JP2004241729A - Light-emitting source, lighting system, display unit and method for manufacturing light-emitting source - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light-emitting source of a simple structure which prevents resin from flowing out at the time of forming a resin sealing body. <P>SOLUTION: The light-emitting source 1 comprises a circuit board 10 in which surface connecting patterns 43 are formed, LED chips L64, L65, and L66 which are connected to the respective connecting patterns 43, the resin sealing bodies R64, R65, and R66 for sealing the respective LED chips L64, L65, and L66, a reflector 60 and a lens board 70. A resin film 50 is formed on the surface of the circuit board 10, enclosing portions where the resin sealing bodies R64, R65, and R66 are formed. That is, the resin sealing bodies R64, R65, and R66 are formed at portions where the resin films 50 are not formed. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a light-emitting light source including a light-emitting element and a resin enclosure for enclosing the light-emitting element, a lighting device using the light-emitting light source, a display device using the light-emitting light source, and a method of manufacturing the light-emitting light source.
[0002]
[Prior art]
It has been studied to mount a large number of light-emitting diodes on a substrate and emit them to use as a planar light-emitting light source. As such, for example, a bare chip of a light emitting diode emitting blue light (hereinafter simply referred to as “LED bare chip”) is used, and blue light emitted from this LED bare chip is converted into white light by a phosphor. There is something.
[0003]
The LED bare chip is encapsulated by a resin encapsulant made of resin, and the phosphor is, for example, mixed in the resin constituting the resin encapsulant or applied to the surface of the resin encapsulant. . For molding the resin encapsulant enclosing the LED bare chip, for example, a mold having a hole in a portion corresponding to the LED bare chip on the substrate is placed on the substrate so that the LED bare chip enters the hole, and the hole is formed. It is performed by injecting a resin into the inside and molding.
[0004]
[Patent Document 1]
JP 2002-184209 A
[0005]
[Problems to be solved by the invention]
However, in the conventional light emitting light source, since the wiring pattern is formed on the surface of the substrate, a step is generated between the surface of the substrate where the wiring pattern is not formed and the surface of the wiring pattern. The step causes a gap between the surface of the substrate where the wiring pattern is not formed and the lower surface of the die when the substrate is covered with the mold. For this reason, when the liquid resin before curing is injected into the hole in the mold, the resin flows out from the gap, and the amount of the resin remaining in the hole varies. Causes unevenness in the shape and size.
[0006]
If the shape and size of the resin encapsulant are not uniform as described above, the light emitted from the LED bare chip passes through the resin encapsulant, and the thickness of the resin encapsulant varies depending on the location of the resin encapsulant. There arises a problem that a desired light amount and light color cannot be obtained as a light source.
Although it is possible to match the shape of the lower surface of the mold to the irregularities on the surface of the substrate, there is a problem that the processing cost of the mold is high, and it is difficult to position the mold and the substrate. .
[0007]
The present invention has been made in view of the above-described problems, and has a light-emitting light source capable of preventing resin from flowing out at the time of molding a resin enclosure with a simple structure, and a lighting device or a display device using the light-emitting light source. It is another object of the present invention to provide a method for manufacturing the light emitting light source.
[0008]
[Means for Solving the Problems]
In order to achieve the above object, a light emitting light source according to the present invention includes a substrate having a wiring pattern formed on a surface thereof, a light emitting element connected to the wiring pattern, and a resin encapsulant enclosing the light emitting element. A light emitting light source, wherein a dam is formed around a portion of the surface of the substrate where the resin encapsulant is to be formed, to prevent resin from flowing out when the resin encapsulant is molded. According to this configuration, it is possible to prevent the resin from flowing out during molding of the resin enclosure.
[0009]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, an LED light source using an LED bare chip as a light emitting element will be described as a light source according to the present invention with reference to the drawings.
1. Structure of the light source
FIG. 1 is a perspective view of an LED light source according to the present embodiment, and FIG. 2 is an exploded perspective view of the LED light source. FIG. 3 is an enlarged view of a vertical cross section taken along line XX of FIG.
[0010]
The LED light source 1 includes a substrate 10 on which a plurality of LED bare chips are mounted, a reflecting plate 60 attached to the surface of the substrate 10 and reflecting light emitted from the LED bare chips in a predetermined direction, and reflected light. And a lens plate 70 for condensing light in a desired direction. The LED light source 1 is a multipoint light source in which LED bare chips are regularly arranged in a direction orthogonal to each other, and is used as a planar light source by emitting these LED bare chips.
[0011]
As shown in FIG. 3, the LED bare chip is sealed with a resin sealing body. Therefore, what is shown in FIG. 2 and mounted on the substrate 10 is not an LED bare chip but a resin encapsulant enclosing it. As shown in FIG. 2, 64 resin-encapsulated bodies, that is, LED bare chips are neatly mounted in a matrix of 8 rows and 8 columns. The resin enclosure is denoted by Rnm (n indicates the number of rows and m indicates the number of columns, each of which is an integer of 1 to 8) (see FIG. 4).
[0012]
As the reflection plate 60, for example, a metal plate such as aluminum is used, and 64 holes 60 </ b> H are opened corresponding to each LED bare chip mounted on the substrate 10. As shown in FIG. 3, the hole 60 </ b> H is formed in a tapered shape (a so-called upwardly-spreading shape) expanding toward the opposite side (upper side) of the substrate 10.
The lens plate 70 is made of, for example, a translucent epoxy resin. As shown in FIGS. 1 and 3, the hole 60 </ b> H of the reflection plate 60, that is, the portion corresponding to the mounting position of the LED bare chip is hemispherical. The convex lens 70L protrudes from the lens. The resin forming the lens plate 70 is filled in the hole 60H of the reflection plate 60, and is integrated with the convex lens 70L.
[0013]
As shown in FIG. 3, the substrate 10 is a so-called metal base substrate including multilayer (two in the embodiment) insulating layers 30 and 40 and a metal plate 20. Here, the metal plate 20 has a function of reinforcing the insulating layers 30 and 40 and releasing heat generated when the LED bare chip emits light.
FIG. 4 is a perspective view of the board in the present embodiment, and FIG. 5 is a plan view of the board showing a state before the LED bare chip is sealed. FIG. 6 is a plan view of the front insulating layer, and FIG. 7 is a plan view of the rear insulating layer.
[0014]
As shown in FIGS. 6 and 7, wiring patterns 31 and 41 for causing the LED bare chip to emit light are formed on the upper surface (the surface on which the LED bare chip is mounted) of each of the insulating layers 30 and 40.
On the surface of the substrate 10, a portion to be formed for forming each resin encapsulant (the surface on which the LED bare chip is mounted is included in the surface for forming the resin encapsulant) and connection terminals 42A, 42B, 42C, 42D are formed. The resin film 50 is formed except for the region including the portion where the resin film is formed. The portion where the resin enclosure is to be formed is a part of the surface of the substrate 10.
[0015]
The region where the resin film 50 is formed is substantially the same as the region where the reflection plate 60 contacts the substrate 10 as can be seen from FIG. The LED bare chips are denoted by Lnm (n indicates the number of rows and m indicates the number of columns, each of which is an integer of 1 to 8) (see FIG. 5).
As shown in FIG. 6, the wiring pattern 41 of the insulating layer 40 on the front side includes a connection pattern 43 to which the LED bare chip Lnm is actually connected and a connection terminal 42 to be connected to an external power supply to receive power. Become.
[0016]
Further, as shown in FIG. 7, the wiring pattern 31 of the insulating layer 30 on the back side includes a connection pattern 33 for connecting the connection terminal 42 and the connection pattern 43 of the insulating layer 40 on the front side or connecting the connection patterns 43 to each other. .
As shown in FIGS. 6 and 7, the connection patterns 33 and 43 formed on the front and back insulating layers 30 and 40 are supplied with power from the connection terminals 42A, 42B, 42C and 42D of the front insulating layer 40, The LED bare chips Lnm mounted in a matrix of columns are connected in series, for example, the LED bare chips of odd columns and the LED bare chips of even columns in each row are connected in series, and the odd columns connected in series in each row. The LED bare chips in the first row and the LED bare chips in the even rows are connected in series.
[0017]
That is, the LED bare chips Lnm are connected in series for each row. For example, in the case of the first row, the LED bare chips Lnm are connected in the order of L11, L13, L15, L17, L12, L14, L16, and L18.
In addition, the connection patterns 33 and 43 further connect the LED bare chips connected in series for each row between the first row to the fourth row in series in the order of row numbers, and the fifth to eighth rows. The eyes are connected in series in the same order as the row numbers. That is, the LED bare chips in the first row and the first column to the fourth row and the eighth column (hereinafter, these LED bare chips are referred to as “first group”) are connected in series, and the fifth row and the first column to the eighth row and the eighth column (Hereinafter, these LED bare chips are referred to as a “second group”) in series.
[0018]
In the first group, as shown in FIGS. 6 and 7, the connection terminal 42A is connected to the connection pattern 43A of the front insulation layer 40 via the connection pattern 33A of the back insulation layer 30, and the connection terminal 42B is connected to the back insulation layer 30. The connection pattern 43B of the layer 30 is connected to the connection pattern 43B of the insulating layer 40 on the front side via the connection pattern 33B of the layer 30, and the connection terminal 42A side becomes the high potential side.
[0019]
On the other hand, in the second group, the connection terminal 42C is connected to the connection pattern 43C of the front insulation layer 40 via the connection pattern 33C of the back insulation layer 30, and the connection terminal 42D is connected to the connection pattern 33D of the back insulation layer 30. To the connection pattern 43D of the insulating layer 40 on the front side, and the connection terminal 42D side becomes the high potential side.
The wiring patterns 30 and 41 formed on the front and back insulating layers 30 and 40 are connected via via holes indicated by ○ in FIGS. 6 and 7. Further, in the present embodiment, the substrate 10 has a multilayer structure using two insulating layers 30 and 40 in order to mount LED bare chips with higher density, but it is not necessary to have a multilayer structure. For example, a single-layer structure using one insulating layer may be used.
[0020]
FIG. 8 is an enlarged view of a portion A in FIG.
On the surface of the substrate 10, that is, on the surface of the insulating layer 40 on the front side, when connecting the LED bare chip Lnm to the connection pattern 43 as well as the connection pattern 43 for connecting the LED bare chip Lnm, as shown in FIG. , A recognition mark 44 serving as a reference for the mounting position is formed. For this reason, the resin film 50 is formed not only in a portion where the resin encapsulant Rnm is to be formed but also in a portion excluding the portion where the recognition mark 44 is formed so as to be exposed. The recognition marks 44 are formed as a pair for each LED bare chip Lnm.
[0021]
The resin film 50 uses, for example, a commonly used white epoxy resin, and is formed to have a thickness that is approximately three times the thickness (approximately 10 μm) of the connection pattern 43. Here, the reason why the resin film 50 is made white is to efficiently extract light emitted from the LED bare chip Lnm.
The LED bare chip Lnm has, for example, a substantially rectangular parallelepiped shape, and is connected to the connection pattern 43 where the resin film 50 is not formed on the substrate 10, that is, exposed on the surface. As shown in FIG. 3, the LED bare chip Lnm uses a so-called single-sided electrode type having both a P electrode and an N electrode (not shown) on the lower surface. Flip chip mounted.
[0022]
As shown in FIG. 4, the LED bare chip Lnm mounted on the substrate 10 is sealed with a cylindrical resin sealing body Rnm. The resin encapsulant Rnm protects the LED bare chip Lnm, and a phosphor is mixed in the resin constituting the resin encapsulation Rnm. Here, the reason why the shape of the resin encapsulant Rnm is cylindrical is that a portion that emits light emitted from the LED bare chip Lnm to the outside from the resin encapsulation Rnm can be limited, and can be closer to a point light source. Because.
[0023]
Although an epoxy resin is used as the resin for the resin enclosure Rnm, another resin may be used, for example, a resin such as polyimide can be used.
In the present embodiment, an InGaN-based LED that emits blue light is used for the LED bare chip, and a silica-based broadband light-emitting phosphor is used for the phosphor. Thereby, the blue light emitted from the LED bare chip Lnm is converted into white light by the phosphor and emitted from the resin enclosure Rnm.
[0024]
2. Manufacturing method of LED light source
Next, a method for manufacturing the LED light source 1 having the above configuration will be described.
FIG. 9 is a diagram illustrating a method for manufacturing an LED light source.
(1) Formation of resin film
First, the wiring pattern is formed (in FIG. 9, the connection pattern 43 of the front-side insulating layer 40 is shown). The metal-based substrate 10 in which the insulating layers 30 and 40 and the metal plate 20 are laminated is prepared. prepare. The thickness of the front and back insulating layers 30 and 40 is 0.1 mm, and the thickness of the metal plate 20 is 1 mm. The distance in the row direction between the pair of recognition marks is 0.9 mm, and the size of one recognition mark is 0.3 mm in diameter.
[0025]
The resin film 50 is formed on the surface of the prepared substrate 10 except for a region where the connection terminal is formed, a portion where the resin encapsulant Rnm is to be formed, and a portion where the recognition mark for mounting the LED bare chip Lnm is formed. To form
The formation of the wiring patterns 31 and 41 is performed, for example, by etching a copper foil attached to the surfaces of the insulating layers 30 and 40 into a desired pattern. The resin film 50 is formed by applying an epoxy resin using, for example, a screen printing method. The curing condition of the applied resin film is about 150 ° C. for about 30 minutes.
[0026]
The thickness of the connection pattern is approximately 10 μm, while the thickness of the resin film 50 is approximately 30 μm. The dimensions of the LED bare chip mounted on the substrate 10 are 300 μm square and 100 μm in height. The size and shape of the portion of the resin film 50 except for the portion where the resin encapsulant is to be formed is a circle having a diameter of 0.7 mm.
At this time, since the resin film 50 applied on the substrate 10 is approximately three times the thickness of the connection pattern 43, the connection pattern 43 formed on the front-side insulating layer 40 is covered with the resin film 50. At the same time, the surface of the resin film 50 can be made substantially flat.
[0027]
Further, since the resin of the resin film 50 is applied by a screen printing method, the resin film 50 can be easily formed. Moreover, by forming the resin film 50, the connection pattern 43 covered by the resin film 50 can be protected.
Next, a portion where the resin film 50 is not formed, that is, the connection pattern 43 exposed on the surface of the substrate 10 is subjected to nickel plating and gold plating in this order. The plating process is performed on the exposed portion of the connection pattern 43 in order to prevent the copper foil used for the connection pattern 43 from being oxidized and to improve the bonding property with the electrode of the LED bare chip.
[0028]
On the surface of the substrate 10, a resin film 50 is formed except for a portion where a resin encapsulant is to be formed, and only in a portion where the connection pattern 43 is exposed on the surface of the substrate 10 without being covered with the resin film 50. Since the nickel and gold plating treatment is performed, the area to be subjected to the gold plating treatment is particularly narrowed, and the cost of plating and the like can be suppressed as compared with the case where a resin film is not formed as in a conventional substrate.
[0029]
(2) Mounting of LED bare chip and molding of resin enclosure
The LED bare chip L is mounted on the substrate 10 on which the resin film 50 is formed. Specifically, the LED bare chip L is flip-chip mounted at the mounting position of the LED bare chip L calculated based on the recognition mark.
Next, a molding die 55 for the resin enclosure R for enclosing the LED bare chip L mounted on the substrate 10 is brought into contact with the surface of the substrate 10 (see FIG. 9B). The molding die 55 is provided with holes 55H at positions corresponding to the LED bare chips L, respectively. When the molding die 55 is put on the substrate 10, each of the LED bare chips L is inserted into each of the holes 55H. ing.
[0030]
Then, a resin containing a phosphor is supplied to the hole 55H by a printing method, and then the resin supplied into the hole 55 is cured. In this embodiment, since epoxy resin is used as the resin for the resin enclosure, the curing conditions are about 150 ° C. and about 30 minutes.
At this time, since the surface of the resin film 50 is substantially flat, when the molding die 55 is brought into contact with the substrate 10, a gap is hardly generated between the lower surface of the molding die 55 and the surface of the resin film 50. . For this reason, the flow of the softened resin from between the mold and the substrate, which has occurred in the conventional method, is reduced, and the resin enclosure R having a substantially constant shape and size can be obtained. . In addition, the shape of the resin enclosure is a column shape, and the size is about 0.6 mm in diameter and 0.15 mm in height.
[0031]
(3) Attachment of reflector and formation of lens plate
The reflection plate 60 is attached to the substrate 10 on which the resin encapsulation R enclosing the LED bare chip L is formed, and the lens plate 70 is formed on the front side of the reflection plate 60. As shown in FIG. 2, the reflecting plate 60 is provided with an upwardly extending hole 60H corresponding to each LED bare chip L. The diameter of the hole 60H is 0.8 mm on the substrate 10 side and 2.44 mm on the lens plate 70 side.
[0032]
The attachment of the reflection plate 60 is performed using an adhesive. Specifically, an adhesive is applied to the back surface of the reflection plate 60, and is adhered to the substrate 10 such that each LED bare chip L enters each hole 60H of the reflection plate 60.
At this time, the surface of the resin film 50 to which the reflection plate 60 is fixed is flat as described above. Therefore, the reflecting plate 60 can be fixed to the substrate 10 in a state where the reflecting plate 60 and the substrate 10 are substantially parallel, and the mounting accuracy of the reflecting plate 60 can be improved.
[0033]
Further, a resin film 50 is formed on the surface of the substrate 10 except for portions to be formed of the resin encapsulant R, portions where recognition marks are formed, and regions where connection terminals are formed. I have. For this reason, for example, even if a conductive material, for example, a metal is used for the reflection plate 60, the connection pattern 43 does not come into contact with the connection pattern 43, and short-circuiting of the connection pattern 43 by the reflection plate 60 can be prevented. Further, by using an insulating resin for the adhesive used for fixing the reflection plate 60, an insulating layer is further formed between the reflection plate 60 and the connection pattern 43, and short-circuit of the connection pattern 43 can be reliably prevented. it can.
[0034]
On the other hand, the connection pattern 43 where the LED bare chip L is mounted is gold-plated. Normally, it is difficult to obtain a strong adhesive force between gold and resin. However, in the above-described configuration, the reflection plate 60 is fixed to the resin film 50 other than the surface on which the gold plating treatment is performed. 10 can be firmly fixed.
Next, as shown in FIG. 9D, a molding die 75 for forming the lens plate 70 is put on the surface of the reflection plate 60. The molding die 75 includes a cavity 75C that is concave in a hemispherical shape so as to form a convex lens 70L at a portion corresponding to the hole 60H of the reflection plate 60. Then, a resin for forming the lens plate 70, for example, an epoxy resin is injected into the cavity 75 </ b> C of the molding die 75 and cured. The curing conditions of this resin are, for example, 150 ° C. and 30 minutes.
[0035]
Then, when the molding die 75 is removed after the resin for the lens plate 70 is cured, the LED light source 1 shown in FIG. 1 is obtained.
As described above, the present invention has been described based on the embodiments. However, it is needless to say that the contents of the present invention are not limited to the specific examples shown in each of the above embodiments. Can be implemented.
[0036]
(1) Molding of resin enclosure
(A) Shape
In the above embodiment, the resin enclosure is formed in a cylindrical shape, but the shape of the resin enclosure in the present invention is not limited to this shape. For example, the shape may be a polygonal prism such as a quadrangular prism or a hemispherical shape. In order to form a resin encapsulant having such a shape, the hole of the mold for a resin encapsulant described in the embodiment may be formed in a desired shape. If the shape of the resin encapsulant changes, it is preferable that the shape of the portion where the resin encapsulant is to be formed also conforms to the shape of the resin encapsulant.
[0037]
(B) Molding method
In the above embodiment, the resin encapsulant is formed by a screen printing method, that is, a mold for molding the resin encapsulant is used. However, the resin encapsulant may be formed without using the mold. As a method of forming the resin encapsulant without using such a mold, for example, utilizing the surface tension of the resin for the resin encapsulant, the resin is dropped from the LED bare chip using a dispenser to form the LED bare chip. There is a method of wrapping and curing as it is (a so-called dispenser method).
[0038]
Here, when a resin encapsulant is formed by dropping the resin onto the substrate described in the section of the related art, the dropped resin flows and the desired state cannot be maintained while enclosing the LED bare chip. Could not be obtained.
On the other hand, in the substrate described in the above embodiment, the resin film is formed on the surface of the substrate around the portion where the resin encapsulant is to be formed. That is, the portion of the resin film where the resin encapsulant is to be formed is open. Therefore, the flow of the dropped resin is regulated by the periphery of the opening of the resin film. That is, as described in the above embodiment, there is a step corresponding to the thickness of the resin film between the surface of the portion where the resin encapsulant is to be formed on the substrate and the surface of the resin film. It acts as.
[0039]
Although the dropped resin tends to maintain a substantially hemispherical shape due to its surface tension, the resin flows out on a flat surface, and the hemispherical shape cannot be maintained. On the other hand, if there is any resin that regulates the flow of the resin, as in the resin film described in the embodiment, the dropped resin can maintain a hemispherical shape.
(C) Phosphor
In the embodiment, the phosphor is mixed in the resin enclosure. However, for example, the phosphor may be applied to the surface after forming the resin enclosure. Naturally, even when the phosphor is applied in this manner, desired visible light can be obtained.
[0040]
Further, for example, when the light emitted from the LED bare chip is used as it is, the phosphor may not be provided. However, in this case, the resin enclosure serves to protect the LED bare chip.
(2) About resin film
(A) Regarding the formation range of the resin film
In the above embodiment, the resin film is formed except for the portion where the resin encapsulant is to be formed, the portion where the recognition mark is formed, and the region where the connection terminal is formed (the resin film is not formed). The portion where the substrate is exposed is combined to form an exposed region.) However, if the purpose of this resin film is only to restrict the outflow of the resin during the molding of the resin encapsulant, it is not necessary to form the resin film on the entire surface of the substrate excluding the exposed region. May be formed only around the portion to be formed (for example, a perforated circular shape in plan view).
[0041]
Furthermore, in the embodiment, the resin film is formed so as to exclude a region where the resin encapsulant is to be formed and the recognition mark are close to each other. The resin film may be formed so as to exclude each of them in an independent state.
(B) About film thickness
In the embodiment, the thickness of the resin film is about three times the thickness of the wiring pattern. However, the thickness of the resin film is preferably at least one time as large as the wiring pattern. This is because, when the thickness of the resin film is less than one time the thickness of the wiring pattern, the resin film cannot completely cover the wiring pattern, and the surface of the wiring pattern and the surface of the resin film are formed on the substrate. There may be a step between them. If the step remains, a gap is formed between the lower surface of the molding die for the resin enclosure and the upper surface of the resin film when the resin enclosure is formed, and the softened resin flows out of the gap.
[0042]
On the other hand, if the resin film is formed such that the upper surface of the resin film is higher than the upper surface of the light emitting element (LED bare chip) connected to the wiring pattern, the surface of the resin film can be reliably flattened. This hinders efficient extraction of light from the light source.
(3) Wiring pattern
In the embodiment, since the wiring pattern is formed on the surface of the substrate, a step is generated between the surface of the wiring pattern and the surface of the substrate. However, even when a step is not formed between the wiring pattern and the insulating layer, when the resin film is formed, it is possible to prevent the resin from flowing out when the resin enclosure is formed by the dispenser method.
[0043]
(4) Light emitting device
In the embodiment, the LED bare chip is used as the light emitting element, but another light emitting element may be used. For example, there is a laser diode (LD). Naturally, it is also possible to apply the LD to the above-mentioned light emitting light source.
(5) Lighting device
In each of the above embodiments, the light emitting light source has been mainly described. However, it is possible to use the light emitting light source as a lighting device by supplying power to the light emitting light source via a power supply terminal.
[0044]
FIG. 10 is a diagram illustrating an example of a lighting device using the above light emitting light source.
The lighting device 100 has a case 151 provided with a base 152 and a reflector 153, and the light emitting light source 110 is attached to the case 151. The base 152 has the same standard as the base used in general electric bulbs. The reflector 153 is for reflecting the light emitted from the light source 110 forward.
[0045]
The light emitting light source 110 is mounted on a mounting portion 154 provided on the case 151 on the side opposite to the base 152. Inside the case 151, a circuit for supplying power to the LED bare chip via a power supply terminal, for example, a rectification circuit for rectifying AC power supplied from a commercial power supply into DC power, and a DC power rectified by the rectification circuit And a power supply circuit including a voltage adjustment circuit for adjusting the voltage value of the power supply.
[0046]
(6) Display device
It is also possible to mount an LED bare chip on the substrate in the embodiment and use it as a display device with 8 rows and 8 columns. However, in this case, a known lighting control circuit or the like that changes the wiring pattern so that each LED bare chip is individually lit, and individually lights the LED bare chip to display characters, symbols, and the like is required.
[0047]
Here, the display device having 8 rows and 8 columns has been described. However, the mounting mode of the LED bare chip is not limited to the 8 rows and 8 columns mode. (In the embodiment, 64 LED bare chips) may be used as one light source of the display device.
[0048]
【The invention's effect】
As described above, the light-emitting light source according to the present invention is a light-emitting light source including a substrate having a wiring pattern formed on a surface thereof, a light-emitting element connected to the wiring pattern, and a resin encapsulant enclosing the light-emitting element. A dam is formed around the portion of the surface of the substrate where the resin encapsulant is to be formed, to prevent the resin from flowing out when the resin encapsulant is molded. Therefore, it is possible to prevent the resin from flowing out during molding of the resin enclosure. In addition, since the resin film is merely formed around the portion where the resin encapsulant is to be formed, it can be easily implemented.
[Brief description of the drawings]
FIG. 1 is a perspective view of a light emitting light source according to an embodiment of the present invention.
FIG. 2 is an exploded perspective view of a light emitting light source according to the embodiment of the present invention.
FIG. 3 is an enlarged view of a vertical section taken along line XX shown in FIG.
FIG. 4 is a perspective view of a substrate according to the embodiment of the present invention.
FIG. 5 is a plan view of a substrate before an LED bare chip is mounted according to the embodiment of the present invention.
FIG. 6 is a plan view of a surface insulating layer according to the embodiment of the present invention.
FIG. 7 is a plan view of an insulating layer of a back layer according to the embodiment of the present invention.
FIG. 8 is an enlarged view of a portion A in FIG.
FIG. 9 is a diagram illustrating a method for manufacturing a light emitting light source according to an embodiment of the present invention.
FIG. 10 is a perspective view showing a lighting device using a light emitting light source according to an embodiment of the present invention.
[Explanation of symbols]
1 Emission light source
10 Substrate
33, 43 connection pattern
50 resin film
60 Reflector
70 lens plate
100 lighting equipment
Lnm LED bare chip
Rnm resin enclosure

Claims (16)

A substrate having a wiring pattern formed on a surface thereof, a light emitting element connected to the wiring pattern, and a light emitting light source including a resin enclosing body for enclosing the light emitting element,
A light emitting light source, wherein a dam is formed around a portion of the surface of the substrate where the resin encapsulant is to be formed, to prevent resin from flowing out when the resin encapsulant is molded. The substrate includes a resin film at least around a portion where the resin encapsulant is to be formed, and the dam is configured by a step between a surface of the resin encapsulant where the resin encapsulant is to be formed and the surface of the resin film. The light-emitting light source according to claim 1, wherein The light-emitting light source according to claim 2, wherein the resin film has a thickness that is at least one time greater than a thickness of the wiring pattern. The wiring pattern includes a connection terminal connected to an external power supply, and a connection pattern connected to the light-emitting element.The resin film includes the connection pattern except for a portion where the resin encapsulant is to be formed. The light emitting source according to claim 2, wherein the light emitting source is covered. The light emitting source according to claim 2, wherein a surface of the resin film is substantially flat. The substrate includes a recognition pattern serving as a reference for a connection position when the light emitting element is connected to the wiring pattern,
The light emitting light source according to claim 2, wherein the resin film is formed excluding the recognition pattern. The reflector according to any one of claims 2 to 6, wherein a reflector for reflecting light from the light emitting element is mounted on a surface of the resin film, and a convex lens is provided on the reflector. The luminescent light source as described. 8. The method according to claim 7, wherein the resin film is formed of an insulating resin, and is formed in a state of sealing a range on the surface of the substrate where the reflection plate is mounted. Luminescent light source. The light emitting light source according to any one of claims 1 to 8, wherein a metal heat sink is attached to a back surface of the substrate. The light-emitting light source according to any one of claims 1 to 9, wherein the light-emitting element is an LED bare chip and a phosphor is included in the resin enclosure. 10. The light emitting device according to claim 1, wherein the light emitting element is a blue light emitting LED bare chip and a light emitting body for converting the blue light emission to white light is included in the resin enclosure. A light-emitting light source according to the item. An illumination device using the light-emitting light source according to claim 1. A display device using the light-emitting light source according to claim 1. After connecting the light emitting element to the wiring pattern formed on the surface of the substrate, a method for manufacturing a light emitting light source obtained by encapsulating the light emitting element in a resin encapsulation,
After forming a wiring pattern on the surface of the substrate,
A dam is formed around the portion where the resin encapsulant is to be formed on the substrate to control the outflow of resin during the molding of the resin encapsulant, and light is emitted from the wiring pattern exposed at the portion where the resin encapsulant is to be formed. A method for manufacturing a light emitting light source, comprising connecting elements. The dam is constituted by a step between a surface of the substrate on which a resin encapsulant is to be formed and a surface of a resin film having a surface higher than the surface, and the resin film is formed by a screen printing method. The method for manufacturing a light-emitting light source according to claim 14, wherein: The method according to claim 15, wherein after the resin film is formed, the exposed wiring pattern is plated, and the light emitting element is connected to the plated portion.

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