JP2004106172A - Fluidic conduit, method for forming fluid conduit, microarray system, dpn system, fluid circuit, and manufacturing method of microarray - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a fluidic conduit which can be used in microarraying systems, nano-lithography systems of dip pen type, a fluidic circuit and microfluidic systems. <P>SOLUTION: This fluidic conduit comprises a spring beam 460 which has a fixed part 453 attached to a substrate 440, and a cantilever part 454 having a curvature away from the substrate 440. The spring beam 460 defines a first channel 452 extending approximately parallel with the curvature of the cantilever part 454, in order to carry fluid along the cantilever part 454 of the spring beam 460. <P>COPYRIGHT: (C)2004,JPO

Description

The present invention relates generally to microfluidic devices, and in particular, to liquid handling probes for such devices.

(1) A conventional microarray system is shown in FIG. The microarray system 100 includes a stage 110 for supporting a biochip 120, a microarray 130 attached to an XYZ positioning system 160, a system controller, and a computer / workstation 170 used for processing measurement data.

FIG. 2 also shows a conventional false pen nanolithography (DPN) system. The DPN system 200 includes a stage 210 that supports a wafer 220, a micropen assembly 230 that attaches to an XYZ positioning system 260, and a computer / workstation 270 that functions as a system controller.

In the DPN system 200 as well as the microarray 130 of the microarray system 100, the micropen assembly 230 uses metal pins. The difficulty and high cost of manufacturing metal pins has limited their use.

It is necessary to be able to produce a microfluidic conduit without incurring the manufacturing difficulties and high costs found in conventional metal pins, and to be able to be formed on microfluidic devices such as microarrays and micropen assemblies. I have.
U.S. Pat. No. 3,842,189 U.S. Pat. No. 5,613,861 Zhang et al., "A MEMS Nanoplotter With High-Density Parallel Dip-Pen Nanolithography Probe Arrays", Institute of Physics Publishing, Institute of Physiscs Publishing, Nanotechnology 13, 2002, p. 212-217 "Microfabrication by Electrochemical Metal Removal", IBM J.C. Res. Dev. , September 4, 1998, Vol. 42, No. 4, p. 655

The present invention provides a fluid system formed using a spring material film having a designed stress.

According to a first aspect of the present invention, there is provided a fluid conduit including a spring beam having a fixed portion attached to a substrate and a cantilever portion having a bend away from the substrate, A spring beam is provided by a fluid conduit defining a first channel extending substantially parallel to the bend of the cantilever portion for carrying fluid along the cantilever portion of the spring beam.

A second aspect of the present invention is a method for forming a spring material film having an internal stress gradient in a direction perpendicular to the release material layer on a release material layer, and forming a spring material island. Etching the spring material film; and causing the cantilever portion of the spring material island to bend away from the second portion of the release layer due to the internal stress gradient. Removing a portion of the spring material island from beneath the cantilever portion; and extending substantially parallel to the bend of the cantilever portion for carrying fluid along the cantilever portion of the spring beam. And defining a channel.

Further, a third aspect of the present invention is a microarray system for simultaneously analyzing a plurality of fluid samples, wherein the analysis integrated circuit (IC) including a plurality of test positions arranged in a first pattern, and a microarray system attached to a substrate. A fixed channel, a first channel extending parallel to the free end bend, and a bend away from the substrate and terminating at a dispensing tip for dispensing liquid from the first channel. A dispensing assembly comprising a plurality of channel spring probes each having a free end, wherein the dispensing tip of the plurality of channel spring probes has a second pattern substantially matching the first pattern. An arrayed dispensing assembly and the dispensing tip of each of the plurality of channel spring probes are contacted with one of the plurality of test locations on the analytical IC. And deployment system for placing to be provided by microarray system comprising a computer / workstation for processing data supplied by the analyzing IC controls the placement system.

Also, a fourth aspect of the present invention is a dip pen nanolithography (DPN) system for patterning a substrate, comprising: a base for supporting and placing the substrate; a fixed end attached to the substrate; A channel extending parallel to the free end bend and the free end having a bend away from the substrate and terminating at a dispensing tip for dispensing liquid from the channel onto the substrate. A micro-pen assembly including a first channel spring probe, and the dispensing tip of the first channel spring probe arranged to contact the substrate and to print a desired pattern on the substrate. Provided by a DPN system having a deployment system and a computer / workstation for controlling the deployment system It is.

In a fifth aspect of the present invention, a first fluid element having a first surface, a fixed portion attached to the first surface, a free portion having a bend away from the first surface, A channel spring probe having a channel for carrying fluid along a free portion of the channel spring probe.

A sixth aspect of the present invention is a method for manufacturing a microarray having a plurality of printing tips, wherein a spring having an internal stress gradient on a release material layer in a direction perpendicular to the release material layer. Forming a material film; etching the spring material film to form a plurality of spring material islands in an array pattern; and forming a plurality of bends each having a bend away from a second portion of the release material layer. A spring beam, wherein a first portion of the release material layer is formed on the cantilever portion of each spring material island to form a plurality of spring beams each comprising one of the plurality of printing tips. And removing from below.

FIG. 3 is a perspective view of a microarray system 300A according to the embodiment of the present invention. The microarray system 300A includes a platform 310A for supporting an analytical IC (Analytical IC) 320A, a distribution assembly 330A attached to a placement subsystem 370A, and a computer / workstation 380A acting as a system controller and measurement data processor. including. The analytical IC 320A can be comprised of a biochip or any other type of IC that provides surface-based analytical capabilities. The placement subsystem 370A is responsive to control signals provided by the computer / workstation 380A to collect test solution samples in an array pattern on the analytical IC 320A and to dispense the array pattern on the analytical IC 320A. , Move the dispensing assembly 330A. The placement subsystem 370A can perform any placement operations necessary to dispense the test sample onto the analysis IC 320A, or the platform 310A can be used to align the analysis IC 320A and the dispensing assembly 330A. Additional placement capabilities may be included. Once the test sample has been dispensed, the analytical IC 320A performs a parallel analysis and provides the results to a computer / workstation 380A for further processing. Accordingly, the microarray system 300A is substantially similar to the microarray system 100 shown in FIG. 1, except that the metal pin based microarray 130 has been replaced with a channel spring probe based distribution assembly 330A.

The dispensing assembly 330A includes a plurality of channel spring probes 350A arranged in an array on a substrate 340A. As described above, the channel spring probe 350A can be manufactured much more economically than the printing tip 150 of the microarray system 100, and can provide significantly improved accuracy and design flexibility. Each channel spring probe 350A includes a channel 351A that extends parallel to the bend of the channel spring probe. Channel 351A is sized so that the test solution is drawn along the channel by capillary action. When any channel spring probe 350A is placed in contact with the liquid source, liquid is drawn into channel 351A. When the tip of any channel spring probe 350A is placed in contact with the surface of the analytical IC 320A, a certain amount of liquid will be deposited on the biochip 320A from the channel 351A. During these liquid drawing and dispensing operations, liquid is retained in channel 351A by capillary and surface tension forces. An optional reservoir 352A formed along each channel 351A can increase the liquid storage capacity of the channel spring probe 350A. Although each channel spring probe 350A is shown as having a tapered tip and a single channel, a channel spring probe according to embodiments of the present invention may have any number of different tips and Channel configurations can be included. For example, each channel 351A of the channel spring probe 350A may represent two channels that allow the dispensing assembly 330A to dispense the mixed solution onto the analytical IC 320A.

FIG. 4 is a perspective view of a dip pen nanolithography (DPN) system 300B according to another embodiment of the present invention. DPN system 300B includes a pedestal 310B for supporting a substrate 320B (such as a wafer), a micropen assembly 330B attached to an XYZ placement subsystem 370B, and a computer / workstation 380B acting as a system controller. Micropen assembly 330B includes one or more channel spring probes 350B mounted to mounting 340B. XYZ placement subsystem 370B moves micropen assembly 330B to print a desired pattern on wafer 320B in response to control signals provided by computer / workstation 380B. The channel 351B (parallel to the bend of the channel spring probe 350B) and the optional reservoir 352B of the channel spring probe 350B allow for applying a printing solution onto the wafer 320B. Accordingly, the DPN system 300B is substantially similar to the DPN system 200 shown in FIG. 2, except that the metal pin-based micropen assembly 230 has been replaced with a channel spring probe based micropen assembly 330B. Nevertheless, it offers the cost and design advantages associated with channel spring probes.

FIG. 5 is a schematic diagram of a fluid circuit 300C according to another embodiment of the present invention. The circuit 300C includes fluidic devices 320C (1) and 320C (2) that can be comprised of any device that uses or incorporates microfluidic liquid volumes. Fluidic elements 320C (1) and 320C (2) can be comprised of a biochip or other analytical integrated circuit (IC) designed for fluid analysis. Fluidic elements 320C (1) include respective channel spring probes 350C (1) and 350C (2) for liquid collection and distribution, microchannel network 321C for in-plane fluid routing, and fluid storage. And an optional reservoir 322C. The free end of the channel spring probe 350C (1) is arranged to be in contact with the liquid 391C in the external supply container 390C, and a part of the liquid 391C is bent by the force of the capillary action by bending the channel spring probe 350C (1). Drawn into a channel 351C (1) extending parallel to. This withdrawn liquid can be stored in an optional reservoir 322C or passed to a microchannel network 321C. The microchannel network 321C then routes the liquid to the appropriate location within the fluidic device 320C (1) (including routing to the channel 351C (2) in the channel spring probe 350C (2)). ). The channel 351C (2) extending parallel to the bend of the channel spring probe 350C (2) allows liquid to be dispensed from the distal end of the channel spring probe 350C (2) onto the fluidic element 320C (2).

6 (A) to 6 (D), FIGS. 7 (A) to 7 (C), and FIGS. 8 (A) and 8 (B) show FIGS. 3 and 3 according to another embodiment of the present invention. FIG. 6 is a simplified side cross-sectional view illustrating a typical manufacturing process used to manufacture channel spring probes, such as the channel spring probes 350A, 350B and 350C shown in FIGS. 4 and 5;

（Referring to FIG. 6A, the manufacturing process starts by forming a release layer 445 on a wafer 440. Substrate 440 is formed from a selected substrate material (eg, glass, quartz, silicon (Si), sapphire, aluminum oxide, or a suitable plastic). In one embodiment, release layer 445 includes one or more of Si, a silicon nitride composition (SiNx), a silicon oxide composition (SiOx), or titanium (Ti) deposited on substrate 440. As described below, the release material is selected such that the channel spring probe remains connected to the substrate 440 via a portion of the release layer 445 after release. In another embodiment, a separate anchor pad is separately formed adjacent to a release material that serves to connect the spring probe to the substrate 440. Although such separately formed anchor pads can increase the strength of the channel spring probe / substrate connection, forming such anchor pads increases the number of steps in the process, thereby The total manufacturing cost of the probe increases. In another embodiment, the substrate material of substrate 440 itself may be used as a release layer (ie, no separate release material deposition process is used, and channel spring probes 350C (1) and 350C (2) of FIG. 5). , The channel spring probe 450 is connected directly to the substrate 440).

As shown in FIG. 6B, a (spring material) film 465 having a stress designed to include an internal stress difference in the growth direction is formed on the release layer 445 using a known process technique. . In one embodiment, the engineered stressed membrane 465 is formed such that the lowermost portion (ie, adjacent to the release material layer 440) has a higher internal compressive stress than the upper portion, thereby moving away from the substrate 440. An internal stress difference is created that causes a bias to bend. Methods of creating such an internal stress difference in a designed stressed film 465 are described, for example, in US Pat. No. 3,842,189 (to deposit two metals having different internal stresses) and US Pat. No. 5,613,861. (E.g., sputtering a single metal while changing process parameters), which are incorporated herein by reference. In one embodiment, the engineered stressed membrane 465 comprises one or more metals suitable for forming a spring structure (eg, molybdenum (Mo), “molychrome” alloy (MoCr), tungsten (W), titanium (W). -One or more of a tungsten alloy (Ti: W), chromium (Cr), and nickel (Ni)). In another embodiment, the designed stressed film 465 is formed using Si, nitride, silicon oxide, carbide or diamond. As will be described in more detail below, the thickness of the designed stressed membrane 465 is determined in part by the selected spring material, the desired spring constant, and the shape of the final spring beam structure.

6 (C), 9 (A) -9 (D), and 10 (A) -10 (D), the elongated spring mask 446 (eg, photoresist) reduces the designed stress. The film 465 is patterned so as to cover a selected portion of the film 465. The spring mask 446 is formed in the shape of the desired channel spring probe and may include various tip, channel and mounting area configurations. A well-characterized lithographic process that can be used to print the spring mask 446 allows for great flexibility in the actual geometry of the spring mask 446. FIG. 9A shows a plan view of a spring mask 446 according to one embodiment of the present invention. The spring mask 446 includes a probe tip region 446-A at one end and a mounting region 446-B at the other end, and a channel region 446 between the probe tip region 446-A and the mounting region 446-B. -C. The size of the channel region 446-C is such that the resulting channel formed in the final channel spring probe provides the necessary capillary action to the liquid collected, stored or dispensed by the channel spring probe. FIG. 9A shows a peeled region 446-D, which is a portion of the spring mask 446 corresponding to a portion where the channel spring probe is peeled from the substrate 440.

Although channel region 446-C is shown overlapping probe tip region 446-A, in other embodiments according to the present invention, channel region 446-C may extend into mounting region 446-B. FIG. 9B shows a channel region 446-C (1) extending through the release region 446-D and into the mounting region 446-B. An optional narrow area 447 is included to provide a more flexible area for the final channel spring probe (note that the narrow area 447 is for illustration purposes a peel area 446-D and a mounting area). Although shown where 446-B meets, narrow area 447 can be located anywhere along strip area 446-D). Other variations can be made to the channel region 446-C, depending on the intended use of the final spring channel probe. For example, FIG. 9C illustrates a channel region 446-C (2) according to another embodiment of the present invention. The inner end of the channel region 446-C (2) is connected to a reservoir region 520 for making the reservoir element of the final channel spring probe. Since the resulting reservoir element is wider than the width of the channel, the fluid holding capacity of the channel region 446-C (2) is increased. Although the reservoir region 520 is shown disposed within the stripping region 446-D, it can be disposed within the mounting region 446-B, as indicated by the dashed line.

The present invention also allows for the formation of multiple channels in a channel spring probe. For example, FIG. 9D illustrates a portion of a spring mask 446 having channel regions 446-C (3) and 446-C (4) according to another embodiment of the present invention. Similar to the channel regions described above with respect to FIGS. 9B and 9C, the channels 446-C (3) and 446-C (4) can include reservoir elements, and / or As shown by the dashed line, it can extend into the mounting area 446-B.

柔軟 性 A similar configuration flexibility is also applied to the mounting region 446-B and the probe tip region 446-A shown in FIG. Although shown as a substantially rectangular area in FIGS. 9A-9D, the mounting area 446-B can take any number of shapes. FIG. 10A shows a mounting area 446-B (1) according to another embodiment of the present invention. The mounting area 446-B (1) has the same width as the stripping area 446-D, resulting in a linear (ie, uniform width) channel spring probe having a uniform width. Various other mounting area configurations are possible, including but not limited to V-shaped, U-shaped, J-shaped, and L-shaped configurations. FIG. 10 (B) shows the mounting area 446-B (2) enlarged to allow for expanded routing of the channel area 446-C (5), which is a single lithographic process. The process allows for the formation of both out-of-plane and in-plane fluid routing channels.

Similarly, the probe tip region 446-A can take any configuration necessary to form the desired channel spring probe. For example, FIG. 10C shows a probe tip region 446-A (1) according to another embodiment of the present invention. In contrast to the blunt probe tip region 446-A of FIG. 9A, the probe tip region 446-A (1) has a chamfer 501 that provides a tapered tip on each side of the channel region 446-C. And 502. This tapered tip configuration can reduce the movement of fluid along the (printed) edge of the resulting channel spring probe tip and is more than would be possible with a similar channel spring probe having a flat tip configuration. Enables distribution of fine fluid lines.

FIG. 10D illustrates a probe tip region 446-A (2) according to another embodiment of the present invention. Probe tip region 446-A (2) not only includes chamfers 501 and 502, but also includes a sharp tip 505 that closes the end of channel region 446-C. With the proper size of the pointed tip 505 and the distance from the end of the channel region 446-C, the resulting fluid in the channel spring probe is carried from the channel region to the pointed tip of the pointed tip and is very thin. The fluid line can be distributed. According to the embodiment of the present invention, the channel region 446-C can also terminate at a position of 1 to 3 μm or less from the vertex of the sharp tip 505.

Returning to the channel spring probe manufacturing process, FIG. 6D illustrates a design surrounding a spring mask 446 that has been etched using one or more etchants 480 to form a spring island 465-1. The exposed portion of the film 465 having the applied stress is shown. Note that this etching process is performed so that limited etching of the release layer 445 surrounding the spring material island 465-1 occurs. In one embodiment, to remove the exposed portions of the designed stressed film 465, the etching step comprises a wet etching process, for example, using a cerium ammonium nitrate solution to remove the MoCr spring metal layer. It may be performed using. In another embodiment, anisotropic dry etching is used to etch the top surfaces of the exposed portions of the designed stressed film 465 and the release layer 445. This embodiment may be performed, for example, using a Mo spring metal and a Si or Ti release layer. Mo, Si and Ti are all etched in a reactive fluorine plasma. The advantage of dry etching a spring material film is that it facilitates obtaining a channel spring probe with a finer shape and a sharper tip. Materials that are not etched in the reactive plasma may be further anisotropically etched by a physical ion etching method such as argon ion milling. In another possible embodiment, IBM {J. Res. Dev. Vol. 42, no. 4 (September 4, 1998), p. 655, using an electrochemical etching process. Many further process variations and material substitutions are possible, and the examples given herein are not intended to be limiting.

FIG. 7A shows the spring material island 465-1 and the release layer 445 after the spring mask 446 (FIG. 6D) has been removed. At this point, an optional channel region patterning 466 may be formed on the spring material island 465-1, as shown in FIG. 7 (B). Channel region patterning 466 allows for the formation of secondary channel elements in spring material island 465-1. If channel elements have already been patterned on the spring material island 465-1, the optional channel region patterning 466 is not necessary, but nonetheless, to deform or add to the elements integrated into the spring material island 465-1. A secondary channel element could be used. Alternatively, this additional channel region patterning may be performed after the appropriate portion of spring material island 465-1 has been stripped from substrate 440 (described below with respect to FIG. 8A).

で は In FIG. 7C, a release mask 450 is formed on the first portion 465-1A of the spring material island 465-1. The release mask 491 defines a release window RW that exposes the second portion 465-1B of the spring material island 465-1 and the surrounding portion of the release layer 445. The release mask 491 also functions as a strap structure for further fixing the first portion 465-1A to the substrate 440. In one embodiment of the present invention, the release mask 491 is formed using a photoresist. In another embodiment of the present invention, a suitable metal or epoxy may be used. According to another embodiment of the present invention, release mask 491 may be removed by appropriately patterning release layer 445 and / or first portion 465-1A of spring material island 465-1.

At this point, the substrate 440 is removed (eg, along the dicing lines DL1 and DL2) to prevent damage to later raised structures (ie, the spring beams 460 shown in FIG. 8A). Dicing may be performed. Optional sticky dicing tape 441 may be used to prevent movement of the substrate during and after dicing (ie, the dicing blade cuts only substrate 440 (and the portion of release layer 445 thereon)). And the adhesive tape 441 thereunder is not cut). Alternatively, dicing may be performed after the portion 465-1B is separated from the substrate 440. In such a case, if it is desired to protect the beam peeled off during dicing, beam passivation using a resist or wax may be used.

In FIG. 8A, a portion of the release layer 445 is removed using an exfoliation etchant 481 (eg, a buffered oxide etch) to expose the exposed portions of the spring island 465-1 (i.e., the second From the bottom of section 465-1B) to form a curved spring beam 460. Upon removal of the exposed release material, the cantilever portion 454 of the spring beam 460 bends away from the substrate 440 in response to internal stress deviations created during formation of the designed stressed film (described above). The fixed end 453 of the spring beam 460 remains fixed to the substrate 440 by a release material (support) portion 445A protected by a release mask 491. Alternatively, the stripping mask 491 may be removed from the fixed end 453 of the spring beam 460 after stripping. If channel region patterning 466 has not been previously formed (eg, in FIG. 7B), optional channel region patterning 466 may be formed in spring beam 460 at this point (ie, after stripping). If channel region patterning 466 is present, an additional deposition process (one or more times) may be used to form the actual channel structure 467 of the completed channel spring probe 450 shown in FIG. (As described above, a channel element may be defined (ie, integrated) within the spring beam 460, in which case the spring probe 450 requires a channel structure 467). Absent).

The formation of the channel structure 467 is shown in detail in FIGS. 11A to 11C. FIG. 11A shows a front view of the intermediate probe tip 455 shown in FIG. 8A, where the channel region patterning 466 is over a desired portion of the spring beam 460. The channel region patterning 466 can be comprised of a hard mask (eg, a hard resist) or any other material that can be removed without removing the subsequently formed channel structure. In FIG. 11B, a channel structure 467 is formed in a portion of the spring beam 460 that is not masked by the channel region patterning 466, and a resist strip (stripping agent) 482 is applied to remove the channel region patterning 466. Is done. FIG. 11 (C) shows a front view of the obtained probe tip 456 (from FIG. 8 (B)). The gap previously occupied by the channel region patterning 466 becomes a channel 468. ing. For channel region patterning 466 and channel structure 467, various other features described with respect to FIGS. 13A-13D, 14A-14C, and 15A. Various geometries are possible. According to embodiments of the present invention, a channel structure 467 may be electroplated over the spring beam 460. According to another embodiment of the present invention, various other materials (eg, oxides, nitrides, organic materials (carbides), etc.) and processes (eg, sputtering, evaporation) to form the channel structure 467. , Chemical vapor deposition (CVD), spinning, etc.). The channel structure creates a beam load that can reduce the peel height of the spring beam 460, but before peeling the spring beam 460 from the substrate 440 (i.e., on the spring island 465-1 shown in FIG. 7C). ), It is also possible to form a channel structure (467).

8B, in accordance with one embodiment of the present invention, substrate 440 can include an integrated fluid path, as indicated by optional fluid path 444. Channel spring beams can be formed on a substrate that already contains such an integrated fluid path to simplify the structure of the new fluid routing system. For example, an optional support structure 442 can be attached to the substrate 440 to provide additional mechanical support and / or interface elements. The support structure 442 can include an optional fluid reservoir 443 for supplying liquid to the channel spring probe 450. In such a situation, substrate 440 may include a pre-formed integral via (fluid path 444) connecting the channel of channel spring probe 450 and reservoir 443 of support structure 442. Fluid reservoir 443 may supply liquid to spring channel probe 450 or store liquid collected by spring channel probe 450.

According to another embodiment of the present invention, an optional protective coating 461 (shown in dashed lines) such as paraline or oxide can be formed over any exposed portions of spring beam 460 (and channel structure 467). . According to another embodiment of the present invention, the material deposited on the surface of the spring beam 460 prior to exfoliation is etched using a method such as FIB, EBD, carbon-nanotube growth, or attached after exfoliation. Allows an optional secondary tip 469 to be formed or attached to the end of the spring beam 460. Thomas Hantschel et al., "Scanning Probe System with Spring Probe and Actuating / Detecting Structure," filed Apr. 30, 2002, which is incorporated herein by reference. Various configurations of the secondary tip are more fully described in commonly-owned co-pending U.S. patent application Ser. No. 10 / 136,258, entitled "With Spring Probe And Actuation / Sensing Structure."

FIG. 12 (A) is a perspective view of the completed channel spring probe 450 of FIG. 8 (B). The channel spring probe 450 can be used in any fluid system, such as the microarray system 300A shown in FIG. 3, the DPN system 300B shown in FIG. 4, and the fluid circuit 300C shown in FIG. Channel spring probe 450 can be used after or after the process described with respect to FIGS. 6A-6D, 7A-7C, and 8A-8B. Also includes an optional operating module 495 that can be formed with the process. The operating module may be adjacent to or attached to the spring beam 460 and the channel spring probe 450 may include actuators, heaters, temperature sensors, stress sensors, optical detectors, deflection sensors, drug sensors, and (actuation, signal processing). Various structures can be included to provide additional functionality, such as integrated electronic circuits (for controlling the like). For example, each channel spring probe in the channel spring probe array (such as the microarray 330A shown in FIG. 3 or the micropen assembly 330B shown in FIG. 4) may have all channel spring probe tips aligned. Actuators and deflection sensors to assist the

For example, FIGS. 16A to 16C show first elongated electrode portions 995 (A) and second elongated electrode portions 995 (A) formed on a substrate 940 and extending in parallel from both sides of a spring beam 960. FIGS. 10A and 10B are a plan view, a side sectional view, and an end view showing a channel spring probe 950 incorporating an working electrode structure including the elongated electrode portion 995 (B) of FIG. Each of the elongated electrode portions 995 (A) and 995 (B) has a relatively wide portion 996 located adjacent the fixed end 953 of the spring beam 960 and a relatively wide portion 996 located adjacent the probe tip 956. And a tapered shape including a thin portion 997. The inventor has noted that the tapered electrode portions 995 (A) and 995 (B) may have a reduced length along the length of the spring beam 960 due to the reduced field strength (along the length) inherent in the tapered electrode design. To reduce the applied force, thereby facilitating a stable "rolling / zipper" operation of the spring beam 960 (described below with reference to FIGS. 17A-17C). It was judged. By offsetting the tapered electrode portions 995 (A) and 995 (B) from the spring beam 960 (ie, attached to both sides of the spring beam 960), it is necessary to achieve full deflection of the probe tip 956. The operating voltage is minimized. Other electrostatically actuated electrode patterns are described in commonly-owned co-pending US patent application Ser. No. 10 / 136,258. The spring beam 960 may include an optional narrow portion 947 to reduce the force required to deflect the spring beam 960, as shown in FIG. The spring beam 960 may include a more flexible portion 948 as shown in FIG. 16B to provide a similar effect. The enhanced flexibility portion 948 can be formed in a variety of ways, including locally thinning the spring beam 960, or locally integrating a softer material into the spring beam 960. The thin portion 947 in FIG. 16A and the enhanced flexibility portion 948 in FIG. 16B can be arranged at any position along the cantilever portion 954.

FIGS. 17 (A) to 17 (C) are side sectional views showing the “rolling / zipper” operation of the spring beam 960. Referring to FIG. 17A, when a relatively small voltage signal is applied by the voltage source 901 to the spring beam 960 and the elongated electrodes 995 (A) and 995 (B), the cantilever portion 954 is substantially biased. (I.e., curves into a shape determined by the design of the channel spring probe). As shown in FIG. 17B, as the applied voltage generated by the voltage source 901 increases, the cantilever portion 954 is actuated toward the substrate 940 and straightens, thereby “spreading” the spring beam 960. As shown in FIG. 17C, when the applied voltage generated by the voltage source 901 reaches a sufficiently large value, the spring beam 960 spreads further until the tip 956 contacts the substrate 940. This actuation capability can substantially improve the functionality of the device incorporating the channel spring probe. For example, in the microarray 330A shown in FIG. 3, the individual channel spring probes 350A can be turned "off" by actuating them toward the substrate 340A. Similarly, the individual channel spring probes of micropen assembly 330B shown in FIG. 4 can be turned off and on by actuating toward (and away from) substrate 340B.

FIG. 12B is an enlarged photograph showing an actual channel spring probe array 730 manufactured by the present inventors using the above-described manufacturing process. Channel spring probe array 730 includes channel spring probes 750 (1), 750 (2), 750 (3) and 750 (4) curved away from substrate 740 (although there are others, but for clarity) Not labeled here). Each of the channel spring probes 750 (1) -750 (4) is attached to the substrate 740 at a fixed end 753 and includes a channel, as described above with respect to FIG. For example, channel spring probe 750 (1) includes a channel 752 that extends through a tapered probe tip 756 (as defined by probe tip region 446-A (1) described with respect to FIG. 10D). Including. As described above with respect to FIGS. 9 (B) and 9 (C), channel 752 extends into fixed end 753 and terminates in reservoir 753.

12A, the channels 452 in the spring beam 460 also include channels 452 that can be supplemented or replaced by channel elements of the optional channel structure 467 (for clarity, Is indicated by the broken line block). Therefore, the probe tip 456 can take various shapes. For example, FIG. 13A shows a front view of a probe tip 456 (1) according to an embodiment of the present invention. Probe tip 456 (1) includes a channel 452 (1) defined by spring beam 460 and channel structure 467 (1). The channel structures 467 (1) -A and 467 (1) -B are disposed directly over the spring beam portions 460-A and 460-B, respectively, so that the height of the channel included in the spring beam 460 is increased. Increase.

FIG. 13B shows a front view of the probe tip 456 (2) according to another embodiment of the present invention. Rather than adding to the existing channel of the spring beam, the channel structure 467 (2) of the probe tip 456 (2) includes a spring beam 460 (1) that does not include any channel elements (ie, a "blank" spring). Beam). Thus, channel 468 (1) is entirely defined by channel structures 467 (2) -A and 467 (2) -B.

FIG. 13C shows a front view of the probe tip 456 (3) according to another embodiment of the present invention. At the probe tip 456 (3), the channel structure 467 (3) formed over the empty spring beam 460 (1) defines a completely enclosed channel 468 (2). The channel structure 467 (3) may be formed, for example, by plating so as to completely cover the channel region patterning, as shown in FIG. Because channel 468 (2) is surrounded on all sides, fluid access is only possible through the ends of channel 468 (2), minimizing the risk of fluid contamination and reducing channel 468 (2). 2) provides a more reliable transport of the liquid retained in it.

FIG. 13D shows a front view of the probe tip 456 (4) according to another embodiment of the present invention. The channel structure 467 (4) is formed by placing the channel structures 467 (4) -A, 467 (4) -B and 467 (4) -C on the empty spring beam 460 (1). 468 (3) and 468 (4) are defined. Using this principle, any number of channels may be formed in the channel spring probe.

FIG. 14A shows a front view of a probe tip 456 (5) including multiple channels, according to another embodiment of the present invention. Probe tip 456 (5) includes channel structures 467 (5) and 467 (6) on the top and bottom of empty spring beam 460 (1), respectively. Channel structure 467 (5) includes channel structures 467 (5) -A and 467 (5) -B that define a channel 468 (5) on the upper surface of spring beam 460 (1), while channel structure 467 (5). 6) includes channel structures 467 (6) -A and 467 (6) -B that define a channel 468 (6) on the bottom surface of the spring beam 460 (1). Probe tip 456 (5) may include only channel structure 467 (6) (as suggested by the dashed line used for channel structure 467 (5)), thereby causing spring beam 460 (1). (I.e., channel 468 (6)) may be provided only on the bottom surface of.

FIG. 14B illustrates a front view of a probe tip 456 (6) including a plurality of enclosed channels, according to another embodiment of the present invention. The probe tip 456 (6) includes channel structures 467 (7) and 467 (8) on the top and bottom of the empty spring beam 460 (1), respectively, thereby providing a completely enclosed channel 468 (6). 7) and 468 (8) are defined respectively. Probe tip 456 (6) may include only channel structure 467 (8) (as suggested by the dashed line used for channel structure 467 (7)), thereby causing spring beam 460 (1). (Ie, channel 468 (8)) may be defined only on the bottom surface of.

A channel element made of a channel structure of the type described above may be used with any reservoir element (as described with respect to FIGS. 9C and 9D) or any other desired on the surface of the spring beam. Configurations can be included. For example, FIG. 14 (C) shows a plan view of a probe tip 456 (7) according to another embodiment of the present invention. The probe tip 456 (7) defines a channel 468 (9) and traversing channels 469-A, 469-B, and 469-C, defining channel structures 467 (4) arranged on an empty spring beam 460 (1). 9) -A to 467 (9) -H. Transverse channels 469-A, 469-B and 469-C are perpendicular to channel 468 (9) and extend across the width of spring beam 460 (1). Channel structures 467 (9) -A and 467 (9) -E are angled such that probe tip 468 (9) has a substantially tapered end. Such an arrangement can be used, for example, in puncture applications where the transverse channels 469-A, 469-B and 469-C provide increased fluid distribution capacity. FIG. 15A is a side view of the probe tip 456 (7), showing transverse channels 469-A, 469-B, and 469-C spaced along the surface of the spring beam 460 (1). I have.

FIG. 15B shows a plan view of a probe tip 456 (8) having a transverse channel, according to another embodiment of the present invention. The probe tip 456 (8) is substantially similar to the probe tip 456 (7) shown in FIGS. 14 (C) and 15 (A), except for the channel of the probe tip 456 (7). Structures 467 (9) -A and 467 (9) -E have been replaced with a single channel structure 467 (9) -I including a sharpened tip 467 (9) -J. Sharp tip 467 (9) -J closes channel 468 (10) at the end of probe tip 456 (8). As described in FIG. 10 (D), the pointed tip 467 (9) -J provides additional stability and penetrating ability to the probe tip 456 (8) while still providing access to the channel 468 (10). And fluid transport from channel 468 (10).

Although the present invention has been described in connection with a plurality of embodiments, it should be understood that the present invention is not limited to the disclosed embodiments, and that various modifications obvious to those skilled in the art are possible. For example, all surfaces of a spring beam (or even bonding wires such as those manufactured by Formfactor, Inc.) could be plated and etched leaving only the plating as an out-of-plane tube. Accordingly, the invention is not limited except as by the appended claims.

It is a perspective view which shows the conventional microarray system. It is a perspective view showing the conventional DPN system. 1 is a perspective view illustrating a microarray system using a distribution assembly of a channel spring probe according to one embodiment of the present invention. FIG. 4 is a perspective view illustrating a DPN system using a micro-pen assembly of a channel spring probe according to another embodiment of the present invention. FIG. 5 is a side view illustrating a fluid circuit using fluid interconnection of a channel spring probe according to another embodiment of the present invention. (A), (B), (C) and (D) are simplified side views illustrating a portion of a typical manufacturing process used to manufacture a channel spring probe, according to another embodiment of the present invention. It is sectional drawing. (A), (B) and (C) are simplified cross-sectional side views illustrating a portion of a typical manufacturing process used to manufacture a channel spring probe according to another embodiment of the present invention. . FIGS. 6A and 6B are simplified cross-sectional side views illustrating a portion of a typical manufacturing process used to manufacture a channel spring probe, according to another embodiment of the present invention. FIG. 6A is a plan view illustrating a spring mask formed over the spring material film during the manufacturing process shown in FIG. 6C, according to another embodiment of the present invention; FIGS. 4C and 4D show details of various regions of the spring mask shown in FIG. 4A, according to various embodiments of the present invention. FIGS. 9A, 9B, 9C, and 9D show details of various regions of the spring mask shown in FIG. 9A, according to various embodiments of the present invention. (A), (B) and (C) are front views illustrating a process for forming a channel in a surface of a spring beam according to another embodiment of the present invention. (A) is a perspective view showing a channel spring probe according to another embodiment of the present invention, (B) is (A) to (D) of FIG. 6, (A) to (C) of FIG. FIG. 9 is a diagram showing an enlarged photograph of an actual channel spring probe array manufactured by the manufacturing process described with reference to FIGS. 8A and 8B. (A), (B), (C) and (D) are front views of the distal end of a channel spring probe according to various embodiments of the present invention. (A) and (B) are front views of the distal end of a channel spring probe according to various embodiments of the present invention, and (C) are one of the distal ends of the channel spring probe according to various embodiments of the present invention. FIG. (A) and (B) are plan views of the distal end of a channel spring probe according to various embodiments of the present invention. (A), (B) and (C) are a plan view, a side sectional view and an end view, respectively, showing a channel spring probe incorporating a working electrode according to one embodiment of the present invention. (A), (B) and (C) are sectional side views which show operation | movement of the channel spring probe of FIG. 16 (B).

Explanation of reference numerals

300A Microarray system 330A Distribution system 350A Channel spring probe 300B Pen-on nanolithography (DPN) system 330B Micro pen assembly 350B Channel spring probe 380B Computer / workstation 300C Fluid circuit 320C (1) Fluid element 320C (2) Fluid element 350C ( 1) Channel spring probe 350C (2) Channel spring probe

Claims (6)

A fluid conduit comprising a spring beam having a fixed portion attached to a substrate and a cantilever portion having a bend away from the substrate, wherein the spring beam directs fluid along the cantilever portion of the spring beam. A fluid conduit defining a first channel for carrying, extending substantially parallel to the bend of the cantilever portion. Forming a spring material film having an internal stress gradient in a direction perpendicular to the release material layer on the release material layer;
Etching the spring material film to form a spring material island;
A first portion of the release material layer is applied to the cantilever portion of the spring material island to cause the cantilever portion of the spring material island to bend away from a second portion of the release layer due to the internal stress gradient. Removing from under the part,
Defining a first channel extending substantially parallel to the bend of the cantilever portion for carrying fluid along the cantilever portion of the spring beam;
A method of forming a fluid conduit comprising: A microarray system for simultaneously analyzing a plurality of fluid samples,
An analytical integrated circuit (IC) including a plurality of test locations arranged in a first pattern;
A fixed end attached to the substrate, a first channel extending parallel to the free end bend, and a dispensing tip having a bend away from the substrate and dispensing liquid from the first channel. A dispensing assembly comprising a plurality of channel spring probes each having a free end terminating at the dispensing end, wherein the dispensing tip of the plurality of channel spring probes substantially coincides with the first pattern. A dispensing assembly arranged in a pattern of
A positioning system for positioning the dispensing tip of each of the plurality of channel spring probes in contact with one of the plurality of test locations on the analytical IC;
A computer / workstation for controlling the placement system and processing data provided by the analysis IC;
A microarray system comprising: A pen-based nanolithography (DPN) system for patterning a substrate, comprising:
A table for supporting and placing the substrate,
A fixed end attached to the substrate, a channel extending parallel to the free end bend, and a dispensing tip for having a bend away from the substrate and dispensing liquid from the channel onto the substrate. A micro-pen assembly including a first channel spring probe having the free end terminating;
An arrangement system for arranging the dispensing tip of the first channel spring probe in contact with the substrate and printing a desired pattern on the substrate;
A computer / workstation for controlling the deployment system;
A DPN system having: A first fluid element having a first surface;
A channel spring probe having a fixed portion attached to the first surface, a free portion having a bend away from the first surface, and a channel for carrying fluid along the free portion of the channel spring probe. ,
A fluid circuit having: A method of manufacturing a microarray having a plurality of printing tips,
Forming a spring material film having an internal stress gradient in a direction perpendicular to the release material layer on the release material layer;
Etching the spring material film to form a plurality of spring material islands in an array pattern;
Forming a plurality of spring beams each having a bend away from a second portion of the release material layer, the plurality of spring beams each comprising one of the plurality of printing tips. Removing a first portion of a release material layer from beneath the cantilever portion of each spring material island;
A method for producing a microarray, comprising:

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