JP2005310128A - Wireless chip and container or the like including the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a wireless tag for appropriately recording a distribution history of an article or a state of contents, and to provide technologies for knowing contents held in a container or a state of contents sealed in a container without opening the container. <P>SOLUTION: A wireless chip which is capable of communicating data by radio communication and to which a sensor function and a memory function are mounted, is held in a container and from the outside of the container, its internal state can be searched. The wireless chip is formed with a memory circuit, a sensor circuit, a communication circuit and the like and an antenna for radio communication is imparted thereto. The sensor is provided for detecting the internal state of the container through an electrical or magnetic means and measures, as substitutive characteristics, brightness, resistance value, electrostatic capacity and the like. From the substitutive characteristics, information of contents is searched without opening the container. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a wireless chip that can perform data communication in a contactless manner and containers that contain the wireless chip.

  Many items such as foods and pharmaceuticals are distributed in sealed containers for safety and health management and quality maintenance. For example, soft drinks such as beer and juice are transported by vehicles that can control the temperature of the cargo compartment. With that, it promotes high quality. Moreover, pharmaceuticals and foodstuffs lose their value as products when the container for storing them is opened. That is, the credit for the safety of the product is lost.

  There is a problem that consumers who purchase these products cannot know exactly how the products are managed in the distribution stage. Even if the label attached to the product has been tampered with, it has not been possible to easily determine whether it is true or false.

  Recently, a technique for identifying and managing an object using a small IC chip instead of a bar code attached to many products has attracted attention. This technology is also called RFID (Radio Frequency Identification). An RFID is an IC chip capable of storing data attached to a tag having a size of several centimeters. Data is wirelessly communicated with an external device called a reader / writer. The non-contact power transmission technology from the antenna side enables communication without a battery.

  However, data handled by the RFID has to be written from an external device. Therefore, it was impossible to instantly know the quality of the product. In addition, necessary information must be sequentially written using an external device.

  An object of this invention is to provide the radio | wireless chip which records the distribution history of goods, and the state of the contents suitably. Moreover, it aims at providing the technique which can know the state of the content hold | maintained in the container, or the content sealed in the container, without opening the said container.

  The present invention includes a wireless chip capable of communicating data by wireless communication and having a sensor function and a memory function. The wireless chip is held in the container, and the internal state can be detected from outside the container.

  The wireless chip includes a memory circuit, a sensor circuit, a communication circuit, and the like, and is provided with an antenna for wireless communication. This wireless chip is realized by a transistor formed over a single crystal semiconductor substrate or a thin film transistor (hereinafter also referred to as “TFT”) formed with a semiconductor film over an insulating substrate. The sensor detects the internal state of the container by electrical or magnetic means, and measures brightness, temperature, resistance value, capacitance, etc. as substitute characteristics. Because of the substitute characteristics, the contents information is detected without opening the container.

  The wireless chip may be present in a state of being separated from the inside of the container, or can be provided in a state of being fixed to the inner wall. You may embed in the member which comprises a container. Moreover, you may attach to the label with which a container is mounted | worn.

  The present invention may include a first wireless chip provided in the packaging body and a second wireless chip provided in a container body placed in the packaging body. The first wireless chip has an arithmetic processing function in addition to the communication function and the memory function. The second wireless chip has a communication function, a memory function, and a sensor function. Further, the first wireless chip may include a storage battery.

  The first wireless chip and the second wireless chip are arranged in a communicable range even for a weak signal. The first wireless chip and the external device that reads and writes data can communicate with each other even if they are several meters to several tens of meters apart. In other words, the second wireless chip performs communication only in a short distance by simplifying the communication function and reducing the antenna size. In addition, the arithmetic processing function and the like are omitted to reduce the size. On the other hand, in the first wireless chip, the antenna may be increased in size, and the communication circuit may be increased in size so that communication can be performed even with a distance of several meters to several tens of meters from an external device.

  The containers of the present invention include a wireless chip including a sensor unit, a memory unit, a control arithmetic circuit unit, a communication circuit unit, and an antenna. The configuration of the memory unit may be a first memory unit that stores output data from the sensor unit and a second memory unit that stores write data received by the communication circuit unit. The sensor portion, the memory portion, the control arithmetic circuit portion, and the communication circuit portion can be realized by a thin film transistor in which a channel region is formed of a semiconductor layer that is formed on an insulating surface and divided into islands.

  According to the present invention, it is possible to know the distribution history of merchandise and the state of contents by arranging a wireless chip with a sensor function in a container. In addition, the internal state of the container can be known without opening the container.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. However, the present invention can be implemented in many different modes, and those skilled in the art can easily understand that the modes and details can be variously changed without departing from the spirit and scope of the present invention. Is done. Therefore, the present invention is not construed as being limited to the description of this embodiment mode. Note that in the drawings described below, the same portions or portions having similar functions are denoted by the same reference numerals, and repetitive description thereof is omitted.

  FIG. 1 illustrates a configuration of a wireless chip 100 including an integrated circuit portion 101 and an antenna 102. The integrated circuit unit 101 includes a sensor unit 106 that detects temperature, humidity, illuminance, and other characteristics by physical or chemical means. The sensor unit 106 includes a sensor 108 and a sensor circuit 109 that controls the sensor 108. The sensor 108 is formed of a semiconductor element such as a resistance element, a capacitive coupling element, an inductive coupling element, a photovoltaic element, a photoelectric conversion element, a thermoelectric element, a transistor, a thermistor, or a diode. The sensor circuit 109 detects a change in impedance, reactance, inductance, voltage, or current, performs analog / digital conversion (A / D conversion), and outputs a signal to the arithmetic processing circuit unit 103.

  The memory unit 104 includes one or both of a read-only memory and a rewritable memory. The memory unit 104 is configured by a static RAM (Static RAM), an EEPROM (Electrically Erasable Programmable Read-Only Memory), a flash memory, or the like, so that external information received via the sensor unit 106 and the antenna 102 can be received as needed. Can be recorded. The memory unit 104 can be divided into a first memory unit 110 that stores signals detected by the sensor unit 106 and a second memory unit 111 that records information written from the reader / writer device. Further, a read-only memory unit may be provided by a mask ROM or a programmable ROM.

  In order to record information detected by the sensor unit 106, the first memory unit 110 is preferably composed of a flash memory or the like that allows sequential writing and does not lose data. In addition, it is preferable to apply a storage element having a floating gate structure, which can be written only once.

  The communication circuit unit 105 includes a demodulation circuit 112 and a modulation circuit 113. The demodulation circuit 112 demodulates a signal input via the antenna 102 and outputs the demodulated signal to the arithmetic processing circuit unit 103. The signal includes a signal for controlling the sensor unit 106 and information stored in the memory unit 104. Further, the signal output from the sensor circuit 109 and the information read from the memory unit 104 are output to the modulation circuit 113 through the arithmetic processing circuit unit 103. The modulation circuit 113 modulates this signal into a signal capable of wireless communication, and outputs the signal to an external device via the antenna 102.

  Electric power necessary for operating the arithmetic processing circuit unit 103, the sensor unit 106, the memory unit 104, and the communication circuit unit 105 is supplied via the antenna 102. The antenna 102 receives electromagnetic waves supplied from an external device called a reader / writer, and generates necessary power in the power supply circuit unit 107. The antenna 102 may be appropriately designed according to the frequency band for communication. As the frequency band of electromagnetic waves, a long wave band up to 135 kHz, a short wave band of 6 to 60 MHz (typically 13.56 MHz), an ultra high frequency band of 400 to 950 MHz, a microwave band of 2 to 25 GHz, and the like can be used. As the long wave band or short wave band antenna, an antenna using electromagnetic induction by a loop antenna is used. In addition, a mutual inductive action (electromagnetic coupling method) or an electrostatic induction action (electrostatic coupling method) may be used. The power is generated by the power supply circuit unit 107. As the antenna 102, a data communication antenna and a power supply antenna may be provided separately.

  Such an antenna 102 is formed using a metal material containing aluminum, copper, or silver. For example, the antenna 102 can be formed using a paste composition of copper or silver by screen printing, offset printing, or an inkjet printing method. Alternatively, the aluminum film may be formed by sputtering or the like, and the antenna 102 may be formed by etching. In addition, the antenna 102 may be formed using an electrolytic plating method or an electroless plating method.

  A wireless chip 120 in which the configuration of the memory unit 104 is changed in the wireless chip 100 illustrated in FIG. 1 is illustrated in FIG. The integrated circuit unit 121 is configured by a memory element having a floating gate structure in which the memory unit 122 can be sequentially written and data is not lost. In particular, it is preferable to use a memory element having a floating gate structure, which can be written only once. The wireless chip 120 having this configuration has only a function of recording and reading data detected by the sensor 108. By simplifying the function, the wireless chip 120 can be reduced in size. In addition, power can be saved.

  FIG. 3 shows an example of a reader / writer module 200 that transmits and receives information to and from the wireless chip 100. A communication circuit unit 202 including an antenna 201, an oscillator 203, a demodulation circuit 204, and a modulation circuit 205 is provided. In addition, an arithmetic processing circuit unit 206 and an external interface unit 207 are provided and can be connected to an information processing apparatus such as a computer. In order to encrypt and transmit the control signal, the encryption / decryption circuit unit 208 and the memory unit 209 may be provided. The power supply circuit unit 210 supplies power to each circuit.

  The wireless chip 100 illustrated in FIG. 1 and the wireless chip 120 illustrated in FIG. 2 are formed by combining other active elements and passive elements such as a transistor manufactured using a single crystal semiconductor and a TFT manufactured using a polycrystalline semiconductor film.

  FIG. 4A shows an example in which a top gate type TFT is applied. Over the substrate 300, a first insulating layer 301 which serves as a base film, a semiconductor layer 302, and a second insulating layer 303 which can function as a gate insulating layer are provided. As the substrate 300, a glass substrate, a quartz substrate, or the like made of aluminosilicate glass, aluminoborosilicate glass, or the like can be used. The first insulating layer 301 is formed using silicon nitride or silicon oxynitride. The second insulating layer 303 is formed using silicon oxide or silicon oxynitride.

  A gate electrode 304 is formed on the second insulating layer 303 so as to correspond to the semiconductor layer 302. A third insulating layer 305 functioning as a protective layer and a third insulating layer 305 functioning as an interlayer insulating layer are provided thereover. A fifth insulating layer 308 functioning as a protective layer may be formed over the wiring 307 that forms a contact with the semiconductor layer 302. The third insulating layer 305 is preferably formed of silicon nitride.

  The semiconductor layer 302 is a layer formed of a semiconductor having a crystal structure, and typically uses polycrystalline silicon. For example, a polycrystalline semiconductor obtained by crystallizing an amorphous or microcrystalline semiconductor by laser beam irradiation is used. In addition, a crystalline semiconductor crystallized by heat treatment, or a crystalline semiconductor crystallized by combining heat treatment and laser light irradiation can be used. In the heat treatment, it is preferable to apply a crystallization method using a metal element such as nickel which has an action of promoting crystallization of the silicon semiconductor.

  When crystallization is performed by irradiation with a laser beam, a high repetition frequency with irradiation of a continuous wave laser beam or a repetition frequency of 10 MHz or more and a pulse width of 1 nanosecond or less, preferably 1 to 100 picoseconds. Irradiate an ultrashort pulse laser beam. By irradiating this pulsed laser beam, crystallization is performed while continuously moving the molten zone in which the semiconductor is melted in the irradiation direction of the laser beam. By irradiation with the laser beam as described above, a crystalline semiconductor in which the crystal grain boundary extends in one direction can be obtained. If a TFT is arranged in accordance with this crystal, a wireless chip capable of high-speed operation can be manufactured. Specifically, high field-effect mobility can be obtained by matching the channel direction of the TFT, that is, the carrier drift direction, with the direction extending to the crystal grain boundary. Thereby, for example, the delay time per stage of the inverter can be 26 n nanoseconds or less.

  The gate electrode 304 is formed using a metal or a polycrystalline semiconductor to which an impurity of one conductivity type is added. In the case of using a metal, tungsten (W), molybdenum (Mo), titanium (Ti), tantalum (Ta), aluminum (Al), or the like can be used. Further, a metal nitride obtained by nitriding the above metal can be used. Or it is good also as a structure which laminated | stacked the 1st layer which consists of the said metal nitride, and the 2nd layer which consists of the said metal. In the case of a laminated structure, the end of the first layer may have a hat shape (hat end) shape extending outward from the end of the second layer. At this time, the adhesion of the second layer metal to the base can be improved by using the first layer as a metal nitride. Moreover, it can be set as a barrier metal. That is, the metal of the second layer can be prevented from diffusing into the second insulating layer 303 and the semiconductor layer 302 below it.

  Various structures such as a single drain structure, an LDD (low concentration drain) structure, and a gate overlap drain structure can be applied to a TFT formed by combining the semiconductor layer 302, the second insulating layer 303, and the gate electrode 304. In addition, a single gate structure, equivalently, a multi-gate structure in which transistors to which a gate voltage of the same potential is applied is connected in series, and a dual gate structure in which a semiconductor layer is sandwiched between gate electrodes up and down are applied. be able to.

  The third insulating layer 305 is formed using an inorganic insulating material such as silicon oxide and silicon oxynitride, or an organic insulating material such as an acrylic resin and a polyimide resin. When a coating method such as spin coating or roll coater is used, silicon oxide in which an insulating layer is formed by heat treatment after coating an insulating film material dissolved in an organic solvent can also be used. For example, an insulating layer that can be formed by heat treatment at 200 to 400 ° C. after forming a coating film containing a siloxane bond can be used. By forming an insulating layer formed by a coating method or an insulating layer flattened by reflow, the third insulating layer 305 can prevent disconnection of wiring formed over the layer. It can also be used effectively when forming multilayer wiring.

  The wiring 307 formed over the fourth insulating layer 306 can be provided so as to intersect with a wiring layer formed of the same layer as the gate electrode 304, and forms a multilayer wiring structure. A multilayer wiring structure can be formed by stacking an interlayer insulating film in the same manner as the fourth insulating layer 306 and forming a wiring on the layer. The wiring is made of a low resistance material such as aluminum (Al), such as a laminated structure of titanium (Ti) and aluminum (Al), or a laminated structure of molybdenum (Mo) and aluminum (Al), and titanium (Ti) or molybdenum (Mo It is preferable to form a combination with a barrier metal using a refractory metal material such as

  The antenna 102 can also be formed over the sixth insulating layer 309. The antenna 102 is formed using a metal material containing aluminum, copper, or silver. For example, the antenna 102 can be formed using a paste composition of copper or silver by screen printing, offset printing, or an inkjet printing method. Alternatively, the aluminum film may be formed by sputtering or the like, and the antenna 102 may be formed by etching. In addition, the antenna 102 may be formed using an electrolytic plating method or an electroless plating method.

  FIG. 5 is a perspective view illustrating a configuration example of the wireless chip 100 or the wireless chip 120 in which the substrate 300, the element formation layer 310, and the antenna 102 are stacked. The element formation layer 310 includes a first insulating layer 301, a semiconductor layer 302, a second insulating layer 303, a gate electrode 304, a third insulating layer 305, a fourth insulating layer 306, and a fifth insulating layer 308 shown in FIG. , A sixth insulating layer and a wiring 307 are included. The antenna 102 is connected to a circuit formed of TFTs. A protective film may be further formed over the antenna 102 with an inorganic insulating material or an organic insulating material. In this manner, the wireless chip can be miniaturized by integrally forming the element formation layer 310 and the antenna 102. The wireless chip 100 or the wireless chip 120 is provided with a sensor unit 106. The sensor unit 106 may be configured such that a light introduction window or an electrode for measuring capacitance is provided and exposed.

  FIG. 4B illustrates an example in which a bottom-gate TFT is applied. A gate electrode 304, a second insulating layer 303 functioning as a gate insulating layer, a semiconductor layer 302, a third insulating layer 305 functioning as a protective layer, and a fourth insulating layer 306 functioning as an interlayer insulating layer are provided over the substrate 300. It has been. A channel protective layer 311 is provided on the side of the semiconductor layer 302 opposite to the gate electrode 304, that is, on the back gate side. Further, a fifth insulating layer 308 functioning as a protective layer may be formed thereover. The wiring 307 can be formed over the third insulating layer 305 or the fourth insulating layer 306.

  Such a TFT can also be provided on a flexible substrate formed using plastic or the like as a material. FIG. 6 shows a mode in which TFTs are provided on a flexible substrate 312. Although the TFT can be formed directly on the flexible substrate, the TFT formed on another substrate is preferably transferred onto the flexible substrate. In the embodiment of FIG. 6, a peeling protective layer 315 is provided between the flexible substrate 312 and the first insulating layer 301 and is fixed by an adhesive layer 318.

As the flexible substrate 312, a plastic material such as polycarbonate, polyarylate, polyethersulfone, polytetrafluoroethylene, polyethylene terephthalate, polyethylene naphthalate, or polyimide can be used. The specific gravity of these plastic materials, polyethylene terephthalate is 1.40 g / cm ^3, so polycarbonate is 1.20 g / cm ^3, generally in the range of 1.0 to 1.5 g / cm ^3, a glass It is characterized by being smaller than 2.52 g / cm ³ . That is, by using these plastic materials, the weight of the wireless chip and the wireless chip on which the wireless chip is mounted can be reduced. In addition, the impact resistance of the wireless chip and the wireless chip on which the wireless chip is mounted can be improved.

  An example of a process for forming the integrated circuit portion 101 or the integrated circuit portion 121 over the flexible substrate 312 is shown in FIG. First, as illustrated in FIG. 7A, a separation layer 314 and a separation protection layer 315 are formed over the first substrate 313. The first substrate 313 only needs to have rigidity enough to withstand a subsequent peeling step, and a glass substrate, a quartz substrate, a ceramic substrate, a silicon substrate, a metal substrate, a stainless steel substrate, or the like can be used. For the release layer 314 and the release protective layer 315, a combination is used in which the internal stress of the film is changed by a heat treatment process so that it can be physically separated.

  As this combination, there is a combination in which the peeling layer 314 is formed of a metal material and the peeling protective layer 315 is formed of an oxide material. The release layer 314 is a kind selected from tungsten (W), molybdenum (Mo) titanium (Ti), tantalum (Ta), niobium (Nd), nickel (Ni), and cobalt (Co), or these elements as main components. An alloy material or a compound material may be used. This release layer 314 is formed by a sputtering method or the like so as to have a thickness of 10 nm to 200 nm, preferably 50 nm to 75 nm. The separation protective layer 315 is preferably formed using silicon oxide or silicon oxynitride, and the film thickness is preferably twice or more that of the separation layer 314.

  The composition of the release layer 314 may be appropriately designed in accordance with the temperature condition of the manufacturing process. For example, in the case of an alloy of tungsten (W) and molybdenum (Mo), the peelable temperature is shifted to a lower temperature side by increasing the molybdenum content. In order to form the release layer 314 with tungsten (W) and to ensure the release at the interface with the release protective layer 315, heat treatment at a temperature of 400 ° C. or higher is necessary. It can be used together by including heat treatment at temperature.

  After that, as illustrated in FIG. 7B, the element formation layer 310 is formed over the separation protective layer 315. The element formation layer 310 includes the first insulating layer 301, the semiconductor layer 302, the second insulating layer 303, the gate electrode 304, the third insulating layer 305, the fourth insulating layer 306, the fifth insulating layer 308, and the wiring 307 illustrated in FIG. Is included. TFTs are formed using these layers, and each functional circuit section as shown in FIGS. 1 and 2 is configured. The included elements may include a capacitor element, an inductive element, a resistance element, and the like in addition to the TFT.

  As shown in FIG. 7C, an adhesive layer 316 is formed over the element formation layer 310, and the second substrate 317 is fixed. The second substrate 317 is preferably a substrate having higher rigidity than the first substrate 313. The adhesive layer 316 is a peelable adhesive, and for example, an ultraviolet peelable adhesive that peels off by ultraviolet rays, a heat peelable adhesive that peels off by heat, a water-soluble adhesive, a double-sided adhesive tape, or the like can be used. .

  In order to peel the element formation layer 310 from the first substrate 313, a force is applied to the first substrate 313 and / or the second substrate 317. As shown in FIG. 8A, peeling occurs at the interface between the peeling layer 314 and the peeling protective layer 315 or in the vicinity thereof. Then, the element formation layer 310 is peeled from the first substrate 313. Peeling is made by cleaving a very thin metal oxide layer formed on the surface of the metal forming the peeling layer 314 when viewed with sight. It is presumed that the metal oxide is formed by forming the peeling protective layer 315 with an oxide material, and more preferably performing a heat treatment at 400 ° C. or higher after that.

  In addition, the method for peeling the element formation layer 310 from the first substrate 313 is not limited to the above method. For example, the substrate may be removed by mechanical polishing. Moreover, you may etch chemically. Stripping can also be performed by a combination of mechanical polishing and chemical etching.

In addition, the element formation layer 310 can be peeled by forming the peeling layer 314 with silicon, forming the peeling protective layer 315 with silicon oxide, and selectively etching the peeling layer 314. In this case, a through-hole reaching the separation layer 314 is opened in the element formation layer 310, and the separation layer 314 is selectively etched using a fluorine-based etching gas. Preferably, ClF ₃ is used as an etching gas. Since ClF ₃ does not substantially etch silicon oxide or silicon nitride and can selectively etch silicon, the element formation layer 310 can be easily separated from the substrate 313.

  After this peeling step, as shown in FIG. 8B, an adhesive layer 318 is formed on the peeling protective layer 315 side, and the flexible substrate 312 is fixed. As the adhesive layer 318, an ultraviolet curable resin, specifically, an adhesive such as an epoxy resin adhesive or a resin additive, or a double-sided adhesive tape can be used. Since the element formation process has already been completed, the flexible substrate 312 is not limited by the process temperature, and as described above, substrates of various plastic materials can be used.

  Finally, as shown in FIG. 8C, a step of removing the second substrate 317 is performed. If the adhesive layer 318 is a material that undergoes photoisomerization, the adhesive layer 318 can be peeled off by irradiating ultraviolet rays to reduce the tackiness. Further, if it is formed of a water-soluble material, it may be washed with water. Such treatment may be combined according to the type of the adhesive layer 318.

  As described above, a wireless chip in which a circuit is formed using TFTs over the flexible substrate 312 can be formed. The antenna 102 can be formed over the element formation layer 310. That is, in FIG. 5, the substrate 300 can be replaced with the flexible substrate 312.

  The sensor unit 106 included in the integrated circuit unit 101 or the integrated circuit unit 121 can be formed in the element formation layer 310. The sensor unit 106 includes a sensor 108 and a sensor circuit 109.

  FIG. 9 shows an example of the sensor unit 106. The sensor unit 106 is a sensor that detects temperature. The sensor 108 is formed of a plurality of ring oscillators 150 using TFTs. This utilizes the fact that the oscillation frequency of the ring oscillator 150 changes depending on the temperature. The threshold voltage of the TFT decreases as the temperature increases. The on-current increases as the threshold voltage decreases. The ring oscillator 150 has a characteristic that the oscillation frequency increases as the on-current of the TFT increases. Using this characteristic, the ring oscillator 150 can be used as a temperature sensor. The oscillation frequency of the ring oscillator 150 can be measured by the pulse counter 151 of the sensor circuit 109. The signal of the pulse counter 151 may be output to the arithmetic processing circuit unit 103 as it is or after being level-shifted.

  FIG. 10A illustrates an example of a sensor that detects ambient brightness or the presence or absence of light irradiation. The sensor 108 is formed of a photodiode, a phototransistor, or the like. The sensor circuit 109 includes a sensor drive circuit 152, a detection circuit 153, and an A / D conversion circuit 154.

  FIG. 10B is a circuit diagram illustrating the detection circuit 153. When the reset TFT 155 is turned on, a reverse bias voltage is applied to the sensor 108. Here, an operation in which the potential of the minus terminal of the sensor 108 is charged to the potential of the power supply voltage is referred to as “reset”. Thereafter, the reset TFT 155 is turned off. At that time, due to the electromotive force of the sensor 108, the potential state changes with time. That is, the potential at the minus terminal of the sensor 108 that has been charged to the potential of the power supply voltage gradually decreases due to the charge generated by the photoelectric conversion. When the bias TFT 157 is turned on after a certain time has elapsed, a signal is output to the output side through the amplification TFT 156. In this case, the amplification TFT 156 and the bias TFT 157 operate as a so-called source follower circuit.

  Although FIG. 10B shows an example in which the source follower circuit is formed of an n-channel TFT, it can of course be formed of a p-channel TFT. A power supply voltage Vdd is applied to the amplification side power supply line 158. The bias-side power line 159 is given a reference potential of 0 volts. The drain side terminal of the amplification TFT 156 is connected to the amplification side power supply line, and the source side terminal is connected to the drain terminal of the bias TFT 157. The source side terminal of the bias TFT 157 is connected to the bias side power line 159. A bias voltage Vb is applied to the gate terminal of the bias TFT 157, and a bias current Ib flows through the TFT. The bias TFT 157 basically operates as a constant current source. The input voltage Vin is applied to the gate terminal of the amplifying TFT 156, and the source terminal becomes the output terminal. The input / output relationship of this source follower circuit is Vout = Vin−Vb. This output voltage Vout is converted into a digital signal by the A / D conversion circuit 154. The digital signal is output to the arithmetic processing circuit unit 103.

  FIG. 11 shows an example in which the sensor 108 is provided with an element for detecting capacitance. The element for detecting the capacitance includes a pair of electrodes. An object to be detected such as a liquid or a gas is filled between the electrodes. By detecting a change in capacitance between the pair of electrodes, for example, the state of the contents sealed in the container is determined. Further, it is possible to detect a change in humidity by interposing a polyimide, acrylic or other hygroscopic dielectric material between a pair of electrodes and reading a minute change in electric resistance.

  The sensor circuit 109 has the following configuration. The oscillation circuit 160 generates a measurement reference signal and inputs the signal to the electrode of the sensor 108. The voltage at this time is also input to the voltage detection circuit 161. The reference signal detected by the voltage detection circuit 161 is converted by the conversion circuit 163 into a voltage signal indicating an effective value. The current flowing between the electrodes of the sensor 108 is detected by the current detection circuit 162. The signal detected by the current detection circuit 162 is converted by the conversion circuit 164 into a current signal indicating an effective value. The arithmetic circuit 166 calculates electric parameters such as impedance or admittance by performing arithmetic processing on the voltage signal output from the conversion circuit 163 and the current signal output from the conversion circuit 164. In addition, the output of the voltage detection circuit 161 and the output of the current detection circuit 162 are input to the phase comparison circuit 165. The phase comparison circuit 165 outputs the phase difference between the two signals to the arithmetic circuit 167. The arithmetic circuit 167 calculates the capacitance using the output signals of the arithmetic circuit 166 and the phase comparison circuit 165. Then, the signal is output to the arithmetic processing circuit unit 103.

  As described above, a wireless chip including a sensor, a memory, and an antenna can be applied to various uses. FIG. 12 shows a state in which the wireless chip 100 is placed together with the contents in a sealed container 400. The wireless chip 100 may be fixed to the inner wall of the container 400, or may be separated from the contents. In order to detect the temperature of the contents, a wireless chip 100 with a sensor as shown in FIG. 9 is used. When the contents are liquid or gas, a wireless chip 100 with a sensor as shown in FIG. 11 is used. And the information which determines the state of the content can be obtained using the change of an electrostatic capacitance. By bringing a head 402 with a reader / writer attached to the data management apparatus 401 close to the container 400, the wireless chip 100 is operated to detect the state of the contents. The information is displayed on the display unit 403 of the data management device 401. Further, it is possible to read the data recorded in the wireless chip 100 and know the history of the storage state. By recording the individual information of the article in the wireless chip 100, it is possible to identify what the contents are.

  FIG. 13 is a flowchart for explaining the operation of the data management device 401 and the wireless chip 100. The data management device 401 transmits control signals such as a sensor activation signal, a data read signal, and a data write signal. The wireless chip 100 receives the control signal. The wireless chip 100 identifies a control signal with an arithmetic processing circuit. Then, it is determined which operation is to be performed among the operation of measuring and recording the data by operating the sensor unit 106, the operation of reading the data recorded in the memory unit, and the operation of writing the data in the memory unit. In the operation of measuring and recording data, the sensor circuit is operated, the sensor signal is read, binarized via the sensor circuit, and recorded in the memory unit. In the operation of writing data, the data transmitted from the data management device 401 is written into the memory unit 104. In the operation of reading the data recorded in the memory unit, the operation of reading the data in the memory unit 104 and transmitting it to the data management device 401 is performed. The power necessary for the operation of the circuit is assumed to be performed simultaneously with the signal transmission or at any time.

  FIG. 14 illustrates a mode in which communication with the wireless chip 100 contained in the container 404 is performed using the information terminal 405. The container 404 can be made of plastic such as a plastic bottle or glass. The wireless chip 100 is fixed inside the container 404 or left in the contents. Alternatively, as shown in FIG. 15, the wireless chip 100 may be attached to a label 407 attached to the container 404. The wireless chip 100 is desirably provided on the side opposite to the printing surface of the label 407. Further, by using the flexible substrate shown in FIG. 6 as a label, the wireless chip 100 can be integrated. That is, a thin wireless chip 100 integrated with the label 407 can be obtained by forming a functional circuit with TFTs. The information terminal 405 is a portable telephone or a computer. It is preferable to have a communication function and to include a recording medium and a display unit.

  FIG. 14 illustrates an example in which the information terminal 405 communicates with the wireless chip 100 using a portable phone. By operating the information terminal 405, the wireless chip 100 is operated to detect the state of the contents. The information is displayed on the display unit 406 of the information terminal 405. Further, the data recorded in the wireless chip 100 can be read to know the history of the product. For example, it is possible to determine whether the contents are left in a place where they are exposed to direct sunlight and become high temperature and the contents are not altered. By recording the individual information of the article in the wireless chip 100, it is possible to identify what the contents are.

  In addition, by connecting the information terminal 405 to an information network such as the Internet, more detailed information can be obtained by combining information obtained from the wireless chip 100 and information obtained via the network. For example, it is possible to know when and how the product has been distributed by referring to the history information after shipment of the product obtained from the wireless chip 100 and the information of the manufacturer acquired via the network.

  FIG. 16 shows a mode in which the first wireless chip 409 provided in the packaging body 408 and the second wireless chip 410 are provided in the container 404 accommodated in the packaging body 408. The first wireless chip 409 has the configuration shown in FIG. The second wireless chip 410 has the configuration shown in FIG. The first wireless chip 409 communicates with the reader / writer device 411. The first wireless chip 409 that has received the control signal from the reader / writer device 411 communicates with the second wireless chip 410. The first wireless chip 409 and the second wireless chip 410 are arranged at a short distance. That is, this corresponds to the positional relationship between the container 404 and its package 408. When the first wireless chip 409 and the second wireless chip 410 are arranged at a short distance, the communication circuit unit and the antenna of the second wireless chip 410 need only have low sensitivity. Therefore, the second wireless chip 410 can be simplified by simplifying the communication function, reducing the size of the antenna, performing communication only at a short distance, and omitting the memory function. As a preferable aspect of the second wireless chip 410, there is one in which an integrated circuit portion and an antenna are formed over the same substrate as shown in FIG. Thereby, the second wireless chip 410 included in the container 404 can be reduced in size. As a result, the appearance of the product is not impaired.

  Such a form can be utilized especially in the distribution process of goods. For example, when a container 404 provided with a second wireless chip 410 is provided in a loading platform of a transport vehicle such as a truck and transported in a package 408 provided with a first wireless chip 409. Can be applied. In such a case, it is effective to grasp the contents of the load. In addition, it is possible to immediately check whether there is any change in quality regarding the cargo. Further, it is useful when the container 404 provided with the second wireless chip 410 is provided in the warehouse with the reader / writer device 411 and stored in the package 408 provided with the first wireless chip 409. In such a case, the reader / writer device 411 is controlled by the computer 412. By making the computer 412 connectable to a network such as the Internet, the information in the package 408 can be acquired by operating the reader / writer device 411 from a remote place.

  As described above, according to the present embodiment, it is possible to know the distribution history of goods and the state of contents by arranging a wireless chip with a sensor function in a container. In addition, the internal state of the container can be known without opening the container. Furthermore, more detailed information can be obtained by connecting a terminal that reads information on the wireless chip to the network.

  In addition, the wireless chip with the sensor function described in this embodiment can detect the distribution history of goods and the state of contents, and can be effectively used in various business situations. Hereinafter, an aspect thereof will be described with reference to FIG.

  FIG. 17 shows a management system when a container filled with a product such as a soft drink or alcoholic beverage is distributed from a manufacturer to a store or the like. This container is lent together with the contents from a manufacturer to a retail store or a store that provides food and drink. As a usage form of the container, it can be handled as a recycling container that is collected and reused when the contents become empty.

  A supply device 501 for delivering the contents from the container 502 is disposed in a store 500 or the like. The supply device 501 is provided with a supply pipe 503 for taking out contents from the container 502 and a supply port 504 connected thereto. The supply pipe 503 is provided with a first valve 505 and a second valve 506 on the way in order to control delivery of contents. The container 502 is provided with a wireless chip 509, and the supply device 501 is provided with a signal processing device 507 that performs wireless communication with the wireless chip. The signal processing device 507 is used in a state where it can communicate with the server 513 of the management center 511 of the manufacturer that supplies the product using a communication network 512 such as a telephone line or the Internet.

  A wireless chip 509 is provided inside or outside the container 502. The wireless chip 509 records information such as the date, manufacturer, contents, and the like when the container 502 is filled with the contents. In addition, the wireless chip 509 is provided with a temperature sensor, a humidity sensor, an optical sensor, and the like, so that changes in temperature of the container 502 or the contents of the container 502 and changes in the environment in which the container 502 is placed are recorded in a timely manner. ing. Therefore, the wireless chip 509 may incorporate a battery. By providing the battery, the wireless chip 509 can operate spontaneously according to a program built in the wireless chip 509.

  When the container 502 is connected to the supply device 501, the signal processing device 507 reads information stored in the wireless chip 509 attached to the container 502. Then, the signal processing device 507 transmits information read from the wireless chip 509 to the server 513 of the management center 511 via the communication network 512. The server 513 has a database in which shipment product data 514 and used product data 515 are recorded. Then, the wireless chip 509 information received via the communication network 512 is collated with the data in the database. That is, the management center 511 collects information on the expiration date, expiration date, manufacturer, etc. of the company's products provided in the city by utilizing the information of the shipment product data 514 and the used product data 515, It is determined whether or not the product can be provided to the consumer. In addition, the consistency between the supply device 501 and the container 502 can be determined, and it can be monitored whether there is a mixture of competitors' products and whether counterfeit products are mixed.

  When the management center 511 determines that the product may be provided to the consumer as a result of the determination, the management center 511 gives the permission information to the signal processing device 507 of the supply device 501 via the communication network 512. In that case, a signal is sent to the control unit 508 of the supply device 501, thereby opening the first valve 505. The second valve 506 is a manual valve, and appropriately opens and closes when the contents are taken out from the container 502 and subdivided.

  On the other hand, if it is determined that the product should not be provided to the consumer as a result of the determination, the permission information is provided to the signal processing device 507 of the supply device 501 via the communication network 512. In that case, the first valve 505 does not operate and the product cannot be provided to the consumer. For example, this is the case when the shelf life of the product has passed, the storage environment of the product is outside the allowable range, or the container is determined not to be genuine.

  With such a system, the manufacturer can directly grasp the consumption of the company's products at retail stores or stores that provide food and drink. Thereby, it is possible to effectively manage the shipping of products, and it is possible to simplify orders at retail stores or stores that provide food and drink.

  In addition, although illustrated about food and drink in FIG. 17, the management system which concerns on this invention is not limited to this, Liquids, such as hot spring water, detergent, liquid fertilizer, livestock feed, volatile oil, domestic water, propane gas, It can be applied to the distribution of various products such as gas such as natural gas, hydrogen gas, oxygen gas, nitrogen gas, and gel fluid such as paste, ice cream and soup.

It is a figure which shows the structure of the radio | wireless chip concerning this invention. It is a figure which shows the structure of the radio | wireless chip concerning this invention. It is a figure which shows the structure of the reader / writer module which concerns on this invention. It is a figure explaining the structure of TFT which comprises the wireless chip concerning this invention. It is a perspective view which shows one structural example of the wireless chip which concerns on this invention. It is a figure explaining the structure of TFT which comprises the wireless chip concerning this invention. It is a figure explaining an example of the process of forming a wireless chip in a flexible substrate. It is a figure explaining an example of the process of forming a wireless chip in a flexible substrate. It is a block diagram explaining the structure of a sensor part. It is (A) block diagram and (B) circuit diagram explaining the structure of a sensor part. It is a block diagram explaining the structure of a sensor part. It is a figure which shows the state which entered the wireless chip with the contents in the sealed container. It is a flowchart explaining operation | movement with a data management apparatus and a radio | wireless chip. It is a figure which shows the aspect which communicates with the wireless chip contained in the container using an information terminal. It is a figure which shows the state which mounted | wore the wireless chip with the label of the container. It is a figure which shows the aspect which provided the wireless chip in the container accommodated in the 1st wireless chip provided in the package, and the package. It is the figure which showed the application example of the radio | wireless chip with the sensor function of this invention.

Explanation of symbols

100 wireless chip 101 integrated circuit unit 102 antenna 103 arithmetic processing circuit unit 104 memory unit 105 communication circuit unit 106 sensor unit 107 power supply circuit unit 108 sensor 109 sensor circuit 110 first memory unit 111 second memory unit 112 demodulation circuit 113 modulation circuit 120 Wireless chip 121 Integrated circuit section 122 Memory section 150 Ring oscillator 151 Pulse counter 152 Sensor drive circuit 153 Detection circuit 154 A / D conversion circuit 155 Reset TFT
156 Amplifying TFT
157 Bias TFT
158 Amplification side power supply line 159 Bias side power supply line 160 Oscillation circuit 161 Voltage detection circuit 162 Current detection circuit 163 Conversion circuit 164 Conversion circuit 165 Phase comparison circuit 166 Operation circuit 167 Operation circuit 200 Reader / writer module 201 Antenna 202 Communication circuit unit 203 Oscillator 204 demodulation circuit 205 modulation circuit 206 arithmetic processing circuit unit 207 external interface unit 208 encryption / decomposition circuit unit 209 memory unit 210 power supply circuit unit 300 substrate 301 first insulating layer 302 semiconductor layer 303 second insulating layer 304 gate electrode 305 first 3rd insulating layer 306 4th insulating layer 307 Wiring 308 5th insulating layer 309 6th insulating layer 310 Element formation layer 311 Channel protective layer 312 Flexible substrate 313 1st substrate 314 Peeling layer 315 Peeling protective layer 316 Adhesive layer 317 Second Substrate 318 Adhesive layer 400 Container 401 Data management device 402 Head 403 Display unit 404 Container 405 Information terminal 406 Display unit 407 Label 408 Package 409 First wireless chip 410 Second wireless chip 411 Reader / writer device 412 Computer

Claims (8)

A wireless chip comprising a sensor unit, a memory unit, a control arithmetic circuit unit, a communication circuit unit, and an antenna. A sensor unit, a memory unit, a control arithmetic circuit unit, a communication circuit unit, and an antenna are formed of a thin film transistor in which a channel region is formed by a semiconductor layer formed on an insulating surface and divided into islands. A wireless chip characterized by that. A sensor unit, a first memory unit that stores output data from the sensor unit, a communication circuit unit, and a second memory unit that stores write data received by the communication circuit unit. Wireless chip. A sensor unit formed of a thin film transistor in which a channel region is formed of a semiconductor layer formed on an insulating surface and divided into islands; a first memory unit that stores output data from the sensor unit; and a communication circuit unit; A wireless chip comprising: a second memory unit for storing write data received by the communication circuit unit. Containers including a wireless chip including a sensor unit, a memory unit, a control arithmetic circuit unit, a communication circuit unit, and an antenna. A sensor unit, a memory unit, a control arithmetic circuit unit, a communication circuit unit, and an antenna, each of which is formed of a thin film transistor in which a channel region is formed by a semiconductor layer formed on an insulating surface and divided into islands. Containers that contain wireless chips. Includes a wireless chip including a sensor unit, a first memory unit that stores output data from the sensor unit, a communication circuit unit, and a second memory unit that stores write data received by the communication circuit unit. Containers. A sensor unit formed of a thin film transistor in which a channel region is formed of a semiconductor layer formed on an insulating surface and divided into islands, a first memory unit that stores output data from the sensor unit, and a communication circuit unit And a container containing a wireless chip comprising a second memory unit for storing write data received by the communication circuit unit.

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