JP2003037093A - Ultrasonic vibrator and ultrasonic cleaning apparatus having the same - Google Patents
Ultrasonic vibrator and ultrasonic cleaning apparatus having the sameInfo
- Publication number
- JP2003037093A JP2003037093A JP2001206069A JP2001206069A JP2003037093A JP 2003037093 A JP2003037093 A JP 2003037093A JP 2001206069 A JP2001206069 A JP 2001206069A JP 2001206069 A JP2001206069 A JP 2001206069A JP 2003037093 A JP2003037093 A JP 2003037093A
- Authority
- JP
- Japan
- Prior art keywords
- ultrasonic
- cleaning
- cleaning liquid
- vibrating
- cleaning tank
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004506 ultrasonic cleaning Methods 0.000 title claims abstract description 36
- 238000004140 cleaning Methods 0.000 claims abstract description 173
- 239000007788 liquid Substances 0.000 claims abstract description 98
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 239000005350 fused silica glass Substances 0.000 claims description 4
- 230000001678 irradiating effect Effects 0.000 claims description 4
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 4
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 4
- 230000003746 surface roughness Effects 0.000 claims description 4
- 229910052715 tantalum Inorganic materials 0.000 claims description 4
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 4
- 239000007921 spray Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 7
- 235000012431 wafers Nutrition 0.000 description 31
- 238000001816 cooling Methods 0.000 description 12
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- 239000000428 dust Substances 0.000 description 7
- 238000002347 injection Methods 0.000 description 7
- 239000007924 injection Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 239000000498 cooling water Substances 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- 238000012423 maintenance Methods 0.000 description 5
- 238000012856 packing Methods 0.000 description 3
- 238000011282 treatment Methods 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 102100031083 Uteroglobin Human genes 0.000 description 1
- 108090000203 Uteroglobin Proteins 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B23/00—Record carriers not specific to the method of recording or reproducing; Accessories, e.g. containers, specially adapted for co-operation with the recording or reproducing apparatus ; Intermediate mediums; Apparatus or processes specially adapted for their manufacture
- G11B23/50—Reconditioning of record carriers; Cleaning of record carriers ; Carrying-off electrostatic charges
- G11B23/505—Reconditioning of record carriers; Cleaning of record carriers ; Carrying-off electrostatic charges of disk carriers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Apparatuses For Generation Of Mechanical Vibrations (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、超音波を利用して
被洗浄物を洗浄するための超音波振動装置及びそれを備
えた超音波洗浄装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an ultrasonic vibration device for cleaning an object to be cleaned using ultrasonic waves and an ultrasonic cleaning device including the ultrasonic vibration device.
【０００２】[0002]
【従来の技術】半導体メモリ等の半導体装置は、シリコ
ンウェハ等の半導体ウェハ（以下、ウェハ）に各種の処
理を施して製造される。半導体装置の製造においては、
所謂ゴミの付着あるいは混入が問題であり、ゴミの付着
あるいは混入を防止することが重要である。しかしなが
ら、現在のところ各処理を行う間にウェハ面等へのゴミ
の付着等を完全に回避することは困難であり、特に、製
造工程中において、サブミクロンの微粒子のゴミの付着
等の回避は非常に困難である。従って、各処理前におい
ては、ウェハ面等に付着したゴミを洗浄して、所定のゴ
ミレベル以下のゴミがない状態として、ウェハの各処理
を行っている。2. Description of the Related Art A semiconductor device such as a semiconductor memory is manufactured by subjecting a semiconductor wafer such as a silicon wafer (hereinafter referred to as a wafer) to various treatments. In the manufacture of semiconductor devices,
So-called dust attachment or mixing is a problem, and it is important to prevent dust attachment or mixing. However, at present, it is difficult to completely prevent dust from adhering to the wafer surface or the like during each process, and in particular, it is possible to avoid dust from adhering submicron particles during the manufacturing process. Very difficult. Therefore, before each treatment, each treatment of the wafer is performed by cleaning the dust adhering to the wafer surface and the like so that there is no dust below a predetermined dust level.
【０００３】ウェハの洗浄装置としては、図５に示すよ
うなウェハ６１の洗浄のための加熱した洗浄液６２を入
れた洗浄槽６３と、冷却水６４を入れた冷却槽６５とを
備え、冷却槽６５の底面の振動板６６あるいは側面６７
の振動板（図示せず）に、超音波振動子６８を接着剤６
９を用いて固着した超音波振動装置を備えた超音波洗浄
装置６０がある。尚、超音波振動子６８は、冷却水６４
により冷却される。超音波振動子６８としては、２００
ｋＨｚから１ＭＨｚの何れかの周波数の超音波を発生さ
せるものが用いられている。また、洗浄槽６３から溢れ
た出た洗浄液６２はオーバーフロー槽７０に入り排出さ
れる。As a wafer cleaning device, a cleaning tank 63 containing a heated cleaning liquid 62 for cleaning the wafer 61 and a cooling tank 65 containing cooling water 64 as shown in FIG. Vibration plate 66 on the bottom surface of 65 or side surface 67
Attach the ultrasonic vibrator 68 to the vibrating plate (not shown) of the adhesive 6
There is an ultrasonic cleaning device 60 provided with an ultrasonic vibrating device fixed by using 9. The ultrasonic transducer 68 is used for the cooling water 64.
Is cooled by. The ultrasonic transducer 68 is 200
A device that generates an ultrasonic wave of any frequency from kHz to 1 MHz is used. Further, the cleaning liquid 62 overflowing from the cleaning tank 63 enters the overflow tank 70 and is discharged.
【０００４】また、前記のように加熱した洗浄液を用い
ない場合は、図５における冷却槽６５を用いずに、洗浄
槽の底面又は側面に直接超音波振動装置である超音波振
動子を固着し、洗浄液で洗浄槽の底面又は側面を冷却し
て、そこに固着した超音波振動子を冷却するようにした
超音波洗浄装置を用いることができる。When the heated cleaning liquid is not used as described above, the ultrasonic vibrator, which is an ultrasonic vibration device, is fixed directly to the bottom surface or the side surface of the cleaning tank without using the cooling tank 65 in FIG. It is possible to use an ultrasonic cleaning device in which the bottom surface or the side surface of the cleaning tank is cooled with a cleaning liquid and the ultrasonic transducer fixed to the cooling tank is cooled.
【０００５】前記超音波洗浄装置では、特に、ウェハに
付着したサブミクロンの微粒子の洗浄に大きな効果があ
るものとして、８５０ｋＨｚから１ＭＨｚの間の周波数
の超音波を発生する超音波振動子を用いたメガヘルツ超
音波洗浄装置がある。前記メガヘルツ超音波洗浄装置で
は、前記のように超音波振動子を冷却槽あるいは洗浄槽
の側面又は底面に取り付け、洗浄液としてＳＣ−１ある
いは純水を用い、前記振動数の超音波を前記洗浄槽に入
れられた洗浄液中に照射し、大きな振動加速度による触
媒作用力を利用して、洗浄液に浸漬されたウェハに付着
したサブミクロンの微粒子のゴミを剥離除去する。尚、
超音波振動子６８の替わりに、超音波振動子と超音波振
動を導く導波体とを結合したものを有する超音波振動装
置を用いた超音波洗浄装置もある。In the above ultrasonic cleaning apparatus, an ultrasonic vibrator for generating ultrasonic waves having a frequency of 850 kHz to 1 MHz is used, which is particularly effective for cleaning submicron particles adhering to the wafer. There is a megahertz ultrasonic cleaning device. In the megahertz ultrasonic cleaning device, the ultrasonic vibrator is attached to the side surface or the bottom surface of the cooling tank or the cleaning tank as described above, SC-1 or pure water is used as the cleaning liquid, and the ultrasonic wave having the frequency is applied to the cleaning tank. Irradiation into the cleaning liquid contained in the cleaning liquid is carried out, and the catalyst action force due to the large vibration acceleration is utilized to remove the submicron fine particles adhering to the wafer immersed in the cleaning liquid. still,
There is also an ultrasonic cleaning device using an ultrasonic vibration device having a combination of an ultrasonic vibrator and a waveguide that guides ultrasonic vibrations instead of the ultrasonic vibrator 68.
【０００６】また、特開平１０−９４７５６号公報に示
されているように、洗浄液の上側に５００ｋＨｚ以上の
超音波を発する超音波振動子に超音波振動を導く導波体
を結合させたものを有する超音波振動装置が取り付けら
れ、その下側にある洗浄液に向かって超音波を照射し
て、洗浄液のシャワーを前記洗浄液が入った容器の下部
からその下に載置されたウェハに曝して洗浄する超音波
洗浄装置がある。Further, as disclosed in Japanese Patent Application Laid-Open No. 10-94756, an ultrasonic transducer which emits ultrasonic waves of 500 kHz or more is coupled with a waveguide for guiding ultrasonic vibration above the cleaning liquid. An ultrasonic vibration device is attached, and ultrasonic waves are radiated toward the cleaning liquid located below the ultrasonic vibration device to expose the cleaning liquid shower from the lower part of the container containing the cleaning liquid to the wafer placed below it. There is an ultrasonic cleaning device.
【０００７】尚、前記超音波洗浄装置では、ウェハばか
りでなく、その他液晶等の被洗浄物を洗浄するために、
洗浄槽の大きさ、超音波振動子の周波数、超音波振動の
ためのパワー等が選択される。In the ultrasonic cleaning apparatus, in order to clean not only the wafer but also other objects to be cleaned such as liquid crystal,
The size of the cleaning tank, the frequency of the ultrasonic vibrator, the power for ultrasonic vibration, etc. are selected.
【０００８】[0008]
【発明が解決しようとする課題】しかしながら、前記従
来の冷却槽あるいは洗浄槽の側面又は底面に超音波振動
装置が取り付けられた超音波洗浄装置では、冷却槽ある
いは洗浄槽の側面又は底面には各種配管があったり、あ
るいは超音波洗浄装置の周囲に各種装置があったりする
ので、側面又は底面に取り付けられた超音波振動装置の
メンテナンスあるいは交換等を行うことが困難であると
いう問題点があった。However, in the ultrasonic cleaning device in which the ultrasonic vibrating device is attached to the side surface or the bottom surface of the conventional cooling tank or cleaning tank, various types are provided on the side surface or the bottom surface of the cooling tank or cleaning tank. Since there are pipes or various devices around the ultrasonic cleaning device, there is a problem that it is difficult to perform maintenance or replacement of the ultrasonic vibration device attached to the side surface or the bottom surface. .
【０００９】また、前記従来の洗浄液の上側に超音波振
動装置が取り付けられたものは、超音波振動装置によ
り、洗浄液をシャワーとしてその下側に載置したウェハ
に吹き付けて洗浄するものであり、ウェハを洗浄液に浸
漬した状態で洗浄することができないという問題点があ
った。In the conventional cleaning liquid having an ultrasonic vibrating device attached to the upper side, the ultrasonic vibrating device sprays the cleaning liquid as a shower onto a wafer placed below the cleaning liquid to clean the wafer. There is a problem that the wafer cannot be cleaned while it is immersed in the cleaning liquid.
【００１０】また、既存の洗浄槽を利用してメガヘルツ
超音波洗浄を行いたいという要望が多いが、そのような
要求に合った超音波洗浄用機器が今までは無かった。Further, although there is a great demand for performing megahertz ultrasonic cleaning using an existing cleaning tank, there has been no ultrasonic cleaning apparatus that meets such a request.
【００１１】本発明は前記問題点を解決するためになさ
れたもので、被洗浄物を既存の洗浄槽を利用して超音波
洗浄、例えば、半導体ウェハのメガヘルツ超音波洗浄を
することができ、被洗浄物を洗浄液に浸漬した状態で洗
浄することができ、超音波振動装置あるいはその中に備
えられた超音波振動子等のメンテナンス又は交換を容易
に行うことができる超音波振動装置及びそれを備えた超
音波洗浄装置を提供することである。The present invention has been made in order to solve the above-mentioned problems, and it is possible to ultrasonically clean an object to be cleaned using an existing cleaning tank, for example, megahertz ultrasonic cleaning of a semiconductor wafer, An ultrasonic vibration device and an ultrasonic vibration device capable of cleaning an object to be cleaned in a state of being immersed in a cleaning liquid and easily performing maintenance or replacement of the ultrasonic vibration device or an ultrasonic vibrator provided therein. It is to provide an equipped ultrasonic cleaning device.
【００１２】[0012]
【課題を解決するための手段】本発明は、上部が開口し
た洗浄槽内の洗浄液中に浸漬された被洗浄物に超音波を
照射するための超音波振動装置であって、前記洗浄槽の
上部開口を蓋状に閉塞するとともに、超音波振動子が固
着された振動板の振動面が下向きに配置され、かつ該振
動面が洗浄槽内の洗浄液中に没入するように構成された
ものである。SUMMARY OF THE INVENTION The present invention is an ultrasonic vibration device for irradiating an ultrasonic wave to an object to be cleaned immersed in a cleaning liquid in a cleaning tank having an opening at the top, which comprises: The upper opening is closed like a lid, and the vibrating surface of the vibration plate to which the ultrasonic transducer is fixed is arranged downward, and the vibrating surface is configured to be immersed in the cleaning liquid in the cleaning tank. is there.
【００１３】また、本発明は、上部が開口した洗浄槽内
の洗浄液中に浸漬された被洗浄物に超音波を照射するた
めの超音波振動装置であって、前記洗浄槽の上部開口を
蓋状に閉塞するとともに、導波体を介して超音波振動子
が固着された振動板の振動面が下向きに配置され、かつ
該振動面が洗浄槽内の洗浄液中に没入するように構成さ
れたものである。Further, the present invention is an ultrasonic vibration device for irradiating an object to be cleaned, which is immersed in a cleaning liquid in a cleaning tank having an open upper part, with ultrasonic waves, wherein the upper opening of the cleaning tank is covered. The diaphragm vibrates with the ultrasonic transducer fixed to it via the waveguide, and the vibrating surface of the vibrating plate is arranged downward, and the vibrating surface is immersed in the cleaning liquid in the cleaning tank. It is a thing.
【００１４】また、前記洗浄槽とヒンジ結合あるいは上
下動手段により該洗浄槽の上部開口を閉塞・開放するよ
うに構成されたものが好ましく、前記振動板の振動数
は、２００ｋＨｚから５ＭＨｚの範囲とするものが好ま
しく、前記振動板は、フッ素樹脂被覆又は不働態化処理
されたＳＵＳ３０４、ＳＵＳ３１６又はＳＵＳ３１６
Ｌ、あるいはタンタル、溶融石英又は炭化ケイ素、ある
いは表面粗さがＲｍａｘ１μｍ以下のＳＵＳで形成され
ているものが好ましく、前記振動板の下面に洗浄槽内の
洗浄液と同じ液を噴射でき、下面に付着した気泡を除去
する気泡除去手段を取り付けたものが好ましい。Further, it is preferable that the cleaning tank is configured to be hinged or vertically movable to close / open the upper opening of the cleaning tank. The vibration frequency of the diaphragm is in the range of 200 kHz to 5 MHz. The vibrating plate is preferably SUS304, SUS316, or SUS316 coated with a fluororesin or passivated.
L, tantalum, fused silica, silicon carbide, or SUS having a surface roughness R max of 1 μm or less is preferable, and the same liquid as the cleaning liquid in the cleaning tank can be sprayed onto the lower surface of the vibration plate. It is preferable that a bubble removing means for removing bubbles adhering to is attached.
【００１５】また、本発明は、前記超音波振動子と、該
超音波振動装置を取り付ける上部開口を有する洗浄槽と
を備えたものである。The present invention is also provided with the above ultrasonic vibrator and a cleaning tank having an upper opening to which the ultrasonic vibration device is attached.
【００１６】また、前記超音波振動装置と、上部が開口
し該上部開口近傍に、前記超音波振動装置の振動板の下
面に洗浄槽内の洗浄液と同じ液を噴射して、振動板の下
面に付着する気泡を除去する気泡除去手段が設けられて
いるものでもよい。Further, the ultrasonic vibrating device is opened at an upper portion thereof, and in the vicinity of the upper opening, the same liquid as the cleaning liquid in the cleaning tank is sprayed onto the lower surface of the vibrating plate of the ultrasonic vibrating device to form the lower surface of the vibrating plate. There may be provided a bubble removing means for removing bubbles attached to the.
【００１７】[0017]
【発明の実施の形態】以下、図面を参照して、本発明の
実施形態について説明する。図１は、本発明による超音
波振動装置の第１実施形態を示し、（ａ）は（ｂ）のＢ
−Ｂ線断面位置における断面図、（ｂ）は（ａ）のＡ−
Ａ線断面位置における断面図である。BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a first embodiment of an ultrasonic vibration device according to the present invention, where (a) is B of (b).
-B is a sectional view taken along the line B, and (b) is A- in (a).
It is sectional drawing in the A line sectional position.
【００１８】図１に示すように、本発明の第１実施形態
の超音波振動装置１０は、一端部が開口し、他端部が振
動板１１となる箱状部材１２と、前記一端部を閉鎖する
前記一端部より広い板状部材１３と、箱状部材１２内側
の振動板１１に、接着剤１４で固着される超音波振動子
１５と、洗浄中に振動板１１の下面に付着あるいは振動
板１１の外側近傍に溜まる気泡を除去する気泡除去手段
である洗浄液噴出機構１６とを備え、洗浄槽（図示せ
ず）の上部開口を蓋状に閉塞するとともに、超音波振動
子１５が固着された振動板１１の振動面が下向きに配置
され、かつ該振動面が前記洗浄槽内の洗浄液中に没入す
るように構成されたものである。As shown in FIG. 1, an ultrasonic vibration device 10 according to a first embodiment of the present invention includes a box-shaped member 12 having an opening at one end and a diaphragm 11 at the other end, and the one end. A plate-shaped member 13 that is wider than the one end that is closed, an ultrasonic vibrator 15 that is fixed to the diaphragm 11 inside the box-shaped member 12 with an adhesive 14, and adheres or vibrates to the lower surface of the diaphragm 11 during cleaning. A cleaning liquid jetting mechanism 16 which is a bubble removing means for removing bubbles accumulated near the outside of the plate 11 is provided to close an upper opening of a cleaning tank (not shown) like a lid and an ultrasonic transducer 15 is fixed. The vibrating plate 11 is arranged so that its vibrating surface faces downward, and the vibrating surface is immersed in the cleaning liquid in the cleaning tank.
【００１９】尚、超音波振動装置１０は、前記洗浄槽と
ヒンジ結合あるいはロボット等の上下動手段により該洗
浄槽の上部開口を閉塞・開放するように構成されたもの
が好ましい。また、既存の洗浄槽で超音波振動装置１０
を利用するために、板状部材１３に、既存の洗浄槽に合
うように取り付けるためのアダプタを用いたり、あるい
は既存の洗浄槽の周囲に、超音波振動装置１０を取り付
ける枠体等を用いたりする。It is preferable that the ultrasonic vibration device 10 is constructed so as to close or open the upper opening of the cleaning tank by means of a hinge connection with the cleaning tank or a vertically moving means such as a robot. In addition, in the existing cleaning tank, the ultrasonic vibration device 10
In order to utilize, the plate-shaped member 13 may be provided with an adapter for fitting it to an existing cleaning tank, or a frame or the like for mounting the ultrasonic vibration device 10 around the existing cleaning tank. To do.
【００２０】気泡除去手段である洗浄液噴出機構１６
は、超音波洗浄中に振動板１１近傍に気泡が溜ったり、
その気泡が振動板１１に付着したりして、振動板１１が
洗浄液により冷却されずに、超音波振動子１５が所謂空
焚きの状態になるのを防止するために備えられるもので
ある。洗浄液噴出機構１６は、洗浄液注入配管１７が設
けられ、両端が閉鎖された円筒状部材の側面に、超音波
振動板１１に向かって洗浄液を噴出する複数の洗浄液噴
出口１８が設けられ、外部に設けられた洗浄液注入口１
９から洗浄液注入配管１７を通じて高圧の洗浄液２０を
注入して、洗浄液噴出口１８から振動板１１近傍に向か
って、洗浄槽中の洗浄液と同じ洗浄液を噴出させるもの
である。この噴出する洗浄液の流れによって、振動板１
１近傍に溜まったりあるいは振動板１１に付着した気泡
を移動させて除去する。Cleaning liquid jetting mechanism 16 which is a bubble removing means
May cause air bubbles to accumulate near the diaphragm 11 during ultrasonic cleaning.
This is provided in order to prevent the ultrasonic transducer 15 from being in a so-called empty-fired state due to the bubbles adhering to the diaphragm 11 and the diaphragm 11 not being cooled by the cleaning liquid. The cleaning liquid ejection mechanism 16 is provided with a cleaning liquid injection pipe 17, and a plurality of cleaning liquid ejection ports 18 for ejecting the cleaning liquid toward the ultrasonic vibration plate 11 are provided on the side surface of the cylindrical member whose both ends are closed, and the cleaning liquid ejection pipe 18 is provided outside. Cleaning liquid inlet 1 provided
The high-pressure cleaning liquid 20 is injected from the cleaning liquid injection pipe 17 through the cleaning liquid injection pipe 17, and the same cleaning liquid as the cleaning liquid in the cleaning tank is ejected from the cleaning liquid ejection port 18 toward the vibrating plate 11. The vibrating plate 1 is caused by the flow of the jetting cleaning liquid.
Bubbles accumulated in the vicinity of 1 or attached to the vibration plate 11 are moved and removed.
【００２１】洗浄液噴出機構１６は、前記円筒状部材の
一端部近傍に備えられた洗浄液注入配管１７及び他端部
近傍に設けられた固定部材（図示せず）により、板状部
材１３に取り付けられ、振動板１１近傍の気泡除去に効
果的な場所に固定される。尚、洗浄液噴出機構１６の固
定方法及び固定場所は、前記以外でもよく、適宜選択す
る。また、洗浄液噴出機構１６、即ち、気泡除去手段は
無くてもよい。その場合は、超音波振動子が空焚きの状
態とならない時間だけ使用するように、使用時間を限定
する。The cleaning liquid jetting mechanism 16 is attached to the plate member 13 by a cleaning liquid injection pipe 17 provided near one end of the cylindrical member and a fixing member (not shown) provided near the other end. , Is fixed at a place near the diaphragm 11 that is effective for removing bubbles. Incidentally, the fixing method and the fixing place of the cleaning liquid ejecting mechanism 16 may be other than those described above, and are appropriately selected. Further, the cleaning liquid ejecting mechanism 16, that is, the bubble removing means may be omitted. In that case, the usage time is limited so that the ultrasonic transducer is used only for a time when the ultrasonic transducer does not become in an empty state.
【００２２】振動板１１は、フッ素樹脂被覆又は複合電
解研摩、電気めっき等の不働態化処理されたＳＵＳ３０
４、ＳＵＳ３１６又はＳＵＳ３１６Ｌ、あるいはタンタ
ル、溶融石英又は炭化ケイ素、あるいは表面粗さがＲ
ｍａｘ１μｍ以下のＳＵＳであり、耐洗浄液性の材料で
形成されている。尚、振動板１１を底面に有する箱状部
材１２全てが前記材料で形成されているものでもよい。
また、振動板１１の厚さは、適宜選択するが、共振型振
動板として使用する場合は、超音波振動で発生する超音
波の波長の１／２倍、１倍、３／２倍、２倍、５／２
倍、３倍、・・・等の厚さとする。また、洗浄液等が箱
状部材１３の中に入らないように、箱状部材１２と板状
部材１３との間に耐洗浄液性のパッキン２３を用いる。The vibrating plate 11 is made of SUS30 which has been passivated by fluororesin coating or composite electrolytic polishing, electroplating or the like.
4, SUS316 or SUS316L, or tantalum, fused silica or silicon carbide, or surface roughness R
The SUS has a max of 1 μm or less and is made of a cleaning liquid resistant material. It should be noted that all the box-shaped members 12 having the vibration plate 11 on the bottom surface may be formed of the above material.
Although the thickness of the diaphragm 11 is appropriately selected, when it is used as a resonance diaphragm, it is 1/2 times, 1 time, 3/2 times, or 2 times the wavelength of the ultrasonic wave generated by ultrasonic vibration. Double, 5/2
The thickness should be double, triple, and so on. Further, a packing 23 that is resistant to the cleaning liquid is used between the box-shaped member 12 and the plate-shaped member 13 so that the cleaning liquid and the like do not enter the box-shaped member 13.
【００２３】超音波振動子１５は、既存の２００ｋＨｚ
から５ＭＨｚの何れかの周波数の超音波を発生させるこ
とができるものを用いる。振動板１１には、１個又は複
数個、ここでは４個、の超音波振動子１５を固着する。
各超音波振動子１５にはリード線２１を通じてコネクタ
２２から所定の電圧が印加される。尚、コネクタ２２の
板状部材１３への取付部分には、そこから洗浄液等が箱
状部材１２内に入らないように密封処理を施す。The ultrasonic transducer 15 is the existing 200 kHz.
1 to 5 MHz is used. One or more, four in this case, ultrasonic transducers 15 are fixed to the diaphragm 11.
A predetermined voltage is applied to each ultrasonic transducer 15 from a connector 22 via a lead wire 21. The connector 22 is attached to the plate-shaped member 13 by a sealing process so that the cleaning liquid or the like does not enter the box-shaped member 12 from there.
【００２４】次に、本発明の第２実施形態の超音波振動
装置３０について図２を用いて説明する。超音波振動装
置３０は、一端部が開口し、他端部が振動板３１となる
箱状部材３２と、前記一端部を閉鎖する前記一端部より
広い板状部材３３と、箱状部材３３内側の振動板３１に
下端面が接着剤で固着されると共に、上端面に超音波振
動子３４を有して超音波振動を導く導波体３５とを備え
たもので、洗浄槽（図示せず）の上部開口を蓋状に閉塞
するとともに、導波体３５を介して超音波振動子３４が
接着剤１４により固着された振動板３１の振動面が下向
きに配置され、かつ該振動面が前記洗浄槽内の洗浄液中
に没入するように構成されたものである。尚、超音波振
動子３４は、導波体３５の上端面に接着剤１４により固
着されている。Next, an ultrasonic vibration device 30 according to a second embodiment of the present invention will be described with reference to FIG. The ultrasonic vibration device 30 has a box-shaped member 32 having one end opened and a vibration plate 31 at the other end, a plate-shaped member 33 wider than the one end for closing the one end, and the inside of the box-shaped member 33. The lower end surface of the diaphragm 31 is fixed to the vibrating plate 31 with an adhesive, and the upper end surface of the vibrating plate 31 is provided with an ultrasonic transducer 34 and a waveguide 35 for guiding ultrasonic vibration. ), The upper opening is closed like a lid, and the vibrating surface of the vibrating plate 31 to which the ultrasonic transducer 34 is fixed by the adhesive 14 via the waveguide 35 is arranged downward, and the vibrating surface is It is configured to be immersed in the cleaning liquid in the cleaning tank. The ultrasonic transducer 34 is fixed to the upper end surface of the waveguide 35 with the adhesive 14.
【００２５】即ち、超音波振動装置３０は、前記超音波
振動装置１０において、超音波振動子１５の替わりに、
超音波振動子３４と超音波振動を導く導波体３５とを用
いるものである。That is, the ultrasonic vibrating device 30 is similar to the ultrasonic vibrating device 10 described above, in place of the ultrasonic vibrator 15.
The ultrasonic transducer 34 and the waveguide 35 for guiding the ultrasonic vibration are used.
【００２６】導波体３５のフランジ３６には、超音波発
生中に導波体３５及び超音波振動子３４を冷却するため
の冷却機構３７が取り付けられている。冷却機構３７
は、フランジ３６の２箇所に設けられた貫通孔３８に、
配管を通じて外部の注入口３９ａと排出口３９ｂが連結
されたものである。注入口３９ａから冷却水３９ｃを注
入して、前記２箇所の貫通孔３８を通して、外部の排出
口３９ｂから冷却水３９ｃを排出するようにして、導波
体３５を冷却すると共に、超音波振動子３４を冷却す
る。A cooling mechanism 37 for cooling the waveguide 35 and the ultrasonic transducer 34 during generation of ultrasonic waves is attached to the flange 36 of the waveguide 35. Cooling mechanism 37
Is in the through holes 38 provided at two positions of the flange 36,
The external inlet 39a and outlet 39b are connected through a pipe. Cooling water 39c is injected from the inlet 39a, the cooling water 39c is discharged from the external outlet 39b through the two through holes 38, and the waveguide 35 is cooled and the ultrasonic transducer Cool 34.
【００２７】導波体３５として、冷却機構を備えたもの
で、超音波振動装置３０に取付可能な既存のもの、例え
ば、特開平１０−９４７５６号公報に記載されているも
の等を用いることができる。大きさ等に関しては、各々
の場合に応じて設計する。As the waveguide 35, an existing one provided with a cooling mechanism and attachable to the ultrasonic vibration device 30, for example, the one described in JP-A-10-94756 can be used. it can. The size etc. shall be designed according to each case.
【００２８】また、既存の洗浄槽への利用の仕方、箱状
部材３２、超音波振動子３４に関しては、第１実施形態
の超音波振動装置１０におけるものと同様のものであ
り、ここでは説明を省略する。尚、超音波振動装置３０
に前記気泡除去手段を備え、前記振動板に付着あるいは
前記振動板の近傍に溜まった気泡を除去するようにして
もよい。The method of use in the existing cleaning tank, the box-shaped member 32, and the ultrasonic vibrator 34 are the same as those in the ultrasonic vibration device 10 of the first embodiment, and will be described here. Is omitted. The ultrasonic vibration device 30
The air bubble removing means may be provided to remove air bubbles attached to the vibrating plate or accumulated in the vicinity of the vibrating plate.
【００２９】以上示したように、超音波振動装置１０、
３０は、比較的簡単に既存の洗浄槽に利用でき、それに
より２００ｋＨｚから５ＭＨｚの何れかの周波数の超音
波を用いたウェハ等の超音波洗浄、特に、５００ｋＨｚ
から５ＭＨｚの超音波振動を用いたメガヘルツ超音波洗
浄を行うことができるようになる。但し、洗浄条件等
は、それぞれの場合において条件出しする必要がある。
また、前記のように、超超音波振動装置１０、３０は、
洗浄槽から容易に取外したり、あるいは洗浄槽上方に一
端部を持ち上げることができるので、超超音波振動装置
１０、３０あるいはその中に備えられた超音波振動子等
のメンテナンス、交換を容易に行うことができる。As shown above, the ultrasonic vibration device 10,
30 can be used in an existing cleaning tank relatively easily, so that ultrasonic cleaning of a wafer or the like using ultrasonic waves of any frequency from 200 kHz to 5 MHz, particularly 500 kHz.
Thus, it becomes possible to perform megahertz ultrasonic cleaning using ultrasonic vibration of 5 MHz. However, the cleaning conditions and the like need to be specified in each case.
Further, as described above, the ultrasonic vibration devices 10 and 30 are
Since it can be easily removed from the cleaning tank or one end can be lifted above the cleaning tank, maintenance and replacement of the ultrasonic vibration devices 10 and 30 or the ultrasonic vibrators provided therein can be easily performed. be able to.
【００３０】次に、本発明の第１実施形態の超音波洗浄
装置４０について、図３と図４を用いて説明する。超音
波洗浄装置４０は、被洗浄物であるウェハ４１等を浸漬
する洗浄液が入れられる洗浄槽４２と、一端部が開口
し、他端部が振動板４３ａとなる箱状部材４３ｂと、前
記一端部を閉鎖する前記一端部より広い板状部材４３ｃ
と、箱状部材４３ｂ内側の振動板４３ａに固着される超
音波振動子（図示せず）と、洗浄中に振動板４３ａに付
着したり、振動板４３ａの外側近傍に溜まったりする気
泡を除去する気泡除去手段、例えば、洗浄液噴出機構４
３ｄとを備え、箱状部材４３ｂの振動板４３ａが前記洗
浄液中に浸かるように洗浄槽４２の上端近傍に設置され
る超音波振動装置４３とを備えたものである。Next, the ultrasonic cleaning device 40 according to the first embodiment of the present invention will be described with reference to FIGS. 3 and 4. The ultrasonic cleaning device 40 includes a cleaning tank 42 in which a cleaning liquid for immersing a wafer 41 or the like to be cleaned is placed, a box-shaped member 43b having an opening at one end and a vibrating plate 43a at the other end, and the one end. A plate-like member 43c wider than the one end for closing the part
And an ultrasonic vibrator (not shown) fixed to the vibrating plate 43a inside the box-shaped member 43b, and removing air bubbles that adhere to the vibrating plate 43a during cleaning or accumulate on the outer side of the vibrating plate 43a. Air bubble removing means, for example, the cleaning liquid ejection mechanism 4
3d, and the ultrasonic vibration device 43 installed near the upper end of the cleaning tank 42 so that the vibration plate 43a of the box-shaped member 43b is immersed in the cleaning liquid.
【００３１】即ち、超音波洗浄装置４０は、箱状部材４
３ｂの振動板４３ａが前記洗浄液中に浸かるように、洗
浄槽４２の上端近傍に超音波振動装置１０と同様の超音
波振動装置４３が備えられ、洗浄液の上側から下側に向
けて超音波を照射して、洗浄液中に浸漬されたウェハ４
１、例えば、２インチ（５０．８ｍｍ）、４インチ（１
０１．６ｍｍ）、６インチ（１５２．４ｍｍ）、８イン
チ（２０３．２ｍｍ）、３００ｍｍあるいは４５０ｍｍ
等のウェハ、を洗浄するものである。尚、板状部材４３
ｃの一端部４４がヒンジ結合で軸回転するようにして、
他端部４５が上下動可能に、あるいはロボット等の上下
動手段により移動可能に洗浄槽４２近傍に設置される。That is, the ultrasonic cleaning device 40 includes the box-shaped member 4
An ultrasonic vibrating device 43 similar to the ultrasonic vibrating device 10 is provided in the vicinity of the upper end of the cleaning tank 42 so that the vibrating plate 43a of 3b is immersed in the cleaning liquid. Wafer 4 irradiated and immersed in cleaning liquid
1, for example, 2 inches (50.8 mm), 4 inches (1
01.6 mm), 6 inches (152.4 mm), 8 inches (203.2 mm), 300 mm or 450 mm
Etc. for cleaning the wafer. The plate member 43
The one end portion 44 of c is rotated about the axis by the hinge connection,
The other end portion 45 is installed near the cleaning tank 42 so as to be vertically movable or movable by a vertically moving means such as a robot.
【００３２】前記のように板状部材４３ｃを上下動させ
るために、例えば、枠体４６の基台４６ａに洗浄槽４２
が固定部材４６ｂで固定され、基台４６ａに取り付けら
れた柱４６ｃに板状部材４３ｃの一端部４４がヒンジ結
合で軸回転可能に取り付けられたもので、振動板４３ａ
が洗浄液中に浸かった状態で超音波振動装置４３が固定
されるように、ロック機構（図示せず）を有する。尚、
ロック機構として、板状部材４３ｃの一端部４４と対向
する他端部をロックするようにしたものでもよい。In order to move the plate member 43c up and down as described above, for example, the cleaning tank 42 is mounted on the base 46a of the frame 46.
Is fixed by a fixing member 46b, and one end 44 of a plate-like member 43c is attached to a pillar 46c attached to a base 46a so as to be axially rotatable by a hinge coupling.
A lock mechanism (not shown) is provided so that the ultrasonic vibration device 43 is fixed in a state where the ultrasonic vibration device 43 is immersed in the cleaning liquid. still,
The locking mechanism may be one that locks the other end of the plate member 43c that faces the one end 44.
【００３３】また、板状部材４３ｃの他端部４５に把手
（図示せず）を取り付け、他端部４５を上下動し易くす
る。Further, a handle (not shown) is attached to the other end 45 of the plate member 43c to facilitate the vertical movement of the other end 45.
【００３４】枠体４６の形状、洗浄槽４２の固定方法、
超音波振動装置４３と枠体４６との組み合わせ方法等
は、前記したものばかりではなく適宜選択すればよい。The shape of the frame 46, the method of fixing the cleaning tank 42,
The method of combining the ultrasonic vibration device 43 and the frame body 46 and the like are not limited to those described above and may be appropriately selected.
【００３５】尚、超音波振動装置４３で用いる超音波振
動子（図示せず）、振動板４３ａ等については、超音波
振動装置１０におけるものと同様のものであり、その他
詳細については前記と同様であるので、ここでは説明を
省略する。The ultrasonic vibrator (not shown) and the vibrating plate 43a used in the ultrasonic vibration device 43 are the same as those in the ultrasonic vibration device 10, and other details are the same as described above. Therefore, the description is omitted here.
【００３６】洗浄槽４２は、上端４７が四角形状で各辺
が複数個の少なくとも谷部４７ａを有する山形状であ
り、且つ前記山形状の谷部４７ａが前記四角形状の角部
４７ｂに位置するように形成されていると共に、側面上
側に、溢れ出た洗浄液を受けるオーバーフロー槽４８
と、洗浄槽４２内の側面下側に、外部から洗浄槽４２内
に洗浄液を噴出する複数個の洗浄液噴出口（図示せず）
と、底に洗浄処理後に不要になった洗浄槽４２中の洗浄
液を排出する排出口４９とを備え、溶融石英、タンタ
ル、表面粗さがＲｍａｘ０．７μｍ以下に処理されたス
テンレス、炭化ケイ素、アルミナ、あるいはフッ素樹脂
などの耐洗浄液性且つ超音波振動により溶融しない材料
で形成されているものである。The washing tank 42 has a quadrangular shape with an upper end 47 having a quadrangular shape and each side having a plurality of troughs 47a, and the ridged troughs 47a are located at the quadrangular corners 47b. And an overflow tank 48 for receiving the overflowed cleaning liquid on the upper side surface.
And a plurality of cleaning liquid ejection ports (not shown) for ejecting the cleaning liquid from the outside into the cleaning tank 42 below the side surface in the cleaning tank 42.
And a discharge port 49 for discharging the cleaning liquid in the cleaning tank 42, which is no longer needed after the cleaning process, and fused quartz, tantalum, stainless steel having a surface roughness of R max 0.7 μm or less, and silicon carbide. , Alumina, or fluororesin, etc., and is made of a material that is resistant to cleaning liquid and does not melt due to ultrasonic vibration.
【００３７】洗浄槽４２の上端４７に谷部４７ａを設け
ることにより、上端４７の各辺それぞれにおいて、谷部
４７ａからほぼ均等に洗浄液が溢れ出るようになる。By providing the valley portion 47a on the upper end 47 of the cleaning tank 42, the cleaning liquid overflows from the valley portion 47a substantially evenly on each side of the upper end 47.
【００３８】洗浄液は、前記洗浄液噴出口から絶えずあ
るいは間欠的に供給され、余分なあるいは洗浄に使用さ
れた洗浄液は、洗浄槽４２の上端４７から溢れ出てオー
バーフロー槽４８に入る。前記洗浄液噴出口は、例え
ば、洗浄槽４２内の下側側面近傍２箇所に備えられた一
端部５０ａが閉鎖された円筒状体５０の側面に、ウェハ
４１に向かって洗浄液を噴出するように設けられた複数
個の孔であり、高圧の洗浄液が注入口５０ｂから注入さ
れて洗浄液噴出口から噴出される。The cleaning liquid is continuously or intermittently supplied from the cleaning liquid jet port, and the excess or the cleaning liquid used for cleaning overflows from the upper end 47 of the cleaning tank 42 and enters the overflow tank 48. The cleaning liquid ejection port is provided so as to eject the cleaning liquid toward the wafer 41, for example, on the side surface of the cylindrical body 50, which is provided at two locations near the lower side surface in the cleaning tank 42 and whose one end 50a is closed. The high-pressure cleaning liquid is injected from the injection port 50b and is ejected from the cleaning liquid ejection port.
【００３９】オーバーフロー槽４８は、図示するよう
に、その底面が傾斜していて、洗浄槽４２から溢れ出た
洗浄液が排出口４８ａに集まり排出される。As shown in the figure, the bottom surface of the overflow tank 48 is inclined, and the cleaning liquid overflowing from the cleaning tank 42 is collected in the discharge port 48a and discharged.
【００４０】尚、洗浄槽４２には、ウェハが嵌入する複
数の嵌入部を有するウェハ固定治具５１が備えられ、ウ
ェハ４１のほんの一部を前記嵌入部に嵌め込んで固定す
る。ウェハ固定治具５１の形状、嵌入部の形状等は、適
宜選択すればよい。図中、４３ｅは超音波振動子（図示
せず）に所定の電圧を印加するためのコネクタ、４３ｆ
は洗浄液の注入口、５２は超音波振動装置４３内に洗浄
液が入らないようにするための耐洗浄液性のパッキン。The cleaning tank 42 is provided with a wafer fixing jig 51 having a plurality of fitting portions into which the wafer is fitted, and only a part of the wafer 41 is fitted into the fitting portion and fixed. The shape of the wafer fixing jig 51, the shape of the fitting portion, etc. may be appropriately selected. In the figure, 43e is a connector for applying a predetermined voltage to an ultrasonic transducer (not shown), 43f
Is a cleaning liquid injection port, and 52 is a cleaning liquid resistant packing for preventing the cleaning liquid from entering the ultrasonic vibration device 43.
【００４１】本発明の第２実施形態の超音波洗浄装置
は、超音波洗浄装置４０における超音波振動装置４３を
超音波振動装置３０と同様なものに置き換え、図３に示
すようにその一端部を上下動可能に設置したものであ
り、その他詳細については前記と同様であるのでここで
は説明を省略する。尚、超音波振動装置１０に示すよう
な、気泡除去手段である洗浄液噴出機構を備えていても
よい。In the ultrasonic cleaning apparatus of the second embodiment of the present invention, the ultrasonic vibrating device 43 in the ultrasonic cleaning device 40 is replaced with the same one as the ultrasonic vibrating device 30, and one end portion thereof as shown in FIG. Is installed so that it can be moved up and down, and other details are the same as described above, and therefore description thereof is omitted here. It should be noted that the ultrasonic vibration device 10 may be provided with a cleaning liquid ejection mechanism which is a bubble removing means.
【００４２】尚、前記第１実施形態あるいは第２実施形
態の超音波洗浄装置において、気泡除去手段である洗浄
液噴出機構として、前記超音波振動装置に備えずに、洗
浄槽に備えて、洗浄槽内の洗浄液と同じ洗浄液を噴出す
るものでもよい。In the ultrasonic cleaning apparatus of the first or second embodiment, the cleaning liquid jetting mechanism, which is a bubble removing means, is not provided in the ultrasonic vibration device but is provided in the cleaning tank. The same cleaning liquid as the inner cleaning liquid may be ejected.
【００４３】以上示したように、前記第１実施形態ある
いは第２実施形態の超音波洗浄装置を用いれば、ウェハ
を洗浄液に浸漬して超音波洗浄することができ、また超
音波振動装置が洗浄槽の上側に設置され、容易に洗浄液
からその上方に持ち上げることができるので、該超音波
振動装置あるいはその中に設置された超音波振動子等の
メンテナンスあるいは交換を容易に行うことができる。
尚、前記超音波洗浄装置は、ウェハばかりでなく、洗浄
槽の大きさ、超音波振動子の周波数、超音波振動のため
のパワー等を適宜選択することにより、その他液晶等の
被洗浄物を洗浄するために用いることができる。As described above, by using the ultrasonic cleaning apparatus of the first embodiment or the second embodiment, the wafer can be immersed in the cleaning liquid for ultrasonic cleaning, and the ultrasonic vibrating apparatus cleans it. Since it is installed on the upper side of the tank and can be easily lifted up from the cleaning liquid, maintenance or replacement of the ultrasonic vibration device or the ultrasonic vibrator installed therein can be easily performed.
In addition to the wafer, the ultrasonic cleaning apparatus can be used for cleaning other objects to be cleaned such as liquid crystal by appropriately selecting the size of the cleaning tank, the frequency of the ultrasonic vibrator, the power for ultrasonic vibration, and the like. It can be used for washing.
【００４４】[0044]
【発明の効果】本発明によれば、既存の洗浄槽に比較的
容易に取り付けられ、被洗浄物の超音波洗浄、例えば、
半導体ウェハのメガヘルツ超音波洗浄も行うことができ
るようになり、また、被洗浄物を洗浄液に浸漬した状態
で洗浄することができ、更に、超音波振動装置あるいは
その中に備えられた超音波振動子等のメンテナンス、交
換等を容易に行うことができる。EFFECTS OF THE INVENTION According to the present invention, it is possible to attach the cleaning object to the existing cleaning tank relatively easily and ultrasonically clean the object to be cleaned.
It is also possible to perform megahertz ultrasonic cleaning of semiconductor wafers, and it is also possible to clean an object to be cleaned while it is immersed in a cleaning liquid. Furthermore, an ultrasonic vibration device or an ultrasonic vibration device provided therein can be used. It is possible to easily perform maintenance and replacement of the child and the like.
【図１】本発明による超音波振動装置の第１実施形態を
示し、（ａ）は（ｂ）のＢ−Ｂ線断面位置における断面
図、（ｂ）は（ａ）のＡ−Ａ線断面位置における断面図
である。1A and 1B show a first embodiment of an ultrasonic vibration device according to the present invention, FIG. 1A is a sectional view taken along line BB in FIG. 1B, and FIG. It is sectional drawing in a position.
【図２】本発明による超音波振動装置の第２実施形態を
示し、（ａ）は（ｂ）のＣ−Ｃ線断面位置における断面
図、（ｂ）（ａ）のＤ−Ｄ線断面位置における断面図で
ある。2A and 2B show a second embodiment of the ultrasonic vibration device according to the present invention, in which FIG. 2A is a sectional view taken along line CC of FIG. 2B, and sectional position taken along line DD of FIG. FIG.
【図３】本発明による超音波洗浄装置の第１実施形態を
示す側面図である。FIG. 3 is a side view showing the first embodiment of the ultrasonic cleaning device according to the present invention.
【図４】図３の超音波洗浄装置を右側から見た図であ
る。FIG. 4 is a diagram of the ultrasonic cleaning device of FIG. 3 viewed from the right side.
【図５】従来の超音波洗浄装置の断面図である。FIG. 5 is a cross-sectional view of a conventional ultrasonic cleaning device.
１０、３０ 超音波振動装置 １１、３１ 振動板 １２、３２ 箱状部材 １３、３３ 板状部材 １４ 接着剤 １５、３４ 超音波振動子 １６ 洗浄液噴出機構 １７ 洗浄液注入配管 １８ 洗浄液噴出口 １９ 注入口 ２０ 洗浄液 ２１ リード線 ２２ コネクタ ２３、５２ パッキン ３５ 導波体 ３６ フランジ ３７ 冷却機構 ３８ 貫通孔 ３９ａ 注入口 ３９ｂ 排出口 ３９ｃ 冷却水 ４０ 超音波洗浄装置 ４１ ウェハ ４２ 洗浄槽 ４３ 超音波振動装置 ４３ａ 振動板 ４３ｂ 箱状部材 ４３ｃ 板状部材 ４３ｄ 洗浄液噴出機構 ４３ｅ コネクタ ４３ｆ 注入口 ４４ 一端部 ４５ 他端部 ４６ 枠体 ４６ａ 基部 ４６ｂ 固定部材 ４６ｃ 柱 ４７ 上端 ４７ａ 谷部 ４７ｂ 角部 ４８ オーバーフロー槽 ４８ａ 排出口 ４９ 排出口 ５０ 円筒状体 ５０ａ 一端部 ５０ｂ 注入口 ５１ ウェハ固定治具 ６０ 超音波洗浄装置 ６１ ウェハ ６２ 洗浄液 ６３ 洗浄槽 ６４ 冷却水 ６５ 冷却槽 ６６ 振動板 ６７ 側面 ６８ 超音波振動子 ６９ 接着剤 10, 30 Ultrasonic vibration device 11,31 diaphragm 12, 32 Box-shaped member 13, 33 Plate-shaped member 14 Adhesive 15,34 Ultrasonic transducer 16 Cleaning liquid ejection mechanism 17 Cleaning liquid injection pipe 18 Cleaning liquid spout 19 inlet 20 cleaning liquid 21 lead wire 22 connector 23, 52 packing 35 Waveguide 36 flange 37 Cooling mechanism 38 through hole 39a inlet 39b outlet 39c cooling water 40 ultrasonic cleaning equipment 41 wafers 42 cleaning tank 43 Ultrasonic vibration device 43a diaphragm 43b Box-shaped member 43c Plate member 43d Cleaning liquid ejection mechanism 43e connector 43f inlet 44 One end 45 the other end 46 frame 46a base 46b fixing member 46c pillar 47 top 47a Tanibe 47b corner 48 overflow tank 48a outlet 49 outlet 50 cylindrical body 50a One end 50b inlet 51 Wafer fixing jig 60 ultrasonic cleaning equipment 61 wafers 62 cleaning liquid 63 washing tank 64 cooling water 65 cooling tank 66 diaphragm 67 side 68 Ultrasonic transducer 69 adhesive
───────────────────────────────────────────────────── フロントページの続き (72)発明者 マイケル・ジェイ・デニス 米国 カリフォルニア州95131サンノゼ、 スィートＣ112、オークランドロード1580 (72)発明者 高橋 典久 東京都羽村市栄町３丁目１番地の５ 株式 会社カイジョー内 (72)発明者 高橋 清吾 東京都羽村市栄町３丁目１番地の５ 株式 会社カイジョー内 Ｆターム(参考） 5D107 AA16 BB01 CC10 CC12 CD05 FF08 ─────────────────────────────────────────────────── ─── Continued front page (72) Inventor Michael Jay Dennis 95131 San Jose, California, USA Sweet C112, Auckland Road 1580 (72) Inventor Norihisa Takahashi 5 shares in 3-chome, Sakaemachi, Hamura, Tokyo Company Kaijo (72) Inventor Seigo Takahashi 5 shares in 3-chome, Sakaemachi, Hamura, Tokyo Company Kaijo F term (reference) 5D107 AA16 BB01 CC10 CC12 CD05 FF08
Claims (8)
漬された被洗浄物に超音波を照射するための超音波振動
装置であって、 前記洗浄槽の上部開口を蓋状に閉塞するとともに、超音
波振動子が固着された振動板の振動面が下向きに配置さ
れ、かつ該振動面が洗浄槽内の洗浄液中に没入するよう
に構成された超音波振動装置。1. An ultrasonic vibration device for irradiating ultrasonic waves to an object to be cleaned, which is immersed in a cleaning liquid in a cleaning tank having an upper opening, wherein the upper opening of the cleaning tank is closed like a lid. At the same time, the ultrasonic vibrating device is configured such that the vibrating surface of the vibrating plate to which the ultrasonic vibrator is fixed is arranged downward, and the vibrating surface is immersed in the cleaning liquid in the cleaning tank.
漬された被洗浄物に超音波を照射するための超音波振動
装置であって、 前記洗浄槽の上部開口を蓋状に閉塞するとともに、導波
体を介して超音波振動子が固着された振動板の振動面が
下向きに配置され、かつ該振動面が洗浄槽内の洗浄液中
に没入するように構成された超音波振動装置。2. An ultrasonic vibration device for irradiating ultrasonic waves to an object to be cleaned, which is immersed in a cleaning liquid in a cleaning tank having an upper opening, wherein the upper opening of the cleaning tank is closed like a lid. At the same time, the vibrating surface of the vibrating plate, to which the ultrasonic transducer is fixed via the waveguide, is arranged downward, and the vibrating surface is immersed in the cleaning liquid in the cleaning tank. .
手段により該洗浄槽の上部開口を閉塞・開放するように
構成された請求項１又は請求項２記載の超音波振動装
置。3. The ultrasonic vibration device according to claim 1, wherein the cleaning tank is hinged or vertically moved to close / open the upper opening of the cleaning tank.
ら５ＭＨｚの範囲とする請求項１から請求項３のいずれ
か１項記載の超音波振動装置。4. The ultrasonic vibration device according to claim 1, wherein the vibration frequency of the diaphragm is in the range of 200 kHz to 5 MHz.
態化処理されたＳＵＳ３０４、ＳＵＳ３１６又はＳＵＳ
３１６Ｌ、あるいはタンタル、溶融石英又は炭化ケイ
素、あるいは表面粗さがＲｍａｘ１μｍ以下のＳＵＳで
形成されていることを特徴とする請求項１から請求項４
のいずれか１項記載の超音波振動装置。5. The vibrating plate is SUS304, SUS316, or SUS that has been fluororesin-coated or passivated.
316L, or tantalum, fused silica, or silicon carbide, or SUS having a surface roughness of R max of 1 μm or less.
The ultrasonic vibration device according to claim 1.
同じ液を噴射でき、下面に付着した気泡を除去する気泡
除去手段を取り付けたことを特徴とする請求項１から請
求項５記載の超音波振動装置。6. The bubble removing means which can inject the same liquid as the cleaning liquid in the cleaning tank on the lower surface of the vibration plate and removes the air bubbles adhering to the lower surface, is provided. Ultrasonic vibration device.
載の超音波振動装置と、該超音波振動装置を取り付ける
上部開口を有する洗浄槽と、 を備えたことを特徴とする超音波洗浄装置。7. An ultrasonic wave, comprising: the ultrasonic vibration device according to claim 1; and a cleaning tank having an upper opening to which the ultrasonic vibration device is attached. Cleaning device.
載の超音波振動装置と、 上部が開口し該上部開口近傍に、前記超音波振動装置の
振動板の下面に洗浄槽内の洗浄液と同じ液を噴射して、
振動板の下面に付着する気泡を除去する気泡除去手段が
設けられていることを特徴とする超音波洗浄装置。8. The ultrasonic vibrating device according to claim 1, wherein an upper part is opened, and a vibrating plate of the ultrasonic vibrating device is provided on a lower surface of the ultrasonic vibrating device in a cleaning tank in the vicinity of the upper opening. Spray the same liquid as the cleaning liquid,
An ultrasonic cleaning device characterized in that a bubble removing means for removing bubbles adhering to the lower surface of the diaphragm is provided.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001206069A JP2003037093A (en) | 2001-07-06 | 2001-07-06 | Ultrasonic vibrator and ultrasonic cleaning apparatus having the same |
| US10/159,804 US20030106566A1 (en) | 2001-07-06 | 2002-05-30 | Method and apparatus for cleaning substrates |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001206069A JP2003037093A (en) | 2001-07-06 | 2001-07-06 | Ultrasonic vibrator and ultrasonic cleaning apparatus having the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2003037093A true JP2003037093A (en) | 2003-02-07 |
Family
ID=19042263
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001206069A Pending JP2003037093A (en) | 2001-07-06 | 2001-07-06 | Ultrasonic vibrator and ultrasonic cleaning apparatus having the same |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US20030106566A1 (en) |
| JP (1) | JP2003037093A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108421051A (en) * | 2018-06-22 | 2018-08-21 | 无锡市人民医院 | A kind of ultrasonic sterilization bucket for department of anesthesia |
| CN112992740A (en) * | 2021-03-01 | 2021-06-18 | 李军平 | Cleaning equipment for cutting wafer |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7138014B2 (en) * | 2002-01-28 | 2006-11-21 | Applied Materials, Inc. | Electroless deposition apparatus |
| EP1635960A2 (en) * | 2003-06-06 | 2006-03-22 | P.C.T. Systems, Inc. | Method and apparatus to process substrates with megasonic energy |
| JP4890919B2 (en) * | 2006-04-13 | 2012-03-07 | 東京エレクトロン株式会社 | Substrate cleaning method, substrate cleaning apparatus, program, and recording medium |
| GB2472998A (en) | 2009-08-26 | 2011-03-02 | Univ Southampton | Cleaning using acoustic energy and gas bubbles |
| GB2538276B (en) * | 2015-05-13 | 2017-05-10 | Univ Southampton | Cleaning apparatus and method |
| GB2569136B (en) | 2017-12-06 | 2022-12-07 | Sloan Water Tech Limited | Apparatus and method for prevention and treatment of marine biofouling |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0731182U (en) * | 1993-11-09 | 1995-06-13 | 株式会社カイジョー | Indirect irradiation type ultrasonic cleaner |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2900038A (en) * | 1957-02-01 | 1959-08-18 | Detrex Chem Ind | Ultrasonic cleaning apparatus |
| US3007478A (en) * | 1958-04-15 | 1961-11-07 | Acoustica Associates Inc | Ultrasonic cleaner |
| US3445092A (en) * | 1968-02-28 | 1969-05-20 | Bausch & Lomb | Ultrasonic cleaning device |
| JPS57196206A (en) * | 1981-05-29 | 1982-12-02 | Hoya Corp | Autofocus binocular |
| US4526038A (en) * | 1984-02-13 | 1985-07-02 | United States Steel Corporation | Cross-flow ultrasonic transducer head |
| US5279316A (en) * | 1992-08-18 | 1994-01-18 | P.C.T. Systems, Inc. | Multiprocessing sonic bath system for semiconductor wafers |
| US5377709A (en) * | 1992-10-22 | 1995-01-03 | Shibano; Yoshihide | Ultrasonic vibrator device for ultrasonically cleaning workpiece |
| US5383484A (en) * | 1993-07-16 | 1995-01-24 | Cfmt, Inc. | Static megasonic cleaning system for cleaning objects |
| JP3274389B2 (en) * | 1996-08-12 | 2002-04-15 | 株式会社東芝 | Semiconductor substrate cleaning method |
| US6039059A (en) * | 1996-09-30 | 2000-03-21 | Verteq, Inc. | Wafer cleaning system |
| US5849091A (en) * | 1997-06-02 | 1998-12-15 | Micron Technology, Inc. | Megasonic cleaning methods and apparatus |
| US6138698A (en) * | 1997-11-20 | 2000-10-31 | Tokyo Electron Limited | Ultrasonic cleaning apparatus |
| US6276370B1 (en) * | 1999-06-30 | 2001-08-21 | International Business Machines Corporation | Sonic cleaning with an interference signal |
-
2001
- 2001-07-06 JP JP2001206069A patent/JP2003037093A/en active Pending
-
2002
- 2002-05-30 US US10/159,804 patent/US20030106566A1/en not_active Abandoned
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0731182U (en) * | 1993-11-09 | 1995-06-13 | 株式会社カイジョー | Indirect irradiation type ultrasonic cleaner |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108421051A (en) * | 2018-06-22 | 2018-08-21 | 无锡市人民医院 | A kind of ultrasonic sterilization bucket for department of anesthesia |
| CN112992740A (en) * | 2021-03-01 | 2021-06-18 | 李军平 | Cleaning equipment for cutting wafer |
Also Published As
| Publication number | Publication date |
|---|---|
| US20030106566A1 (en) | 2003-06-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI467642B (en) | Megasonic precision cleaning of semiconductor process equipment components and parts | |
| TW201400203A (en) | Cleaning apparatus and cleaning method | |
| JP2003037093A (en) | Ultrasonic vibrator and ultrasonic cleaning apparatus having the same | |
| WO2019082483A1 (en) | Ultrasonic cleaning device and ultrasonic cleaning system | |
| KR102676133B1 (en) | Apparatus and method for cleaning semiconductor wafers | |
| JPH0855827A (en) | Wafer cassette and cleaning equipment using it | |
| TW201313342A (en) | Improved ultrasonic cleaning method and apparatus | |
| JP4248257B2 (en) | Ultrasonic cleaning equipment | |
| JP4623706B2 (en) | Ultrasonic cleaning equipment | |
| JP3746248B2 (en) | Ultrasonic cleaning nozzle, ultrasonic cleaning device and semiconductor device | |
| JP5053183B2 (en) | Liquid discharge head cleaning device and liquid discharge device including the cleaning device | |
| JP4255818B2 (en) | Ultrasonic cleaning nozzle and ultrasonic cleaning device | |
| JP3338926B2 (en) | Ultrasonic cleaning equipment | |
| JP2006013015A (en) | Cleaning device and cleaning method | |
| KR20040060735A (en) | Apparatus and method for cleaning electronic components | |
| JP2001340820A (en) | Ultrasonic washing apparatus | |
| JPH0442530A (en) | Ultrasonic cleaning device | |
| JP3839527B2 (en) | Ultrasonic processing method and ultrasonic processing apparatus | |
| JPH11204479A (en) | Ultrasonic cleaning device | |
| KR101575001B1 (en) | Ultrasonic washing nozzle apparatus for panel | |
| JP7282472B2 (en) | ultrasonic shower cleaner | |
| JP2883844B2 (en) | High frequency cleaning method | |
| JPH11179306A (en) | Single wafer processing cleaner | |
| JP2887114B2 (en) | Ultrasonic cleaning equipment | |
| JPH10150016A (en) | Method and device for cleaning electrode plate of plasma treating device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20080509 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20100420 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20101012 |