed on the core part similarly to said (4). Thereafter, in the same manner as in the above [2] (7) to (9), a batch curing process is performed, and further, a conductor part and a positioning reference pad are formed, and then a light emitting element and a light receiving element are mounted and compared. An optical waveguide device was obtained.

[6] Evaluation of optical bondability Each optical path conversion unit using the optical waveguide device of the present invention obtained in the above [4] and the comparative optical waveguide device obtained in the above [5] The optical coupling loss at was measured. As a result, the comparative optical waveguide device obtained in [5] had a coupling loss of 18 dB, whereas the optical waveguide device of the present invention obtained in [4] had 0.8 dB. The ratio of the coupling loss with respect to the comparative product was 4%, which was remarkably improved. This is probably because light is leaking to the rear of the optical path conversion unit in the comparative product, whereas the conversion efficiency is high because the optical path conversion unit is in contact with the core in the product of the present invention.

  The optical waveguide device and the manufacturing method thereof according to the present invention can be widely used in the fields of optical communication, electric and electronics, and the like. For example, it can be used as an optical waveguide, an optical branching coupler, an optical multiplexer / demultiplexer, an optical isolator, an optical fiber amplifier, a wiring board, an IC package, and the like.

It is typical sectional drawing of an example of the optical waveguide device of this invention. It is explanatory drawing which shows the AA cross section in FIG. 1 typically. It is explanatory drawing which shows typically the example of arrangement | positioning of an optical path change part. It is explanatory drawing which shows the other example of arrangement | positioning of an optical path changing part typically. It is explanatory drawing which shows the other example of arrangement | positioning of an optical path changing part typically. It is explanatory drawing which shows typically an example of the uncured film for core part formation. It is explanatory drawing which shows an example of an unhardened composite body typically. It is explanatory drawing which shows typically another example of an unhardened composite body. It is explanatory drawing which illustrates typically the manufacturing method of an example of this optical waveguide device. It is explanatory drawing which illustrates typically the process of following the manufacturing method of FIG.9 and FIG.13 of the manufacturing method of an example of this optical waveguide device. It is explanatory drawing which illustrates typically the manufacturing method of the other example of this optical waveguide device. FIG. 12 is an explanatory diagram schematically illustrating a process following FIG. 11 of the manufacturing method of another example of the present optical waveguide device. It is explanatory drawing which illustrates typically the manufacturing method of another example of this optical waveguide device.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 100, 101; Optical waveguide device, 1; Core part, 10: Uncured film for core formation, 11: Uncured core part, 20: Uncured lower clad part, 21: Lower clad part, 211: Optical path conversion part formation Recessed part, 22; Upper clad part, 3; Base part, 4, 41, 42; Optical path conversion part, 411, 421; Pad for optical path conversion part, 51; Support, 52; Surface protective film, 61; Light receiving element, 7; photomask, 81, 82; conductor, 91, 92; positioning reference.

Claims (10)

A base, a lower clad disposed on the base, a core that is stacked on the lower clad and transmits light, an upper clad disposed on the core, and formed on the base And a method of manufacturing an optical waveguide device comprising: an optical path conversion unit that converts an optical path of light propagated through the core unit;
A core part forming uncured film disposing step of disposing a core part forming uncured film on a laminate comprising the base, and the lower clad part and the optical path changing part formed on the base. When,
A core part forming step for forming the core part;
And an upper clad portion forming step for forming the upper clad portion. A base, a lower cladding disposed on the base, a core that is laminated on the lower cladding and propagates light, an upper cladding disposed on the core, and formed on the base And a method of manufacturing an optical waveguide device comprising: an optical path conversion unit that converts an optical path of light propagated through the core unit;
For forming a core part in which an uncured film for forming a core part is disposed on a laminate including the base part, and an uncured lower clad part and an optical path changing part to be the lower clad part formed on the base part. An uncured film disposing step;
A core part forming step for forming the core part;
And an upper clad portion forming step for forming the upper clad portion.   In the step of disposing the uncured film for forming the core portion, the uppermost portion of the optical path changing portion is flush with the upper surface of the uncured film for forming the core portion, or the uppermost portion of the optical path changing portion is the core. The method for manufacturing an optical waveguide device according to claim 1, wherein the uncured film for forming a core part is disposed so as to protrude from an upper surface of the uncured film for forming a part.   The method for manufacturing an optical waveguide device according to any one of claims 1 to 3, wherein the uncured film forming step for forming a core part includes a crimping process for crimping the uncured film for forming a core part.   The said crimping | compression-bonding process is a manufacturing method of the optical waveguide device of Claim 4 performed using the lamination method.   The said crimping | compression-bonding process is a manufacturing method of the optical waveguide device of Claim 4 performed using the press method.   The method for manufacturing an optical waveguide device according to any one of claims 4 to 6, wherein the pressure bonding is performed by applying pressure at 0.1 to 2.4 MPa at a temperature of 20 to 130 ° C.   The method for producing an optical waveguide device according to claim 1, wherein the uncured film for forming a core part has a viscosity at a temperature of 20 ° C. of 10 Pa · s or more. A base, a lower cladding disposed on the base, a core that is laminated on the lower cladding and propagates light, an upper cladding disposed on the core, and formed on the base And a method of manufacturing an optical waveguide device comprising: an optical path conversion unit that converts an optical path of light propagated through the core unit;
An uncured composite comprising an uncured lower clad portion to be the lower clad portion and an uncured core portion to be the core portion is disposed on the base portion having the optical path conversion portion formed on the surface. A curing composite arrangement step;
A core part forming step for forming the core part;
And an upper clad portion forming step for forming the upper clad portion.   An optical waveguide device obtained by the manufacturing method according to claim 1.

Images