JP2004061359A - Method and system for evaluating surface roughness of component for image forming device, and method and system for cutting - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a surface roughness evaluating method for sensitively and accurately comprehending a local change or variation of a surface to be measured, in surface roughness measurement of a component for an image forming device such as a base substance for an electrophotography photoreceptor. <P>SOLUTION: According to this surface roughness evaluating method of a component for an image forming device, a cross- section curve defined by JIS B0601 is found on the surface condition of the component to perform multiple resolution analysis on positional data rows in a surface roughness direction at equally spaced positions on the cross-section curve, and the state of the surface roughness is evaluated at least based on the result. <P>COPYRIGHT: (C)2004,JPO

Description

ここで、
Ｗ（ｂ，ａ）　ウェーブレット変換
ψ（ｔ）　マザーウェーブレット
ａ　　スケールパラメータ
ｂ　　トランスレートパラメータ
である。
（数１）は連続関数のウェーブレット変換、すなわち連続ウェーブレット変換である。本発明では、サンプリングを一定間隔に行うので、離散系であり、離散ウェーブレット変換を行う。離散ウェーブレット変換において、ウェーブレット係数ｃ_ｊ，ｋは（数２）で表される。
【数２】

である。また、スケーリング係数ｄ_ｊ，ｋは（数３）で表される。
【数３】

（数３）においてφ（ｔ）はスケーリング関数である。
また、（数２）、（数３）においてｊはレベルであり、元信号に対する解像度である階層の番号を示す。ウェーブレット係数ｃ_ｊ，ｋは信号の周波と時間分布を示す。また、スケーリング関数ｄ_ｊ，ｋは元信号のｊ次の解像度の離散化表現である。
【００５５】
離散ウェーブレット変換では、データーを（数４）によって計算する。
【数４】

（数４）において、係数群ｐ及びｑはウェーブレット変換のための変換基底であり、それぞれローパスフィルター、ハイパスフィルターの機能がある。従って、（ｊ＋１）次のスケーリング係数ｄ_{ｊ＋１，ｋ}は、ｊ次のスケーリング係数ｄ_ｊ，ｋより１つ下の解像度表現となり、解析可能な周波数及び時間的な解像度がｊ次の１／２になる。
【００５６】
一方、（ｊ＋１）次のウェーブレット係数ｃ_{ｊ＋１，ｋ}はｊ次のスケーリング係数ｄ_ｊ，ｋをハイパスフィルターに通すことにより得られ、スケーリング係数ｄ_{ｊ＋１，ｋ}とｄ_ｊ，ｋの間の周波数成分を表すことになる。
【００５７】
図２はウェーブレット変換の処理フローを示した図であり、元信号１０（Ｓｏｕｒｃｅ　Ｓｉｇｎａｌ）をハイパスフィルター（ＨＰＦ）に通し、さらにデーターをひとつ置きに間引く処理（ＳＳ）を行って、信号１１に示されるＨ成分（Ｈ　ｐａｒｔ）を得る。
また、元信号１０（Ｓｏｕｒｃｅ　Ｓｉｇｎａｌ）をローパスフィルター（ＬＰＦ）に通し、さらにデーターをひとつ置きに間引く処理（ＳＳ）を行って信号１２を得る。
このようにして得た信号１２をハイパスフィルター（ＨＰＦ）に通し、さらにデーターをひとつ置きに間引く処理（ＳＳ）を行って、信号１３に示されるＬＨ成分（ＬＨ　ｐａｒｔ）を得る。
また、信号１２をローパスフィルター（ＬＰＦ）に通し、さらにデーターをひとつ置きに間引く処理（ＳＳ）を行って信号１４を得る。
このようにして得た信号１４をハイパスフィルター（ＨＰＦ）に通し、さらにデーターをひとつ置きに間引く処理（ＳＳ）を行って、信号１５に示されるＬＬＨ成分（ＬＬＨ　ｐａｒｔ）を得る。
また、信号１４をローパスフィルター（ＬＰＦ）に通し、さらにデーターをひとつ置きに間引く処理（ＳＳ）を行って、信号１６に示されるＬＬＬ成分（ＬＬＬ　ｐａｒｔ）を得る。
図３はこのようにして多重解像度解析処理を行った結果を示した図であり、元信号はＬＬＬ成分、ＬＬＨ成分、ＬＨ成分、Ｈ成分の４成分に分解される。
【００５８】
ここで、ウェーブレット変換は直交ウェーブレット変換と非直交ウェーブレット変換に分類することが可能であり、このいずれを用いても良い。
【００５９】
直交ウェーブレット変換では、ウェーブレット関数は実数形のみが用いられることが多い。このウェーブレット関数としては、ドビッシー（Ｄａｕｂｅｃｉｅｓ）関数、ハール（Ｈａｒｒ）関数、メーヤー（Ｍｅｙｅｒ）関数、シムレット（Ｓｙｍｌｅｔ）関数、そしてコイフレット（Ｃｏｉｆｌｅｔ）関数等が使用可能である。ここでＤａｕｂｅｃｉｅｓはドベシィと表記することがある。これらの直交ウェーブレット変換では、演算した絶対値にローパスフィルターなどにより包絡線（エンベロープ）処理を行えば強度に相当する情報が得られる。
【００６０】
非直交ウェーブレット関数には、複素数形ウェーブレットと実数形ウェーブレットを用いるものがある。複素数形ウェーブレット関数としてはガウス形ウェーブレット関数がある。この複素数形ウェーブレット関数を用いた場合、ウェーブレット変換結果に対して絶対値を演算することにより強度が得られる。実数形ウェーブレット関数としては、メキシカンハット関数、フレンチハット関数等があるが、これを使用して得たウェーブレット変換結果に対して絶対値を演算しても強度は得られない。しかし、演算した絶対値にローパスフィルター等で包絡線（エンベロープ）処理を行うことにより強度に相当する値を得ることが可能である。
【００６１】
ウェーブレット変換結果の二乗絶対値はスカログラム（Ｓｃａｌｏｇｒａｍ）と呼ばれ、スカログラムで示すこともできる。短時間フーリエ変換から求められるスペクトログラムは定周波数バンド分析であるが、ウェーブレット変換によるスペクトログラムは定対数バンド幅分析である。
【００６２】
次にバンドパスフィルターによる処理であるが、これは数種のバンドパスフィルターをあらかじめ用意しておき、信号を順次これらのフィルターに通過させて、信号の多重解像度解析を行う方法である。バンドパスフィルターによる方法では、信号はデジタル信号である必要は無く、アナログ信号であってもかまわない。アナログ信号のバンドパスフィルター処理では、処理の高速化が行える利点がある。
【００６３】
最後に、ウィグナー分布について説明する。時間信号ｆ（ｔ）のウィグナー分布は（数５）で表される。
【数５】

ここで、＊は複素共役を示す。ウィグナー（Ｗｉｇｎｅｒ）分布はウィグナー−ビレ（Ｗｉｇｎｅｒ−Ｖｉｌｌｅ）分布と呼ぶ場合もある。本発明では、信号は位置の関数であるが、時間の関数と読み替えてウィグナー分布の計算を行うことが可能である。
【００６４】
これらのバンドパスフィルター処理、ウェーブレット変換、短時間フーリエ変換、ウィグナー分布計算は各種の方法で行うことが可能である。例えばソフトウェアで行う場合、ｍａｔｈｅｍａｔｉｃａではウェーブレット変換を行うパッケージで可能であるＷａｖｅｌｅｔ　Ｅｘｐｌｏｒｅ等を併用して計算できる。また、ＭＡＴＬＡＢではウェーブレット変換を行うパッケージ（Ｗａｖｅｌｅｔ　Ｔｏｏｌ　Ｂｏｘ）等を併用して計算できる。また、Ｃ言語等でプログラミングしても計算が可能であり、専用の数値演算プロセッサーによっても計算が可能である。
【００６５】
本発明において、バンドパスフィルター処理結果、ウェーブレット変換結果、短時間フーリエ変換結果、ウィグナー分布計算結果は別に測定を行った正常なもの、あるいは、正常ではないものの結果と照合比較することによって、判定を行うことができる。
【００６６】
本発明者の測定では、表面粗さ計は東京精密社製サーフコム５７０Ａを使用し、パーソナルコンピューターはＩＢＭ社製パーソナルコンピューターを使用し、サーフコム５７０ＡとＩＢＭ製パーソナルコンピューターの間はＲＳ−２３２−Ｃケーブルで接続した。サーフコムからパーソナルコンピューターに送られた表面粗さデーターの処理とその多重解像度解析、ウィグナー分布の計算等は、Ｃ言語で作成したソフトウェアで行った。
【００６７】
以下、本発明による表面粗さ評価方法で評価を行った電子写真感光体用基体を用いた電子写真感光体及び該電子写真感光体を搭載した電子写真装置の構成例について説明する。なお、電子写真装置は、狭義の意味での、後述する電子写真プロセスカートリッジを包含する。
【００６８】
図４は、本発明による電子写真感光体の層構成を模式的に表わす断面図であり、導電性の電子写真感光体用基体（以下単に基体とも称する）２１上に、下引き層２２を介して、電荷発生材料を主成分とする電荷発生層２３と、電荷輸送材料を主成分とする電荷輸送層４とが積層された構成をとっている。更に、図５は電荷輸送層２４の上に保護層２５を設けた構成になっている。
【００６９】
導電性基体（支持体）２１としては、体積抵抗１０^１０Ωｃｍ以下の導電性を示すもの、例えば、アルミニウム、ニッケル、クロム、ニクロム、銅、金、銀、白金などの金属、酸化スズ、酸化インジウムなどの金属酸化物を、蒸着又はスパッタリングにより、フィルム状もしくは円筒状のプラスチック、紙に被覆したもの、あるいは、アルミニウム、アルミニウム合金、ニッケル、ステンレス等の板及びそれらを押し出し、引き抜き等の工法で素管化後、切削、超仕上げ、研磨等で表面処理した管等を使用することができる。また、特開昭５２−３６０１６に開示されたエンドレスニッケルベルト、エンドレスステンレスベルトも導電性基体２１として用いることができる。
【００７０】
この他、上記基体上に導電性粉体を適当な結着樹脂に分散して塗工したものも、本発明の導電性基体２１として用いることができる。この導電性粉体としては、カーボンブラック、アセチレンブラック、また、アルミニウム、ニッケル、鉄、ニクロム、銅、亜鉛、銀等の金属粉或いは導電性酸化スズ、ＩＴＯ等の金属酸化物粉体等が挙げられる。また、同時に用いられる結着樹脂には、ポリスチレン、スチレン−アクリロニトリル共重合体、スチレン−ブタジエン共重合体、スチレン−無水マレイン酸共重合体、ポリエステル、ポリ塩化ビニル、塩化ビニル−酢酸ビニル共重合体、ポリ酢酸ビニル、ポリ塩化ビニリデン、ポリアリレート樹脂、フェノキシ樹脂、ポリカーボネート、酢酸セルロース樹脂、エチルセルロース樹脂、ポリビニルブチラール、ポリビニルホルマール、ポリビニルトルエン、ポリ−Ｎ−ビニルカルバゾール、アクリル樹脂、シリコーン樹脂、エポキシ樹脂、メラミン樹脂、ウレタン樹脂、フェノール樹脂、アルキッド樹脂等の熱可塑性、熱硬化性樹脂又は光硬化性樹脂が挙げられる。このような導電性層は、これらの導電性粉体と結着樹脂を適当な溶剤、例えば例えばＴＨＦ（テトラヒドロフラン）、ＭＤＣ（ジクロロメタン）、ＭＥＫ（メチルエチルケトン）、トルエン等に分散して塗布することにより設けることができる。更に、適当な円筒基体上にポリ塩化ビニル、ポリプロピレン、ポリエステル、ポリスチレン、ポリ塩化ビニリデン、ポリエチレン、塩化ゴム、テフロン（商標名）などの素材に前記導電性粉体を含有させた熱収縮チューブによって導電性層を設けてなるものも、本発明の導電性基体２１として良好に用いることができる。
【００７１】
導電性基体２１の加工方法としては、各種の切削加工、研削加工、研磨加工が可能であり、それらの加工法の組み合わせも有効である。
【００７２】
次に感光層について説明する。感光層は単層でも積層でもよいが、説明の都合上、まず電荷発生層２３と電荷輸送層２４から構成される場合から述べる。
【００７３】
電荷発生層２３は、電荷発生材料を主成分とする層である。電荷発生材料には、顔料、染料などの有機材料が用いられ、その代表例として、モノアゾ顔料、ジスアゾ顔料、トリスアゾ顔料、ペリレン系顔料、ペリノン系顔料、キナクリドン系顔料、キノン系縮合多環化合物、スクアリック酸系染料、フタロシアニン系顔料、ナフタロシアニン系顔料、アズレニウム塩系染料等が挙げられ用いられる。電荷発生材料は、単独であるいは２種以上混合して用いられる。
【００７４】
電荷発生層２３に用いられる結着樹脂としては、ポリアミド、ポリウレタン、エポキシ樹脂、ポリケトン、ポリカーボネート、シリコーン樹脂、アクリル樹脂、ポリビニルブチラール、ポリビニルホルマール、ポリビニルケトン、ポリスチレン、ポリスルホン、ポリ−Ｎ−ビニルカルバゾール、ポリアクリルアミド、ポリビニルベンザール、ポリエステル、フェノキシ樹脂、塩化ビニル−酢酸ビニル共重合体、ポリ酢酸ビニル、ポリフェニレンオキシド、ポリアミド、ポリビニルピリジン、セルロース系樹脂、カゼイン、ポリビニルアルコール、ポリビニルピロリドン等が挙げられる。結着樹脂の量は、電荷発生物質１００重量部に対し２０〜２００重量部、好ましくは５０〜１５０重量部が適当である。
【００７５】
ここで用いられる溶剤としては、例えばイソプロパノール、アセトン、メチルエチルケトン、シクロヘキサノン、テトラヒドロフラン、ジオキサン、エチルセルソルブ、酢酸エチル、酢酸メチル、ジクロロメタン、ジクロロエタン、モノクロロベンゼン、シクロヘキサン、トルエン、キシレン、リグロイン等が挙げられる。塗布液の塗工法としては、浸漬塗工法、スプレーコート、ビートコート、ノズルコート、スピナーコート、リングコート等の方法を用いることができる。電荷発生層２３の膜厚は０．０１〜５μｍ程度が適当であり、好ましくは０．１〜２μｍである。
【００７６】
電荷輸送層２４は、電荷輸送物質及び結着樹脂を適当な溶剤に溶解ないし分散し、これを電荷発生層２３上に塗布、乾燥することにより形成できる。また、必要により可塑剤、レベリング剤、酸化防止剤等を添加することもできる。レベリング剤としては、ジメチルシリコーンオイル、メチルフェニルシリコーンオイルなどのシリコーンオイル類や、側鎖にパーフルオロアルキル基を有するポリマーあるいはオリゴマーが使用され、その使用量は結着樹脂に対して０〜１重量％程度が適当である。
【００７７】
電荷輸送物質には、正孔輸送物質と電子輸送物質とがある。電子輸送物質としては、例えば、クロルアニル、ブロムアニル、テトラシアノエチレン、テトラシアノキノジメタン、２，４，７−トリニトロ−９−フルオレノン、２，４，５，７−テトラニトロ−９−フルオレノン、２，４，５，７−テトラニトロキサントン、２，４，８−トリニトロチオキサントン、２，６，８−トリニトロ−４Ｈ−インデノ［１，２−ｂ］チオフェン−４−オン、１，３，７−トリニトロジベンゾチオフェン−５，５−ジオキサイド、ベンゾキノン誘導体等の電子受容性物質が挙げられる。
【００７８】
正孔輸送物質としては、ポリ−Ｎ−カルバゾール及びその誘導体、ポリ−γ−カルバゾリルエチルグルタメート及びその誘導体、ピレン−ホルムアルデヒド縮合物及びその誘導体、ポリビニルピレン、ポリビニルフェナントレン、ポリシラン、オキサゾール誘導体、オキサジアゾール誘導体、イミダゾール誘導体、モノアリールアミン誘導体、ジアリールアミン誘導体、トリアリールアミン誘導体、スチルベン誘導体、α−フェニルスチルベン誘導体、ベンジジン誘導体、ジアリールメタン誘導体、トリアリールメタン誘導体、９−スチリルアントラセン誘導体、ピラゾリン誘導体、ジビニルベンゼン誘導体、ヒドラゾン誘導体、インデン誘導体、ブタジエン誘導体、ピレン誘導体等、ビススチルベン誘導体、エナミン誘導体等その他公知の材料が挙げられる。これらの電荷輸送物質は、単独で又は２種以上混合して用いられる。
【００７９】
結着樹脂としては、ポリスチレン、スチレン−アクリロニトリル共重合体、スチレン−ブタジエン共重合体、スチレン−無水マレイン酸共重合体、ポリエステル、ポリ塩化ビニル、塩化ビニル−酢酸ビニル共重合体、ポリ酢酸ビニル、ポリ塩化ビニリデン、ポリアリレート、フェノキシ樹脂、ポリカーボネート、酢酸セルロース樹脂、エチルセルロース樹脂、ポリビニルブチラール、ポリビニルホルマール、ポリビニルトルエン、ポリ−Ｎ−ビニルカルバゾール、アクリル樹脂、シリコーン樹脂、エポキシ樹脂、メラミン樹脂、ウレタン樹脂、フェノール樹脂、アルキッド樹脂等の熱可塑性又は熱硬化性樹脂が挙げられる。
【００８０】
電荷輸送物質の量は、結着樹脂１００重量部に対し、２０〜３００重量部、好ましくは４０〜１５０重量部が適当である。また、電荷輸送層の膜厚は、５〜５０μｍ程度とすることが好ましい。
【００８１】
ここで用いられる溶剤としては、テトラヒドロフラン、ジオキサン、トルエン、ジクロロメタン、モノクロロベンゼン、ジクロロエタン、シクロヘキサノン、メチルエチルケトン、アセトンなどが挙げられる。
【００８２】
また、電荷輸送層には電荷輸送物質としての機能と、バインダー樹脂の機能をもった高分子電荷輸送物質も良好に使用される。これら高分子電荷輸送物質から構成される電荷輸送層は、耐摩耗性に優れたものである。高分子電荷輸送物質としては、公知の材料が使用できるが、トリアリールアミン構造を主鎖及び／又は側鎖に含むポリカーボネートが良好に用いられる。例えば、特開２０００−１０３９８４の（１）〜（１０）式で表わされる高分子電荷輸送物質が良好に用いられる。
【００８３】
また、本発明において、電荷輸送層２４に可塑剤やレベリング剤を添加してもよい。可塑剤としては、ジブチルフタレート、ジオクチルフタレートなど一般の樹脂の可塑剤として使用されているものがそのまま使用でき、その使用量としては結着樹脂に対して０〜３０重量％程度が適当である。レベリング剤としては、ジメチルシリコーンオイル、メチルフェニルシリコーンオイルなどのシリコーンオイル類や、側鎖にパーフルオロアルキル基を有するポリマーあるいはオリゴマーが使用され、その使用量は結着樹脂に対して０〜１重量％程度が適当である。
【００８４】
本発明における電子写真感光体には、図４、図５に示すように、導電性基体２１と感光層（２３、２４）との間に下引き層２２を設けることができる。下引き層２２は一般には樹脂を主成分とするが、これらの樹脂はその上に感光層を溶剤で塗布することを考えると、一般の有機溶剤に対して耐溶剤性の高い樹脂であることが望ましい。このような樹脂としては、ポリビニルアルコール、カゼイン、ポリアクリル酸ナトリウム等の水溶性樹脂、共重合ナイロン、メトキシメチル化ナイロン等のアルコール可溶性樹脂、ポリウレタン、メラミン樹脂、フェノール樹脂、アルキッド−メラミン樹脂、エポキシ樹脂等、三次元網目構造を形成する硬化型樹脂などが挙げられる。
【００８５】
また、下引き層２２にはモアレ防止、残留電位の低減等のために、酸化チタン、シリカ、アルミナ、酸化ジルコニウム、酸化スズ、酸化インジウム等で例示できる金属酸化物の微粉末を加えてもよい。これらの下引き層２２は、前述の感光層の場合と同様、適当な溶媒、塗工法を用いて形成することができる。
【００８６】
さらに、本発明における下引き層２２として、シランカップリング剤、チタンカップリング剤、クロムカップリング剤等を使用することもできる。この他、下引き層２２にはＡｌ_２Ｏ_３を陽極酸化にて設けたものや、ポリパラキシリレン（パリレン）等の有機物や、ＳｉＯ_２、ＳｎＯ_２、ＴｉＯ_２、ＩＴＯ、ＣｅＯ_２等の無機物を真空薄膜作製法にて設けたものも良好に使用できる。この他にも公知のものを用いることができる。下引き層２２の膜厚は０〜５μｍが適当である。
【００８７】
図５に示すように、本発明の電子写真感光体には、感光層保護の目的で、保護層２５を感光層の上に設けることもある。保護層２５に使用する材料としては、ＡＢＳ樹脂、ＡＣＳ樹脂、オレフィン−ビニルモノマー共重合体、塩素化ポリエーテル、アリル樹脂、フェノール樹脂、ポリアセタール、ポリアミド、ポリアミドイミド、ポリアクリレート、ポリアリルスルホン、ポリブチレン、ポリブチレンテレフタレート、ポリカーボネート、ポリエーテルスルホン、ポリエチレン、ポリエチレンテレフタレート、ポリイミド、アクリル樹脂、ポリメチルペンテン、ポリプロピレン、ポリフェニレンオキシド、ポリスルホン、ポリスチレン、ＡＳ樹脂、ブタジエン−スチレン共重合体、ポリウレタン、ポリ塩化ビニル、ポリ塩化ビニリデン、エポキシ樹脂等の樹脂が挙げられる。保護層２５にはその他、耐摩耗性を向上する目的で、ポリテトラフルオロエチレンのような弗素樹脂、シリコーン樹脂及びこれら樹脂に酸化チタン、酸化スズ、チタン酸カリウム等の無機材料を分散したもの等を添加することができる。
【００８８】
保護層２５の形成方法としては、通常の塗布法が採用される。なお、保護層２５の厚さは、０．１〜７μｍ程度が適当である。また、以上の他に真空薄膜作製法にて形成したａ−Ｃ、ａ−ＳｉＣなど公知の材料も保護層２５として用いることができる。
【００８９】
本発明においては、感光層（２３、２４）と保護層２５との間に中間層を設けることも可能である。中間層には、一般にバインダー樹脂を主成分として用いる。これら樹脂としては、ポリアミド、アルコール可溶性ナイロン、水酸化ポリビニルブチラール、ポリビニルブチラール、ポリビニルアルコールなどが挙げられる。中間層の形成法としては、前述のごとく通常の塗布法が採用される。なお、中間層の厚さは０．０５〜２μｍ程度が適当である。
【００９０】
次に、上記電子写真感光体を搭載した本発明による電子写真装置について説明する。
図６は、該電子写真装置の一例を模式的に説明する概略図であり、下記するような変形例も本発明の範疇に属するものである。
図６に示す電子写真装置は、ドラム状の電子写真感光体３１のまわりに、帯電機構３２、露光光源３３、現像機構３４、転写機構３５、クリーニング機構３７が配置されている。転写機構３５において、転写材３８にはトナーが転写され、これは定着機構３６で定着される。
【００９１】
上記の電子写真装置を使用した電子写真方法においては、電子写真感光体３１は、反時計方向に回転して、帯電機構３２で正又は負に帯電され、露光光源３３からの露光によって、静電潜像を電子写真感光体３１上に形成する。
【００９２】
帯電機構３２には、コロトロン、スコロトロン、固体帯電器（ソリッドステートチャージャ）、帯電ローラなどをはじめとする公知の帯電手段を用いることができる。転写機構３５には、一般の帯電器が使用できるが、転写チャージャと分離チャージャを併用したものが効果的である。
【００９３】
また露光光源３３、及び図示されていないが、除電光源等で使用する光源としては、蛍光灯、タングステンランプ、ハロゲンランプ、水銀灯、ナトリウム灯、発光ダイオード（ＬＥＤ）、半導体レーザー（ＬＤ）、エレクトロルミネッセンス（ＥＬ）等の発光物を使用することができる。そして、所望の波長域の光のみを照射するために、シャープカットフィルター、バンドパスフィルター、近赤外カットフィルター、ダイクロイックフィルター、干渉フィルター、色温度変換フィルターなどの各種フィルターを用いることもできる。かかる光源等は、図６に図示した構成の他に、光照射を併用した転写工程、除電工程、クリーニング工程、或いは前露光等の工程を設けることにより、感光体に光が照射される際にも用いることができる。
【００９４】
感光体に正又は負の帯電を施して画像露光を行った場合、感光体上には正又は負の静電潜像が形成される。これを負又は正に帯電した極性のトナー（検電微粒子）で現像すればポジ画像が得られるし、逆に正又は負に帯電した極性のトナーで現像すればネガ画像が得られる。かかる現像には、公知の方法を適用することができ、また除電手段にも公知の方法が用いられる。
【００９５】
この例においては、導電性基体はドラム状のものとして示されているが、シート状、エンドレスベルト状のものを使用することができる。クリーニング前チャージャとしては、コロトロン、スコロトロン、固体帯電器（ソリッドステートチャージャ）、帯電ローラなどをはじめとする公知の帯電手段を用いることができる。
また転写チャージャ及び分離チャージャには、通常上記の帯電手段を使用することができる。
クリーニング機構には、ファーブラシ、マグファーブラシなどをはじめとする公知のブラシやポリウレタン製ブレードを使用することができる。
【００９６】
以上に示すような電子写真装置に代表される本発明の画像形成手段は、複写装置、ファクシミリ、プリンタなどの装置内に固定して組み込まれていてもよいが、プロセスカートリッジの形でそれら装置内に組み込まれてもよい。プロセスカートリッジとは、感光体を内蔵し、他に帯電手段、露光手段、現像手段、転写手段、クリーニング手段、除電手段などを含んだ一つの装置（部品）である。プロセスカートリッジの形状等は多く挙げられるが、一般的な例として図７に示すものが挙げられる。
【００９７】
図７に本発明による電子写真用プロセスカートリッジを示す。
図７において、３１は電子写真感光体、３２は帯電手段、３３は画像露光光源、３４は現像手段、３５は転写手段、３８は紙等の転写材、３６は定着機構、３７はクリーニング機構、３９はプロセスカートリッジの容器を示す。
【００９８】
この図は一構造例を示したものであり、各手段は図に示した以外の形態でも良い。
例えば、帯電手段３２はコロトロン、スコロトロン、帯電ロール等の公知の帯電手段が使用可能である。
画像露光、及び図示されていない前露光光の光源には、蛍光燈、タングステンランプ、ハロゲンランプ、水銀灯、ナトリウム灯、発光ダイオード（ＬＥＤ）、半導体レーザー（ＬＤ）、エレクトロルミネッセンス（ＥＬ）などの発光手段を使用することができる。
また、所定の波長域の光のみを照射するために、シャープカットフィルター、バンドパスフィルター、近赤外カットフィルター、ダイクロックフィルター、干渉フィルター、色温度変換フィルターなどの各種フィルターが使用可能である。クリーニング機構３７は、クリーニングブレードだけで行われることもあり、クリーニングブラシ、もしくはブレードと併用されることもある。
図７に示すプロセスカートリッジにおいて、クリーニング手段等がプロセスカートリッジに含まれなくても良い。また、図では内蔵していない発光手段や転写手段をプロセスカートリッジに内蔵していても良い。
【００９９】
次に本願第２の発明について説明する。
本願第２の発明は、画像形成装置用部品の切削加工において、切削工具又は切削工具の取り付け治具に振動センサーを取り付け、切削加工時に、該振動センサーにより切削工具の振動を計測し、この計測信号から切削加工面に対応する二次元配列データーを作成し、この二次元配列データーを評価するか、又はこの二次元配列データーの信号解析を行って評価することにより、切削加工状態を把握しながら切削加工を行うことを特徴とするものである。
【０１００】
本願第２の発明では、切削時に切削工具（例えばバイト）の振動データーを計測し、計測して得た一次元データーを被加工物の表面に対応する二次元データーとして配列する。この二次元データーには、切削加工時の被加工物の１回転に１回しか発生しないような発生頻度の少ない変異であっても、特定の箇所には変異の発生が集中するので、検出が容易となる。
【０１０１】
図８は本発明を実施するのに好適な旋盤とバイト振動データーの処理装置の構成図である。図８において、４１は被加工物、４２はバイト取り付け部である。バイト取り付け部４２には振動センサー（図示せず）が取り付けられており、その信号は４３のケーブルで４４のバイトの信号を処理する信号処理装置に伝えられる。そして、４５は被加工物４１を回転させるモーター、４６はバイトを載せた台を左右に動作させるモーターである。
【０１０２】
図９はバイトの振動信号データーから本発明の請求項１６、請求項１７に示す二次元データーを作成する過程の図であり、Ｉはバイトの振動信号のデーターである。Ｉにおいて、ｎの部分はｎ回転目、ｎ＋１の部分はｎ＋１回転目、ｎ＋２の部分はｎ＋２回転目、ｎ＋３の部分はｎ＋３回転目であり、このデーターが連続している。
図９のＩＩはＩのデーターを１回転ごとに並べた図であり、このように二次元データーが作成される。
図９のＩＩＩはＩＩを二次元配列にしたデーターであり、１行目はｎ回転目、２行目はｎ＋１回転目、３行目はｎ＋２回転目、４行目はｎ＋３回転目であり、以降このデーターが連続する。
【０１０３】
次に、本願第２の発明における信号処理方法を説明する。
始めに二次元フーリエ変換による方法から説明する。画像のｘ軸方向の空間周波数をω_ｘ、軸方向の空間周波数をω_ｙとする。この場合、二次元フーリエ変換は（数６）で求まる。
【数６】

ただし、実際の画像データーの場合は離散二次元フーリエ変換となる。
【０１０４】
画像データーマトリックスを二次元フーリエ変換する場合、マトリックスの行と列の点数は同じであることが好ましい。また、マトリックスの行と列の点数は２の階乗であることが好ましく、５１２以上が良い。データー点数が２の階乗でなくともフーリエ変換は可能であるが、フーリエ変換の計算速度が低下するので好ましくない。データー点数が２の階乗でない場合は、２の階乗になるように０の列あるいは行を入れて２の階乗になるようにすることが好ましい。
【０１０５】
次に本願第２の発明で用いるウェーブレット変換による方法を説明するが、一次元ウェーブレット変換については、第１の発明で説明したものと同じであるので重複説明を避けるため、その説明は省略する。
【０１０６】
一次元ウェーブレット変換は第１の発明で説明したと同様に行うが、二次元ウェーブレット変換は二次元データーに対して縦方向と横方向（列方向と行方向）に行うことで求めることができる。
【０１０７】
図１０は離散二次元ウェーブレット変換を行った場合のフローであり、元データーＳ_０は低周波成分Ｌ_１、縦方向高周波成分Ｖ_１、横方向高周波成分Ｈ_１、斜め方向高周波成分Ｔ_１に分けられる。このようにして得た低周波成分Ｌ_１を同様にしてウェーブレット変換することにより、低周波成分Ｌ_２、縦方向高周波成分Ｖ_２、横方向高周波成分Ｈ_２、斜め方向高周波成分Ｔ_２に分けられる。同様にして低周波成分をウェーブレット変換してゆき、低周波成分Ｌ_ｎ、縦方向高周波成分Ｖ_ｎ、横方向高周波成分Ｈ_ｎ、斜め方向高周波成分Ｔ_ｎを得ることができる。
【０１０８】
ここで、離散二次元ウェーブレット変換を行う場合、変換する画像のサイズは作成した二次元画像マトリックスを一度に行う必要はなく、分割して処理しても良い。
【０１０９】
本願第２の発明において、被評価面を測定して、その二次元画像データーマトリックスを作成し、ウェーブレット変換するが、ウェーブレット変換は二次元画像データーマトリックスのデーターがすべて揃ってから行う必要は無く、二次元画像データーマトリックスの作成を行いつつ、マトリックスが用意できた部分についてのウェーブレット変換を行っても良い。
【０１１０】
同様に、フーリエ変換も、二次元画像データーマトリックスのデーターがすべて揃ってから行う必要は無く、二次元画像データーマトリックスの作成を行いつつ、マトリックスが用意できた部分についての二次元フーリエ変換を行っても良い。
【０１１１】
本願第２の発明において、二次元画像データーマトリックスの作成、ウェーブレット変換、フーリエ変換は各種の手段で実施可能であり、例えば、マイクロプロセッサー、ＤＳＰ（デジタルシグナルプロセッサ）、ＡＳＩＣ、あるいは専用ＩＣやＬＳＩが使用可能である。例えばソフトウェアで行う場合、ｍａｔｈｅｍａｔｉｃａではウェーブレット変換を行うパッケージで可能であるＷａｖｅｌｅｔ　Ｅｘｐｌｏｒｅを用いることによって計算できる。また、ＭＡＴＬＡＢではウェーブレット変換を行うパッケージ（Ｗａｖｅｌｅｔ　Ｔｏｏｌ　Ｂｏｘ）を用いて計算できる。また、Ｃ言語等でプログラミングしても計算が可能であり、専用の数値演算プロセッサーによっても計算が可能である。本発明者の検討ではＣ＋＋言語で作成したプログラムで計算した。
【０１１２】
本願第２の発明における画像形成装置用部品として典型的なものは電子写真感光体用基体であるが、このような基体としてはアルミニウム又はアルミニウム合金が好ましく使用される。具体的にはＡ１１００、Ａ３０３０、Ａ６０６３合金が特に好ましく使用される。このような基体は切削加工を施した後、陽極酸化や化成処理を施してもよい。
【０１１３】
本願第２の発明による電子写真感光体及び電子写真装置としては、好ましく適用される基体を除き、第１の発明で説明したものと同様であるので、その説明は省略する。
本願請求項１〜９の発明において、演算処理の結果はコンピューターによる比較処理でも良く、あるいは演算処理結果を印字出力するかあるいは画面出力し、その出力を人間が見て判断しても良い。
【０１１４】
【実施例】
以下、本発明を実施例及び比較例により詳細に説明する。
【０１１５】
＜第１の発明＞
先ず、実施例及び比較例で測定対象とする電子写真感光体用基体の作成法と、その基体から電子写真感光体を作成する方法を説明し、次に作成した電子写真感光体の画像評価結果を説明する。そして、本発明による測定を実施例と比較例で説明し、この測定結果と画像評価結果を照合して本発明の効果を検証する。以下順に説明してゆく。
【０１１６】
（測定試料の用意）
本発明に従う測定を行う試料として、切削加工で３条件の加工を行い、電子写真感光体用基体３種を作成した。また、センタレス研削加工で２条件の加工を行い、電子写真感光体用基体２種を作成した。以下その条件を示す。
【０１１７】
測定試料Ａ：アルミニウム合金ＪＩＳ規格Ａ６０６３材をポートホール押出し法により外径φ３０．２ｍｍ、内径φ２８．５ｍｍのパイプ状に連続押出しし、それを長さ２５４ｍｍにカットして円筒シリンダーとした。この管を昌運社製旋盤でＲバイトを使用して外径３０．０ｍｍに切削加工した。このようにして作製した電子写真感光体用基体を測定試料Ａとする。この基体の表面粗さを測定したところ、１０本測定し、平均でＲｚは１．６２であった。
【０１１８】
測定試料Ｂ：アルミニウム合金ＪＩＳ規格Ａ６０６３材をポートホール押出し法により外径φ３０．２ｍｍ、内径φ２８．５ｍｍのパイプ状に連続押出しし、それを長さ２５４ｍｍにカットして円筒シリンダーとした。この管を昌運社製旋盤で測定試料Ａ切削時とは異なるＲフラットバイトを使用して外径３０．０ｍｍに切削加工した。このようにして作製した電子写真感光体用基体を測定試料Ｂとする。この基体の表面粗さを測定したところ、１０本測定し、平均でＲｚは１．３１であった。
【０１１９】
測定試料Ｃ：バイトが摩滅したＲバイトを使用した以外は測定試料Ａと同様な方法で切削加工した。このようにして作製した電子写真感光体用基体を測定試料Ｃとする。この基体の表面粗さを測定したところ、１０本測定し、平均でＲｚは１．５５であった。
【０１２０】
測定試料Ｄ：アルミニウム合金ＪＩＳ規格Ａ６０６３材をポートホール押出し法により外径φ３０．２ｍｍ、内径φ２８．５ｍｍのパイプ状に連続押出しし、それを長さ２５４ｍｍにカットして円筒シリンダーとした。この管をミクロン精機製センタレス研削盤で粗センタレス研削を行った後、仕上げンタレス研削を行って外径３０．０ｍｍに加工した。センタレス研削条件は以下に示す。このようにして作製した電子写真感光体用基体を測定試料Ｄとする。この基体の表面粗さを測定したところ、１０本測定し、平均でＲｚは２．７８であった。
【０１２１】
（粗センタレス加工）
研削輪の粒度　　　　８００メッシュ
研削輪の砥粒材質　　炭化珪素質（ＳｉＣ）
研削輪の回転数　　　１２５０ｒｐｍ
粗研削送り速度　　　０．００７６ｍｍ／秒
（仕上げセンタレス加工）
研削輪の粒度　　　　１０００メッシュ
研削輪の砥粒材質　　炭化珪素質（ＳｉＣ）
研削輪の回転数　　　１２５０ｒｐｍ
仕上げ研削送り速度　０．００２２ｍｍ／秒
【０１２２】
測定試料Ｅ：アルミニウム合金ＪＩＳ規格Ａ６０６３材をポートホール押出し法により外径φ３０．２ｍｍ、内径φ２８．５ｍｍのパイプ状に連続押出しし、それを長さ２５４ｍｍにカットして円筒シリンダーとした。この管を測定試料Ｃと同様にしてセンタレス研削を行って外形３０．０ｍｍに加工した。ここで、仕上げ研削に使用した研削輪は目詰まりを起こしていた。このようにして作製した電子写真感光体用基体を測定試料Ｅとする。この基体の表面粗さを測定したところ、１０本測定し、平均でＲｚは１．７１であった。
【０１２３】
（電子写真感光体の作成）
次に測定試料Ａ〜Ｅから電子写真感光体を以下の手順で作成した。
（１）洗浄
測定試料Ａ〜Ｅの基体を、ジェット水流を用いた水洗浄装置にて洗浄し、表面に付着しているオイル分を除去した。その際、界面活性剤として、常盤化学（株）のケミコールＣ（商品名）及び超音波発振機を併用し、ジェット洗浄後に純水にて再洗浄して界面活性剤を完全に除去してから乾燥を行った。
（２）下引き層の形成
次いで、この基体面に下記の組成からなる樹脂塗料を浸漬法で塗布し、次いで１５０℃で１５分間加熱し、熱硬化させて、基体面に厚さ５μｍの下引き層を形成させた。
酸化チタン　　　　　　　　　　　　　　２０　重量部
アルキッド樹脂　　　　　　　　　　　　１０　重量部
メラミン樹脂　　　　　　　　　　　　　１０　重量部
メチルエチルケトン　　　　　　　　　　６０　重量部
（３）電荷発生層の形成
次いで、この下引き層上に、電荷発生層を積層形成するために下記の組成からなる樹脂塗料（塗工樹脂液）を調製し、上記基体に同じく浸漬法でこの樹脂塗料を塗布し、１００℃で１０分間乾燥し、下引き層上に電荷発生層を積層形成させた。
ブチラール樹脂（ＵＣＣ社製ＸＹＨＬ）　　　　１重量部
ジスアゾ顔料［下記（１）式］　　　　　　　　９重量部
シクロヘキサノン　　　　　　　　　　　　　３０重量部
テトラヒドロフラン（ＴＨＦ）　　　　　　　３０重量部
【化１】

（４）電荷輸送層の形成
さらに、この電荷発生層上に電荷輸送層を積層形成するために下記の組成からなる樹脂塗料（塗工樹脂液）を調製し、上記基体に同じく浸漬法でこの樹脂塗料を塗布し、塗布後１２０℃で１５分間乾燥し、電荷発生層上に電荷輸送層を積層形成させた。
ポリカーボネート樹脂　　　　　　　　　　１０重量部
電荷移動剤［下記（２）式］　　　　　　　１０重量部
ジクロロメタン　　　　　　　　　　　　　８０重量部
なお、ポリカーボネート樹脂は帝人社製のパンライトＫ−１３００を使用した。
【化２】

【０１２４】
このようにして測定試料Ａの基体から電子写真感光体Ａを作成した。また、測定試料Ｂの基体から電子写真感光体Ｂを作成した。同様にして電子写真感光体Ｃ，Ｄ、Ｅを作成した。
【０１２５】
（画像評価）
作成した電子写真感光体Ａ〜Ｅを図６に示す電子写真装置に取り付け、画像評価を行った。その結果を表１に示す。表１から判るように切削加工法で作成したＡ、Ｂ、ＣではＡが優れており、本発明の目的とする基体評価でＡとＢ、Ｃの判別ができれば良いことになる。また、センタレス加工法で作成したＤ、ＥではＤが優れており、同上に本発明の目的とする基体評価でＤとＥの区別が出来れば良いことになる。
【０１２６】
【表１】

【０１２７】
画像評価で上のような結果が出たが、本発明の効果を検証するために測定試料Ａ〜Ｅの基体の評価を行った。この実施例と比較例を以下に説明する。
【０１２８】
［実施例１］
測定試料Ａ〜Ｅを図１に示した装置で表面粗さを測定し、得た断面曲線データーのウェーブレット変換を行った。
実施例１の測定例として、測定試料Ａの断面曲線を図１１に、そのウェーブレット変換を行った結果を図１２に示す。また、測定試料Ｄの断面曲線を図１３に、そのウェーブレット変換を行った結果を図１４に示す。
【０１２９】
［実施例２］
測定試料Ａ〜Ｅを図１に示した装置で表面粗さを測定し、得た断面曲線データーをウェーブレット変換し、その結果のスカログラム（ｓｃａｒｏｇｒａｍ）を求めた。
実施例２の測定例として、測定試料Ａの元データーとそのスカログラムを図１５に示す。また、試料Ｄの元データーとそのスカログラムを図１６に示す。
【０１３０】
［実施例３］
測定試料Ａ〜Ｅを図１に示した装置で表面粗さを測定し、得た断面曲線データーを短時間フーリエ変換した。
【０１３１】
［実施例４］
測定試料Ａ〜Ｅを図１に示した装置で表面粗さを測定し、得た断面曲線データーのウィグナー分布を求めた。
実施例４の測定例として、測定試料Ａのウィグナー分布を図１７に、更にそれを三次元表示した図を図１８に示す。また、測定試料Ｄのウィグナー分布を図１９に、更にそれを三次元表示した図を図２０に示す。
【０１３２】
［比較例１］
測定試料Ａ〜Ｅの表面粗さをＪＩＳ　Ｂ０６０１に示す方法で行い、断面曲線を得た。
【０１３３】
［比較例２］
比較例１で求めた断面曲線のフーリエ変換を行った。
【０１３４】
実施例１〜４、比較例１、２の評価結果を表２に示す。ここで、表２において、実施例１〜４はコンピューターで測定試料Ａ、Ｂ、Ｃの測定結果を演算処理した結果を更にコンピューターで比較した結果である。
【０１３５】
【表２】

【０１３６】
以上の結果から、本願第１の発明による方法によって、切削加工法で作成した測定試料Ａ、Ｂ、Ｃ間の差を検出できた。また、センタレス研削法で作成した測定試料Ｄ、Ｅの差を検出できたので、本発明の効果を検証できた。
＜第２の発明＞
【０１３７】
［実施例５］
Ａ３００３アルミニウム合金を押し出し加工で作成した外径３０．５ｍｍ、内径２８．５ｍｍ、長さ３４０ｍｍのアルミニウム合金を図８に示す旋盤に取り付けた。
旋盤に取り付けたアルミニウム合金管を５０００ｒｐｍで回転させつつ、バイトには５ｍｍの焼結ダイヤモンド製バイトを使用し、灯油を噴霧しながら、バイト送り速度５０ｍｍ／ｓｅｃで切削加工を行い、このときの振動を測定した。このとき、振動センサーのサンプリング周波数は８０ＫＨｚで行った。振動を検出した信号をＡ／Ｄ変換し、ＩＢＭ社製パーソナルコンピューターに取り込んで、切削表面に対応した二次元データーを作成した。このデーターは数値のマトリックスなので、視認しやすいように画像データーに変換した結果の例を図２１で示す。図２１で判るように、縞状パターンが確認できた。
ここで、バイトを先端が摩滅したバイトに交換し、切削ビビリが発生気味にして切削を行い、切削振動データーから同様にして画像を作成したところ、ビビリに対応した大きく、濃い縞が確認できた。また、切削加工時の巣と思われる信号の変異も確認できた。その様子を図２２に拡大図として示す。
【０１３８】
［実施例６］
実施例５と同様にして切削加工を行い、切削振動を取り込んで二次元データーを作成した。この二次元データーを二次元フーリエ変換した結果を図２３に示す。また、これを三次元表示した結果を図２４に示す。
バイトを研磨不良のバイトに交換し、切削スジが発生するようにして切削を行い、このときの振動を取り込んで二次元データーを作成し、この二次元データーを二次元フーリエ変換した。その結果にはスジによると思われる低い周波数成分が確認できた。
【０１３９】
［実施例７］
実施例５と同様にして切削加工を行い、切削振動を取り込んで二次元データーを作成した。次に、この二次元データーの二次元離散ウェーブレット変換を行った。このウェーブレット変換ではドビッシー関数を使用した。この結果を図２５に示す。
次に、バイトを先端が摩滅したバイトに交換し、切削ビビリが発生気味にして切削を行い、切削振動データーから同様にして二次元データーを作成し、更にこれを同様にウェーブレット変換したところ、ウェーブレット変換結果にはビビリに対応した縞が確認できた。このウェーブレット変換ではコフィレット関数を使用した。
【０１４０】
［実施例８］
実施例５と同様にして切削加工を行い、切削振動を取り込んで二次元データーを作成した。次に、この二次元データーの二次元離散ウェーブレット変換を行った。このウェーブレット変換ではドベシィ関数を使用した。
次に、バイトを研磨不良のバイトに交換し、切削スジが発生するようにして切削を行い、このときの振動を取り込んで二次元データーを作成し、更にこれを同様にウェーブレット変換したところ、ウェーブレット変換結果には切削スジに対応したと思われる縞が確認できた。
【０１４１】
［比較例３］
実施例５と同様にして切削加工を行い、切削振動を取り込んで一次元データーを作成した。この一次元データーをフーリエ変換した。
次に、バイトを研磨不良のバイトに交換し、切削スジが発生するようにして切削を行い、このときの振動を取り込んで一次元データーを作成し、この一次元データーをフーリエ変換した。この二つのフーリエ変換結果を比較したが、差は認められなかった。
【０１４２】
［比較例４］
実施例５と同様にして切削加工を行い、切削振動を取り込んで一次元データーを作成した。この一次元データーの一次元離散ウェーブレット変換を行った。次に、バイトを研磨不良のバイトに交換し、切削スジが発生するようにして切削を行い、このときの振動を取り込んで一次元データーを作成し、この一次元データーの一次元離散ウェーブレット変換を行った。この二つのウェーブレット変換結果を比較したが、差は認められなかった。
【０１４３】
【発明の効果】
本願第１の発明によれば、従来の表面粗さ評価方法すなわちＲｚ、Ｒａ、Ｒｍａｘでは把握できなかった測定対象面の局所的な変化や微細な変異も把握可能となり、画像異常が発生することが無く、均質で高画質な画像を形成できる画像形成装置を提供することができる。
本願第２の発明によれば、画像形成装置用部品、特に、アルミニウムあるいはアルミニウム合金製管の切削加工において、切削加工の状態を精度良く把握し、切削不良や切削異常の発生を検知しながら切削加工を行うことができるので、良好な品質の切削面を有する画像形成装置用部品、ひいては均質で高画質な画像を形成できる画像形成装置を提供することができる。
【図面の簡単な説明】
【図１】本発明を実施するのに好適な表面粗さ評価システムの構成図
【図２】ウェーブレット変換の処理フローの図
【図３】ウェーブレット変換の概念の図
【図４】電子写真感光体の層構成の図
【図５】電子写真感光体の別の層構成の図
【図６】電子写真装置の構成図
【図７】電子写真用装置用プロセスカートリッジの構成図
【図８】本発明を実施するのに適な切削加工システムの構成図
【図９】切削加工時に測定した振動データーから二次元データーを作成するフローの図
【図１０】二次元ウェーブレット変換の処理フロー図
【図１１】切削によって作成した基体の断面曲線の図
【図１２】図１１の断面曲線のデーターをウェーブレット変換によって多重解像度解析した結果の図
【図１３】図１１の断面曲線のデーターをウェーブレット変換して求めたスカログラムの図
【図１４】図１１の断面曲線のデーターのウィグナー分布を求めた図
【図１５】図１１の断面曲線のデーターのウィグナー分布の三次元表示の図
【図１６】切削によって作成した基体の断面曲線の図
【図１７】図１６の断面曲線のデーターをウェーブレット変換によって多重解像度解析した結果の図
【図１８】図１６の断面曲線のデーターをウェーブレット変換して求めたスカログラムの図
【図１９】図１６の断面曲線のデーターのウィグナー分布を求めた図
【図２０】図１６の断面曲線のデーターのウィグナー分布の三次元表示の図
【図２１】実施例５で作成した二次元データーを二次元濃度グラフで示した図
【図２２】実施例５で作成した二次元データーを二次元濃度グラフで示した図の部分拡大図
【図２３】図２１のデーターを二次元フーリエ変換した結果の図
【図２４】図２１のデーターを二次元フーリエ変換した結果を三次元表示した図
【図２５】図２１のデーターを離散二次元ウェーブレット変換した結果の図
【符号の説明】
１　測定対象
２　表面粗さを測定するプローブを取り付けた治具
３　上記治具を測定対象に沿って移動させる機構
４　表面粗さ計
５　信号解析を行うパーソナルコンピューター
１０　元信号
１１　ローパスフィルターを通過した信号
１２　ハイパスフィルターを通過した信号
１３　ローパスフィルターを通過した信号
１４　ハイパスフィルターを通過した信号
１５　ローパスフィルターを通過した信号
１６　ハイパスフィルターを通過した信号
２１　電子写真感光体用基体
２２　下引き層
２３　電荷発生層
２４　電荷輸送層
２５　保護層
３１　電子写真感光体
３２　帯電機構
３３　露光光源
３４　現像機構
３５　転写機構
３６　定着機構
３７　クリーニング機構
３８　転写材
３９　プロセスカートリッジのケース
４１　被加工物
４２　バイト取り付け台
４３　振動センサーからの信号を伝えるケーブル
４４　信号処理装置
４５　主軸駆動用モーター
４７　バイト取り付け台送り駆動用モーター[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a method and system for evaluating the surface roughness of a part for an image forming apparatus, and more particularly to a method for evaluating the surface roughness of a part for an image forming apparatus, which is suitable for evaluating the surface roughness of a substrate for an electrophotographic photosensitive member. And an evaluation system.
In addition, the present invention relates to a cutting method and a cutting processing system for a component for an image forming apparatus, and more particularly, to a cutting method and a cutting system suitable for being applied to surface processing of an electrophotographic photosensitive member substrate. .
[0002]
[Prior art]
When a coherent light source such as a laser is used as a writing light source in an electrophotographic apparatus, there is a problem that an image has interference fringes. The reason for this is that when coherent light enters the photosensitive layer, the amount of light contributing to image formation varies depending on the interference between the phase of the incident light and the phase of the reflected light. As a countermeasure, a method of roughening the surface of the base has been widely used. For example, in Japanese Patent Application Laid-Open No. H5-222437 (Electrophotographic Photoreceptor Substrate and Surface Treatment Method), fine frozen particles obtained by freezing water vapor are sprayed onto a gas surface to remove contaminants on the substrate surface, The surface of the substrate is roughened, and an electrophotographic photosensitive member formed using the substrate treated by this surface treatment method can prevent the formation of interference fringes due to laser light.
[0003]
As described above, the surface roughness of the substrate is important for image quality, but in the past, it was often measured and judged based on the surface roughness specified in JIS B0601, etc. Widely used measuring methods include arithmetic average roughness (Ra), maximum height (Rmax), and ten-point average roughness (Rz).
[0004]
For example, as an example of evaluating the surface of a substrate by this surface roughness measuring method, an aluminum cylinder produced by ironing or cold drawing in Japanese Patent Application Laid-Open No. 5-72785 (substrate for electrophotographic photosensitive member and method for producing the same). An aluminum cylindrical substrate for an electrophotographic photoreceptor, wherein the surface of the substrate has a streak in the axial direction of the substrate over the entire circumference, and an Rmax in the circumferential direction on the surface is 0.2 to 3 μm, and a method for producing the same. Has been proposed.
Japanese Patent Application Laid-Open No. 8-76395 (aluminum substrate for a photoconductor in an electrophotographic apparatus) is an aluminum substrate (substrate) for a photoconductor in an electrophotographic apparatus in which a light emitting diode is used as a light source, and has a surface roughness Rz of 0. A substrate defined to be 8 μm or less is proposed.
JP-A-6-138865 (electrophotographic photoreceptor) discloses an electrophotographic photoreceptor having at least a photosensitive layer and a surface protective layer on a conductive support (substrate), and a surface roughness Rz of the conductive support. Is set to 0.01 μm or more and 0.5 μm or less, and the surface roughness Rz of the surface protective layer is set to 0.2 μm or more and 1.2 μm or less.
[0005]
However, any of the above-described surface roughness measuring methods has a problem in that the surface roughness required as a measure against image interference fringes cannot be completely defined.
[0006]
Further, in the definition of the surface roughness Ra, Rz, etc., which has been conventionally used as the surface roughness expression method, there is a problem in that when there are peaks and valleys protruding within the measurement length, the calculated surface roughness becomes large. . To cope with such a problem, methods for defining the surface roughness by various methods have been studied. Next I will introduce it.
[0007]
In JP-A-7-104497, a partition width centered on an average line is defined on a cross-sectional curve obtained by measuring a surface shape with a surface roughness measuring device, and adjacent peaks and valleys exceeding the partition width are defined. The surface shape is evaluated based on the number of a pair of peaks per unit length, and a substrate having a partition width of 20 μm and a unit length of 1 cm and a peak number of 100 or less has been proposed by such a method. However, such a method is not sufficient as a method for evaluating surface roughness, and even if the above evaluation method has a sufficient value, an image abnormality may occur when a photoconductor is actually produced.
[0008]
Therefore, the present inventors have proposed a method of evaluating the surface roughness by performing Fourier transform in JP-A-2001-265014 and JP-A-2001-289630.
However, in the Fourier transform, a change that appears frequently in a cross-sectional curve can be regarded as its frequency distribution, but a more effective one has been desired for examining a change that occurs less frequently. That is, even if there are several sharp peaks and valleys in the cross-sectional curve, there is a problem that the Fourier transform hardly appears in the spectrum. In addition, there was a problem that it was not possible to know where the change occurred from the result of the Fourier transform. If there are several sharp peaks and valleys in the electrophotographic photosensitive member substrate, there is a problem that image defects occur, but they cannot be detected by the conventional method using surface roughness and the method using Fourier transform.
[0009]
Due to such a problem, conventionally, at the time of measuring the surface roughness, the recording chart of the surface roughness meter was stored and determined from the cutting waveform recorded in the recording chart. There was a problem that it had to be read and required skill.
[0010]
As described above, the conventional method for evaluating the surface roughness (Ra, Rmax, Rz) has a problem that local changes and variations on the surface to be measured cannot be accurately and accurately grasped.
Further, as described above, in the Fourier transform, a change appearing frequently in a signal can be grasped as its frequency distribution, but there is a problem that it is not effective for examining a change having a low frequency. In addition, there was a problem that it was not possible to know where the change occurred from the result of the Fourier transform.
[0011]
On the other hand, a photosensitive layer is provided on a rotating drum-shaped substrate for an electrophotographic photosensitive member (hereinafter abbreviated as “substrate” as appropriate), which is widely used in electrophotographic apparatuses such as electrophotographic copying machines, digital copiers, and laser printers. As a material for the substrate constituting the electrophotographic photosensitive member, an aluminum-based material is preferably used because of its advantages such as low cost, light weight, and ease of processing. The rotating drum-shaped substrate made of this aluminum-based material is generally finished by cutting the surface of a tubular material.
[0012]
Here, the cutting of the surface of the cylindrical body is performed by rotating the base and moving the cutting tool (blade) in the axial direction of the base to perform cutting, or by fixing the base and then surrounding the cutting tool (blade). There is a method of rotating and cutting.
The former method is introduced as a normal lathe in precision engineering course 11 cutting engineering published by Corona, for example. Japanese Patent No. 3215829, Japanese Patent No. 2795357, and 7-77814 and JP-A-8-276301.
The latter method is introduced in JP-A-6-328301 and JP-A-6-32830.
[0013]
In general, a lathe has a headstock for giving rotation to the workpiece, a tailstock for supporting the other end of the workpiece in opposition to this, and a reciprocating machine for attaching a cutting tool to give feed. There is a table (a tool post). Working conditions such as the angle of each part of the tool, cutting speed, feed, etc., when cutting a workpiece using a tool with such a lathe, include the chip generation mechanism, cutting resistance, cutting temperature, tool life, and surface finish of the cut surface. And chatter vibration.
[0014]
When manufacturing components used in an image forming apparatus by cutting, particularly a substrate for an electrophotographic photosensitive member, a good cut surface free of cutting chatter and cutting streaks is required.
Here, it is known that chatter vibration generated during cutting includes forced chatter vibration and self-excited chatter vibration. The cause of the forced chatter vibration is considered to be imbalance of the rotating body, vibration due to the structure of the lathe, and the like. It is considered that the self-excited chatter vibration is caused by the fluctuation of the cutting resistance and the vibration characteristics of the lathe, the cutting tool, and the material to be cut.
[0015]
As described above, since problems such as chattering and streaks occur in the cutting process, JP-A-8-336706, JP-A-9-29503, JP-A-9-80914, JP-A-9-192959, and JP-A-9-234639. A number of methods have been studied, such as JP-A-10-58212, JP-A-10-71501, and JP-A-11-188566. But none was perfect.
[0016]
As an evaluation method of an object generated due to such a trouble in the cutting process, Japanese Unexamined Patent Application Publication No. 10-267749, "Method of Diagnosing Abnormality in Cutting Process", describes an abnormality in which the cause of the abnormality in cutting process can be accurately specified from the vibration of the cutting tool. As a diagnostic method, a dimensional and dimensionless feature parameter X, an effective value Xrms, a peak value Xp, a crest factor C, a distortion degree β1, a sharpness β2, an intersection frequency No. The extreme value frequency Nm, the degree of steady state α, the degree of fluctuation ε, the primary and secondary average frequencies f1 and f2 are obtained under the recommended cutting conditions and the actual processing state, and these values are sampled about ten times and averaged. And a standard deviation, a discrimination index DI representing the difference between the two distributions is calculated, and the cause is specified by a combination of two or more outlier characteristic parameters of the discrimination index. However, this evaluation method has a problem that the processing is complicated and an abnormality cannot be diagnosed by itself.
[0017]
The quality required for the substrate of the electrophotographic photoreceptor is extremely high, and even if the above-described measures against chatter and streaks are taken, chatter and streaks may still occur. Therefore, several methods for inspecting the cut surface after cutting have been proposed.
[0018]
Japanese Patent Application Laid-Open No. H8-105732 “Grinding surface inspection device” is a device for easily and reliably determining whether or not chattering occurs on a grinding surface when an outer peripheral surface of a cylindrical member is ground. Then, while projecting light from the light projecting unit arranged above toward the grinding surface, and projecting the reflected light on the projection surface, if chatter occurs on the grinding surface, a stripe-shaped shadow is projected on the projection surface The presence or absence of the shadow is used to determine the presence or absence of chatter. However, with this method, although inspection after cutting can be performed, the state of cutting cannot be grasped during cutting.
[0019]
As described above, the conventional cutting cannot prevent sudden chatter or streaks from occurring, and there is a problem that it is difficult to detect during machining.
[0020]
[Problems to be solved by the invention]
Therefore, the present invention provides a method for measuring the surface roughness of a part for an image forming apparatus such as a substrate for an electrophotographic photoreceptor, which enables sensitive and accurate grasp of local changes and variations of a surface to be measured with high sensitivity. It is an object to provide an evaluation method and an evaluation system.
In addition, the present invention relates to an image forming apparatus component such as a substrate for an electrophotographic photoreceptor, in particular, a cutting process when preparing a substrate for an electrophotographic photoreceptor by cutting a tube made of aluminum or an aluminum alloy. Another object is to provide a cutting method and a cutting system capable of accurately grasping, detecting the occurrence of cutting abnormalities such as chatter and streaks with high accuracy, and producing a cut surface of good quality. And
[0021]
[Means for Solving the Problems]
According to the first invention of the present application, the above-mentioned problem is solved by the following technical means.
(1) A cross-sectional curve defined in JIS B0601 is obtained for the state of the surface of the component for an image forming apparatus, and a multiresolution analysis of a position data sequence in the surface roughness direction at equal intervals on the cross-sectional curve is performed. A method for evaluating the surface roughness of a component for an image forming apparatus, wherein the state of the surface roughness is evaluated based on the evaluation.
According to the present method, it is possible to detect a local change or variation in the cross-sectional curve that cannot be detected by the method using the surface roughness Rz, Ra, Rmax, or the like.
[0022]
(2) The method for evaluating the surface roughness of a component for an image forming apparatus according to (1), wherein the method of multi-resolution analysis is wavelet transform.
In this method, since the method of the multi-resolution analysis is the wavelet transform, the multi-resolution analysis can be performed quickly and accurately, and as a result, such a method cannot be detected by the method using the surface roughness Rz, Ra, Rmax, or the like. A local change or mutation in the cross-sectional curve can be detected.
[0023]
(3) The method for evaluating the surface roughness of a component for an image forming apparatus according to the above (1), wherein the method of the multi-resolution analysis is band-pass filter processing or short-time fast Fourier transform.
In this method, since the method of the multi-resolution analysis is based on the band-pass filter, the multi-resolution analysis can be performed quickly and accurately, and thus cannot be detected by the method using the surface roughness Rz, Ra, Rmax, or the like. Local changes and variations in such cross-sectional curves can be detected.
[0024]
(4) A cross-sectional curve defined in JIS B0601 is obtained for the state of the surface of the component for an image forming apparatus, and a Wigner distribution of a position data sequence in the surface roughness direction at equal intervals on the cross-sectional curve is obtained. A method for evaluating the surface roughness of a component for an image forming apparatus, wherein the state of the surface roughness is evaluated.
In the present method, the Wigner distribution is obtained and the state of the surface roughness is evaluated based on the result. Therefore, as described above, in the cross-sectional curve which cannot be detected by the method using the surface roughness Rz, Ra, Rmax, or the like. Certain local changes or mutations can be detected.
[0025]
(5) The method for evaluating the surface roughness of a component for an image forming apparatus according to any one of the above (1) to (4), wherein the component for an image forming apparatus is a substrate for an electrophotographic photosensitive member. According to the present method, a local change or variation in the cross-sectional curve, which cannot be detected by the method using the surface roughness Rz, Ra, Rmax, or the like, can be detected for the electrophotographic photosensitive member substrate.
[0026]
(6) The image as described in any of (1) to (4) above, wherein the component for an image forming apparatus is an electrophotographic photosensitive member having a coating layer formed on a substrate for an electrophotographic photosensitive member. A method for evaluating the surface roughness of a part for a forming apparatus.
In this method, the electrophotographic photosensitive member having the coating layer formed on the substrate for the electrophotographic photosensitive member has a cross-sectional curve which cannot be detected by the method using the surface roughness Rz, Ra, Rmax, or the like. Local changes and mutations can be detected.
[0027]
(7) The image forming apparatus according to any one of (1) to (4), wherein the component for the image forming apparatus is a charging roller, a developing roller, a fixing roller, a transfer belt, or a transport belt for an electrophotographic apparatus. Evaluation method for surface roughness of equipment parts.
In this method, a local portion in a cross-sectional curve which cannot be detected by a method using surface roughness Rz, Ra, Rmax, or the like is applied to a charging roller, a developing roller, a fixing roller, a transfer belt, or a transport belt for an electrophotographic apparatus. Changes and mutations can be detected.
[0028]
(8) The surface roughness evaluation method according to any one of (1) to (7) above, and a ten-point average roughness (Rz), an arithmetic average roughness (Ra), and a maximum height (Rmax) defined in JIS B0601. And e) evaluating the surface roughness of at least one of the components.
In the present method, similar to the above, it is possible to detect a local change or variation in the cross-sectional curve that could not be detected by a method based only on the surface roughness Rz, Ra, Rmax, or the like.
[0029]
(9) The surface roughness is determined by comparing the evaluation result of the surface roughness evaluation method according to any one of (1) to (8) with a predetermined reference. A method for evaluating the surface roughness of a component for an image forming apparatus.
In this method, since the evaluation information is determined by comparing it with a separately provided reference, accurate evaluation is possible.
[0030]
(10) A surface roughness measuring sensor for measuring the surface roughness of a component for an image forming apparatus, an electric circuit for amplifying a signal from the sensor, and a function of performing a wavelet transform on an electric signal output from the electric circuit. A surface roughness evaluation system for a component for an image forming apparatus, comprising: hardware or software having a feature; a surface roughness measurement sensor; and a mechanism for relatively moving an object to be measured.
In this system, the above evaluation method can be executed at high speed and accurately.
[0031]
(11) A surface roughness measuring sensor for measuring the surface roughness of a part for an image forming apparatus, an electric circuit for amplifying a signal from the sensor, and a band-pass filter processing of an electric signal output from the electric circuit. Or a hardware or software having a function of performing a short-time fast Fourier transform process, a surface roughness measuring sensor, and a mechanism for relatively moving an object to be measured; The evaluation system.
In the present system, the evaluation method can be executed at high speed and accurately, similarly to the above system.
[0032]
(12) A surface roughness measuring sensor for measuring the surface roughness of a component for an image forming apparatus, an electric circuit for amplifying a signal from the sensor, and a Wigner distribution of an electric signal output from the electric circuit. A surface roughness evaluation system for a component for an image forming apparatus, comprising: hardware or software having a function; a surface roughness measurement sensor; and a mechanism for relatively moving an object to be measured.
In the present system, the evaluation method can be executed at high speed and accurately, similarly to the above system.
[0033]
(13) A substrate for an electrophotographic photosensitive member, which is evaluated by the surface roughness evaluation method according to any one of (1) to (4) and (9).
Since the present electrophotographic photoreceptor substrate is evaluated by the above-described surface roughness evaluation method, it is possible to inspect fine variations and changes in the surface thereof, and therefore, it is possible to obtain a good image when used for the electrophotographic photoreceptor. Can be formed.
[0034]
(14) An electrophotographic photosensitive member evaluated by the surface roughness evaluation method according to any one of (1) to (4) and (9).
Since the present electrophotographic photoreceptor uses the electrophotographic photoreceptor substrate of (13), a good image can be formed.
[0035]
(15) An electrophotographic apparatus comprising the electrophotographic photosensitive member according to (14).
Since the electrophotographic apparatus uses the electrophotographic photosensitive member of (14), a good image can be formed.
[0036]
(16) Attach a vibration sensor to the cutting tool or a jig for attaching the cutting tool, measure the vibration of the cutting tool by the vibration sensor during cutting, and create two-dimensional array data corresponding to the cutting surface from the measurement signal. The two-dimensional array data is evaluated, or the signal analysis of the two-dimensional array data is performed for evaluation, whereby the cutting process is performed while grasping the cutting process state. Cutting method.
According to the present method, it is possible to detect a mutation or an abnormality that cannot be detected by the one-dimensional vibration of the cutting process. Therefore, the workpiece can be cut while accurately grasping the state of the cut surface, so that a high-quality workpiece can be obtained.
[0037]
(17) The method for cutting a component for an image forming apparatus according to (16), wherein the method of analyzing the created two-dimensional array data is a two-dimensional Fourier transform.
In the present method, since the analysis method of the two-dimensional array data is the two-dimensional Fourier transform, highly accurate evaluation is possible.
[0038]
(18) The method for cutting a component for an image forming apparatus according to (16), wherein the analysis method of the created two-dimensional array data is two-dimensional multi-resolution analysis. In this method, since the analysis method of the created two-dimensional array data is two-dimensional multi-resolution analysis, the two-dimensional data to be evaluated can be analyzed for each frequency range, and highly accurate evaluation can be performed.
[0039]
(19) The method according to (18), wherein the two-dimensional multi-resolution analysis method is a discrete two-dimensional wavelet transform.
In this method, since the analysis method of the two-dimensional array data is a discrete two-dimensional wavelet transform, high-speed and highly accurate evaluation is possible.
[0040]
(20) The two-dimensional data created by measuring the vibration is subjected to a discrete two-dimensional wavelet transform, and a part of the result of the discrete two-dimensional wavelet transform is removed or arithmetic processing is performed, and a two-dimensional wavelet inverse transform is performed. The method according to (19), wherein the result is analyzed and evaluated.
In this method, surplus and surplus information is removed by the inverse wavelet transform, and therefore, high-speed and high-accuracy evaluation is possible.
[0041]
(21) The method for cutting a part for an image forming apparatus according to (18), wherein the method of two-dimensional multi-resolution analysis is a method using a band-pass filter.
In this method, since the method of two-dimensional multi-resolution analysis of the created two-dimensional array data is a method using a band-pass filter, high-speed and highly accurate evaluation is possible.
[0042]
(22) The method according to (18), wherein the two-dimensional multi-resolution analysis method is a short-time fast Fourier transform.
In this method, since the method of the two-dimensional multi-resolution analysis of the created two-dimensional array data is the short-time fast Fourier transform, high-speed and highly accurate evaluation is possible.
[0043]
(23) The cutting method according to any one of (16) to (22), wherein the workpiece is aluminum or an aluminum alloy.
In this method, even if the material to be cut is aluminum or an aluminum alloy, the cutting method described in any of the above (16) to (22) is employed, so that highly accurate cutting evaluation can be performed. .
[0044]
(24) The cutting method according to any one of (16) to (23), wherein the workpiece is a substrate for an electrophotographic photosensitive member.
In this method, even if the workpiece is a substrate for an electrophotographic photosensitive member that requires high quality, the cutting method described in any of the above (16) to (23) is used. High cutting performance can be evaluated.
[0045]
(25) A lathe, a vibration sensor for detecting vibration of a cutting tool used in the lathe, and a storage device for recording signals from the vibration sensor or a storage for recording two-dimensional data created from signals from the vibration sensor. A cutting apparatus comprising: an apparatus; and hardware or software for performing a discrete two-dimensional wavelet transform.
According to the present apparatus, cutting according to the above (16) to (24) can be performed.
[0046]
(26) A substrate for an electrophotographic photosensitive member prepared by the cutting method according to any one of (16) to (24).
Since the electrophotographic photoreceptor substrate is prepared by the cutting method according to any one of the above (16) to (24), the substrate is a high-quality substrate free from poor cutting and abnormal cutting.
[0047]
(27) An electrophotographic photosensitive member using the electrophotographic photosensitive member substrate according to (26).
Since the electrophotographic photoreceptor uses the electrophotographic photoreceptor substrate of (26), the electrophotographic photoreceptor is a high-quality photoreceptor.
(28) An electrophotographic apparatus equipped with the electrophotographic photosensitive member according to (27).
Since the electrophotographic apparatus is equipped with the electrophotographic photosensitive member of (27), the electrophotographic apparatus is a high-quality electrophotographic apparatus.
[0048]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, the present invention will be described in detail.
First, the first invention of the present application will be described. In the surface roughness evaluation technique according to the first invention of the present application, a cross-sectional curve defined in JIS B0601 is obtained for the state of the surface of the component for an image forming apparatus, and a position data sequence in the surface roughness direction at equal intervals on the cross-sectional curve. Is performed, and the state of surface roughness is evaluated based on at least the result.
In the first invention of the present application, specifically, the components of the image forming apparatus are evaluated by the following method. First, the state of the surface to be evaluated is measured by a surface roughness meter to obtain a cross-sectional curve shown in JIS B0601. This cross-sectional curve can be regarded as a one-dimensional data array, that is, a one-dimensional signal. This can be obtained from a surface roughness meter as an analog or digital electrical signal.
[0049]
From the signal measured in this way, only frequency components to be measured are filtered as necessary. If the signal is an analog signal, A / D conversion is performed to convert the signal into a digital signal. When performing A / D conversion, it is performed with a resolution of at least 8 bits or more, preferably 10 bits or more. The A / D conversion speed may be appropriately selected according to the specifications of the system. Hundreds or tens of thousands of data digitized in this way are temporarily stored in a memory.
[0050]
Next, the data is subjected to multi-resolution analysis by various methods, or a Wigner distribution is obtained and evaluated. Multi-resolution analysis is a method of analyzing the time course of fluctuation while simultaneously analyzing the spectrum in the frequency domain. For example, it is described in "Wavelet Analysis" by Ryuichi Ashino and Norio Yamamoto, June 1997, published by Kyoritsu Shuppan. I have. In the present invention, the multi-resolution analysis can be performed by various methods, and as described in the claims, a process by a wavelet transform, a process by a band-pass filter, and a process by a short-time fast Fourier transform can be used.
[0051]
FIG. 1 is a configuration diagram schematically showing a configuration example of a device for evaluating the surface roughness of a component for an image forming apparatus to which the first invention of the present application is applied. In the figure, reference numeral 1 denotes an object to be measured, such as a substrate for an electrophotographic photoreceptor or an object having a subbing layer formed on the surface thereof; Is a mechanism for moving the object along the measurement object, 4 is a surface roughness meter, and 5 is a personal computer for performing signal analysis. In this figure, the above-described multi-resolution analysis and Wigner distribution calculation are performed by the personal computer 5.
[0052]
This diagram is shown as an example, and the configuration may be other configurations. For example, multiresolution analysis and Wigner distribution calculation may be performed by a dedicated numerical calculation processor instead of a personal computer. Further, this treatment may be performed by the surface roughness meter itself. Various methods can be used for displaying the result, and the result may be displayed on a CRT or a liquid crystal screen, or may be printed out. Further, the signal may be transmitted to another device as an electric signal, or may be stored on a floppy disk or an MO disk.
[0053]
Next, the signal processing method in the first invention of the present application will be briefly described.
First, the Short Time Fourier Transform is a method devised to capture a temporal change of a frequency component of a non-stationary signal, and is obtained by cutting out a signal every short time and performing a Fourier transform. In the Fourier transform, in order to improve the accuracy, it is necessary to reduce the number of samples (shortening the time taken out), but in this case, the accuracy with respect to frequency (frequency resolution) decreases. In the short-time Fourier transform, the cut-out time window and the length of the Fourier transform are separately set to improve the time resolution while maintaining the necessary frequency resolution. The distribution of the absolute square value of the result of the short-time Fourier transform is called a spectrogram.
Here, the short-time Fourier transform may be a short-time fast Fourier transform in which the processing algorithm is speeded up.
[0054]
Next, a method based on the wavelet transform will be described.
The wavelet transform of the function f (t) is represented by (Equation 2).
(Equation 1)

here,
W (b, a) wavelet transform
ψ (t) Mother wavelet
a Scale parameter
b Translate parameter
It is.
(Equation 1) is a continuous function wavelet transform, that is, a continuous wavelet transform. In the present invention, since sampling is performed at regular intervals, it is a discrete system, and a discrete wavelet transform is performed. In the discrete wavelet transform, the wavelet coefficient c _{j, k} Is represented by (Equation 2).
(Equation 2)

It is. Also, the scaling coefficient d _{j, k} Is represented by (Equation 3).
[Equation 3]

In (Equation 3), φ (t) is a scaling function.
In (Equation 2) and (Equation 3), j is a level, and indicates a layer number which is a resolution for the original signal. Wavelet coefficient c _{j, k} Indicates the frequency and time distribution of the signal. Also, the scaling function d _{j, k} Is the discretized representation of the j-th resolution of the original signal.
[0055]
In the discrete wavelet transform, data is calculated by (Equation 4).
(Equation 4)

In (Equation 4), the coefficient groups p and q are transform bases for wavelet transform, and have the functions of a low-pass filter and a high-pass filter, respectively. Therefore, the (j + 1) -order scaling coefficient d _{j + 1, k} Is the j-order scaling factor d _{j, k} The resolution is one level lower than that, and the resolvable frequency and temporal resolution are 1/2 of the j order.
[0056]
On the other hand, the (j + 1) -order wavelet coefficient c _{j + 1, k} Is the j-order scaling factor d _{j, k} Through a high-pass filter, and the scaling factor d _{j + 1, k} And d _{j, k} Represents the frequency component between.
[0057]
FIG. 2 is a diagram showing a processing flow of the wavelet transform, in which an original signal 10 (Source Signal) is passed through a high-pass filter (HPF), and a process (SS) for thinning out data every other is performed, and the signal 11 is shown. H component (H part) is obtained.
Further, the signal 12 is obtained by passing the original signal 10 (Source Signal) through a low-pass filter (LPF), and further performing a process (SS) of thinning out every other data.
The signal 12 thus obtained is passed through a high-pass filter (HPF), and the data is thinned out every other data (SS) to obtain an LH component (LH part) shown in the signal 13.
In addition, the signal 12 is passed through a low-pass filter (LPF), and a process (SS) for thinning out every other data is performed to obtain a signal 14.
The signal 14 thus obtained is passed through a high-pass filter (HPF), and the data is thinned out every other data (SS) to obtain the LLH component (LLH part) shown in the signal 15.
Further, the signal 14 is passed through a low-pass filter (LPF), and a process (SS) for thinning out every other data is performed to obtain an LLL component (LLL part) shown in the signal 16.
FIG. 3 is a diagram showing a result of performing the multi-resolution analysis processing in this manner, and the original signal is decomposed into four components of an LLL component, an LLH component, an LH component, and an H component.
[0058]
Here, the wavelet transform can be classified into an orthogonal wavelet transform and a non-orthogonal wavelet transform, and either of them may be used.
[0059]
In the orthogonal wavelet transform, only the real form is often used for the wavelet function. As the wavelet function, a Daubesies function, a Harr function, a Meyer function, a Simlet function, a Coiflet function, and the like can be used. Here, Daubesies may be described as Dobesy. In these orthogonal wavelet transforms, information corresponding to the intensity can be obtained by performing an envelope process on the calculated absolute value using a low-pass filter or the like.
[0060]
Some non-orthogonal wavelet functions use complex wavelets and real wavelets. As the complex wavelet function, there is a Gaussian wavelet function. When this complex wavelet function is used, the intensity is obtained by calculating the absolute value of the wavelet transform result. The real-type wavelet function includes a Mexican hat function, a French hat function, and the like. However, even if an absolute value is calculated for a wavelet transform result obtained by using the function, no intensity can be obtained. However, it is possible to obtain a value corresponding to the intensity by performing an envelope process on the calculated absolute value with a low-pass filter or the like.
[0061]
The square absolute value of the result of the wavelet transform is called a scalogram, and can be represented by a scalogram. The spectrogram obtained from the short-time Fourier transform is a constant frequency band analysis, whereas the spectrogram by the wavelet transform is a constant logarithmic bandwidth analysis.
[0062]
Next, a process using a band-pass filter is a method in which several types of band-pass filters are prepared in advance, and signals are sequentially passed through these filters to perform multi-resolution analysis of the signals. In the method using a bandpass filter, the signal does not need to be a digital signal, and may be an analog signal. The bandpass filter processing of an analog signal has an advantage that the processing can be speeded up.
[0063]
Finally, the Wigner distribution will be described. The Wigner distribution of the time signal f (t) is represented by (Equation 5).
(Equation 5)

Here, * indicates a complex conjugate. The Wigner distribution may be referred to as a Wigner-Ville distribution. In the present invention, the signal is a function of the position, but it is possible to calculate the Wigner distribution by reading it as a function of the time.
[0064]
These bandpass filter processing, wavelet transform, short-time Fourier transform, and Wigner distribution calculation can be performed by various methods. For example, in the case of performing with software, in mathematicalmatica, the calculation can be performed in combination with Wavelet Explorer, which is possible with a package that performs wavelet transform. In MATLAB, the calculation can be performed by using a package (Wavelet Tool Box) for performing wavelet transform. The calculation can be performed by programming in C language or the like, and the calculation can be performed by a dedicated numerical processor.
[0065]
In the present invention, the band-pass filter processing result, the wavelet transform result, the short-time Fourier transform result, and the Wigner distribution calculation result are compared with the result of a normal measurement or a measurement of a non-normal measurement, and the judgment is performed. It can be carried out.
[0066]
In the measurement by the present inventor, the surface roughness meter uses Surfcom 570A manufactured by Tokyo Seimitsu Co., Ltd., the personal computer uses an IBM personal computer, and the RS-232-C cable is used between Surfcom 570A and the IBM personal computer. Connected with. The processing of the surface roughness data sent from Surfcom to the personal computer, its multi-resolution analysis, the calculation of the Wigner distribution, etc. were performed by software created in C language.
[0067]
Hereinafter, an example of the configuration of an electrophotographic photosensitive member using the substrate for an electrophotographic photosensitive member evaluated by the surface roughness evaluation method according to the present invention and an electrophotographic apparatus equipped with the electrophotographic photosensitive member will be described. The electrophotographic apparatus includes an electrophotographic process cartridge described later in a narrow sense.
[0068]
FIG. 4 is a cross-sectional view schematically showing a layer structure of the electrophotographic photoreceptor according to the present invention, in which an undercoat layer 22 is provided on a conductive electrophotographic photoreceptor base (hereinafter, also simply referred to as a base) 21. Thus, a configuration is adopted in which a charge generation layer 23 mainly containing a charge generation material and a charge transport layer 4 mainly containing a charge transport material are stacked. Further, FIG. 5 shows a configuration in which a protective layer 25 is provided on the charge transport layer 24.
[0069]
The conductive substrate (support) 21 has a volume resistance of 10 ¹⁰ What shows conductivity of Ωcm or less, for example, aluminum, nickel, chromium, nichrome, copper, gold, silver, metals such as platinum, tin oxide, metal oxides such as indium oxide, by vapor deposition or sputtering, in the form of a film or Cylindrical plastic, paper-coated or aluminum, aluminum alloy, nickel, stainless steel, etc. plates and extruded, tubed by methods such as drawing, and surface-treated by cutting, superfinishing, polishing, etc. A tube or the like can be used. Further, an endless nickel belt and an endless stainless belt disclosed in JP-A-52-36016 can also be used as the conductive substrate 21.
[0070]
In addition, a substrate obtained by dispersing a conductive powder in a suitable binder resin on the above substrate and coating the same can also be used as the conductive substrate 21 of the present invention. Examples of the conductive powder include carbon black, acetylene black, and metal powders such as aluminum, nickel, iron, nichrome, copper, zinc, and silver, and conductive metal oxide powders such as tin oxide and ITO. Can be The binder resins used simultaneously include polystyrene, styrene-acrylonitrile copolymer, styrene-butadiene copolymer, styrene-maleic anhydride copolymer, polyester, polyvinyl chloride, and vinyl chloride-vinyl acetate copolymer. , Polyvinyl acetate, polyvinylidene chloride, polyarylate resin, phenoxy resin, polycarbonate, cellulose acetate resin, ethyl cellulose resin, polyvinyl butyral, polyvinyl formal, polyvinyl toluene, poly-N-vinyl carbazole, acrylic resin, silicone resin, epoxy resin, Thermoplastic, thermosetting resin or photocurable resin such as melamine resin, urethane resin, phenol resin, alkyd resin and the like. Such a conductive layer is formed by dispersing the conductive powder and the binder resin in an appropriate solvent, for example, THF (tetrahydrofuran), MDC (dichloromethane), MEK (methyl ethyl ketone), toluene, or the like, and applying. Can be provided. Further, a conductive material is formed by a heat-shrinkable tube in which a material such as polyvinyl chloride, polypropylene, polyester, polystyrene, polyvinylidene chloride, polyethylene, chlorinated rubber, and Teflon (trade name) is contained on a suitable cylindrical substrate. A substrate provided with a conductive layer can also be favorably used as the conductive substrate 21 of the present invention.
[0071]
As a method of processing the conductive substrate 21, various cutting, grinding, and polishing processes are possible, and a combination of these processing methods is also effective.
[0072]
Next, the photosensitive layer will be described. The photosensitive layer may be a single layer or a laminate, but for convenience of explanation, the case where the photosensitive layer is composed of the charge generation layer 23 and the charge transport layer 24 will be described first.
[0073]
The charge generation layer 23 is a layer containing a charge generation material as a main component. Organic materials such as pigments and dyes are used for the charge generation material.Typical examples thereof include monoazo pigments, disazo pigments, trisazo pigments, perylene pigments, perinone pigments, quinacridone pigments, quinone condensed polycyclic compounds, Squaric acid dyes, phthalocyanine pigments, naphthalocyanine pigments, azulenium salt dyes, and the like are used. The charge generating materials are used alone or in combination of two or more.
[0074]
Examples of the binder resin used for the charge generation layer 23 include polyamide, polyurethane, epoxy resin, polyketone, polycarbonate, silicone resin, acrylic resin, polyvinyl butyral, polyvinyl formal, polyvinyl ketone, polystyrene, polysulfone, poly-N-vinylcarbazole, Examples include polyacrylamide, polyvinyl benzal, polyester, phenoxy resin, vinyl chloride-vinyl acetate copolymer, polyvinyl acetate, polyphenylene oxide, polyamide, polyvinyl pyridine, cellulose resin, casein, polyvinyl alcohol, polyvinyl pyrrolidone, and the like. The amount of the binder resin is suitably from 20 to 200 parts by weight, preferably from 50 to 150 parts by weight, per 100 parts by weight of the charge generating substance.
[0075]
Examples of the solvent used here include isopropanol, acetone, methyl ethyl ketone, cyclohexanone, tetrahydrofuran, dioxane, ethyl cellosolve, ethyl acetate, methyl acetate, dichloromethane, dichloroethane, monochlorobenzene, cyclohexane, toluene, xylene, ligroin and the like. As a method for applying the coating solution, a method such as a dip coating method, a spray coat, a beat coat, a nozzle coat, a spinner coat, and a ring coat can be used. The thickness of the charge generation layer 23 is suitably about 0.01 to 5 μm, and preferably 0.1 to 2 μm.
[0076]
The charge transport layer 24 can be formed by dissolving or dispersing a charge transport material and a binder resin in an appropriate solvent, applying the solution on the charge generation layer 23, and drying. If necessary, a plasticizer, a leveling agent, an antioxidant and the like can be added. As the leveling agent, silicone oils such as dimethyl silicone oil and methyl phenyl silicone oil, and polymers or oligomers having a perfluoroalkyl group in a side chain are used in an amount of 0 to 1 wt. % Is appropriate.
[0077]
The charge transport materials include a hole transport material and an electron transport material. Examples of the electron transporting substance include chloranil, bromanil, tetracyanoethylene, tetracyanoquinodimethane, 2,4,7-trinitro-9-fluorenone, 2,4,5,7-tetranitro-9-fluorenone, 4,5,7-tetranitroxanthone, 2,4,8-trinitrothioxanthone, 2,6,8-trinitro-4H-indeno [1,2-b] thiophen-4-one, 1,3,7- Electron accepting substances such as trinitrodibenzothiophene-5,5-dioxide, benzoquinone derivatives and the like.
[0078]
Examples of the hole transport material include poly-N-carbazole and derivatives thereof, poly-γ-carbazolylethyl glutamate and derivatives thereof, pyrene-formaldehyde condensate and derivatives thereof, polyvinylpyrene, polyvinylphenanthrene, polysilane, oxazole derivatives, and oxalate. Diazole derivative, imidazole derivative, monoarylamine derivative, diarylamine derivative, triarylamine derivative, stilbene derivative, α-phenylstilbene derivative, benzidine derivative, diarylmethane derivative, triarylmethane derivative, 9-styrylanthracene derivative, pyrazoline derivative , Divinylbenzene derivatives, hydrazone derivatives, indene derivatives, butadiene derivatives, pyrene derivatives, etc., bisstilbene derivatives, enamine derivatives and other known materials Fees. These charge transport materials are used alone or in combination of two or more.
[0079]
As the binder resin, polystyrene, styrene-acrylonitrile copolymer, styrene-butadiene copolymer, styrene-maleic anhydride copolymer, polyester, polyvinyl chloride, vinyl chloride-vinyl acetate copolymer, polyvinyl acetate, Polyvinylidene chloride, polyarylate, phenoxy resin, polycarbonate, cellulose acetate resin, ethyl cellulose resin, polyvinyl butyral, polyvinyl formal, polyvinyl toluene, poly-N-vinyl carbazole, acrylic resin, silicone resin, epoxy resin, melamine resin, urethane resin, Thermoplastic or thermosetting resins such as phenolic resins and alkyd resins are exemplified.
[0080]
The amount of the charge transporting material is suitably 20 to 300 parts by weight, preferably 40 to 150 parts by weight based on 100 parts by weight of the binder resin. Further, the thickness of the charge transport layer is preferably about 5 to 50 μm.
[0081]
Examples of the solvent used here include tetrahydrofuran, dioxane, toluene, dichloromethane, monochlorobenzene, dichloroethane, cyclohexanone, methyl ethyl ketone, acetone and the like.
[0082]
For the charge transporting layer, a polymer charge transporting material having a function as a charge transporting material and a function as a binder resin is also preferably used. The charge transport layer composed of these polymer charge transport materials has excellent abrasion resistance. As the polymer charge transport substance, known materials can be used, but polycarbonates containing a triarylamine structure in the main chain and / or side chain are preferably used. For example, polymer charge transport materials represented by formulas (1) to (10) of JP-A-2000-103984 are preferably used.
[0083]
In the present invention, a plasticizer or a leveling agent may be added to the charge transport layer 24. As the plasticizer, those used as plasticizers for general resins such as dibutyl phthalate and dioctyl phthalate can be used as they are, and the amount of the plasticizer is suitably about 0 to 30% by weight based on the binder resin. As the leveling agent, silicone oils such as dimethyl silicone oil and methyl phenyl silicone oil, and polymers or oligomers having a perfluoroalkyl group in a side chain are used in an amount of 0 to 1 wt. % Is appropriate.
[0084]
In the electrophotographic photoreceptor of the present invention, as shown in FIGS. 4 and 5, an undercoat layer 22 can be provided between the conductive substrate 21 and the photosensitive layers (23, 24). The undercoat layer 22 generally contains a resin as a main component. However, considering that the photosensitive layer is coated thereon with a solvent, these resins should be resins having high solvent resistance to general organic solvents. Is desirable. Examples of such a resin include water-soluble resins such as polyvinyl alcohol, casein, and sodium polyacrylate, copolymer-soluble nylons, alcohol-soluble resins such as methoxymethylated nylon, polyurethane, melamine resins, phenol resins, alkyd-melamine resins, and epoxy resins. Curable resins that form a three-dimensional network structure, such as resins, are exemplified.
[0085]
Further, fine powder of a metal oxide exemplified by titanium oxide, silica, alumina, zirconium oxide, tin oxide, indium oxide, or the like may be added to the undercoat layer 22 in order to prevent moiré, reduce residual potential, and the like. . These undercoat layers 22 can be formed using an appropriate solvent and a coating method as in the case of the above-described photosensitive layer.
[0086]
Furthermore, a silane coupling agent, a titanium coupling agent, a chromium coupling agent, or the like can be used as the undercoat layer 22 in the present invention. In addition, the undercoat layer 22 includes Al ₂ O ₃ Provided by anodic oxidation, organic substances such as polyparaxylylene (parylene), SiO 2 ₂ , SnO ₂ , TiO ₂ , ITO, CeO ₂ Also, inorganic materials such as those provided by a vacuum thin film manufacturing method can be used favorably. In addition to this, known ones can be used. The thickness of the undercoat layer 22 is suitably from 0 to 5 μm.
[0087]
As shown in FIG. 5, in the electrophotographic photoreceptor of the present invention, a protective layer 25 may be provided on the photosensitive layer for the purpose of protecting the photosensitive layer. Materials used for the protective layer 25 include ABS resin, ACS resin, olefin-vinyl monomer copolymer, chlorinated polyether, allyl resin, phenol resin, polyacetal, polyamide, polyamideimide, polyacrylate, polyallyl sulfone, and polybutylene. , Polybutylene terephthalate, polycarbonate, polyether sulfone, polyethylene, polyethylene terephthalate, polyimide, acrylic resin, polymethylpentene, polypropylene, polyphenylene oxide, polysulfone, polystyrene, AS resin, butadiene-styrene copolymer, polyurethane, polyvinyl chloride, Resins such as polyvinylidene chloride and epoxy resin are exemplified. For the purpose of improving abrasion resistance, the protective layer 25 may be made of a fluororesin such as polytetrafluoroethylene, a silicone resin, or an inorganic material such as titanium oxide, tin oxide or potassium titanate dispersed in these resins. Can be added.
[0088]
As a method for forming the protective layer 25, a normal coating method is employed. Note that the thickness of the protective layer 25 is suitably about 0.1 to 7 μm. In addition, other known materials such as aC and a-SiC formed by a vacuum thin film manufacturing method can also be used as the protective layer 25.
[0089]
In the present invention, an intermediate layer may be provided between the photosensitive layers (23, 24) and the protective layer 25. The intermediate layer generally uses a binder resin as a main component. Examples of these resins include polyamide, alcohol-soluble nylon, polyvinyl butyral hydroxide, polyvinyl butyral, and polyvinyl alcohol. As a method for forming the intermediate layer, a normal coating method is employed as described above. The thickness of the intermediate layer is suitably about 0.05 to 2 μm.
[0090]
Next, an electrophotographic apparatus according to the present invention equipped with the above electrophotographic photosensitive member will be described.
FIG. 6 is a schematic diagram schematically illustrating an example of the electrophotographic apparatus, and the following modified examples also belong to the category of the present invention.
In the electrophotographic apparatus shown in FIG. 6, a charging mechanism 32, an exposure light source 33, a developing mechanism 34, a transfer mechanism 35, and a cleaning mechanism 37 are arranged around a drum-shaped electrophotographic photosensitive member 31. In the transfer mechanism 35, the toner is transferred to the transfer material 38, and the toner is fixed by the fixing mechanism 36.
[0091]
In the electrophotographic method using the above-described electrophotographic apparatus, the electrophotographic photosensitive member 31 is rotated in a counterclockwise direction, is positively or negatively charged by the charging mechanism 32, and is exposed to the electrostatic force by the exposure light source 33. A latent image is formed on the electrophotographic photosensitive member 31.
[0092]
As the charging mechanism 32, known charging means such as a corotron, a scorotron, a solid state charger (solid state charger), a charging roller, and the like can be used. Although a general charger can be used for the transfer mechanism 35, a mechanism using both a transfer charger and a separation charger is effective.
[0093]
In addition, as the exposure light source 33 and a light source (not shown) used as a static elimination light source, a fluorescent lamp, a tungsten lamp, a halogen lamp, a mercury lamp, a sodium lamp, a light emitting diode (LED), a semiconductor laser (LD), an electroluminescence A light emitting material such as (EL) can be used. To irradiate only light in a desired wavelength range, various filters such as a sharp cut filter, a band pass filter, a near infrared cut filter, a dichroic filter, an interference filter, and a color temperature conversion filter can be used. Such a light source or the like is provided with a transfer step using light irradiation in addition to the configuration shown in FIG. 6, a charge removal step, a cleaning step, or a step such as pre-exposure so that the light is irradiated to the photoconductor. Can also be used.
[0094]
When image exposure is performed by applying positive or negative charge to the photoconductor, a positive or negative electrostatic latent image is formed on the photoconductor. A positive image can be obtained by developing the toner with negatively or positively charged toner (electrostatic fine particles), and a negative image can be obtained by developing the toner with a positively or negatively charged toner. A known method can be applied to such development, and a known method is also used for the static elimination means.
[0095]
In this example, the conductive substrate is shown as a drum, but a sheet or an endless belt may be used. As the pre-cleaning charger, known charging means such as a corotron, a scorotron, a solid state charger (solid state charger), a charging roller and the like can be used.
The above-mentioned charging means can be usually used for the transfer charger and the separation charger.
As the cleaning mechanism, a known brush such as a fur brush or a mag fur brush or a polyurethane blade can be used.
[0096]
The image forming means of the present invention typified by the electrophotographic apparatus as described above may be fixedly incorporated in an apparatus such as a copying machine, a facsimile, a printer, or the like. It may be incorporated in The process cartridge is one device (part) including a photoconductor, and further including a charging unit, an exposing unit, a developing unit, a transferring unit, a cleaning unit, a discharging unit, and the like. Although there are many shapes and the like of the process cartridge, a general example is shown in FIG.
[0097]
FIG. 7 shows an electrophotographic process cartridge according to the present invention.
7, reference numeral 31 denotes an electrophotographic photosensitive member, 32 denotes a charging unit, 33 denotes an image exposure light source, 34 denotes a developing unit, 35 denotes a transferring unit, 38 denotes a transfer material such as paper, 36 denotes a fixing mechanism, 37 denotes a cleaning mechanism, Reference numeral 39 denotes a process cartridge container.
[0098]
This figure shows one structural example, and each means may be in a form other than that shown in the figure.
For example, as the charging unit 32, a known charging unit such as a corotron, a scorotron, and a charging roll can be used.
Light sources for image exposure and pre-exposure light (not shown) include fluorescent lamps, tungsten lamps, halogen lamps, mercury lamps, sodium lamps, light emitting diodes (LED), semiconductor lasers (LD), and electroluminescence (EL). Means can be used.
In order to irradiate only light in a predetermined wavelength range, various filters such as a sharp cut filter, a band pass filter, a near infrared cut filter, a dichroic filter, an interference filter, and a color temperature conversion filter can be used. The cleaning mechanism 37 may be performed only by a cleaning blade, or may be used together with a cleaning brush or a blade.
In the process cartridge shown in FIG. 7, the cleaning means and the like may not be included in the process cartridge. Further, light emitting means and transfer means which are not incorporated in the drawing may be incorporated in the process cartridge.
[0099]
Next, the second invention of the present application will be described.
In the second invention of the present application, a vibration sensor is attached to a cutting tool or a jig for mounting the cutting tool in the cutting of the image forming apparatus part, and the vibration of the cutting tool is measured by the vibration sensor during the cutting, and the measurement is performed. Create two-dimensional array data corresponding to the cutting surface from the signal and evaluate this two-dimensional array data, or evaluate by performing signal analysis of this two-dimensional array data, while grasping the cutting processing state It is characterized by performing cutting.
[0100]
In the second invention of the present application, vibration data of a cutting tool (for example, a cutting tool) is measured at the time of cutting, and one-dimensional data obtained by the measurement is arranged as two-dimensional data corresponding to the surface of the workpiece. In this two-dimensional data, even if the mutation occurs less frequently, such as occurs only once per rotation of the workpiece during cutting, the occurrence of the mutation is concentrated at a specific location, so detection is not possible. It will be easier.
[0101]
FIG. 8 is a configuration diagram of a lathe suitable for carrying out the present invention and a device for processing cutting tool vibration data. In FIG. 8, reference numeral 41 denotes a workpiece, and reference numeral 42 denotes a tool attaching portion. A vibration sensor (not shown) is attached to the bite mounting portion 42, and its signal is transmitted to a signal processing device that processes a signal of 44 bytes by a cable of 43. Reference numeral 45 denotes a motor for rotating the workpiece 41, and reference numeral 46 denotes a motor for moving the table on which the cutting tool is mounted left and right.
[0102]
FIG. 9 is a diagram showing a process of creating two-dimensional data according to claims 16 and 17 of the present invention from the vibration signal data of the byte, where I is data of the vibration signal of the byte. In I, the n portion is the nth rotation, the n + 1 portion is the n + 1th rotation, the n + 2 portion is the n + 2th rotation, and the n + 3 portion is the n + 3th rotation, and these data are continuous.
II in FIG. 9 is a diagram in which the data of I is arranged for each rotation, and thus two-dimensional data is created.
III in FIG. 9 is data obtained by converting II into a two-dimensional array. The first row is the nth rotation, the second row is the n + 1 rotation, the third row is the n + 2 rotation, the fourth row is the n + 3 rotation, Thereafter, this data continues.
[0103]
Next, a signal processing method in the second invention of the present application will be described.
First, a method based on the two-dimensional Fourier transform will be described. Let the spatial frequency in the x-axis direction of the image be ω _x , The spatial frequency in the axial direction is ω _y And In this case, the two-dimensional Fourier transform is obtained by (Equation 6).
(Equation 6)

However, in the case of actual image data, a discrete two-dimensional Fourier transform is performed.
[0104]
When two-dimensional Fourier transform is performed on an image data matrix, it is preferable that the rows and columns have the same score. The score of the row and column of the matrix is preferably a factorial of 2, and is preferably 512 or more. Although the Fourier transform is possible even if the number of data points is not a factorial of 2, it is not preferable because the calculation speed of the Fourier transform decreases. When the data score is not a factorial of 2, it is preferable to insert a column or a row of 0 so as to be a factorial of 2 so as to be a factorial of 2.
[0105]
Next, a method based on wavelet transform used in the second invention of the present application will be described. The one-dimensional wavelet transform is the same as that described in the first invention, so that the description thereof will be omitted to avoid redundant description.
[0106]
The one-dimensional wavelet transform is performed in the same manner as described in the first invention, but the two-dimensional wavelet transform can be obtained by performing two-dimensional data in the vertical direction and the horizontal direction (column direction and row direction).
[0107]
FIG. 10 shows a flow when the discrete two-dimensional wavelet transform is performed. ₀ Is the low frequency component L ₁ , Vertical high frequency component V ₁ , Horizontal high frequency component H ₁ , Oblique high-frequency component T ₁ Divided into The low frequency component L thus obtained ₁ Is subjected to a wavelet transform in the same manner to obtain a low-frequency component L ₂ , Vertical high frequency component V ₂ , Horizontal high frequency component H ₂ , Oblique high-frequency component T ₂ Divided into Similarly, the low-frequency component is wavelet-transformed, and the low-frequency component L _n , Vertical high frequency component V _n , Horizontal high frequency component H _n , Oblique high-frequency component T _n Can be obtained.
[0108]
Here, when performing the discrete two-dimensional wavelet transform, the size of the image to be converted does not need to be performed at once for the created two-dimensional image matrix, and may be divided and processed.
[0109]
In the second invention of the present application, the surface to be evaluated is measured, the two-dimensional image data matrix is created, and the wavelet transform is performed. However, the wavelet transform does not need to be performed after all the data of the two-dimensional image data matrix is completed. While creating the two-dimensional image data matrix, the wavelet transform may be performed on the portion where the matrix is prepared.
[0110]
Similarly, it is not necessary to perform the Fourier transform after all the data of the two-dimensional image data matrix is prepared, and perform the two-dimensional Fourier transform on the portion where the matrix is prepared while creating the two-dimensional image data matrix. Is also good.
[0111]
In the second invention of the present application, creation of a two-dimensional image data matrix, wavelet transform, and Fourier transform can be performed by various means. For example, a microprocessor, a DSP (digital signal processor), an ASIC, or a dedicated IC or LSI can be used. Can be used. For example, in the case of performing with software, in mathematicalmatica, calculation can be performed by using Wavelet Explorer, which is possible with a package that performs wavelet transform. In MATLAB, calculation can be performed using a package (Wavelet Tool Box) that performs wavelet transform. The calculation can be performed by programming in C language or the like, and the calculation can be performed by a dedicated numerical processor. In the study of the present inventor, calculation was performed using a program created in the C ++ language.
[0112]
A typical component for an image forming apparatus in the second invention of the present application is a base for an electrophotographic photosensitive member, and aluminum or an aluminum alloy is preferably used as such a base. Specifically, A1100, A3030, and A6063 alloys are particularly preferably used. Such a substrate may be subjected to anodic oxidation or chemical conversion after cutting.
[0113]
The electrophotographic photoreceptor and the electrophotographic apparatus according to the second invention of the present application are the same as those described in the first invention, except for the substrate that is preferably applied, and therefore the description thereof is omitted.
In the first to ninth aspects of the present invention, the result of the arithmetic processing may be a comparison processing by a computer, or the result of the arithmetic processing may be printed out or output to a screen, and the output may be judged by a human.
[0114]
【Example】
Hereinafter, the present invention will be described in detail with reference to Examples and Comparative Examples.
[0115]
<First invention>
First, a method of preparing a substrate for an electrophotographic photosensitive member to be measured in Examples and Comparative Examples, and a method of forming an electrophotographic photosensitive member from the substrate will be described. Next, image evaluation results of the created electrophotographic photosensitive member Will be described. Then, the measurement according to the present invention will be described with reference to examples and comparative examples, and the effect of the present invention will be verified by comparing the measurement results with the image evaluation results. It will be described in order below.
[0116]
(Preparation of measurement sample)
As a sample to be measured according to the present invention, three types of processing were performed by cutting to prepare three types of substrates for electrophotographic photosensitive members. In addition, two conditions were processed by centerless grinding to prepare two types of substrates for electrophotographic photosensitive members. The conditions are shown below.
[0117]
Measurement sample A: Aluminum alloy JIS standard A6063 material was continuously extruded into a pipe having an outer diameter of 30.2 mm and an inner diameter of 28.5 mm by a porthole extrusion method, and was cut into a length of 254 mm to form a cylindrical cylinder. The pipe was cut to an outer diameter of 30.0 mm using an R bit with a lathe manufactured by Shoun Co., Ltd. The substrate for an electrophotographic photosensitive member produced in this manner is referred to as a measurement sample A. When the surface roughness of this substrate was measured, ten were measured, and Rz was 1.62 on average.
[0118]
Measurement sample B: Aluminum alloy JIS standard A6063 material was continuously extruded by a porthole extrusion method into a pipe having an outer diameter of 30.2 mm and an inner diameter of 28.5 mm, and was cut into a length of 254 mm to form a cylindrical cylinder. This pipe was cut to an outer diameter of 30.0 mm with a lathe made by Shoun Co. using an R flat bite different from that used for cutting the measurement sample A. The substrate for an electrophotographic photosensitive member produced in this manner is referred to as a measurement sample B. When the surface roughness of this substrate was measured, ten were measured, and Rz was 1.31 on average.
[0119]
Measurement sample C: Cutting was performed in the same manner as in measurement sample A, except that an R bit with worn bits was used. The substrate for an electrophotographic photosensitive member produced in this manner is used as a measurement sample C. When the surface roughness of this substrate was measured, ten were measured, and Rz was 1.55 on average.
[0120]
Measurement sample D: Aluminum alloy JIS standard A6063 material was continuously extruded into a pipe having an outer diameter of 30.2 mm and an inner diameter of 28.5 mm by a porthole extrusion method, and was cut into a length of 254 mm to form a cylindrical cylinder. This pipe was subjected to rough centerless grinding with a centerless grinding machine manufactured by Micron Seiki, and then finished to an outer diameter of 30.0 mm by performing a centerless grinding. The centerless grinding conditions are shown below. The substrate for an electrophotographic photosensitive member produced in this manner is referred to as a measurement sample D. When the surface roughness of this substrate was measured, ten were measured, and Rz was 2.78 on average.
[0121]
(Rough centerless processing)
Grinding wheel particle size 800 mesh
Abrasive grain material of grinding wheel Silicon carbide (SiC)
Number of revolutions of grinding wheel 1250rpm
Coarse grinding feed rate 0.0076mm / sec
(Finish centerless processing)
Grinding wheel particle size 1000 mesh
Abrasive grain material of grinding wheel Silicon carbide (SiC)
Number of revolutions of grinding wheel 1250rpm
Finish grinding feed rate 0.0022mm / sec
[0122]
Measurement sample E: Aluminum alloy JIS A6063 material was continuously extruded into a pipe having an outer diameter of 30.2 mm and an inner diameter of 28.5 mm by a porthole extrusion method, and was cut into a length of 254 mm to form a cylindrical cylinder. This tube was subjected to centerless grinding in the same manner as in the case of the measurement sample C, and processed into an outer shape of 30.0 mm. Here, the grinding wheel used for the finish grinding was clogged. The substrate for an electrophotographic photosensitive member manufactured in this manner is referred to as a measurement sample E. When the surface roughness of this substrate was measured, ten were measured, and Rz was 1.71 on average.
[0123]
(Creation of electrophotographic photoreceptor)
Next, an electrophotographic photosensitive member was prepared from the measurement samples A to E in the following procedure.
(1) Cleaning
The substrates of the measurement samples A to E were washed with a water washing device using a jet water flow to remove oil adhering to the surface. At that time, use as a surfactant a combination of Chemicol C (trade name) of Tokiwa Chemical Co., Ltd. and an ultrasonic oscillator, and after jet cleaning, re-wash with pure water to completely remove the surfactant. Drying was performed.
(2) Formation of undercoat layer
Next, a resin coating having the following composition was applied to the substrate surface by a dipping method, and then heated at 150 ° C. for 15 minutes and thermally cured to form an undercoat layer having a thickness of 5 μm on the substrate surface.
20 parts by weight of titanium oxide
Alkyd resin 10 parts by weight
Melamine resin 10 parts by weight
Methyl ethyl ketone 60 parts by weight
(3) Formation of charge generation layer
Next, a resin coating (coating resin liquid) having the following composition was prepared on the undercoating layer to form a charge generation layer on the undercoating layer, and the resin coating was applied to the substrate by the same dipping method. It dried at 10 degreeC for 10 minutes, and formed the charge generation layer on the undercoat layer.
Butyral resin (XYHL manufactured by UCC) 1 part by weight
Disazo pigment [Formula (1) below] 9 parts by weight
30 parts by weight of cyclohexanone
30 parts by weight of tetrahydrofuran (THF)
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(4) Formation of charge transport layer
Further, in order to form a charge transport layer on the charge generation layer, a resin paint (coating resin liquid) having the following composition is prepared, and the resin paint is applied to the above-mentioned substrate by the same dipping method. After drying at 120 ° C. for 15 minutes, a charge transport layer was laminated on the charge generation layer.
10 parts by weight of polycarbonate resin
Charge transfer agent [formula (2) below] 10 parts by weight
80 parts by weight of dichloromethane
The polycarbonate resin used was Panlite K-1300 manufactured by Teijin Limited.
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[0124]
Thus, an electrophotographic photosensitive member A was prepared from the substrate of the measurement sample A. Further, an electrophotographic photosensitive member B was prepared from the base of the measurement sample B. In the same manner, electrophotographic photosensitive members C, D, and E were prepared.
[0125]
(Image evaluation)
The prepared electrophotographic photosensitive members A to E were attached to an electrophotographic apparatus shown in FIG. 6, and image evaluation was performed. Table 1 shows the results. As can be seen from Table 1, A is excellent in A, B, and C prepared by the cutting method, and it suffices that A, B, and C can be discriminated in the evaluation of the base object of the present invention. In addition, D is excellent in D and E prepared by the centerless processing method, and it is sufficient that D and E can be distinguished in the evaluation of the substrate as the object of the present invention.
[0126]
[Table 1]

[0127]
Although the above results were obtained in the image evaluation, the substrates of the measurement samples A to E were evaluated in order to verify the effects of the present invention. This embodiment and a comparative example will be described below.
[0128]
[Example 1]
The surface roughness of the measurement samples A to E was measured by the apparatus shown in FIG. 1, and the obtained cross-sectional curve data was subjected to wavelet transform.
As a measurement example of Example 1, a cross-sectional curve of the measurement sample A is shown in FIG. 11, and a result obtained by performing a wavelet transform thereof is shown in FIG. FIG. 13 shows a cross-sectional curve of the measurement sample D, and FIG. 14 shows a result of the wavelet transform.
[0129]
[Example 2]
The surface roughness of each of the measurement samples A to E was measured by the apparatus shown in FIG. 1, the obtained cross-sectional curve data was subjected to wavelet transform, and the resulting scalogram was obtained.
As a measurement example of Example 2, the original data of the measurement sample A and its scalogram are shown in FIG. FIG. 16 shows the original data of sample D and its scalogram.
[0130]
[Example 3]
The surface roughness of the measurement samples A to E was measured by the apparatus shown in FIG. 1, and the obtained cross-sectional curve data was subjected to a short-time Fourier transform.
[0131]
[Example 4]
The surface roughness of the measurement samples A to E was measured by the apparatus shown in FIG. 1, and the Wigner distribution of the obtained cross-sectional curve data was obtained.
As a measurement example of Example 4, the Wigner distribution of the measurement sample A is shown in FIG. 17, and a three-dimensional representation thereof is shown in FIG. FIG. 19 shows the Wigner distribution of the measurement sample D, and FIG. 20 shows a three-dimensional representation thereof.
[0132]
[Comparative Example 1]
The surface roughness of the measurement samples A to E was measured by the method shown in JIS B0601, and the cross-sectional curves were obtained.
[0133]
[Comparative Example 2]
Fourier transformation was performed on the cross-sectional curve obtained in Comparative Example 1.
[0134]
Table 2 shows the evaluation results of Examples 1 to 4 and Comparative Examples 1 and 2. Here, in Table 2, Examples 1 to 4 are the results of further calculating by computer the results of calculation processing of the measurement results of the measurement samples A, B, and C by computer.
[0135]
[Table 2]

[0136]
From the above results, the difference between the measurement samples A, B, and C created by the cutting method could be detected by the method according to the first invention of the present application. Further, since the difference between the measurement samples D and E prepared by the centerless grinding method could be detected, the effect of the present invention could be verified.
<Second invention>
[0137]
[Example 5]
An aluminum alloy having an outer diameter of 30.5 mm, an inner diameter of 28.5 mm, and a length of 340 mm prepared by extruding A3003 aluminum alloy was attached to a lathe shown in FIG.
While rotating the aluminum alloy tube attached to the lathe at 5000 rpm, a cutting tool is used at a tool feed speed of 50 mm / sec while spraying kerosene while using a 5 mm sintered diamond tool tool. Was measured. At this time, the sampling frequency of the vibration sensor was set to 80 KHz. A signal from which the vibration was detected was subjected to A / D conversion and taken into an IBM personal computer to create two-dimensional data corresponding to the cut surface. Since this data is a matrix of numerical values, FIG. 21 shows an example of the result of conversion into image data so that the data can be easily recognized. As can be seen from FIG. 21, a stripe pattern was confirmed.
Here, the cutting tool was replaced with a cutting tool whose tip was worn, cutting was performed with cutting chatters occurring, and an image was created in the same manner from cutting vibration data.As a result, large, dark stripes corresponding to chattering were confirmed. . In addition, the variation of the signal considered to be a nest during cutting was also confirmed. This is shown in FIG. 22 as an enlarged view.
[0138]
[Example 6]
Cutting was performed in the same manner as in Example 5, and cutting vibrations were taken in to create two-dimensional data. FIG. 23 shows the result of two-dimensional Fourier transform of the two-dimensional data. FIG. 24 shows the result of three-dimensional display.
The cutting tool was replaced with a cutting tool having poor polishing, cutting was performed so as to generate a cutting streak, and the vibration at this time was taken in to create two-dimensional data, and the two-dimensional data was subjected to two-dimensional Fourier transform. As a result, a low frequency component considered to be caused by streaks was confirmed.
[0139]
[Example 7]
Cutting was performed in the same manner as in Example 5, and cutting vibrations were taken in to create two-dimensional data. Next, two-dimensional discrete wavelet transform of the two-dimensional data was performed. In this wavelet transform, a Dobssy function was used. The result is shown in FIG.
Next, the cutting tool was replaced with a cutting tool with a worn tip, cutting was performed while cutting chatter was likely to occur, two-dimensional data was created in the same manner from cutting vibration data, and this was further subjected to wavelet transformation in the same way. Stripes corresponding to chatter could be confirmed in the conversion results. In this wavelet transform, a cofillet function was used.
[0140]
Example 8
Cutting was performed in the same manner as in Example 5, and cutting vibrations were taken in to create two-dimensional data. Next, two-dimensional discrete wavelet transform of the two-dimensional data was performed. In this wavelet transform, a Dobesy function was used.
Next, the cutting tool was replaced with a badly-polished cutting tool, cutting was performed so that cutting streaks were generated, and the vibration at this time was captured to create two-dimensional data. In the conversion result, stripes considered to correspond to the cutting streaks were confirmed.
[0141]
[Comparative Example 3]
Cutting was performed in the same manner as in Example 5, and cutting vibration was taken in to create one-dimensional data. This one-dimensional data was subjected to Fourier transform.
Next, the cutting tool was replaced with a cutting tool having poor polishing, cutting was performed so as to generate a cutting streak, vibration at this time was taken in to create one-dimensional data, and this one-dimensional data was subjected to Fourier transform. When the two Fourier transform results were compared, no difference was observed.
[0142]
[Comparative Example 4]
Cutting was performed in the same manner as in Example 5, and cutting vibration was taken in to create one-dimensional data. One-dimensional discrete wavelet transform of this one-dimensional data was performed. Next, the cutting tool is replaced with a badly-polished cutting tool, cutting is performed so that cutting streaks are generated, and the vibration at this time is captured to create one-dimensional data, and the one-dimensional discrete wavelet transform of the one-dimensional data is performed. went. When the two wavelet transform results were compared, no difference was observed.
[0143]
【The invention's effect】
According to the first invention of the present application, it becomes possible to grasp a local change or a minute variation of a measurement target surface which cannot be grasped by the conventional surface roughness evaluation method, that is, Rz, Ra, Rmax, and image abnormality occurs. Therefore, it is possible to provide an image forming apparatus capable of forming a uniform and high-quality image without any problem.
According to the second aspect of the present invention, when cutting a part for an image forming apparatus, in particular, a pipe made of aluminum or an aluminum alloy, the state of the cutting is accurately grasped, and cutting is performed while detecting occurrence of a cutting defect or a cutting abnormality. Since the processing can be performed, it is possible to provide a part for an image forming apparatus having a cut surface of good quality, and further, an image forming apparatus capable of forming a uniform and high-quality image.
[Brief description of the drawings]
FIG. 1 is a configuration diagram of a surface roughness evaluation system suitable for carrying out the present invention.
FIG. 2 is a diagram of a processing flow of a wavelet transform.
FIG. 3 is a conceptual diagram of a wavelet transform.
FIG. 4 is a diagram showing a layer configuration of an electrophotographic photosensitive member.
FIG. 5 is a diagram showing another layer configuration of the electrophotographic photosensitive member.
FIG. 6 is a configuration diagram of an electrophotographic apparatus.
FIG. 7 is a configuration diagram of a process cartridge for an electrophotographic apparatus.
FIG. 8 is a configuration diagram of a cutting system suitable for carrying out the present invention.
FIG. 9 is a flowchart of creating two-dimensional data from vibration data measured during cutting.
FIG. 10 is a processing flowchart of a two-dimensional wavelet transform.
FIG. 11 is a diagram of a cross-sectional curve of a substrate formed by cutting.
12 is a diagram showing the result of multiresolution analysis of the data of the cross-sectional curve in FIG. 11 by wavelet transform.
13 is a diagram of a scalogram obtained by performing a wavelet transform on the data of the cross-sectional curve in FIG. 11;
14 is a diagram showing a Wigner distribution of the data of the cross-sectional curve in FIG. 11;
FIG. 15 is a diagram of a three-dimensional display of the Wigner distribution of the data of the cross-sectional curve in FIG. 11;
FIG. 16 is a diagram of a cross-sectional curve of a base formed by cutting.
FIG. 17 is a diagram showing a result of multi-resolution analysis of the data of the cross-sectional curve in FIG. 16 by wavelet transform.
18 is a diagram of a scalogram obtained by performing a wavelet transform on the data of the cross-sectional curve in FIG.
FIG. 19 is a diagram showing a Wigner distribution of the data of the cross-sectional curve in FIG. 16;
20 is a diagram of a three-dimensional display of the Wigner distribution of the data of the cross-sectional curve in FIG.
FIG. 21 is a diagram showing a two-dimensional density graph of the two-dimensional data created in Example 5.
FIG. 22 is a partially enlarged view showing a two-dimensional density graph of the two-dimensional data created in the fifth embodiment.
FIG. 23 is a diagram showing a result of two-dimensional Fourier transform of the data of FIG. 21;
FIG. 24 is a diagram in which the result of two-dimensional Fourier transform of the data in FIG. 21 is displayed in three dimensions.
FIG. 25 is a diagram showing a result of performing a discrete two-dimensional wavelet transform on the data of FIG. 21;
[Explanation of symbols]
1 Measurement target
2 Jig with probe for measuring surface roughness
3. Mechanism for moving the jig along the measurement target
4 Surface roughness meter
5 Personal computer for signal analysis
10 original signal
11 Signal passed through low-pass filter
12 Signal passed through high-pass filter
13 Signal passed through low-pass filter
14 High-pass filtered signal
15 Signal passed through low-pass filter
16 Signal passed through high-pass filter
21 Substrate for electrophotographic photoreceptor
22 Undercoat layer
23 charge generation layer
24 charge transport layer
25 Protective layer
31 Electrophotographic photoreceptor
32 Charging mechanism
33 Exposure light source
34 Developing mechanism
35 Transfer mechanism
36 Fixing mechanism
37 Cleaning mechanism
38 Transfer material
39 Process cartridge case
41 Workpiece
42 byte mounting base
43 Cable to transmit signal from vibration sensor
44 Signal processing device
45 Spindle drive motor
47 byte mounting table feed drive motor

Claims (28)

A cross-sectional curve defined in JIS B0601 is obtained for the state of the surface of the component for an image forming apparatus, and a multiresolution analysis of a position data sequence in the surface roughness direction at equal intervals on the cross-sectional curve is performed. A method for evaluating the surface roughness of a component for an image forming apparatus, comprising evaluating a state of roughness. 2. The method according to claim 1, wherein the multi-resolution analysis is a wavelet transform. 2. The method for evaluating the surface roughness of a component for an image forming apparatus according to claim 1, wherein the method of the multi-resolution analysis is band-pass filtering or short-time fast Fourier transform. A cross-sectional curve defined in JIS B0601 is obtained for the state of the surface of the component for an image forming apparatus, and a Wigner distribution of a position data sequence in a surface roughness direction at equal intervals on the cross-sectional curve is obtained. A method for evaluating the surface roughness of a component for an image forming apparatus, characterized by evaluating a state of the surface roughness. The method for evaluating the surface roughness of a component for an image forming apparatus according to any one of claims 1 to 4, wherein the component for an image forming apparatus is a substrate for an electrophotographic photosensitive member. The surface of the component for an image forming apparatus according to any one of claims 1 to 4, wherein the component for an image forming apparatus is an electrophotographic photosensitive member having a coating layer formed on a substrate for an electrophotographic photosensitive member. Roughness evaluation method. The surface roughness of the component for an image forming apparatus according to any one of claims 1 to 4, wherein the component for an image forming apparatus is a charging roller, a developing roller, a fixing roller, a transfer belt, or a transport belt for an electrophotographic device. Evaluation method. The surface roughness evaluation method according to any one of claims 1 to 7, and at least one of a ten-point average roughness (Rz), an arithmetic average roughness (Ra), and a maximum height (Rmax) specified in JIS B0601. A method for evaluating the surface roughness of a component for an image forming apparatus, comprising: evaluating the surface roughness of the components. An image forming apparatus component according to claim 1, wherein the evaluation result of the surface roughness evaluation method according to claim 1 is compared with a predetermined reference to determine the surface roughness. Surface roughness evaluation method. A surface roughness measuring sensor for measuring the surface roughness of a component for an image forming apparatus; an electric circuit for amplifying a signal from the sensor; and a hardware having a function of performing a wavelet transform on an electric signal output from the electric circuit. A surface roughness evaluation system for a component for an image forming apparatus, comprising: wear or software; a surface roughness measurement sensor; and a mechanism for relatively moving a measurement target. A surface roughness measuring sensor for measuring the surface roughness of the image forming apparatus component, an electric circuit for amplifying a signal from the sensor, and a band-pass filter processing or a short-time processing of the electric signal output from the electric circuit. A surface roughness evaluation system for a component for an image forming apparatus, comprising: hardware or software having a function of performing a fast Fourier transform process; and a mechanism for relatively moving a surface roughness measurement sensor and a measured object. . A surface roughness measuring sensor for measuring the surface roughness of the component for the image forming apparatus; an electric circuit for amplifying a signal from the sensor; and a function for obtaining a Wigner distribution of the electric signal output from the electric circuit. A surface roughness evaluation system for a component for an image forming apparatus, comprising: hardware or software; a surface roughness measurement sensor; and a mechanism for relatively moving a measurement target. A substrate for an electrophotographic photosensitive member, which is evaluated by the surface roughness evaluation method according to any one of claims 1 to 4. An electrophotographic photosensitive member evaluated by the surface roughness evaluation method according to claim 1. An electrophotographic apparatus comprising the electrophotographic photosensitive member according to claim 14. Attach a vibration sensor to the cutting tool or a jig for mounting the cutting tool, measure the vibration of the cutting tool by the vibration sensor during cutting, create two-dimensional array data corresponding to the cutting surface from this measurement signal, Evaluating the two-dimensional array data, or performing signal analysis of the two-dimensional array data and evaluating, thereby performing cutting while grasping the cutting state, and cutting a part for an image forming apparatus. Method. 17. The method according to claim 16, wherein an analysis method of the created two-dimensional array data is a two-dimensional Fourier transform. 17. The method according to claim 16, wherein an analysis method of the created two-dimensional array data is two-dimensional multi-resolution analysis. 19. The method according to claim 18, wherein the method of the two-dimensional multi-resolution analysis is a discrete two-dimensional wavelet transform. The two-dimensional data created by measuring the vibration is subjected to a discrete two-dimensional wavelet transform, and a part of the result of the discrete two-dimensional wavelet transform is removed or arithmetic processing is performed, and then the two-dimensional wavelet inverse transform is performed. 20. The method according to claim 19, wherein the component is analyzed and evaluated. 19. The method according to claim 18, wherein the two-dimensional multi-resolution analysis is performed using a band-pass filter. 19. The cutting method according to claim 18, wherein the two-dimensional multi-resolution analysis method is a short-time fast Fourier transform. The method according to any one of claims 16 to 22, wherein the workpiece is aluminum or an aluminum alloy. 24. The method according to claim 16, wherein the workpiece is a substrate for an electrophotographic photosensitive member. Lathe, a vibration sensor that detects the vibration of the cutting tool used in the lathe, and a storage device that records a signal from the vibration sensor or a storage device that records two-dimensional data created from the signal from the vibration sensor, An image forming apparatus component cutting apparatus further comprising hardware or software for performing a discrete two-dimensional wavelet transform. A substrate for an electrophotographic photosensitive member prepared by the cutting method according to claim 16. An electrophotographic photosensitive member using the substrate for an electrophotographic photosensitive member according to claim 26. An electrophotographic apparatus comprising the electrophotographic photosensitive member according to claim 27.

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