JP2000085282A - Noncontact ic card and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a noncontact IC card of a novel material constitution easy to provide an additional function such as printing a face photograph, embossing, forming magnetic stripes or the like by providing a high surface smoothness accuracy or a print design without wear. SOLUTION: The noncontact IC card comprises an IC chip 12 for connecting an antenna coil 14 between terminals and embedded in a card base, one or two amorphous copolyester sheet layers laminated on both surfaces of the coil 14 via mesh sheets 15, 16 and integrated as card base by heat fusion bonding. When print designs 17, 18 are provided at inner sides of the sheets, its wear resistance can be enhanced. The method for manufacturing the noncontact IC card comprises the steps of sandwiching the thus laminated card base material between mirror surface plates, introducing it to a hot press, heat fusion bonding it and the like.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a non-contact IC card, and more particularly to a non-contact IC card having a card base which protects a printed pattern on the surface of the card and is easy to provide various additional functions, and a method of manufacturing the same. About.

[0002]

2. Description of the Related Art At present, a non-contact IC card uses Mifa
There are many cards with "micron registered trademark" specifications on the market. The card has a structure in which a non-contact IC chip is embedded in a card base material, and is divided into a structure using a vinyl chloride base material and a structure using a nonwoven fabric and a PET (polyethylene terephthalate) base material.
FIG. 3 is a diagram showing a cross-sectional configuration of a conventional non-contact IC card using a vinyl chloride base material. This card comprises a vinyl chloride sheet 211 serving as a center sheet and oversheets 212 and 2 made of vinyl chloride laminated on both sides thereof.
13. The IC chip 22 is embedded in the embedding hole of the center sheet. At this time, the connection terminal of the antenna coil or the winding antenna coil 24 formed on the center sheet by the printed wiring technique is
The connection is made such that the positions of the bumps 221 and 222 of the C chip 22 match. When laminating the center sheet and the oversheet, hot pressing is performed using a heat-curable epoxy-based adhesive (or an adhesive sheet) 23 as shown in FIG.

FIG. 4 is a diagram showing a cross-sectional structure of a conventional non-contact IC card using a nonwoven fabric and a PET substrate.
In the case of this card, after connecting the IC chip 22 to the coiled antenna coil 24, non-woven fabrics 25 and 26 are applied to both surfaces thereof, and the outer surfaces of the non-woven fabrics 25 and 26 are further heat-cured epoxy adhesive (adhesive sheet). May be used.)
The laminated body sandwiching the PET sheets 271 and 272 through 23 is hot-pressed to be integrated into a card base. During hot pressing, the adhesive penetrates into the nonwoven fabric,
After cooling, an integrated card substrate is formed by the thermosetting adhesive.

However, in the case of the vinyl chloride-based non-contact IC card as described above, since printing is performed on the outermost surface, the printed pattern is liable to be worn out during use. However, there are problems that the transfer is difficult, and the number of steps is increased due to an adhesion step for lamination. Also, in the case of the conventional PET non-contact IC card, the printing is performed on the outermost surface similarly,
There are problems such as that printed patterns are easily worn out during use, and that the base material is a semi-crystalline stretched sheet, so that it is difficult to impart additional functions of embossing, magnetic stripe, and hologram.

[0005]

SUMMARY OF THE INVENTION Accordingly, the present invention provides a non-contact type with good surface properties that can accurately perform post-processing such as embossing, magnetic stripe, addition of a rewrite display portion, and face photograph printing without wear of a printed pattern. This is to realize an IC card. In particular, the general PET substrate
A non-crystalline copolyester sheet different from the sheet, in particular, a PET-G sheet is used.

[0006]

SUMMARY OF THE INVENTION The first aspect of the present invention for solving the above-mentioned problems is that an antenna coil connected to an antenna is connected.
In a non-contact IC card in which a C chip is embedded in a card base, an amorphous copolyester sheet is laminated on both sides of an IC chip and an antenna coil via a mesh sheet, and is formed into an integrated card base by heat fusion. Contactless IC card. Since such a non-contact IC card is used, it is easy to provide a printed pattern and it is easy to provide an additional function.

A second aspect of the present invention to solve the above-mentioned problem is a non-contact IC card in which an IC chip connected to an antenna coil is embedded in a card base.
First and second non-crystalline copolyester sheets are laminated on a first surface of a C chip and an antenna coil via a first mesh sheet, and a second mesh sheet is disposed on a second surface of an IC chip via a second mesh sheet. Then, the third and fourth non-crystalline copolyester sheets are laminated, and the first to fourth non-crystalline copolyester sheets and the first and second mesh sheets are formed into an integrated card base by heat fusion. A non-contact IC card characterized in that: Since such a non-contact IC card is used, it is easy to provide a printed pattern and it is easy to provide an additional function.

A third aspect of the present invention for solving the above problems is a non-contact IC card in which an IC chip to which an antenna coil is connected is embedded in a card base.
First and second non-crystalline copolyester sheets are laminated on a first surface of a C chip and an antenna coil via a first mesh sheet, and a second mesh sheet is disposed on a second surface of an IC chip via a second mesh sheet. That is, the third non-crystalline copolyester sheet is laminated, and the first to third non-crystalline copolyester sheets and the first and second mesh sheets are formed into an integrated card base by heat fusion. A non-contact IC card. Since such a non-contact IC card is used, it is easy to provide a printed pattern and it is easy to provide an additional function.

A fourth aspect of the present invention for solving the above-mentioned problem is that an IC chip to which an antenna coil is connected, the antenna coil as a center, and a first surface on a first surface thereof via a first mesh sheet. Laminating a second non-crystalline copolyester sheet, a second surface on the second surface of the IC chip;
Laminating at least a third non-crystalline copolyester sheet through the mesh sheet of the above, and introducing the laminated body of the first to third non-crystalline copolyester sheets and the mesh sheet into a hot press and heat-sealing And a method of manufacturing a non-contact IC card, wherein the card base is integrated by the above steps. With this method of manufacturing a non-contact IC card, it is easy to provide a printed picture and easily manufacture a non-contact IC card that is easy to provide an additional function.

A fifth aspect of the present invention for solving the above-mentioned problem is that an IC chip to which an antenna coil is connected, a step of mounting the antenna coil between a first mesh sheet and a second mesh sheet, Temporarily bonding a mesh sheet on which a chip and an antenna coil are mounted to a first non-crystalline copolyester sheet, laminating second and third non-crystalline copolyester sheets on both surfaces of the temporarily bonded body, Introducing a third laminate of the non-crystalline copolyester sheet and the mesh sheet into a hot press machine and heat-sealing the laminate, thereby integrating the card substrate. ,It is in. With this method of manufacturing a non-contact IC card, it is easy to provide a printed picture and easily manufacture a non-contact IC card that is easy to provide an additional function.

[0011]

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a novel non-contact IC card and a method for producing the same, and particularly to a non-crystalline copolyester, PET-G, which is different from a general PET substrate for an IC card substrate. It is characterized by the following. Hereinafter, embodiments of the present invention will be specifically described, but the present invention is not limited to the following embodiments.

FIG. 1 is a diagram showing a non-contact IC card lamination process of the present invention. As shown in FIG. 1, the mesh sheet 1
IC chip 12 with antenna coil 14 between 5 and 16
And core sheets 111 and 112 by PET-G.
Then, after the oversheets 113 and 114 made of PET-G are laminated on the outer surface, heat fusion is performed by applying heat pressure. The antenna coil 14 is formed by winding a thin conductive wire of copper, aluminum, or the like several times around the size of the card size, and
Are connected between the two bumps 121 and 122. In the case of FIG. 1, the PET-G sheet has the configuration of the core sheets 111 and 112 and the oversheets 113 and 114, but is not limited to these configurations, and one or both sides of the PET-G sheet have a single layer. It may be a sheet. The total thickness before stacking the above sheets and pressing is 0.68 to 0.66 mm in order for the thickness after pressing to be the reference thickness of 0.76 mm.
It is preferably about 0.84 mm.

PET-G sheet 11 serving as a core sheet
On the surface on the outer side of 1,112, a printed pattern 17,
If 18 is applied, the printed portion is protected by the oversheet, so that the abrasion of the picture pattern due to use can be prevented. The printing may be performed on the inner side of the sheet 113 or 114, but in this case, it is necessary to perform back printing.
When adding a magnetic stripe to a non-contact IC card,
The magnetic stripe 19 for transfer is pasted on the PET-G sheet on the surface.

The card base material laminated in the state shown in FIG. 1 is sandwiched between mirror plates and introduced into a press machine under the same conditions as a normal PVC card (heating 100 to 150 ° C., pressure 10 to 30 kgf).
/ Cm ² ), the PET-G core sheet partially melts, penetrates the mesh sheet, and the PET-G sheets on both sides sandwiching the IC chip are fused together. Become. At this time, it is considered that PET-G on the outer surface side of the card is also melted, but there is no change in appearance since the PET-G is pressed by the mirror plate. FIG. 2 is a view showing a state after hot pressing of the non-contact IC card of the present invention. After hot pressing, PET-G melts and penetrates into each gap of the mesh sheet, and after cooling and solidification, becomes a completely integrated card base material. In addition, since the IC chip 12 has a thickness of about 50 to 150 μm, it hardly appears in the thickness of the mesh sheet and the PET-G which are elastic before being solidified, so that the IC chip 12 has irregularities on the card surface. Absent. That is, the mesh sheet provides the card with the strength and the molten P
Infiltrate ET-G, PET-G on both sides of IC chip
Are integrated, and the surface shape is smoothed by absorbing the irregularities of the IC chip and the antenna coil.

In the production of such a non-contact IC card, since PET-G penetrates between the mesh sheets and is heat-sealed, it is not necessary to use an adhesive unlike the above-described conventional IC card. Is simplified. In addition, PET-
G is thermoplastic and excellent in moldability, so the embossing required for the card is easy, and sticking of the sign panel, transfer of the hologram transfer foil, and application of the rewritable thermosensitive display layer are the same as ordinary PVC cards. Easy. Further PET-G
Since the substrate has good dye receptivity of the sublimation transfer ribbon at the time of heat-sensitive sublimation transfer, a face photograph print can be performed well.

In this case, prior to the hot pressing, a step of lightly hot pressing the IC chip 12 to which the antenna coil 14 is connected between the first mesh sheet and the second mesh sheet and mounting the IC chip 12 is performed. Is also good. This is because when the mesh sheet is heat-meltable, heat is applied to dissolve it slightly to fix the IC chip between the sheets and stabilize it. Further, a step of temporarily attaching a PET-G sheet to one surface of the mesh sheet on which the IC chip and the antenna coil are mounted may be performed. In this method, an ultrasonic sealer or the like is pressed to apply heat in a spot manner and similarly fixed to any one of the sheets.

Hereinafter, the materials used will be described. Mesh sheet layer The mesh sheet layer to be laid is made of a material having high shear strength and resilient flexibility and cushioning properties when bent, or a card base and a rigid body when bent under predetermined conditions. It is preferable to be made of a material having sufficient elasticity to absorb the shearing stress concentrated at the boundary with the chip and diffuse the force. Especially shear strength, flexibility,
In addition, a material having high elasticity is preferably used. Also,
It is necessary to have an appropriate gap through which the molten resin penetrates. For example, it can be constituted by a mesh sheet made of a mesh sheet as described below, a nonwoven fabric, or the like.

(The material is nylon (nylon 6
6, nylon 6, nylon 11, nylon 610, nylon 4, nylon 7, nylon 9, nylon 12, etc.), polyester, acrylic, vinylon, rayon,
Polypropylene, polyvinylidene chloride, polyethylene,
Polyurethane, polystyrene, polyfluoroethylene (Teflon) synthetic fibers, acetate, triacetate, cellulose such as ethyl cellulose, chloride rubber,
Semi-synthetic fiber of hydrochloric acid rubber, natural fiber such as yarn, surface, silk, etc., glass fiber, various plastic films with perforated sheets and the like can be used.

(There are various production methods for sheets formed into a cloth without using a loom. For example, a wet nonwoven fabric in which fibers and paper are made by papermaking technology, and a chemical bond in which a fibrous web is bonded with an adhesive. Also, there are thermal bond dry non-woven fabric which is self-bonded by heat, spun bond which is self-bonded by direct spinning, etc. Fibers used for these are various natural or synthetic fibers like the above-mentioned mesh sheet. can do.

PET-G sheet The PET-G sheet is a semi-crystalline PET resin sheet obtained by forming a resin obtained by polymerizing terephthalic acid (TPA) and ethylene glycol (EG) into a sheet and stretching it. PET-G is a non-crystalline sheet made of a resin obtained by copolymerizing TPA, EG and 1,4-cyclohexanedimethanol (CHDM). This resin is Eas
tar PETG6763, manufactured by Eastman Chemical Company, and its molded sheet is sold by each company. PETG6763 is chemically resistant,
Excellent oil resistance. Has heat sealability and solvent adhesion. It has a high gloss and a glass-like appearance. High low-temperature impact strength. Transparency is maintained by any molding method. Etc. The present invention aims at a non-contact IC card using a resin sheet having such characteristics.

[0021]

(Example 1) A PET-G sheet having a thickness of 0.20 mm was used as the core sheets 111 and 112, and a P-type sheet having a thickness of 0.10 mm was used as the oversheets 113 and 114.
ET-G sheets (both "Diafix" manufactured by Mitsubishi Plastics Corporation) were used. The IC chip 12 has a thickness of 12
A copper wire having a diameter of 0 μm was used, and a copper wire was wound around the antenna coil 14 four times to form a rectangular planar shape of 30 × 70 mm, which was connected to bumps for use. 0.1 mm thick made of PE / PET fiber on both sides of this IC chip and antenna coil
Was applied and heated and mounted.

The surface of the nonwoven fabric 16 on which the IC chip is mounted
The ET-G sheets were laminated and temporarily attached. In the temporary bonding, the ultrasonic sealer was pressed against the PET-G sheet surface from the nonwoven fabric surface and heated to partially melt the base material and fix several places. One PET-G sheet is further added to the surface of the nonwoven fabric 16 of the temporary bonded body, and two P-
The ET-G sheet was laminated. The total thickness was 0.80 mm before the press where the nonwoven fabric and the PET-G sheet were laminated. At this time, appropriate printings 17 and 18 were applied to the portions of the core sheets 111 and 112 to be the outer surfaces of the cards by the offset printing, and the printing was performed by the front printing. Further, the magnetic stripe transfer ribbon 19 was stuck on the oversheet.

Next, mirror-surface plates were applied to both sides of the laminate, and the laminate was introduced into a press machine and heated at a pressure of 140 ° C., 25 kgf /
(cm ² , 15 minutes). After pressing,
The card has a smooth surface and the total thickness of the card base is 760.
μm. The magnetic stripe portion was also embedded in the card base, and a smooth surface was obtained. The number of card impositions on the card base material was 24 in 4 rows and 6 rows, and then punching was performed to separate the individual cards. A hologram transfer foil (Dai Nippon Printing Co., Ltd.) was transferred to the surface of the card, and a face photo was printed by sublimation thermal transfer printing. Was.

Regarding the completed non-contact IC card,
The following tests were performed. (1) Bending in the long side direction of the card Bending is performed 250 times at a rate of 30 cm per minute in the front and back directions at a deflection of 2 cm. (2) Bending in the short side direction of the card Bending is performed 250 times in the front and back directions at a rate of 30 cm per minute each with a deflection of 1 cm. As a result, the non-contact IC of this embodiment
In the card, the card base was not broken or cracked in the IC chip embedded portion or other portions, and there was no change in appearance.
In addition, communication with the external device was successfully performed without contact. (3) Smoothness of the card surface The unevenness of the card surface according to the conventional method is an average ±
In contrast to the unevenness of 20 μm, the non-contact IC card according to the present embodiment had a thickness of ± 10 μm or less.

[0025]

As described above, the non-contact IC card of the present invention is excellent in surface smoothness, so that a face photograph print and a hologram foil can be transferred well, and a sign panel and a rewritable display portion made of a thermosensitive recording material can be formed. Addition and printing (UG) can be easily performed. Since PET-G is thermoplastic, embossing and addition of a magnetic stripe can be performed with high accuracy, similarly to vinyl chloride. Since the non-contact IC card of the present invention having such characteristics can be provided with the additional functions described above, it can be used in various fields such as the medical field, the payment field, the distribution field, and the ID card field. In particular, it can be used for both settlement and ID cards, for example, an employee card and cash card, and can be widely adapted to market needs.

According to the method for manufacturing a non-contact IC card of the present invention, the IC card and the antenna coil mounted on the mesh sheet can be manufactured simply by sandwiching the IC chip and the antenna coil between the PET-G core sheets. It can be manufactured in process.

[Brief description of the drawings]

FIG. 1 is a view showing a lamination process of a non-contact IC card of the present invention.

FIG. 2 is a view showing a state after hot pressing of the non-contact IC card of the present invention.

FIG. 3 Conventional non-contact IC using a vinyl chloride substrate
FIG. 3 is a diagram illustrating a cross-sectional configuration of a card.

FIG. 4 is a diagram showing a cross-sectional configuration of a conventional non-contact IC card using a nonwoven fabric and a PET substrate.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 12 IC chip 14 Antenna coil 15 and 16 Mesh sheet 17 and 18 Printing pattern 19 Magnetic stripe 22 IC chip 23 Adhesive 24 Antenna coil 25 and 26 Nonwoven fabric 111 and 112 Core sheet 113 and 114 Oversheet 121 and 122 Bump of IC chip 211 Vinyl chloride sheet 212,213 Over sheet 221,222 Bump of IC chip 271,272 PET sheet

 ──────────────────────────────────────────────────の Continuing on the front page F term (reference) 2C005 MA19 NA09 PA03 PA04 PA14 PA21 RA04 4F100 AK04 AK42D AK42E AL01E AS00A AT00D AT00E BA05 BA06 BA10D BA10E DC11B DC11C DG15B DG15C EJ172 EJ422 GB71 HB31E02A JA12D03 BA03 BD07A CB06A KH08 5B035 AA00 AA07 AA08 BA03 BA05 BB09 BC00 CA02 CA03 CA06 CA23

Claims (8)

[Claims] 1. A non-contact IC card in which an IC chip connected to an antenna coil is embedded in a card base, a non-crystalline copolyester sheet is laminated on both sides of the IC chip and the antenna coil via a mesh sheet,
A non-contact IC card, which is formed into an integrated card base by heat fusion. 2. A non-contact IC card in which an IC chip to which an antenna coil is connected is embedded in a card base, a first surface of the IC chip and a first surface of the antenna coil via a first mesh sheet. No. 2 non-crystalline copolyester sheets are stacked, and third and fourth non-crystalline copolyester sheets are stacked on the second surface of the IC chip via a second mesh sheet, and the first to fourth non-crystalline copolyester sheets are stacked. A non-contact IC card, wherein the non-crystalline copolyester sheet and the first and second mesh sheets are formed into an integrated card base by heat fusion. 3. A non-contact IC card in which an IC chip to which an antenna coil is connected is embedded in a card base, wherein the first surface of the IC chip and the first surface of the antenna coil are interposed via a first mesh sheet. The second non-crystalline copolyester sheet is laminated, the third non-crystalline copolyester sheet is laminated on the second surface of the IC chip via the second mesh sheet, and the first to third non-crystalline copolyester sheets are laminated. A non-contact IC card, wherein the copolyester sheet and the first and second mesh sheets are formed into an integrated card base by heat fusion. 4. The non-crystalline copolyester sheet according to claim 1, wherein a printed pattern is provided on any surface other than the surface that is the outermost surface of the card substrate. Non-contact IC card. 5. The non-crystalline copolyester sheet is made of PET.
The non-contact IC card according to any one of claims 1 to 3, wherein the non-contact IC card is a G sheet. 6. An IC chip to which an antenna coil is connected,
A step of laminating first and second non-crystalline copolyester sheets on a first surface of the antenna chip with a first mesh sheet therebetween, and a second mesh on a second surface of the IC chip; A step of laminating at least a third non-crystalline copolyester sheet via a sheet, a step of introducing a laminate of the first to third non-crystalline copolyester sheets and the mesh sheet into a hot press machine and heat-sealing the laminated body And a method for manufacturing a non-contact IC card, wherein the card base is integrated. 7. An IC chip to which an antenna coil is connected,
A step of mounting the antenna coil between the first mesh sheet and the second mesh sheet; a step of temporarily bonding the IC chip and the mesh sheet mounting the antenna coil to the first non-crystalline copolyester sheet; Laminating second and third non-crystalline copolyester sheets on both sides of the body, introducing the first to third non-crystalline copolyester sheets and the mesh sheet into a hot press and heat-sealing A method of manufacturing a non-contact IC card, comprising: 8. The non-crystalline copolyester sheet is made of PET.
The method for manufacturing a non-contact IC card according to claim 6, wherein the non-contact IC card is a G sheet.