JP2005051088A - Printed circuit board with heat conductive member, and method for manufacturing the same - Google Patents

Printed circuit board with heat conductive member, and method for manufacturing the same Download PDF

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JP2005051088A
JP2005051088A JP2003282335A JP2003282335A JP2005051088A JP 2005051088 A JP2005051088 A JP 2005051088A JP 2003282335 A JP2003282335 A JP 2003282335A JP 2003282335 A JP2003282335 A JP 2003282335A JP 2005051088 A JP2005051088 A JP 2005051088A
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circuit board
printed circuit
heat
conductive member
heat conductive
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JP3922642B2 (en
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Asako Kato
朝子 加藤
Shigetoshi Abe
重敏 安部
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Japan Radio Co Ltd
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Japan Radio Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member

Landscapes

  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a printed circuit board with a heat conductive member of a simple structure. <P>SOLUTION: The printed circuit board 20 with the heat conductive member is provided with heat radiation chips 30 fixed simultaneously when fixing two sheets of core material with thermosetting resin. On one surface side of the printed circuit board 20, an electronic part 27 is mounted. On the other surface side, a heat sink 24 is fitted. The heat generated by the electronic part 27 is radiated to the outside air (air) through a fill 40, the chips 30 and the surface contacting with the air of the heat sink 24. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

この発明は、構造が簡単で低コストの熱伝導部材付きプリント基板及びその製造方法に関する。   The present invention relates to a printed circuit board with a heat conductive member having a simple structure and low cost, and a method for manufacturing the same.

近年、集積回路（ＩＣ）等の電子部品の使用により、携帯電話やＰＤＡ（Personal Digital Assistants）等の電子装置の小型軽量・薄型化が進み、利便性が向上している。電子装置のより小型軽量・薄型化を図るためには、電子部品自体の小型軽量・薄型化とともに、この電子部品を搭載するプリント基板全体として小型軽量・薄型化を図る必要がある。   In recent years, the use of electronic components such as integrated circuits (ICs) has led to the reduction in size, weight, and thickness of electronic devices such as mobile phones and PDAs (Personal Digital Assistants), and convenience has improved. In order to reduce the size, weight, and thickness of electronic devices, it is necessary to reduce the size, weight, and thickness of the electronic components themselves, and to reduce the size, weight, and thickness of the entire printed circuit board on which the electronic components are mounted.

電子部品搭載プリント基板全体を小型軽量・薄型化する場合に、この電子部品搭載プリント基板全体の放熱構造に考慮を払うことが重要である。   When making the entire electronic component-mounted printed circuit board small, light, and thin, it is important to consider the heat dissipation structure of the entire electronic component-mounted printed circuit board.

図１６は、電子部品搭載プリント基板全体の放熱構造の従来技術を示している（特許文献１参照）。   FIG. 16 shows a prior art of a heat dissipation structure for the entire electronic component-mounted printed circuit board (see Patent Document 1).

図１６に示す電子部品搭載プリント基板２を構成するプリント基板４は、座ぐり部である凹部６Ａと、この凹部６Ａの底面の中央に形成された貫通孔６Ｂからなる開口６を有している。   A printed circuit board 4 constituting the electronic component mounting printed circuit board 2 shown in FIG. 16 has a recess 6A that is a spot facing portion and an opening 6 that is formed of a through hole 6B formed in the center of the bottom surface of the recess 6A. .

また、銅等の放熱部材８に半田１０を介して固着された発熱部品としての大規模集積回路（ＬＳＩ）１２が、リード１４及び半田１６を介してプリント基板４のパターンに取り付けられるとともに、放熱部材８の取付部８Ｂが半田１８を介してプリント基板４の凹部６Ａの底面に取り付けられる。   In addition, a large scale integrated circuit (LSI) 12 as a heat generating component fixed to the heat radiating member 8 such as copper via the solder 10 is attached to the pattern of the printed circuit board 4 via the lead 14 and the solder 16 and also radiates heat. The attachment portion 8B of the member 8 is attached to the bottom surface of the recess 6A of the printed circuit board 4 via the solder 18.

このように構成される電子部品搭載プリント基板２において、ＬＳＩ１２の発熱が、放熱部材８を通じて、プリント基板４の裏面側の空間に放出される。   In the electronic component mounting printed circuit board 2 configured as described above, the heat generated by the LSI 12 is released to the space on the back surface side of the printed circuit board 4 through the heat dissipation member 8.

特開平７−８６７１７号公報（図１）JP-A-7-86717 (FIG. 1)

しかしながら、上記従来技術では、放熱部材８をプリント基板４に載せるために、プリント基板４には座ぐり部を形成し、放熱部材８にはフランジ部を形成することが必要となる。このため、プリント基板４の構造及び放熱部材８の形状が複雑になり、その結果、電子部品搭載プリント基板２自体のコストが高くなるという問題がある。   However, in the above prior art, in order to place the heat radiating member 8 on the printed board 4, it is necessary to form a counterbore part on the printed board 4 and form a flange part on the heat radiating member 8. For this reason, the structure of the printed circuit board 4 and the shape of the heat dissipation member 8 become complicated, and as a result, there is a problem that the cost of the electronic component mounting printed circuit board 2 itself increases.

また、上記従来技術では、放熱しようとする電子部品毎に、径や面積の異なる座ぐり部及び放熱部材が必要になるという製造上、管理上の繁雑さがある。   Further, in the above-described conventional technology, there is a manufacturing and management complexity that a spot facing portion and a heat radiating member having different diameters and areas are required for each electronic component to be radiated.

この発明はこのような課題を考慮してなされたものであり、簡単な構造で低コストの熱伝導部材付きプリント基板及びその製造方法を提供することを目的とする。   The present invention has been made in consideration of such problems, and an object of the present invention is to provide a printed circuit board with a heat conductive member having a simple structure and a low cost, and a method for manufacturing the same.

この発明の熱伝導部材付きプリント基板は、間に挟まれた充填材により固着された第１コア材と第２コア材とを含むプリント基板と、前記プリント基板に設けられた貫通孔と、前記貫通孔に挿入され、かつ前記充填材により固着された熱伝導部材とを備え、前記プリント基板の一面側に搭載される発熱部品に前記熱伝導部材の一端部が熱的に結合され、前記発熱部品で発熱された熱が、前記熱伝導部材の他端部を介して放熱されることを特徴とする（請求項１記載の発明）。   A printed circuit board with a heat conductive member of the present invention includes a printed circuit board including a first core material and a second core material fixed by a filler sandwiched therebetween, a through hole provided in the printed circuit board, A heat conductive member inserted into the through hole and fixed by the filler, and one end of the heat conductive member is thermally coupled to a heat generating component mounted on one side of the printed circuit board. The heat generated by the component is dissipated through the other end of the heat conducting member (the invention according to claim 1).

この発明の熱伝導部材付きプリント基板は、貫通孔に挿入された熱伝導部材と第１コア材と第２コア材とが同一の充填材により固着されているので、構造が簡単である。   The printed circuit board with a heat conductive member of the present invention has a simple structure because the heat conductive member inserted into the through hole, the first core material, and the second core material are fixed by the same filler.

この場合、前記熱伝導部材を、導電部材とすることで、前記熱伝導部材をスルーホールあるいはビアホールとして兼用することができる（請求項２記載の発明）。   In this case, by using the heat conducting member as a conductive member, the heat conducting member can also be used as a through hole or a via hole (the invention according to claim 2).

熱伝導部材は円柱形状が好ましいが、角柱形状等、上下面と側面からなる任意の大きさの柱形状とすることができる（請求項３記載の発明）。   The heat conducting member is preferably a columnar shape, but can be a columnar shape having an arbitrary size composed of upper and lower surfaces and side surfaces such as a prismatic shape (the invention according to claim 3).

この発明の熱伝導部材付きプリント基板の製造方法は、硬化していない充填材を間に挟んで第１コア材と第２コア材を重ねた積層体を作成する工程と、前記積層体に貫通孔を設ける工程と、前記貫通孔に熱伝導部材を挿入する工程と、前記貫通孔に前記熱伝導部材が挿入された積層体を真空加熱プレス処理することで、前記充填材により、前記第１コア材と前記第２コア材を固着するとともに前記熱伝導部材を挿入位置に固着してプリント基板を作成する工程とを有することを特徴とする（請求項４記載の発明）。   The method of manufacturing a printed circuit board with a heat conducting member according to the present invention includes a step of creating a laminate in which a first core material and a second core material are stacked with an uncured filler interposed therebetween, and a through-hole to the laminate. A step of providing a hole; a step of inserting a heat conductive member into the through hole; and a vacuum heating press treatment of the laminate in which the heat conductive member is inserted into the through hole. And a step of fixing the core material and the second core material and fixing the heat conducting member at an insertion position to form a printed circuit board (invention according to claim 4).

この発明の製造方法は、硬化していない充填材を間に挟んだ第１コア材と第２コア材を重ねた積層体に設けた貫通孔に熱伝導部材を挿入し真空加熱プレス処理することで、充填材により、第１コア材と第２コア材を固着するとともに熱伝導部材を挿入位置に固着してプリント基板を作成するようにしているので、簡単な工程で熱伝導部材付きプリント基板を製造することができる。   In the manufacturing method of the present invention, a heat conductive member is inserted into a through-hole provided in a laminated body in which a first core material and a second core material are stacked with an uncured filler interposed therebetween, and vacuum heating press processing is performed. Since the first core material and the second core material are fixed by the filler and the heat conductive member is fixed to the insertion position to produce the printed circuit board, the printed circuit board with the heat conductive member is manufactured in a simple process. Can be manufactured.

この発明によれば、熱伝導部材のプリント基板への取付を工夫し、プリント基板に座ぐり部を形成する必要のない簡単な構造の熱伝導部材付きプリント基板を得ることができる。   According to the present invention, it is possible to obtain a printed circuit board with a heat conductive member having a simple structure that does not require a counterbore portion to be formed on the printed circuit board by devising attachment of the heat conductive member to the printed circuit board.

また、座ぐり部を形成する必要がないので、製造工程が簡単になる。   Moreover, since it is not necessary to form a spot facing portion, the manufacturing process is simplified.

さらに、熱伝導部材の標準化が容易である。   Furthermore, standardization of the heat conducting member is easy.

結果として、熱伝導部材付きプリント基板及び電子部品搭載プリント基板のコストを低減することができる。   As a result, the cost of the printed circuit board with a heat conductive member and the printed circuit board with an electronic component mounted thereon can be reduced.

以下、この発明の実施の形態について図面を参照して説明する。   Embodiments of the present invention will be described below with reference to the drawings.

図１は、この実施形態の熱伝導部材付きプリント基板２０が使用されたワイヤボンディングタイプの電子部品搭載プリント基板放熱構造体２６の模式的断面図を示している。   FIG. 1 is a schematic cross-sectional view of a printed circuit board heat dissipation structure 26 of a wire bonding type electronic component on which the printed circuit board 20 with a heat conducting member of this embodiment is used.

図２は、図１に示す電子部品搭載プリント基板放熱構造体２６の分解斜視図を示している。   FIG. 2 is an exploded perspective view of the electronic component mounting printed board heat dissipation structure 26 shown in FIG.

この電子部品搭載プリント基板放熱構造体２６は、基本的には、熱伝導部材付きプリント基板２０の表面に集積回路（ＩＣ）等の発熱部品である電子部品２７が搭載された電子部品搭載プリント基板２２の裏面にヒートシンク２４が取り付けられた構造とされている。この電子部品２７は、熱伝導部材付きプリント基板２０に形成されているパターン（ランド）３２に、金線３６を介してボンディングにより取り付けられている。   This electronic component mounting printed circuit board heat dissipation structure 26 is basically an electronic component mounting printed circuit board in which an electronic component 27 which is a heat generating component such as an integrated circuit (IC) is mounted on the surface of the printed circuit board 20 with a heat conducting member. The heat sink 24 is attached to the back surface of the 22. The electronic component 27 is attached to a pattern (land) 32 formed on the printed circuit board 20 with a heat conducting member via a gold wire 36 by bonding.

この場合、熱伝導部材付きプリント基板２０の貫通孔２８には、それぞれ、熱伝導部材（放熱部材）である円柱形状の放熱チップ３０が埋め込まれている。   In this case, columnar heat radiation chips 30 that are heat conduction members (heat radiation members) are embedded in the through holes 28 of the printed circuit board 20 with the heat conduction member, respectively.

放熱チップ３０には、金属かつ導体であって熱伝導率の大きいＣｕ製、Ａｇ製等が用いられている。熱伝導部材付きプリント基板２０の上下導体パターンを電気的に接続する必要がない場合には、導体である必要はない。導体以外の材料として、タングステン、モリブデン及びマグネシウム等を挙げることができる。   The heat dissipation chip 30 is made of Cu, Ag, or the like, which is a metal and conductor and has high thermal conductivity. When it is not necessary to electrically connect the upper and lower conductor patterns of the printed circuit board 20 with the heat conducting member, it is not necessary to be a conductor. Examples of materials other than the conductor include tungsten, molybdenum, and magnesium.

この電子部品搭載プリント基板放熱構造体２６は、電子部品２７の基板対向面と、熱伝導部材付きプリント基板２０の電子部品２７の対向面上、放熱チップ３０を含む部分との間に、樹脂フィルムあるいは樹脂ペースト等の充填材４０が挟まれた状態で電子部品２７が熱伝導部材付きプリント基板２０の一面に取り付けられ、熱伝導部材付きプリント基板２０の他面側にＡｌ製等のヒートシンク２４が図示していないエポキシ系の接着フィルム等により固着されている。   The electronic component mounting printed circuit board heat dissipation structure 26 includes a resin film between the substrate facing surface of the electronic component 27 and the portion including the heat dissipation chip 30 on the facing surface of the electronic component 27 of the printed circuit board 20 with the heat conducting member. Alternatively, the electronic component 27 is attached to one surface of the printed circuit board 20 with a heat conductive member with a filler 40 such as a resin paste sandwiched, and a heat sink 24 made of Al or the like is provided on the other surface side of the printed circuit board 20 with a heat conductive member. It is fixed by an epoxy adhesive film (not shown).

このように構成される電子部品搭載プリント基板放熱構造体２６は、電子部品２７での発熱が、主に、充填材４０、放熱チップ３０の一面、放熱チップ３０の本体部、放熱チップ３０の他面を通じてヒートシンク２４に直接伝導され、ヒートシンク２４の空気と触れている面を通じて外気（空気）に対して放熱される。   In the electronic component mounting printed circuit board heat dissipation structure 26 configured as described above, the heat generated by the electronic component 27 mainly includes the filler 40, one surface of the heat dissipation chip 30, the main body of the heat dissipation chip 30, and the heat dissipation chip 30. The heat is directly conducted to the heat sink 24 through the surface, and is radiated to the outside air (air) through the surface of the heat sink 24 in contact with the air.

次に、この実施形態に係る熱伝導部材付きプリント基板２０の製造方法について、図３の工程フロー図を参照しながら説明する。   Next, the manufacturing method of the printed circuit board 20 with a heat conductive member which concerns on this embodiment is demonstrated, referring the process flowchart of FIG.

まず、第１工程Ｓ１において、図４Ａに示すように、充填材であり硬化していない樹脂であるプリプレグ等の熱硬化性樹脂材料（充填材）５０を挟んで、片面銅箔４９Ａ、５１Ａを有する第１コア材及び第２コア材であるコア材料（ここでは、片面銅箔ガラスエポキシプリント基板）４９、５１の銅箔４９Ａ、５１Ａの面が外層となるように積み重ねる。   First, in the first step S1, as shown in FIG. 4A, the single-sided copper foils 49A and 51A are sandwiched by sandwiching a thermosetting resin material (filler) 50 such as a prepreg which is a filler and an uncured resin. The core material (here, single-sided copper foil glass epoxy printed circuit board) 49 and 51 that is the first core material and the second core material 49 and 51 are stacked so that the surfaces of the copper foils 49A and 51A are outer layers.

なお、図４Ａ、図４Ｂでは、分かりやすさを考慮して、コア材料４９、５１と熱硬化性樹脂５０をそれぞれ離して描いているが、実際には、隙間なく積層されている。この実施形態において、コア材料４９、５１の厚みはそれぞれ０．３［ｍｍ］、熱硬化性樹脂５０の厚みは０．２［ｍｍ］（０．１［ｍｍ］のものを２枚重ね）である。   In FIGS. 4A and 4B, the core materials 49 and 51 and the thermosetting resin 50 are drawn apart from each other for ease of understanding. In this embodiment, the core materials 49 and 51 each have a thickness of 0.3 [mm], and the thermosetting resin 50 has a thickness of 0.2 [mm] (two layers of 0.1 [mm] are stacked). is there.

次に、第２工程Ｓ２において、図４Ｂに示すように、これら３層のコア材料４９、５１と熱硬化性樹脂５０を積層した積層体５２の状態で、熱伝導部材としての放熱チップ３０を埋め込む部分に貫通孔２８を明ける。貫通孔２８を明ける場合、３層の積層体５２の上下にあて板を当てて、ドリルあるいはレーザ光により明けることができる。また型等を利用して明けることもできる。   Next, in the second step S2, as shown in FIG. 4B, in the state of the laminated body 52 in which the three layers of the core materials 49 and 51 and the thermosetting resin 50 are laminated, the heat dissipation chip 30 as the heat conducting member is formed. The through hole 28 is opened in the portion to be embedded. When the through hole 28 is opened, it can be opened with a drill or a laser beam by applying a plate to the top and bottom of the three-layer laminate 52. It can also be opened using a mold or the like.

ここで、貫通孔２８の径（穴径）φは、放熱チップ３０の径に対応した径φとされるが、熱硬化性樹脂５０の樹脂流れ性も考慮して明けられる。径φの最適値は、実験等により決めることができる。貫通孔２８の径φは、たとえば、０．２［ｍｍ］〜６［ｃｍ］程度に明けられる。通常、丸穴であるが、丸穴ではなく、楕円穴、角穴とすることもできる。なお、放熱チップ３０は、径が大きい場合、放熱シートあるいは放熱板等と呼ばれるが、いずれの場合でも熱伝導部材であることには変わりはない。   Here, the diameter (hole diameter) φ of the through hole 28 is set to a diameter φ corresponding to the diameter of the heat dissipation chip 30, but is also considered in consideration of the resin flowability of the thermosetting resin 50. The optimum value of the diameter φ can be determined by experiments or the like. The diameter φ of the through hole 28 is set to about 0.2 [mm] to 6 [cm], for example. Usually, it is a round hole, but it may be an elliptical hole or a square hole instead of a round hole. In addition, although the thermal radiation chip | tip 30 is called a thermal radiation sheet or a thermal radiation board, when a diameter is large, in any case, it is a heat conductive member.

熱伝導部材である放熱チップ３０の形状は、基本的に、上面と底面とこれらを接続する側面（本体部）からなる柱形状とされるが、貫通孔２８が、丸穴である場合には、円柱形状に、四角穴である場合には、四角柱形状等、貫通孔２８の形状に相似した形状とすることが好ましい。貫通孔２８と放熱チップ３０の本体部の外周との隙間を一定間隔とするためである。隙間は０［μｍ］〜１．０［ｍｍ］程度に設定されるが、この値も、個々のケース毎に最適値を実験等により決めることができる。   The shape of the heat dissipation chip 30 that is a heat conducting member is basically a columnar shape including a top surface, a bottom surface, and a side surface (main body portion) that connects them, but when the through hole 28 is a round hole, When the cylindrical shape is a square hole, a shape similar to the shape of the through hole 28, such as a quadrangular prism shape, is preferable. This is because the gap between the through hole 28 and the outer periphery of the main body portion of the heat dissipation chip 30 is set to a constant interval. The gap is set to about 0 [μm] to 1.0 [mm], and this value can also be determined by experiment or the like for each case.

次に、第３工程Ｓ３において、図４Ｃに示すように、積層体５２の各貫通孔２８に、対応した径（対応した大きさ）を有する熱伝導部材である放熱チップ３０を嵌め込み挿入し、放熱チップ３０が貫通孔２８に挿入された積層体５３を作成する。   Next, in the third step S3, as shown in FIG. 4C, the heat dissipating chip 30 which is a heat conducting member having a corresponding diameter (corresponding size) is fitted and inserted into each through hole 28 of the stacked body 52, A laminated body 53 in which the heat dissipation chip 30 is inserted into the through hole 28 is created.

次に、第４工程Ｓ４において、図５に模式的に示すように、真空加熱プレス装置６０のチャンバー６１の中の可動押圧ブロック６２上に積層体５３を配置し、ヒータ６８により加熱する。そして、アクチュエータ６４を作動させて、積層体５３の載せられた可動押圧ブロック６２を固定押圧ブロック６６に押しつけた状態で真空引きを行う。すなわち、真空加熱プレス処理工程を行う。なお、真空加熱プレス条件は、熱硬化性樹脂５０の成形条件による。たとえば、熱硬化性樹脂５０として、プリプレグ「ＴＬＰ５５１｛日立化成（株）製｝」を用いた場合に、温度は、１３０［℃］で約４５分加熱後、１８０［℃］で約１時間加熱する。同時に圧力は、加熱を開始してから約３０分の間は０．５［ＭＰａ］、その後、４［ＭＰａ］の圧力を１時間３０分程度かける。   Next, in the fourth step S <b> 4, as schematically shown in FIG. 5, the laminated body 53 is disposed on the movable pressing block 62 in the chamber 61 of the vacuum heating press device 60 and heated by the heater 68. Then, the actuator 64 is operated to evacuate the movable pressing block 62 on which the laminated body 53 is placed against the fixed pressing block 66. That is, a vacuum heating press processing step is performed. The vacuum heating press conditions depend on the molding conditions of the thermosetting resin 50. For example, when a prepreg “TLP551 {manufactured by Hitachi Chemical Co., Ltd.}” is used as the thermosetting resin 50, the temperature is heated at 130 [° C.] for about 45 minutes and then heated at 180 [° C.] for about 1 hour. To do. At the same time, the pressure is 0.5 [MPa] for about 30 minutes after the start of heating, and then a pressure of 4 [MPa] is applied for about 1 hour 30 minutes.

この第４工程Ｓ４により、図６Ａに示すように、放熱チップ３０と積層体５３貫通孔２８との隙間に熱硬化性樹脂５０が溶融し充填されて硬化する。この真空加熱プレス処理工程により、放熱チップ３０が硬化した熱硬化性樹脂５０を通じて積層体５３に固着されるとともに、コア材料４９、５１が熱硬化性樹脂５０により接着されて固着され、パターンニング前の熱伝導部材付きプリント基板７０が作成される。   By this fourth step S4, as shown in FIG. 6A, the thermosetting resin 50 is melted and filled in the gap between the heat dissipation chip 30 and the laminated body 53 through-hole 28 and cured. By this vacuum heating press treatment process, the heat dissipation chip 30 is fixed to the laminate 53 through the cured thermosetting resin 50, and the core materials 49 and 51 are bonded and fixed by the thermosetting resin 50, before patterning. A printed circuit board 70 with a heat conducting member is produced.

次いで、第５工程Ｓ５において、パターンニング（エッチングを含む。）をすることで、図６Ｂに示すように、銅箔５１Ａ、４９Ａ（図４Ａ参照）で形成されたパターン３２、３３が両面に形成された図１、図２に示した熱伝導部材付きプリント基板（熱伝導部材付き両面プリント基板）２０が作成される。この実施形態の熱伝導部材付きプリント基板２０の厚みは、約０．８［ｍｍ］である。   Next, in the fifth step S5, patterning (including etching) is performed to form patterns 32 and 33 formed on the copper foils 51A and 49A (see FIG. 4A) on both sides as shown in FIG. 6B. The printed circuit board with a heat conductive member (double-sided printed circuit board with a heat conductive member) 20 shown in FIGS. 1 and 2 is produced. The thickness of the printed circuit board 20 with a heat conductive member of this embodiment is about 0.8 [mm].

このようにして作成（製造）された熱伝導部材付きプリント基板２０は、硬化した熱硬化性樹脂５０である充填材により固着された第１コア材４９と第２コア材５１と放熱チップ３０とを備えている。そして、この熱伝導部材付きプリント基板２０の一面側に、図１に示したように電子部品２７が搭載され、他面側にヒートシンク２４が取り付けられて、電子部品搭載プリント基板放熱構造体２６が製作される。   The printed circuit board 20 with the heat conducting member thus produced (manufactured) is composed of the first core material 49, the second core material 51, and the heat dissipation chip 30 fixed by the filler that is the cured thermosetting resin 50. It has. The electronic component 27 is mounted on one surface side of the printed circuit board 20 with the heat conducting member as shown in FIG. 1, the heat sink 24 is mounted on the other surface side, and the electronic component mounted printed circuit board heat dissipation structure 26 is formed. Produced.

この場合、発熱部品である電子部品２７に放熱チップ３０の一面側が充填材４０を介して熱的に結合され、電子部品２７で発熱された熱が、充填材４０、放熱チップ３０の一面側、本体側、および他面側、さらにヒートシンク２４の空気と触れている面を通じて外気（空気）に対して放熱される。   In this case, one surface side of the heat dissipation chip 30 is thermally coupled to the electronic component 27, which is a heat generating component, via the filler 40, and the heat generated by the electronic component 27 is changed to one surface side of the filler 40, the heat dissipation chip 30, Heat is radiated to the outside air (air) through the main body side, the other surface side, and the surface of the heat sink 24 that is in contact with air.

この熱伝導部材付きプリント基板２０は、貫通孔２８に挿入された放熱チップ３０と第１コア材４９と第２コア材５１とが同一の充填材である硬化した熱硬化性樹脂５０により固着されているので、構造が簡単である。   The printed circuit board 20 with the heat conducting member is fixed by a cured thermosetting resin 50 in which the heat radiation chip 30 inserted into the through hole 28, the first core material 49, and the second core material 51 are the same filler. So the structure is simple.

なお、熱伝導部材付きプリント基板２０は、両面プリント基板であるが、片面プリント基板とする場合には、第５工程Ｓ５において、片面の銅箔４９Ａは全てエッチング等により除去することで、パターン３２だけが形成された図６Ｃに示す熱伝導部材付きプリント基板２０Ａを作成することができる。もちろん、片面側の銅箔４９Ａがもともと付いていないコア材料を使用すれば、銅箔５１Ａ部分のみのパターンニングを行えばよいことになる。また、３層以上の多層プリント基板とする場合には、前記の第１工程Ｓ１において、積層体５２に代替して、図４Ｄに示すように、熱硬化性樹脂材料（充填材）５０を挟んで、両面銅箔４９Ａ、４９Ｃと、５１Ａ、５１Ｃを有する、たとえばガラスエポキシ基板等の第１コア材４９ｍと第２コア材５１ｍの、予めパターンニングした銅箔４９Ｃと５１Ｃとを対向させて積み重ねた積層体５２ｍを用いればよい。この場合には、４層プリント基板が得られる。   The printed circuit board 20 with the heat conducting member is a double-sided printed board. However, when the printed board 20 is a single-sided printed board, in the fifth step S5, the copper foil 49A on one side is completely removed by etching or the like, thereby forming the pattern 32. A printed circuit board 20A with a heat conducting member shown in FIG. Of course, if a core material not originally provided with the copper foil 49A on one side is used, it is only necessary to pattern only the copper foil 51A portion. Further, when a multilayer printed board having three or more layers is used, in the first step S1, a thermosetting resin material (filler) 50 is sandwiched as shown in FIG. The first core material 49m and the second core material 51m, such as a glass epoxy substrate, having double-sided copper foils 49A and 49C and 51A and 51C, for example, are stacked with the previously patterned copper foils 49C and 51C facing each other. The laminated body 52m may be used. In this case, a four-layer printed board is obtained.

ここで、放熱チップ３０により熱伝導部材付きプリント基板７０の両面のパターンを接続するための、いわゆるスルーホールあるいはビアホールとして放熱チップ３０を利用する場合の熱伝導部材付きプリント基板の作成手順を説明する。   Here, a procedure for creating a printed circuit board with a heat conductive member when the heat radiation chip 30 is used as a so-called through hole or via hole for connecting the patterns on both sides of the printed circuit board 70 with a heat conductive member by the heat radiating chip 30 will be described. .

第４工程Ｓ４と第５工程Ｓ５との間の第４Ａ工程Ｓ４Ａにおいて、図７Ｂに示すように（図７Ａのパターンニング前の熱伝導部材付きプリント基板７０は、図６Ａに示したものと同一のものを再掲している。）、銅箔４９Ａ、５１Ａ、及び放熱チップ３０の上下面（端面）にめっき（銅めっき、ニッケルめっき、金めっき等のめっき層）７２（７２Ａ、７２Ｂ）を形成する。   In the 4A process S4A between the 4th process S4 and the 5th process S5, as shown in FIG. 7B (the printed circuit board 70 with the heat conducting member before patterning in FIG. 7A is the same as that shown in FIG. 6A. The copper foils 49A and 51A and the upper and lower surfaces (end surfaces) of the heat radiation chip 30 are plated (plating layers of copper plating, nickel plating, gold plating, etc.) 72 (72A, 72B). To do.

次に、第５工程Ｓ５において、図７Ｃに示すように、両面パターンニング処理を行うことで、銅箔５１Ａ、４９Ａで形成された上下のパターン１３２、１３３が上下めっき７２Ａ、７２Ｂ及び放熱チップ３０を通じて電気的に導通される。このようにして、熱伝導部材である放熱チップ３０によりスルーホールあるいはビアホールを形成した熱伝導部材付きプリント基板２０Ｂが作成される。   Next, in the fifth step S5, as shown in FIG. 7C, the upper and lower patterns 132, 133 formed by the copper foils 51A, 49A are formed by the upper and lower plating 72A, 72B and the heat dissipation chip 30 by performing a double-side patterning process. Is electrically conducted through. In this manner, the printed circuit board 20B with the heat conductive member in which the through hole or the via hole is formed by the heat dissipation chip 30 that is the heat conductive member is formed.

図８は、この発明の他の実施形態の熱伝導部材付きプリント基板１２０が使用された電子部品搭載プリント基板放熱構造体１２６の模式的断面図を示している。   FIG. 8 shows a schematic cross-sectional view of an electronic component mounted printed board heat dissipation structure 126 in which the printed board 120 with a heat conducting member of another embodiment of the present invention is used.

図９は、図８に示す電子部品搭載プリント基板放熱構造体１２６の分解斜視図を示している。   FIG. 9 shows an exploded perspective view of the electronic component mounting printed board heat dissipation structure 126 shown in FIG.

この電子部品搭載プリント基板放熱構造体１２６は、熱伝導部材付きプリント基板１２０の表面にＢＧＡ（Ball Grid Array）タイプの集積回路（ＩＣ）等の発熱部品である電子部品１２７が搭載された電子部品搭載プリント基板１２２の裏面にヒートシンク１２４が取り付けられた構造とされている。この電子部品１２７は、熱伝導部材付きプリント基板１２０に形成されているパターン（ランド）１３３に半田である接続ボール１３６を介して取り付けられている。   This electronic component mounting printed circuit board heat dissipation structure 126 is an electronic component in which an electronic component 127 which is a heat generating component such as a BGA (Ball Grid Array) type integrated circuit (IC) is mounted on the surface of the printed circuit board 120 with a heat conducting member. The heat sink 124 is attached to the back surface of the mounted printed circuit board 122. The electronic component 127 is attached to a pattern (land) 133 formed on the printed circuit board 120 with a heat conducting member via a connection ball 136 that is solder.

この場合、熱伝導部材付きプリント基板１２０の貫通孔１２８には、熱伝導部材（放熱部材）である円柱形状の放熱チップ１３０が埋め込まれている。   In this case, a cylindrical heat radiation chip 130 that is a heat conduction member (heat radiation member) is embedded in the through hole 128 of the printed circuit board 120 with the heat conduction member.

放熱チップ１３０には、金属かつ導体であって熱伝導率の大きいＣｕ製、Ａｌ製等が用いられる。上述したように、熱伝導部材付きプリント基板１２０の上下導体パターンを電気的に接続する必要がない場合には、導体である必要はない。   The heat dissipation chip 130 is made of Cu, Al, or the like, which is a metal and conductor and has a high thermal conductivity. As described above, when it is not necessary to electrically connect the upper and lower conductor patterns of the printed circuit board 120 with the heat conducting member, it is not necessary to be a conductor.

この電子部品搭載プリント基板放熱構造体１２６は、電子部品１２７の基板対向面と、熱伝導部材付きプリント基板１２０の放熱チップ１３０を含む部分の電子部品１２７に対する対向面との間にアンダーフィルである充填材１４０が充填された状態で電子部品１２７が熱伝導部材付きプリント基板１２０の一面に取り付けられ、熱伝導部材付きプリント基板１２０の他面側にＡｌ製等の金属ブロックであるヒートシンク１２４が図示していないエポキシ系の接着フィルム等により接着されている。   This electronic component mounting printed board heat dissipation structure 126 is an underfill between the board facing surface of the electronic component 127 and the face facing the electronic component 127 of the portion including the heat dissipation chip 130 of the printed board 120 with the heat conducting member. The electronic component 127 is attached to one surface of the printed circuit board 120 with the heat conducting member in a state where the filler 140 is filled, and the heat sink 124 that is a metal block made of Al or the like is illustrated on the other surface side of the printed circuit board 120 with the heat conducting member. It is bonded by an epoxy adhesive film not shown.

このように構成される電子部品搭載プリント基板放熱構造体１２６は、電子部品１２７での発熱が、充填材１４０、放熱チップ１３０の一面、放熱チップ１３０の本体部、放熱チップ１３０の他面を通じてヒートシンク１２４に直接伝導され、ヒートシンク１２４の空気と触れている面を通じて外気（空気）に対して放熱される。   In the electronic component mounting printed circuit board heat dissipation structure 126 configured as described above, the heat generated by the electronic component 127 is a heat sink through the filler 140, one surface of the heat dissipation chip 130, the main body of the heat dissipation chip 130, and the other surface of the heat dissipation chip 130. The heat is directly conducted to 124 and is radiated to the outside air (air) through the surface of the heat sink 124 in contact with the air.

なお、図９例の熱伝導部材付きプリント基板１２０では、電子部品１２７の接続ボール１３６が配置されていない部分に対応して、放熱チップ１３０を一列に３個並べた形状に配置しているが、これに限ることなく、図１０の模式的平面図に示すように、熱伝導部材付きプリント基板１５０上、電子部品２７や電子部品１２７のスペース部分に対して、自由な形状に放熱チップ１３０Ａを配置することができる。   In the printed circuit board 120 with the heat conducting member of FIG. 9 example, the three heat radiation chips 130 are arranged in a line corresponding to the portion where the connection balls 136 of the electronic component 127 are not arranged. Without being limited thereto, as shown in the schematic plan view of FIG. 10, the heat dissipation chip 130 </ b> A can be freely formed on the printed circuit board 150 with the heat conducting member on the space of the electronic component 27 and the electronic component 127. Can be arranged.

なお、図１に示した熱伝導部材付きプリント基板２０の放熱チップ３０及び図９、図１０に示した熱伝導部材付きプリント基板１２０、１５０の放熱チップ１３０、１３０Ａは、各放熱チップ３０、１３０、１３０Ａの大きさがプリント基板上に搭載される他のチップ部品と同等程度の大きさであれば、そのチップ部品の搭載機、いわゆるチップ部品マウンタを利用して、他のチップ部品と同時に自動的に取り付けることができる。   The heat radiation chip 30 of the printed circuit board 20 with a heat conducting member shown in FIG. 1 and the heat radiation chips 130 and 130A of the printed circuit boards 120 and 150 with a heat conduction member shown in FIGS. If the size of 130A is about the same size as other chip components mounted on the printed circuit board, the chip component mounting machine, so-called chip component mounter, is used to automatically Can be attached.

放熱チップ３０、１３０、１３０Ａは、管理コストや製造コストを低減する上では、同一のものを使用することが好ましいが、性能を最優先し、小型軽量・薄型化等を図る場合には、異なる形状の放熱チップ３０、１３０、１３０Ａを用いることができることはいうまでもない。   It is preferable to use the same heat dissipation chip 30, 130, 130A in order to reduce the management cost and the manufacturing cost. Needless to say, the heat dissipation chips 30, 130, and 130A having a shape can be used.

次に、図１１の完成品の断面図に示すように、熱伝導部材としての放熱チップ２０１〜２０４をビヤホールあるいはスルーホールとして兼用可能な熱伝導部材付きプリント基板（熱伝導部材付き多層プリント基板）２００の製造方法について説明する。   Next, as shown in the sectional view of the finished product in FIG. 11, a printed circuit board with a heat conductive member (multilayer printed circuit board with a heat conductive member) in which the heat radiation chips 201 to 204 as heat conductive members can also be used as via holes or through holes. A manufacturing method 200 will be described.

この場合、まず、図１２Ａを参照して説明するように、図７Ｂに示したパターンニング前の両面めっき・熱伝導部材付きプリント基板と同等の製作工程で、図１２Ａに示す放熱チップ２０１、２０２付きプリント基板２０６を作成する。すなわち、このプリント基板２０６は、一面側から他面側に、めっき２１１、銅箔２１２、コア材（ガラスエポキシ材料）２１３、真空加熱プレス工程により溶融後硬化した熱硬化性樹脂２１４、コア材（ガラスエポキシ材料）２１５、銅箔２１６及びめっき２１７の７層構造とされている。   In this case, first, as will be described with reference to FIG. 12A, the heat dissipation chips 201, 202 shown in FIG. 12A are manufactured in the same manufacturing process as the printed board with double-sided plating / heat conducting member before patterning shown in FIG. 7B. The attached printed circuit board 206 is created. That is, this printed circuit board 206 has a plating 211, a copper foil 212, a core material (glass epoxy material) 213, a thermosetting resin 214 cured after being melted by a vacuum heating press process, and a core material (from the one surface side to the other surface side. Glass epoxy material) 215, copper foil 216 and plating 217.

貫通孔１２８内にある放熱チップ２０１、２０２は、真空加熱プレス工程により溶融後硬化した熱硬化性樹脂２１４を介してコア材２１３、２１５に固着されている。   The heat radiation chips 201 and 202 in the through-hole 128 are fixed to the core materials 213 and 215 via a thermosetting resin 214 that is melted and cured by a vacuum heating press process.

次に、図１２Ｂに示すように、パターンニングにより、一面（図中、下面）側にパターン２１７Ａ、２１７Ｂを形成したプリント基板２０８を作成する。そして、図４Ｃに示した積層体５３と同様に作成されるが、片面に銅箔層のない積層体２２０を準備する。この積層体２２０は、真空加熱プレス処理工程前の銅箔２２２、コア材（ガラスエポキシ材料）２２４、硬化前の熱硬化性樹脂２２６、コア材（ガラスエポキシ材料）２２８、及び貫通孔１２８Ａに放熱チップ２０３、２０４が嵌め込み挿入された構成を有する。   Next, as shown in FIG. 12B, a printed circuit board 208 in which patterns 217A and 217B are formed on one surface (the lower surface in the drawing) is created by patterning. Then, a laminate 220 is prepared in the same manner as the laminate 53 shown in FIG. 4C, but without a copper foil layer on one side. This laminated body 220 radiates heat to the copper foil 222, the core material (glass epoxy material) 224, the thermosetting resin 226 before curing, the core material (glass epoxy material) 228, and the through hole 128A before the vacuum heating press processing step. Chips 203 and 204 are inserted and inserted.

次に、図１３に示すように、プリント基板２０８と積層体２２０と固着するためのエポキシ系の接着フィルム２３０を間に挟んで位置決めする。なお、エポキシ系の接着フィルム２３０は、プリント基板２０８と積層体２２０の対向面を、放熱チップ２０１〜２０４の電気的接続部を除いて絶縁するためのものであり、放熱チップ２０１〜２０４の電気的接続部に対応する部分に孔２３２、２３３を明けてある。   Next, as shown in FIG. 13, an epoxy adhesive film 230 for fixing the printed circuit board 208 and the laminated body 220 is sandwiched and positioned. The epoxy adhesive film 230 is for insulating the opposing surface of the printed circuit board 208 and the laminated body 220 except for the electrical connection portions of the heat dissipation chips 201 to 204. Holes 232 and 233 are formed in portions corresponding to the general connection portions.

次いで、上述した真空加熱プレス処理を施すことで、図１４に示すように、プリント基板２０８と積層体２２０が接着フィルム２３０により固着され、かつ放熱チップ２０３、２０４が、溶融して貫通孔に充填された熱硬化性樹脂２２６により固着される。このようにして、中間物としての積層体２３６が作成される。   Next, by performing the above-described vacuum heating press treatment, as shown in FIG. 14, the printed circuit board 208 and the laminate 220 are fixed by the adhesive film 230, and the heat radiation chips 203 and 204 are melted and filled into the through holes. The thermosetting resin 226 is fixed. In this way, a laminate 236 as an intermediate is created.

次に、この積層体２３６の両面にめっき２３８、２４０をつけ、図１５に示す中間物としてのパターンニング前の熱伝導部材付き多層プリント基板２４２を作成する。   Next, plating 238, 240 is applied to both surfaces of the laminate 236, and a multilayer printed board 242 with a heat conductive member before patterning as an intermediate shown in FIG. 15 is produced.

次いで、パターンニングをすることでパターン２４４、２４６、２４８、２５０の形成された、図１１に示した熱伝導部材付きプリント基板２００が作成される。   Next, by patterning, the printed circuit board 200 with the heat conductive member shown in FIG. 11 in which the patterns 244, 246, 248, 250 are formed is produced.

このように作成される図１１例の熱伝導部材付き多層プリント基板２００は、パターン２４４、めっき２１１、放熱チップ２０１、パターン２１７Ｂ、放熱チップ２０３及びパターン２４８から構成されるクランク型の熱伝導部材構造兼用ビヤホール的な電気的接続構造を有する。同時に、熱伝導部材付き多層プリント基板２００はパターン２４６、めっき２１１、放熱チップ２０２、パターン２１７Ａ、放熱チップ２０４及びパターン２５０から構成されるクランク型の熱伝導部材構造兼用スルーホール的な電気的接続構造を有する。   The multilayer printed circuit board 200 with the heat conducting member in the example of FIG. 11 created in this way has a crank type heat conducting member structure composed of the pattern 244, the plating 211, the heat radiating chip 201, the pattern 217B, the heat radiating chip 203, and the pattern 248. It has a dual-purpose electrical connection structure. At the same time, the multilayer printed circuit board 200 with a heat conductive member is a crank-type heat conductive member structure and a through-hole electrical connection structure composed of a pattern 246, a plating 211, a heat radiation chip 202, a pattern 217A, a heat radiation chip 204, and a pattern 250. Have

上記のように構成される熱伝導部材付きプリント基板２０（図６Ｂ）、２０Ａ（図６Ｃ）、２０Ｂ（図７Ｃ）、１２０（図８）及び熱伝導部材付き多層プリント基板２００（図１１）は、たとえば無線機に使用されるＤＳＰ（Digital Signal Processor）、ＬＰＡ（Low-noise Power Amplifier）等の発熱の大きい電子部品に適用した場合には、きわめて小型・軽量かつ薄型で簡単な構造の低コストの電子部品搭載プリント基板放熱構造体を形成することができる。   The printed circuit board 20 (FIG. 6B), 20A (FIG. 6C), 20B (FIG. 7C), 120 (FIG. 8) and the multilayer printed circuit board 200 (FIG. 11) with a heat conductive member configured as described above are as follows. For example, when applied to electronic parts with large heat generation such as DSP (Digital Signal Processor) and LPA (Low-noise Power Amplifier) used in radio equipment, it is extremely small, lightweight, thin, and has a simple structure and low cost. The electronic component mounting printed circuit board heat dissipation structure can be formed.

この発明の一実施形態の熱伝導部材付きプリント基板が使用されたワイヤーボンディングタイプの電子部品搭載プリント基板放熱構造体の断面図である。1 is a cross-sectional view of a printed circuit board heat dissipation structure with a wire bonding type electronic component on which a printed circuit board with a heat conducting member according to an embodiment of the present invention is used. 図１例の電子部品搭載プリント基板放熱構造体の分解斜視図である。It is a disassembled perspective view of the electronic component mounting printed circuit board thermal radiation structure of the example of FIG. 熱伝導部材付きプリント基板の製造工程を示すフロー図である。It is a flowchart which shows the manufacturing process of the printed circuit board with a heat conductive member. 図４Ａは、コア材により熱硬化性樹脂を挟んでいる状態を示す説明図である。 図４Ｂは、積層体に貫通孔を形成する状態を示す説明図である。 図４Ｃは、貫通孔に放熱チップを挿入する状態を示す説明図である。 図４Ｄは、他のコア材により熱硬化性樹脂を挟んでいる状態を示す説明図である。FIG. 4A is an explanatory view showing a state in which a thermosetting resin is sandwiched between core materials. FIG. 4B is an explanatory diagram illustrating a state in which a through hole is formed in the stacked body. FIG. 4C is an explanatory diagram illustrating a state in which the heat dissipation chip is inserted into the through hole. FIG. 4D is an explanatory view showing a state in which a thermosetting resin is sandwiched between other core materials. 真空加熱プレス処理の説明図である。It is explanatory drawing of a vacuum heating press process. 図６Ａは、真空加熱プレス処理後の積層体の断面図である。 図６Ｂは、パターンニング処理後の熱伝導部材付き両面プリント基板の断面図である。 図６Ｃは、パターンニング処理後の熱伝導部材付き片面プリント基板の断面図である。FIG. 6A is a cross-sectional view of the laminate after the vacuum heat press treatment. FIG. 6B is a cross-sectional view of the double-sided printed board with a heat conducting member after the patterning process. FIG. 6C is a cross-sectional view of the single-sided printed board with a heat conductive member after the patterning process. 図７Ａは、図６Ａに示した真空加熱プレス処理後の積層体を再掲した説明図である。 図７Ｂは、めっき処理を施した積層体の断面図である。 図７Ｃは、熱伝導部材をスルーホール的に使用したパターンニング処理後の熱伝導部材付き両面プリント基板の断面図である。FIG. 7A is an explanatory diagram showing the laminated body after the vacuum heating press process shown in FIG. 6A again. FIG. 7B is a cross-sectional view of the laminated body that has been subjected to plating treatment. FIG. 7C is a cross-sectional view of a double-sided printed board with a heat conductive member after patterning processing using the heat conductive member in a through-hole manner. この発明の一実施形態の熱伝導部材付きプリント基板が使用されたＢＧＡタイプの電子部品搭載プリント基板放熱構造体の断面図である。It is sectional drawing of the BGA type electronic component mounting printed circuit board thermal radiation structure in which the printed circuit board with a heat conductive member of one Embodiment of this invention was used. 図８例の電子部品搭載プリント基板放熱構造体の分解斜視図である。It is a disassembled perspective view of the electronic component mounting printed circuit board thermal radiation structure of the example of FIG. 放熱チップにより構成される熱伝導部材の形状の自由度の説明図である。It is explanatory drawing of the freedom degree of the shape of the heat conductive member comprised by a thermal radiation chip. クランクタイプの熱伝導部材付き多層プリント基板の断面図である。It is sectional drawing of a multilayer printed circuit board with a crank type heat conductive member. 図１２Ａは、真空加熱プレス処理後の片側の積層体の断面図である。 図１２Ｂは、真空加熱プレス処理後の片側の積層体に、処理前の積層体を対向配置した状態の説明図である。FIG. 12A is a cross-sectional view of the laminate on one side after the vacuum heat press treatment. FIG. 12B is an explanatory diagram of a state in which the laminate before processing is disposed opposite to the laminate on one side after the vacuum heating press treatment. 二つの積層体の間に貫通孔付き接着フィルムを配置した状態の説明図である。It is explanatory drawing of the state which has arrange | positioned the adhesive film with a through-hole between two laminated bodies. 図１３に示す二つの積層体の真空加熱プレス処理後の積層体の断面図である。It is sectional drawing of the laminated body after the vacuum heating press process of two laminated bodies shown in FIG. 図１４例の積層体に両面めっき処理を施した積層体の断面図である。It is sectional drawing of the laminated body which performed the double-sided plating process to the laminated body of the example of FIG. 従来技術の説明図である。It is explanatory drawing of a prior art.

符号の説明Explanation of symbols

２０、２０Ａ、２０Ｂ、１２０、１５０、２００…熱伝導部材付きプリント基板
２４、１２４…ヒートシンク
２６、１２６…電子部品搭載プリント基板放熱構造体
２７、１２７…電子部品（発熱部品） ２８、１２８、１２８Ａ…貫通孔
３０、１３０、１３０Ａ、２０１、２０２〜２０４…放熱チップ（熱伝導部材、放熱部材）
４９、５１…コア材
５０…熱硬化性樹脂（充填材） ５２、５３…積層体
６０…真空加熱プレス装置

20, 20A, 20B, 120, 150, 200 ... Printed circuit board with heat conducting member 24, 124 ... Heat sink 26, 126 ... Printed circuit board heat dissipation structure with electronic component 27, 127 ... Electronic component (heat generating component) 28, 128, 128A ... Through hole 30, 130, 130A, 201, 202 to 204 ... Heat dissipation chip (heat conduction member, heat dissipation member)
49, 51 ... Core material 50 ... Thermosetting resin (filler) 52, 53 ... Laminate 60 ... Vacuum heating press device

Claims (5)

間に挟まれた充填材により固着された第１コア材と第２コア材とを含むプリント基板と、
前記プリント基板に設けられた貫通孔と、
前記貫通孔に挿入され、かつ前記充填材により固着された熱伝導部材とを備え、
前記プリント基板の一面側に搭載される発熱部品に前記熱伝導部材の一端部が熱的に結合され、前記発熱部品で発熱された熱が、前記熱伝導部材の他端部を介して放熱される
ことを特徴とする熱伝導部材付きプリント基板。 A printed circuit board including a first core material and a second core material fixed by a filler sandwiched therebetween;
A through hole provided in the printed circuit board;
A heat conduction member inserted into the through hole and fixed by the filler,
One end of the heat conducting member is thermally coupled to a heat generating component mounted on one side of the printed circuit board, and heat generated by the heat generating component is dissipated through the other end of the heat conducting member. A printed circuit board with a heat conducting member. 請求項１記載の熱伝導部材付きプリント基板において、
前記熱伝導部材が、導電部材である
ことを特徴とする熱伝導部材付きプリント基板。 In the printed circuit board with a heat conductive member according to claim 1,
The heat conductive member is a conductive member. A printed circuit board with a heat conductive member. 請求項１または２記載の熱伝導部材付きプリント基板において、
前記熱伝導部材は、上下面と側面からなる柱形状である
ことを特徴とする熱伝導部材付きプリント基板。 In the printed circuit board with a heat conductive member according to claim 1 or 2,
The heat conductive member has a columnar shape composed of upper and lower surfaces and side surfaces. A printed circuit board with a heat conductive member. 硬化していない充填材を間に挟んで第１コア材と第２コア材を重ねた積層体を作成する工程と、
前記積層体に貫通孔を設ける工程と、
前記貫通孔に熱伝導部材を挿入する工程と、
前記貫通孔に前記熱伝導部材が挿入された積層体を真空加熱プレス処理することで、前記充填材により、前記第１コア材と前記第２コア材を固着するとともに前記熱伝導部材を挿入位置に固着してプリント基板を作成する工程と
を有することを特徴とする熱伝導部材付きプリント基板の製造方法。 Creating a laminate in which a first core material and a second core material are stacked with an uncured filler interposed therebetween;
Providing a through hole in the laminate;
Inserting a heat conductive member into the through hole;
The laminated body in which the heat conducting member is inserted into the through hole is subjected to a vacuum heating press process, whereby the first core material and the second core material are fixed by the filler and the heat conducting member is inserted into the through hole. A method for producing a printed circuit board with a heat conducting member, comprising: a step of forming a printed circuit board by adhering to the substrate. 請求項４記載の熱伝導部材付きプリント基板の製造方法において、
前記熱伝導部材が、導電部材である
ことを特徴とする熱伝導部材付きプリント基板の製造方法。

In the manufacturing method of the printed circuit board with a heat conductive member of Claim 4,
The method for manufacturing a printed circuit board with a heat conductive member, wherein the heat conductive member is a conductive member.

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