JP2002314100A - Method for manufacturing resin sealed semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To form the lens part of a resin sealed semiconductor device easily and surely. SOLUTION: A precoat resin part 5 is arranged on the bottom part of a case 2, a lead frame 3 is arranged thereon, a cover 15 having a lens forming part 16 for a semiconductor element 6 on the lead frame is provided at the upper opening of the case and then a translucent resin material 10 is injected into the case up to the height of the cover and cured. The lead frame 3 is secured by the resin part 5. A height adjusting member is allowed to be employed in place of the resin part 5. Alternatively, a lens forming plate having a lens forming part is arranged on the bottom part of the case 2, a conductive lead frame 3 having at least the semiconductor element 6 for the lens forming part is arranged on the lens forming plate and then the translucent resin material 10 is injected into the case and cured. A cover is applied to the upper opening of the case 2. A protrusion 17 for forming a component fixing part is formed around the lens forming part. An electronic component 8 is arranged along the right angle bend of the lead frame 3.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for mounting a semiconductor element or an electronic component on a conductive lead frame, covering these with a light-transmitting resin material, and forming a lens portion for the optical element integrally with the resin material. The present invention relates to a method of manufacturing a resin-sealed semiconductor device to be manufactured.

[0002]

2. Description of the Related Art FIGS. 11 to 12 show an embodiment of a conventional method of manufacturing a resin-encapsulated semiconductor device (Japanese Patent Application Laid-Open No. 58-22564).
No. 1).

A method of manufacturing this resin-encapsulated semiconductor device is as follows.
One of a conductive metal lead frame 53 having a semiconductor element 52 is inserted into a casting case 51, and the leading end of the lead frame 53 is positioned against a concave portion 54 of a bottom wall of the case 51. Is positioned on the set base 55 with the pins 56, and in this state, a light-transmitting and insulating liquid resin is poured into the case 51 and solidified, and the light-transmitting resin body is extracted from the case 51 integrally with the lead frame 53. Finally, the unnecessary portion 57 on the other side (outside) of the lead frame 53 is cut to serve as a lead terminal.
A resin-encapsulated semiconductor device is obtained. Semiconductor element 5
2 is connected in advance to a plurality of circuits 58 of the lead frame 53 by respective metal wires 59.

However, in the above-described conventional manufacturing method, the distance between the element 52 on the lead frame and the surface of the light-transmitting resin body is accurately defined by the positioning means 56, so that a photodiode or the like can be used. Although the laser beam can be focused on the surface of the element 52, the case 5
There is a concern that the lens unit 1 may be in the way and the lens unit cannot be integrally formed on the resin body facing the element 52, and the directivity of light tends to deteriorate.

FIGS. 13 to 15 show a method of manufacturing a conventional resin-encapsulated semiconductor device in which a lens portion can be integrally molded with a resin body covering a semiconductor element (Japanese Patent Application Laid-Open No. 62-55970). It is.

The method of manufacturing this resin-encapsulated semiconductor device is as follows.
A lead frame 63 made of a conductive metal is set on the bottom walls of a pair of left and right storage chambers 62 of a ceramic insulating outer case 61 (FIG. 13), and the lead frame 63 is penetrated before and after the outer case 61 to lead. The light emitting element 64 and the light receiving element 65 are positioned and set by die bonding on the lead frame of each accommodation chamber 62 (FIG. 13), and the elements 64 and 65 are connected to the lead frame 63 by wires 66. The housings 62 are combined (FIG. 14), and a hemispherical lid 67 is put on the top of each of the storage chambers 62. A thermosetting epoxy resin 69 is poured into the storage chambers from the holes 68 at the tops of the lids 67 and filled. After solidification, the lid 67 is removed, and the resin body 69 is removed.
Then, a convex lens portion 70 (FIG. 15) integral with the lens is formed.

The lid 67 and the outer case 61 are positioned by the pins 71 and the holes. The outer package 61, the lead frame 63, the semiconductor elements 64 and 65, and the resin body 69 of FIG. The light emitted from the light emitting element 64 is reflected by another external part (not shown) and received by the light receiving element 65, whereby the sensor function and the switch function are exhibited. The directivity of the light is enhanced by each lens 70, and the light from the light emitting element 64 is reliably received by the light receiving element 65.

[0008]

However, in the method of manufacturing the conventional resin-encapsulated semiconductor device 72,
Since the resin material 69 must be completely filled between the housing chamber 62 and the lid 67 without any gap, it is necessary to precisely define the amount of the resin material, work accuracy is required, and air bubbles are generated in the resin material. In the case where is mixed, there is a concern that chipping or the like may occur in the lens unit 70 and light directivity performance and focus performance may be deteriorated. Further, when the resin material in the hole 68 of the lid 67 adheres to the lens portion 70, the lens portion 70 has to be modified and processed. Further, since the resin-sealed semiconductor device 72 as a product includes the outer package 61, there is a concern that the size, weight, and cost will increase.

Further, since electronic components (not shown) such as a capacitor chip mounted on the flat lead frame 63 are fixed and connected to the lead frame 63 in a planar manner, the fixing strength and connection strength of the electronic components are increased. Tend to be weak,
For example, there is a concern that the connection performance between the electronic component and the lead frame 63 may be deteriorated due to, for example, vibration of the automobile.

In view of the above, the present invention provides a small, low-cost resin-sealed semiconductor device that can easily and reliably form a lens portion without chipping, and does not include a peripheral device. It is another object of the present invention to provide a method of manufacturing a resin-sealed semiconductor device capable of firmly connecting an electronic component such as a capacitor chip on a lead frame.

[0011]

According to a first aspect of the present invention, there is provided a method of manufacturing a resin-encapsulated semiconductor device, comprising the steps of: disposing a pre-coated resin portion at a bottom of a casting case; A conductive lead frame is disposed on the portion, and a cover having a lens molding portion for a semiconductor element on the lead frame is covered at an upper opening of the case, and the light is transmitted to the height of the cover in the case. Characterized by injecting a solid resin material and solidifying it. With the above configuration, the lead frame is raised by the pre-coated resin portion, the lead frame, the bottom of the case and the cover are positioned in parallel, and the distance between the semiconductor element on the lead frame and the lens molding portion of the cover is set to a required dimension. Is done. By injecting the translucent resin material into the case, the lens portion is integrally molded with the resin material by the lens molding portion of the cover.
By removing the cover and taking out the lead frame integrally with the resin material from the case, a resin-sealed semiconductor device can be obtained. The lead frame is fixed between the precoat resin portion and the translucent resin material and is insulated from the outside, and the semiconductor element is covered with the translucent resin material and is insulated and protected.

According to a second aspect of the present invention, in the method of manufacturing a resin-sealed semiconductor device according to the first aspect, the lead frame is fixed by the pre-coated resin portion. I do. With the above configuration,
Since the lead frame can be easily positioned and fixed by bonding the lead frame to the pre-coated resin portion, other means for positioning and fixing the lead frame in the case is not required, simplifying the structure and simplifying the manufacturing method. Become

According to a third aspect of the present invention, there is provided a method of manufacturing a resin-encapsulated semiconductor device according to the first aspect, wherein a height-adjusting member is used instead of the pre-coated resin portion. The lead frame is supported by a member for height adjustment. According to the above configuration, the height of the lead frame with respect to the lens molding portion is accurately defined by the height adjusting member. The member for height adjustment is taken into the translucent resin material together with the lead frame.

According to a fourth aspect of the present invention, there is provided a method of manufacturing a resin-encapsulated semiconductor device according to any one of the first to third aspects, wherein the lens molding portion is formed of a convex for forming a concave lens. Part. With the above configuration, when the translucent resin material is injected to the height of the cover,
Since the convex portion as the lens molding portion is located lower than the cover, the resin material surely goes around, and the concave lens portion is surely molded without chipping or the like.

According to a fifth aspect of the present invention, in the method of manufacturing a resin-encapsulated semiconductor device according to any one of the first to fourth aspects, the lead frame is set in the case. Thereafter, the semiconductor element is provided on the lead frame. According to the above configuration, for example, after the lead frame is positioned in the case by an automatic processing machine, the semiconductor element can be accurately assembled at a predetermined position of the lead frame.

According to a sixth aspect of the present invention, in a method of manufacturing a resin-encapsulated semiconductor device, a lens forming plate having a lens forming portion is disposed on a bottom of a casting case, and the lens forming plate is provided on the lens forming plate. A conductive lead frame including at least a semiconductor element for the portion is provided, and a transparent resin material is injected into the case and solidified.
With the above configuration, by injecting the translucent resin material into the case, the lens portion is integrally formed with the resin material by the lens molding portion of the lens molding plate located on the bottom side of the case. Since the lens molding portion is located on the bottom side of the case, the resin material surely wraps around the lens molding portion by its own weight, and the lens portion is formed in an accurate shape without chipping or the like. Remove the cover,
By taking out the lead frame integrally with the resin material from the case, a resin-sealed semiconductor device can be obtained. The lead frame and the semiconductor element are covered with a translucent resin material to be insulated and protected. By exchanging the lens forming plate, it is possible to easily obtain lens forming portions of various shapes.

According to a seventh aspect of the present invention, there is provided a method of manufacturing a resin-encapsulated semiconductor device according to the sixth aspect, wherein a cover is provided over an upper opening of the case. I do. According to the above configuration, by injecting the translucent resin material to the height of the cover, the thickness of the resin material is accurately defined, and the insulation and protection of the lead frame are reliably performed.

According to an eighth aspect of the present invention, in the method of manufacturing a resin-encapsulated semiconductor device according to the sixth or seventh aspect, the lens molding portion includes a concave portion for molding a convex lens. It is characterized by being. According to the above configuration, the concave portion is filled with the translucent resin material by its own weight surely and uniformly, and the convex lens portion is finished in an accurate shape.

According to a ninth aspect of the present invention, in the method of manufacturing a resin-encapsulated semiconductor device according to any one of the sixth to eighth aspects, the height is adjusted on the lens molding plate. A lead member, and the lead frame is placed on the height adjusting member. According to the above configuration, the height of the lead frame with respect to the lens forming plate is accurately defined by the height adjusting member. The member for height adjustment is taken into the translucent resin material together with the lead frame.

According to a tenth aspect of the present invention, there is provided a method for manufacturing a resin-encapsulated semiconductor device according to any one of the sixth to ninth aspects, wherein the case for the case is replaced with the lens-formed plate. The lens molding part is integrally formed on the bottom wall. According to the above configuration, it is not necessary to separately mold the lens forming plate, and it is not necessary to set the lens forming plate.

According to an eleventh aspect of the present invention, there is provided a method of manufacturing a resin-encapsulated semiconductor device according to any one of the first to tenth aspects, wherein a part is formed on the lens molded plate around the lens molded portion. A convex portion or a concave portion for forming a mounting portion is formed, and a lens portion and a component mounting portion are simultaneously formed on the translucent resin material. With the above configuration, for example, an optical fiber attachment portion is simultaneously formed around the lens portion, and light from the optical fiber is received by the lens portion,
Alternatively, light from the lens unit is sent through an optical fiber.

According to a twelfth aspect of the present invention, there is provided a method of manufacturing a resin-encapsulated semiconductor device according to any one of the first to eleventh aspects, wherein the lead frame bent in a crank shape in the height direction is used. The vertical portion of the lead frame is projected outside through a gap between the case and the cover, and the translucent resin material is injected into the case from the gap. With the above configuration, a relatively wide gap for resin material injection is formed between the case and the cover,
The resin material can be easily injected into the case from the gap. In the gap, the resin material is injected smoothly and reliably along the vertical portion of the lead frame. The portion of the lead frame that protrudes to the outside from the gap becomes the lead terminal portion or a portion following it. Since the gap for injecting the resin material is separated from the lens molding portion, there is no adverse effect on the lens molding portion (such as a case where an injection mark is left on the lens portion as in the related art).

According to a thirteenth aspect of the present invention, there is provided a method of manufacturing a resin-encapsulated semiconductor device according to the twelfth aspect, wherein the electronic component is disposed along a right-angled bent portion of the lead frame. It is characterized by doing. According to the above configuration, the electronic component is joined to the lead frame on two orthogonal surfaces and is firmly connected.

[0024]

Embodiments of the present invention will be described below in detail with reference to the drawings. 1 to 4 show a first embodiment of a method for manufacturing a resin-sealed semiconductor device according to the present invention.

As shown in FIGS. 1 and 2, the method for manufacturing the resin-encapsulated semiconductor device 1 includes a flat casting case 2 having a low height and a large width in front, rear, left and right directions. Using a lead frame 3 made of a conductive metal bent in a crank shape, first, a resin portion 5 for height adjustment is pre-coated on the bottom wall 4 of the housing chamber of the case 2 (adhered or arranged in advance). One of the L-shaped vertical sections of the lead frame 3 is arranged on the pre-coated resin portion 5 (preferably fixed by the adhesive force of the pre-coated resin portion 5), and various semiconductor elements 6, 7 are set on the lead frame 3. Then, a lens forming plate (cover) 1 is inserted into the upper opening of the case 2.
5 to cover the gap 9 between the lens forming plate 15 and the case 2.
Then, a transparent translucent liquid or viscous resin material 10 is poured into the case 2 and solidified, and a lens portion 18 (FIG. 3) for the optical element 6 on the lead frame 3 is integrally formed with the resin material 10. It is to let.

As the precoat resin portion 5, a synthetic resin material such as thermoplastic PBT (saturated polyester polybutylene terephthalate) or thermosetting black epoxy is preferable.

In the case of a thermoplastic resin, for example, the lead frame 3 is coated on the surface of the softened resin portion 5 while coating the bottom wall 4 of the case 2 with a certain thickness in a state where the precoat resin portion 5 is heated and melted. The lead frame 3 is mounted and adhered, and the lead frame 3 is fixed as the resin portion 5 is hardened by natural cooling. In the case of a thermosetting resin, the lead frame 3 is placed on the surface of the resin portion 5 while the resin material 5 fluidized or semi-fluidized at room temperature is coated on the bottom wall 4 of the case 2 with a constant thickness. The lead frame 3 is fixed to the resin portion 5 while being adhered and the resin portion 5 is heated from, for example, the lower side of the case 2 or the case 2 is heated and cured.

By coating the resin portion 5 with the case 2 horizontal, a uniform thickness can be easily obtained by utilizing the fluidity of the resin material 5. Since the thickness of the resin portion 5 can be uniformly and accurately defined, the upper surface (element mounting surface) 12a of the lead frame 3 and the lens forming surface 15a which is the inner surface of the lens forming plate 8 are kept parallel. In addition, the distance between the optical element 6 such as an LED (light emitting diode) on the lead frame 3 and the lens unit 18 (FIG. 3) is accurately defined, and the focusing accuracy and the light directivity of the optical element 6 are improved.

Further, by pressing the lead frame 3 against the resin portion 5 while the resin portion 5 is soft, the distance between the lead frame 3 and the lens forming plate 15 can be accurately defined (for example, by an automatic machine). The same effect as described above can also be obtained by measuring the distance and pressing strongly when the distance is too large. By pressing the lead frame 3 against the resin portion 5, the lead frame 3
Is securely bonded and fixed to the resin portion 5. Further, by using the black opaque resin material 5, unnecessary light entering the optical element 6 from the lower side of the lead frame 3 in the resin-sealed semiconductor device 1 in the product stage in FIG. Unnecessary light emission to the side is prevented, and the light receiving / emitting performance of the optical element 6 is improved.

The pre-coated resin portion 5 has a function of insulating the conductive lead frame 3 of the completed resin-sealed semiconductor device 1 from the outside. Since the positioning, bonding, and insulation of the lead frame 3 are performed by the resin portion 5, the structure of the resin-encapsulated semiconductor device 1 is simplified,
Lower cost.

Further, by using a heat-resistant resin material or the like as the resin portion 5, after pre-coating the resin portion 5, various semiconductor elements 6 and 7 are die-bonded on the lead frame 3 (set using a positioning die (not shown)). ) Or connect the various semiconductor elements 6 and 7 to the lead frame 3 by wire bonding (a method of bonding thin wires 19 made of conductive metal with solder or the like).

It is preferable that the lead frame 3 and the case 2 are fixed in a state where the essential parts of the lead frame 3 are initially positioned on the case 2 by means of jig pins or clamps (not shown). Alternatively, the lead group (FIG. 4
Indicates a lead group composed of four lead portions 21), and is formed such that the case 2 and the lead group are already accurately positioned when each lead group is accommodated in each case 2.
It is also possible to set the positional relationship between the chain portion 20 (FIG. 4) and the case 2. This is suitable mainly for automatic processing machines.

With the lead frame 3 positioned and fixed in the case 2, electronic components 8 such as various semiconductor elements 6 and 7 and chip capacitors are positioned and fixed and connected to required portions of the lead frame 3. Before setting the lead frame 3 in the case 2, it is also possible to fix and connect these semiconductor elements 6, 7 and the electronic component 8 to the lead frame 3.

A horizontally long rectangular (rectangular) chip component (electronic component) 8 such as a chip capacitor or a chip resistor.
Is preferably arranged inside a right-angled bent portion 21 (FIG. 3) of the lead frame 3 bent in a substantially crank shape in a vertical section. That is, the electronic component 8 is arranged in contact with the upper side surface 12 a of the horizontal portion 12 of the lead frame 3 located above the precoat resin portion 5 and the inner side surface 13 a of the vertical portion 13. In addition, the left and right electrodes 8a of one electronic component 8 are arranged to be in contact with two adjacent leads 21 (FIG. 4). Two orthogonal surfaces 12a, 1 of the lead frame 3
When the two orthogonal surfaces of the electronic component 8 are in contact with 3a, the joining area is increased, the fixing force of the electronic component 8 is increased, and the reliability and stability of the electrical connection are increased by the enlarged contact area of the electrode 8a. .

The lead frame 3 of the present embodiment has four horizontal lead terminals 14, one of the lead terminals 14 follows a short vertical portion 13 orthogonal to the downward direction, and the vertical portion 13 is a pre-coated resin portion 5. Following the upper horizontal circuit portion 23 (FIG. 4) and the wide, substantially rectangular pad portion 24 (FIG. 4), the other of the lead terminal portions 14 extends orthogonally to the horizontal chain portion 20. On each pad section 24, the integrated circuit element 7 for transmission and reception
Elements such as an LED and a light emitting diode (LED) 6 are provided, and each of the elements 6 and 7 is connected to a pad section 24, another pad section 24, and a circuit section 23 by wires 19. The lead terminal portion 14 is cut from the chain portion 20, for example, as shown by a chain line L (FIGS. 3 and 4).

1 and 2, the front, rear, left and right ends 3a of the lead frame 3 are connected to the front, rear, left and right peripheral walls 27 of the case 2.
Is positioned at a small distance (gap) from the inner surface of the. Similarly, it is preferable that the front, rear, left and right end portions 5a of the precoat resin portion 5 are similarly located at a small distance (gap) on the inner surface of the peripheral wall 27 of the case 2.

The vertical portion 13 of the lead frame 3 is
Is raised near one side wall of the case 2 and protrudes upward higher than the height of the case 2 and continues to a horizontal lead terminal portion 14. The lead terminal portion 14 extends over one side wall of the case 2 and extends horizontally. . The lead frame 3 is arranged with respect to the case 2 in such a form.

After setting the lead frame 3 in the case 2, the lens forming plate 15 is covered so as to cover the upper opening of the case 2 except for the vertical portion 13 of the lead frame 3 and a portion in the vicinity thereof. The lens forming plate 15 is formed of a metal material, ceramics, or the like in a flat plate shape similarly to the case 2, and has a substantially hemispherical or arcuate cross section at a position near the center corresponding to the optical element (light emitting element or light receiving element) 6. The molded part 16 is integrally provided.

The lens forming portion 16 of the present embodiment is a convex portion protruding downward, and can form a concave lens. Annular ridges (projections for forming a component mounting portion) 17 are formed on both sides of the lens forming portion 16. The protrusion height of the ridge 17 is substantially the same as the protrusion height of the lens molding 16. The ridge 17 forms an annular concave groove 25 (FIG. 3) around the lens portion 18 (FIG. 3) of the translucent resin portion 10. Groove (part mounting part)
For example, a sleeve for attaching an optical fiber is fitted to 25. As described above, the lens portion 18 and the optical fiber mounting portion, that is, the component mounting portion 25 can be simultaneously and easily and reliably formed. Instead of the ridge 17, an annular groove (recess for forming a component mounting portion) is formed in the lens forming plate 15, and the annular ridge formed in the groove can be used as an optical fiber mounting portion. It is. The shapes of the ridges 17 and the concave grooves are not limited to an annular shape, and are appropriately set according to the shapes of components such as an optical fiber sleeve. Further, it is also possible to provide two lens forming portions 16 on one lens forming plate 15 corresponding to the light emitting element and the light receiving element, and to form the lens portion 18 for each optical element.

A positioning pin 28 (FIG. 1) is projected downward from a square portion of the lens forming plate 15, and an engaging hole is provided in the case 2 corresponding to the pin 28. The lens forming plate 15 is accurately positioned with respect to the case 2 by engaging the pin 28 with the hole. Since the optical element 6 is accurately positioned in the case 2 by a technique such as die bonding, the hemispherical lens molded portion 16 is accurately positioned on the optical element 6. A positioning pin 28 is protruded from the case 2 and a hole is formed in the lens forming plate 15.
May be provided. One end 15b (FIG. 2) of the lens forming plate 15 is located close to the vertical portion (rise portion) 13 of the lead frame 3, and is located between the one end 15b of the lens forming plate 15 and the case 2 (the lens). A gap 9 for injecting a resin material is formed at one side end 15b of the molded plate and the vertical portion 13 of the lead frame 3).

A liquid or viscous transparent translucent resin material 10 is injected into the case 2 from the gap 9. Resin material 1
0 may be thermoplastic or thermosetting. The liquid or viscous resin material 10 covers the periphery of the pre-coated resin portion 5 (front and rear, left and right and upper part), the periphery of the lead frame 3 and the periphery of each of the elements 6, 7 and the electronic components 8 in the case 2, and a lens molding plate. The surface of the lens molding portion 16 is filled in close contact with the lower surface 15a of the lens 15 and is substantially hemispherical. The upper end surface of the case 2 is located on the same plane as the lower surface 15 a of the lens forming plate 15, and the lens forming portion 16 is
Since it protrudes downward from a, filling the resin material 10 up to the upper end surface of the case 2 allows the concave lens to be accurately molded without chipping or the like.

After the translucent resin material 10 is cured, the lens molding plate 15 is removed from the case 2, and a portion (for example, the lead terminal portion 14) protruding outside the lead frame 3 is gripped and pulled up. The resin-sealed semiconductor device 1 shown in FIGS. 3 and 4 is completed.

By inclining the inner surface 29 of the wall of the case 2 on the resin injection side in a tapered shape as shown in FIG. 1 can be easily taken out. One end surface of the transparent resin portion 10 in FIG. 3 is slightly tapered. The above-described molding of the precoat resin portion 5, setting of the lead frame 3, opening and closing of the lens forming plate 15 as a cover plate, and the like can all be performed by an automatic machine.

When a convex lens portion is formed instead of the concave lens portion 18 (FIG. 3), a lens forming plate (not shown) having a hemispherically concave lens forming portion is used instead of the hemispherically protruding lens forming portion 16. The liquid resin material 10 is preferably forcibly filled from the gap 9 between the case 2 and the lens molding plate with pressure, so that the liquid resin material 10 is securely filled in the concave lens molding portion without any gap. Can be filled.

As shown in FIGS. 3 and 4, the resin-encapsulated semiconductor device 1 has a pre-coated resin portion 5, a lead frame 3 on the pre-coated resin portion 5, various semiconductor elements 6, 7 and electronic components on the lead frame 3. 8, the precoat resin portion 5, the lower half portion 12 of the lead frame 3, the various semiconductor elements 6, 7 and the electronic component 8, and the concave lens portion 1 facing the optical element 6.
8 and a transparent light-transmitting resin portion 10. It does not have a peripheral device as in the conventional case (FIGS. 13 to 15),
The structure is simplified, downsized, and reduced in cost.

Further, since the front, rear, left and right end portions 5a of the precoat resin portion 5 are covered with the translucent resin material 10, the fixing force between the precoat resin portion 5 and the lead frame 3 is reinforced, and the precoat resin portion 5 is reinforced. 5 is prevented from peeling off. FIG.
Reference numeral 30 denotes a raised portion of the resin material 10 formed at the time of filling, thereby reinforcing the fixing strength of the lead frame 3. Note that, instead of the horizontal portion (lead terminal portion) 14 above the vertical portion 13 of the lead frame 3, the vertical portion 13 can be extended in the height direction to form a lead terminal portion.

As shown in FIG. 4, each circuit portion 23 and each pad portion 24 of the lead frame 3 are placed on the rectangular pre-coated resin portion 5.
Are arranged horizontally at a slight distance from each other, and unnecessary light from the lower side is prevented by the light-impermeable precoat resin portion 5. The lead terminal portion 14 is cut off from the chain portion 20 as shown by a chain line L, and the resin-sealed semiconductor device 1 as a complete product is obtained.

In the above embodiment, the translucent resin material 10 is injected from the gap 9 between the terminal forming plate 15 and the case 2, but, for example, engages the lens forming plate 15 with the vertical portion 13 of the lead frame 2. By providing a comb-shaped positioning slit (not shown), the gap 9 is eliminated, and the lens forming plate 15 is formed.
It is also possible to provide a resin injection hole (not shown) at the bottom.

FIGS. 5 to 8 show a second embodiment of the method for manufacturing a resin-sealed semiconductor device according to the present invention. The method for manufacturing the resin-encapsulated semiconductor device 31 is characterized in that a piece member for height adjustment (a member for height adjustment) 32 is used instead of the precoat resin portion 5 in the first embodiment. Things. The other configuration is substantially the same as that of the first embodiment, and the detailed description is omitted using the same reference numerals as those in FIGS.

As shown in FIGS. 5 and 6, a piece member 32 for height adjustment is provided.
Are the leads 21 (the circuit section 2) of the lead frame 3 (FIG. 8).
3 and the pad portion 24), it is preferable that the short portion is appropriately disposed at one position, and the long portion is disposed at the front, rear, and middle portions. As the piece member 32, an insulating material such as a rectangular three-dimensional insulating and preferably heat-resistant synthetic resin or ceramic is used, and any material having a width substantially equal to the width of the lead terminal portion 14, for example, may be used. It is also possible to use a long rectangular bar-shaped height adjusting member (not shown) that supports the plurality of leads 21 collectively across the plurality of leads 21.

Each piece member 32 is arranged on the upper surface of the bottom wall 4 of the casting case 2, and the lead frame 3 is arranged thereon. Alternatively, each piece member 32 is fixed to the lead frame 3 in advance by bonding or the like, and the lead frame 3 is arranged in the case 2. The lead frame 3 is accurately positioned with respect to the case 2 by positioning means (not shown).

Next, various semiconductor elements 6 and 7 and electronic components 8 are arranged and connected on the lead frame 3. Next, a lens forming plate (cover) 15 serving as a lid is put on the upper opening of the case 2. The lens forming plate 15 and the case 2 are accurately positioned by the positioning pins 28 and the holes. Next, a translucent resin material 10 is filled from the gap 9 between the lens molding plate 15 and the case 2, and the concave lens portion 18 is integrally formed with the translucent resin portion 10 by the convex lens molding portion 16.

When a thermosetting resin material is used as the translucent resin portion 10, the case is filled with a liquid or viscous resin material 10 at room temperature, and then heated and cured to form a thermoplastic resin material. Is used, the resin material 10 is heated and melted in a resin injection machine (not shown), injected into the case 2, and then cured by natural cooling.

In FIG. 5, the lead frame 3 and the lens forming plate 15 are positioned in parallel by each piece member 32, and the distance between the optical element 6 and the lens forming portion 16 is accurately defined. Since the piece member 32 is a rigid body, there is no variation or variation in the height dimension, and the distance between the optical element 6 and the lens portion 18 is accurately defined. Thereby, the focus accuracy and the light directivity performance for the optical element 6 are improved.

After the translucent resin material 10 is cured, the lens forming plate 15 is removed, and the product 31 is taken out of the case 2. Finally, the lead terminal 14 is connected to the chain portion 20 (FIGS. 7 and 8).
To obtain a resin-sealed semiconductor device 31 as a finished product.

As shown in FIGS. 7 and 8, the height adjustment piece 3
2 is taken into the translucent resin part 10 as a part of the product 31. The lead frame 3 is firmly fixed by being surrounded by a translucent resin material 10 from above and below.

9 and 10 show a third embodiment of the method for manufacturing a resin-sealed semiconductor device according to the present invention. According to the method of manufacturing the resin-encapsulated semiconductor device 33, a lens forming plate 35 having a concave lens forming portion 34 is laid on the upper surface of the bottom wall 4 of the casting case 2, and the optical element 6 is opposed to the lens forming portion 34. Is positioned in the case 2, a cover plate 36 is covered on the upper opening of the case 2, and a liquid or viscous transparent material is introduced into the case 2 from the gap 9 between the cover plate 36 and the case 2. It is characterized by filling the optical resin material 10 and molding the convex lens 37 integrally with the resin material 10. The same components as those in the first embodiment are denoted by the same reference numerals, and detailed description is omitted.

The case 2, the lens forming plate 35 and the cover plate 36 are formed of metal, ceramic or the like. The lens forming plate 35 is formed with substantially the same area as the bottom surface of the case 2 and is fitted and fixed on the bottom surface of the case 2 without back and forth play and clearance. Thereby, the lens molding portion 35 for the case 2
Is precisely defined. The lens forming portion 34 is a concave portion having a substantially hemispherical shape or a circular arc shape in a vertical cross section, and an annular ridge 17 is protruded upward around the concave portion 34 so that, for example, an optical fiber mounting portion can be formed easily and reliably. And a thick convex lens portion 37 having high light directivity (FIG. 10).
Can be molded. It is also possible to form a concave groove (not shown) instead of the ridge 17 as the optical fiber attaching portion.

The lens forming plate 3 is integrally formed on the bottom wall 4 of the case 2.
5, that is, a concave lens forming portion 34, an annular ridge 17 or a concave groove can be formed. By separately forming the case 2 and the lens forming plate 35 as shown in FIG.
By sharing the case 2 and changing the lens forming plate 35 for each lead frame 3 having a different position of the optical element 6, various types of resin-encapsulated semiconductor devices 33 can be efficiently and easily formed at low cost. Become. It is of course possible to form a concave lens part instead of the convex lens part 37 by using a lens molded plate (of the form shown in FIG. 1) in which a substantially hemispherical convex part is formed upward instead of the concave part as the lens molding part 34. is there.

On the upper surface of the lens forming plate 35, for example, a piece member 38 for height setting similar to that shown in FIG.
8, the lead frame 3 is arranged. The upper surface of the lens forming plate 35 and the lower surface of the lead frame 3 are positioned parallel to each other by the piece member 38, preventing the optical element 6 on the lead frame side from being tilted, and ensuring accurate spacing between the optical element 6 and the lens forming section 34. Stipulated. When the bridge member 38 is not used, the upper half of the lead frame 3, that is, the portion exposed on the upper side of the case 2 is fixed by positioning means (not shown).
The positions of the optical element 6 and the lens molding section 34 are defined. It is of course possible to form two lens forming portions 34 on one lens forming plate 35 corresponding to the light emitting element and the light receiving element as the optical element 6.

Elements such as the transmitting and receiving integrated circuit element 7 and the LED (light emitting diode) 6 are fixedly connected in advance to the lower surface of the one horizontal portion 12 of the conductive metal lead frame 3 by a method such as die bonding or wire bonding. Also,
The electronic component 8 such as a chip capacitor is disposed in the L-shaped bent portion 21 of the lead frame 3. In this state, the lead frame 3 is set in the case 2. By joining the electronic component 8 to the lead frame 3 on two orthogonal surfaces, the electronic component 8 is firmly and stably fixed, and is reliably connected with a small electric resistance due to a large contact area. After the lead frame 3 is accommodated in the case 2, the electronic components 8 can be provided.

The lead frame 3 is positioned and fixed in the front, rear, right and left directions by positioning fixing means (not shown) outside the case. When the piece member 38 for height adjustment is not used, the lead frame 3 is positioned in the case 2 in the front-rear, left-right and up-down directions by this positioning and fixing means.

After that, the cover plate 36 is covered on the upper opening of the case 2. The lid plate 36 and the case 2 are accurately positioned by fitting the key pins 28 and the holes. Next, a liquid or viscous translucent resin material 10 is filled into the case through the upper gap 9 between the cover plate 36 and the case 2. Since the lens forming plate 35 is disposed at the bottom of the case 2 and the lens forming portion 34 is a downward concave portion for forming a convex lens, the liquid or viscous resin material 10 is surely filled by its own weight in the concave portion, and the filling is insufficient. Is reliably prevented from being chipped by the lens.

When the height adjusting member 38 is used, the distance between the element mounting surface (lower surface) of the lead frame 3 and the inner side surface (upper surface) of the lens forming plate 35 is directly defined. The distance between the element 6 and the lens 37 (FIG. 10) is more accurately defined, and the focusing accuracy of light on the optical element 6 is increased.

After the light transmitting resin material 10 is solidified, the cover plate 36
Then, the lead frame 3 is gripped and the product 33 is taken out of the case 2 to obtain the resin-sealed semiconductor device 33 of FIG. The cover plate 36 is effective for finishing the upper surface of the translucent resin material 10 flat, but the resin material 10 can be injected without using the cover plate 36.

The resin-encapsulated semiconductor device 33 includes a lead frame 3 bent in a crank shape and a lead frame 3.
Semiconductor components 6 and 7 disposed on the lower surface of the electronic component 8 joined to the upper surface of the horizontal portion 12 and the side surface of the vertical portion 13 on the lower side of the lead frame 3; Translucent resin portion 10 in which horizontal portion 12, lower half portion of vertical portion 13, semiconductor elements 6, 7 and electronic component 8 are embedded.
The translucent resin part 10 has a downward convex lens part 37 for the optical element 6.

The lens section 37 can be a convex lens section or a concave lens section. A piece member 38 for height adjustment is located in the translucent resin portion 10. When the bridge member 38 is not used, only the translucent resin portion 10 is used. The horizontal portion 14 on the upper side of the lead frame 3 is separated from the chain portion 20 to become a lead terminal.

[0068]

As described above, according to the first aspect of the present invention, the height of the lead frame is adjusted by the precoat resin portion, and the distance between the semiconductor element on the lead frame and the lens molding portion of the cover is adjusted. Can be accurately defined, so that the focus accuracy and light directivity of the lens unit are improved. Further, by injecting the translucent resin material into the case to the height of the cover, the resin material goes around the lens molding portion of the cover, and the lens portion is formed simply and reliably. Also, by removing the cover and detaching the resin material from the case integrally with the lead frame, a small, lightweight, and inexpensive resin-sealed semiconductor device without a case can be obtained.

According to the second aspect of the present invention, since the lead frame can be easily positioned and fixed in the case, the productivity is enhanced. Further, since another means for positioning and fixing the lead frame in the case is not required, the manufacturing apparatus is simplified and the manufacturing cost is reduced. Further, according to the third aspect of the present invention, the height of the lead frame with respect to the lens forming portion is accurately defined by the height adjusting member, and the same effect as the first aspect of the invention is exerted.

According to the fourth aspect of the present invention, when the translucent resin material is injected to the height of the cover, the projection as the lens molding portion is located lower than the cover. The material surely wraps around and the concave lens portion is reliably formed without chipping or the like. According to the invention described in claim 5, the lead frame is positioned in the case by, for example, an automatic processing machine, and then the semiconductor element is assembled at a predetermined position of the lead frame. (Although it is usually required twice for assembling a semiconductor and for setting a lead frame), thereby improving productivity.

According to the sixth aspect of the invention, since the lens molding portion is located on the bottom side of the case, the transparent resin material surely goes around the lens molding portion by its own weight, and the lens portion is not chipped. Easily molded with accurate shape. Further, by exchanging the lens forming plate, it is possible to easily obtain lens forming portions of various shapes, and it is possible to cope with lens portions of various forms. In addition, by detaching the resin material from the case integrally with the lead frame, it is possible to obtain a small, lightweight, and inexpensive resin-sealed semiconductor device without a case.

According to the seventh aspect of the present invention, by injecting a translucent resin material to the height of the cover, the thickness of the resin material is accurately defined, and the insulation and protection of the lead frame can be ensured. Done in Further, the resin material is finished flat and neatly along the cover without protruding, thereby increasing the commercial value. According to the eighth aspect of the present invention, since the transparent resin material is reliably and uniformly filled in the concave portion by its own weight, the convex lens portion is finished in an accurate shape, and the focus accuracy and the light directivity are improved. Increase.

According to the ninth aspect of the present invention, the height of the lead frame with respect to the lens molding portion is accurately defined by the height adjusting member, and the same effect as that of the first aspect of the invention is exhibited. You. According to the tenth aspect,
There is no need to separately form the lens forming plate, which reduces the cost of the jig and eliminates the need for setting the lens forming plate, thereby reducing the number of manufacturing steps.

According to the eleventh aspect of the present invention, for example, an optical fiber mounting portion can be formed around the lens portion simultaneously and easily and reliably, thereby improving the function of the resin-encapsulated semiconductor device. Can be done. According to the twelfth aspect, the resin material can be easily injected into the case from a relatively wide gap between the case and the cover, so that the injection of the resin material is performed smoothly and quickly. , And productivity is improved. Further, since the gap for injecting the resin material is separated from the lens molding portion, there is no adverse effect on the lens molding portion, such as in the related art, in which an injection mark is formed on the lens portion. According to the thirteenth aspect of the present invention, the electronic component is joined to the lead frame on two orthogonal surfaces, so that the electronic component is firmly connected, and there is no fear that the connection of the electronic component is loosened due to vibration of the vehicle or the like. Reliability and stability of dynamic connection are improved.

[Brief description of the drawings]

FIG. 1 is a longitudinal sectional view (AA sectional view of FIG. 2) showing a first embodiment of a method for manufacturing a resin-sealed semiconductor device according to the present invention.

FIG. 2 is a plan view showing a method for manufacturing the resin-encapsulated semiconductor device.

3 is a longitudinal sectional view (BB sectional view of FIG. 3) showing the completed resin-sealed semiconductor device.

FIG. 4 is a plan view showing the resin-sealed semiconductor device.

FIG. 5 is a longitudinal sectional view (a sectional view taken along the line CC in FIG. 6) showing the second embodiment of the method for manufacturing a resin-encapsulated semiconductor device according to the present invention.

FIG. 6 is a plan view showing the same method for manufacturing the resin-encapsulated semiconductor device.

FIG. 7 is a vertical sectional view (DD sectional view of FIG. 8) showing the completed resin-sealed semiconductor device.

FIG. 8 is a plan view showing the resin-sealed semiconductor device.

FIG. 9 is a longitudinal sectional view showing a third embodiment of the method for manufacturing a resin-sealed semiconductor device according to the present invention.

FIG. 10 is a longitudinal sectional view showing a completed resin-sealed semiconductor device.

FIG. 11 is a vertical sectional view in front view showing one embodiment of a conventional method for manufacturing a resin-encapsulated semiconductor device.

FIG. 12 is a vertical cross-sectional view showing a manufacturing method of the resin-encapsulated semiconductor device.

FIG. 13 is a longitudinal sectional view showing another embodiment of a method for manufacturing a conventional resin-encapsulated semiconductor device.

FIG. 14 is a sectional view taken along the line EE of FIG. 13;

FIG. 15 is a longitudinal sectional view showing a completed conventional resin-encapsulated semiconductor device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1, 31, 33 Resin-sealed semiconductor device 2 Case 3 Lead frame 4 Bottom wall 5 Precoat resin part 6, 7 Semiconductor element 8 Electronic component 9 Gap 10 Translucent resin material 13 Vertical part 15 Lens molding plate (cover) 16, 34 Lens molding part 17 Ridge (convex part) 18, 37 Lens part 21 Bent part 25 Concave groove (part attachment part) 32, 38 Height adjustment piece member (member) 35 Lens molding plate 36 Cover

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 5F041 AA06 AA47 DA17 DA25 DA44 DA57 DA58 DA59 DA83 EE11 EE24 5F088 AA01 EA06 JA02 JA06 JA12 JA20

Claims (13)

[Claims] 1. A pre-coating resin part is disposed at the bottom of a casting case, a conductive lead frame is disposed on the pre-coating resin part, and a semiconductor chip on the lead frame is provided at an upper opening of the case. A method for manufacturing a resin-encapsulated semiconductor device, comprising: covering a cover having a lens molding portion; and injecting a transparent resin material into the case to the height of the cover and solidifying the resin. 2. The method according to claim 1, wherein said lead frame is fixed by said pre-coated resin portion. 3. The resin-encapsulated semiconductor device according to claim 1, wherein a height-adjusting member is used in place of the pre-coated resin portion, and the lead-frame is supported by the height-adjusting member. Manufacturing method. 4. The method for manufacturing a resin-encapsulated semiconductor device according to claim 1, wherein said lens molding portion is a convex portion for molding a concave lens. 5. The resin-encapsulated semiconductor device according to claim 1, wherein after setting the lead frame in the case, the semiconductor element is disposed on the lead frame. Manufacturing method. 6. A lens molding plate having a lens molding portion is disposed on the bottom of a casting case, and a conductive lead frame having at least a semiconductor element for the lens molding portion is provided on the lens molding plate. A method of manufacturing a resin-encapsulated semiconductor device, comprising: disposing a light-transmissive resin material in the case; and solidifying the resin material. 7. The method according to claim 6, wherein a cover is provided over an upper opening of the case. 8. The method of manufacturing a resin-encapsulated semiconductor device according to claim 6, wherein said lens molding portion is a concave portion for molding a convex lens. 9. The apparatus according to claim 6, wherein a member for height adjustment is arranged on the lens forming plate, and the lead frame is arranged on the member for height adjustment. The manufacturing method of the resin-sealed semiconductor device according to the above. 10. The resin-encapsulated semiconductor device according to claim 6, wherein the lens molding portion is formed integrally with the bottom wall of the case in place of the lens molding plate. Method. 11. A convex portion or a concave portion for forming a component mounting portion is formed on the lens forming plate around the lens forming portion, and the lens portion and the component mounting portion are simultaneously formed on the translucent resin material. The method for manufacturing a resin-encapsulated semiconductor device according to claim 1. 12. Using the lead frame bent in a crank shape in a height direction, a vertical portion of the lead frame is projected outside from a gap between the case and the cover, and the transparent part is inserted into the case from the gap. The method of manufacturing a resin-encapsulated semiconductor device according to claim 1, wherein an optical resin material is injected. 13. An electronic component is arranged along a bent portion of the lead frame at a right angle.
The manufacturing method of the resin-sealed semiconductor device according to the above.