JP2001177156A - Side emitting led lamp - Google Patents

Side emitting led lamp

Info

Publication number
JP2001177156A
JP2001177156A JP35517299A JP35517299A JP2001177156A JP 2001177156 A JP2001177156 A JP 2001177156A JP 35517299 A JP35517299 A JP 35517299A JP 35517299 A JP35517299 A JP 35517299A JP 2001177156 A JP2001177156 A JP 2001177156A
Authority
JP
Japan
Prior art keywords
electrode
led
light
led elements
led lamp
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP35517299A
Other languages
Japanese (ja)
Inventor
Masataka Tejima
聖貴 手島
Yoshimi Katsumoto
善巳 勝本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koha Co Ltd
Original Assignee
Koha Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koha Co Ltd filed Critical Koha Co Ltd
Priority to JP35517299A priority Critical patent/JP2001177156A/en
Priority to KR1019990059155A priority patent/KR20010064820A/en
Priority to TW088123055A priority patent/TW448588B/en
Publication of JP2001177156A publication Critical patent/JP2001177156A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Landscapes

  • Led Device Packages (AREA)
  • Led Devices (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a side emitting LED lamp having uniform directivity, small deviation between LED elements and reduced in size. SOLUTION: This side emitting LED lamp 1 comprises a red LED element 5R, a green LED element 5G and blue LED element 5b arranged in one row in a direction perpendicular to the end 2c on a board 2 for loading LED elements. In this case, the elements 5R, 5G and 5B are sealed with a convex lens 7.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、例えば、携帯電話
等における液晶ディスプレイのバックライトに好適な側
面発光型LEDランプに関し、特に、指向特性が均一で
あり、かつ、LED素子間でずれが少なく、小型化を図
った側面発光型LEDランプに関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a side emission type LED lamp suitable for a backlight of a liquid crystal display in a cellular phone or the like, and in particular, has a uniform directional characteristic and a small deviation between LED elements. The present invention relates to a small-sized side-emitting LED lamp.

【0002】[0002]

【従来の技術】従来の側面発光型LEDランプとして、
例えば、特開平10−290029号公報に示されるも
のがある。
2. Description of the Related Art As a conventional side-emitting LED lamp,
For example, there is one disclosed in JP-A-10-290029.

【0003】図8は、その側面発光型LEDランプを示
す。このLEDランプ1は、同図(a)に示すように、
LED素子搭載用基板2の上に第1のLED素子5aお
よび第2のLED素子5bを搭載し、これらのLED素
子5a,5bを透明のモールド樹脂17で封止したもの
である。LED素子搭載用基板2の表面2aおよび裏面
2bには、共通電極3cが各々形成され、基板2の一方
の側面2dには、第1の個別電極3a、他方の側面2d
には、第2の個別電極3bが各々形成され、表面2aの
共通電極3cと裏面2bの共通電極3cとは、スルーホ
ールめっきを半分に切断した接続めっき4’によって接
続されている。第1および第2のLED素子5a,5b
は、上面に第1の電極を有し、下面に第2の電極を有す
る。第1のLED素子5aの第1 の電極は、ボンディン
グワイヤ6によって第1の個別電極3aに接続され、第
2のLED素子5bの第1 の電極は、ボンディングワイ
ヤ6によって第2の個別電極3bに接続され、第1およ
び第2のLED素子5a,5bの第2の電極は、導電性
接着剤によって表面2aの共通電極3cに接続されてい
る。
FIG. 8 shows the side-emitting LED lamp. This LED lamp 1 is, as shown in FIG.
The first LED element 5 a and the second LED element 5 b are mounted on the LED element mounting board 2, and these LED elements 5 a and 5 b are sealed with a transparent mold resin 17. A common electrode 3c is formed on each of the front surface 2a and the back surface 2b of the LED element mounting substrate 2. One side surface 2d of the substrate 2 has a first individual electrode 3a and the other side surface 2d.
, A second individual electrode 3b is formed, and the common electrode 3c on the front surface 2a and the common electrode 3c on the back surface 2b are connected by a connection plating 4 'obtained by cutting through-hole plating in half. First and second LED elements 5a, 5b
Has a first electrode on the upper surface and a second electrode on the lower surface. The first electrode of the first LED element 5a is connected to the first individual electrode 3a by a bonding wire 6, and the first electrode of the second LED element 5b is connected to the second individual electrode 3b by a bonding wire 6. And the second electrodes of the first and second LED elements 5a and 5b are connected to the common electrode 3c on the surface 2a by a conductive adhesive.

【0004】このLEDランプ1をプリント基板10に
実装する場合は、図8(b)に示すように、LED素子
搭載用基板2の端面2cを下にしてプリント基板10上
に立設し、LED素子搭載用基板2の裏面2bに露出し
ている個別電極3a,3bおよび共通電極3cとプリン
ト基板10上の対応する配線パターン11a,11b,
11cとをハンダ12によって接続することにより行わ
れる。配線パターン11a,11b,11c間に電流を
流すことにより、第1および第2のLED素子5a,5
bからモールド樹脂17を介して第1および第2の色の
光8a,8bがプリント基板10の表面に平行に出射さ
れる。
When the LED lamp 1 is mounted on a printed circuit board 10, as shown in FIG. 8 (b), the LED element mounting board 2 is erected on the printed circuit board 10 with the end surface 2c of the board 2 facing down. The individual electrodes 3a, 3b and the common electrode 3c exposed on the back surface 2b of the element mounting substrate 2 and the corresponding wiring patterns 11a, 11b,
11c by solder 12. By passing a current between the wiring patterns 11a, 11b, 11c, the first and second LED elements 5a, 5
b, light 8 a and 8 b of the first and second colors are emitted in parallel to the surface of the printed circuit board 10 via the mold resin 17.

【0005】図9は、水平方向の指向特性を示す。この
LEDランプ1は、同図に示すように、2つのLED素
子5a,5bに対して同一の指向特性を有しているの
で、液晶ディスプレイのバックライトとして用いた場合
に液晶ディスプレイにおける色むらを防げる。
FIG. 9 shows directional characteristics in the horizontal direction. Since the LED lamp 1 has the same directional characteristics with respect to the two LED elements 5a and 5b as shown in the figure, when used as a backlight of a liquid crystal display, color unevenness in the liquid crystal display is reduced. Can be prevented.

【0006】[0006]

【発明が解決しようとする課題】しかし、従来の側面発
光型LEDランプによると、モールド樹脂17は矩形状
を有するため、図9に示すように、その角部7aによっ
て指向特性が大きく変化し、液晶ディスプレイに光を均
一に照射できない。
However, according to the conventional side-emitting type LED lamp, since the molding resin 17 has a rectangular shape, the directivity characteristics are greatly changed by the corners 7a as shown in FIG. Unable to uniformly illuminate the liquid crystal display.

【0007】また、基板2の表面2aと裏面2bの共通
電極3cを接続する接続めっき4’がLED素子5a,
5bの並ぶ方向に設けられているため、プリント基板1
0上に実装した場合に、高さ寸法が大きくなり、また、
個別電極3a,3bは、基板2の側面2dに設けられて
いるため、幅寸法が大きくなる。このように周端面に電
極を有する構造では、3つ以上のLED素子を搭載する
場合には、電極構造が複雑化し、大型化する。
The connection plating 4 'for connecting the common electrode 3c on the front surface 2a and the back surface 2b of the substrate 2 is provided with the LED elements 5a,
5b, the printed circuit board 1
When mounted on 0, the height dimension increases, and
Since the individual electrodes 3a and 3b are provided on the side surface 2d of the substrate 2, the width dimension increases. As described above, in a structure having electrodes on the peripheral end surface, when three or more LED elements are mounted, the electrode structure becomes complicated and large.

【0008】一方、2つのLED素子5a,5bを発光
側から見て斜めに配置することにより、高さ寸法を小さ
くすることも可能であるが、色間で水平方向の指向特性
が異なるため、液晶ディスプレイ上に色むらが生じてし
まう。
On the other hand, by arranging the two LED elements 5a and 5b obliquely when viewed from the light emitting side, the height dimension can be reduced. However, since the horizontal directivity differs between colors, Color unevenness occurs on the liquid crystal display.

【0009】従って、本発明の目的は、指向特性が均一
であり、かつ、LED素子間でずれが少ない側面発光型
LEDランプを提供することにある。
SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a side-emitting type LED lamp having uniform directional characteristics and little deviation between LED elements.

【0010】また、本発明の他の目的は、小型化を図っ
た側面発光型LEDランプを提供することにある。
[0010] Another object of the present invention is to provide a side emission type LED lamp which is reduced in size.

【0011】[0011]

【課題を解決するための手段】本発明は、上記目的を達
成するため、基板の表面に列状に配置された複数のLE
D素子と、前記複数のLED素子の列方向に伸びて前記
複数のLED素子に共通して設けられ、前記複数のLE
D素子の発光光を所定の広がり角を有する光に整形して
出射する凸レンズとを備えたことを特徴とする側面発光
型LEDランプを提供する。上記構成によれば、複数の
LED素子を列状に配置することにより、LED素子間
で指向特性のずれが少なくなる。また、複数のLED素
子の発光光を凸レンズによって所定の広がり角を有する
光に整形して出射することにより、均一な指向特性が得
られる。
SUMMARY OF THE INVENTION In order to achieve the above object, the present invention provides a plurality of LEs arranged in a row on the surface of a substrate.
A D element and a plurality of LEs extending in a column direction of the plurality of LED elements and provided in common with the plurality of LED elements;
And a convex lens for shaping the emitted light of the D element into light having a predetermined spread angle and emitting the light. According to the above configuration, by arranging the plurality of LED elements in a row, the deviation of the directional characteristics between the LED elements is reduced. In addition, uniform directional characteristics can be obtained by shaping the emitted light of the plurality of LED elements into light having a predetermined divergence angle using a convex lens and emitting the light.

【0012】本発明は、上記目的を達成するため、絶縁
部材からなる基板と、前記基板の表面に形成された表電
極と、前記基板の裏面に形成された裏電極と、前記表電
極と前記裏電極とを接続するスルーホールめっきと、前
記表電極に接続された複数のLED素子とを備えたこと
を特徴とする側面発光型LEDランプを提供する。上記
構成によれば、表電極と裏電極とをスルーホールめっき
によって接続することにより、基板の側面に設けた金属
によって接続するのと比較して小型なものとなる。
In order to achieve the above object, the present invention provides a substrate comprising an insulating member, a front electrode formed on a surface of the substrate, a back electrode formed on a back surface of the substrate, A side-emitting LED lamp comprising: a through-hole plating for connecting to a back electrode; and a plurality of LED elements connected to the front electrode. According to the above configuration, by connecting the front electrode and the back electrode by through-hole plating, the size is reduced as compared with the case where the front electrode and the back electrode are connected by the metal provided on the side surface of the substrate.

【0013】[0013]

【発明の実施の形態】図1(a),(b)は、本発明の
第1の実施の形態に係る側面発光型LEDランプを示
す。この側面発光型LEDランプ1は、LED素子搭載
用基板2と、このLED素子搭載用基板2の表面2a
に、端面2cに直交する方向に一列に配列された赤色系
LED素子5R、緑色系LED素子5Gおよび青色系L
ED素子5Bと、LED素子5R,5G,5Bを封止す
るとともに、各LED素子5R,5G,5Bの発光光を
所定の広がり角を有する光に整形して出射する凸レンズ
(同図(a)において点線で示す。)7とを有する。
1A and 1B show a side emission type LED lamp according to a first embodiment of the present invention. The side-emitting LED lamp 1 includes an LED element mounting substrate 2 and a surface 2a of the LED element mounting substrate 2.
A red LED element 5R, a green LED element 5G and a blue LED L arranged in a line in a direction orthogonal to the end face 2c.
A convex lens that seals the ED element 5B and the LED elements 5R, 5G, and 5B, and shapes and emits light emitted from each of the LED elements 5R, 5G, and 5B into light having a predetermined spread angle (FIG. Are indicated by a dotted line).

【0014】LED素子搭載用基板2は、耐熱性の高い
材料、例えば、ガラスエポキシ樹脂やアルミナ等からな
り、表面2aには、共通電極3C、赤色用電極3R、緑
色用電極3Gおよび青色用電極3Bが形成され、その裏
面2bには、同図(b)に示すように、表面2aの赤色
用電極3R、緑色用電極3Gおよび青色用電極3Bにス
ルーホールめっき4によって接続された赤色用電極3
R、緑色用電極3Gおよび青色用電極3Bが形成されて
いる。表面2aの共通電極3Cと、裏面2bの緑色用電
極3G、赤色用電極3R、青色用電極3Bは、プリント
基板への実装を容易にするために端面2cの縁まで延在
している。なお、LED素子搭載用基板2は、表面2a
が各LED素子5R,5G,5Bの発光波長の全てに対
して高い光反射率を有するもの、例えば、白色のものを
用いるのが望ましい。これにより、発光効率が高くなる
ので、低電力化が図れる。なお、2eは基板2の上面、
2dは基板2の側面をそれぞれ示す。
The LED element mounting substrate 2 is made of a material having high heat resistance, such as glass epoxy resin or alumina, and has a common electrode 3C, a red electrode 3R, a green electrode 3G, and a blue electrode on the surface 2a. A red electrode 3R is formed on the rear surface 2b of the red electrode 3R, the green electrode 3G and the blue electrode 3B on the front surface 2a by through-hole plating 4, as shown in FIG. 3
R, a green electrode 3G and a blue electrode 3B are formed. The common electrode 3C on the front surface 2a and the green electrode 3G, the red electrode 3R, and the blue electrode 3B on the back surface 2b extend to the edge of the end surface 2c to facilitate mounting on a printed circuit board. Note that the LED element mounting substrate 2 has a surface 2a.
It is desirable to use one having high light reflectance for all of the emission wavelengths of the LED elements 5R, 5G, 5B, for example, a white one. As a result, the luminous efficiency is increased, and the power consumption can be reduced. 2e is the upper surface of the substrate 2,
2 d indicates the side surface of the substrate 2.

【0015】赤色系LED素子5Rは、約600〜70
0nmのドミナント発光波長を有す赤色系の光を発光す
るものであり、例えば、InGaAlP(インジウム・
ガリウム・アルミ・リン)系の半導体からなり、上面に
第1の電極、下面に第2の電極を備える。赤色系LED
素子5Rは、上面の第1の電極がボンディングワイヤ6
によって赤色用電極3Rに電気的に接続され、下面の第
2の電極が導電性接着剤によって共通電極3Cに電気的
および機械的に接続されている。
The red LED element 5R is about 600 to 70
It emits red light having a dominant emission wavelength of 0 nm. For example, InGaAlP (indium.
It is made of a gallium-aluminum-phosphorus-based semiconductor and has a first electrode on the upper surface and a second electrode on the lower surface. Red LED
The element 5R is such that the first electrode on the upper surface is a bonding wire 6
Is electrically connected to the red electrode 3R, and the second electrode on the lower surface is electrically and mechanically connected to the common electrode 3C by a conductive adhesive.

【0016】緑色系LED素子5Gは、約510〜58
0nmのドミナント発光波長を有す緑色系の光を発光す
るものであり、例えば、GaN(窒化ガリウム)系の半
導体からなり、上面に第1の電極と第2の電極を備え
る。緑色系LED素子5Gは、下面が接着剤によって共
通電極3Cに機械的に接続され、第1の電極がボンディ
ングワイヤ6によって緑色用電極3Gに電気的に接続さ
れ、第2の電極がボンディングワイヤ6によって共通電
極3Cに電気的に接続されている。
The green LED element 5G is about 510-58.
It emits green light having a dominant emission wavelength of 0 nm and is made of, for example, a GaN (gallium nitride) semiconductor, and has a first electrode and a second electrode on the upper surface. The green LED element 5G has a lower surface mechanically connected to the common electrode 3C with an adhesive, a first electrode electrically connected to the green electrode 3G by a bonding wire 6, and a second electrode connected to the bonding wire 6G. Is electrically connected to the common electrode 3C.

【0017】青色系LED素子5Bは、約420〜50
5nmのドミナント発光波長を有す青色系の光を発光す
るものであり、例えば、GaN(窒化ガリウム)系の半
導体からなり、上面に第1の電極と第2の電極を備え
る。青色系LED素子5Bは、下面が接着剤によって共
通電極3Cに機械的に接続され、第1の電極がボンディ
ングワイヤ6によって青色用電極3Bに電気的に接続さ
れ、第2の電極がボンディングワイヤ6によって共通電
極3Cに電気的に接続されている。
The blue LED element 5B is about 420 to 50
It emits blue light having a dominant emission wavelength of 5 nm, and is made of, for example, a GaN (gallium nitride) semiconductor and has a first electrode and a second electrode on the upper surface. The blue LED element 5B has a lower surface mechanically connected to the common electrode 3C by an adhesive, a first electrode electrically connected to the blue electrode 3B by a bonding wire 6, and a second electrode connected to the bonding electrode 6B. Is electrically connected to the common electrode 3C.

【0018】凸レンズ7は、透明のエポキシ系樹脂、あ
るいは光拡散効果を有するフィラー等を配合した半透明
のエポキシ系樹脂で構成された半円柱形状を有し、端面
2cに平行な面において、各LED素子5R,5G,5
Bに対して同一の指向特性を有する。また、凸レンズ7
は、各LED素子5R,5G,5Bの発光面より後方に
焦点を有する。これにより、各LED素子5R,5G,
5Bの発光光を拡散して出射することができる。なお、
狭い角度の光が必要な場合は、凸レンズ7の焦点が各L
ED素子5R,5G,5Bの発光面より前方に有するも
のを用いればよい。
The convex lens 7 has a semi-cylindrical shape made of a transparent epoxy resin or a translucent epoxy resin mixed with a filler having a light diffusing effect, and has a surface parallel to the end face 2c. LED elements 5R, 5G, 5
B has the same directional characteristics. Also, the convex lens 7
Has a focal point behind the light emitting surface of each of the LED elements 5R, 5G, 5B. Thereby, each LED element 5R, 5G,
The emitted light of 5B can be diffused and emitted. In addition,
When light at a narrow angle is required, the focal point of the convex lens 7 is
The ED elements 5R, 5G, and 5B may be provided in front of the light emitting surfaces.

【0019】図2は、回路構成を示す。このLEDラン
プ1は、同図に示すように、各LED素子5R,5G,
5Bの一端がコモン端子となる4端子構成を有する。す
なわち、各LED素子5R,5G,5Bのアノードは、
コモン端子15Cに接続され、各LED素子5R,5
G,5Bのカソードは、それぞれ端子15G,15R,
15Bに接続されている。各LED素子5R,5G,5
Bを同時に発光させたり、別々に発光させたり、2つを
組み合わせて発光させることにより、7種類の色を発光
させることができる。
FIG. 2 shows a circuit configuration. As shown in FIG. 1, the LED lamp 1 includes LED elements 5R, 5G,
5B has a four-terminal configuration in which one end is a common terminal. That is, the anode of each LED element 5R, 5G, 5B is
Connected to the common terminal 15C, each LED element 5R, 5
The cathodes of G and 5B are connected to terminals 15G, 15R,
15B. Each LED element 5R, 5G, 5
By causing B to emit light simultaneously, separately, or by combining the two, seven colors can be emitted.

【0020】次に、LEDランプ1の製造方法を図面を
参照して説明する。
Next, a method of manufacturing the LED lamp 1 will be described with reference to the drawings.

【0021】図3(a),(b),(c)は、多数個取
り用基板を示す。まず、同図(a)に示すように、多数
のLED素子搭載用基板2を製作するための多数個取り
用基板20を作製する。この多数個取り用基板20は、
縦にm個(例えば42個)、横にn個(例えば15個)
の計m×n個(例えば630個)のLED素子搭載用基
板2となる基板部21を有し、1つの基板部21は、例
えば、3.65×2.15mmの大きさを有し、多数個
取り用基板20全体として、例えば、68×101mm
の大きさを有する。同図(b)に示すように、基板20
の各基板部21の表面2aに、共通電極3C、赤色用電
極3R、緑色用電極3Gおよび青色用電極3Bを形成
し、同図(c)に示すように、各基板部21の裏面2b
に、赤色用電極3R、緑色用電極3Gおよび青色用電極
3Bを形成し、各基板部21の表裏の赤色用電極3R、
緑色用電極3Gおよび青色用電極3B同士をそれぞれス
ルーホールめっき4によって接続する。次に、各基板部
21に図1に示したように各LED素子5R,5G,5
Bを搭載し、各LED素子5R,5G,5B等を印刷あ
るいはトランスファモールド等の工法によって凸レンズ
7で封止した後、各基板部21を切断して分割すること
により、m×n個のLEDランプ1を製造する。
FIGS. 3A, 3B and 3C show a multi-piece substrate. First, as shown in FIG. 1A, a multi-piece substrate 20 for manufacturing a large number of LED element mounting boards 2 is manufactured. This multi-piece substrate 20
M (for example, 42) vertically and n (for example, 15) horizontally
And a total of m × n (for example, 630) substrate portions 21 serving as the LED element mounting substrates 2. One substrate portion 21 has a size of, for example, 3.65 × 2.15 mm, For example, 68 × 101 mm
It has the size of As shown in FIG.
A common electrode 3C, a red electrode 3R, a green electrode 3G, and a blue electrode 3B are formed on the front surface 2a of each of the substrate portions 21, and the back surface 2b of each of the substrate portions 21 as shown in FIG.
The electrode 3R for red, the electrode 3G for green, and the electrode 3B for blue are formed, and the electrodes 3R for red on the front and back of each substrate portion 21 are formed.
The green electrode 3G and the blue electrode 3B are connected to each other by through-hole plating 4. Next, as shown in FIG. 1, each of the LED elements 5R, 5G, 5
B is mounted, each LED element 5R, 5G, 5B, etc. is sealed with a convex lens 7 by a method such as printing or transfer molding, and then each substrate section 21 is cut and divided to obtain m × n LEDs. The lamp 1 is manufactured.

【0022】図4(a),(b)は、指向特性を示す。
このLEDランプ1は、同図(a)に示すように、水平
方向の指向特性を凸レンズ7の特性により指向角度(半
値角)θを140度と広幅化している。また、垂直方向
の指向特性には、同図(b)に示すように、凸レンズ7
の角部7aの影響によって若干変化が現れている。
FIGS. 4A and 4B show directional characteristics.
In the LED lamp 1, as shown in FIG. 1A, the directional angle (half-value angle) θ of the horizontal direction is increased to 140 degrees by the characteristics of the convex lens 7. In addition, the directional characteristics in the vertical direction include a convex lens 7 as shown in FIG.
Slightly changed due to the influence of the corner 7a.

【0023】図5(a),(b)は、本LEDランプ1
をプリント基板上に実装した状態を示す。基板2の端面
2cを下にしてプリント基板10上に載置し、共通電極
3Cと共通電極ライン11C、緑色用電極3Gと緑色用
電極ライン11G、赤色用電極3Rと赤色用電極ライン
11R、青色用電極3Bと青色用電極ライン11Bとを
ハンダ12によって各々接続する。これにより、電極ラ
イン11C,11G,11R,11B間に電流を流すこ
とにより、各LED素子5R,5G,5Bから緑色系の
光8G、赤色系の光8R、青色系の光8Bが凸レンズ7
を介してプリント基板10の表面に平行に出射される。
FIGS. 5A and 5B show the LED lamp 1 of the present invention.
On a printed circuit board. The substrate 2 is placed on the printed circuit board 10 with the end surface 2c facing down, and the common electrode 3C and the common electrode line 11C, the green electrode 3G and the green electrode line 11G, the red electrode 3R and the red electrode line 11R, and the blue color The electrode 3B for blue and the electrode line 11B for blue are connected by the solder 12 respectively. As a result, by passing a current between the electrode lines 11C, 11G, 11R, and 11B, the green light 8G, the red light 8R, and the blue light 8B from each of the LED elements 5R, 5G, and 5B are projected from the convex lens 7.
Are emitted in parallel to the surface of the printed circuit board 10 through.

【0024】上記第1の実施の形態のLEDランプ1に
よれば、各LED素子5R,5G,5Bを端面2cに直
交する方向に一列に配列しているので、LED素子間で
水平方向の指向特性のずれが少なく、液晶ディスプレイ
のバックライトとして用いた場合に、液晶ディスプレイ
における色むらを防げる。また、凸レンズ7によって各
LED素子5R,5G,5Bの発光光を整形して出射し
ているので、均一な指向特性が得られる。また、各LE
D素子5R,5G,5Bの発光面より後方に焦点を有す
る凸レンズ7を用いているので、光が広い角度で出射さ
れるため、液晶ディスプレイのバックライトとして用い
た場合に、導光板の面内に容易に均一に拡散させること
ができ、液晶ディスプレイ全体を均一に発光させること
ができる。また、基板2の表面2aと裏面2bに、電極
3C,3G,3R,3Bを形成し、表面2aと裏面2b
の電極3G,3R,3Bをスルーホールめっき4によっ
て接続するとともに、各LED素子5R,5G,5Bを
チップサイズ以下の間隔となるように、ピッチ0.5m
mで近接させて配置したので、小型・軽量化を図ること
ができる。例えば、大きさを幅3.5mm、厚み2m
m、高さ2mmと小型化でき、重さを0.018gと軽
量化できる。また、各LED素子5R,5G,5Bを近
接させたことにより、混色性が高まり、LEDランプ1
の高さを低くでき、導光板も薄型化できる。また、RG
Bの三原色の光を発光するLED素子5R,5G,5B
を搭載しているので、液晶ディスクプレイのバックライ
トとして用いた場合にディスプレイのフルカラー化を実
現できる。また、多数個取り用基板20を用いているの
で、量産性が高く、比較的安価にLEDランプを製造す
ることができる。
According to the LED lamp 1 of the first embodiment, the LED elements 5R, 5G and 5B are arranged in a line in a direction orthogonal to the end face 2c, so that the LED elements 5R, 5G and 5B are directed in a horizontal direction between the LED elements. The characteristic deviation is small, and when used as a backlight of a liquid crystal display, color unevenness in the liquid crystal display can be prevented. In addition, since the emitted light of each of the LED elements 5R, 5G, and 5B is shaped and emitted by the convex lens 7, uniform directional characteristics can be obtained. In addition, each LE
Since the convex lens 7 having a focal point behind the light-emitting surfaces of the D elements 5R, 5G, and 5B is used, light is emitted at a wide angle. The light can be easily and uniformly diffused, and the entire liquid crystal display can emit light uniformly. Also, electrodes 3C, 3G, 3R, 3B are formed on the front surface 2a and the back surface 2b of the substrate 2, and the front surface 2a and the back surface 2b are formed.
Electrodes 3G, 3R, and 3B are connected by through-hole plating 4 and the LED elements 5R, 5G, and 5B are arranged at a pitch of 0.5 m so as to have an interval equal to or less than the chip size.
Since they are arranged close to each other by m, the size and weight can be reduced. For example, the size is 3.5 mm wide and 2 m thick
m and a height of 2 mm, and a weight of 0.018 g. In addition, by bringing the LED elements 5R, 5G, and 5B close to each other, color mixing is enhanced, and the LED lamp 1
Height can be reduced, and the light guide plate can be made thin. Also, RG
LED elements 5R, 5G, 5B that emit light of three primary colors B
, So that the display can be made full color when used as a backlight for a liquid crystal display. Further, since the multi-piece substrate 20 is used, the mass productivity is high, and the LED lamp can be manufactured relatively inexpensively.

【0025】図6は、本発明の第2の実施の形態に係る
側面発光型LEDランプを示す。この第2の実施の形態
は、凸レンズ7を略半球状にしたものである。これによ
り、垂直方向の指向特性は、図4(b)に示すような大
きな変化がなくなる。
FIG. 6 shows a side emission type LED lamp according to a second embodiment of the present invention. In the second embodiment, the convex lens 7 is substantially hemispherical. As a result, the directivity in the vertical direction does not change greatly as shown in FIG.

【0026】図7は、本発明の第3の実施の形態に係る
側面発光型LEDランプを示す。この第3の実施の形態
は、凸レンズ7の角部7aに丸みを持たせたものであ
る。これにより、垂直方向の指向特性の均一化が図れ
る。
FIG. 7 shows a side emission type LED lamp according to a third embodiment of the present invention. In the third embodiment, the corner 7a of the convex lens 7 is rounded. Thereby, the directional characteristics in the vertical direction can be made uniform.

【0027】なお、上記実施の形態では、3つのLED
素子を用いた場合について説明したが、2つのLED素
子を用いた場合にも本発明を適用することができる。ま
た、上記実施の形態では、赤色系、緑色系、青色系の光
を発光するLED素子の組合せについて説明したが、3
80nm(紫色)、590nm(黄色)等の他の波長
(赤外、紫外を含む)の光を発光するLED素子を組み
合わせてもよい。また、LED素子は、上面に第1 およ
び第2の電極、上面に第1の電極、下面に第2の電極を
有するものの他、下面に第1 および第2の電極を有する
ものも用いることができる。
In the above embodiment, three LEDs are used.
Although the case where an element is used has been described, the present invention can be applied to a case where two LED elements are used. In the above-described embodiment, the combination of the LED elements that emit red, green, and blue light has been described.
LED elements that emit light of other wavelengths (including infrared and ultraviolet) such as 80 nm (purple) and 590 nm (yellow) may be combined. In addition, an LED element having first and second electrodes on an upper surface, a first electrode on an upper surface, a second electrode on a lower surface, and an LED element having first and second electrodes on a lower surface may be used. it can.

【0028】[0028]

【発明の効果】以上説明したように、本発明の側面発光
型LEDランプによれば、複数のLED素子を列状に配
置しているので、LED素子間で指向特性のずれが少な
くなり、また、複数のLED素子の発光光を凸レンズに
よって整形しているので、均一な指向特性が得られる。
また、表電極と裏電極とをスルーホールめっきによって
接続しているので、小型化が図れる。
As described above, according to the side emission type LED lamp of the present invention, since a plurality of LED elements are arranged in a row, deviation of the directivity between the LED elements is reduced, and Since the light emitted from the plurality of LED elements is shaped by the convex lens, uniform directional characteristics can be obtained.
Further, since the front electrode and the back electrode are connected by through-hole plating, downsizing can be achieved.

【図面の簡単な説明】[Brief description of the drawings]

【図1】(a)は本発明の第1の実施の形態に係る側面
発光型LEDランプを表側から見た斜視図、(b)はそ
の側面発光型LEDランプを裏側から見た斜視図
FIG. 1A is a perspective view of a side emission type LED lamp according to a first embodiment of the present invention as viewed from the front side, and FIG. 1B is a perspective view of the side emission type LED lamp as viewed from the back side.

【図2】第1の実施の形態に係る側面発光型LEDラン
プの回路構成を示す図
FIG. 2 is a diagram showing a circuit configuration of the side-emitting LED lamp according to the first embodiment.

【図3】(a)は第1の実施の形態に係る多数個取り用
基板を示す平面図、(b)は要部表面図、(c)は表側
から透視した要部裏面図
3A is a plan view showing a multi-piece substrate according to the first embodiment, FIG. 3B is a front view of a main part, and FIG. 3C is a rear view of a main part seen from the front side.

【図4】(a)は第1の実施の形態の側面発光型LED
ランプの水平方向の指向特性を示す図、(b)はその側
面発光型LEDランプの垂直方向の指向特性を示す図
FIG. 4A is a side view light emitting LED according to the first embodiment.
The figure which shows the horizontal directivity of a lamp, (b) is the figure which shows the vertical direction of the side emission type LED lamp.

【図5】(a)は第1の実施の形態の側面発光型LED
ランプの実装状態を前方から見た斜視図、(b)はその
側面発光型LEDランプの実装状態を後方から見た斜視
FIG. 5A is a side view light emitting LED according to the first embodiment.
A perspective view of the mounting state of the lamp as viewed from the front, and (b) is a perspective view of the mounting state of the side-emitting LED lamp as viewed from the rear.

【図6】本発明の第2の実施の形態に係る側面発光型L
EDランプ、およびその水平方向の指向特性を示す図
FIG. 6 is a side view light emitting type L according to a second embodiment of the present invention.
Diagram showing ED lamp and its directional characteristics in the horizontal direction

【図7】本発明の第3の実施の形態に係る側面発光型L
EDランプを示す側面図
FIG. 7 is a side view light emitting type L according to a third embodiment of the present invention.
Side view showing ED lamp

【図8】(a)は従来の側面発光型LEDランプを表側
から見た斜視図、(b)はその側面発光型LEDランプ
の実装状態を示す斜視図
FIG. 8A is a perspective view of a conventional side-emitting LED lamp as viewed from the front side, and FIG. 8B is a perspective view showing a mounting state of the side-emitting LED lamp.

【図9】従来の側面発光型LEDランプの水平方向の指
向特性を示す図
FIG. 9 is a diagram showing the directional characteristics of a conventional side emission type LED lamp in the horizontal direction.

【符号の説明】[Explanation of symbols]

1 側面発光型LEDランプ 2 LED素子搭載用基板 2a 表面 2b 裏面 2c 端面 2d 側面 2e 上面 3B 青色用電極 3C 共通電極 3G 緑色用電極 3R 赤色用電極 3a 第1の個別電極 3b 第2の個別電極 3c 共通電極 4 スルーホールめっき 4’ 接続めっき 5B 青色系LED素子 5G 緑色系LED素子 5R 赤色系LED素子 5a 第1のLED素子 5b 第2のLED素子 6 ボンディングワイヤ 7 凸レンズ 8B 青色系の光 8G 緑色系の光 8R 赤色系の光 8a 第1の色の光 8b 第2の色の光 10 プリント基板 11 配線パターン 12 ハンダ 17 モールド樹脂 15C コモン端子 15G,15R,15B 端子 20 多数個取り用基板 21 基板部 DESCRIPTION OF SYMBOLS 1 Side emission type LED lamp 2 LED element mounting board 2a Front surface 2b Back surface 2c End surface 2d Side surface 2e Top surface 3B Blue electrode 3C Common electrode 3G Green electrode 3R Red electrode 3a First individual electrode 3b Second individual electrode 3c Common electrode 4 Through-hole plating 4 'Connection plating 5B Blue LED element 5G Green LED element 5R Red LED element 5a First LED element 5b Second LED element 6 Bonding wire 7 Convex lens 8B Blue light 8G Green 8R Red light 8a Light of the first color 8b Light of the second color 10 Printed circuit board 11 Wiring pattern 12 Solder 17 Mold resin 15C Common terminal 15G, 15R, 15B terminal 20 Multi-piece substrate 21 Substrate part

Claims (9)

【特許請求の範囲】[Claims] 【請求項1】基板の表面に列状に配置された複数のLE
D素子と、 前記複数のLED素子の列方向に伸びて前記複数のLE
D素子に共通して設けられ、前記複数のLED素子の発
光光を所定の広がり角を有する光に整形して出射する凸
レンズとを備えたことを特徴とする側面発光型LEDラ
ンプ。
1. A plurality of LEs arranged in a row on a surface of a substrate.
D element; and the plurality of LEs extending in the column direction of the plurality of LED elements.
A side-emission type LED lamp, comprising: a convex lens provided in common with the D element, the emitted light of the plurality of LED elements being shaped into light having a predetermined spread angle and emitted.
【請求項2】前記凸レンズは、前記列方向に沿う略半円
柱状を有する構成の請求項1記載の側面発光型LEDラ
ンプ。
2. The side-emitting LED lamp according to claim 1, wherein the convex lens has a substantially semi-cylindrical shape along the row direction.
【請求項3】前記凸レンズは、略半球状を有する構成の
請求項1記載の側面発光型LEDランプ。
3. A side-emitting LED lamp according to claim 1, wherein said convex lens has a substantially hemispherical shape.
【請求項4】前記凸レンズは、前記複数のLED素子の
発光面より後方に焦点を有する構成の請求項1記載の側
面発光型LEDランプ。
4. The side-emitting LED lamp according to claim 1, wherein said convex lens has a focal point behind a light-emitting surface of said plurality of LED elements.
【請求項5】前記複数のLED素子は、異なる色の光を
それぞれ発光する第1、第2および第3のLED素子を
含む構成の請求項1記載の側面発光型LEDランプ。
5. The side-emitting LED lamp according to claim 1, wherein said plurality of LED elements include first, second and third LED elements respectively emitting light of different colors.
【請求項6】前記第1のLED素子は、赤色系の光を発
光する赤色系LED素子であり、 前記第2のLED素子は、緑色系の光を発光する緑色系
LED素子であり、 前記第3のLED素子は、青色系の光を発光する青色系
LED素子である構成の請求項5記載の側面発光型LE
Dランプ。
6. The first LED element is a red LED element that emits red light, and the second LED element is a green LED element that emits green light. 6. The side emission type LE according to claim 5, wherein the third LED element is a blue LED element that emits blue light.
D lamp.
【請求項7】前記基板は、前記表面に形成された表電極
と、前記表面に対向する裏面に形成された裏電極と、前
記表電極と前記裏電極とを接続するスルーホールめっき
とを備え、 前記複数のLED素子は、前記表電極に接続された構成
の請求項1記載の側面発光型LEDランプ。
7. The substrate includes a front electrode formed on the front surface, a back electrode formed on a back surface opposite to the front surface, and a through-hole plating connecting the front electrode and the back electrode. The side-emitting LED lamp according to claim 1, wherein the plurality of LED elements are connected to the front electrode.
【請求項8】絶縁部材からなる基板と、 前記基板の表面に形成された表電極と、 前記基板の裏面に形成された裏電極と、 前記表電極と前記裏電極とを接続するスルーホールめっ
きと、 前記表電極に接続された複数のLED素子とを備えたこ
とを特徴とする側面発光型LEDランプ。
8. A substrate made of an insulating member, a front electrode formed on the front surface of the substrate, a back electrode formed on the back surface of the substrate, and through-hole plating for connecting the front electrode and the back electrode. And a plurality of LED elements connected to the front electrode.
【請求項9】前記複数のLED素子は、第1の電極およ
び第2の電極を備え、 前記表電極は、前記複数のLED素子の前記第1の電極
が接続された複数の個別電極と、前記複数のLED素子
の前記第2の電極が接続された共通電極とを備え、 前記裏電極は、複数の個別電極を備え、 前記スルーホールめっきは、前記表電極の前記複数の個
別電極と前記裏電極の前記複数の個別電極とを接続する
構成の請求項8記載の側面発光型LEDランプ。
9. The plurality of LED elements include a first electrode and a second electrode, and the front electrode includes: a plurality of individual electrodes to which the first electrodes of the plurality of LED elements are connected; A common electrode to which the second electrodes of the plurality of LED elements are connected; the back electrode includes a plurality of individual electrodes; and the through-hole plating includes the plurality of individual electrodes of the front electrode and the plurality of individual electrodes. 9. The side-emitting LED lamp according to claim 8, wherein a back electrode is connected to the plurality of individual electrodes.
JP35517299A 1999-12-14 1999-12-14 Side emitting led lamp Pending JP2001177156A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP35517299A JP2001177156A (en) 1999-12-14 1999-12-14 Side emitting led lamp
KR1019990059155A KR20010064820A (en) 1999-12-14 1999-12-20 Led lamp of side surface light emitting type
TW088123055A TW448588B (en) 1999-12-14 2000-01-07 LED lamp of edge emitting type

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP35517299A JP2001177156A (en) 1999-12-14 1999-12-14 Side emitting led lamp

Publications (1)

Publication Number Publication Date
JP2001177156A true JP2001177156A (en) 2001-06-29

Family

ID=18442369

Family Applications (1)

Application Number Title Priority Date Filing Date
JP35517299A Pending JP2001177156A (en) 1999-12-14 1999-12-14 Side emitting led lamp

Country Status (3)

Country Link
JP (1) JP2001177156A (en)
KR (1) KR20010064820A (en)
TW (1) TW448588B (en)

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003234507A (en) * 2002-02-07 2003-08-22 Koha Co Ltd Side emission type led lamp
JP2004342781A (en) * 2003-05-14 2004-12-02 Nichia Chem Ind Ltd Light emitting device and display unit
JP2005045199A (en) * 2003-07-25 2005-02-17 Seoul Semiconductor Co Ltd Chip light emitting diode and its manufacturing method
US6883934B2 (en) 2000-07-13 2005-04-26 Seiko Epson Corporation Light source device, illumination device liquid crystal device and electronic apparatus
KR100586966B1 (en) 2004-05-27 2006-06-08 삼성전기주식회사 Back light module
JP2006229055A (en) * 2005-02-18 2006-08-31 Nichia Chem Ind Ltd Light-emitting device
JP2006286608A (en) * 2005-03-07 2006-10-19 Nichia Chem Ind Ltd Planar illumination light source and planar illumination device
US7128453B2 (en) 2003-02-13 2006-10-31 Koito Manufacturing Co., Ltd. Vehicular headlamp
JP2007173787A (en) * 2005-12-21 2007-07-05 Samsung Electro Mech Co Ltd Led package and backlight unit using the same
WO2008099784A1 (en) * 2007-02-15 2008-08-21 Panasonic Electric Works Co., Ltd. Led package and structure for mounting three-dimensional circuit component
JP2008198891A (en) * 2007-02-15 2008-08-28 Matsushita Electric Works Ltd Led package
JP2008205266A (en) * 2007-02-21 2008-09-04 Matsushita Electric Works Ltd Led package
JP2009135136A (en) * 2007-11-28 2009-06-18 Stanley Electric Co Ltd Semiconductor light emitting device and lighting device
US8558446B2 (en) 2005-02-18 2013-10-15 Nichia Corporation Light emitting device provided with lens for controlling light distribution characteristic
KR20140097901A (en) * 2013-01-30 2014-08-07 엘지이노텍 주식회사 Light Emitting Device
JP2014150292A (en) * 2014-05-29 2014-08-21 Mitsubishi Electric Corp Light-emitting device
JP2014239073A (en) * 2006-03-21 2014-12-18 株式会社半導体エネルギー研究所 Liquid crystal display device
JP2016171217A (en) * 2015-03-13 2016-09-23 シチズン電子株式会社 Lateral face mounting type light-emitting device
JPWO2015182272A1 (en) * 2014-05-30 2017-04-20 シャープ株式会社 Light emitting device
JP2019083350A (en) * 2019-03-04 2019-05-30 ローム株式会社 LED module
US11705541B2 (en) 2019-04-26 2023-07-18 Nichia Corporation Light-emitting device and light-emitting module

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4369668B2 (en) 2003-02-13 2009-11-25 株式会社小糸製作所 Vehicle headlamp
KR100644684B1 (en) * 2005-02-26 2006-11-14 삼성전자주식회사 Linear side emitter and back light system and liquid display apparatus employing it
KR100600404B1 (en) * 2005-06-22 2006-07-18 엘지전자 주식회사 Light emitting diode package of side view type and fabricating method thereof
CN102324456A (en) * 2011-06-22 2012-01-18 浙江英特来光电科技有限公司 A kind of high-power LED encapsulation structure
KR101484915B1 (en) * 2013-11-27 2015-01-23 케이알에코스타 주식회사 Rgb led package and a transparent light emitting apparatus using thereof

Cited By (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6883934B2 (en) 2000-07-13 2005-04-26 Seiko Epson Corporation Light source device, illumination device liquid crystal device and electronic apparatus
JP2003234507A (en) * 2002-02-07 2003-08-22 Koha Co Ltd Side emission type led lamp
US7128453B2 (en) 2003-02-13 2006-10-31 Koito Manufacturing Co., Ltd. Vehicular headlamp
JP2004342781A (en) * 2003-05-14 2004-12-02 Nichia Chem Ind Ltd Light emitting device and display unit
JP2007235182A (en) * 2003-07-25 2007-09-13 Seoul Semiconductor Co Ltd Chip light emitting diode
JP2005045199A (en) * 2003-07-25 2005-02-17 Seoul Semiconductor Co Ltd Chip light emitting diode and its manufacturing method
USRE42112E1 (en) 2003-07-25 2011-02-08 Seoul Semiconductor Co., Ltd. Chip light emitting diode and fabrication method thereof
KR100586966B1 (en) 2004-05-27 2006-06-08 삼성전기주식회사 Back light module
US8836210B2 (en) 2005-02-18 2014-09-16 Nichia Corporation Light emitting device provided with lens for controlling light distribution characteristic
US9093619B2 (en) 2005-02-18 2015-07-28 Nichia Corporation Light emitting device provided with lens for controlling light distribution characteristic
TWI419375B (en) * 2005-02-18 2013-12-11 Nichia Corp Light emitting device provided with lens for controlling light distribution characteristic
JP2006229055A (en) * 2005-02-18 2006-08-31 Nichia Chem Ind Ltd Light-emitting device
US8558446B2 (en) 2005-02-18 2013-10-15 Nichia Corporation Light emitting device provided with lens for controlling light distribution characteristic
JP2006286608A (en) * 2005-03-07 2006-10-19 Nichia Chem Ind Ltd Planar illumination light source and planar illumination device
JP2007173787A (en) * 2005-12-21 2007-07-05 Samsung Electro Mech Co Ltd Led package and backlight unit using the same
US8197090B2 (en) 2005-12-21 2012-06-12 Samsung Led Co., Ltd. LED package and backlight unit using the same
JP2014239073A (en) * 2006-03-21 2014-12-18 株式会社半導体エネルギー研究所 Liquid crystal display device
JP4582100B2 (en) * 2007-02-15 2010-11-17 パナソニック電工株式会社 LED package
JP2008198891A (en) * 2007-02-15 2008-08-28 Matsushita Electric Works Ltd Led package
WO2008099784A1 (en) * 2007-02-15 2008-08-21 Panasonic Electric Works Co., Ltd. Led package and structure for mounting three-dimensional circuit component
JP4687665B2 (en) * 2007-02-21 2011-05-25 パナソニック電工株式会社 LED package
JP2008205266A (en) * 2007-02-21 2008-09-04 Matsushita Electric Works Ltd Led package
JP2009135136A (en) * 2007-11-28 2009-06-18 Stanley Electric Co Ltd Semiconductor light emitting device and lighting device
KR102019830B1 (en) * 2013-01-30 2019-09-09 엘지이노텍 주식회사 Light Emitting Device
KR20140097901A (en) * 2013-01-30 2014-08-07 엘지이노텍 주식회사 Light Emitting Device
JP2014150292A (en) * 2014-05-29 2014-08-21 Mitsubishi Electric Corp Light-emitting device
JPWO2015182272A1 (en) * 2014-05-30 2017-04-20 シャープ株式会社 Light emitting device
US9818731B2 (en) 2014-05-30 2017-11-14 Sharp Kabushiki Kaisha Light emitting device
JP2016171217A (en) * 2015-03-13 2016-09-23 シチズン電子株式会社 Lateral face mounting type light-emitting device
JP2019083350A (en) * 2019-03-04 2019-05-30 ローム株式会社 LED module
US11705541B2 (en) 2019-04-26 2023-07-18 Nichia Corporation Light-emitting device and light-emitting module

Also Published As

Publication number Publication date
KR20010064820A (en) 2001-07-11
TW448588B (en) 2001-08-01

Similar Documents

Publication Publication Date Title
JP2001177156A (en) Side emitting led lamp
KR100851194B1 (en) light emitting apparatus and manufacture method thereof, backlight apparatus
US6834977B2 (en) Light emitting device
KR100421688B1 (en) Full-color Light Source Unit
JP4757477B2 (en) Light source unit, illumination device using the same, and display device using the same
US8395178B2 (en) Light emitting device package and method of fabricating the same
US20180233492A1 (en) Triangular-combination led circuit board, triangular led device and display
US20080123367A1 (en) Light source unit for use in a backlight module
JPH1098215A (en) Light-emitting diode device
KR20050105838A (en) Light emitting diode array module and backlight unit using the same
JPH05304318A (en) Led array board
KR20080027601A (en) Light emitting device
US7375384B2 (en) Side structure of a bare LED and backlight module thereof
JP5209969B2 (en) Lighting system
JP3829582B2 (en) Light emitting device
JPH10284757A (en) Light-emitting diode device
JPH10242523A (en) Light emitting diode display device and picture display device utilizing the same
CN211826815U (en) LED packaging light-emitting module and backlight assembly
JP2003234507A (en) Side emission type led lamp
JP2002232015A (en) Semiconductor light emitting device
CN211957678U (en) LED lamp bead, LED module and LED display screen
JP2009099881A (en) Light-emitting device, and light-emitting module and backlight device using the device
KR101006658B1 (en) Luminous device mounting substrate, luminous device mounting package, and planar light source device
JP2002368280A (en) Light-emitting diode
CN217086564U (en) LED lamp bead, LED display module and LED display screen

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20051129

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20080807

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20080812

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20081209