|
US6316821B1
(en)
*
|
1998-09-28 |
2001-11-13 |
Cypress Semiconductor Corporation |
High density lead frames and methods for plastic injection molding
|
|
JP3711776B2
(en)
*
|
1999-02-09 |
2005-11-02 |
松下電器産業株式会社 |
Solid electrolytic capacitor manufacturing method and manufacturing apparatus thereof
|
|
US6486538B1
(en)
*
|
1999-05-27 |
2002-11-26 |
Infineon Technologies Ag |
Chip carrier having ventilation channels
|
|
USD465207S1
(en)
*
|
2001-06-08 |
2002-11-05 |
Gem Services, Inc. |
Leadframe matrix for a surface mount package
|
|
USD485243S1
(en)
*
|
2002-10-22 |
2004-01-13 |
Gem Services, Inc. |
Portion of a matrix for surface mount package leadframe
|
|
USD483336S1
(en)
*
|
2002-11-15 |
2003-12-09 |
Gem Services, Inc. |
Portion of a matrix for surface mount package leadframe
|
|
USD484858S1
(en)
*
|
2002-11-15 |
2004-01-06 |
Gem Services, Inc. |
Portion of a matrix for surface mount package leadframe
|
|
USD484103S1
(en)
*
|
2002-11-15 |
2003-12-23 |
Gem Services, Inc. |
Portion of a matrix for surface mount package leadframe
|
|
USD492266S1
(en)
*
|
2002-11-15 |
2004-06-29 |
Gem Services, Inc. |
Portion of a matrix for surface mount package leadframe
|
|
USD484104S1
(en)
|
2002-11-25 |
2003-12-23 |
Gem Services, Inc. |
Portion of a matrix for surface mount package leadframe
|
|
USD483337S1
(en)
*
|
2002-11-25 |
2003-12-09 |
Gem Services, Inc. |
Portion of a matrix for surface mount package leadframe
|
|
USD491900S1
(en)
*
|
2002-12-17 |
2004-06-22 |
Gem Services, Inc. |
Portion of a matrix for surface mount package leadframe
|
|
USD486802S1
(en)
*
|
2002-12-17 |
2004-02-17 |
Gem Services, Inc. |
Portion of a matrix for surface mount package leadframe
|
|
USD485244S1
(en)
*
|
2002-12-17 |
2004-01-13 |
Gem Services, Inc. |
Portion of a matrix for surface mount package leadframe
|
|
USD494939S1
(en)
*
|
2002-12-17 |
2004-08-24 |
Gem Services, Inc. |
Portion of a matrix for surface mount package leadframe
|
|
USD513608S1
(en)
*
|
2003-01-03 |
2006-01-17 |
Gem Services, Inc. |
Portion of a matrix for surface mount package leadframe
|
|
USD487431S1
(en)
*
|
2003-01-03 |
2004-03-09 |
Gem Services, Inc. |
Portion of a matrix for surface mount package leadframe
|
|
USD485808S1
(en)
*
|
2003-01-03 |
2004-01-27 |
Gem Services, Inc. |
Portion of a matrix for surface mount package leadframe
|
|
USD505122S1
(en)
*
|
2003-01-03 |
2005-05-17 |
Gem Services, Inc. |
Portion of a matrix for surface mount package leadframe
|
|
USD488136S1
(en)
*
|
2003-01-03 |
2004-04-06 |
Gem Services, Inc. |
Portion of a matrix for surface mount package leadframe
|
|
USD505121S1
(en)
*
|
2003-01-03 |
2005-05-17 |
Gem Services, Inc. |
Portion of a matrix for surface mount package leadframe
|
|
USD484859S1
(en)
*
|
2003-02-07 |
2004-01-06 |
Gem Services, Inc. |
Portion of a matrix for surface mount package leadframe
|
|
USD487432S1
(en)
|
2003-02-07 |
2004-03-09 |
Gem Services, Inc. |
Portion of a matrix for surface mount package leadframe
|
|
USD588080S1
(en)
*
|
2007-09-26 |
2009-03-10 |
Gem Services, Inc. |
2021-8J matrix leadframe
|
|
USD588557S1
(en)
*
|
2007-10-02 |
2009-03-17 |
Gem Services, Inc. |
4040-28J matrix leadframe
|
|
JP5634033B2
(en)
*
|
2008-08-29 |
2014-12-03 |
セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー |
Resin-sealed semiconductor device and manufacturing method thereof
|
|
CN102169864B
(en)
*
|
2010-02-26 |
2015-06-17 |
飞思卡尔半导体公司 |
Lead frame sheet
|
|
JP5762078B2
(en)
*
|
2011-03-28 |
2015-08-12 |
新光電気工業株式会社 |
Lead frame
|
|
JP5875848B2
(en)
*
|
2011-12-16 |
2016-03-02 |
株式会社東芝 |
Photocoupler manufacturing method and photocoupler lead frame sheet
|
|
US8884414B2
(en)
*
|
2013-01-09 |
2014-11-11 |
Texas Instruments Incorporated |
Integrated circuit module with dual leadframe
|
|
JP6499387B2
(en)
*
|
2013-03-05 |
2019-04-10 |
日亜化学工業株式会社 |
Lead frame and light emitting device
|
|
US9748164B2
(en)
*
|
2013-03-05 |
2017-08-29 |
Nichia Corporation |
Semiconductor device
|
|
US9171766B2
(en)
*
|
2013-05-03 |
2015-10-27 |
Infineon Technologies Ag |
Lead frame strips with support members
|
|
JP6603982B2
(en)
*
|
2013-07-31 |
2019-11-13 |
日亜化学工業株式会社 |
Lead frame, lead frame with resin, resin package, light emitting device, and method for manufacturing resin package
|
|
US9263419B2
(en)
*
|
2013-08-30 |
2016-02-16 |
Infineon Technologies Ag |
Lead frame strips with electrical isolation of die paddles
|
|
US9252063B2
(en)
*
|
2014-07-07 |
2016-02-02 |
Infineon Technologies Ag |
Extended contact area for leadframe strip testing
|
|
US9337130B2
(en)
*
|
2014-07-28 |
2016-05-10 |
Texas Instruments Incorporated |
Leadframe strip and leadframes
|
|
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(en)
*
|
2015-01-22 |
2019-09-11 |
大口マテリアル株式会社 |
Lead frame
|