JP2003257911A - Dressing method and dressing device, polishing device, and semiconductor device and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To flatly dress a polishing pad with higher accuracy. <P>SOLUTION: A dressing device 6 dresses the polishing surface of a polishing pad 4 by moving a substrate 5 relatively to a dressing tool 11 while making the polishing surface of the polishing pad 4 supported by the substrate 5 abut on the dressing surface 13 of the dressing tool 11. A tilt adjusting mechanism 22 can be set by adjusting the relative tilt of the dressing surface 13 to a required tilt on the basis of the lower surface of the substrate 5. While keeping the relative tilt of the dressing surface 13 set by the tilt adjusting mechanism 22, as the substrate 5 is moved relatively to the dressing tool 11, the polishing surface of the polishing pad 4 is dressed. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a dressing method and apparatus for dressing a polishing surface of a polishing pad for polishing an object to be polished such as a semiconductor device wafer, a polishing apparatus, and a semiconductor device manufacturing method using the polishing apparatus. And a semiconductor device.

[0002]

2. Description of the Related Art For example, chemical mechanical polishing (Ch
emical Mechanical Polishing or Chemical Mechanical
A polishing pad is used in a polishing apparatus that performs planarization (hereinafter, referred to as CMP).

Since the polishing surface of such a polishing pad is clogged and deteriorates depending on the polishing time, it is maintained so that good dressing can be continued by performing regular dressing.

This dressing is performed by bringing the polishing surface of the polishing pad supported by the base material into contact with the dressing surface of the dressing tool and moving the base material and the dressing tool relatively. The relative movement is performed, for example, by rotating both the base material supporting the polishing pad and the dressing tool. Due to manufacturing errors and the like, it is difficult to make the rotation axis of the base material and the rotation axis of the dressing tool completely parallel, so in practice,
Both axes of rotation are slightly inclined to each other.

Conventionally, a gimbal mechanism is used between the dressing tool and its rotating shaft in order to dress the polishing pad evenly in spite of such an inclination, and the gimbal mechanism utilizes the angle followability of the dressing tool. Then it was dressed. For example, since a CMP apparatus is required to polish a semiconductor wafer or the like with high precision, the polishing pad is also required to be flat with high precision. Therefore, conventionally, when dressing a polishing pad used in a CMP apparatus or the like,
It has been considered indispensable to utilize the angle followability of the gimbal mechanism.

[0006]

In recent years, in order to further miniaturize semiconductor devices, it has been required to polish semiconductor wafers and the like to a flat surface with higher accuracy. Along with this, polishing pads are more required. It is required to be flat with high accuracy. Therefore, it has become necessary to dress the polishing pad evenly with high accuracy.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a dressing method and apparatus capable of dressing a polishing pad evenly with high accuracy.

Another object of the present invention is to provide a polishing apparatus capable of polishing an object to be polished by using a polishing pad which is dressed flat with high accuracy.

Further, the present invention provides a semiconductor device manufacturing method capable of manufacturing a semiconductor device with improved yield and low cost, and a low cost semiconductor device, as compared with the conventional semiconductor device manufacturing method. To aim.

[0010]

As a result of the research conducted by the present inventor,
In the dressing of the polishing pad utilizing the angle followability by the gimbal mechanism as described above, the reason is as follows.
It has been found that there is a limit to improving the flatness of the polishing pad.

First, when the distance between the center position of the dressing tool and the center position of the polishing pad changes, the radial cross-sectional shape of the polishing pad becomes convex upward due to the effect of the eccentric load on the gimbal mechanism. The surface shape of the polishing pad changes due to the grading or the upward depression, and it is difficult to improve the flatness of the polishing pad.

Secondly, since the mechanical resistance of the gimbal mechanism varies in each direction, the surface shape of the polishing pad varies due to the influence of this variation, and the flatness of the polishing pad is improved. It is difficult.

Thirdly, the mechanical resistance between the polishing pad and the dressing tool changes in each part due to the individual difference of the dressing tool and the progress of wear, and accordingly the dressing is performed by the angle followability of the gimbal mechanism. Since the tool is tilted, it is difficult to improve the flatness of the polishing pad.

As described above, as a result of the research conducted by the present inventor, the angle-following property of the gimbal mechanism, which was conventionally considered to be indispensable for dressing the polishing pad with high precision and flatness, was found to be excellent. It turned out to be an obstacle when trying to dress flatly with higher precision.

The present invention has been made as a result of the investigation of the cause, which is contrary to the conventional common sense.
In order to solve the above-mentioned problems, the dressing method according to the first aspect of the present invention comprises bringing the polishing surface of a polishing pad supported by a base material into contact with the dressing surface of a dressing tool to form the base material and the dressing tool. In the dressing method of dressing the polishing surface by relatively moving and, the setting step of adjusting and setting the relative inclination of the dressing surface with respect to the base material to a desired inclination, and the setting step. And a dressing step of dressing the polishing surface while maintaining the relative inclination set in (4).

In the dressing method according to the second aspect of the present invention, in the first aspect, the setting step includes a step of obtaining information according to a surface shape of the polishing surface, and the relative step based on the information. And a step of adjusting and setting a different inclination.

A dressing method according to a third aspect of the present invention is, in the first or second aspect, including a step of alternately repeating the setting step and the dressing step a plurality of times.

A dressing method according to a fourth aspect of the present invention is the dressing method according to any one of the first to third aspects, wherein the dressing of the polishing surface in the dressing step is such that a part of the dressing surface is the polishing surface. It is performed in a state where it protrudes from the surroundings.

In a dressing method according to a fifth aspect of the present invention, in any one of the first to fourth aspects, the relative inclination passes near the center of the polishing surface and near the center of the dressing surface. The inclination is about a predetermined axis that is substantially orthogonal to the straight line.

In the dressing device according to the sixth aspect of the present invention, the polishing surface of the polishing pad supported by the base material is brought into contact with the dressing surface of the dressing tool to relatively move the base material and the dressing tool. By letting
In a dressing device for dressing the polishing surface, a tilt adjusting mechanism that can set a relative tilt of the dressing surface with respect to the base material to a desired tilt, and the tilt adjusting mechanism that sets the tilt. And a moving mechanism for dressing the polishing surface by moving the base material and the dressing tool relative to each other while maintaining the relative inclination.

The dressing device according to a seventh aspect of the present invention is the dressing device according to the sixth aspect, wherein the relative inclination is a desired inclination based on information according to the surface shape of the polishing surface. A control unit for operating the tilt adjusting mechanism is provided.

A dressing device according to an eighth aspect of the present invention is the dressing device according to the seventh aspect, further comprising a measuring section for acquiring the information.

In the dressing device according to the ninth aspect of the present invention, the polishing surface of the polishing pad supported by the base material is brought into contact with the dressing surface of the dressing tool, and the base material and the dressing tool are relatively moved. By letting
In a dressing device for dressing the polishing surface, (a) an inclination adjusting mechanism capable of adjusting and setting a relative inclination of the dressing surface with respect to the base material to a desired inclination, and (b) the inclination adjustment A moving mechanism for dressing the polishing surface by relatively moving the base material and the dressing tool while maintaining the relative inclination set by the mechanism, and (c) information according to the surface shape of the polishing surface. And (d) in response to a predetermined command signal, (i) actuating the moving mechanism to perform the dressing, and (ii) acquiring by the measuring unit after the dressing in (i). Based on the information obtained, it is determined whether or not the currently set relative inclination is a desired inclination, and (iii) when it is determined that the relative inclination is a desired inclination in (ii). In the case where the adjustment of the relative inclination is completed and (iv) it is determined that the inclination is not the desired inclination in (ii), the relative inclination becomes the desired inclination or an inclination close to the desired inclination. As described above, the control unit repeats the operations after (i) after the tilt adjusting mechanism is operated.

A dressing device according to a tenth aspect of the present invention is the dressing device according to any one of the sixth to ninth aspects,
The dressing of the polishing surface is performed with a part of the dressing surface protruding from the periphery of the polishing surface.

The dressing apparatus according to an eleventh aspect of the present invention is the dressing apparatus according to any one of the sixth to tenth aspects, wherein the relative inclination passes near the center of the polishing surface and near the center of the dressing surface. The inclination is about a predetermined axis that is substantially orthogonal to the straight line.

A polishing apparatus according to the twelfth aspect of the present invention is
A polishing tool having a polishing pad, and a holding unit for holding an object to be polished, a load is applied between the polishing pad of the polishing tool and the object to be polished, and the polishing tool and the object to be polished are opposed to each other. In the polishing apparatus for polishing the object to be polished by moving, the polishing pad is the dressing method according to any one of the first to fifth aspects or the dressing apparatus according to any one of the sixth to eleventh aspects. It is dressed.

A polishing apparatus according to the thirteenth aspect of the present invention is
A polishing tool having a polishing pad, and a holding unit for holding an object to be polished, a load is applied between the polishing pad of the polishing tool and the object to be polished, and the polishing tool and the object to be polished are opposed to each other. The polishing apparatus for polishing the object to be polished by moving the polishing apparatus includes the dressing apparatus according to any one of the sixth to eleventh aspects.

A semiconductor device manufacturing method according to a fourteenth aspect of the present invention comprises a step of flattening the surface of a semiconductor wafer using the polishing apparatus according to the twelfth or thirteenth aspect.

A semiconductor device according to a fifteenth aspect of the present invention is manufactured by the semiconductor device manufacturing method according to the fourteenth aspect.

[0030]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A dressing method and apparatus, a polishing apparatus, a semiconductor device and a semiconductor device manufacturing method according to the present invention will be described below with reference to the drawings.

[First Embodiment]

FIG. 1 is a schematic configuration diagram schematically showing a polishing apparatus according to the first embodiment of the present invention. FIG. 2 shows a dressing tool 11 when dressing the polishing pad 4.
FIG. 6 is a schematic plan view schematically showing the positional relationship between the dressing surface 13 and the polishing pad 4.

The polishing apparatus according to this embodiment comprises a polishing tool 1, a wafer holder 3 for holding a wafer 2 below the polishing tool 1 located at a polishing station (polishing zone),
A polishing agent supply unit (not shown) that supplies a polishing agent (slurry) between the wafer 2 and the polishing tool 1 via a supply path (not shown) formed in the polishing tool 1, and a dressing station (dressing zone). ), A dressing device 6 for dressing the polishing surface of the polishing pad 4 of the polishing tool 1 located at the dressing station, a displacement meter 7 disposed at the dressing station, a controller 8 including a computer, and a controller 8 A drive unit 9 for driving the motors of the respective units under the control of the above and an input unit 10 such as a keyboard are provided.

The polishing tool 1 has a polishing pad 4 and a base material 5 for supporting the surface of the polishing pad 4 opposite to the polishing surface. In the present embodiment, as shown in FIG. 2, the polishing pad 4 has a ring shape in which a portion near the center of rotation is removed, but the shape is not limited to this, and for example, a circle. It may be plate-shaped. Polishing tool 1
1 can rotate, move up and down, and oscillate (reciprocate) left and right by a mechanism (not shown) using an electric motor as an actuator, as shown by arrows A, B, and C in FIG. Further, the polishing tool 1 is moved by an unillustrated moving mechanism using an electric motor as an actuator.
As shown in FIG. 1, it is possible to move to a polishing station and a dressing station.

The polishing tool 1 is mechanically connected to a rotary shaft 16 via a gimbal mechanism 15 which can be locked.
Although not shown in the drawing, this gimbal support structure 15
Has a configuration basically similar to that of a gimbal mechanism used conventionally, but also has a lock mechanism operated by an electromagnetic actuator, and under the control of the control unit 8, the polishing tool 1
So that it can be tilted with respect to the rotating shaft 16 (gimbal state) and a state in which the polishing tool 1 is fixed with respect to the rotating shaft 16 and cannot be tilted (gimbal lock state) can be switched. Has been done. In the gimbal-locked state, the lower surface of the base material 5 (polishing pad support surface) is perpendicular to the rotating shaft 16. Gimbal mechanism 15
Is placed in a gimbal state at the polishing station and placed in a gimbal locked state at the dressing station.

The wafer 2 is held on the wafer holder 3, and the upper surface of the wafer 2 is the surface to be polished. The wafer holder 3 has a mechanism (not shown) using an electric motor as an actuator, as shown by an arrow D in FIG.
It can be rotated.

In the present embodiment, the diameter of the polishing tool 1 is smaller than the diameter of the wafer 2, the footprint of the entire apparatus is small, and high-speed, low-load polishing is easy. However, in the present invention, the diameter of the polishing tool 1 may be the same as or larger than the diameter of the wafer 2.

Now, the polishing of the wafer 2 by this polishing apparatus will be described. In the polishing station, the polishing tool 1 swings while rotating and is pressed against the upper surface of the wafer 2 on the wafer holder 3 with a predetermined pressure (load). Rotate the wafer holder 3 to rotate the wafer 2,
A relative movement is performed between the wafer 2 and the polishing tool 1. In this state, the polishing agent is supplied from the polishing agent supply unit between the wafer 2 and the polishing tool 1, and diffuses between them to polish the surface to be polished of the wafer 2. That is, the mechanical polishing due to the relative movement of the polishing tool 1 and the wafer 2 and the chemical action of the polishing agent act synergistically to perform favorable polishing.

The dressing device 6 comprises a dressing tool 11. In the present embodiment, the dressing tool 11 has a disk-shaped tool body 12 in which a ring-shaped portion on the outer peripheral side of the upper surface is configured as a plane having a higher level, and a diamond or the like is formed on the upper surface of the ring-shaped portion. It has a structure in which abrasive grains are distributed. The ring-shaped region in which the abrasive grains are distributed constitutes the dressing surface 13. However, the configuration of the dressing tool 11 is not limited to such a configuration. Also, the dressing surface 13
Is not limited to a ring shape, and may be a circular shape, for example.

Further, in the present embodiment, the dressing device 6 includes a rotating mechanism 21 for rotating the dressing tool 11 as indicated by an arrow E, and an arrow F on the dressing surface 13.
A tilt adjusting mechanism 22 capable of adjusting and setting a tilt in a direction,
Is equipped with.

The tilt adjusting mechanism 22 has a bracket 24 fixed to a base 23, a tilting member 26 supported by the bracket 24 so as to be tiltable by a shaft 25, and an electric motor as an actuator (not shown). When the tilting member 26 is tilted by operating the motor and the electric motor is stopped, the tilting member 26 is held at that position. Needless to say, the tilt adjusting mechanism 22 is not limited to such a structure and various structures can be adopted.
Although not shown in detail in the drawing, a base side of the rotating mechanism 21 is fixed to the tilting member 26, and a rotating side of the rotating mechanism 21 is fixed to the tool body 12 of the dressing tool 11. The rotation mechanism 21 has an electric motor (not shown) as an actuator.

The shaft 25 of the tilt adjusting mechanism 22 extends in a direction perpendicular to the paper surface of FIG. 1, and is a straight line G (FIG. 2) shown in FIG.
Center O1 of the polishing pad 4 at the time of dressing shown in
And a straight line passing through the center O2 of the dressing surface 13 of the dressing tool 11).
Thereby, in the present embodiment, the inclination of the dressing surface 13 around the axis of the shaft 25 (direction of arrow F) can be adjusted and set. Although it is most preferable to be able to adjust the inclination of the dressing surface 13 in this direction F, the inclination adjusting mechanism 22 may be configured so that the inclination of the dressing surface 13 in other directions can be adjusted. In the present embodiment, the inclination adjusting mechanism 22 is configured to adjust and set the inclination of the dressing surface 13 as described above, but conversely, adjust the inclination of the polishing tool 1. It is also possible to configure so that it can be set.

As shown in FIGS. 1 and 2, the dressing of the polishing surface (the lower surface in this embodiment) of the polishing pad 4 was applied by the polishing pad 4 of the polishing tool 1 located at the dressing station. In this state, the dressing tool 11 is pressed against the dressing surface 13 of the dressing tool 11 by the arrows A,
By rotating as indicated by E, it is performed in the same manner as polishing. However, the polishing tool 1 is not rocked in the direction of arrow C. As shown in FIGS. 1 and 2, this dressing is performed with a part of the dressing surface 13 protruding from the polishing pad 4 to the outer peripheral side and the inner peripheral side thereof. During this dressing, the gimbal mechanism 15 is set to the gimbal lock state, and the tilt adjusting mechanism 22 sets the preset dressing surface 13 of the dressing tool 11.
The inclination of is maintained as it is. Therefore, during dressing of the polishing pad 4, the relative inclination of the dressing surface 13 with respect to the polishing pad supporting surface (lower surface) of the base material 5 of the polishing tool 1 does not change.

In the present embodiment, the displacement gauge 7 arranged at the dressing station constitutes a measuring unit for obtaining information according to the surface shape of the polishing surface of the polishing pad 4. The displacement gauge 7 obtains this information under the control of the control unit 8. In the present embodiment, although not shown in the drawings, a commercially available contact stylus type displacement meter is used as the displacement meter 7, and the stylus contacts the polishing surface of the polishing pad 4 and moves up and down according to the height thereof. The surface shape of the polishing surface of the polishing pad 4 can be measured by sliding the stylus in the radial direction of the polishing pad 4. Since the height of each position on the circumference of the polishing pad 4 having the same radius is substantially the same, the height of each position on one line along a certain radius of the polishing pad 4 may be measured. Good. As the displacement gauge 7, an optical displacement gauge or the like may be used instead of the contact stylus displacement gauge.

As a normal control, the control unit 8 controls each unit so that the above-mentioned polishing operation is performed in the polishing station, and controls each unit so that the above-mentioned dressing is performed at the dressing station at a predetermined frequency.

The controller 8 also performs the tilt adjustment control shown in FIG. FIG. 3 is a schematic flowchart showing the operation of the tilt adjustment control. The control unit 8 starts the tilt adjustment control in response to the tilt adjustment command signal from the input unit 10 operated by the operator. This command signal may be given, for example, when the dressing tool 11 is replaced with a new one. However, the tilt adjustment command signal may be given at a predetermined frequency even during the period when the same dressing tool 11 is used. The tilt adjustment command signal may not be given from the input unit 10 by the operator, but may be automatically generated, for example, by the control unit 8 itself judging the time corresponding to the preset frequency.

When the control section 8 starts the tilt adjustment control,
First, the dressing of the polishing pad 4 described above is performed (step S1). When this dressing is completed, the control unit 8 gives the displacement meter 7 a control signal to measure the surface shape of the polishing pad 4 described above, and takes in the surface shape data (step S2). When measuring the surface shape, for example, the rotation of the dressing tool 11 is stopped, the polishing surface of the polishing pad 4 is lifted from the dressing surface 13 of the dressing tool 11, and the polishing tool 1 is rotated.

Next, the control unit 8 determines whether or not the latest surface shape captured in step S2 is within a predetermined allowable range with respect to the ideal perfectly flat surface shape. The dressing surface 1 of the dressing tool 11 currently set by the tilt adjusting mechanism 22 is
It is determined whether the inclination of 3 is a desired inclination (step S
3).

When it is determined in step S3 that the surface shape is not within the allowable range (that is, the current inclination of the dressing surface 13 is not the desired inclination), the control unit 8 determines that the surface shape after dressing is within the allowable range. The inclination adjusting mechanism 22 is operated so that the inclination is such that the surface shape of the dressing surface 13 approaches or approaches the surface shape of the dressing surface 13
Is adjusted and set to that (step S
4) and returns to step S1. Note that it is possible to obtain the necessary tilt adjustment amount by using a formula or a lookup table obtained from experimental data or the like as the relationship between the surface shape and the inclination of the dressing surface 13. Alternatively, the adjustment amount of the inclination may be set to a small constant amount, and only the increasing / decreasing direction of the inclination may be obtained from the surface shape obtained in step S2.

On the other hand, when it is determined in step S3 that the surface shape is within the allowable range, the control unit 8 ends the tilt adjustment control and executes the above-described normal control.

According to this embodiment, as described above,
During the dressing of the polishing pad 4, the relative inclination of the dressing surface 13 with respect to the polishing pad supporting surface (lower surface) of the base material 5 of the polishing tool 1 is set by the inclination adjusting mechanism 22 in advance. Maintained at a high inclination. Then, as a result of the above-mentioned tilt adjustment control by the control unit 8, the finally set relative tilt of the dressing surface 13 is influenced by the difference in tilt between the rotation axis of the polishing tool 1 and the rotation axis of the dressing tool 11. Is eliminated and the inclination is adjusted and set so that the surface shape of the polishing pad 4 that is as close as possible to the ideal perfectly flat surface shape can be obtained.

Therefore, according to the present embodiment, in the dressing technique of the polishing pad utilizing the angle followability by the gimbal mechanism, the above-mentioned first to third factors that hinder the improvement of the flatness of the polishing pad are caused. Further, the influence of the difference in inclination between the rotation axis of the polishing tool 1 and the rotation axis of the dressing tool 11 is completely eliminated. For this reason,
According to the present embodiment, polishing pad 4 can be dressed flatly with higher accuracy than ever before.
Further, according to the present embodiment, since the wafer 2 is polished at the polishing station by the polishing pad 4 which is dressed flat with high accuracy as described above, the wafer 2 can be polished flat with high accuracy. .

[Second Embodiment]

FIG. 4 is a schematic configuration diagram schematically showing a dressing device according to a second embodiment of the present invention. FIG. 5 is a schematic plan view schematically showing the positional relationship between the dressing surface 44 of the dressing tool 32 and the polishing pad 4.

In the first embodiment, the dressing device 6 was incorporated in the polishing device. Further, in the first embodiment, the tilt adjustment by the tilt adjusting mechanism 22 is automated.

On the other hand, the dressing device according to this embodiment is constructed independently of the polishing device. Further, in the present embodiment, the operator manually adjusts the tilt by the tilt adjusting mechanism.

The dressing device according to the present embodiment is
For example, the polishing surface (the lower surface in FIG. 4) of the polishing pad 4 used in the polishing apparatus obtained by removing the dressing apparatus 6 in the polishing apparatus shown in FIG. 1 according to the first embodiment is dressed.

The dressing device according to the present embodiment is
A pad holder 31 for holding the polishing pad 4 by vacuum suction or the like, a dressing tool 32, and an inclination adjusting mechanism 33.
And a vertical movement mechanism 34, a displacement gauge 35, and a display unit 36.

The pad holder 31 has a disk-shaped base material 41 for supporting the surface of the polishing pad 4 opposite to the polishing surface. Also in the present embodiment, the shape of the polishing pad 4 is a ring shape in which the portion near the center of rotation is removed as shown in FIG. 5, but the shape is not limited to this, and for example, It may be disk-shaped. The pad holder 31 can rotate as shown by an arrow H in FIGS. 1 and 2 by a mechanism (not shown) using an electric motor as an actuator. Pad holder 3
1 does not move up and down or swing. The pad holder 31 is
It is fixed to the rotary shaft 42 without a gimbal mechanism. Therefore, the pad holder 31 cannot be tilted.

In the present embodiment, the dressing tool 32
Has a rectangular parallelepiped tool body 43, and has a structure in which abrasive grains such as diamond are distributed over the entire upper surface thereof.
The rectangular area in which the abrasive grains are distributed constitutes the dressing surface 44. However, dressing tool 32
The configuration and the shape of the dressing surface 44 are not limited to such a configuration and shape.

The tilt adjusting mechanism 33 includes a dressing surface 44.
The tilt in the direction of arrow J can be adjusted and set. The tilt adjusting mechanism 33 includes a bracket 46 fixed to the base member 45, a tilting member 48 supported by the bracket 46 so as to be tiltable by a shaft 47, an adjusting screw 49, and an adjusting screw 49 fixed to the member 45. A support member 50 that movably supports, a left-right moving member 51 that is screwed with an adjusting screw 49 and can move left and right on the member 45 as indicated by an arrow K in FIG. And a lock screw (not shown) for locking and releasing the lock. The upper surface of the left-right moving member 51 and the lower surface of the tilting member 48 on the tip end side are tapered surfaces that engage with each other. In the tilt adjusting mechanism 33, when the operator releases the lock screw and turns the adjusting screw 49 to one side or the other side, the left and right moving member 51 moves left and right according to the turning direction and amount. Since the left and right moving members 51 and the tapered surfaces of the tilting member 48 are engaged with each other, the tilting member 48 has an arrow J in FIG.
The inclination of the direction is determined. The tilting member 48 and the tool body 43 of the dressing tool 32 are fixed via a connecting member 52. Therefore, the operator can adjust the inclination of the dressing surface 44 in the direction of arrow J by releasing the lock screw and rotating the adjusting screw 49 to one side or the other, and after the adjustment, the lock screw is used to lock. By doing so, the inclination can be maintained.
However, it goes without saying that the tilt adjusting mechanism 33 is not limited to such a structure and various structures can be adopted.

The shaft 47 of the tilt adjusting mechanism 33 extends in a direction perpendicular to the paper surface of FIG. 4, and is a straight line M (FIG. 5) shown in FIG.
Center O1 of the polishing pad 4 at the time of dressing shown in
And a straight line passing through the center O3 of the dressing surface 44 of the dressing tool 32).
As a result, in this embodiment, the inclination of the dressing surface 44 around the axis of the shaft 47 (direction of arrow J) can be adjusted and set. Although it is most preferable to be able to adjust the inclination of the dressing surface 44 in this direction J, the inclination adjusting mechanism 33 may be configured so that the inclination of the dressing surface 44 in other directions than this direction can be adjusted. In the present embodiment, the inclination adjusting mechanism 33 is configured to adjust and set the inclination of the dressing surface 44 as described above, but conversely, adjust the inclination of the pad holder 31. It is also possible to configure so that it can be set.

The vertical movement mechanism 34 is composed of a cylinder. That is, the vertical mechanism 34 includes a cylinder tube 54 fixed to the base 53, a piston 55 slidably fitted in the cylinder tube 54 in the axial direction (vertical direction), and a cylinder tube connected to the piston 55. And a piston rod 56 extending upward through 54. The upper end of the rod 56 is fixed to the member 45. Piston 55 in cylinder tube 54
The piston rod 56 moves up and down in the direction of the arrow L and the pressing force of the dressing surface 44 of the dressing tool 32 against the polishing pad 4 is determined by appropriately setting the supply and exhaust of the chambers on both sides and the pressures thereof. be able to.

The displacement gauge 35 constitutes a measuring section for obtaining information according to the surface shape of the polishing surface of the polishing pad 4 like the displacement gauge 7 in FIG. 1, and the same one as the displacement gauge 7 is used. You can The display unit 36 displays the surface shape measured by the displacement meter 35.

According to the present embodiment, the dressing of the polishing surface (the lower surface in the present embodiment) of the polishing pad 4 is moved upward by the vertical movement mechanism 34 as shown in FIGS. The polishing pad 4 is brought into contact with and pressed against the dressing surface 44 of the dressing tool 32 in a state where a load is applied, and the pad holder 31 is rotated as shown by an arrow H to perform this. As shown in FIGS. 4 and 5, this dressing is performed with a part of the dressing surface 44 protruding from the polishing pad 4 to the outer peripheral side and the inner peripheral side thereof. During this dressing, the inclination of the pad holder 31 does not change, and the inclination adjusting mechanism 33 maintains the inclination of the preset dressing surface 44 of the dressing tool 32 as it is. Therefore, during dressing of the polishing pad 4, the dressing surface 4 with the polishing pad support surface (lower surface) of the base material 41 of the pad holder 31 as a reference.
The relative slope of 4 remains unchanged.

In this embodiment, the operator has a function substantially corresponding to the tilt adjustment control function shown in FIG. 3 of the control unit 8 in FIG. That is, the operator first causes the dressing operation described above to be performed. When this dressing is completed, the operator uses the displacement gauge 35 to measure the surface shape of the polishing pad 4, and causes the display unit 36 to display the measured surface shape. Then, the operator looks at the surface shape displayed on the display unit 36 and determines whether or not the surface shape is within a predetermined allowable range with respect to the ideal perfectly flat surface shape. By the determination, it is determined whether the inclination of the dressing surface 44 of the dressing tool 32 currently set by the inclination adjusting mechanism 33 is a desired inclination. If the surface shape is not within the allowable range, the operator determines that the surface shape after dressing is a surface shape within the allowable range or approaches the surface shape based on the surface shape displayed on the display unit 36. The inclination of the dressing surface 44 is adjusted by the inclination adjusting mechanism 33 so that the inclination is obtained, and the inclination is set to that inclination.
The above operation is repeated until the measured and displayed surface shape is within the allowable range. If the surface shape is within the allowable range, the inclination adjustment of the dressing surface 44 is completed, and the dressing of the polishing pad 4 is completed.

According to the present embodiment, since the work of the operator is required, it is slightly complicated as compared with the case of the first embodiment, but like the first embodiment, The polishing pad 4 can be dressed more flatly with higher accuracy than in the conventional case.

By the way, in the first embodiment, instead of the tilt adjusting mechanism 22 and the rotating mechanism 21 in FIG. 1, a tilt adjusting mechanism 33 and a connecting member 52 in FIG. 4 may be provided. On the contrary, in the second embodiment, as shown in FIG.
Instead of the tilt adjusting mechanism 33 and the connecting member 52 in FIG.
The tilt adjusting mechanism 22 and the rotating mechanism 21 may be provided. In this case, if a control unit and an input unit that perform a control procedure corresponding to the operation of the operator described above are provided, automation can be achieved even in a dressing device independent of the polishing device. When automation is achieved in such an independent dressing device, it is not always necessary to provide the displacement gauge 35 in the dressing device. In this case, with the polishing pad 4 once removed from the pad holder 31, the surface shape of the polishing surface of the polishing pad 4 is measured by another displacement gauge independent of the dressing device, and the data is input from the input unit to the control unit. You can enter it in.

Further, in the polishing apparatus shown in FIG. 1 according to the first embodiment in which the dressing apparatus 6 is removed, the polishing pad 4 dressed by the dressing apparatus according to the second embodiment is What is used is a polishing apparatus according to another embodiment of the present invention.

[Third Embodiment]

FIG. 6 is a flowchart showing the semiconductor device manufacturing process. After starting the semiconductor device manufacturing process, first, in step S200, an appropriate processing step is selected from the following steps S201 to S204. According to the selection, steps S201 to S204
Proceed to either.

Step S201 is an oxidation process for oxidizing the surface of the silicon wafer. Step S202 is CV
CV for forming an insulating film on the surface of a silicon wafer by D, etc.
It is the D step. Step S203 is an electrode forming step of forming an electrode film on the silicon wafer by a process such as vapor deposition.
Step S204 is an ion implantation step of implanting ions into the silicon wafer.

After the CVD process or the electrode forming process,
In step S209, it is determined whether to perform the CMP process. If not, the process proceeds to step S206,
If so, the process proceeds to step S205. Step S205
Is a CMP step. In this step, the polishing apparatus according to the present invention is used to flatten the interlayer insulating film and to form a damascene by polishing the metal film on the surface of the semiconductor device.

After the CMP process or the oxidation process, the process proceeds to step S206. Step S206 is a photolithography process. In the photolithography process, a resist is applied to a silicon wafer, a circuit pattern is printed on the silicon wafer by exposure using an exposure device, and the exposed silicon wafer is developed. Further, in the next step S207, parts other than the developed resist image are removed by etching,
This is an etching process in which the resist is removed and the resist that is no longer needed after etching is removed.

Next, in step S208, it is determined whether or not all necessary steps are completed. If not completed, step S20
The circuit pattern is formed on the silicon wafer by returning to 0 and repeating the above steps. If it is determined in step S208 that all steps have been completed, the process ends.

In the semiconductor device manufacturing method according to the present invention, since the polishing apparatus according to the present invention is used in the CMP step, the wafer 2 can be flatly polished with high accuracy. Therefore, the yield in the CMP process is improved,
As compared with the conventional semiconductor device manufacturing method, there is an effect that the semiconductor device can be manufactured at low cost.

The polishing apparatus according to the present invention may be used in the CMP process of the semiconductor device manufacturing process other than the above-mentioned semiconductor device manufacturing process.

The semiconductor device according to the present invention is manufactured by the semiconductor device manufacturing method according to the present invention. As a result, the semiconductor device can be manufactured at a lower cost than the conventional semiconductor device manufacturing method, and the manufacturing cost of the semiconductor device can be reduced.

Although the respective embodiments of the present invention and their modifications have been described above, the present invention is not limited to these embodiments and modifications.

[0080]

As described above, according to the present invention,
It is possible to provide a dressing method and apparatus that can dress a polishing pad evenly with high accuracy. Further, according to the present invention, it is possible to provide a polishing apparatus that can polish an object to be polished using a polishing pad that is dressed flat with high accuracy.

Further, the present invention provides a semiconductor device manufacturing method capable of manufacturing a semiconductor device with improved yield and low cost, and a low cost semiconductor device, as compared with the conventional semiconductor device manufacturing method. it can.

[Brief description of drawings]

FIG. 1 is a schematic configuration diagram schematically showing a polishing apparatus according to a first embodiment of the present invention.

FIG. 2 is a schematic plan view schematically showing the positional relationship between the dressing surface of the dressing tool and the polishing pad when dressing the polishing pad in the polishing apparatus shown in FIG.

FIG. 3 is a schematic flowchart showing an operation of tilt adjustment control.

FIG. 4 is a schematic configuration diagram schematically showing a dressing device according to a second embodiment of the present invention.

5 is a schematic plan view schematically showing a positional relationship between a dressing surface of a dressing tool and a polishing pad in the dressing device shown in FIG.

FIG. 6 is a flowchart showing a semiconductor device manufacturing process.

[Explanation of symbols]

1 polishing tool 2 wafers 3 Wafer holder 4 polishing pad 5,41 base material 6 Dressing device 7,35 displacement gauge 8 control unit 11,32 dressing tools 13,44 Dressing surface 22, 33 Tilt adjustment mechanism 31 pad holder

Claims (15)

[Claims] 1. The dressing surface is dressed by bringing the polishing surface of a polishing pad supported by a base material into contact with the dressing surface of a dressing tool and relatively moving the base material and the dressing tool. In the dressing method, a setting step of adjusting and setting a relative inclination of the dressing surface with respect to the base material to a desired inclination, while maintaining the relative inclination set in the setting step, A dressing method, comprising: a dressing step of dressing a polishing surface. 2. The setting step includes the steps of obtaining information according to the surface shape of the polishing surface and adjusting and setting the relative inclination based on the information. The dressing method according to claim 1. 3. The dressing method according to claim 1, further comprising the step of alternately repeating the setting step and the dressing step a plurality of times. 4. The dressing of the polishing surface in the dressing step is performed with a part of the dressing surface protruding from the periphery of the polishing surface. Dressing method. 5. The relative inclination is an inclination about a predetermined axis which is substantially orthogonal to a straight line passing through the center of the polishing surface and the center of the dressing surface. The dressing method according to any one of 1 to 4. 6. The polishing surface is dressed by bringing the polishing surface of a polishing pad supported by a base material into contact with the dressing surface of a dressing tool and moving the base material and the dressing tool relative to each other. In the dressing device, a relative inclination of the dressing surface with respect to the base material can be adjusted to a desired inclination and can be set, and the relative inclination set by the inclination adjusting mechanism can be maintained. At the same time, a dressing device comprising: a moving mechanism that relatively moves the base material and the dressing tool to dress the polishing surface. 7. Based on information according to the surface shape of the polishing surface, the relative inclination becomes a desired inclination,
7. The dressing device according to claim 6, further comprising a control unit that operates the tilt adjusting mechanism. 8. The dressing device according to claim 7, further comprising a measuring unit that acquires the information. 9. The polishing surface is dressed by bringing the polishing surface of a polishing pad supported by a base material into contact with the dressing surface of a dressing tool and moving the base material and the dressing tool relative to each other. In the dressing device, an inclination adjusting mechanism capable of adjusting and setting a relative inclination of the dressing surface with respect to the base material to a desired inclination, and maintaining the relative inclination set by the inclination adjusting mechanism. Meanwhile, a moving mechanism that relatively moves the base material and the dressing tool to dress the polishing surface, a measuring unit that acquires information according to the surface shape of the polishing surface, and in response to a predetermined command signal. , (I) actuating the moving mechanism to perform the dressing, (ii) the (i)
Based on the information acquired by the measuring unit after the dressing by, it is determined whether or not the currently set relative inclination is a desired inclination, and (iii) the desired inclination in (ii). When it is determined that the relative inclination is adjusted, the relative inclination adjustment is ended, and (iv) when it is determined that the relative inclination is not the desired inclination in (ii), the relative inclination is the desired inclination or So that the inclination approaches
A dressing apparatus comprising: a control unit that repeats the operation of (i) and after after operating the tilt adjusting mechanism. 10. The dressing device according to claim 6, wherein the dressing of the polishing surface is performed with a part of the dressing surface protruding from the periphery of the polishing surface. 11. The relative inclination is an inclination around a predetermined axis which is substantially orthogonal to a straight line passing through the center of the polishing surface and the center of the dressing surface. The dressing device according to any one of 6 to 10. 12. A polishing tool having a polishing pad and a holding portion for holding an object to be polished, wherein a load is applied between the polishing pad of the polishing tool and the object to be polished, and the polishing tool and the A polishing apparatus for polishing an object to be polished by moving the object to be polished relative to the dressing method according to any one of claims 1 to 5 or the polishing pad according to any one of claims 6 to 11. A polishing device characterized by being dressed by a dressing device. 13. A polishing tool having a polishing pad, and a holding portion for holding an object to be polished, wherein a load is applied between the polishing pad of the polishing tool and the object to be polished, the polishing tool and the polishing tool. A polishing apparatus for polishing an object to be polished by relatively moving the object to be polished, comprising the dressing device according to any one of claims 6 to 11. 14. A method of manufacturing a semiconductor device, comprising the step of planarizing the surface of a semiconductor wafer using the polishing apparatus according to claim 12. 15. A semiconductor device manufactured by the method for manufacturing a semiconductor device according to claim 14.