JP2003501827A - Method for transferring elements and apparatus for enabling such transfer - Google Patents

Abstract

(57) [Summary] The grip (20) has a plurality of receiving surfaces (7) and an elastic membrane (4) that can be extended. In this case, each receiving surface (7) can move so that it can approach and separate uniformly. By using the grip (20), elements such as pads (1) and chips (1, 10, 9, 42) are changed in pitch from the donor substrate (2) to the receiver substrate (3). Can be transported. That is, the present invention belongs to the technical field of transferring elements from a donor substrate to a receiver substrate. In addition, the present invention relates to a transfer grip, a transfer method using the transfer grip according to the present invention, and further relates to a method for manufacturing a multifunctional chip using the transfer grip according to the present invention. .

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD OF THE INVENTION

The present invention is in the technical field of transferring elements from a donor substrate to a receiver substrate. The present invention also relates to a transfer grip, a transfer method using the transfer grip according to the present invention, and a method for manufacturing a multi-functional chip using the transfer grip according to the present invention. .

[0002]

[Prior Art and Problems to be Solved by the Invention]

It is already known to transfer chips from a first substrate to a second substrate using a grip, which is commonly referred to as a grip and which is actually an intermediate substrate, whether reusable or not. Is. Further, in order to perform chip-on-chip hybridization between the chip of the first base and the chip of the second base, the chip is linearly transferred from the first base toward the chip of the second base. That method is also known. Mass transfer is always performed between chips that have the same pitch in both the X and Y directions.

[0003]

[Means for Solving the Problems]

It is an object of the present invention that each element has a first pitch in a first direction and a second pitch in a second direction that are spaced from one another in a first direction to another pitch in a first direction and a second pitch. An apparatus and method that allows for mass transfer of elements to a receiving substrate where each element is to be placed at another pitch in the direction and spaced apart from each other.

The term “element” is understood to mean a wafer, chip or subchip, depending on the intended use.

The term “wafer” means any single layer or multilayer structure that can carry functional elements.

The wafer can be divided into chips that are the same or different from each other. Each chip has one or more functional elements. The chip can be divided into the same or different sub chips. Sub chips can also be divided.

In biological and chemical applications, subchips are commonly referred to as spots.

In the present invention, in particular, a chip having spots of various functions can be formed from a chip having a single function spot. Thus, transfer of a wafer from a donor medium to a receive medium, transfer of chips from a wafer to one or more wafers, which may themselves have chips, and from chip to one or more chips. The transfer of the sub-chips can be performed in the same manner.

The present invention can be applied to intensive hybridization such as chip-on-chip hybridization.

In the present invention, a matrix arrangement is provided on a substrate called donor substrate with a pitch (d ₁ ) in the first direction (X) and a pitch (d ₂ ) in the second direction (Y). A number of elements, such as a plurality of chips or spots, are transferred from the donor substrate to a grip with a means for moving the members closer and / or further apart.

After the first transfer is performed, by driving the approaching / separating means in the X direction and / or the Y direction, a new pitch (D ₁ ) and a second direction (X 1) in the first direction (X) are obtained. In Y), a new pitch (D ₂ ) arrangement is formed.

After the driving of the approaching / separating means, the final transfer to the receiving substrate takes place according to known methods.

Depending on the approaching / separating means used, the setting of the new pitch can take place several times, for example twice. In this case, the pitch setting of D ₁ is the first transfer from the donor substrate to the first intermediate substrate provided with the approaching / separating means, and then the approaching and / or separating operation is performed so that the pitch setting of D ₁ is made. Then, further transfer is performed from the first intermediate substrate to the second intermediate substrate provided with the approaching / separating means so that the pitch is set to D ₁ . That is, the present invention is a pitch (d ₁₎ for transferring a plurality of elements arranged side by side on a single line with a, or, and with a pitch (d ₁₎ in the first direction (X) second A grip for transporting a plurality of elements arranged in a matrix with a pitch (d ₂ ) in the direction (Y), the grip having a pitch (d ₁
) In the first direction, and in some cases in the second direction (Y), the pitch (
d ₂ ) more receiving surfaces are provided than the number of said plurality of elements to be transferred arranged with grips for gripping-to bring the receiving surfaces close to each other and / or to separate them from each other. The present invention relates to a grip, which is provided with means, and is capable of moving the receiving surfaces at variable pitches in at least the first direction.

It should be noted that the directions (X, Y) are usually perpendicular to each other. However, this configuration is not essential.

In a first embodiment, the grip comprises an extensible membrane and means for stretching the membrane, the means being in one tensioning direction with respect to the membrane or in a plurality of directions. The elements are evenly spaced from each other in the pulling direction of. The modified example of the first embodiment includes an elastic membrane capable of separating the elements by pulling the membrane. Also, elastic membranes can be used to bring the elements closer together. To provide such access, the membrane may be pre-stretched prior to receiving the element and then relaxed. This causes the elements to approach each other uniformly.

In a second embodiment, the receiving surface of the element comprises a support, each having a top surface. The means for moving the receiving surfaces closer to each other and / or separating the receiving surfaces from each other include elastic means for connecting adjacent supports in at least a first direction and a support located outside in at least a first direction. And a pulling force applying means connected to the.

The pulling force applying means may comprise pull bars connected to each of the first and last supports in the row of supports, which pull bars are associated with the columns. It is possible to translate in parallel directions.

The pulling force applying means has pull bars connected to each of the first and last supports in the column of supports, the draw bars being parallel to the rows. It is possible to translate in any direction. In a modification of this embodiment,
The receiving surface shall be capable of containing a liquid. The receiving surface can be hollow or porous, for example.

Grips of this kind can be used, in particular, for producing multifunction chips from single-function chips. For example, the spot of the multifunction chip is in the first direction (X).
In the same direction (d ₁ ) and in the second direction (Y) with the same pitch (d ₂ ).

The dimension in the first direction (X) is (n ₁ × d ₁ ) due to the n ₁ columns, and the dimension in the second direction (Y) is (n ₂ × d ₁ ) due to the n ₂ rows. when it is desire to n pieces of the spots as a _{2) (n = n 1 ×} n 2) to produce a n number of multi-function chips are arranged, the following method is used. Single-function chips are formed with more spots than the N multi-function chips that it is desired to manufacture. For example, if it was desired to manufacture N chips, each with n spots having a particular function, each single-function chip had N similar spots. N single function chips are formed. The single function chips are arranged in, for example, n ₃ columns and n ₄ rows. Here, N = n ₃ × n ₄ .

In this way, the N multi-functional chips, for example, each chip has n ₁ rows and n ₂ columns.
It is formed as a matrix of n ₃ columns and n ₄ rows arranged in rows.

In order to obtain such a multifunction chip, the following method is used. First of all, from the first single-function chip, for bringing them closer to each other and / or
Or transfer the N spots to a grip provided with means for spacing them from each other; -the receiving surfaces, in the first direction (X), the rows adjacent to each other are n ₁ × d _1. To a distance such that the length is equal to the length of the cutout path (C) plus the distance between the receiving surfaces in the second direction (Y) is n. Move closer to or more than ₂ * d < ₂ > plus the width of the truncation path (C);-transfer N spots to the final substrate.

The two operations of approaching or separating in the direction (X, Y) can be performed sequentially or simultaneously.

In this way, for example, a spot located at the upper left corner of the multifunction chip is obtained. Here, the n ₃ columns are separated from each other by a distance of n ₁ × d ₁ + C (C is the width of the cut path), and the n ₄ rows are separated by a distance of n ₂ × d ₂ + C. Separated from each other.

The same operation need only be repeated for the remaining (N-1) single function chips. In that case, the insertion of a spot having a rank i (i ≦ n ₁ ) in the X direction and a rank j (j ≦ n ₂ ) in the Y direction causes the receiving substrate to move in the X direction (
It is obtained by shifting i−1) × d ₁ and (j−1) × d ₂ in the Y direction.

[0026]   The spots have the same dimension d in the X direction₁ In the Y direction
All have the same dimension d₁ Does not have d₁₁, D₁₂, ..., d_1n1 The dimension
And in the Y direction d_{twenty one}, ..., d_2n2 If the dimensions are
n₁× d₁To Σdi (i = 1 to n), (i−1) × d₁ Σd1i (i = 1 to
i-1), n₂× d₂Σd_2jTo (j = 1 to n), (j-1) * d₂ Σd _2j It is clear that it is appropriate to replace (j = 1 to j-1)
.

If a variant is used in which the receiving surface is supposed to be able to contain a liquid, a cleaning stage should be provided after each transfer when carrying out multiple transfers with the same grip. You can In that case, the particular liquid medium for the next spot to be transferred is deposited in large quantities over the receiving surface.

[0028]

DETAILED DESCRIPTION OF THE INVENTION

  The present invention will be described below with reference to the accompanying drawings.

[0029]   FIG. 1 illustrates the purpose of the present invention. The chips or sub-chips of the wafer
Figure 1 (A) shows the arrangement of elements such as the spots or spots (1).
Thus, in the first network, the first peak between two chips adjacent to each other is
(Or, in the case of spots, the first between two adjacent spots)
Pitch) is d in the first direction₁ And d in the second direction₂ And on the other hand
In FIG. 1B, the second pitch between two chips adjacent to each other is the first pitch.
D in direction₁ And in the second direction D₂ That is the problem. Figure
In 1, the elements to be transported are represented by squares with the reference numeral (1).
Has been done. In FIG. 1, the first pitch (d₁And d₂) Is the second pitch (D ₁ And D₂) Is less than. However, the first pitch is
It may be longer than 2 pitches. In other words, one is big
And the other can be smaller. 2 is perpendicular to the substrate
And a cross-section through a plane extending in a direction parallel to the rows is shown. In Figure 2
Shows a plurality of chips (10) spaced from each other by a pitch (d).
It Substrate (2) is the donor substrate. Tip (10) uses grip (20)
From this donor substrate (2), the receiving group shown in FIGS.
It will be transferred to the plate (3). In the transfer method according to the present invention,
First, attach the grip to the grip (20) as shown in cross section in FIG.
Be transferred to. The grip (20) is extendable on the support plate (6)
It has an elastic membrane (4). Pull on both ends of the membrane (4)
A step (5) is provided. The support plate (6) has a circular or rectangular shape.
can do. The perimeter of the plate shall be shaped and free of sharp edges.
Has been. For example, it is rounded. This will not damage the membrane (4)
I'm supposed to be. The pulling means (5) can be of annular shape,
Allows simultaneous pulling in all directions. Or
, The pulling means are arranged symmetrically so that the two members can provide pulling in the X direction.
The other two members are placed symmetrically so that they can bring about a pull in the Y direction.
It can also be composed of a total of four members. In FIG. 3, the donor substrate (2)
And a chip (10) on this donor substrate (2) are shown, in this case
The flap (10) is a stretchable elastic membrane of the grip (20) from the substrate (2).
(4) is in a transfer standby state. As is well known,
10) is transferred from the donor substrate (2) to the receiving membrane (4). In that case
, Chips are received on the receiving side (7) of the membrane (4), and this receiving side (7)
Function as an intermediate intervening plane (8). Then, as shown in Figure 4, the membrane
The cord (4) is stretched in tension in all directions. men
Due to the uniformity of the bran (4), the membrane (4) is stretched uniformly. this
Allows the chips (10) to be evenly distributed with a new pitch (D).
Become. If the membrane (4) is not elastic and is simply stretchable, the dimensions (
D) should be larger than dimension (d). However, the membrane (4)
If the is elastic, pre-stretch the membrane and attach it to the grip (20).
It can be shrunk after the tip (10) is transferred to it. In this case,
The switch (D) can be smaller than the initial pitch (d). Menbu
If the run (4) is elastic, just as for stretchable membranes.
It is clear that a pitch larger than the initial pitch can be obtained. Chip (1
0) is set to the desired pitch, the chip (10) is
Transferred from the grip (20) to the receiving substrate (3). When the transfer is complete
, The chip (10), as shown in FIG.
3) It will be located above. FIG. 7 is a schematic diagram of the pull-out diagram illustrated in FIGS.
It is a figure which expands and shows the tension | pulling means (5). The pulling means (5) may be, for example, a jig.
It is composed of YO (11, 12), and a member is placed between these jaws.
A run has been inserted. For example, a jaw (11,
By the fastening means (13) for fastening 12), the jaws (11, 12) are
Fastened together and fastened on the membrane (4) over the width of the membrane.
Tied up. Pull in the direction perpendicular to the pulling direction across the width of the membrane.
The membrane (for example, pull it downwards) to stretch the membrane evenly in the pulling direction.
Can be stretched. For two-dimensional stretching, pull the other jaw to the second
It can be provided perpendicular to the direction.

The pulling means (5) can also be annular in shape. In this case,
A single pull can result in stretching in all directions.

FIG. 8 schematically shows a second embodiment of the grip (30) according to the invention. In this embodiment, the receiving surface (7) is tailored to individual requirements,
It can have a predetermined size. The receiving surface (7) is constituted by the upper surface of the support (15). In a special embodiment, the upper surface (7) of the support can contain a liquid. In that case, the upper surface of the support can be, for example, concave.
Alternatively, it can be formed from a porous medium. The support (15) can be configured as a matrix network such that rows are formed along the first direction and columns are formed along the second direction. Each row of supports comprises an initial support, a final support and an intermediate support. In the first direction, the supports are separated from the adjacent supports by the intermediate space (19). All the intermediate supports have a facing surface that faces the surface of the other support in the first direction. The first support and the last support in each row have surfaces perpendicular to the first direction that do not face the other surfaces of the support. Similarly, each row of supports is
It comprises an initial support, a final support and an intermediate support. In the second direction, the supports are separated from the adjacent supports by the intermediate space (21). All the intermediate supports have a facing surface that faces the surface of the other support in the second direction. The first support and the last support in each row have surfaces that are perpendicular to the second direction such that they do not face the other surfaces of the support. The support located on the outer side of the grip (30) is attached to the first pulling force applying means (27, 23, 26, 22) at the center in the first direction by interposing the pull rods (25, 24). Are connected to each other, and the pull rod (35
, 34) at the center in the second direction to be connected to the second pulling force applying means (32, 36, 33, 37). Each of the free spaces (19, 21) between the two facing surfaces of the adjacent supports has a support (15
) Are connected to springs (18, 17). This allows the support (
15) A force in the first direction is exerted between them (by the spring (18)), and a force in the second direction is exerted between the supports (15) (the spring (1)).
7)). The first pulling force applying means has pulling bars (22, 23) located on both sides of the entire receiving surface and perpendicular to the first direction. The pull rods (25, 24) connect the outer supports of each row to rings (27, 26) slidably attached to each of the pull rods (23, 22).

Similarly, the second pulling force applying means has pulling bars (32, 33) located on both sides of the entire receiving surface and perpendicular to the second direction. The pull rods (35, 34) connect the outer supports of each row to rings (37, 36) slidably attached to each of the pull rods (33, 32).

The operation of this grip (30) is shown in FIG. FIG. 9 shows the same grip (30) as the grip (30) shown in FIG. 8, in which case the supports (15) are moving away from each other. For simplicity of illustration, the support is shown in a smaller size than in FIG. When a pulling force (F) is applied to the pull rods (22, 23) in parallel to the first direction, the pull rods (34, 35) integrated with the rings (36, 37) are Each slides on a pull rod (32, 33) and is evenly spaced from one another under the action of a spring (18) inserted in the space (19) between the supports (15). Similarly, when a pulling force (F ′) is applied to the pulling rods (32, 33), the pulling rods (24, 25) inserted in the through holes (28) penetrating the support (15). ) Respectively slides with respect to the pull rods (22, 23) and is inserted into the space (21) between the supports (15) (21).
Under the action of 17), they are evenly spaced from one another. By inserting a locking means (not shown) such as a locking screw into the rings (27, 37) located at the corners, the support body (15) can be fixed in the pre-set state. When it is desired to bring the chips or the spots closer to each other between the donor substrate and the receiver substrate, the restraint of the corner ring by the locking means is released and the pull bar (22, 23, 32, 33) is desired. It is clear that by manipulating to the extent the support (15) only needs to be placed further apart in advance.

FIG. 10 shows a first possible mode of use of the grip (20, 30) according to the invention, where it is arranged with a pitch (d ₁ ) in the first direction and in the second direction. Chips (9) forming a donor matrix (14) arranged with a pitch (d ₂ ) are arranged with a pitch (D ₁ ) in a first direction and a second
Hybridized onto chips (38) forming a receiving matrix (39) arranged with a pitch (D ₂ ) in the direction. The chips (9) are transferred by the grips (20 or 30) according to the invention. The grip is not shown in FIG. The receiving surface is set at a pitch (D ₁ ) in the first direction and at a pitch (D ₂ ) in the second direction. Then, the transfer to the receiving matrix (39) is performed. This results in a hybridized matrix (40). Therefore, 1mm x 1mm G that performs radio wave function (amplification and frequency change)
It is possible to hybridize an aAs chip onto an 8 mm x 10 mm silicon chip that performs all logic and analog processing functions with lower frequency radio signals of medium frequency.

Another mode of use of the grips (20, 30) according to the invention is shown in FIG. This concerns the manufacture of the biochip (41). Each biochip (41) is composed of a plurality of spots (42) having a predetermined function. For example, each spot can carry one or more identical molecules (chemical or biological) called probes. The probe is suitable for carrying out a selective hybridization reaction with the target molecule that has come into contact with the probe. The probe can be, for example, a DNA strand. In FIG. 11, as shown in a simplified form in FIG.
It has twelve spots (42) arranged in a matrix of columns. Also, the spot (42) is shown by a square with dimension (d). In the following, 4 rows 3 by using 12 such single function chips (43), each chip having spots (42) with different functions.
A method of manufacturing a chip (41) having 12 multi-functional chips (41) arranged in a matrix of columns and each chip having a matrix of 2 rows and 6 columns will be described.

First of all, the spot (42) in the first single-function chip (43) is transferred using the grip (20 or 30) according to the invention. Spot (42)
Are separated from each other in the first direction by a length of 6 times the distance (d) plus the width of the cutout path (44) provided on the final receiving substrate. Also,
The spots (42) are, in the second direction, twice as long as the distance (d) plus the width of the cutout path (44) provided on the final receiving substrate, relative to each other. Be separated. The plurality of spots (42) arranged in this manner are then displayed in FIG.
The spots (42) are arranged as shown in B) and are transferred to the final receiving substrate (45). The above transfer and spacing operations are simply repeated for the other five single function matrices (43). However, the transfer operation performed on the receiving substrate (45) is performed by first transferring the substrate (45) to the transfer substrate before each transfer operation.
This is done after offsetting the distance (d) in the direction. As a result, the first row of each of the 12 multifunction chips (41) is obtained. Then, the same operation is repeated for the remaining six single-function chips (43) with the substrate (45) previously displaced by the distance (d) in the second direction. As a result, the substrate (45
12) to obtain 12 final multifunctional chips as shown for the chip (41) located in the upper left corner. The chip (41) has a multifunctional matrix (4
It is clear that it is not necessary to have spots in every row or column in 1). In this case, one or more of the last lines is incomplete.

Thereafter, the tip (41) is cut along the cutting path (44) if necessary.

As mentioned above, if a variant of the grip (30) is used, which, if necessary, can hold liquid on the upper surface (7) of the support (15), the receiving substrate A cleaning operation can be performed after the transfer operation to. This cleaning operation removes certain liquids that correspond to the function of the spot to be received immediately.
It can be done after a large amount of deposition on the receiving surface (7).

By using the above method, for example, 900 biochips each having a size of 3 mm × 3 mm and each having 225 spots arranged in 15 rows and 15 columns, 200 μm x 20 for each single function matrix
900 identical spots of size 0 μm were produced from 225 single-function matrices arranged in 30 rows and 30 columns. The separation distance in the transfer grip was 3.1 mm in each direction. That is, 15 × 200 μm
In addition, the length obtained by adding 100 μm of the length of the cutout path was taken as the separation distance.

[Brief description of drawings]

FIG. 1 is a diagram showing the purpose of the present invention.

FIG. 2 is a stage used to transfer a grip according to the invention and elements on a first substrate arranged at a first pitch onto a second substrate arranged at a second pitch. And FIG.

FIG. 3 is a stage used to transfer a grip according to the invention and the elements on a first substrate arranged at a first pitch onto a second substrate arranged at a second pitch. And FIG.

FIG. 4 is a stage used to transfer a grip according to the present invention and elements on a first substrate arranged at a first pitch onto a second substrate arranged at a second pitch. And FIG.

FIG. 5 is a stage used to transfer a grip according to the present invention and elements on a first substrate arranged at a first pitch onto a second substrate arranged at a second pitch. And FIG.

FIG. 6 is a stage used to transfer a grip according to the invention and the elements on a first substrate arranged at a first pitch onto a second substrate arranged at a second pitch. And FIG.

FIG. 7 is a diagram showing details of the grip shown in FIG. 3 in the first embodiment.

FIG. 8 is a diagram showing a second embodiment of the grip according to the present invention.

FIG. 9 is a view showing a second embodiment of the grip according to the present invention.

FIG. 10 shows a first mode of use of the grip in the method according to the invention.

FIG. 11 shows a second mode of use of the grip in the method according to the invention.

[Explanation of symbols]

  1 element   2 Donor substrate (first substrate)   3 Receiving substrate (2nd substrate)   4 membranes (approaching means)   5 Pulling means (approaching means)   7 receipt side 15 Support 17 Spring (elastic means, approaching / separating means) 18 Spring (elastic means, approaching / separating means) 20 grips 22 Pull bar (pulling force applying means, approaching / separating means) 23 Pull bar (pulling force applying means, approaching / separating means) 24 Pull bar (pulling force applying means, approaching / separating means) 25 Pull bar (pulling force applying means, approaching / separating means) 26 ring (pulling force applying means, approaching / separating means) 27 ring (tensile force applying means, approaching / separating means) 30 grip 32 Pull bar (pulling force applying means, approaching / separating means) 33 Pull bar (pulling force applying means, approaching / separating means) 34 Pull bar (pulling force applying means, approaching / separating means) 35 Pull bar (pulling force applying means, approaching / separating means) 36 ring (tensile force applying means, approaching / separating means) 37 ring (tensile force applying means, approaching / separating means) 41 Biochip (chip) 42 spots 43 Single Function Matrix 44 Cutting route 45 Receiving substrate

[Procedure for Amendment] Submission for translation of Article 34 Amendment of Patent Cooperation Treaty

[Submission date] May 5, 2001 (2001.5.5)

[Procedure Amendment 1]

[Document name to be amended] Statement

[Name of item to be amended] Claims

[Correction method] Change

[Contents of correction]

[Claims]

2. A grip according to claim 1, wherein (30), wherein the pulling force applying means (22-27; 32-37) are pre-Symbol support the first support and the last in the row forming A grip characterized in that it has pull bars ( 24, 25 ) connected to each of the supports, these pull bars being translatable in a direction parallel to the rows.

3. The grip (30) according to claim 1 , wherein the tensile force applying means (22-27; 32-37) are the first support and the last support in the row formed by the supports. A grip characterized in that it has pull bars (34, 35) connected to each of the bodies, the pull bars being translatable in a direction parallel to the rows.

4. The grip (30) according to claim 2 or 3 , wherein the pull rods (24, 25; 34, 35) are the pull rods (24, 2).
5; 34, 35) and the pulling rod (32, which is positioned parallel to the pulling direction).
, 33; 22, 23) and slidable rings (26, 27; 36)
, 37) connected to the grip.

5. The grip (30) according to any one of claims 1 to 4 , characterized in that the receiving surface (7) of the support (15) can contain a liquid. Grip to do.

6. A plurality of elements () arranged in a matrix with a pitch (d ₁ ) in the first direction (X) and a pitch (d ₂ ) in the second direction (Y).
1) A method for transferring 1), which comprises firstly providing from the first substrate (2) more receiving surfaces (7) than the number of said plurality of elements (1) to be transferred. In carrying out the method of transferring to the grip ( 30 ) being opened and then from the grip (30) to the second substrate (3), it is also possible in the first direction. Said receiving surfaces (7) being movable relative to each other by using means for bringing said receiving surfaces (7) closer together and / or separating them from each other in said second direction. Using a grip; -transferring said element (1) to be transferred from said first substrate (2) to said receiving surface of said grip; -said receiving surface (7) from said first And in the second direction if possible There are moved away or closer to each other; -; wherein the said element (1), the receiving surface of the grip, transport and into the second base (2).

[Claims]7] N₁ Row and n₂ In line (n₁ × n₂ = N) arranged
Each chip has its own function (F₁, F₂,,, F_n ) With n spots
To (42) (P₁, P₂,…, P_n ) With N chips (41)
In the direction of the pitch (d₁ ) And in the second direction the pitch (d₂ )
So n₃ Row and n_Four Line (n₃ × n_Four = N), the same N arranged in
To fabricate from n single-function matrices, each with a number of spots
Method of   In this case, the first chip is functional (F₁ ) N spots (P₁ ),
The last chip is the function (F_n ) N spots (P_n ) If you have
And   a) From the first single-function chip,₃ Row and n_Four Matri in a row
At least N receiving surfaces arranged in the box and close to and / or close to each other.
Or a grip with said receiving surface movable relative to each other by means for separating.
Transfer the spot to   b) driving said means for approaching and / or separating from each other in said row direction
And the pitch (d₁ ) N₁ Cut route (4
Adjust the distance so that the length is the width of 4);   c) driving said means for approaching and / or separating from each other in said column direction
And the pitch (d₂ ) N₂ Cut route (4
Adjust the distance so that the length is the width of 4);   d) The spot of the first chip, from the grip, the N chips
Transfer to a receiving substrate for;   e) (n₁ -1) For each of the other single-function chips,
In the row direction for each (d₁ )), And then the above a) to d) operations are performed (n ₁  -1) Repeatedly, thereby forming the first row of N multi-functional chips (41)
Do;   f) n₁ X (n₂ -1) for (n) other single-function chips₂ -1)
With respect to the other rows, the receiving substrate (45) is separated by a distance (d₂ ) Just move
After moving it, the above a) to e) operations are performed (n₂ -1) repeated, which gives
The remaining (n) of the N multi-function chips (41)₂ -1) forming rows;   g) If necessary, cut the receiving substrate along the cutout path (44).
R; A manufacturing method characterized by the above.

8. The manufacturing method according to claim 7 , wherein the receiving surface (7) comprises a support (15) each having an upper surface (7), the receiving surface (15) of the support (15). 7) uses a grip such as is supposed to be able to contain a liquid, and prior to the transfer of said spot of at least one said single-function chip, a specific corresponding to the function of the spot to be received immediately afterwards. Liquid for all said receiving surfaces (7)
A manufacturing method characterized by depositing a large amount on top.

[Procedure Amendment 2]

[Document name to be amended] Statement

[Name of item to be corrected] 0002

[Correction method] Change

[Contents of correction]

[0002]

BACKGROUND OF THE INVENTION A grip, which is commonly referred to as a grip and is actually an intermediate base, whether or not it is reusable, is used to provide a first base to a second base. Transferring chips to two substrates is already known. Further, in order to perform chip-on-chip hybridization between the chip of the first base and the chip of the second base, the chip is linearly transferred from the first base toward the chip of the second base. That method is also known. Mass transfer is always performed between chips that have the same pitch in both the X and Y directions. In Japanese Sho 63-023334 Patent Gazette (SONY Corporation) are grips is disclosed which includes a is the shape of the metal ring (7) Film (3). The disc (1) is adhered onto the film (3). Contact adhesive film (3) is then stretched, as a result, and if the semiconductor (2) adjacent to each other on the disk (1) is spaced apart from each other, thereby, the semiconductor chip (2) How to between A separation is obtained. More using the apparatus described in this document, each other is moved away tip each other, it is the this distance the tip each other to each other. U.S. Pat. No. 4,465,543 (TOKYO SHIBAURA ELECTRIC) discloses a device which essentially comprises three members. In this case, the first member is a member intended to convey the band (B) shown in FIG. 1 in the BD direction by using the toothed wheel engaged with the band . A table (31) is provided at the end of the first member parallel to the band (B). Table (31), for example as shown in FIGS. 1 and 2, on the vertical axis is a movably ability. The table (31) is also movable in the BD direction on the support (25, 26) shown in FIG. The second member is shown in FIG . The second member is made of the inclined band, the inclined band has an inclined tip shown FIGS. 5 and 6 smell Te by the sign (34E or 34E '). Adhesive band (A) is by toothed wheels (36, 37) is engaged in one direction, such as for example AD ₁ Tsu trough. Known in English as the'apical plane ', the tip of the band (A) is parallel to the band (BD) below and in the vicinity of the band (BD). Matrix scan consisting chip (100) is formed on the band (A). The assembly (34) forming an inclined plane between the toothed wheels (36, 37) is movable in the SD direction perpendicular to the BD direction . The operation is as follows. For example, the first row of the matrix is formed, for example, by moving the device (34) to the height of position (101) in FIG. At this time, the table (31) is sent down descending, by which the band (B) is in contact with the line (101), this line (101) is transferred to the band (B). This transport by band (A) is pulled toward both sides of or falling edge of di line (101), the line (101) of the part already possible even if detached from the bands (A) Is. After that, the member (34) moves in the SD direction to form the band (102), the band (103), and the like. In Japanese Patent Sho 62-026833 Patent Publication (MITSUBISHI ELECTRIC Corp.), the means for spacing move the chips to each other is disclosed. Chip is initially disposed on the first band, Push toward the wheel having a boss by a pointer (16) Murrell. When the pointer (16) pushes the chip toward the boss, the chip (4) adheres onto the boss. Then, the boss rotates 180 ° and faces the second band. After advancing the second band, it is possible to place a chip on the second band. As a result, the chip arrangement can be changed .

Claims (11)

[Claims] 1. Transferring a plurality of elements (1) arranged side by side in a row with a pitch (d ₁ ), or in the first direction (X) a pitch (d ₁ ).
A grip (20, 30) for transporting a plurality of elements (1) arranged in a matrix with a pitch (d ₂ ) in the second direction (Y), the grip comprising a pitch (d). More than the number of said plurality of elements (1) to be transported arranged in the first direction with (d ₁ ) and possibly with pitch (d ₂ ) in the second direction (Y). Receiving surfaces (7) are provided, said grips-means (5,4,7,8,17,18,) for bringing said receiving surfaces (7) closer together and / or separating them from each other. 22-27, 32-37
), Said means being capable of moving said receiving surfaces (7) at variable pitches at least in said first direction. 2. Grip (20) according to claim 1, wherein said means (4, 5) for bringing said receiving surfaces (7) closer to and / or further apart from each other are at least said first. A grip characterized in that it comprises a membrane (4) which is stretchable in the direction. 3. Grip (20) according to claim 1, wherein said means (4, 5) for bringing said receiving surfaces (7) closer to and / or further apart from each other are at least said first. Directionally elastic membrane (4), said means (4, 5) for bringing said receiving surfaces (7) closer to one another relaxes said previously stretched elastic membrane (4). The grip is characterized in that the above-mentioned approach is performed. 4. Grip (30) according to claim 1, wherein said receiving surfaces (7) comprise supports (15) each having an upper surface (7), said receiving surfaces being closer to and / or closer to each other. Alternatively, the means for separating from each other is provided with an elastic means (18, 17) for connecting the support bodies (15) adjacent to each other in at least the first direction and an outer side in at least the first direction. A grip force applying means (22-27; 32-37) connected to the positioned support body (15). 5. The grip (30) according to claim 4, wherein the pulling force applying means (22-27; 32-37) further comprises a first support and a last support in the row formed by the supports. A grip, characterized in that it has pull bars (34, 35) connected to each of said supports, said pull bars being translatable in a direction parallel to said rows. 6. Grip (30) according to claim 4, wherein said tension applying means (22-27; 32-37) are the first support and the last support in said row of said supports. A grip characterized in that it has pull bars (34, 35) connected to each of the bodies, the pull bars being translatable in a direction parallel to the rows. 7. The grip (30) according to claim 5 or 6, wherein the pull rods (24, 25; 34, 35) are the pull rods (24, 2).
5; 34, 35) and the pulling rod (32, which is positioned parallel to the pulling direction).
, 33; 22, 23) and slidable rings (26, 27; 36)
, 37) connected to the grip. 8. The grip (30) according to any one of claims 4 to 7, characterized in that the receiving surface (7) of the support (15) is capable of containing a liquid. Grip to do. 9. Transferring a plurality of elements (1) arranged side by side in a row with a pitch (d ₁ ), or in the first direction (X) a pitch (d ₁ ).
A method for transferring a plurality of elements (1) arranged in a matrix with a pitch (d ₂ ) in a second direction (Y), first of all from a first substrate (2) , To a grip (20, 30) provided with more receiving surfaces (7) than the number of said plurality of elements (1) to be transferred, and then from said grip to a second substrate In carrying out the method of transferring to (3):-to move the receiving surfaces (7) towards and / or away from each other in the first direction and possibly in the second direction. Using said grips in which said receiving surfaces (7) are movable with respect to each other by means of: for transferring said element (1) to be transferred from said first substrate (2), Transfer to the receiving surface of the grip -Separating or approaching the receiving surfaces (7) from each other in the first direction and possibly in the second direction; -said element (1) from the receiving surface of the grip to the second base body Transferring to (2); 10. n₁ Row and n₂ In line (n₁ × n₂ = N)
Each chip has its own function (F₁, F₂,,, F_n ) With n spots
(42) (P₁, P₂,…, P_n ) With N chips (41)
In the direction of the pitch (d₁ ) And in the second direction the pitch (d₂ )so
Take n₃ Row and n_Four Line (n₃ × n_Four = N), the same number of N arranged in
For manufacturing from n single-function matrices, each of which has a spot of
Method,   In this case, the first chip is functional (F₁ ) N spots (P₁ ),
The last chip is the function (F_n ) N spots (P_n ) If you have
And   a) From the first single-function chip,₃ Row and n_Four Matri in a row
At least N receiving surfaces arranged in the box and close to and / or close to each other.
Or a grip with said receiving surface movable relative to each other by means for separating.
Transfer the spot to   b) driving said means for approaching and / or separating from each other in said row direction
And the pitch (d₁ ) N₁ Cut route (4
Adjust the distance so that the length is the width of 4);   c) driving said means for approaching and / or separating from each other in said column direction
And the pitch (d₂ ) N₂ Cut route (4
Adjust the distance so that the length is the width of 4);   d) The spot of the first chip, from the grip, the N chips
Transfer to a receiving substrate for;   e) (n₁ -1) For each of the other single-function chips,
In the row direction for each (d₁ )), And then the above a) to d) operations are performed (n ₁  -1) Repeatedly, thereby forming the first row of N multi-functional chips (41)
Do;   f) n₁ X (n₂ -1) for (n) other single-function chips₂ -1)
With respect to the other rows, the receiving substrate (45) is separated by a distance (d₂ ) Just move
After moving it, the above a) to e) operations are performed (n₂ -1) repeated, which gives
The remaining (n) of the N multi-function chips (41)₂ -1) forming rows;   g) If necessary, cut the receiving substrate along the cutout path (44).
R; A manufacturing method characterized by the above. 11. The manufacturing method according to claim 10, wherein the receiving surface (7) comprises a support (15) each having an upper surface (7), the receiving surface (7) of the support (15). 7) uses a grip such as is supposed to be able to contain a liquid, and prior to the transfer of said spot of at least one said single-function chip, a specific corresponding to the function of the spot to be received immediately afterwards. Liquid for all said receiving surfaces (7)
A manufacturing method characterized by depositing a large amount on top.