JP2002273596A - Tin-silver-base solder alloy - Google Patents
Tin-silver-base solder alloyInfo
- Publication number
- JP2002273596A JP2002273596A JP2001077769A JP2001077769A JP2002273596A JP 2002273596 A JP2002273596 A JP 2002273596A JP 2001077769 A JP2001077769 A JP 2001077769A JP 2001077769 A JP2001077769 A JP 2001077769A JP 2002273596 A JP2002273596 A JP 2002273596A
- Authority
- JP
- Japan
- Prior art keywords
- tin
- weight
- silver
- solder alloy
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
- C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、錫−銀系ハンダ合
金に関し、詳しくは良好な伸び特性を有し、高接合信頼
性を有する錫−銀系ハンダ合金に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a tin-silver solder alloy, and more particularly, to a tin-silver solder alloy having good elongation characteristics and high bonding reliability.
【０００２】[0002]
【従来の技術及び発明が解決しようとする課題】従来、
ハンダ合金としては、Ｐｂ−Ｓｎの共晶組成付近の合金
が代表的なものとして周知である。また、Ｐｂ−Ｓｎの
共晶ハンダよりも強度を高めたＺｎ−Ｃｄからなる合金
等も知られている。しかしながら、前者のハンダ合金は
鉛の有害性が問題となっており、また後者のハンダはカ
ドミウム蒸気の作業者への悪影響等が問題となってお
り、近年の環境問題を解消し得ないものであった。2. Description of the Related Art
As a solder alloy, an alloy near the eutectic composition of Pb-Sn is well known as a typical one. Further, an alloy made of Zn-Cd having a higher strength than a eutectic solder of Pb-Sn is also known. However, the former solder alloy has a problem of harmful lead, and the latter solder has a problem that cadmium vapor has a bad influence on workers, and cannot solve environmental problems in recent years. there were.
【０００３】そこで、ハンダ合金として有害なＰｂある
いはＣｄ等を含まない代表的な無鉛ハンダとして、Ｓｎ
−Ａｇ系ハンダ合金が種々提案されている。このＳｎ−
Ａｇ系のハンダは、現行のハンダ（Ｓｎ−３７重量％Ｐ
ｂ、融点１８３℃）の融点と比べ高くなる。そのため、
ハンダ付温度も高くなり部品への熱的影響が懸念され、
Ｓｎ−Ａｇ系ハンダの低融点化は大きな課題となってい
た。[0003] Therefore, a typical lead-free solder containing no harmful Pb or Cd as a solder alloy is Sn
-Various Ag-based solder alloys have been proposed. This Sn-
Ag-based solder is the current solder (Sn-37 wt% P
b, melting point 183 ° C.). for that reason,
The soldering temperature also rises, and there is concern about thermal effects on parts,
Reducing the melting point of Sn-Ag solder has been a major issue.
【０００４】そこで、第３もしくは４元素の含有による
融点低下が行われているが、供給性、製造性等から、Ｉ
ｎ、Ｂｉ、Ｃｕが一般的である。例えばＳｎ−Ａｇ−Ｃ
ｕ系ハンダでは２１７℃ぐらいまでが限界で、さらに低
い融点を得るにはＩｎ、Ｂｉの含有が必要となる。しか
し、Ｉｎの含有にはコスト面から限界がある。また、Ｂ
ｉの含有は融点を下げ、引張強さを向上させる効果があ
るが、反面破断伸びを低下させる。この伸び特性は、接
合部の信頼性に大きく関与していると言われていること
から、Ｂｉの含有は接合信頼性を低下させると考えられ
る。また、Ｂｉの含有量が５重量％以上のハンダでは、
電子基板ランド材料や電子部品電極材料のメッキの種類
によって強度劣化が著しく生じることが指摘されてい
る。このようにＢｉの含有により接合信頼性低下が問題
となっており、その一方で電子部品の耐熱性という観点
から、２０５℃付近の融点を有するハンダが必要とされ
ているのも事実である。Therefore, the melting point is reduced by the inclusion of the third or fourth element.
n, Bi, and Cu are common. For example, Sn-Ag-C
The limit is about 217 ° C. in the case of u-based solder. In order to obtain a lower melting point, In and Bi must be contained. However, there is a limit to the In content in terms of cost. Also, B
The inclusion of i has the effect of lowering the melting point and improving the tensile strength, but decreases elongation at break. Since it is said that this elongation characteristic greatly contributes to the reliability of the joint, it is considered that the inclusion of Bi lowers the joint reliability. In the case of a solder having a Bi content of 5% by weight or more,
It has been pointed out that the strength is significantly deteriorated depending on the type of plating of the electronic substrate land material and the electronic component electrode material. As described above, the decrease in bonding reliability is a problem due to the inclusion of Bi. On the other hand, it is a fact that solder having a melting point of around 205 ° C. is required from the viewpoint of heat resistance of electronic components.
【０００５】このため高接合信頼性を有するＢｉ含有ハ
ンダ（Ｂｉ量が５重量％以上）の開発が求められてい
る。この高接合信頼性は、ハンダ組織の安定性、接合界
面の反応層の成長が遅いこと、ハンダ材料の伸び特性が
良好なこと等に起因するものと考えられる。[0005] Therefore, development of a Bi-containing solder (Bi content of 5% by weight or more) having high bonding reliability is required. This high bonding reliability is considered to be due to the stability of the solder structure, the slow growth of the reaction layer at the bonding interface, and the good elongation characteristics of the solder material.
【０００６】従って、本発明の目的は、良好な伸び特性
等を示し、高接合信頼性を有する錫−銀系ハンダ合金を
提供することにある。SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a tin-silver based solder alloy exhibiting good elongation characteristics and the like and having high bonding reliability.
【０００７】[0007]
【課題を解決するための手段】本発明者らは、検討の結
果、ビスマス又はビスマスとインジウムを一定量含有す
る錫−銀系ハンダ合金において、銅に拡散しやすい亜鉛
を特定量含有させ、界面改質を行い反応層の成長を抑制
することによって、上記目的が達成し得ることを知見し
た。Means for Solving the Problems As a result of the study, the present inventors have found that in a tin-silver solder alloy containing a certain amount of bismuth or bismuth and indium, a specific amount of zinc which is easily diffused into copper is contained, It has been found that the above object can be achieved by suppressing the growth of the reaction layer by reforming.
【０００８】本発明は、上記知見に基づきなされたもの
で、Ａｇ３〜４重量％、Ｂｉ５〜１０重量％、Ｚｎ０．
１〜１．５重量％を含有し、残部がＳｎからなることを
特徴とする錫−銀系ハンダ合金を提供するものである。[0008] The present invention has been made based on the above findings, and contains 3 to 4% by weight of Ag, 5 to 10% by weight of Bi,
An object of the present invention is to provide a tin-silver solder alloy containing 1 to 1.5% by weight, with the balance being Sn.
【０００９】また、本発明は、Ａｇ３〜４重量％、Ｂｉ
５〜１０重量％、Ｉｎ５重量％以下、Ｚｎ０．１〜１．
５重量％を含有し、残部がＳｎからなることを特徴とす
る錫−銀系ハンダ合金を提供するものである。Further, the present invention relates to a method of producing a composition comprising 3 to 4% by weight of Ag,
5 to 10% by weight, In 5% by weight or less, Zn 0.1 to 1.
An object of the present invention is to provide a tin-silver-based solder alloy containing 5% by weight, with the balance being Sn.
【００１０】[0010]
【発明の実施の形態】以下、本発明の錫−銀系ハンダ合
金の実施の形態について説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the tin-silver solder alloy of the present invention will be described below.
【００１１】本発明の錫−銀系ハンダ合金におけるＡｇ
含有量は３〜４重量％であり、最適には３．５重量であ
るが、ハンダ合金製造時の製造歩留りから上記範囲であ
る。Ag in the tin-silver solder alloy of the present invention
The content is 3 to 4% by weight, optimally 3.5% by weight, but within the above range from the production yield at the time of producing a solder alloy.
【００１２】また、Ｂｉ含有量は５〜１０重量％であ
る。Ｂｉ含有量が５重量％未満では、融点が高くなり、
また引張強度が低下する。また、１０重量％を超える
と、接合信頼性が低下する。The Bi content is 5 to 10% by weight. If the Bi content is less than 5% by weight, the melting point becomes high,
Also, the tensile strength decreases. On the other hand, if the content exceeds 10% by weight, the joining reliability is reduced.
【００１３】さらに、Ｉｎを含有させる場合には、その
含有量は５重量％以下である。Ｉｎ含有量が５重量％を
超えるとコスト面から経済性に劣る。Further, when In is contained, its content is 5% by weight or less. If the In content exceeds 5% by weight, economical efficiency is inferior in terms of cost.
【００１４】本発明の錫−銀系ハンダ合金では亜鉛を
０．１〜１．５重量％含有する。亜鉛を含有することに
よって、接合信頼性が向上する。亜鉛の含有量が０．１
重量％未満又は１．５重量％を超えた場合には、いずれ
も接合信頼性の向上効果が得られない。The tin-silver solder alloy of the present invention contains zinc in an amount of 0.1 to 1.5% by weight. By containing zinc, bonding reliability is improved. The zinc content is 0.1
When the amount is less than 1.5% by weight or less than 1.5% by weight, the effect of improving the bonding reliability cannot be obtained.
【００１５】このように、本発明の錫−銀系ハンダ合金
は、亜鉛を一定量含有することによって、接合信頼性が
向上する。As described above, the tin-silver solder alloy of the present invention contains a certain amount of zinc, thereby improving the bonding reliability.
【００１６】[0016]
【実施例】以下、実施例等に基づき本発明を具体的に説
明する。なお、表１の合金組成において、数値のみは重
量％を示す。EXAMPLES Hereinafter, the present invention will be specifically described based on examples and the like. In addition, in the alloy compositions of Table 1, only numerical values indicate% by weight.
【００１７】〔実施例１〜５及び比較例１〜２〕表１に
示した組成となるように、総重量で１０ｋｇを秤量し、
黒鉛ルツボを使用して大気中で電気炉にて溶解した。溶
解温度は３００℃とした。完全に各金属が溶解した後、
重力偏析をなくすために、充分に撹拌した。[Examples 1 to 5 and Comparative Examples 1 and 2] A total weight of 10 kg was weighed so that the composition shown in Table 1 was obtained.
Melting was performed in an electric furnace in the air using a graphite crucible. The dissolution temperature was 300 ° C. After each metal is completely dissolved,
Stirring was sufficient to eliminate gravity segregation.
【００１８】このようにして得られた錫−銀系ハンダ合
金を用い、図１に示すように、形状１０×３０×１ｍｍ
の２枚の銅板先端部１０×５ｍｍ部に上記ハンダをそれ
ぞれ塗布した後、そのハンダ部を重ねることによって試
験片を作製した。その後、インストロン型引張試験機に
より、図１に示す上下方向に引張試験を行い、継ぎ手強
度を評価した。継ぎ手強度の評価は、初期と１００℃、
１０００時間経過後で行い、その劣化率で評価した。結
果を表１に示す。Using the tin-silver-based solder alloy thus obtained, as shown in FIG.
After applying the above-mentioned solder to the 10 × 5 mm portions of the two copper plates at the tip end, the test pieces were prepared by overlapping the solder portions. Thereafter, a tensile test was performed in the vertical direction shown in FIG. 1 using an Instron type tensile tester, and the joint strength was evaluated. Evaluation of the joint strength is initial and 100 ° C,
The evaluation was performed after the elapse of 1000 hours, and the deterioration rate was evaluated. Table 1 shows the results.
【００１９】[0019]
【表１】 [Table 1]
【００２０】表１の結果から明らかなように、亜鉛を一
定量含有させることによって、継ぎ手強度の劣化率が小
さい（実施例１〜５）。これに対し、亜鉛を含有しない
ものは継ぎ手強度の劣化率が大きい（比較例１〜２）。As is evident from the results in Table 1, the rate of deterioration of the joint strength is small by adding a certain amount of zinc (Examples 1 to 5). On the other hand, those containing no zinc have a large deterioration rate of the joint strength (Comparative Examples 1 and 2).
【００２１】また、実施例１〜５及び比較例１〜２につ
いては、下記の方法によって界面観察を行った。In Examples 1 to 5 and Comparative Examples 1 and 2, interfaces were observed by the following method.
【００２２】すなわち、上記引張試験後の試験片の断面
を研摩後、走査電子顕微鏡（ＳＥＭ）、エネルギー分散
形Ｘ線分析装置（ＥＤＳ）を用い観察し、また接合界面
の反応層の厚さを測定した。この反応層の厚さは、ＳＥ
Ｍで観察した写真から１０点を測定し平均した値であ
る。反応層の厚さを表２に示す。That is, the cross section of the test piece after the tensile test is polished, observed using a scanning electron microscope (SEM) and an energy dispersive X-ray analyzer (EDS), and the thickness of the reaction layer at the bonding interface is measured. It was measured. The thickness of this reaction layer is SE
It is a value obtained by measuring and averaging 10 points from the photograph observed in M. Table 2 shows the thickness of the reaction layer.
【００２３】[0023]
【表２】 [Table 2]
【００２４】表２から明らかなように、実施例１〜５
は、比較例１〜２に比べて、概ね接合界面の反応層の成
長が遅い。As is clear from Table 2, Examples 1 to 5
The growth of the reaction layer at the bonding interface is generally slower than in Comparative Examples 1 and 2.
【００２５】亜鉛を含有していない場合（比較例１〜
２）、通常Ｃｕ−Ｓｎ系の反応層が形成されており、界
面形状はＣｕ板／Ｃｕ−Ｓｎ系反応層／ハンダの界面が
形成されているが、亜鉛を含有させることでＣｕ板／Ｃ
ｕ−Ｓｎ系反応層／Ｃｕ−Ｚｎ系反応層／ハンダの界面
が形成されていた。このＣｕ−Ｚｎ系反応層によりＣｕ
−Ｓｎ系の反応層の成長を抑制していると思われる。特
に、亜鉛を１重量％％含有する場合（実施例３及び
５）、熱処理後若干成長しているが、初期の界面形状を
維持しており安定していた。When zinc is not contained (Comparative Examples 1 to 5)
2) Normally, a Cu-Sn-based reaction layer is formed, and the interface shape is an interface of Cu plate / Cu-Sn-based reaction layer / solder.
The interface of u-Sn-based reaction layer / Cu-Zn-based reaction layer / solder was formed. Cu-Zn based reaction layer allows Cu
It seems that the growth of the -Sn-based reaction layer is suppressed. In particular, when zinc was contained at 1% by weight (Examples 3 and 5), although growth was slight after the heat treatment, the initial interface shape was maintained and stable.
【００２６】[0026]
【発明の効果】本発明の錫−銀系ハンダ合金は、良好な
伸び特性等を示し、高接合信頼性を有する。The tin-silver solder alloy of the present invention exhibits good elongation characteristics and the like and has high bonding reliability.
【図１】図１は、継ぎ手強度の測定方法を示す簡略図で
ある。FIG. 1 is a simplified diagram showing a method for measuring joint strength.
Claims (2)
％、Ｚｎ０．１〜１．５重量％を含有し、残部がＳｎか
らなることを特徴とする錫−銀系ハンダ合金。1. A tin-silver solder alloy containing 3 to 4% by weight of Ag, 5 to 10% by weight of Bi, and 0.1 to 1.5% by weight of Zn, with the balance being Sn.
％、Ｉｎ５重量％以下、Ｚｎ０．１〜１．５重量％を含
有し、残部がＳｎからなることを特徴とする錫−銀系ハ
ンダ合金。2. A tin-silver solder containing 3 to 4% by weight of Ag, 5 to 10% by weight of Bi, 5% by weight or less of In, and 0.1 to 1.5% by weight of Zn, with the balance being Sn. alloy.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001077769A JP2002273596A (en) | 2001-03-19 | 2001-03-19 | Tin-silver-base solder alloy |
| US10/046,781 US20030003012A1 (en) | 2001-03-19 | 2002-01-17 | Tin-silver soldering alloy |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001077769A JP2002273596A (en) | 2001-03-19 | 2001-03-19 | Tin-silver-base solder alloy |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2002273596A true JP2002273596A (en) | 2002-09-25 |
Family
ID=18934471
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001077769A Pending JP2002273596A (en) | 2001-03-19 | 2001-03-19 | Tin-silver-base solder alloy |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US20030003012A1 (en) |
| JP (1) | JP2002273596A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012157873A (en) * | 2011-01-31 | 2012-08-23 | Fujitsu Ltd | Solder, soldering method and semiconductor device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06238479A (en) * | 1993-02-22 | 1994-08-30 | American Teleph & Telegr Co <Att> | Lead-free solder material |
| JPH08192291A (en) * | 1995-01-13 | 1996-07-30 | Matsushita Electric Ind Co Ltd | Cream solder |
| JPH08206874A (en) * | 1995-02-06 | 1996-08-13 | Matsushita Electric Ind Co Ltd | Solder material |
| JPH10193171A (en) * | 1996-12-27 | 1998-07-28 | Murata Mfg Co Ltd | Soldering article |
| JPH10328880A (en) * | 1997-06-04 | 1998-12-15 | Mitsui Mining & Smelting Co Ltd | Tin-silver based lead-free solder |
-
2001
- 2001-03-19 JP JP2001077769A patent/JP2002273596A/en active Pending
-
2002
- 2002-01-17 US US10/046,781 patent/US20030003012A1/en not_active Abandoned
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06238479A (en) * | 1993-02-22 | 1994-08-30 | American Teleph & Telegr Co <Att> | Lead-free solder material |
| JPH08192291A (en) * | 1995-01-13 | 1996-07-30 | Matsushita Electric Ind Co Ltd | Cream solder |
| JPH08206874A (en) * | 1995-02-06 | 1996-08-13 | Matsushita Electric Ind Co Ltd | Solder material |
| JPH10193171A (en) * | 1996-12-27 | 1998-07-28 | Murata Mfg Co Ltd | Soldering article |
| JPH10328880A (en) * | 1997-06-04 | 1998-12-15 | Mitsui Mining & Smelting Co Ltd | Tin-silver based lead-free solder |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012157873A (en) * | 2011-01-31 | 2012-08-23 | Fujitsu Ltd | Solder, soldering method and semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| US20030003012A1 (en) | 2003-01-02 |
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