JP2005300930A - Method for manufacturing optical and electrical consolidated substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing an optical and electrical consolidated substrate that includes a stage of peeling a temporary base material after laminating a conductor layer and an optical wiring layer on the temporary base material, and in which the optical and electrical consolidated substrate can stably be manufactured in high yield so that the temporary base material never carefully peels off from the conductor layer during UV treatment, heat treatment, etc., and has excellent peeling property when peeled. <P>SOLUTION: The method includes the stage of peeling the temporary base material 1 off the conductor layer 2 after the conductor layer 2 is laminated on one surface of the temporary base material 1 without being chemically bonded and an optical wiring layer 3 having a core layer 5 and a clad layer 4 is formed on the opposite surface of the conductor layer 2 from the temporary base material 1. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a method for manufacturing an opto-electric hybrid board in which optical wiring and electric wiring are provided in a mixed manner on the same substrate.

  In recent years, the need for an information processing circuit having a very high-speed information transmission path is increasing with the rapid widening of communication infrastructure and the dramatic increase in information processing capability of computers and the like. Under such a background, transmission by an optical signal is considered as one means for breaking the limit of the transmission speed of an electric signal, and various studies have been made on mounting an optical wiring on an electric wiring.

  As one method of manufacturing an opto-electric hybrid board in which such electrical wiring and optical wiring are mixed, an optical wiring layer or a conductor layer composed of a clad layer and a core layer is formed on the temporary base, and then the temporary base Has been employed (see Patent Document 1).

As one of the methods for manufacturing an opto-electric hybrid board using such a temporary base material, the one shown in FIG. 4 has been proposed. This is made by laminating a metal foil 12 such as a copper foil on one surface of a temporary substrate 1 with a peelable sheet 13 such as a heat peelable sheet such as a thermally foamable sheet or a UV peelable sheet. An optical waveguide constituting the optical wiring layer 3 composed of the clad layer 4 and the core layer 5 is formed on the surface of the foil, and light is transmitted and received between the light guided through the optical wiring layer 3 and the outside as necessary. For this purpose, the temporary base 1 and the metal foil 12 are peeled off by heating the releasable sheet 13 or by irradiating UV, thereby peeling off the temporary base 1 and the metal foil 12, and patterning the metal foil 12. Thus, electric wiring is formed.
JP 2002-228866 A

  However, in the above prior art, when a heat-release sheet is used as the release sheet, heat treatment cannot be performed in the middle of the process, and the heat-release sheet is generally low in solvent resistance and is not washed or developed. Etc. could not be processed. Further, when a UV peelable sheet is used, UV treatment such as lithography cannot be performed in the middle of the process, and the UV peelable sheet is generally low in heat resistance and solvent resistance, and the upper limit when performing heat treatment. There are problems that the temperature is limited, the processing time during processing such as washing and development is restricted, and that when such processing is performed, peeling reproducibility deteriorates.

  The present invention has been made in view of the above points, and in a method for manufacturing an opto-electric hybrid board including a step of peeling a temporary base material after forming a conductor layer and an optical wiring layer on the temporary base material. , A method in which a temporary base material is not inadvertently peeled off from a conductor layer by UV treatment, heat treatment, etc., and exhibits good peelability when the temporary base material is peeled off, and can stably produce an opto-electric hybrid board. Is intended to provide.

  The method for manufacturing an opto-electric hybrid board according to the present invention is a method for manufacturing an opto-electric hybrid board in which optical wiring and electrical wiring are provided on the same substrate. After forming the optical wiring layer 3 having the core layer 5 and the clad layer 4 on the surface of the conductor layer 2 opposite to the temporary base material 1 without being bonded to the temporary base 1, It includes a step of peeling the material 1. For this reason, the conductor layer 2 and the temporary base material 1 are not inadvertently peeled off even if the conductor layer 2 and the temporary base material 1 are bonded, even if UV treatment or heat treatment is performed. The degree of freedom in manufacturing becomes high, and when the temporary substrate 1 is peeled off, it can be easily peeled off.

  The conductor layer 2 can be formed by laminating and forming a plurality of conductor films. In this case, the conductor layer 2 is formed by laminating conductor films having various functions to enhance the functionality of the conductor layer 2. be able to.

  The conductor layer 2 can be formed by a vacuum film forming method or a plating method. In this case, the conductor layer 2 having a desired thickness can be formed with high thickness accuracy. At this time, when formed by a vacuum film formation method in particular, the conductor layer 2 having a very small thickness variation and a very high film thickness accuracy can be formed, and the occurrence of defects such as pinholes is suppressed. A quality conductor layer 2 is formed, and if formed by plating, a relatively thick conductor layer 2 can be easily formed.

  The conductor layer 2 is formed by laminating a plurality of conductor films, and at least one of the conductor film in contact with the temporary substrate 1 and the conductor film in contact with the optical wiring layer 3 is formed by a vacuum film formation method. You may make it form by. In this way, an ideal interface can be formed between the conductor layer 2 and the temporary base material 1 or the optical wiring layer 3, and in this case, in particular, the conductor film in contact with the temporary base material 1 is formed by a vacuum film formation method. When the temporary substrate 1 is peeled off from the conductor layer 2, it is possible to suppress the occurrence of unexpected changes in adhesion and to impart good peelability, and to provide a conductor film in contact with the optical wiring layer 3 Is formed by a vacuum film-forming method, the surface of the conductor layer 2 on the side of the optical wiring layer 3 can be composed of fine crystal grains having a diameter of about several tens of nanometers. When this surface is roughened, A rough surface having fine and high density irregularities can be formed.

  Further, before forming the optical wiring layer 3 on the surface of the conductor layer 2, it is preferable to roughen the surface of the conductor layer 2 on the optical wiring layer 3 side. When such a rough surface is formed, the adhesion between the conductor layer 2 and the optical wiring layer 3 can be improved by the anchoring effect.

  When the surface of the conductor layer 2 on the optical wiring layer 3 side is thus roughened, the surface roughness Ry (JIS B0601: maximum height) is roughened within a range of 0.5 μm or less. In this case, it is possible to suppress the generation of light intensity due to light loss by preventing excessive irregularities from being formed on the outer surface of the cladding layer 4 of the optical wiring layer 3 formed by being laminated on the conductor layer 2. it can.

  The surface of the conductor layer 2 on the side of the optical wiring layer 3 is preferably roughened by an etching process. In this case, the conductor layer 2 is easily etched at the crystal grain boundary, so that irregularities are formed. Thus, the morphology of the surface of the conductor layer 2 after the treatment is determined by the crystal grain size and the distribution state of the crystal grains, and a rough surface having a very fine and high density uneven shape can be formed.

  The roughening of the surface of the conductor layer 2 on the optical wiring layer 3 side is also preferably performed by surface oxidation treatment. In this case, the conductor layer 2 is prone to oxidation from the crystal grain boundary, For this reason, the morphology of the surface of the conductor layer 2 after the treatment is determined by the crystal grain size and the distribution of crystal grains, and a rough surface having a very fine and high-density concavo-convex shape can be formed.

  In addition, after the optical wiring layer 3 is formed and before the temporary base material 1 is peeled off, it is preferable to provide the support material 6 on the surface of the optical wiring layer 3 opposite to the temporary base material 1. When the temporary base material 1 is peeled from the layer 2, rigidity is imparted to the laminate of the optical wiring layer 3 and the conductor layer 2, and the occurrence of warpage can be suppressed.

  When the support member 6 is provided in this way, it is preferable that the surface of the cladding layer 4 of the optical wiring layer 3 that is in contact with the support member 6 is formed of an adhesive resin. In this case, the surface of the clad layer 4 in contact with the support material 6 is formed of an adhesive resin, and the support material 6 can be laminated on the optical wiring layer 3 by the adhesive force of the adhesive. As a result, the support material 6 can be bonded simultaneously with the formation of the clad layer 4, the manufacturing process can be simplified, and the need for a separate adhesive is eliminated, so that the overall thickness is reduced. Can do.

  Moreover, after peeling the temporary base material 1 from the conductor layer 2, the conductor wiring 10 can be formed by performing a patterning process on the conductor layer 2. If it does in this way, electrical wiring can be constituted by conductor wiring 10.

  According to the present invention, the optical wiring layer can be formed in a state where the conductor layer is bonded to the temporary base material, and the workability is good, and at this time, UV treatment or heat treatment is performed. However, the temporary base material can be prevented from peeling off from the conductor layer, and the degree of freedom in manufacturing becomes high. In addition, after the optical wiring layer is formed, when the temporary base material is peeled from the conductor layer, the temporary base material has good peelability and can be easily peeled off. Therefore, stable manufacturing can be performed in manufacturing the opto-electric hybrid board, and the yield can be improved.

  Hereinafter, the present invention will be described based on the best mode for carrying out the invention.

  In the manufacturing process of the opto-electric hybrid board shown in FIGS. 1 and 2, first, as shown in FIGS. 1A and 1B, the conductor layer 2 is chemically bonded to one surface of the temporary base 1. Without lamination.

  As the temporary base material 1, an appropriate material can be used, and is not particularly limited. For example, a glass plate material can be used.

  The conductor layer 2 can be formed of an appropriate metal, but can be formed of, for example, copper, nickel, gold, or the like.

  Here, lamination molding without chemically bonding means that the conductor layer 2 and the temporary base material 1 are in close contact with each other in a state where no chemical bond is formed between the conductor layer 2 and the temporary base material 1. It means a state of being laminated, for example, a state where the conductor layer 2 and the temporary base material 1 are joined mainly by van der Waals force, or the conductor layer 2 and the temporary base material 1 are partially bonded. It also means a state in which the conductor layer 2 and the temporary base material 1 are in direct contact with each other in a large area while being joined with an agent or the like.

  When the conductor layer 2 is laminated and formed on one surface of the temporary base material 1 without being chemically bonded, the conductor layer 2 can be formed on one surface side of the temporary base material 1 by a deposition method. That is, the conductor layer 2 is formed by depositing a metal on one surface of the temporary substrate 1 and depositing the metal until a desired thickness is obtained. In this case, the conductor layer 2 having a desired thickness can be formed with high thickness accuracy.

  As the deposition method, a vacuum film formation method, a plating method, or the like can be applied.

  In the vacuum film forming method, a metal is deposited on the surface of the temporary substrate 1 placed in a vacuum or in a reduced pressure atmosphere, and a vacuum deposition method, sputtering, or the like can be applied. When such a vacuum film-forming method is applied, the conductor layer 2 has a very high film thickness accuracy with little variation in thickness, and the occurrence of defects such as pinholes is suppressed, resulting in a very high-quality conductor. Layer 2 is formed.

  Further, when the conductor layer 2 is formed by plating, for example, the conductor layer 2 having a desired film thickness is formed by electroless plating, or the electroplating is performed after the electroless plating is performed. Thus, the conductor layer 2 having a desired thickness can be formed. When the conductor layer 2 is formed by such a plating method, even a relatively thick conductor layer 2 can be easily formed.

  Although the said conductor layer 2 is formed in appropriate thickness, Preferably it can form in the range of 0.1-30 micrometers.

  A specific example of the method for forming the conductor layer 2 is as follows. First, for example, a glass plate having a high smoothness of 75 mm in diameter and 1 mm in thickness is used as the temporary substrate 1, and a copper conductor layer having a thickness of, for example, 1 μm is formed on one surface thereof by a sputtering method. 2 can be formed.

  Further, a copper conductor layer 2 having a thickness of, for example, 10 μm can be formed on one surface of the same temporary substrate 1 by electroless plating.

  In forming the conductor layer 2, the conductor layer 2 can also be formed by laminating and forming a plurality of conductor films. Thereby, it is possible to increase the functionality of the conductor layer 2 by stacking and forming conductor films having various functions.

  For example, the conductor film that is directly bonded to the temporary base material 1 is provided with peelability when the temporary base material 1 is peeled from the conductor layer 2, and this conductor film is the most surface layer when the conductor wiring 10 is formed. Since it is disposed, it is preferable to impart corrosion resistance and wire bonding properties. The conductor film formed last, that is, the conductor film formed closest to the optical wiring layer 3 side, is preferably provided with a function of mainly imparting high conductivity to the conductor layer 2. Further, if necessary, in order to improve the corrosion resistance, strength and the like of the conductor layer 2, an appropriate conductor film can be laminated.

  For example, a conductive film made of gold is first formed as a first conductive film on the surface of the temporary base material 1 to a thickness of, for example, 0.1 μm by a vacuum deposition method, and then a conductive film made of nickel is used as the second conductive film. The conductor layer 2 can be formed by forming a conductor film made of copper as a third conductor film to a thickness of, for example, 10 μm by electrolytic plating or the like. it can.

  Of course, when forming the conductor layer 2 with a plurality of conductor films, the formation method and the number of layers of each conductor film are not limited to those described above, and appropriate methods such as plating and vacuum film formation are used for each conductor film. Thus, it is possible to form a desired number of layers of conductor films having an appropriate material and thickness. At this time, when the conductor film is formed by a deposition method such as plating or vacuum film formation, the conductor layer 2 having high adhesion between the layers of the conductor film can be formed.

  Further, when at least one of the surface of the conductor layer 2 in contact with the temporary substrate 1 and the surface in contact with the optical wiring layer 3 is formed by a vacuum film forming method, the conductor layer 2, the temporary substrate 1 or the optical wiring layer 3 An ideal interface can be formed between the two.

  That is, when forming the conductor layer 2, it is preferable to form the surface directly in contact with the temporary substrate 1 by a vacuum film formation method. In this case, for example, all the conductor layers 2 are formed by a vacuum film formation method. When the conductor layer 2 is formed of a plurality of conductor films, the first conductor film, that is, the conductor film 2 formed closest to the temporary base material 1 and in contact with the temporary base material 1 is vacuum formed. It is formed by a film method. In this way, it is possible to improve the peelability when peeling the temporary substrate 1 from the conductor layer 2 and to easily adjust the peelability to a desired one.

  Here, factors that deteriorate the peelability include deposits on the surface of the temporary base 1 (attached organic matter, oils and fats from the atmosphere), and in the plating solution when the conductor layer 2 is formed by plating. These impurities are present at the interface between the temporary base material 1 and the conductor layer 2, causing unexpected changes in adhesion, and dust on the surface of the formed conductor layer 2. A pinhole may occur due to the adhesion of dust to the surface of the temporary substrate 1 before the formation of the conductor layer 2 and the formation of the conductor layer 2 at that site. The clad layer 4 (first clad layer 4a) may be in direct contact with the portion where the film is formed. However, when the conductor layer 2 is formed by the vacuum film formation method as described above, a clean surface state is obtained. High purity conductor in vacuum on temporary substrate 1 2 can be formed, and thus the factors that change the adhesion as described above can be eliminated, and the desired adhesion (peelability) can be imparted. .

  When the conductor layer 2 is formed, the surface on the side where the optical wiring layer 3 is formed, that is, the surface opposite to the surface in contact with the temporary substrate 1 is formed by a vacuum film forming method. In this case, for example, when the conductor layer 2 is entirely formed by a vacuum film forming method and the conductor layer 2 is formed of a plurality of conductor films, the last formed conductor film, that is, a temporary substrate A conductor film disposed on the side opposite to the surface in contact with the material 1 and in contact with the optical wiring layer 3 is formed by a vacuum film formation method. In this way, the surface of the conductor layer 2 that contacts the optical wiring layer 3 is composed of fine crystal grains having a diameter of about several tens of nanometers, and will be described later on the surface of the conductor layer 2. When the roughening treatment is performed, a rough surface having a fine and high density unevenness can be formed, and high adhesion to the optical wiring layer 3 can be obtained due to the anchoring effect.

  After the formation of the conductor layer 2, the surface of the conductor layer 2 on the side where the optical wiring layer 3 is formed, that is, the surface opposite to the surface in contact with the temporary substrate 1, is subjected to a roughening treatment. By applying, it is preferable to improve the adhesion between the conductor layer 2 and the optical wiring layer 3 by the anchoring effect when the optical wiring layer 3 is formed.

  The roughening treatment can be performed by an appropriate method, and for example, etching treatment or surface oxidation treatment can be performed.

  In the etching process, the surface of the conductor layer 2 is treated with an appropriate etching solution according to the material of the conductor layer 2. For example, the etching process using an etching solution containing sulfuric acid as a main component for the conductor layer 2 made of copper. It can be performed. At this time, the conductor layer 2 has unevenness because the crystal grain boundary is easily etched, and the morphology of the surface of the conductor layer 2 after the treatment is determined by the crystal grain size and the distribution of crystal grains. In addition, it is possible to form a roughened surface having a high-density concavo-convex shape.

An example of the roughening treatment of the conductor layer 2 by etching treatment is as follows. The surface of the temporary base material 1 made of a flat glass plate having a diameter of 75 mm and a thickness of 1 mm, for example, has a thickness of about 1 μm and a crystal grain size of about 5 nm. After the copper conductor layer 2 is formed, the conductor layer 2 is first treated with a pre-dip agent (BO-7770VP) using an etching solution, for example, a surface treatment agent BO-7770V manufactured by MEC Co., Ltd., which mainly contains sulfuric acid. ) And 35% hydrogen peroxide solution, for example, in a volume ratio of 99: 1, for example, in a 100 cm ³ mixture, for example, at 23 ° C. for 60 seconds, and then the treatment agent (BO-7770VM) and 35% a hydrogen peroxide solution eg 94: 6 immersed mixture of 100 cm ³ were mixed at a volume ratio of for example 10 seconds at 23 ° C., and then to flowing water, for example, rinse 5 minutes Ri, desired surface roughness, such as surface roughness Ry (JIS B0601: maximum height) can form a roughened surface of 0.4 .mu.m.

  The surface oxidation treatment is to oxidize the surface of the conductor layer 2 with an appropriate oxidation treatment agent according to the material of the conductor layer 2. For example, the copper conductor layer 2 is subjected to a so-called blackening treatment. be able to. At this time, the conductor layer 2 is prone to oxidation from the crystal grain boundary, and therefore the morphology of the surface of the conductor layer 2 after the treatment is determined by the crystal grain size and the distribution of crystal grains, and is very fine and A roughened surface having a high-density concavo-convex shape can be formed.

  As an example of the roughening treatment of the conductor layer 2 by the surface oxidation treatment, the copper conductor layer 2 formed under the same conditions as in the etching treatment described above was first subjected to a primary treatment with an aqueous solution containing, for example, sulfuric acid as a main component. Then, it is oxidized (sub-oxidized) by immersing it in an oxidation treatment agent, for example, a blackening treatment agent HIST-500 manufactured by Hitachi Chemical Co., Ltd., for example, at 80 ° C. for 5 minutes. A roughened surface having a roughness Ry of 0.2 μm can be formed.

  When the surface of the conductor layer 2 is roughened in this way, it is preferable that the surface roughness Ry of the roughened surface be 0.5 μm or less. In this way, generation of light intensity due to light loss can be suppressed by preventing excessive irregularities from being formed on the outer surface of the cladding layer 4 of the optical wiring layer 3 formed by being laminated on the conductor layer 2. Further, in order to maintain high adhesion between the conductor layer 2 and the optical wiring layer 3, the surface roughness Ry is preferably 0.05 μm or more.

  After forming the conductor layer 2 and further performing the roughening treatment as described above, the optical wiring layer 3 having the core layer 5 and the clad layer 4 is laminated on the conductor layer 2 to be formed.

  In forming the optical wiring layer 3, two types of transparent resins having different refractive indexes are molded and cured to form a clad layer 4 by being laminated on the conductor layer 2 and embedded in the clad layer 4. 5 is formed to form an optical waveguide constituting the optical wiring. Further, if necessary, a mirror for guiding the light guided through the core layer 5 to the outside of the optical wiring layer 3 or guiding the light incident from the outside to the core layer 5 is provided in the core layer 5. 8 is provided. For example, the mirror 8 has a photoelectric conversion element mounted on an opto-electric hybrid wiring board, guides light emitted from the photoelectric conversion element to the core layer 5, or guides light guided through the core layer 5 to the photoelectric conversion element. It is provided to receive light by sending it to

  As the transparent resin constituting the optical wiring layer 3, a known appropriate resin conventionally used for forming the cladding layer 4 and the core layer 5 of the optical wiring layer 3 can be used. As the forming method, a known appropriate method can be used.

An example of a specific method for forming the optical wiring layer 3 is as follows. For example, a liquid UV curable transparent resin containing a UV curable epoxy resin and having a cured product having a refractive index of 1.52 is used as a conductor layer. As shown in FIG. 1 (c), after being applied to the upper surface of 2 by spin coating or the like, for example, after being cured by irradiation with UV light of ³ J / mm ² , for example, heat treatment is performed at 120 ° C. for 1 hour. For example, the first cladding layer 4a having a thickness of 20 μm is formed.

Next, for example, a liquid UV curable transparent resin containing a UV curable epoxy resin and a cured product having a refractive index of 1.54 is applied to the upper surface of the first cladding layer 4a by spin coating or the like. After irradiating, for example, 3 J / mm ² of UV light through a predetermined mask pattern, the uncured portion is washed and removed with an organic solvent, and as shown in FIG. The core layer 5 is formed.

Next, for example, the same liquid UV curable transparent resin as that used when forming the first clad layer 4a is used, and the upper surface on which the core layer 5 is not formed on the first clad layer 4a; Then, for example, by applying UV light of ³ J / mm ² and curing, heat treatment is performed at 120 ° C. for 1 hour, for example. Thereby, as shown in FIG. 1E, the intermediate cladding layer 4b is formed so as to be laminated on the first cladding layer 4a, and the core layer 5 is embedded in the intermediate cladding layer 4b. At this time, the thickness between the upper surface of the intermediate cladding layer 4b and the upper surface of the core layer 5 is formed to be thin, for example, about 1 μm thick.

  Next, the upper surface of the intermediate cladding layer 4b is cut so as to cross the core layer 5 with a dicing blade (# 6000) having a blade edge angle of 90 °, for example, as shown in FIG. 1 (f). A groove 7 having a V-shaped cross section is formed. At this time, the V-shaped groove 7 is formed so as to cross a predetermined portion of the core layer 5. Further, instead of forming such a V-shaped groove 7, an inclined surface having an angle of 45 ° is formed so as to cross a predetermined portion of the core layer 5 by ablation processing using an excimer laser having a wavelength of 248 nm, for example. You may do it. Then, a reflective film 9 made of a gold thin film or the like is selectively formed on the inner surface of the V-shaped groove 7 or the surface of the inclined surface by a vacuum vapor deposition method, a sputtering method, or the like, whereby FIG. As shown, a mirror 8 is formed. The thickness of the reflective film 9 can be set to 0.2 μm, for example.

Next, for example, the same liquid UV curable transparent resin as that used for forming the first clad layer 4a is used, and this is applied to the upper surface of the intermediate clad layer 4b by a spin coat method or the like. After being cured by irradiation with UV light of mm ² , for example, heat treatment is performed at 120 ° C. for 1 hour. Thus, as shown in FIG. 2B, the second cladding layer 4c having a thickness of 20 μm, for example, is formed so as to be laminated on the intermediate cladding layer 4b.

  Needless to say, the formation of the optical wiring layer 3 is not limited to the above-described conditions, and can be performed by appropriately changing the materials used, the processing method, and the processing conditions.

  After forming the optical wiring layer 3 as described above, a support material 6 is laminated on the surface of the optical wiring layer 3 opposite to the conductor layer 2 as shown in FIG. Provide. Although the support material 6 can be made of an appropriate material, it is preferable to use a material having a certain degree of rigidity. For example, a glass epoxy plate can be used. As a glass epoxy board here, the thing of predetermined thickness (for example, 0.1 mm) obtained by laminating | stacking several glass cloth base-material epoxy resin prepregs as needed, and heat-hardening can be used.

  Lamination | stacking of the support material 6 can be performed by a suitable method, for example, can be laminated | stacked by adhere | attaching with adhesives, such as a thermosetting epoxy resin adhesive agent.

  Further, in providing the support material 6, at least the surface in contact with the support material 6 in the cladding layer 4 of the optical wiring layer 3 is formed of an adhesive resin, and the support material 6 is formed by the adhesive property of the resin. It can also be provided by directly adhering to the clad layer 4. For example, in forming the optical wiring layer 3 as described above, when the second cladding layer 4c is formed, the refractive index of the cured product has other portions (the first cladding layer 4a and the intermediate cladding layer 4b). ) And a transparent liquid thermosetting adhesive (for example, an adhesive made of a thermosetting epoxy resin composition), and this thermosetting adhesive is applied to the upper surface of the intermediate cladding layer 4b. Prior to curing, the support 6 is laminated and disposed, and in this state, the thermosetting adhesive is cured by heating at 110 ° C. for 1 hour, for example. In this way, the surface of the clad layer 4 in contact with the support material 6 can be formed of an adhesive resin, and the support material 6 can be laminated on the optical wiring layer 3 by the adhesive force of the resin. At this time, the support material 6 can be bonded simultaneously with the formation of the clad layer 4, the manufacturing process can be simplified, and it is not necessary to intervene a separate adhesive, so that the entire thickness is reduced. It is something that can be done.

Next, as shown in FIG. 2 (d), the temporary substrate 1 is peeled from the conductor layer 2. At this time, the temporary base material 1 can be easily peeled off by an appropriate technique. For example, the side face of the temporary base material 1 is sandwiched by an appropriate jig and is peeled by applying a tensile stress with the jig. be able to. At this time, when the support material 6 is provided, the temporary support 1 can be peeled off more easily by holding the support material 6 and slightly bending it. Moreover, it can also peel by applying a suction force to the temporary substrate 1 by using a suction nozzle or a suction head.

  Thus, when the temporary base material 1 is peeled from the conductor layer 2, if the support material 6 is laminated on the optical wiring layer 3 as described above, the optical wiring layer 3 and the conductor layer 2 are laminated. Stiffness is imparted to the object, and the occurrence of warpage is suppressed.

  Next, the conductor layer 2 exposed by peeling the temporary base material 1 is subjected to a patterning process to form a conductor wiring 10 as shown in FIG. The patterning process can be performed by a known appropriate method. For example, after the etching resist is formed on the surface of the conductor layer 2, the etching process is performed, and the etching resist is peeled off.

  In the above embodiment, the case where the conductor layer 2 is mainly formed on the temporary base material 1 by the deposition method has been described. However, as described above, the conductor layer 2 is chemically treated with respect to the temporary base material 1. In the lamination molding without being bonded to the film, the deposition method is not limited to using the deposition method. For example, as shown in FIG.

  3, as shown in FIG. 3A, a holding margin 1 a is integrally provided on the periphery of the temporary base 1, and a held margin is provided on the periphery of the metal foil 12 such as a copper foil. 2a is integrally provided, and a metal foil 12 such as a copper foil is placed in contact with one surface of the temporary base 1, and a thermosetting adhesive is provided between the holding margin portion 1a and the held margin portion 2a. 11, the conductor layer 2 formed of the metal foil 12 is fixed to the temporary base material 1. In this case, the use of the thermosetting adhesive 11 prevents a decrease in adhesive force due to ultraviolet irradiation or heating. At this time, when the adhesive 11 is provided, a thermosetting adhesive film in which a film made of a thermosetting adhesive is formed on both surfaces of a film-like substrate can also be used.

  The temporary substrate 1 and the metal foil 12 (conductor layer 2) are preferably bonded in a vacuum or a reduced pressure atmosphere. In this case, the adhesion between the temporary base material 1 and the conductor layer 2 inside the holding margin portion 1a and the held margin portion 2a can be improved, and high adhesion strength can be obtained.

  At this time, the thickness of the metal foil 12 is not particularly limited, but may be in the range of 10 to 35 μm, for example. Moreover, as a thermosetting adhesive, appropriate things, such as an epoxy resin adhesive, can be used.

  As a specific example of this embodiment, for example, a glass substrate having a plan view size of 10 cm × 10 cm and a thickness of 1 mm is used as the temporary substrate 1, and the holding margin 1a is provided over the entire periphery of the periphery, For example, a metal foil 12 having a plan view size of 10 cm × 10 cm and a thickness of 35 μm (for example, “MPGT” manufactured by Furukawa Electric Co., Ltd.) is provided, and a holding margin 2a is provided over the entire periphery of the peripheral edge. The material 1 and the metal foil 12 are stacked in a reduced-pressure atmosphere (for example, 13.3 Pa), and a thermosetting adhesive film (for example, “Elephan” manufactured by Yodogawa Paper Co., Ltd.) is provided between the holding margin 1a and the held margin 2a. UH1W ”, adhesive layer thickness 20 μm, substrate thickness 25 μm), for example, hot pressing is performed under the conditions of 275 ° C. for 30 seconds, whereby temporary substrate 1 and metal foil 12 (conductor layer 2) are Joining You can.

  Next, in the same manner as described above, the optical wiring layer 3 can be provided on the upper surface of the conductor layer 2 as shown in FIG. 3B, and the support material 6 is provided if necessary although not shown. be able to.

  Next, when the temporary substrate 1 is peeled from the conductor layer 2, as shown in FIG. 3C, first, the temporary substrate 1, the conductor layer 2, and the optical wiring layer 3 (or further the support material 6) are formed. The part corresponding to the holding allowance part 1a and the held allowance part 2a is cut from the laminate. At this time, the holding margin 1a of the temporary base 1 and the held margin 2a of the conductor layer 2 are cut, and the holding margin 1a and the held margin in the optical wiring layer 3 (or further the support material 6) are cut. The part 3a overlapping with 2a is also cut at the same time. If it does in this way, the adhesive agent 11 which joined the conductor layer 2 and the temporary base material 1 will be removed, and the temporary base material 1 can be easily peeled from this conductor layer 2.

  After the temporary base material 1 is peeled off, the conductive wiring 10 can be formed by performing a patterning process on the conductor layer 2 in the same manner as described above to obtain an opto-electric hybrid board.

An example of the manufacturing process of the opto-electric hybrid board is shown, and (a) to (f) are sectional views. The manufacturing process of the opto-electric hybrid board following the manufacturing process is shown, and (a) to (e) are cross-sectional views. The other example of the manufacturing process of an opto-electric hybrid board is shown, (a) to (c) are sectional views. An example of the manufacturing process of the conventional opto-electric hybrid board | substrate is shown, (a) to (d) is sectional drawing.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Temporary base material 2 Conductor layer 3 Optical wiring layer 4 Cladding layer 5 Core layer 6 Support material

Claims (11)

  In a method of manufacturing an opto-electric hybrid board in which optical wiring and electric wiring are provided on the same board, a conductor layer is laminated on one surface of the temporary base material without being chemically bonded, and the temporary base of the conductor layer is formed. A method for producing an opto-electric hybrid board, comprising: forming an optical wiring layer having a core layer and a cladding layer on a surface opposite to the material, and then peeling the temporary base material from the conductor layer.   The method for manufacturing an opto-electric hybrid board according to claim 1, wherein the conductor layer is formed by laminating a plurality of conductor films.   The method for manufacturing an opto-electric hybrid board according to claim 1, wherein the conductor layer is formed by a vacuum film forming method or a plating method.   The conductor layer is formed by laminating a plurality of conductor films, and at least one of the conductor film in contact with the temporary base material and the conductor film in contact with the optical wiring layer is formed by a vacuum film formation method. The method for manufacturing an opto-electric hybrid board according to claim 2, wherein the opto-electric hybrid board is manufactured.   5. The opto-electric hybrid loading according to claim 1, wherein the surface of the conductor layer on the optical wiring layer side is roughened before the optical wiring layer is formed on the surface of the conductor layer. 6. A method for manufacturing a substrate.   6. The method for producing an opto-electric hybrid board according to claim 5, wherein the surface of the conductor layer on the optical wiring layer side is roughened in a range where the surface roughness Ry is 0.5 [mu] m or less.   7. The method for producing an opto-electric hybrid board according to claim 5, wherein the surface of the conductor layer is roughened by an etching process.   7. The method for producing an opto-electric hybrid board according to claim 5, wherein the surface of the conductor layer is roughened by a surface oxidation treatment.   9. The support material is provided on the surface of the optical wiring layer opposite to the temporary base material after the optical wiring layer is formed and before the temporary base material is peeled off. Manufacturing method of the opto-electric hybrid board.   The method for manufacturing an opto-electric hybrid board according to claim 9, wherein a surface of the clad layer of the optical wiring layer in contact with the support member is formed of an adhesive resin.   11. The opto-electric hybrid board manufacturing method according to claim 1, wherein after the temporary base material is peeled from the conductor layer, a conductor wiring is formed by patterning the conductor layer. Method.

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