JP2002096335A - Mold for molding optical element and method for molding optical element - Google Patents
Mold for molding optical element and method for molding optical elementInfo
- Publication number
- JP2002096335A JP2002096335A JP2000290257A JP2000290257A JP2002096335A JP 2002096335 A JP2002096335 A JP 2002096335A JP 2000290257 A JP2000290257 A JP 2000290257A JP 2000290257 A JP2000290257 A JP 2000290257A JP 2002096335 A JP2002096335 A JP 2002096335A
- Authority
- JP
- Japan
- Prior art keywords
- mold
- optical element
- layer
- molding
- heat insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Diffracting Gratings Or Hologram Optical Elements (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】この発明は、ミクロンオーダ
ー以下の形状精度が要求される映像記録、光記録、光通
信機器などに使用される回折光学素子や、光学レンズ、
ミラー等を合成樹脂の射出成形で製造するための光学素
子成形用の金型、及びその金型を使用した光学素子の成
形方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a diffractive optical element used for video recording, optical recording, optical communication equipment, etc., which requires a form accuracy of a micron order or less, an optical lens,
The present invention relates to a mold for molding an optical element for manufacturing a mirror or the like by injection molding of a synthetic resin, and a method for molding an optical element using the mold.
【０００２】[0002]
【従来の技術】合成樹脂の射出成形により光学素子を製
造する場合に使用される成形型は、従来から鋼などの金
属材料で製作された金型が使用されてきた。このような
従来の金型を用いて０．１μｍ乃至１ｍｍの微細形状を
持つ回折光学素子を熱可塑性樹脂で射出成形する場合、
溶融樹脂が持つ熱は金型内に射出された瞬間に急速に金
型に移動し、キャビテイ型又はコア型に接触している樹
脂表面は急速に冷却され、固化する。2. Description of the Related Art A mold used for manufacturing an optical element by injection molding of a synthetic resin has conventionally been a mold made of a metal material such as steel. When a diffractive optical element having a fine shape of 0.1 μm to 1 mm is injection-molded with a thermoplastic resin using such a conventional mold,
The heat of the molten resin is rapidly transferred to the mold as soon as it is injected into the mold, and the resin surface in contact with the cavity mold or the core mold is rapidly cooled and solidified.
【０００３】このため、樹脂を射出した後の形状転写工
程である保圧工程（樹脂射出後に所定の時間、圧力を維
持する工程）において、十分な転写性が得られない、即
ちミクロンオーダー以下の高い精度で金型の形状を成形
体に転写することができないという不都合がある。For this reason, in the pressure-holding step (a step of maintaining the pressure for a predetermined time after the resin is injected), which is a shape transfer step after the resin is injected, sufficient transferability cannot be obtained, that is, in the order of microns or less. There is a disadvantage that the shape of the mold cannot be transferred to the molded body with high accuracy.
【０００４】転写性を改善するための対策としては、射
出圧力を高めたり、射出速度を上げるなどの方策がある
が、転写性を改善するには限界があり、十分に転写性を
改善することはできない。As measures for improving the transferability, there are measures such as increasing the injection pressure and increasing the injection speed. However, there is a limit in improving the transferability, and it is necessary to improve the transferability sufficiently. Can not.
【０００５】また、射出成形に先立つて金型を樹脂の転
写可能温度（ガラス転移温度）まで加熱すると転写性は
向上するが、射出成形後は金型を離型可能な温度まで冷
却する必要があり、射出成形の工程に金型加熱工程や金
型冷却工程が加わり、工程数が増加するほか、金型の加
熱冷却設備に多額の費用を要し、現実的な成形方法では
ない。Further, if the mold is heated to a resin transferable temperature (glass transition temperature) prior to injection molding, transferability is improved, but after injection molding, it is necessary to cool the mold to a temperature at which the mold can be released. In addition, a mold heating step and a mold cooling step are added to the injection molding step, so that the number of steps increases, and a large amount of cost is required for heating and cooling equipment for the mold, which is not a realistic molding method.
【０００６】このような課題を解決する手段として、金
型表面に断熱層を設け、射出工程において金型内に充填
された樹脂の温度が、その後の形状転写工程である保圧
工程まで高温に保つようにすることで転写性を向上させ
る方法が、主に外観を重視する部品の成形を目的に提案
されている。具体的には、断熱層にポリイミド樹脂を使
用するもの（例えば、特許第２６７６２３号、特許第２
７０６２２１号、特許第２７２７３０３号）や、断熱層
にセラミックスを使用するもの（例えば、特開平６−２
１８７６９号公報、特開平１０−１４９５８７号公報）
等が提案されている。As means for solving such a problem, a heat insulating layer is provided on the surface of the mold, and the temperature of the resin filled in the mold in the injection step is increased to a high temperature until the pressure-holding step, which is the subsequent shape transfer step. A method of improving the transferability by keeping the same has been proposed mainly for the purpose of molding a part that emphasizes the appearance. Specifically, those using a polyimide resin for the heat insulating layer (for example, Patent No. 267623, Patent No. 2
No. 706221, Japanese Patent No. 2727303), and those using ceramics for the heat insulating layer (for example, JP-A-6-2)
18769, JP-A-10-149587)
Etc. have been proposed.
【０００７】[0007]
【発明が解決しようとする課題】上記した断熱層を表面
に設けた金型による光学素子の成形においては、以下の
ような不都合が指摘されている。The following inconveniences have been pointed out in molding an optical element using a mold provided with a heat insulating layer on the surface as described above.
【０００８】即ち、断熱層にポリイミド樹脂を使用した
場合は、ポリイミド樹脂硬化物は金属等に比較して粘
弾性があるため、ポリイミド樹脂硬化物で被覆された金
型表面を切削加工や研磨加工により光回折効果をもたら
す溝等の微細形状の形成や光学表面の形成が不可能であ
ること。ポリイミド樹脂硬化物は金属に比較して熱膨
張係数が約５倍大きいため、熱履歴が繰り返し加わる金
型表面にポリイミド樹脂硬化物を被覆した場合は、金型
母材と被覆物との密着性を長期間確保することが困難で
あること。That is, when a polyimide resin is used for the heat insulating layer, the cured polyimide resin is more viscoelastic than metal or the like, so that the mold surface covered with the cured polyimide resin is cut or polished. It is impossible to form a fine shape such as a groove and an optical surface which bring about an optical diffraction effect. Since the cured polyimide resin has a coefficient of thermal expansion about 5 times larger than that of metal, if the cured polyimide resin is coated on the mold surface to which heat history is repeatedly applied, the adhesion between the mold base material and the coating Is difficult to secure for a long time.
【０００９】断熱層にセラミックスを使用した場合は、
セラミックスは金属に比較して硬度や脆性が高く、しか
も微粒子により構成されているため、切削加工や研磨加
工により光回折効果をもたらす溝等の微細形状の形成や
光学表面の形成が困難であること。When ceramics are used for the heat insulating layer,
Ceramics have higher hardness and brittleness than metals, and are composed of fine particles, making it difficult to form microscopic shapes such as grooves and optical surfaces that provide an optical diffraction effect by cutting or polishing. .
【００１０】断熱層にセラミックスを使用し、充填され
る樹脂との接触面を金属製の別部材として構成した場合
は、充填される樹脂の急冷を防ぐために金属製の別部材
の厚みを薄くする必要がある。しかし、厚みの薄い金属
製の別部材に切削加工や研磨加工を施して光回折効果を
もたらす溝等の微細形状の形成すると、加工応力による
変形が生じ、精度を保証することができない。また、球
面、非球面、自由曲面等を光学部品として要求される高
い精度で加工することも不可能である。In the case where ceramic is used for the heat insulating layer and the contact surface with the resin to be filled is formed as a separate metal member, the thickness of the separate metal member is reduced to prevent rapid cooling of the filled resin. There is a need. However, when a thin metal member is cut or polished to form a fine shape such as a groove that produces an optical diffraction effect, deformation occurs due to processing stress, and accuracy cannot be guaranteed. Further, it is impossible to process a spherical surface, an aspherical surface, a free-form surface, and the like with high precision required as an optical component.
【００１１】上記した金属製の別部材を電鋳法により形
成するときは、その形状精度は原理的に金型母型（マス
ター）の形状精度よりも低下するから、高精度が要求さ
れる光学部品製作用の金型としては適当でない。When the above-mentioned separate metal member is formed by the electroforming method, the shape accuracy is in principle lower than the shape accuracy of the mold master (master). It is not suitable as a mold for manufacturing parts.
【００１２】上記した金属製の別部材をセラミックス断
熱層の上に接着や圧接により接合固定する場合は、その
接合応力により金属製の別部材に変形が生じ、光学部品
として要求される精度を確保することが困難となる。さ
らに、セラミックス断熱層との間の密着状態が不均一に
なり、金型の温度ムラ、樹脂の流動ムラが発生し、また
冷却固化が不均一になるなどの支障が発生し、光学部品
として要求される高い精度を確保することが困難とな
る。When the above-mentioned separate metal member is bonded and fixed on the ceramic heat-insulating layer by adhesion or pressure welding, the separate metal member is deformed by the bonding stress, and the accuracy required as an optical component is secured. It will be difficult to do. Furthermore, the state of adhesion to the ceramic heat insulating layer becomes non-uniform, uneven temperature of the mold, uneven flow of the resin, and uneven cooling and solidification occur. It is difficult to ensure high accuracy.
【００１３】[0013]
【課題を解決するための手段】この発明は、上記課題を
解決することを目的とするもので、請求項１の発明は、
コア型と、該コア型との間に部材成形空間を隔てて配置
されたキャビテイ型とを備えた合成樹脂成形用の金型で
あつて、少なくとも前記コア型及びキャビテイ型のいず
れか一方は、その部材成形空間に対向する面に、金型母
材の上に断熱層を介在させて表面加工層が形成されてい
ることを特徴とする光学素子成形用金型である。SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problems.
A mold for synthetic resin molding comprising a core mold and a cavity mold arranged with a member molding space interposed between the core mold and at least one of the core mold and the cavity mold, An optical element molding die, characterized in that a surface processed layer is formed on a surface facing the member molding space with a heat insulating layer interposed on a die base material.
【００１４】そして、前記表面加工層は、０．１μｍ乃
至１ｍｍの範囲の微細形状が切削加工により形成され、
或いは面粗度０．０５μｍ以下の光学鏡面が研磨加工若
しくは切削加工により形成されている。[0014] The surface processing layer is formed by cutting a fine shape in a range of 0.1 µm to 1 mm.
Alternatively, an optical mirror surface having a surface roughness of 0.05 μm or less is formed by polishing or cutting.
【００１５】また、前記断熱層は、前記コア型又はキャ
ビテイ型の部材成形空間に対向する面にセラミックス系
材料を溶射して形成された断熱層である。The heat insulating layer is a heat insulating layer formed by spraying a ceramic material on a surface facing the core-type or cavity-type member forming space.
【００１６】また、前記断熱層は、熱伝導率が１０．０
Ｗ／ｍ・Ｋ以下で、且つ厚みが０．１ｍｍ乃至３ｍｍの
範囲内である。The heat insulation layer has a thermal conductivity of 10.0.
It is not more than W / m · K and the thickness is in the range of 0.1 mm to 3 mm.
【００１７】そして、前記表面加工層は、前記断熱層の
上に非鉄金属材料をメッキして形成された表面加工層で
ある。[0017] The surface processing layer is a surface processing layer formed by plating a non-ferrous metal material on the heat insulating layer.
【００１８】また、前記表面加工層は、厚みが１μｍ乃
至２００μｍの範囲内にある。The thickness of the surface-treated layer is in the range of 1 μm to 200 μm.
【００１９】そして、前記金型母材、断熱層及び表面加
工層は、それぞれ隣接する金型母材と断熱層或いは断熱
層と表面加工層との間の熱膨張係数の差が１５×１０-6
／℃以下になるように選択された材料により構成すると
よい。The mold base material, the heat-insulating layer and the surface-treated layer each have a difference in thermal expansion coefficient of 15 × 10 − between the adjacent mold base material and the heat-insulating layer or between the heat-insulating layer and the surface-treated layer. 6
/ ° C. or less.
【００２０】請求項９の発明は、請求項１乃至請求項８
のいずれかに記載の光学素子成形用金型を使用した光学
素子の成形方法であつて、前記光学素子成形用金型の部
材成形空間に熱可塑性合成樹脂を射出して光学素子を成
形することを特徴とする光学素子の成形方法である。The invention of claim 9 is the invention of claims 1 to 8
An optical element molding method using the optical element molding die according to any one of the above, wherein a thermoplastic synthetic resin is injected into a member molding space of the optical element molding die to form an optical element. A method for molding an optical element, characterized by the following.
【００２１】[0021]
【発明の実施の形態】以下、この発明の実施の形態につ
いて説明する。Embodiments of the present invention will be described below.
【００２２】［第１の実施の形態］まず、金型の構成の
概略を説明する。図１は第１の実施の形態の金型１０の
構成を説明する断面図で、回折光学素子を製作する金型
の一例が例示されている。図１において、３はステンレ
ス鋼製のコア型、１はコア型３の表面にセラミックス系
材料であるジルコニアを溶射して直接金型母材に一体に
形成した断熱層、２は断熱層１の上に非鉄金属材料であ
るニッケルを無電解メッキして断熱層１に一体に形成し
た表面加工層である。[First Embodiment] First, an outline of the configuration of a mold will be described. FIG. 1 is a cross-sectional view illustrating the configuration of a mold 10 according to the first embodiment, illustrating an example of a mold for manufacturing a diffractive optical element. In FIG. 1, reference numeral 3 denotes a stainless steel core mold, 1 denotes a heat insulating layer formed by spraying zirconia, which is a ceramic material, on the surface of the core mold 3 and directly formed integrally with the mold base material; This is a surface processed layer integrally formed on the heat insulating layer 1 by electroless plating nickel which is a non-ferrous metal material.
【００２３】表面加工層２には、製作する光学部品に応
じて切削加工による表面加工が施される。ここでは回折
光学素子の金型として、表面加工層２の表面にピッチ７
μｍ、高さ３．５μｍの回折格子のブレーズ形状２ａ
が、ダイヤモンド工具による切削加工により形成されて
いる。The surface processing layer 2 is subjected to surface processing by cutting in accordance with the optical component to be manufactured. Here, as a mold of the diffractive optical element, a pitch of 7
μm, 3.5 μm high diffraction grating blaze shape 2a
Are formed by cutting with a diamond tool.
【００２４】４及び５はコア型３の周囲を囲んでキャビ
テイを形成するキャビテイ型であつて、コア型３の表面
の断熱層１の上に形成された表面加工層２とキャビテイ
型４及び５との間に形成される部材形成空間６に合成樹
脂が射出され、合成樹脂製の光学部品である回折光学素
子が形成される。Numerals 4 and 5 denote cavities which surround the periphery of the core mold 3 to form cavities. The surface treatment layer 2 formed on the heat insulating layer 1 on the surface of the core mold 3 and the cavity molds 4 and 5 are provided. The synthetic resin is injected into the member forming space 6 formed between them, and a diffractive optical element which is an optical component made of the synthetic resin is formed.
【００２５】コア型３、断熱層１及び表面加工層２の物
理的特性は以下のとおりである。コア型３の熱膨張係数
１１×１０-6／℃、熱伝導率２４．０Ｗ／ｍ・Ｋ、断熱
層１の厚み１ｍｍ、熱膨張係数９×１０-6／℃、熱伝導
率１．２Ｗ／ｍ・Ｋ、表面加工層２の厚み０．１ｍｍ、
熱膨張係数１３×１０-6／℃、熱伝導率８．０Ｗ／ｍ・
Ｋである。上記した物理的特性を図２に纏めて示した。The physical characteristics of the core mold 3, the heat insulating layer 1 and the surface processing layer 2 are as follows. Thermal expansion coefficient of core mold 3 11 × 10 −6 / ° C., thermal conductivity 24.0 W / m · K, thickness of heat insulating layer 1 1 mm, thermal expansion coefficient 9 × 10 −6 / ° C., thermal conductivity 1.2 W / M · K, the thickness of the surface-treated layer 2 is 0.1 mm,
Thermal expansion coefficient 13 × 10 −6 / ° C, thermal conductivity 8.0 W / m ·
K. The physical properties described above are summarized in FIG.
【００２６】合成樹脂としては、ポリカーボネイト樹脂
（ガラス転移温度１４８℃）を使用し、射出成形条件
は、成形樹脂温度２９０℃、金型温度１００℃、成形時
間１５０秒である。As the synthetic resin, a polycarbonate resin (glass transition temperature: 148 ° C.) is used, and the injection molding conditions are a molding resin temperature of 290 ° C., a mold temperature of 100 ° C., and a molding time of 150 seconds.
【００２７】次に、上記した条件で製作した回折光学素
子の表面形状の転写精度の測定結果を従来例と比較して
説明する。Next, the measurement result of the transfer accuracy of the surface shape of the diffractive optical element manufactured under the above conditions will be described in comparison with a conventional example.
【００２８】図３は、回折光学素子の金型のねらい形
状、コア型形状、及び成形品形状を説明する拡大断面図
で、図３の（ａ）は従来の金型の各形状を、図３の
（ｂ）は上記した第１の実施の形態の金型の各形状を示
す。FIG. 3 is an enlarged cross-sectional view for explaining the aimed shape, core shape, and molded product shape of the mold of the diffractive optical element. FIG. 3 (a) shows each shape of the conventional mold. 3 (b) shows each shape of the mold of the first embodiment described above.
【００２９】従来の金型では、図３の（ａ）に示すよう
に、回折光学素子のねらい形状２１に対し、コア型の形
状２２は材料の粘弾性等の影響により先端部分が僅かに
垂れた形状に仕上がり、更にこのコア型による成形品の
形状２３は、先端部分が大きく垂れた形状となつてい
る。In the conventional mold, as shown in FIG. 3A, the core shape 22 slightly sags due to the viscoelasticity and the like of the material, while the aim shape 21 of the diffractive optical element. In addition, the shape 23 of the molded product of the core mold has a shape whose tip end portion is drooped greatly.
【００３０】そのねらい形状２１に対する成形品の形状
誤差Ｄは、使用する合成樹脂の種類により異なるが、
０．６乃至１．１μｍ程度であつた。The shape error D of the molded product with respect to the target shape 21 differs depending on the type of synthetic resin used.
It was about 0.6 to 1.1 μm.
【００３１】一方、第１の実施の形態の金型では、図３
の（ｂ）に示すように、回折光学素子のねらい形状２５
に対し、コア型の形状２６はねらい形状２５に略一致し
た形状に仕上がり、更にこのコア型による成形品の形状
２７もねらい形状２５に略一致した形状に成形すること
ができた。On the other hand, in the mold of the first embodiment, FIG.
As shown in (b) of FIG.
On the other hand, the shape 26 of the core mold was finished to have a shape substantially corresponding to the aimed shape 25, and the shape 27 of the molded product by the core mold could be formed to a shape substantially matched to the aimed shape 25.
【００３２】そのねらい形状２５に対する成形品の形状
誤差Ｄは、使用する合成樹脂の種類により異なるが、
０．１μｍ以下であつた。The shape error D of the molded product with respect to the target shape 25 differs depending on the type of synthetic resin used.
It was 0.1 μm or less.
【００３３】図４に、従来の金型による成形品の形状誤
差の測定結果と、第１の実施の形態の金型による成形品
の形状誤差の測定結果とを、使用する合成樹脂の種類別
により示す。FIG. 4 shows the measurement result of the shape error of the molded article by the conventional mold and the measurement result of the shape error of the molded article by the mold of the first embodiment, for each type of synthetic resin used. Indicated by.
【００３４】図４から明らかなように、第１の実施の形
態の金型によれば、従来の金型に比較して成形品の形状
誤差Ｄは極めて小さく、使用する合成樹脂の種類にも殆
ど影響の無いことが分かる。As is apparent from FIG. 4, according to the mold of the first embodiment, the shape error D of the molded product is extremely small as compared with the conventional mold, and the type of synthetic resin used is also small. It can be seen that there is almost no effect.
【００３５】［第２の実施の形態］図５は、第２の実施
の形態の金型３０の構成を説明する断面図で、レーザビ
ームプリンタに使用されるｆθミラーを製作する金型の
一例が例示されている。[Second Embodiment] FIG. 5 is a cross-sectional view illustrating the configuration of a mold 30 according to a second embodiment, and is an example of a mold for manufacturing an fθ mirror used in a laser beam printer. Is exemplified.
【００３６】図５において、３３ａ及び３３ｂはステン
レス鋼製のコア型、３１ａはコア型３３ａの表面にセラ
ミック系材料であるジルコニアを溶射して一体形成した
断熱層、３２ａは断熱層３１ａの上に非鉄金属材料であ
るニッケルを無電解メッキして断熱層３１ａに一体形成
した表面加工層である。In FIG. 5, 33a and 33b are stainless steel core molds, 31a is a heat insulating layer integrally formed by spraying zirconia as a ceramic material on the surface of the core mold 33a, and 32a is on the heat insulating layer 31a. This is a surface processed layer formed integrally with the heat insulating layer 31a by electroless plating nickel, which is a non-ferrous metal material.
【００３７】表面加工層３２ａには、製作する光学部品
に応じて切削加工による表面加工が施される。ここでは
ｆθミラーの金型として、表面加工層３２ａの表面に面
粗度０．０２μｍの自由曲面３２ｂがダイヤモンド工具
による切削加工により形成されている。The surface processing layer 32a is subjected to surface processing by cutting in accordance with the optical component to be manufactured. Here, as a mold for the fθ mirror, a free-form surface 32b having a surface roughness of 0.02 μm is formed on the surface of the surface processing layer 32a by cutting with a diamond tool.
【００３８】３４及び３５はコア型３３ａ、３３ｂの周
囲を囲むキャビテイ型で、コア型３３ａの表面の断熱層
３１ａの上に形成された表面加工層３２ａと、コア型３
３ｂ、キャビテイ型３４及び３５との間に形成される部
材成形空間３６に合成樹脂が射出され、合成樹脂製の光
学部品であるｆθミラーが形成される。Numerals 34 and 35 denote cavities surrounding the core molds 33a and 33b, and a surface processed layer 32a formed on the heat insulating layer 31a on the surface of the core mold 33a and a core mold 3a.
3b, synthetic resin is injected into a member molding space 36 formed between the cavity molds 34 and 35, and an fθ mirror, which is an optical component made of synthetic resin, is formed.
【００３９】コア型３３ａ、断熱層３１ａ及び表面加工
層３２ａの物理的特性は以下のとおりである。即ち、コ
ア型３３ａの熱膨張係数１１×１０-6／℃、熱伝導率２
４．０Ｗ／ｍ・Ｋ、断熱層３１ａの厚み１ｍｍ、熱膨張
係数９×１０-6／℃、熱伝導率１．２Ｗ／ｍ・Ｋ、表面
加工層３２ａの厚み０．１５ｍｍ、熱膨張係数１３×１
０-6／℃、熱伝導率８．０Ｗ／ｍ・Ｋである。この特性
は先に説明した第１の実施の形態の金型の物理的特性と
同じである。The physical characteristics of the core mold 33a, the heat insulating layer 31a and the surface processing layer 32a are as follows. That is, the thermal expansion coefficient of the core mold 33a is 11 × 10 −6 / ° C., and the thermal conductivity is 2
4.0 W / m · K, thickness of heat insulating layer 31 a 1 mm, coefficient of thermal expansion 9 × 10 −6 / ° C, thermal conductivity 1.2 W / m · K, thickness of surface processed layer 32 a 0.15 mm, coefficient of thermal expansion 13x1
0 −6 / ° C., thermal conductivity 8.0 W / m · K. This characteristic is the same as the physical characteristic of the mold of the first embodiment described above.
【００４０】なお、上記の金型により、両面を光学鏡面
とする光学部品を形成する場合は、コア型３３ａ及び３
３ｂの両方に断熱層及び表面加工層を形成すればよい。In the case where an optical component having optical mirror surfaces on both sides is formed by the above-mentioned mold, the core molds 33a and 3d are used.
What is necessary is just to form a heat insulation layer and a surface processing layer in both of 3b.
【００４１】以上説明した、第１及び第２の実施の形態
においては、断熱層の材料として、ジルコニアを使用し
たが、断熱層の材料はこれに限られるものではなく、セ
ラミック系材料、即ち、アルミナ、酸化チタン、酸化ク
ロム等を含む各種のセラミックの他、それ等のセラミッ
ク材料と金属材料との混合物であるサーメットなどを使
用することができる。その材料の選定に際しては、その
材料の熱膨張係数が金型母材や表面加工層の材料の熱膨
張係数と大きく異ならない材料を選択するものとする。In the first and second embodiments described above, zirconia is used as the material of the heat insulating layer. However, the material of the heat insulating layer is not limited to this, and a ceramic material, that is, In addition to various ceramics including alumina, titanium oxide, chromium oxide, and the like, cermet, which is a mixture of such a ceramic material and a metal material, can be used. When selecting the material, a material whose coefficient of thermal expansion does not greatly differ from the coefficient of thermal expansion of the material of the mold base material or the surface processing layer is selected.
【００４２】即ち、金型母材の熱膨張係数は概略５〜３
０×１０-6／℃、断熱層の材料の熱膨張係数は概略３〜
３０×１０-6／℃、表面加工層の材料の熱膨張係数は概
略５〜３０×１０-6／℃であるから、これらの材料の選
択・組み合わせに際しては、隣接する金型母材と断熱層
或いは断熱層と表面加工層との間の熱膨張係数の差が１
５×１０-6／℃以下になるように材料を選択し組み合わ
せるとよい。That is, the thermal expansion coefficient of the mold base material is approximately 5 to 3
0 × 10 −6 / ° C., the thermal expansion coefficient of the material of the heat insulating layer is approximately 3 to
30 × 10 -6 / ℃, because the thermal expansion coefficient of the material of the surface processed layer is a schematic 5~30 × 10 -6 / ℃, when the selection and combination of these materials, the adjacent mold base material and the heat insulating The difference in the coefficient of thermal expansion between the layer or the heat insulation layer and the surface treatment layer is 1
It is advisable to select and combine the materials so as to be 5 × 10 −6 / ° C. or less.
【００４３】また、説明した、第１及び第２の実施の形
態においては、コア型（キャビテイ型でも同じ）の部材
成形空間に対向する面に形成する層は、断熱層と表面加
工層との２層構造としたが、金型母材の表面と断熱層、
断熱層と表面加工層との間の密着力を向上させるため、
又は表面加工層の鏡面性を向上させるため、その間に中
間層を設けてもよい。中間層は、金型母材、断熱層の材
料、表面加工層の材料との間でそれぞれ高い親和力を持
つ材料で構成するものとする。In the first and second embodiments described above, the layer formed on the surface of the core type (same for the cavity type) facing the member forming space is formed by the heat insulating layer and the surface processing layer. Although it has a two-layer structure, the surface of the mold base material and the heat insulating layer,
In order to improve the adhesion between the heat insulation layer and the surface treatment layer,
Alternatively, an intermediate layer may be provided therebetween in order to improve the mirror finish of the surface processing layer. The intermediate layer is made of a material having a high affinity with the mold base material, the material of the heat insulating layer, and the material of the surface processing layer.
【００４４】[0044]
【発明の効果】以上説明したとおり、請求項１の発明の
光学素子成形用金型は、少なくともコア型及びキャビテ
イ型のいずれか一方は、その部材成形空間に対向する面
に、金型母材の上に断熱層を介在させて表面加工層が形
成されており、断熱層は金型にセラミックス系材料を溶
射して形成された断熱層で、表面加工層は前記断熱層の
上に非鉄金属材料をメッキして形成された表面加工層で
ある。As described above, according to the optical element molding die of the first aspect of the present invention, at least one of the core die and the cavity die is provided on the surface facing the member molding space. A surface processing layer is formed with a heat insulating layer interposed therebetween, and the heat insulating layer is a heat insulating layer formed by spraying a ceramic material on a mold, and the surface processing layer is a non-ferrous metal on the heat insulating layer. This is a surface processed layer formed by plating a material.
【００４５】表面加工層に非鉄金属材料を使用し、その
下側の断熱層にセラミック系材料を使用することで表面
加工層の強度を高めることができるので、表面加工層に
ミクロンオーダー以下の極めて精度の高い金型形状を加
工することが可能となる。By using a non-ferrous metal material for the surface treatment layer and using a ceramic material for the heat insulating layer below the surface treatment layer, the strength of the surface treatment layer can be increased. A highly accurate mold shape can be processed.
【００４６】また、表面加工層の下側に断熱層が存在す
ることにより、金型の温度ムラ、樹脂の流動ムラ、冷却
固化の不均一などが発生することがなく、射出工程にお
いて金型内に充填された樹脂の温度を、その後の形状転
写工程である保圧工程まで高温に保つことができるか
ら、表面加工層に形成されたミクロンオーダー以下の極
めて精度の高い金型形状を高い精度で成形品に転写する
ことができ、光学部品として要求される精度を確保する
ことができる等、従来の光学素子成形用金型に見られな
い優れた性能の金型を提供することができる。Further, since the heat insulating layer exists below the surface processing layer, unevenness in the temperature of the mold, uneven flow of the resin, and uneven cooling and solidification do not occur. The temperature of the resin charged into the surface can be kept high until the pressure-holding step, which is the subsequent shape transfer step. It is possible to provide a mold having excellent performance not found in conventional molds for molding optical elements, such as being able to be transferred to a molded article and ensuring the precision required as an optical component.
【００４７】更に、請求項９の発明の光学素子成形方法
は、上記した光学素子成形用金型を使用して光学素子を
成形するものであるから、ミクロンオーダー以下の極め
て精度の高い光学素子を成形することができる。Further, in the optical element molding method according to the ninth aspect of the present invention, since the optical element is molded using the above-described mold for molding an optical element, an optical element having extremely high precision on the order of microns or less can be obtained. Can be molded.
【図１】第１の実施の形態の金型の構成を説明する断面
図。FIG. 1 is a sectional view illustrating the configuration of a mold according to a first embodiment.
【図２】コア型、断熱層及び表面加工層の物理的特性を
示す図。FIG. 2 is a view showing physical characteristics of a core mold, a heat insulating layer, and a surface processing layer.
【図３】従来の回折光学素子金型、及び第１の実施の形
態の回折光学素子金型のねらい形状、コア型形状、及び
成形品形状を説明する拡大断面図。FIG. 3 is an enlarged cross-sectional view illustrating a target shape, a core shape, and a molded product shape of a conventional diffractive optical element mold and the diffractive optical element mold of the first embodiment.
【図４】従来の金型による成形品の形状誤差の測定結果
と、第１の実施の形態の金型による成形品の形状誤差の
測定結果を説明する図。FIG. 4 is a diagram illustrating a measurement result of a shape error of a molded product by a conventional mold and a measurement result of a shape error of a molded product by the mold according to the first embodiment.
【図５】第２の実施の形態の金型の構成を説明する断面
図。FIG. 5 is a sectional view illustrating a configuration of a mold according to a second embodiment.
１０ 第１の実施の形態の金型 １ 断熱層 ２ 表面加工層 ２ａ 回折格子のブレーズ形状 ３ コア型 ４、５ キャビテイ型 ６ 部材成形空間 ３０ 第２の実施の形態の金型 ３１ａ 断熱層 ３２ａ 表面加工層 ３２ｂ 自由曲面 ３３ａ、３３ｂ コア型 ３４、３５ キャビテイ型 ３６ 部材成形空間 Reference Signs List 10 Mold of first embodiment 1 Heat insulation layer 2 Surface treatment layer 2a Blazed shape of diffraction grating 3 Core mold 4, 5 Cavity mold 6 Member molding space 30 Mold of second embodiment 31a Heat insulation layer 32a Surface Working layer 32b Free-form surface 33a, 33b Core mold 34, 35 Cavity mold 36 Member forming space
───────────────────────────────────────────────────── フロントページの続き Ｆターム(参考） 2H049 AA31 AA40 AA63 4F202 AF14 AH73 AJ06 AJ09 AJ13 AR12 AR13 CA11 CB01 CD14 CD18 CD26 CK88 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2H049 AA31 AA40 AA63 4F202 AF14 AH73 AJ06 AJ09 AJ13 AR12 AR13 CA11 CB01 CD14 CD18 CD26 CK88
Claims (9)
間を隔てて配置されたキャビテイ型とを備えた合成樹脂
成形用の金型であつて、 少なくとも前記コア型及びキャビテイ型のいずれか一方
は、その部材成形空間に対向する面に、金型母材の上に
断熱層を介在させて表面加工層が形成されていることを
特徴とする光学素子成形用金型。1. A synthetic resin mold comprising a core mold and a cavity mold arranged with a member molding space between the core mold and at least one of the core mold and the cavity mold. Either one is a mold for molding an optical element, characterized in that a surface processing layer is formed on a surface facing a member molding space with a heat insulating layer interposed on a mold base material.
ｍの範囲の微細形状が切削加工により形成されているこ
とを特徴とする請求項１記載の光学素子成形用金型。2. The surface-treated layer has a thickness of 0.1 μm to 1 m.
2. The optical element molding die according to claim 1, wherein a fine shape in a range of m is formed by cutting.
以下の光学鏡面が研磨加工若しくは切削加工により形成
されていることを特徴とする請求項１記載の光学素子成
形用金型。3. The surface-treated layer has a surface roughness of 0.05 μm.
The optical element molding die according to claim 1, wherein the following optical mirror surface is formed by polishing or cutting.
イ型の部材成形空間に対向する面にセラミックス系材料
を溶射して形成された断熱層であることを特徴とする請
求項１記載の光学素子成形用金型。4. The optical device according to claim 1, wherein the heat insulating layer is a heat insulating layer formed by spraying a ceramic material on a surface facing the core-shaped or cavity-shaped member forming space. Element molding die.
ｍ・Ｋ以下で、且つ厚みが０．１ｍｍ乃至３ｍｍの範囲
内であることを特徴とする請求項１記載の光学素子成形
用金型。5. The heat insulating layer has a thermal conductivity of 10.0 W /
2. The mold for molding an optical element according to claim 1, wherein the thickness is within a range of 0.1 mm to 3 mm.
鉄金属材料をメッキして形成された表面加工層であるこ
とを特徴とする請求項１記載の光学素子成形用金型。6. The optical element molding die according to claim 1, wherein the surface processing layer is a surface processing layer formed by plating a non-ferrous metal material on the heat insulating layer.
００μｍの範囲内にあることを特徴とする請求項１記載
の光学素子成形用金型。7. The surface-treated layer has a thickness of 1 μm to 2 μm.
The mold for molding an optical element according to claim 1, wherein the diameter is within a range of 00 µm.
は、それぞれ隣接する金型母材と断熱層或いは断熱層と
表面加工層との間の熱膨張係数の差が１５×１０-6／℃
以下になるように選択された材料により構成されている
ことを特徴とする請求項１乃至請求項７のいずれかに記
載の光学素子成形用金型。8. The mold base material, the heat insulating layer and the surface treatment layer each have a difference in thermal expansion coefficient of 15 × 10 − between the adjacent mold base material and the heat insulation layer or between the heat insulation layer and the surface treatment layer. 6 / ℃
The optical element molding die according to any one of claims 1 to 7, comprising a material selected as follows.
の光学素子成形用金型を使用した光学素子の成形方法で
あつて、前記光学素子成形用金型の部材成形空間に熱可
塑性合成樹脂を射出して光学素子を成形することを特徴
とする光学素子の成形方法。9. An optical element molding method using the optical element molding die according to any one of claims 1 to 8, wherein the member molding space of the optical element molding die has thermoplasticity. A method for molding an optical element, comprising molding an optical element by injecting a synthetic resin.
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|---|---|---|---|
| JP2000290257A JP4135304B2 (en) | 2000-09-25 | 2000-09-25 | Manufacturing method of mold for molding optical element |
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|---|---|---|---|
| JP2008098059A Division JP4650514B2 (en) | 2008-04-04 | 2008-04-04 | Optical element molding method |
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| JP2002096335A true JP2002096335A (en) | 2002-04-02 |
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