JP2000233936A - Glass cutting device - Google Patents
Glass cutting deviceInfo
- Publication number
- JP2000233936A JP2000233936A JP3254699A JP3254699A JP2000233936A JP 2000233936 A JP2000233936 A JP 2000233936A JP 3254699 A JP3254699 A JP 3254699A JP 3254699 A JP3254699 A JP 3254699A JP 2000233936 A JP2000233936 A JP 2000233936A
- Authority
- JP
- Japan
- Prior art keywords
- glass
- nozzle
- glass plate
- glass cutting
- refrigerant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/10—Glass-cutting tools, e.g. scoring tools
- C03B33/102—Glass-cutting tools, e.g. scoring tools involving a focussed radiation beam, e.g. lasers
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Optics & Photonics (AREA)
- Toxicology (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Thermal Sciences (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、レーザー光の照射
によってガラス板を分割するガラス切断装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a glass cutting apparatus for dividing a glass plate by irradiating a laser beam.
【0002】[0002]
【従来の技術】この種の装置としてPCT特許第WO93
/20015号(特表平8-509947)の「非金属材料の分割」が
あり、図1を用いて簡単に述べる。矢印の方向に移動す
るガラス板1に対して、レーザー照射を行う光学系2に
より長円のレーザービームスポット3が照射され、その
ビームスポット3後方の部位(冷却部位)4に対して、ノ
ズル5によって冷媒ジェットが吹き付けられる。このよ
うにレーザー照射により過熱された部位が次に急速冷却
されることにより、ガラス内部に熱歪(応力)が生じてガ
ラス板1がレーザー照射のラインQに沿って分断する。2. Description of the Related Art PCT Patent No. WO 93
/ 20015 (Tokuhyo Hei 8-509947) entitled "Division of non-metallic materials", which will be briefly described with reference to FIG. The glass plate 1 moving in the direction of the arrow is irradiated with an elliptical laser beam spot 3 by an optical system 2 for irradiating a laser, and a portion (cooling portion) 4 behind the beam spot 3 is Blows a refrigerant jet. When the portion heated by the laser irradiation is rapidly cooled next, thermal distortion (stress) is generated inside the glass, and the glass plate 1 is divided along the laser irradiation line Q.
【0003】[0003]
【発明が解決しようとする課題】大きな熱歪(応力)を発
生させるには、ビームスポット3の後端縁から冷却部位
4の前端縁までの間隔lには最適位置がある。しかしな
がらその傾きを大きくすれば、飛散した水ジェットが加
熱部位へ流れ込むようになり、レーザー照射による加熱
を妨げた。In order to generate a large thermal strain (stress), there is an optimum position in the interval l from the rear edge of the beam spot 3 to the front edge of the cooling portion 4. However, when the inclination was increased, the scattered water jet flowed into the heated area, which prevented heating by laser irradiation.
【0004】従って本発明は、ビームスポットと冷却部
位とを接近させても加熱部位に冷媒が流れ込むことのな
いノズルを備えたガラス切断装置を提供することを目的
とする。Accordingly, an object of the present invention is to provide a glass cutting apparatus provided with a nozzle that does not allow a coolant to flow into a heating portion even when a beam spot and a cooling portion are brought close to each other.
【0005】[0005]
【課題を解決するための手段】本発明の第1態様は、請
求項1にあるように、一方向に移動するガラス板に対し
てレーザービームを照射して加熱し、その加熱部位の下
流側においてノズルを用いて冷媒を吹き付け急速冷却す
ることでガラス板を分断するガラス切断装置において、
前記ノズルのガラス板に対する吹き付け角度θ1をガラ
ス板の移動方向に対し75°〜120°とする。According to a first aspect of the present invention, a glass plate moving in one direction is heated by irradiating a laser beam to a glass plate moving in one direction, and the glass plate is moved downstream of the heated portion. In a glass cutting device that cuts a glass plate by spraying a coolant using a nozzle and rapidly cooling it,
The spray angle θ1 of the nozzle with respect to the glass plate is set to 75 ° to 120 ° with respect to the moving direction of the glass plate.
【0006】本発明の第2態様は、請求項7にあるよう
に、一方向に移動するガラス板に対してレーザービーム
を照射して加熱し、その加熱部位の下流側においてノズ
ルを用いて冷媒を吹き付け急速冷却することでガラス板
を分断するガラス切断装置において、前記ノズルを上記
分断のライン両側にそれぞれ設ける。According to a second aspect of the present invention, a glass plate moving in one direction is heated by irradiating a laser beam to the glass plate, and a coolant is provided downstream of the heated portion by using a nozzle. In a glass cutting apparatus for dividing a glass plate by spraying and rapidly cooling, the nozzles are provided on both sides of the dividing line.
【0007】[0007]
【発明の実施の形態】図2は本発明の第1態様を示して
おり、1本のノズル5を用いている。そのノズル5は、
図1の場合と同様に、光学系2とガラス板1の移動方向
(X方向)に一列に並ぶ。そしてノズル5は、随意の支点
を中心に傾動自在に設けられ、ガラス板上のX方向に対
する吹き付け角度θ1が75°〜120°の範囲に保持
される。ノズル5の設置角度がこの範囲内であれば、吹
き付けた冷媒ジェットが加熱部位における加熱に悪影響
を及ぼさないことがわかった。FIG. 2 shows a first embodiment of the present invention, in which one nozzle 5 is used. The nozzle 5
As in the case of FIG. 1, the moving direction of the optical system 2 and the glass plate 1
(X direction). The nozzle 5 is provided so as to be tiltable about an arbitrary fulcrum, and the spray angle θ1 with respect to the X direction on the glass plate is maintained in a range of 75 ° to 120 °. It was found that when the installation angle of the nozzle 5 was within this range, the sprayed refrigerant jet did not adversely affect the heating at the heating site.
【0008】このノズル5の保持機構としては、以下に
示すように最多で5軸までの多軸移動機構を具備するた
め、最初にその5軸における軸相互の関係を図3に示
す。ガラス板1の加工時の移動方向となるX軸移動、X
軸移動とワーク面上で直交するY軸移動、ガラス板1の
表面に鉛直のZ軸移動、Y軸を回転軸の軸中心とするY
(θ)移動およびZ軸を回転軸の軸中心とするZ(θ)移動
の計5要素がある。As a holding mechanism for the nozzle 5, a multi-axis moving mechanism of up to five axes as shown below is provided. First, the mutual relationship among the five axes is shown in FIG. X-axis movement, which is the movement direction when processing the glass plate 1, X
Y-axis movement orthogonal to the axis movement on the work surface, Z-axis movement perpendicular to the surface of the glass plate 1, Y with the Y-axis as the axis center of the rotation axis
There are a total of five elements: (θ) movement and Z (θ) movement with the Z axis as the axis of the rotation axis.
【0009】図4は、この第1態様における第1実施形
態を示した正面図である。加工時、ガラス板1はX方向
に移動し、光学系2の下流側に適した保持部材11が立
設されており、その下端に円盤12がY(θ)移動可能
に、即ち、この紙面を回転面にして回転可能に設けられ
る。この円盤12の所定部にはノズル5が固定されてい
る。前述の保持部材11を所定の位置にセットすること
で、図1にある距離l(ビームスポット3の後端縁から
冷却部位4の前端縁までの間隔)およびノズル先端から
ガラス面までの間隔を調整する。この第1実施形態は、
Y(θ)移動の1移動要素を持つ。FIG. 4 is a front view showing the first embodiment in the first mode. At the time of processing, the glass plate 1 moves in the X direction, and a suitable holding member 11 is provided on the downstream side of the optical system 2, and the disk 12 is movable at the lower end thereof by Y (θ). Is provided so as to be rotatable as a rotation surface. The nozzle 5 is fixed to a predetermined portion of the disk 12. By setting the holding member 11 at a predetermined position, the distance l (the distance from the rear edge of the beam spot 3 to the front edge of the cooling portion 4) and the distance from the nozzle tip to the glass surface shown in FIG. adjust. In the first embodiment,
It has one movement element of Y (θ) movement.
【0010】図5は、この第1態様における第2実施形
態を示した正面図であり、図4と同一の要素については
同一の符号を付している。前述の保持部材11の下端に
X方向に移動自在のX方向移動機構13を設け、このX
方向移動部材13の所定部に、ノズル5を固定した円盤
12がY(θ)移動可能に設けられる。このX方向移動機
構13の移動によって前述の距離lを自在に設定でき
る。この第2実施形態は、Y(θ)移動、X移動の2移動
要素を持つ。FIG. 5 is a front view showing a second embodiment in the first mode, and the same elements as those in FIG. 4 are denoted by the same reference numerals. An X-direction moving mechanism 13 is provided at the lower end of the holding member 11 so as to be movable in the X direction.
A disk 12 to which the nozzle 5 is fixed is provided at a predetermined portion of the direction moving member 13 so as to be movable by Y (θ). The distance l can be set freely by moving the X-direction moving mechanism 13. The second embodiment has two moving elements of Y (θ) movement and X movement.
【0011】図6は、この第1態様における第3実施形
態を示した正面図であり、図7にその側面図を示す。こ
の第3実施形態は、図5に対して、保持部材11とX方
向移動機構13との間にZ軸移動機構14を介在させた
ものであり、このZ軸移動機構14の移動によって、ノ
ズル先端からガラス面までの間隔を調整できる。この第
3実施形態は、Y(θ)移動、X移動、Z移動の3移動要
素を持つ。FIG. 6 is a front view showing a third embodiment in the first mode, and FIG. 7 is a side view thereof. In the third embodiment, the Z-axis moving mechanism 14 is interposed between the holding member 11 and the X-direction moving mechanism 13 with respect to FIG. The distance from the tip to the glass surface can be adjusted. The third embodiment has three moving elements of Y (θ) movement, X movement, and Z movement.
【0012】図8は、この第1態様における第4実施形
態を示した正面図であり、図9にその側面図を示す。こ
の第4実施形態は、図6に対して、Z軸移動機構14と
X軸移動機構13との間にY軸移動機構15を介在させ
たものであり、このY軸移動機構15の移動によって、
図1に示したレーザー照射のラインQの直上にノズル5
のノズル口を位置させることができる。この第4実施形
態は、Y(θ)移動、X移動、Z移動、Y移動の4移動要
素を持つ。FIG. 8 is a front view showing a fourth embodiment of the first aspect, and FIG. 9 is a side view thereof. The fourth embodiment is different from FIG. 6 in that a Y-axis moving mechanism 15 is interposed between a Z-axis moving mechanism 14 and an X-axis moving mechanism 13. ,
The nozzle 5 is located immediately above the laser irradiation line Q shown in FIG.
Nozzle port can be located. The fourth embodiment has four movement elements of Y (θ) movement, X movement, Z movement, and Y movement.
【0013】図10は、この第1態様における第5実施
形態を示した正面図であり、図11にその側面図を示
す。この第5実施形態は、X軸移動機構13に対して円
盤12をZ(θ)移動させるZ(θ)移動機構16を備えて
おり、このZ(θ)移動機構16の移動によって、レーザ
ー照射のラインQの直上にノズル5のノズル口を位置さ
せることができる。この第5実施形態は、Y(θ)移動、
X移動、Z移動、Y移動、Z(θ)移動の5移動要素を持
つ。FIG. 10 is a front view showing a fifth embodiment of the first aspect, and FIG. 11 is a side view thereof. The fifth embodiment includes a Z (θ) moving mechanism 16 for moving the disk 12 by Z (θ) with respect to the X-axis moving mechanism 13, and the laser irradiation is performed by the movement of the Z (θ) moving mechanism 16. The nozzle port of the nozzle 5 can be located directly above the line Q of the above. In the fifth embodiment, Y (θ) movement,
It has five movement elements of X movement, Z movement, Y movement, and Z (θ) movement.
【0014】図12は本発明の第2態様の第1実施形態
を示した斜視図であり、ノズルを5、5’のごとく2台
用いている。これらのノズル5、5’は、レーザー照射
のラインQを境として両側方から冷媒ジェットを吹き付
けるように設置される。ガラス面に対するノズル5、
5’の吹き付け角度θ2、θ2’は互いに等しく、30
°〜85°の範囲である。図13上方から眺めた図であ
り、上方から眺めたときの、両ノズル5、5’のなす角
度θ3(下流側でなす角度)は、図14に示すように、3
0°〜330°の広範囲にできる。FIG. 12 is a perspective view showing a first embodiment of the second aspect of the present invention, in which two nozzles such as 5, 5 'are used. These nozzles 5, 5 'are installed so as to blow a coolant jet from both sides with respect to a laser irradiation line Q. Nozzle 5 for glass surface
The spray angles θ2 and θ2 ′ of 5 ′ are equal to each other, and
° to 85 °. FIG. 13 is a diagram viewed from above, and when viewed from above, the angle θ3 between the nozzles 5 and 5 ′ (the angle formed on the downstream side) is 3 as shown in FIG.
A wide range of 0 ° to 330 ° is possible.
【0015】図14で示したように、ノズル5、5’
は、光学系2の上流側(図中上側)に設置することも可能
となり、かつ各冷媒ジェットが互いに打ち消されて下流
に向かって流れるため、上述の間隔lをより小さくして
も上述したビームスポット領域に流れ込むことはない。As shown in FIG. 14, the nozzles 5, 5 '
Can be installed on the upstream side (upper side in the figure) of the optical system 2, and since the respective coolant jets are canceled each other and flow downstream, the above-described beam is obtained even if the above-mentioned interval l is made smaller. It does not flow into the spot area.
【0016】この実施形態で用いたノズル5、5’の保
持機構としては、図4〜図11で示したいずれかの機構
および図4〜図9にZ(θ)移動機構を付加したいずれか
の機構を採用できる。又、ノズル5、5’を随意の角度
に手動で設定する機構として、図15のごときボール球
21を用いた首振り自在の機構22も使用できる。As a holding mechanism of the nozzles 5, 5 'used in this embodiment, any of the mechanisms shown in FIGS. 4 to 11 and any of the FIGS. 4 to 9 in which a Z (θ) moving mechanism is added. Mechanism can be adopted. As a mechanism for manually setting the nozzles 5 and 5 'to an arbitrary angle, a swingable mechanism 22 using a ball ball 21 as shown in FIG. 15 can also be used.
【0017】図16は、本発明の第2態様の第2実施形
態を示した斜視図であり、ノズル5とノズル5’とで冷
媒ジェットの吹き付け量に差を持たせることによって冷
媒吹き付け条件に差を持たせている。これにより、レー
ザー照射ラインQの両側で冷却速度が異なる結果、形成
される垂直クラックが一方に傾くようになり、閉曲線に
沿った領域の切り取りに適する。冷媒吹き付け条件に差
を持たせる別の手法としては、冷媒の温度、冷却能力(c
al/min)、単位時間当たりの質量流量(kg/min)などがあ
り、こうした条件に差を持たせることにより、レーザー
照射ラインQの両側で冷却速度が異なる結果、傾斜した
垂直クラックの形成および閉曲線に沿った領域の切り取
りに適する。FIG. 16 is a perspective view showing a second embodiment of the second aspect of the present invention. The difference in the amount of the refrigerant jet sprayed between the nozzle 5 and the nozzle 5 'allows the refrigerant spray condition to be adjusted. There is a difference. As a result, the cooling rates differ on both sides of the laser irradiation line Q, so that the formed vertical cracks are inclined to one side, which is suitable for cutting out a region along a closed curve. Another technique for providing a difference in the refrigerant spraying conditions is the temperature of the refrigerant, the cooling capacity (c
al / min), mass flow rate per unit time (kg / min), etc., and by making these conditions different, the cooling rate is different on both sides of the laser irradiation line Q, resulting in the formation of inclined vertical cracks and Suitable for cutting out areas along closed curves.
【0018】図17は、本発明の第2態様の第3実施形
態を示した斜視図であり、両ノズル5、5’の吹き付け
角度θ2、θ2’を互いに異ならせることによって設置
条件を互いに異ならせたものであり、この場合もレーザ
ー照射ラインQの両側で冷却速度が異なる結果、傾斜し
た垂直クラックの形成および閉曲線に沿った領域の切り
取りに適する。設置条件を互いに異ならせる別の手法と
しては、図13において、両ノズル5、5'のなす角度
θ3において、照射ラインQに対するそれぞれの角度θ
3a、θ3bを互いに異ならせてもよい。又、この設置条
件を互いに異ならせることと、上述の吹き付け条件に差
を持たせるととを併用することもできる。FIG. 17 is a perspective view showing a third embodiment of the second aspect of the present invention, in which the spraying angles θ2, θ2 ′ of the nozzles 5, 5 ′ are different from each other so that the installation conditions are different. In this case, too, the cooling rates are different on both sides of the laser irradiation line Q, so that it is suitable for forming inclined vertical cracks and cutting out a region along a closed curve. As another method for making the installation conditions different from each other, in FIG. 13, at the angle θ3 formed by the two nozzles 5 and 5 ′, the respective angles θ with respect to the irradiation line Q
3a and θ3b may be different from each other. Further, it is also possible to use both different installation conditions and different spraying conditions described above.
【0019】本発明の第2態様における第4実施形態で
は、一方のノズル5から冷媒ジェットを吹き付け、その
冷媒ジェットが例えば下流側に導けるように、他方のノ
ズル5’からエアーを吹き付けている。この構成によれ
ば、冷媒ジェットの使用量を低減できる。冷媒としては
水と気体の混合物ジェットの他に窒素、炭酸ガス、ヘリ
ウムなどの不活性ガスであってもよい。In the fourth embodiment according to the second aspect of the present invention, a coolant jet is blown from one nozzle 5, and air is blown from the other nozzle 5 'so that the coolant jet can be guided, for example, downstream. According to this configuration, the usage amount of the refrigerant jet can be reduced. The refrigerant may be an inert gas such as nitrogen, carbon dioxide, helium or the like in addition to the jet of a mixture of water and gas.
【0020】[0020]
【発明の効果】以上説明したように、本発明の第1態様
では、ノズルの吹き付け角度をガラス板の移動方向に対
し75°〜120°としており、ノズルの吹き付け角度
がこの範囲内であれば、吹き付けた冷媒ジェットが加熱
部位における加熱に悪影響を及ぼすことはない。本発明
の第2態様では、ノズルを分断ラインの両側にそれぞれ
設け、一方のノズルからの冷媒の流れを他方のノズルか
らの冷媒流で制御するか、もしくは打ち消すようにした
ので、冷媒の加熱部位へ流れ込みをなくせる。As described above, according to the first aspect of the present invention, the spray angle of the nozzle is set to 75 ° to 120 ° with respect to the moving direction of the glass plate. In addition, the sprayed refrigerant jet does not adversely affect the heating at the heating portion. In the second aspect of the present invention, the nozzles are provided on both sides of the dividing line, and the flow of the refrigerant from one nozzle is controlled by the flow of the refrigerant from the other nozzle, or is canceled. Eliminates inflow.
【図1】 レーザー照射を用いた従来のガラス切断法を
示した図FIG. 1 is a diagram showing a conventional glass cutting method using laser irradiation.
【図2】 本発明の第1態様を示したガラス切断装置の
図FIG. 2 is a view of a glass cutting apparatus showing a first embodiment of the present invention.
【図3】 5軸移動機構における軸相互の関係を示した
図FIG. 3 is a diagram showing a relationship between axes in a five-axis moving mechanism.
【図4】 第1態様の第1実施形態を示したガラス切断
装置の正面図FIG. 4 is a front view of the glass cutting apparatus showing the first embodiment of the first aspect.
【図5】 第1態様の第2実施形態を示したガラス切断
装置の正面図FIG. 5 is a front view of a glass cutting device showing a second embodiment of the first aspect.
【図6】 第1態様の第3実施形態を示したガラス切断
装置の正面図FIG. 6 is a front view of a glass cutting device showing a third embodiment of the first aspect.
【図7】 第1態様の第3実施形態を示したガラス切断
装置の側面図FIG. 7 is a side view of a glass cutting device showing a third embodiment of the first aspect.
【図8】 第1態様の第4実施形態を示したガラス切断
装置の正面図FIG. 8 is a front view of a glass cutting device showing a fourth embodiment of the first aspect.
【図9】 第1態様の第4実施形態を示したガラス切断
装置の側面図FIG. 9 is a side view of a glass cutting device showing a fourth embodiment of the first aspect.
【図10】 第1態様の第5実施形態を示したガラス切
断装置の正面図FIG. 10 is a front view of a glass cutting device showing a fifth embodiment of the first aspect.
【図11】 第1態様の第5実施形態を示したガラス切
断装置の側面図FIG. 11 is a side view of a glass cutting device showing a fifth embodiment of the first aspect.
【図12】 本発明の第2態様の第1実施形態を示した
ガラス切断装置の図FIG. 12 is a view of a glass cutting apparatus showing a first embodiment of a second aspect of the present invention.
【図13】 図12のガラス切断装置を上方から眺めた
図FIG. 13 is a view of the glass cutting apparatus of FIG. 12 as viewed from above.
【図14】 図13における角度θ3の角度範囲を示し
た図14 is a diagram showing an angle range of an angle θ3 in FIG.
【図15】 本第2態様におけるノズルの保持機構を示
した図FIG. 15 is a diagram showing a nozzle holding mechanism according to the second embodiment.
【図16】 本発明の第2態様の第2実施形態を示した
ガラス切断装置の図FIG. 16 is a view of a glass cutting apparatus showing a second embodiment of the second aspect of the present invention.
【図17】 本発明の第2態様の第3実施形態を示した
ガラス切断装置の図FIG. 17 is a view of a glass cutting apparatus showing a third embodiment of the second aspect of the present invention.
1 ガラス板 2 光学系 3 ビームスポット 4 冷却部位 5 ノズル 11 保持部材 12 円盤 13 X方向移動機構 14 Z軸移動機構 15 Y軸移動機構 16 Z(θ)移動機構 Q レーザー照射ライン DESCRIPTION OF SYMBOLS 1 Glass plate 2 Optical system 3 Beam spot 4 Cooling part 5 Nozzle 11 Holding member 12 Disk 13 X-direction moving mechanism 14 Z-axis moving mechanism 15 Y-axis moving mechanism 16 Z (θ) moving mechanism Q Laser irradiation line
───────────────────────────────────────────────────── フロントページの続き (72)発明者 原口 博壮 大阪府摂津市香露園14番7号 三星ダイヤ モンド工業株式会社内 (72)発明者 松本 真人 大阪府摂津市香露園14番7号 三星ダイヤ モンド工業株式会社内 Fターム(参考) 4G015 FA06 FB01 FC04 FC11 FC14 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Hiroso Haraguchi 14-7 Koroen, Settsu-shi, Osaka Samsung Diamond Industry Co., Ltd. (72) Inventor Masato Matsumoto 14-7 Koroen, Settsu-shi, Osaka Samsung Diamond Monde 4G015 FA06 FB01 FC04 FC11 FC14
Claims (14)
ザービームを照射して加熱し、その加熱部位の下流側に
おいてノズルを用いて冷媒を吹き付け急速冷却すること
でガラス板を分断するガラス切断装置において、 前記ノズルのガラス板に対する吹き付け角度θ1をガラ
ス板の移動方向に対し75°〜120°としたことを特
徴とするガラス切断装置。1. A glass cutting machine that irradiates a glass plate moving in one direction with a laser beam and heats it, and blows a coolant using a nozzle at a downstream side of the heated portion to rapidly cool the glass plate to cut the glass plate. In the apparatus, the spray angle θ1 of the nozzle to the glass plate is set to 75 ° to 120 ° with respect to the moving direction of the glass plate.
しくは傾動自在とする1軸移動回動機構を備えた請求項
1記載のガラス切断装置。2. The glass cutting apparatus according to claim 1, further comprising a one-axis moving / rotating mechanism that allows the nozzle to rotate or tilt about a fulcrum.
記載のガラス切断装置。3. The apparatus according to claim 2, further comprising a one-axis moving / rotating mechanism.
The glass cutting apparatus according to the above.
記載のガラス切断装置。4. The apparatus according to claim 2, further comprising a two-axis moving / rotating mechanism.
The glass cutting apparatus according to the above.
記載のガラス切断装置。5. The apparatus according to claim 2, further comprising a three-axis moving / rotating mechanism.
The glass cutting apparatus according to the above.
記載のガラス切断装置。6. The apparatus according to claim 2, further comprising a four-axis moving / rotating mechanism.
The glass cutting apparatus according to the above.
ザービームを照射して加熱し、その加熱部位の下流側に
おいてノズルを用いて冷媒を吹き付け急速冷却すること
でガラス板を分断するガラス切断装置において、 前記ノズルを上記分断のライン両側にそれぞれ設けたこ
とを特徴とするガラス切断装置。7. A glass cutting device that irradiates a glass plate moving in one direction with a laser beam and heats it, and blows a coolant using a nozzle at a downstream side of the heated portion to rapidly cool the glass plate, thereby cutting the glass plate. In the apparatus, the nozzle is provided on both sides of the dividing line, respectively.
角度θ2を30〜85°とし、上方から見たときの両冷
却ノズルがなす角度θ3を30°〜330°とした請求
項7記載のガラス切断装置。8. The glass cutting apparatus according to claim 7, wherein the spray angle θ2 of the nozzle with respect to the glass plate is 30 to 85 °, and the angle θ3 between the two cooling nozzles when viewed from above is 30 ° to 330 °. .
を持たせるか、および/または設置条件を互いに異なら
せてガラス板を分断する請求項8記載のガラス切断装
置。9. The glass cutting apparatus according to claim 8, wherein the glass sheet is divided by providing different conditions for spraying the refrigerant between the two nozzles and / or by setting different installation conditions.
載のガラス切断装置。10. The glass cutting apparatus according to claim 9, wherein the dividing line is a closed curve.
方のノズルからエアーを吹き付け、前記冷媒を所定の方
向に導く請求項8記載のガラス切断装置。11. The glass cutting apparatus according to claim 8, wherein a coolant is blown from one nozzle and air is blown from the other nozzle to guide the coolant in a predetermined direction.
ーザービームを照射して加熱し、その加熱部位の下流側
においてノズルを用いて冷媒を吹き付け急速冷却するこ
とでガラス板を分断するガラス切断方法において、 前記ノズルを前記分断のライン両側にそれぞれ設け、前
記ノズルのガラス板に対する吹き付け角度θ2を30°
〜85°とし、前記両ノズルにおける冷媒吹き付けの条
件に差を持たせるか、および/または設置条件を互いに
異ならせることにより、傾斜した垂直クラックを生じさ
せることを特徴とするガラス切断方法。12. A glass cutting machine which irradiates a laser beam onto a glass plate moving in one direction and heats it, and blows a coolant using a nozzle at a downstream side of the heated portion to rapidly cool the glass plate, thereby cutting the glass plate. In the method, the nozzles are provided on both sides of the dividing line, respectively, and a spray angle θ2 of the nozzles with respect to a glass plate is set to 30 °.
A glass cutting method, characterized in that inclined vertical cracks are generated by setting a difference in the condition of spraying the refrigerant between the two nozzles and / or setting different installation conditions.
混合物である請求項1〜11のいずれかに記載のガラス
切断装置。13. The glass cutting apparatus according to claim 1, wherein the refrigerant is a gas or a mixture of a gas and a liquid.
混合物である請求項12記載のガラス切断方法。14. The glass cutting method according to claim 12, wherein the refrigerant is a gas or a mixture of a gas and a liquid.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3254699A JP2000233936A (en) | 1999-02-10 | 1999-02-10 | Glass cutting device |
TW89108417A TW474901B (en) | 1999-02-10 | 2000-05-03 | Glass cutting method and device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3254699A JP2000233936A (en) | 1999-02-10 | 1999-02-10 | Glass cutting device |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2000233936A true JP2000233936A (en) | 2000-08-29 |
JP2000233936A5 JP2000233936A5 (en) | 2005-06-16 |
Family
ID=12361943
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3254699A Pending JP2000233936A (en) | 1999-02-10 | 1999-02-10 | Glass cutting device |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP2000233936A (en) |
TW (1) | TW474901B (en) |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100381165B1 (en) * | 2000-12-01 | 2003-04-26 | 엘지전자 주식회사 | A Glass Cutting Device and a Method |
KR100400059B1 (en) * | 2000-10-10 | 2003-09-29 | 삼성전자주식회사 | Apparatus and method for cutting non-metal substrate |
WO2004014625A1 (en) * | 2002-08-09 | 2004-02-19 | Mitsuboshi Diamond Industrial Co.,Ltd. | Method and device for scribing fragile material substrate |
EP1733837A1 (en) * | 2005-06-13 | 2006-12-20 | Jenoptik Automatisierungstechnik GmbH | Apparatus for separating a flat workpiece made of a brittle material by means of a laser |
KR100673073B1 (en) * | 2000-10-21 | 2007-01-22 | 삼성전자주식회사 | Method and Apparatus for cutting non-metal substrate using a laser beam |
KR100676249B1 (en) * | 2001-05-23 | 2007-01-30 | 삼성전자주식회사 | Coolant for cutting substrate and method for cutting using the same and apparatus for performing the same |
JP2010150068A (en) * | 2008-12-25 | 2010-07-08 | Mitsuboshi Diamond Industrial Co Ltd | Method for breaking brittle material substrate |
KR101016157B1 (en) * | 2002-08-21 | 2011-02-17 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | Method of breaking a brittle substrate |
CN102643017A (en) * | 2011-03-14 | 2012-08-22 | 京东方科技集团股份有限公司 | Non-contact type breaking method and equipment and method and equipment for cutting and breaking |
WO2015098641A1 (en) * | 2013-12-27 | 2015-07-02 | 旭硝子株式会社 | Glass plate, and glass plate processing method |
WO2016156233A1 (en) * | 2015-03-27 | 2016-10-06 | Schott Ag | Method and device for the continuous cutting of glass |
KR20200002108A (en) * | 2018-06-29 | 2020-01-08 | (주)에이치아이티오토모티브 | Heat treatment apparatus for small material |
CN112894359A (en) * | 2021-01-05 | 2021-06-04 | 中国人民解放军陆军装甲兵学院 | Jet cutting method and system thereof |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI426058B (en) * | 2009-11-06 | 2014-02-11 | Metal Ind Res Anddevelopment Ct | Non-linear cutting method |
CN106186656B (en) * | 2016-07-05 | 2018-09-04 | 温州大学 | A kind of laser cutting method of tempered glass |
-
1999
- 1999-02-10 JP JP3254699A patent/JP2000233936A/en active Pending
-
2000
- 2000-05-03 TW TW89108417A patent/TW474901B/en not_active IP Right Cessation
Cited By (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100400059B1 (en) * | 2000-10-10 | 2003-09-29 | 삼성전자주식회사 | Apparatus and method for cutting non-metal substrate |
KR100673073B1 (en) * | 2000-10-21 | 2007-01-22 | 삼성전자주식회사 | Method and Apparatus for cutting non-metal substrate using a laser beam |
KR100381165B1 (en) * | 2000-12-01 | 2003-04-26 | 엘지전자 주식회사 | A Glass Cutting Device and a Method |
KR100676249B1 (en) * | 2001-05-23 | 2007-01-30 | 삼성전자주식회사 | Coolant for cutting substrate and method for cutting using the same and apparatus for performing the same |
WO2004014625A1 (en) * | 2002-08-09 | 2004-02-19 | Mitsuboshi Diamond Industrial Co.,Ltd. | Method and device for scribing fragile material substrate |
CN1298523C (en) * | 2002-08-09 | 2007-02-07 | 三星钻石工业股份有限公司 | Method and device for scribing fragile material substrate |
KR101016157B1 (en) * | 2002-08-21 | 2011-02-17 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | Method of breaking a brittle substrate |
EP1733837A1 (en) * | 2005-06-13 | 2006-12-20 | Jenoptik Automatisierungstechnik GmbH | Apparatus for separating a flat workpiece made of a brittle material by means of a laser |
US7223936B2 (en) * | 2005-06-13 | 2007-05-29 | Jenoptik Automatisierungstechnik Gmbh | Arrangement for severing a flat workpiece of brittle material multiple times by means of a laser |
JP2010150068A (en) * | 2008-12-25 | 2010-07-08 | Mitsuboshi Diamond Industrial Co Ltd | Method for breaking brittle material substrate |
CN102643017A (en) * | 2011-03-14 | 2012-08-22 | 京东方科技集团股份有限公司 | Non-contact type breaking method and equipment and method and equipment for cutting and breaking |
CN102643017B (en) * | 2011-03-14 | 2014-09-10 | 京东方科技集团股份有限公司 | Non-contact type breaking method and equipment and method and equipment for cutting and breaking |
WO2015098641A1 (en) * | 2013-12-27 | 2015-07-02 | 旭硝子株式会社 | Glass plate, and glass plate processing method |
CN105849057A (en) * | 2013-12-27 | 2016-08-10 | 旭硝子株式会社 | Glass plate, and glass plate processing method |
KR20160102996A (en) * | 2013-12-27 | 2016-08-31 | 아사히 가라스 가부시키가이샤 | Glass plate, and glass plate processing method |
JPWO2015098641A1 (en) * | 2013-12-27 | 2017-03-23 | 旭硝子株式会社 | Glass plate and glass plate processing method |
CN105849057B (en) * | 2013-12-27 | 2019-08-02 | Agc株式会社 | The processing method of glass plate and glass plate |
KR102260140B1 (en) | 2013-12-27 | 2021-06-04 | 에이지씨 가부시키가이샤 | Glass plate, and glass plate processing method |
WO2016156233A1 (en) * | 2015-03-27 | 2016-10-06 | Schott Ag | Method and device for the continuous cutting of glass |
US10407336B2 (en) | 2015-03-27 | 2019-09-10 | Schott Ag | Method and apparatus for continuously cutting glass |
KR20200002108A (en) * | 2018-06-29 | 2020-01-08 | (주)에이치아이티오토모티브 | Heat treatment apparatus for small material |
KR102150354B1 (en) * | 2018-06-29 | 2020-09-01 | (주)에이치아이티오토모티브 | Heat treatment apparatus for small material |
CN112894359A (en) * | 2021-01-05 | 2021-06-04 | 中国人民解放军陆军装甲兵学院 | Jet cutting method and system thereof |
CN112894359B (en) * | 2021-01-05 | 2022-03-01 | 中国人民解放军陆军装甲兵学院 | Jet cutting method and system thereof |
Also Published As
Publication number | Publication date |
---|---|
TW474901B (en) | 2002-02-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2000233936A (en) | Glass cutting device | |
JP4156513B2 (en) | Scribing method and scribing apparatus for brittle material substrate | |
JP2787990B2 (en) | Method and apparatus for forming a recess in a workpiece using a laser beam | |
JP4700279B2 (en) | Method and apparatus for forming a hole in a workpiece using a laser beam | |
JPH02290685A (en) | Laser beam machine | |
JP5171838B2 (en) | Laser scribing method for brittle material substrate | |
KR20060129966A (en) | Arrangement for severing a flat workpiece of brittle material multiple times by means of a laser | |
US5120926A (en) | Method and apparatus for high speed laser cutting | |
CN104114316B (en) | Laser machine | |
JP2000233936A5 (en) | ||
CN101842203A (en) | Method for cutting a fragile material substrate | |
JP2001130921A (en) | Method and device for processing brittle substrate | |
JP2011230940A (en) | Cutting method for brittle material substrate | |
JP4080484B2 (en) | Scribing method and scribing apparatus for brittle material substrate | |
JPWO2003008352A1 (en) | Scribing apparatus and scribing method for brittle material substrate | |
JP3532223B2 (en) | Laser processing machine head | |
JP4615231B2 (en) | Scribing apparatus and scribing method using the apparatus | |
JPWO2003013816A1 (en) | Method and apparatus for scribing brittle material substrate | |
EP3446825A1 (en) | Laser cladding device and complex machine tool | |
CN111989178A (en) | Manufacturing device and method for additive manufacturing with a movable flow section | |
JP3126790B2 (en) | Laser welding equipment | |
US4655591A (en) | Platform arrangement with movable mirrors, one movable with tracking means, directing light from a fixed laser source | |
KR100634976B1 (en) | Method of glass cutting and equipment therefor | |
JP3126788B2 (en) | Assist gas injection control device for laser welding equipment | |
JP2010184457A (en) | Method for dividing brittle material substrate |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Written amendment |
Effective date: 20040917 Free format text: JAPANESE INTERMEDIATE CODE: A523 |
|
A621 | Written request for application examination |
Effective date: 20040917 Free format text: JAPANESE INTERMEDIATE CODE: A621 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20070306 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20070417 |
|
A521 | Written amendment |
Effective date: 20070615 Free format text: JAPANESE INTERMEDIATE CODE: A523 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20070807 |