JP2003226739A - Epoxy resin composition and semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition having excellent flame retardance, anti-reflow reliability such as exfoliation resistance and blistering properties at reflowing as well as filling ability in molding. <P>SOLUTION: This epoxy resin composition comprises an epoxy resin (A), a curing agent (B) and a filler (C). The epoxy resin (A) comprises a bisphenol-F type epoxy resin (a1) represented by the general formula (I) and comprises a metal hydroxide (D) as an indispensable component. The bisphenol-F type epoxy resin (a1) may be a tetramethyl bisphenol-F type epoxy resin represented by chemical formula (II). <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an epoxy resin composition which is excellent in flame retardancy, reflow reliability and moldability and is particularly suitable for semiconductor encapsulation.

[0002]

2. Description of the Related Art Conventionally, as a sealing method for electronic circuit parts such as semiconductor devices, phenolic resin, silicone resin, and hermetic seals made of metal or ceramics have been used.
Resin encapsulation with an epoxy resin or the like has been proposed, and a resin used for such encapsulation is generally called an encapsulant resin. Among them, the resin encapsulation with an epoxy resin is most actively used from the viewpoint of the balance of economic efficiency, productivity and physical properties. And the sealing method with epoxy resin is
A method in which a semiconductor element is set in a mold and sealed by a transfer molding method or the like using a composition obtained by adding a curing agent, a filler and the like to an epoxy resin is generally used.

Recently, the mounting of a semiconductor device package on a printed circuit board has been increased in density and automation. Instead of the conventional "insertion mounting method" in which lead pins are inserted into holes in the board, the semiconductor device package is mounted on the surface of the substrate. "Surface mounting method" for soldering solder has become popular. Along with this, the semiconductor device package has changed from the conventional DIP (dual in-line package) to a thin FPP (flat plastic package) suitable for high-density mounting and surface mounting.
Package). Among them, recently
Due to advances in fine processing technology, TSO with a thickness of 2 mm or less
P, TQFP and LQFP are becoming mainstream. Therefore, it becomes more susceptible to external influences such as humidity and temperature, and reliability such as reflow reliability, high temperature reliability, and moisture resistance reliability will become more important in the future. In particular, recently, it has been demanded to improve the reflow reliability in a package having a thickness of 1 mm or less such as TSOP and TQFP.

In surface mounting, solder reflow is usually used for mounting. In this method, a semiconductor device package is placed on a substrate, exposed to a high temperature of 200 ° C. or higher, and the solder previously attached to the substrate is melted to adhere the semiconductor device package to the substrate surface. In such a mounting method, since the entire semiconductor device package is exposed to high temperature, if the hygroscopicity of the sealing resin is high, peeling may occur between the sealing resin and the semiconductor chip, or between the sealing resin and the lead frame, A phenomenon occurs in which moisture absorbed absorbs explosive expansion during solder reflow to generate cracks. In the case of a thin package, the silver paste layer absorbs moisture and peels from the interface with the silicon chip or the lead frame during reflow, and the package bottom is pushed down to swell the package bottom (swelling characteristic), which is a problem. Furthermore, in recent years, lead-free solders that do not contain lead have been used from the viewpoint of environmental protection, but lead-free solders have a high melting point, which increases the reflow temperature, resulting in higher reflow reliability. It has been demanded.

On the other hand, in electronic parts such as semiconductor devices, it is now indispensable to comply with UL94 V-0, which is a flame retardant standard. Hitherto, it has been general to use halogenated compounds such as brominated epoxy resin and antimony oxide for flame retarding epoxy resin for semiconductor encapsulation.

[0006] However, regarding the above-mentioned technology for imparting flame retardancy, there is a danger that the generation of harmful gases such as hydrogen bromide, bromine gas and antimony bromide at the time of combustion may be harmful to the human body and corrosive to equipment, and the semiconductor element may be sealed. Environmental safety has become a problem, such as industrial waste produced during the stoppage process and disposal of semiconductor devices after use. Furthermore, if a semiconductor device adopting the above flame retardant technology is left at high temperature for a long time, aluminum wiring on the semiconductor element will be corroded by the effect of liberated bromine, causing failure of the semiconductor device. The decrease in sex is a problem.

In order to solve the above problems, there has been proposed a method of adding a large amount of a non-halogen-nonantimony type metal hydroxide as an inorganic flame retardant as a flame retardant. However, in this method, a large amount of metal hydroxide (for example, 20% by weight or more based on the total resin composition) must be used, and reflow resistance (particularly swelling property), fluidity and high temperature reliability are deteriorated. It has caused a significant decrease. Further, a method of using a metal hydroxide and a metal oxide in combination (JP-A-9-100337) and a method of using a metal hydroxide in combination with a metal nitrate metal salt (JP-A-2001-279063).
However, the blistering property has not reached a satisfactory level.

Further, it is known that increasing the proportion of the filler in the encapsulating resin composition is effective as a means for improving the flame retardancy, and this means is also effective for improving the reflow resistance. Is. This is because the hygroscopicity is reduced by reducing the resin component in the encapsulating resin composition. However, if the proportion of the filler in the encapsulating resin composition is simply increased, the fluidity deteriorates, and problems such as unfilled package and stage shift occur. On the contrary, if the proportion of the filler in the encapsulating resin composition is decreased, the flame retardancy decreases.

As described above, the above-mentioned problems occur in the conventional flame-retardant technology. Therefore, the material is a safe and non-polluting material which does not generate harmful gas at the time of combustion, and has flame-retardant property, swelling property and fluidity. There is a strong demand for a resin composition having excellent properties and high temperature reliability.

[0010]

The object of the present invention has been made in view of the above circumstances, and is an epoxy resin composition excellent in flame retardancy, reflow reliability (swelling property), and moldability. And a semiconductor device sealed with the epoxy resin composition.

[0011]

The present inventors have arrived at the present invention as a result of extensive studies to achieve the above object.

The present invention mainly has the following constitutions. That is, "an epoxy resin composition containing an epoxy resin (A), a curing agent (B), and a filler (C), in which the epoxy resin (A) is a bisphenol F type represented by the following general formula (I): Epoxy resin composition containing an epoxy resin (a1) and a metal hydroxide (D) as an essential component

[0013]

[Chemical 9] (However, R _{1 to} R ₈ represent a hydrogen atom, a halogen atom or a lower alkyl group having 1 to 4 carbon atoms and may be the same or different.) ”.

[0014]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described in detail below.

The present invention contains an epoxy resin (A), a curing agent (B), a filler (C) and a metal hydroxide (D) as essential components.

In the present invention, the epoxy resin (A)
Contains a bisphenol F type epoxy resin (a1) represented by the following general formula (I) as an essential component.

[0017]

[Chemical 10] (However, R _{1 to} R ₈ represent a hydrogen atom, a halogen atom or a lower alkyl group having 1 to 4 carbon atoms and may be the same or different.) The epoxy resin is represented by the general formula (I). By containing the bisphenol F type epoxy resin (a1), the swollenness at the time of reflow is improved. Furthermore, since the effect of lowering the viscosity and improving the moldability is also obtained, it is possible to obtain a resin composition that exhibits good moldability even if the blending ratio of the filler (C) and the metal hydroxide (D) is increased. You can as a result,
It is possible to obtain a resin composition which is a non-halogen-nonantimony system and is excellent in all of flame retardancy, swelling characteristics, fluidity, and high temperature reliability. Among the bisphenol F type epoxy resins (a1) represented by the general formula (I), among the general formula (II)
It is preferable to use a tetramethylbisphenol F type epoxy resin represented by

[0018]

[Chemical 11] The content of the bisphenol F type epoxy resin epoxy resin (a1) represented by the general formula (I) is preferably 10% by weight or more with respect to the total amount of the epoxy resin (A) in order to further enhance the effect of addition. A) 5 for the total amount
It is more preferably 0% by weight or more.

Depending on the use, an epoxy resin other than the bisphenol F type epoxy resin (a1) represented by the general formula (I) may be used in combination. The other epoxy resin is not particularly limited as long as it is a compound having two or more epoxy groups in one molecule, and includes all monomers, oligomers and polymers. For example, bisphenol F type epoxy resin having no alkyl substituent, cresol novolac type epoxy resin, phenol novolac type epoxy resin, 4,4
′ -Bis (2,3-epoxypropoxy) biphenyl,
4,4'-bis (2,3-epoxypropoxy)-
3,3 ', 5,5'-tetramethylbiphenyl, 4,4
′ -Bis (2,3-epoxypropoxy) -3,3 ′,
5,5'-tetraethylbiphenyl, 4,4'-bis (2,3-epoxypropoxy) -3,3 ', 5,5'
-Biphenyl type epoxy resin such as tetrabutyl biphenyl, phenol aralkyl type epoxy resin, naphthalene type epoxy resin, bisphenol A type epoxy resin,
Examples thereof include triphenol type epoxy resins, dicyclopentadiene skeleton-containing epoxy resins, triphenylmethane type epoxy resins, and halogenated epoxy resins. You may use 2 or more types as other epoxy resins.

When two or more epoxy resins are used in combination,
Particularly preferable examples of the other epoxy resin of the bisphenol F type epoxy resin (a1) represented by the general formula (I) include a biphenyl type epoxy (a2) represented by the general formula (IV). 4,4'-bis (2,3-epoxypropoxy) -3,3 ', 5,5'
-Tetramethylbiphenyl is particularly preferred.

[0021]

[Chemical 12] (However, R _{1 to} R ₈ represent a hydrogen atom, a halogen atom or a lower alkyl group having 1 to 4 carbon atoms and may be the same or different.) When two or more epoxy resins are used in combination, From the viewpoint of improving the swelling property, the content of the bisphenol F type epoxy resin (a1) represented by the general formula (I) is preferably 5% by weight or more, and 20% by weight or more based on the total amount of the epoxy resin (A). Is more preferable. The compounding amount of the epoxy resin (A) is usually 0.5 to 12 with respect to the whole epoxy resin composition.
%, Especially 1-8% by weight is preferred.

The curing agent (B) is not particularly limited as long as it can be cured by reacting with an epoxy resin, and specific examples thereof include novolac resins such as phenol novolac, cresol novolac and naphthol novolac, and diborane. Cyclopentadiene skeleton-containing phenol resin, naphthol aralkyl resin, bisphenol compound such as bisphenol A, acid anhydride such as maleic anhydride, phthalic anhydride, pyromellitic anhydride, and aromatic such as metaphenylenediamine, diaminodiphenylmethane, diaminodiphenylsulfone Examples include amines. Among them, the curing agent represented by the following general formula (III) is particularly preferably used. These curing agents may be used alone or in combination of two or more.

[0023]

[Chemical 13] (However, in the formula, n represents 0 or an integer of 1 or more.) The melt viscosity of the curing agent (B) is 1 in terms of ICI (150 ° C.) viscosity.
Pa · s or less, and more preferably 0.3 Pa · s or less are particularly preferably used.

The content of the curing agent (B) is usually 0.5 to 12% by weight, preferably 1 to 8% by weight, based on the whole epoxy resin composition. Further, the compounding ratio of the epoxy resin (A) and the curing agent (B) is such that the chemical equivalent ratio of the curing agent (B) to the epoxy resin (A) is 0.5-1. 5, especially in the range of 0.7 to 1.3.

Further, in the present invention, the epoxy resin (A)
A curing catalyst for accelerating the curing reaction of the curing agent (B) may be used. The curing catalyst is not particularly limited as long as it accelerates the curing reaction, and for example, 2-methylimidazole, 2,4-dimethylimidazole, 2-ethyl-4-
Methylimidazole, 2-phenylimidazole, 2-
Imidazole compounds such as phenyl-4-methylimidazole and 2-heptadecylimidazole, triethylamine, benzyldimethylamine, α-methylbenzylmethylamine, 2- (dimethylaminomethyl) phenol, 2,4,6-tris (dimethylaminomethyl) ) Phenol, tertiary amine compounds such as 1,8-diazabicyclo (5,4,0) undecene-7, zirconium tetramethoxide, zirconium tetrapropoxide, tetrakis (acetylacetonato) zirconium, tri (acetylacetonato) aluminum Organometallic compounds such as triphenylphosphine, tetraphenylphosphonium tetraphenylborate salt, trimethylphosphine, triethylphosphine, tributylphosphine,
Examples thereof include organic phosphine compounds such as tri (p-methylphenyl) phosphine and tri (nonylphenyl) phosphine. Among them, organic phosphine compounds are preferable from the viewpoint of reliability and moldability, and triphenylphosphine is particularly preferably used.

Two or more of these curing catalysts may be used in combination depending on the intended use, and the addition amount is preferably in the range of 0.1 to 10 parts by weight with respect to 100 parts by weight of the epoxy resin (A).

The present invention is characterized by containing a metal hydroxide (D) as an essential component. The metal hydroxide used in the present invention is a compound in which a metal atom is bonded to a hydroxyl group, or a compound in which a metal oxide is bonded to water,
It means a hydroxide having metal atoms other than water-soluble hydroxides such as barium and lithium. Among the metal atoms constituting the metal hydroxide, aluminum, magnesium,
It is preferably at least one selected from the group consisting of calcium, manganese, iron, cobalt, nickel, tin, zinc, copper, zirconium, boron, and specific examples include aluminum hydroxide, magnesium hydroxide, and hydroxide. Examples thereof include calcium and cobalt hydroxide. Among them, magnesium hydroxide is particularly preferably used from the viewpoint of reflow resistance. These may be used alone,
You may use together 2 or more types.

The metal hydroxide is preferably used in a granular form, and preferably has a particle size of 0.1 to 30 μm.

The content of the metal hydroxide (D) used in the present invention is preferably 1 to 15% by weight, and more preferably 3 to 10% by weight based on the total epoxy resin composition. If it is 1% or more, a sufficient flame retardant effect can be obtained.
If it is less than 15%, the high temperature reliability does not deteriorate.

In the production of the resin composition, the metal hydroxide (D) may be melt-mixed with the epoxy resin (A) or the curing agent (B) in advance in order to improve the dispersibility.

As the filler (C), a metal hydroxide (D)
Use other than. An inorganic filler is preferable as the filler (C). Specifically, amorphous silica, crystalline silica,
Examples include calcium carbonate, magnesium carbonate, alumina, magnesia, clay, talc, calcium silicate, metal oxides such as titanium oxide and antimony oxide, asbestos, glass fibers and glass spheres, among which amorphous silica is linear expansion. It is preferably used because it has a large effect of lowering the coefficient and is effective in reducing stress. As the shape, a crushed shape or a spherical shape is used, and a spherical shape is particularly preferably used from the viewpoint of fluidity.

The amorphous silica referred to herein generally means one having a true specific gravity of 2.3 or less. This amorphous silica can be produced by any known method, for example, a method of melting crystalline silica and a method of oxidizing metallic silicon,
A synthesis method from various raw materials such as hydrolysis of alkoxysilane can be used. Among the amorphous silica, spherical fused silica produced by melting quartz is particularly preferably used, and it is particularly preferred that the spherical fused silica is contained in 90% by weight or more in the total filler (C).

The particle size and particle size distribution of the filler (C) are not particularly limited, but the average particle size (meaning median size; the same applies hereinafter) is taken from the viewpoint of fluidity and reduction of burrs during molding. It is preferably in the range of 5 to 30 μm. Further, two or more kinds of fillers having different average particle diameters or particle size distributions can be combined.

In the present invention, the ratio of the filler (C) to the total resin composition is preferably 70 to 95% by weight, and 76
˜90% by weight is particularly preferred. Since the content of the filler in the entire resin composition is 76% by weight or more, sufficient flame retardancy can be obtained because it contains a metal hydroxide, and when it is less than 90% by weight, moldability does not deteriorate.

In the present invention, the ratio of the total weight of the filler (C) and the metal hydroxide (D) to the total resin composition is preferably 80 to 95% by weight, particularly preferably 86 to 93% by weight. High flame retardancy is obtained at 80% by weight or more, 95
If it is less than wt%, the moldability will not deteriorate.

In the present invention, a silane coupling agent (F) may be added. As the silane coupling agent, those commonly used can be used, and specific examples thereof include γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldimethoxysisilane, and γ- (2,3
-Epoxycyclohexyl) propyltrimethoxysilane, γ- (N-phenylamino) propyltrimethoxysilane, γ- (N-phenylamino) propylmethyldimethoxysilane, γ- (N-methylamino) propyltrimethoxysilane, γ- (N-methylaminopropyl)
Methyldimethoxysilane, γ- (N-ethylamino) propyltrimethoxysilane, γ- (N-ethylamino)
Propylmethyldimethoxysilane, γ-glycidoxypropyltrimethoxysilane, γ- (N-ethylamino)
Propylmethyltrimethoxysilane, γ-methacryloxypropyltrimethoxysilane, γ-methacryloxypropylmethyldimethoxysilane, γ-mercaptopropyltrimethoxysilane, γ-mercaptopropylmethyldimethoxysilane, N-β- (aminoethyl)- γ-aminopropyltrimethoxysilane, N-β- (aminoethyl) -γ-aminopropylmethyldimethoxysilane, N
-Β- (aminoethyl) -γ-aminopropyltriethylsilane, γ-aminopropyltriethoxysilane, γ
-Aminopropylmethyldiethoxysilane, γ-aminopropyltrimethoxysilane, γ-aminopropylmethyldimethoxysilane, γ- (N, N-dimethylamino)
Examples thereof include propyltrimethoxysilane, and it is particularly preferable that the silane coupling agent (F) contains at least 5% by weight or more of at least one selected from the group consisting of primary, secondary and tertiary aminosilanes. .

As the primary aminosilane, for example, γ-
Examples of the secondary aminosilane include aminopropyltrimethoxysilane, γ-aminopropyldimethoxysilane, γ-aminopropyltriethoxysilane, γ-aminopropyldiethoxysilane, and N-phenyl-γ-
Aminopropyltrimethoxysilane, N-phenyl-γ
-Aminopropyldimethoxysilane, N-phenyl-γ
-Aminopropyltriethoxysilane, N-phenyl-
Examples of tertiary amino such as γ-aminopropyldiethoxysilane include γ-dibutylaminopropyltrimethoxysilane, γ-dibutylaminopropyldimethoxysilane, γ-dibutylaminopropyltriethoxysilane, γ-dibutylaminopropyldisilane. Examples include, but are not limited to, ethoxysilane and the like. or,
The above aminosilane coupling agents may be used alone or in combination.

The silane coupling agent (F) may be surface-treated in advance with the filler, but the effect can be exhibited by simply blending it with other constituent components.

The silane coupling agent (F) is preferably added in an amount of 0.1 to 2% by weight based on the total amount of the epoxy resin composition in terms of fluidity and filling property.

In the present invention, a phosphorus-based flame retardant (E) may be used in combination as the flame retardant. As the phosphorus-based flame retardant, an organic adjacent compound is particularly preferable, and as the organic phosphorus compound, for example, compounds of the general formulas (V) to (VII) can be mentioned, and further, specific examples thereof will be given below.

As a specific example of the general formula (V), the following formula (IX)
The compound shown by is mentioned.

[0042]

[Chemical 14] (In the formula, X ¹ represents an aryl group or an alkyl group. X ² represents a hydroxyl group, an aryl group or an alkyl group, and may be the same or different.)

[0043]

[Chemical 15] Specific examples of the general formula (VI) include compounds represented by the following formula (X).

[0044]

[Chemical 16] (In the formula, X ² represents a hydroxyl group, an aryl group or an alkyl group, and may be the same or different. R ¹ represents a hydrogen, amino group, hydroxyl group, phosphoric acid group, aryl group or alkyl group.)

[0045]

[Chemical 17] Specific examples of the general formula (VII) include compounds represented by the following formula (XI) and the following formula (XII).

[0046]

[Chemical 18] (In the formula, X ³ represents a monovalent or higher valent aromatic group and may be the same or different.)

[0047]

[Chemical 19]

[0048]

[Chemical 20] Specific examples of the general formula (VIII) include compounds represented by the following formula (XIII), the following formula (XIV) and the following formula (XV).

[0049]

[Chemical 21] (In the formula, R ² represents hydrogen, an alkyl group, an alkoxyl group, a carboxy group, a phenoxy group or an amino group, and may be the same or different.)

[0050]

[Chemical formula 22]

[0051]

[Chemical formula 23]

[0052]

[Chemical formula 24] These compounds can be used in combination of two or more kinds.

The organic phosphorus compound may be used in the form of solid (powder) or liquid, but solid (powder) is preferable from the viewpoint of workability. In the case of powder, a maximum particle size of 80 μm or less is preferable because there is less possibility of clogging of the mold gate during molding. The average particle size is 2 to 50 μm in terms of the effect on fluidity and the effect on flame retardancy.

The amount of the organophosphorus compound added is preferably the minimum amount necessary for exhibiting flame retardancy, and is usually 5 with respect to the total composition.
It is less than or equal to wt. When the content is 5% by weight or less, it is possible to minimize the deterioration of moisture resistance and adhesion, and more preferably 0.2% by weight to 3% by weight.

The phosphorus-based flame retardant (E) used in the present invention is an inorganic-based material in which the core portion is red phosphorus and the shell portion is an organic layer.
Organic complexes can also be used.

The epoxy resin composition of the present invention may further optionally contain various additives listed below. Various colorants and pigments such as carbon black and iron oxide, silicone rubber, olefin copolymers, modified nitrile rubber, modified polybutadiene rubber and other elastomers, silicone oil, polyethylene and other thermoplastic resins, fluorine-based, silicone Surfactants such as
Long-chain fatty acids, metal salts of long-chain fatty acids, esters of long-chain fatty acids, amides of long-chain fatty acids, various releasing agents such as paraffin wax, ion trapping agents such as hydrotalcites, cross-linking agents such as organic peroxides .

The epoxy resin composition of the present invention is preferably produced by melt-kneading the above components. For example, various raw materials are mixed by a known method such as a mixer, and then melt-kneaded by a known kneading method such as a Banbury mixer, a kneader, a roll, a single-screw or twin-screw extruder and a cokneader. The resin temperature during melt kneading is usually in the range of 70 to 150 ° C.

The epoxy resin composition of the present invention is melted by heating and kneading, cooled and pulverized into the shape of a powder, tablet shape obtained by tableting the powder, and tablet which is melted by heating and kneading and cooled and solidified in a mold. And the shape of pellets that are melted by heating and kneading, extruded and further cut.

Then, from these shapes, the semiconductor element is provided for sealing and the semiconductor device is manufactured. The epoxy resin composition of the present invention is applied to, for example, 120 to 250 ° C., preferably 150 to 20 on a member having a semiconductor fixed to a substrate.
At a temperature of 0 ° C., molding is performed by a method such as transfer molding, injection molding, or casting method to manufacture a semiconductor device sealed with a cured product of an epoxy resin composition.
If necessary, additional heat treatment (for example, 150 to 200
C., 2 to 16 hours).

[0060]

EXAMPLES The present invention will be described in detail below with reference to examples, but the present invention is not limited to the examples given here. In addition,% in an Example shows weight%. [Examples 1 to 13, Comparative Examples 1 to 3] The components shown in Table 1 were dry-blended with a mixer at the composition ratios (weight ratios) shown in Tables 2 to 3, and then a mixing roll having a roll surface temperature of 90 ° C was used. The mixture was heated and kneaded for 5 minutes, cooled and pulverized to obtain an epoxy resin composition for semiconductor encapsulation.

[0061]

[Table 1]

[0062]

[Chemical 25] (However, n represents 0 or an integer of 1 or more in the formula.) <Flame Retardancy Test> 127 × 1 under the same molding conditions as above.
A flame-retardant test piece of 2.7 × 1.6 mm was molded and post-cured, and flame retardancy was evaluated according to UL94 standard. <Evaluation of swelling property (reflow resistance reliability)> 176 pin LQFP (outer size: 24 mm x) for the obtained resin composition
24 mm × 1.4 mm, frame material: copper), using a low-pressure transfer molding machine, mold temperature 175 ° C.,
The package was molded under the condition that the curing time was 1 minute.
As the evaluation chip, a chip element having a surface of which a silicon nitride film is coated is mounted and the chip size is 10 mm × 10 m.
The m × 0.3 mm one was used.

176 pin LQ obtained by the above molding
After 10 packages of FP were post-cured at 180 ° C. for 6 hours, the thickness I (μm) of the central part of the package was measured with a micrometer. 40 ℃ / 8
After humidifying at 0% RH for 72 hours, it was heat-treated in an IR reflow furnace having a maximum temperature of 260 ° C. The temperature profile of the reflow furnace is in the range of 150 ° C to 200 ° C for 60 seconds to 10 seconds.
The heating rate from 200 ° C to 260 ° C for 0 seconds is 1.5 to 2.
The temperature was maintained at 5 ° C / sec and the maximum temperature of 255 ° C to 265 ° C for 10 to 20 seconds, and the temperature decreasing rate from 260 ° C to 200 ° C was 1.5 to 2.5 ° C / sec.

Five seconds after the package left the reflow furnace, the thickness of the central portion of the package was measured again with a micrometer II.
(Μm) was measured. Furthermore, (thickness II-thickness I) was calculated for each of 10 packages, and the average value of the 10 packages was defined as "swelling" (μm). The swelling is preferably small, and particularly preferably 100 μm or less. <Peeling resistance (reflow resistance, chip surface adhesion) evaluation> About the obtained resin composition 176pinLQFP
Using a mold for (outer shape: 24 mm × 24 mm × 1.4 mm, frame material: copper), a package was molded by a low-pressure transfer molding machine under conditions of a mold temperature of 175 ° C. and a cure time of 1 minute. As the evaluation chip, a chip having a chip size of 10 mm × 10 mm × 0.3 mm, on which a simulated element coated with a silicon nitride film was mounted, was used.

176 pin LQ obtained by the above molding
After 10 packages of FP were post-cured at 180 ° C. for 6 hours, they were humidified at 40 ° C./80% RH for 72 hours. After heat-treating this for 10 seconds in an IR reflow furnace at a temperature of 260 ° C., the sample was subjected to ultrasonic flaw detection,
The peeling from the chip surface was observed. The number of packages obtained well, excluding defective packages in which peeling occurred, was determined.

<Evaluation of Moldability (Package Fillability)> 176pin LQFP Package 1 Obtained by Molding Above
After molding, 0 pieces were visually observed and cut into sections, and then observed with a microscope of 20 times to examine the stage displacement and the presence or absence of unfilled. The number of packages obtained well, excluding defective packages in which stage displacement and unfilling occurred, was determined. Regarding the stage displacement, the inclination of the package gate portion and the bent portion of less than 100 μm is good, and the inclination of 100 μm or more is bad.

[0067]

[Table 2]

[0068]

[Table 3] Tables 2 to 3 show the evaluation results. As seen in Table 3, flame retardancy is insufficient when no metal hydroxide is used. Further, when the bisphenol F type epoxy resin (a1) represented by the general formula (I) is not used, moldability and swelling properties are insufficient. On the other hand, as shown in Table 3, the epoxy resin composition of the present invention is excellent in flame retardancy, peel resistance during reflow, swelling property, and package filling property.

[0069]

As described above, according to the present invention, by using the bisphenol F type epoxy resin represented by the general formula (I) and the metal hydroxide, flame retardancy, peeling resistance at the time of reflow, and swelling are obtained. It is possible to obtain an epoxy resin composition for semiconductor encapsulation having excellent reflow reliability such as characteristics and filling property during molding, and a semiconductor device encapsulated with the epoxy resin composition.

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) H01L 23/31 F term (reference) 4J002 CC032 CD051 DE066 DE076 DE096 DE106 DE116 DE146 EN028 EU098 EU118 EW047 EW127 EW137 EW138 EW147 EW178 EX078 FD137 FD142 FD148 GQ05 4J036 AD07 AD08 AD09 DA01 DC05 DC06 DC38 DC41 DD07 FA02 FA13 GA23 JA07 4M109 AA01 BA01 CA21 EA02 EA03 EB02 EB07 EB12 EC01 EC03 EC09 EC20

Claims (11)

[Claims] 1. An epoxy resin composition containing an epoxy resin (A), a curing agent (B) and a filler (C), wherein the epoxy resin (A) is represented by the following general formula (I). An epoxy resin composition comprising an F-type epoxy resin (a1) and a metal hydroxide (D) as an essential component. [Chemical 1] (However, R _{1 to} R ₈ represent a hydrogen atom, a halogen atom or a lower alkyl group having 1 to 4 carbon atoms, and may be the same or different.) 2. A bisphenol F represented by the general formula (I)
The epoxy resin composition according to claim 1, wherein the type epoxy resin (a1) is a tetramethylbisphenol F type epoxy resin represented by the chemical formula (II). [Chemical 2] (However, R _{1 to} R ₈ represent a hydrogen atom, a halogen atom or a lower alkyl group having 1 to 4 carbon atoms, and may be the same or different.) 3. The metal atom of the metal hydroxide (D) is at least one selected from the group consisting of aluminum, magnesium, calcium, manganese, iron, cobalt, nickel, tin, zinc, copper, zirconium, and boron. The epoxy resin composition according to claim 1 or 2, wherein 4. The epoxy resin composition according to claim 1, wherein the metal atom of the metal hydroxide (D) is magnesium. 5. The total weight of the filler (C) and the metal hydroxide (D) is 86 to 93 based on the whole epoxy resin composition.
It is a weight%, The epoxy resin composition in any one of Claims 1-4 characterized by the above-mentioned. 6. The epoxy resin composition according to any one of claims 1 to 5, wherein the curing agent (B) contains a phenol aralkyl resin (b) represented by the following general formula (III). . [Chemical 3] (However, in the formula, n represents 0 or an integer of 1 or more.) 7. The epoxy resin composition according to any one of claims 1 to 6, wherein the epoxy resin (A) further contains a biphenyl type epoxy resin (a2) represented by the following general formula (IV). object. [Chemical 4] (However, R _{1 to} R ₈ represent a hydrogen atom, a halogen atom or a lower alkyl group having 1 to 4 carbon atoms, and may be the same or different.) 8. The epoxy resin composition according to claim 1, which contains a phosphorus-based flame retardant (E) as an essential component. 9. A group of compounds in which the phosphorus-based flame retardant (E) has a structure represented by the following general formula (V), general formula (VI), general formula (VII) and general formula (VIII): The epoxy resin composition according to claim 8, which is an organic phosphorus compound containing at least one kind. [Chemical 5] (In the formula, X ¹ represents an aryl group or an alkyl group. X ² represents a hydroxyl group, an aryl group or an alkyl group, and may be the same or different.) (In the formula, X ² represents a hydroxyl group, an aryl group or an alkyl group, and may be the same or different. R ¹ represents a hydrogen, amino group, hydroxyl group, phosphoric acid group, aryl group or alkyl group.) [Chemical 7] (In the formula, X ³ represents a monovalent or higher valent aromatic group and may be the same or different.) (In the formula, R ² represents hydrogen, an alkyl group, an alkoxyl group, a carboxy group, a phenoxy group or an amino group, and may be the same or different.) 10. A silane coupling agent (F) is contained as an essential component, and the silane coupling agent (F) is a primary,
2. Containing at least one selected from the group consisting of secondary and tertiary aminosilanes.
The epoxy resin composition according to any one of 1 to 9. 11. A semiconductor device, which is encapsulated with the cured product of the epoxy resin composition according to claim 1.