JP2001144225A - Electronic part module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a small and highly reliable electronic part module exhibiting excellent heat dissipation properties. SOLUTION: A molded board 8 has a plurality of conductive plates 32 buried in a synthetic resin sealed part 31 wherein a bend 46 is formed in a specified conductive plate 32. An IGBT 18 is mounted on the upper surface of the bend 46 and an exposed part 47 is provided on the rear side of the IGBT 18. Since a thicker and narrower conductive plate 32 can be used as compared with a copper foil pattern, size of a device is reduced. Since the electrical joint of the IGBT 18 is resin sealed, reliability is enhanced. Furthermore, heat dissipation properties are enhanced because heat generated from the IGBT 18 is dissipated through the exposed part 47 to the outside of the sealed part 31.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component module in which a conductive plate is embedded in a sealing portion made of resin.

[0002]

The present applicant has filed an application for an electronic component module in which an electronic component is mounted on a conductive plate, wire-bonded, and then the conductive plate and the electronic component are sealed with resin. In the case of this configuration, a thicker and narrower conductive plate can be used as compared with the copper foil pattern, so that the device is downsized. In addition, since the electrical connection portion of the electronic component is sealed with resin, the reliability is improved. However, since heat generated in the electronic component is hardly released to the outside, there is room for improvement in heat dissipation.

[0003] The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a small, highly reliable electronic component module having excellent heat dissipation.

[0004]

According to a first aspect of the present invention, there is provided an electronic component module comprising: a conductive plate on which an electronic component is mounted; and a resin sealing portion for sealing the conductive plate and the electronic component. It is characterized in that an exposed portion exposed to the outside through one surface of the sealing portion is provided on the back side of the electronic component in the conductive plate.

According to a second aspect of the present invention, there is provided an electronic component module comprising: a conductive plate on which an electronic component is mounted; a resin sealing portion for sealing the conductive plate and the electronic component; A heat transfer member having a contact portion in contact with the back side of the electronic component in the conductive plate, wherein an exposed portion exposed to the outside through one surface of the sealing portion is provided on the back side of the contact portion in the heat transfer member. It has a characteristic where it is used.

According to a third aspect of the present invention, there is provided an electronic component module, comprising: a conductive plate on which an electronic component is mounted; a resin-made sealing portion for sealing the conductive plate and the electronic component; A heat transfer member having a proximity portion in a non-contact state close to the back side of the electronic component in the conductive plate, wherein the exposed portion exposed to the outside through one surface of the sealing portion is the proximity portion of the heat transfer member. The feature is that it is provided on the back side of.

According to the first to third aspects, a thicker and narrower conductive plate can be used as compared with the copper foil pattern, so that the apparatus can be downsized. In addition, since the current loop is reduced, noise is reduced. Further, the electrical connection portion of the electronic component is sealed with resin, so that the reliability is improved.
Further, heat generated in the electronic component is released to the outside through the exposed portion of the conductive plate (claim 1), and is released from the conductive plate to the outside through the exposed portion of the heat transfer member (claim 2).
3) The heat dissipation of the electronic component is improved.

The electronic component module according to the fourth aspect is characterized in that the conductive plate is formed of copper and the heat transfer member is formed of aluminum. According to the fourth aspect, the heat generated in the electronic component is radiated to the outside through copper and aluminum having high thermal conductivity, so that the heat dissipation of the electronic component is further enhanced.

The electronic component module according to the fifth aspect is characterized in that a heat radiating member is provided on one surface of a sealing portion with an insulating member interposed therebetween. According to the fifth aspect of the present invention, heat generated in the electronic component is radiated from the insulating member to the outside through the heat radiating member, so that the heat radiating property of the electronic component is further enhanced and the insulation between the electronic component and the heat radiating member is further improved. Nature is secured.

The electronic component module according to the present invention is characterized in that a heat radiating member is directly provided on one surface of the sealing portion. According to the sixth aspect, the heat generated in the electronic component is released to the outside through the heat radiation member, so that the heat radiation of the electronic component is further enhanced. In addition, since there is no need to interpose an insulating member between the heat transfer member and the heat radiation member, the configuration is simplified.

An electronic component module according to a seventh aspect is characterized in that the heat transfer member is formed of aluminum nitride. According to the measure of claim 7,
For example, even when the heat radiating member is directly mounted on one surface of the sealing portion, the heat radiating member and the electronic component are insulated from each other through the heat transfer member, so that the insulating member is not required and the configuration is simplified. .

The electronic component module according to the present invention is characterized in that the insulating member is formed of silicon rubber. According to the means of claim 8, the degree of adhesion of the heat radiating member to the insulating member is increased. For this reason, heat generated in the electronic component is efficiently transmitted from the insulating member to the heat radiating member, so that the heat radiating property of the electronic component is further improved.

The electronic component module according to the ninth aspect is characterized in that the exposed portion of the conductive plate has a step with respect to other portions of the conductive plate. An electronic component module according to a tenth aspect is characterized in that a portion of the conductive plate that contacts the heat transfer member has a step relative to other portions of the conductive plate. An electronic component module according to an eleventh aspect is characterized in that a portion of the conductive plate close to the heat transfer member has a step relative to other portions of the conductive plate. According to the ninth to eleventh aspects, it is not necessary to expose the conductive plate or the heat transfer member to the outside of the sealing portion based on locally reducing the thickness of the sealing portion.
For this reason, since the thickness of the sealing portion can be made uniform, warpage or the like during molding of the sealing portion can be suppressed.

An electronic component module according to claim 12 is
When the heat transfer member is housed in the mold for resin sealing, the heat transfer member is provided with an opening that is fitted to the protrusion of the mold. According to the twelfth aspect, the heat transfer member is held in a state of being in contact with or close to the conductive plate when the sealing portion is formed, so that the heat dissipating property of the electronic component is reduced due to the displacement of the heat transfer member. Is prevented.

[0015]

FIG. 1 shows a first embodiment of the present invention.
A description will be given with reference to FIG. First, in FIG.
The cabinet 1 has a rectangular box shape with an open front surface, and a cooking chamber 2 is formed in the cabinet 1. A door 3 is rotatably mounted at a front end of the cooking chamber 2, and a front opening of the cooking chamber 2 is opened and closed based on a rotation operation of the door 3.

An operation panel 4 is fixed to the front end of the cabinet 1 on the right side of the cooking chamber 2. The operation panel 4 is located in the cabinet 1 behind the operation panel 4.
(See FIG. 3). The machine room 5 is adjacent to the right side of the cooking room 2, and a magnetron 6 (see FIG. 4) is disposed in the machine room 5.

As shown in FIG. 3, a magnetron drive circuit module 7 corresponding to an electronic component module is disposed in the machine room 5. The magnetron drive circuit module 7 has a magnetron drive circuit 9 mounted on a molded substrate 8. A drive power is supplied to the magnetron 6 from a commercial AC power supply 10 (see FIG. 4) through the magnetron drive circuit 9. Hereinafter, the magnetron drive circuit 9 and the molded substrate 8 will be described in detail.

<Regarding the Magnetron Driving Circuit 9> Both input terminals of the rectifying circuit 11 are connected to both terminals of the commercial AC power supply 10, as shown in FIG. This rectifier circuit 1
Reference numeral 1 denotes a bridge connection of four rectifier diodes 12, and a noise prevention capacitor 13 is connected between both input terminals of the rectifier circuit 11. The rectifier circuit 11
Is connected to one terminal of the choke coil 14, and the other terminal of the choke coil 14 is connected to the output terminal (−) of the rectifier circuit 11 via a series circuit of two resonance capacitors 15. Have been.

A smoothing capacitor 16 and an inverter circuit 17 are connected between both output terminals of the rectifier circuit 11. This inverter circuit 17 includes two IGBTs 18 and 2
And flywheel diodes 19, each of which is an IGBT.
18 are connected in anti-parallel between the collector terminal and the emitter terminal.

A common connection point between the two IGBTs 18 is connected to one terminal of a primary coil 21 of the step-up transformer 20, and a common connection point between the two resonance capacitors 15 is connected to the other terminal of the primary coil 21. ing. The step-up transformer 20 is formed by winding a primary coil 21, a secondary coil 23, and a heater coil 24 around a bobbin 22 (see FIG. 3) made of a synthetic resin. The resonance circuit 25 is configured.

A high voltage circuit 26 is connected to both terminals of the secondary coil 23.
Is connected. This high voltage circuit 26 is a secondary coil 23
A high-voltage diode 27 connected between the two terminals of the high-voltage diode 27; a high-voltage capacitor 28 interposed between the anode terminal of the high-voltage diode 27 and one terminal of the secondary coil 23; The cathode terminal of the high-voltage diode 27 is grounded to the bottom plate 30 of the cabinet 1 (see FIG. 3), and the other terminal of the secondary coil 23 is connected to the high-voltage diode 2.
7 is connected between the cathode terminal 7 and the bottom plate 30.

Both terminals of the heater coil 24 are connected to both cathode terminals of the magnetron 6, as shown in FIG. The cathode of the magnetron 6 also serves as a heater, and the anode terminal of the magnetron 6 is grounded to the bottom plate 30 of the cabinet 1. The rectifier diodes 12, the IGBTs 18, the flywheel diodes 19, and the high-voltage diodes 27 correspond to electronic components, and are composed of semiconductor bare chips.

<Regarding the Molded Substrate 8> As shown in FIG. 2, the molded substrate 8 is formed by embedding a plurality of elongated conductive plates 32 in a rectangular plate-shaped sealing portion 31. Part 3
1 is formed based on injecting an epoxy resin into a mold (not shown). In addition, a plurality of conductive plates 3
Reference numeral 2 denotes a circuit pattern 33 for electrically connecting the rectifier circuit 11 to the high-voltage resistor 29, which is formed by pressing a copper plate.

As shown in FIG. 3, on the lower surface of the sealing portion 31, cylindrical bosses 34 are integrally formed at four corners (only two bosses are shown). Screws 35 are screwed into the inner peripheral surface of each of the bosses 34 from below through the bottom plate 30 of the cabinet 1.
Is fixed to the upper surface of the bottom plate 30 with the fastening force of Further, an insulating barrier 36 is integrally formed on the upper surface of the sealing portion 31. The insulating barrier 36 is formed in a flat plate shape extending in the front-rear direction.
7 and a low pressure region 38 in the right half.

The bobbin 22 of the step-up transformer 20 is formed with two through holes (not shown), and a screw 39 is inserted into each through hole from above. Also, the sealing portion 31
Has two screw holes 40 formed in the high-pressure area 37. The step-up transformer 20 tightens the lower end of each screw 39 into the screw hole 40 so that the high-pressure It is fixed in the area 37.

As shown in FIG. 2, a plurality of through holes 41 are formed in the molded substrate 8. Each of these through holes 41
As shown in FIG. 1, a circular terminal hole 42 formed in the conductive plate 32, a tapered hole 43 penetrating the upper half of the sealing part 31, and a penetrating lower part of the sealing part 31 Tapered hole 44
A plurality of lead terminals 45 (only one is shown) of the step-up transformer 20 are inserted into the plurality of through holes 41 from above, and the step-up transformer 20 connects the plurality of lead terminals 45 to the plurality of lead terminals 45. It is electrically connected to the conductive plate 32 (circuit pattern 33) based on soldering to the peripheral portion of the terminal hole 42.

On the upper surface of the sealing portion 31, as shown in FIG.
3, choke coil 14, two resonance capacitors 15,
The smoothing capacitor 16 is mounted, and the high voltage capacitor 28 and the high voltage resistor 29 are mounted in the high voltage region 37 (the mounting state of the choke coil 14, the high voltage capacitor 28, and the high voltage resistor 29 is not shown). The plurality of lead terminals 45 of the noise prevention capacitor 13 to the high voltage resistor 29
Are inserted into the plurality of through holes 41 from above, and the noise prevention capacitor 13 to the high voltage resistor 29 are connected to the circuit pattern 33 based on soldering the plurality of lead terminals 45 to the peripheral portions of the plurality of terminal holes 42. It is electrically connected.

As shown in FIG. 2, a bent portion 46 is formed on a plurality of predetermined conductive plates 32. As shown in FIG. 1, each of the bent portions 46 has a step below the remaining portion of the conductive plate 32.
The entire lower surface of 6 functions as an exposed portion 47 that is exposed to the outside through the lower surface of the sealing portion 31. In addition, each exposed part 47 is arranged on the same horizontal plane as the lower surface of the sealing part 31.

As shown in FIG. 2, 4
Two rectifier diodes 12, two IGBTs 18, two flywheel diodes 19, and a high-voltage diode 27 are embedded. These four rectifier diodes 12 to high-voltage diodes 27 are mounted on the upper surface of the bent portion 46, and are wire-bonded to the conductive plate 32 as shown as one IGBT 18 in FIG. Is electrically connected to the circuit pattern 33 in the sealing portion 31 based on

As shown in FIG. 3, the predetermined conductive plate 32 is formed with an earth connection portion 48 protruding outside the sealing portion 31. The ground connection portion 48 is provided on the predetermined conductive plate 3.
2 is formed by bending, and is grounded by being screwed to the bottom plate 30 of the cabinet 1. In addition, as shown in FIG.
The cathode terminal of the high voltage diode 27 is grounded to the bottom plate 30.

As shown in FIG. 3, the heat radiating member 5 is provided on the lower surface of the sealing portion 31 through an insulating member 49 made of silicon rubber.
0 is screwed. The former insulating member 49 has a flat plate shape, and each exposed portion 47 is in close contact with the upper surface of the insulating member 49 as shown in FIG. The latter heat-dissipating member 50 has a flat base 51 and a plurality of heat-dissipating fins 52 extending in the front-rear direction. The lower surface of the insulating member 49 is in close contact with the upper surface of the base 51. The heat radiation member 50 is formed based on extrusion molding of aluminum. The magnetron drive circuit module 7 is configured as described above.

A control circuit board (not shown) composed of a printed wiring board is provided in the machine room 5, and a control device (not shown) is mounted on the control circuit board. This control device has a microcomputer, a gate drive circuit, and the like, and changes the voltage and current generated in the primary coil 21 of the step-up transformer 20 based on switching control of the two IGBTs 18 to heat the magnetron 6. Control the output.

Next, a method of manufacturing the magnetron drive circuit module 7 will be described.

(1) Four rectifier diodes 12, two IGBTs 18, two flywheel diodes 19,
One high voltage diode 27 is mounted on the upper surface of the bent portion 46 and wire-bonded to a predetermined conductive plate 32. In this state, a plurality of conductive plates 32 are connected to a plurality of connecting bars (not shown).
And is connected to a single plate through the first plate, and this single plate is referred to as a frame plate.

(2) The frame plate is positioned and stored in the molding die based on being sandwiched between a movable die and a fixed die (both not shown). Then, the molded substrate 8 is molded based on the injection of the epoxy resin into the molding die, and the molded substrate 8 is removed from the molding die.

(3) The molded substrate 8 is set in a press device (not shown), and the frame plate is pressed. Then, the plurality of connecting bars are cut at once, and the frame plate is separated into the plurality of conductive plates 32.

(4) Noise prevention capacitor 13, choke coil 14, resonance capacitor 15, smoothing capacitor 1
6. Insert the plurality of lead terminals 45 of the high voltage capacitor 28 and the high voltage resistor 29 into the plurality of through holes 41 of the molded board 8. At the same time, the plurality of lead terminals 45 of the step-up transformer 20 are inserted into the plurality of through holes 41, and the step-up transformer 20
Is screwed to the sealing portion 31.

(5) The molded substrate 8 is put into a solder bath (not shown), and each lead terminal 45 is soldered to a peripheral portion of the terminal hole 42 in the solder bath.

According to the first embodiment, the internal electronic components such as the IGBT 18 are mounted on the conductive plate 32. For this reason, the conductive plate 32, which is thicker and narrower than the copper foil pattern, can be used, so that the magnetron drive circuit module 7 is downsized. In addition, since the current loop is reduced, noise is reduced. In recent years, in order to improve the merchantability of microwave ovens,
The volume ratio of the cooking chamber 2 tends to increase. For this reason, since the machine room 5 is small, there is a great merit in downsizing the magnetron drive circuit module 7.

The IGBT 18 and the like are embedded in the sealing portion 31. For this reason, the electrical connection portion such as the IGBT 18 is sealed with resin, so that the electrical reliability is improved. The exposed portion 4 is provided on the back side of the IGBT 18 or the like in the conductive plate 32.
7 was provided. For this reason, the heat generated in the IGBT 18 and the like is released to the outside of the sealing portion 31 through the exposed portion 47, so that the heat dissipation of the IGBT 18 and the like is improved.

A conductive plate 32 made of copper was used. Therefore, heat generated in the IGBT 18 or the like is released to the outside through copper having a high thermal conductivity, so that the heat dissipation of the IGBT 18 or the like is further improved. In addition, since the lead terminals 45 of external electronic components such as the noise prevention capacitor 13 can be inserted into the terminal holes 42 and soldered, productivity is improved.

Further, the lead terminal 45 of the IGBT 18 or the like was inserted into the through hole 41 of the molded substrate 8 from the upper surface side. For this reason, the plurality of lead terminals 45 can be soldered to the plurality of conductive plates 32 from the lower surface all at once based on the injection of the molded substrate 8 into the solder bath, so that the manufacturing workability is improved.

Since the heat radiating member 50 is mounted on the lower surface of the sealing portion 31 via the insulating member 49, the heat generated in the IGBT 18 and the like is radiated to the outside through the insulating member 49 and the heat radiating member 50. Therefore, the heat dissipation of the IGBT 18 and the like is further improved, and the insulation between the IGBT 18 and the like and the heat dissipation member 50 is ensured.

Since the insulating member 49 made of silicon rubber is used, the degree of adhesion of the exposed portion 47 to the insulating member 49 and the degree of adhesion of the heat radiating member 50 to the insulating member 49 are increased. For this reason, heat generated in the IGBT 18 and the like is efficiently transmitted from the exposed portion 47 to the heat radiating member 50 through the insulating member 49, so that the heat radiation of the IGBT 18 and the like is further improved.

Further, since a step is formed between the exposed portion 47 of the conductive plate 32 and the other portion of the conductive plate 32, the conductive plate 32 is formed on the basis of the local thinning of the sealing portion 31. There is no need to provide the exposed portion 47. For this reason, since the thickness of the sealing portion 31 can be made uniform, warpage or the like during molding of the sealing portion 31 can be suppressed. In addition, the distance between the mounting portion such as the IGBT 18 and the other conductive plate 32 becomes longer, so that the
The insulating property with respect to another conductive plate 32 such as the BT 18 is improved.

Next, a second embodiment of the present invention will be described with reference to FIGS.
It will be described based on. As shown in FIG. 6, a plurality of heat transfer members 53 are embedded in the sealing portion 31 (only one is shown). Each of the heat transfer members 53 is formed of aluminum as a material, and each heat transfer member 53 is exposed to the outside through the contact portion 54 that is in close contact with the lower surface of the bent portion 46 and the lower surface of the sealing portion 31. A part 55 is provided. Each of these exposed portions 55 is arranged on the same horizontal plane as the lower surface of the sealing portion 31 and is in close contact with the upper surface of the insulating member 49.

As shown in FIG. 7, each heat transfer member 53 has
A plurality of positioning holes 56 are formed (only one is shown). Each of the positioning holes 56 corresponds to an opening. When the sealing portion 31 is formed, the plurality of positioning holes 56 are fitted to the outer peripheral surfaces of the plurality of positioning pins 58 (only one is shown) of the molding die 57. Heat transfer member 5
Position 3 In this state, the frame plate is housed in the molding die 57, and the sealing portion 31 is molded based on the injection of the epoxy resin. Each positioning pin 58 corresponds to a projection of the molding die 57.

According to the second embodiment, the contact portion 54 of the electric heating member 53 is brought into contact with the back side of the IGBT 18 or the like of the conductive plate 32, and the exposed portion 55 is provided on the back side of the contact portion 54 of the heat transfer member 53. Was. For this reason, heat generated in the IGBT 18 and the like is released from the conductive plate 32 to the outside through the exposed portion 55 of the heat transfer member 53, so that the heat dissipation of the IGBT 18 and the like is improved.

Since the insulating member 49 made of silicon rubber is used, the degree of adhesion of the exposed portion 55 of the heat transfer member 53 to the insulating member 49 and the degree of adhesion of the heat radiating member 50 to the insulating member 49 are increased. Therefore, heat generated in the IGBT 18 or the like is transmitted from the exposed portion 55 through the insulating member 49 to the heat radiating member 5.
Since it is efficiently transmitted to 0, the heat dissipation of the IGBT 18 and the like is further enhanced.

Further, since a step is formed between the portion of the conductive plate 32 that contacts the contact portion 54 of the heat transfer member 53 and the other portion of the conductive plate 32, the sealing portion 31 is locally thinned. Therefore, it is not necessary to expose the exposed portion 55 of the heat transfer member 53 to the outside of the sealing portion 31 based on the formation. For this reason,
Since the thickness of the sealing portion 31 can be made uniform, warpage during molding of the sealing portion 31 can be suppressed. In addition, since the separation distance between the mounting portion such as the IGBT 18 and the other conductive plate 32 is increased, the insulating property with respect to another conductive plate 32 such as the IGBT 18 is improved.

A positioning hole 56 was provided in the heat transfer member 53, and the positioning hole 56 was fitted to a positioning pin 58 of a molding die 57. Therefore, when the sealing portion 31 is formed, the heat transfer member 5 is formed.
3 is prevented from being displaced with respect to the conductive plate 32,
Since the heat transfer member 53 is kept in contact with the conductive plate 32, it is possible to prevent the heat dissipation from being deteriorated due to the displacement of the heat transfer member 53.

In the first and second embodiments, the insulating member 49 made of silicon rubber is used. However, the present invention is not limited to this. For example, an insulating member made of natural rubber or an insulating member made of ceramic is used. A member may be used.

Next, a third embodiment of the present invention will be described with reference to FIG. Each heat transfer member 53 is provided with a proximity portion 59 which is adjacent to the lower surface of the bent portion 46 via a gap. Also,
The heat radiating member 50 is directly screwed to the lower surface of the sealing portion 31, and the exposed portion 55 of each heat transfer member 53 is
0 base 51.

According to the third embodiment, the adjacent portion 59 of the heat transfer member 53 is made to approach the back side of the IGBT 18 or the like in the conductive plate 32 in a non-contact state.
The exposed part 55 was provided on the back side of the. For this reason, IGBT18
Since the heat generated in the IGBT 18 and the like is released to the outside from the conductive plate 32 through the exposed portion 55 of the heat transfer member 53, the heat dissipation of the IGBT 18 and the like is improved.

Further, the heat radiating member 50 was directly mounted on the lower surface of the sealing portion 31. Therefore, there is no need to interpose the insulating member 49 between the heat transfer member 53 and the heat radiating member 50, so that the configuration is simplified.

In the second and third embodiments, the heat transfer member 53 made of aluminum is used. However, the present invention is not limited to this. For example, a heat transfer member made of aluminum nitride may be used. good. This heat transfer member has both high heat conductivity and insulating properties.
When a heat transfer member made of aluminum nitride is used in the embodiment, the heat radiating member 50 can be brought into direct contact with the lower surface of the sealing portion 31 without the interposition of the insulating member 49. Further, when a heat transfer member made of aluminum nitride is used in the third embodiment, the insulation between the IGBT 18 and the like and the heat dissipation member 50 is improved.

In the second and third embodiments, a plurality of positioning holes 56 are formed in the heat transfer member 53. However, the present invention is not limited to this. The heat transfer member 53 may be positioned with respect to the molding die 57 based on fitting of the plurality of positioning pins 58 of the molding die 57 into the plurality of depressions.

In the first to third embodiments, the inverter circuit 17 is connected to the two IGBTs 18 and 2
The resonance circuit 25 is composed of two resonance capacitors 15 and the primary coil 2.
The inverter circuit 17 is composed of one IGBT 18 and one flywheel diode 19, as shown in FIG. 9 showing a fourth embodiment of the present invention. , The resonance circuit 25 may be composed of one resonance capacitor 15 and the primary coil 21.

In the first to fourth embodiments, a plurality of conductive plates 32 are formed by pressing a copper plate. However, the present invention is not limited to this. For example, the copper plate is etched. Based on this, a plurality of conductive plates 32 may be formed.

In the first to fourth embodiments, the rectifier diode 12, the IGBT 18, the flywheel diode 19, and the high-voltage diode 27 are embedded in the sealing portion 31, but the present invention is not limited to this. For example, at least one of the rectifier diode 12, the IGBT 18, the flywheel diode 19, and the high-voltage diode 27
The electronic components may be embedded in the sealing portion 31, and the remaining electronic components may be mounted on the upper surface of the sealing portion 31.

In the first to fourth embodiments, the noise prevention capacitor 13, the choke coil 14, the resonance capacitor 15, the smoothing capacitor 16, the high voltage capacitor 28, and the high voltage resistor 29 are mounted on the upper surface of the sealing portion 31. However, the present invention is not limited to this. For example, the noise prevention capacitor 13, the choke coil 14, the resonance capacitor 1
5, At least one electronic component among the smoothing capacitor 16, the high-voltage capacitor 28, and the high-voltage resistor 29 may be mounted on the upper surface of the sealing portion 31, and the remaining electronic components may be embedded in the sealing portion 31.

In the first to fourth embodiments, the present invention is applied to the magnetron drive circuit module 7 for driving the magnetron 6 of the microwave oven. However, the present invention is not limited to this. The present invention may be applied to a coil drive circuit module for driving a heating coil, a motor drive circuit module for rotationally driving a main motor of a washing machine, and the like.

[0063]

As is clear from the above description, the electronic component module of the present invention has the following effects. According to the first to third aspects of the present invention, the electronic component is mounted on the conductive plate, and the electronic component and the conductive plate are sealed with a resin, so that the device is downsized and the reliability is improved. In addition, since the exposed portion is provided on the conductive plate (claim 1) and the exposed portion is provided on the heat transfer member (claims 2 and 3), the heat dissipation of the electronic component is enhanced.

According to the fourth aspect of the present invention, since the conductive plate made of copper and the heat transfer member made of aluminum are used, the heat radiation of the electronic component is further enhanced. According to the means of claim 5, since the heat radiating member is provided on one surface of the sealing portion with the insulating member interposed therebetween, the heat radiating property of the electronic component is further enhanced, and the insulating property between the electronic component and the heat radiating member is improved. Secured.

According to the sixth aspect of the present invention, since the heat radiating member is directly provided on one surface of the sealing portion, the heat radiating property of the electronic component is further improved, and the structure is simplified. According to the seventh aspect of the present invention, since the heat transfer member made of aluminum nitride is used, the heat transfer member and the electronic component are insulated even when the heat transfer member is directly mounted on one surface of the sealing portion. . According to the means of claim 8, since the insulating member made of silicon rubber is used, heat generated in the electronic component is efficiently transmitted from the insulating member to the heat radiating member, and the heat radiating property of the electronic component is further enhanced.

According to the measures described in claims 9 to 11,
A step may be provided between the exposed portion of the conductive plate and another portion (claim 9), or a step may be provided between a portion of the conductive plate that contacts the heat transfer member and another portion (claim 10). ), A step is provided between a portion of the conductive plate close to the heat transfer member and another portion (claim 11). For this reason, since the thickness of the sealing portion can be made uniform, warpage or the like during molding of the sealing portion can be suppressed.
According to the twelfth aspect, the opening of the heat transfer member is fitted to the projection of the mold. For this reason, the heat transfer member is kept in contact with or in close proximity to the conductive plate when the sealing portion is formed, so that the heat dissipation of the electronic component is prevented from being reduced due to the displacement of the heat transfer member.

[Brief description of the drawings]

FIG. 1 is a view showing a first embodiment of the present invention (a longitudinal front view of a molded substrate showing a mounted state of electronic components).

FIG. 2 is a perspective view showing a molded substrate.

FIG. 3 is a front view showing the electronic component module.

FIG. 4 is a diagram showing an electrical connection state;

FIG. 5 is a perspective view showing the appearance of a microwave oven.

FIG. 6 is a view corresponding to FIG. 1, showing a second embodiment of the present invention.

FIG. 7 is a sectional view showing a state in which the heat transfer member is housed in a molding die.

FIG. 8 is a view corresponding to FIG. 1, showing a third embodiment of the present invention.

FIG. 9 is a view corresponding to FIG. 4, showing a fourth embodiment of the present invention.

[Explanation of symbols]

7 is a magnetron drive circuit module (electronic component module), 12 is a rectifier diode (electronic component), 18 is I
GBT (electronic parts), 19 is a flywheel diode (electronic part), 27 is a high-voltage diode (electronic part), 3
1 is a sealing portion, 32 is a conductive plate, 47 is an exposed portion, 49 is an insulating member, 50 is a heat radiating member, 53 is a heat transfer member, 54 is a contact portion, 55 is an exposed portion, and 56 is a positioning hole (opening). , 57
Indicates a molding die, 58 indicates a positioning pin (projection), and 59 indicates an adjacent portion.

Claims (12)

[Claims] A conductive plate on which an electronic component is mounted; and a resin sealing portion for sealing the conductive plate and the electronic component. An electronic component module, comprising: an exposed portion that is exposed to the outside through one surface of a sealing portion. 2. A conductive plate on which an electronic component is mounted; a resin sealing portion for sealing the conductive plate and the electronic component; and the electronic component of the conductive plate embedded in the sealing portion. A heat transfer member having a contact portion that contacts the back side of the heat transfer member, wherein, on the back side of the contact portion of the heat transfer member, an exposed portion that is exposed to the outside through one surface of the sealing portion is provided. Electronic component module featuring. 3. A conductive plate on which an electronic component is mounted; a resin sealing portion for sealing the conductive plate and the electronic component; and the electronic component embedded in the sealing portion, the electronic component being included in the conductive plate. A heat transfer member having a proximity portion that is close to the back side of the heat transfer member in a non-contact state, and an exposed portion that is exposed to the outside through one surface of the sealing portion is provided on the back side of the proximity portion of the heat transfer member. An electronic component module, comprising: 4. The electronic component module according to claim 2, wherein the conductive plate is made of copper, and the heat transfer member is made of aluminum. 5. A heat dissipating member is provided on one surface of the sealing portion via an insulating member.
Electronic component module according to any one of the above. 6. The electronic component module according to claim 3, wherein a heat radiation member is directly provided on one surface of the sealing portion. 7. The electronic component module according to claim 2, wherein the heat transfer member is made of aluminum nitride. 8. The electronic component module according to claim 5, wherein the insulating member is formed of silicon rubber. 9. The electronic component module according to claim 1, wherein the exposed portion of the conductive plate has a step with respect to other portions of the conductive plate. 10. The electronic component module according to claim 2, wherein a portion of the conductive plate that contacts the heat transfer member has a step relative to other portions of the conductive plate. 11. The electronic component module according to claim 3, wherein a portion of the conductive plate close to the heat transfer member has a step relative to other portions of the conductive plate. 12. The heat transfer member is provided with an opening that is fitted into a protrusion of the molding die when the heat transmission member is housed in a molding die for resin sealing. The electronic component module according to claim 2.