IL45045A - Thin-film electrical circuit - Google Patents

Thin-film electrical circuit

Info

Publication number: IL45045A
Authority: IL; Israel
Prior art keywords: tantalum; layer; aluminium; thin; content
Prior art date: 1973-06-20

Application number

IL45045A

Other languages

English (en)

Other versions

IL45045A0 (en

Original Assignee

Siemens Ag

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1973-06-20

Filing date

1974-06-17

Publication date

1977-04-29

1973-06-20 Priority claimed from DE19732331586 external-priority patent/DE2331586C3/de

1974-06-17 Application filed by Siemens Ag filed Critical Siemens Ag

1974-09-10 Publication of IL45045A0 publication Critical patent/IL45045A0/xx

1977-04-29 Publication of IL45045A publication Critical patent/IL45045A/en

Links

239000010409 thin film Substances 0.000 title claims description 20
239000010410 layer Substances 0.000 claims description 114
RVSGESPTHDDNTH-UHFFFAOYSA-N alumane;tantalum Chemical compound [AlH3].[Ta] RVSGESPTHDDNTH-UHFFFAOYSA-N 0.000 claims description 54
229910052715 tantalum Inorganic materials 0.000 claims description 39
GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 39
239000003990 capacitor Substances 0.000 claims description 33
239000000758 substrate Substances 0.000 claims description 22
229910000838 Al alloy Inorganic materials 0.000 claims description 21
238000000034 method Methods 0.000 claims description 20
239000004020 conductor Substances 0.000 claims description 17
VQLOCUKZAJRPAO-UHFFFAOYSA-N aluminum oxygen(2-) tantalum(5+) Chemical compound [O--].[O--].[O--].[O--].[Al+3].[Ta+5] VQLOCUKZAJRPAO-UHFFFAOYSA-N 0.000 claims description 15
230000003647 oxidation Effects 0.000 claims description 15
238000007254 oxidation reaction Methods 0.000 claims description 15
238000005530 etching Methods 0.000 claims description 13
239000000243 solution Substances 0.000 claims description 13
PQLZZALLLYUAKL-UHFFFAOYSA-N [Au].[Cr].[Ni] Chemical compound [Au].[Cr].[Ni] PQLZZALLLYUAKL-UHFFFAOYSA-N 0.000 claims description 12
KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims description 10
238000004519 manufacturing process Methods 0.000 claims description 8
230000013011 mating Effects 0.000 claims description 8
HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 6
KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims description 6
230000000873 masking effect Effects 0.000 claims description 5
GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 4
229910017604 nitric acid Inorganic materials 0.000 claims description 4
239000000919 ceramic Substances 0.000 claims description 3
OZECDDHOAMNMQI-UHFFFAOYSA-H cerium(3+);trisulfate Chemical compound [Ce+3].[Ce+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O OZECDDHOAMNMQI-UHFFFAOYSA-H 0.000 claims description 3
238000000151 deposition Methods 0.000 claims description 3
239000011521 glass Substances 0.000 claims description 3
239000011810 insulating material Substances 0.000 claims description 3
239000000463 material Substances 0.000 claims description 3
239000010453 quartz Substances 0.000 claims description 3
229910052594 sapphire Inorganic materials 0.000 claims description 3
239000010980 sapphire Substances 0.000 claims description 3
VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
238000004544 sputter deposition Methods 0.000 claims description 3
239000011260 aqueous acid Substances 0.000 claims description 2
239000007864 aqueous solution Substances 0.000 claims description 2
239000002344 surface layer Substances 0.000 claims description 2
YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 claims 2
FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 claims 1
229960004889 salicylic acid Drugs 0.000 claims 1
239000002966 varnish Substances 0.000 description 6
229910045601 alloy Inorganic materials 0.000 description 4
239000000956 alloy Substances 0.000 description 4
XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
229910052782 aluminium Inorganic materials 0.000 description 3
239000004411 aluminium Substances 0.000 description 3
VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
239000003795 chemical substances by application Substances 0.000 description 2
VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical compound [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 description 2
PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
229910018487 Ni—Cr Inorganic materials 0.000 description 1
UEJQQMLXZQUJHF-UHFFFAOYSA-L [K+].[I+].[I-].[I-] Chemical compound [K+].[I+].[I-].[I-] UEJQQMLXZQUJHF-UHFFFAOYSA-L 0.000 description 1
230000015572 biosynthetic process Effects 0.000 description 1
230000015556 catabolic process Effects 0.000 description 1
238000004140 cleaning Methods 0.000 description 1
239000011248 coating agent Substances 0.000 description 1
238000000576 coating method Methods 0.000 description 1
RKTYLMNFRDHKIL-UHFFFAOYSA-N copper;5,10,15,20-tetraphenylporphyrin-22,24-diide Chemical compound [Cu+2].C1=CC(C(=C2C=CC([N-]2)=C(C=2C=CC=CC=2)C=2C=CC(N=2)=C(C=2C=CC=CC=2)C2=CC=C3[N-]2)C=2C=CC=CC=2)=NC1=C3C1=CC=CC=C1 RKTYLMNFRDHKIL-UHFFFAOYSA-N 0.000 description 1
230000008021 deposition Effects 0.000 description 1
238000010586 diagram Methods 0.000 description 1
239000003792 electrolyte Substances 0.000 description 1
238000005516 engineering process Methods 0.000 description 1
230000002349 favourable effect Effects 0.000 description 1
239000010408 film Substances 0.000 description 1
OVBPIULPVIDEAO-LBPRGKRZSA-N folic acid Chemical compound C=1N=C2NC(N)=NC(=O)C2=NC=1CNC1=CC=C(C(=O)N[C@@H](CCC(O)=O)C(O)=O)C=C1 OVBPIULPVIDEAO-LBPRGKRZSA-N 0.000 description 1
239000010931 gold Substances 0.000 description 1
229910052737 gold Inorganic materials 0.000 description 1
235000011121 sodium hydroxide Nutrition 0.000 description 1

Classifications

- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/702—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof
- H01L21/707—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof of thin-film circuits or parts thereof
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor

Landscapes

Engineering & Computer Science (AREA)
Microelectronics & Electronic Packaging (AREA)
Manufacturing & Machinery (AREA)
Computer Hardware Design (AREA)
Condensed Matter Physics & Semiconductors (AREA)
General Physics & Mathematics (AREA)
Physics & Mathematics (AREA)
Power Engineering (AREA)
Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Parts Printed On Printed Circuit Boards (AREA)
Apparatuses And Processes For Manufacturing Resistors (AREA)
Multi-Conductor Connections (AREA)
Coupling Device And Connection With Printed Circuit (AREA)

IL45045A 1973-06-20 1974-06-17 Thin-film electrical circuit IL45045A (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
DE19732331586 DE2331586C3 (de)		1973-06-20	Aluminium-Tantal-Schichten für Dünnschichtschaltungen sowie diskrete Widerstände und Kondensatoren

Publications (2)

Publication Number	Publication Date
IL45045A0 IL45045A0 (en)	1974-09-10
IL45045A true IL45045A (en)	1977-04-29

Family

ID=5884643

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
IL45045A IL45045A (en)	1973-06-20	1974-06-17	Thin-film electrical circuit

Country Status (17)

Country	Link
US (1)	US3949275A (it)
JP (1)	JPS5346266B2 (it)
AT (1)	AT342733B (it)
BE (1)	BE816632R (it)
CA (1)	CA1007382A (it)
CH (1)	CH574200A5 (it)
DK (1)	DK143084C (it)
FR (1)	FR2234638B2 (it)
GB (1)	GB1424980A (it)
IE (1)	IE39514B1 (it)
IL (1)	IL45045A (it)
IT (1)	IT1019657B (it)
LU (1)	LU70349A1 (it)
NL (1)	NL7408158A (it)
NO (1)	NO139021C (it)
SE (1)	SE405052B (it)
YU (2)	YU40428B (it)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS51108469A (ja) *	1975-03-19	1976-09-25	Hitachi Metals Ltd	Gokanchoryukonbeya
US4445274A (en) *	1977-12-23	1984-05-01	Ngk Insulators, Ltd.	Method of manufacturing a ceramic structural body
DE2823881C3 (de) *	1978-05-31	1982-03-18	Siemens AG, 1000 Berlin und 8000 München	Verfahren zur Herstellung von elektrischen Dünnschichtschaltungen für die Herstellung integrierter Leiterbahnüberkreuzungen
DE2906813C2 (de) *	1979-02-22	1982-06-03	Robert Bosch Gmbh, 7000 Stuttgart	Elektronische Dünnschichtschaltung
US4200502A (en) *	1979-03-12	1980-04-29	Siemens Aktiengesellschaft	Method for producing an electrical thin layer circuit
US4654680A (en) *	1980-09-24	1987-03-31	Semiconductor Energy Laboratory Co., Ltd.	Sidewall gate IGFET
DE3480243D1 (en) *	1983-03-31	1989-11-23	Matsushita Electric Ind Co Ltd	Method of manufacturing thin-film integrated devices
JPS6045008A (ja) *	1983-08-22	1985-03-11	松下電器産業株式会社	薄膜コンデンサの製造方法
JPS60147462U (ja) *	1984-03-13	1985-09-30	長谷川化学工業株式会社	竹刀
ATE138418T1 (de) *	1989-02-28	1996-06-15	Canon Kk	Nicht-monokristalliner stoff enhaltend iridium, tantal und aluminium
US5027253A (en) *	1990-04-09	1991-06-25	Ibm Corporation	Printed circuit boards and cards having buried thin film capacitors and processing techniques for fabricating said boards and cards
US5419787A (en) *	1994-06-24	1995-05-30	The United States Of America As Represented By The Secretary Of The Air Force	Stress reduced insulator
WO1996007188A1 (en) *	1994-08-26	1996-03-07	Rohm Co., Ltd.	Chip type thick film capacitor and method of making the same
US5598131A (en) *	1995-11-16	1997-01-28	Emc Technology, Inc.	AC coupled termination
US5977582A (en) *	1997-05-23	1999-11-02	Lucent Technologies Inc.	Capacitor comprising improved TaOx -based dielectric
KR100359860B1 (ko) *	1998-12-31	2003-02-20	주식회사 하이닉스반도체	반도체 소자의 캐패시터 형성방법
DE19902865A1 (de) *	1999-01-25	2000-07-27	Philips Corp Intellectual Pty	Zero-IF-Konverter mit RC-Filter
US6278356B1 (en) *	2000-05-17	2001-08-21	Compeq Manufacturing Company Limited	Flat, built-in resistors and capacitors for a printed circuit board
DE10039710B4 (de) *	2000-08-14	2017-06-22	United Monolithic Semiconductors Gmbh	Verfahren zur Herstellung passiver Bauelemente auf einem Halbleitersubstrat

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US2179960A (en) *	1931-11-28	1939-11-14	Schwarzkopf Paul	Agglomerated material in particular for electrical purposes and shaped bodies made therefrom
US3217209A (en) *	1960-05-12	1965-11-09	Xerox Corp	Printed circuits with resistive and capacitive elements
US3386011A (en) *	1962-10-23	1968-05-28	Philco Ford Corp	Thin-film rc circuits on single substrate
US3172196A (en) *	1963-01-22	1965-03-09	Brush Beryllium Co	Sintered intermetallic compoundcomposition bodies
US3198628A (en) *	1963-06-13	1965-08-03	Dow Chemical Co	Uranium-tantalum-aluminum alloy
US3387952A (en) *	1964-11-09	1968-06-11	Western Electric Co	Multilayer thin-film coated substrate with metallic parting layer to permit selectiveequential etching
US3406043A (en) *	1964-11-09	1968-10-15	Western Electric Co	Integrated circuit containing multilayer tantalum compounds
US3423821A (en) *	1965-03-18	1969-01-28	Hitachi Ltd	Method of producing thin film integrated circuits
FR1537897A (fr) *	1967-07-19	1968-08-30	Europ Composants Electron	Procédé de fabrication de circuits électriques en couches minces
US3616282A (en) *	1968-11-14	1971-10-26	Hewlett Packard Co	Method of producing thin-film circuit elements
US3607679A (en) *	1969-05-05	1971-09-21	Bell Telephone Labor Inc	Method for the fabrication of discrete rc structure
US3718565A (en) *	1970-11-27	1973-02-27	Bell Telephone Labor Inc	Technique for the fabrication of discrete rc structure
US3781610A (en) *	1972-05-22	1973-12-25	G Bodway	Thin film circuits and method for manufacture

1974
- 1974-06-07 GB GB2540174A patent/GB1424980A/en not_active Expired
- 1974-06-10 NO NO742086A patent/NO139021C/no unknown
- 1974-06-10 AT AT476974A patent/AT342733B/de not_active IP Right Cessation
- 1974-06-17 SE SE7407961A patent/SE405052B/xx not_active IP Right Cessation
- 1974-06-17 CH CH823974A patent/CH574200A5/xx not_active IP Right Cessation
- 1974-06-17 IL IL45045A patent/IL45045A/en unknown
- 1974-06-18 NL NL7408158A patent/NL7408158A/xx not_active Application Discontinuation
- 1974-06-18 FR FR7421128A patent/FR2234638B2/fr not_active Expired
- 1974-06-18 LU LU70349A patent/LU70349A1/xx unknown
- 1974-06-18 DK DK325474A patent/DK143084C/da active
- 1974-06-18 CA CA202,758A patent/CA1007382A/en not_active Expired
- 1974-06-19 US US05/480,826 patent/US3949275A/en not_active Expired - Lifetime
- 1974-06-19 IE IE1283/74A patent/IE39514B1/xx unknown
- 1974-06-19 IT IT24145/74A patent/IT1019657B/it active
- 1974-06-20 JP JP7073674A patent/JPS5346266B2/ja not_active Expired
- 1974-06-20 BE BE145686A patent/BE816632R/xx not_active IP Right Cessation
- 1974-06-20 YU YU1732/74A patent/YU40428B/xx unknown
1980
- 1980-11-10 YU YU02869/80A patent/YU286980A/xx unknown

Also Published As

Publication number	Publication date
IT1019657B (it)	1977-11-30
DK143084B (da)	1981-03-23
CH574200A5 (it)	1976-03-31
JPS5032474A (it)	1975-03-29
JPS5346266B2 (it)	1978-12-12
GB1424980A (en)	1976-02-11
US3949275A (en)	1976-04-06
IL45045A0 (en)	1974-09-10
SE7407961L (it)	1974-12-23
DK143084C (da)	1981-10-26
AU7019474A (en)	1975-12-18
FR2234638B2 (it)	1978-08-04
YU173274A (en)	1982-02-28
BE816632R (fr)	1974-10-16
DE2331586A1 (de)	1975-01-09
DK325474A (it)	1975-02-17
NO139021B (no)	1978-09-11
FR2234638A2 (it)	1975-01-17
YU40428B (en)	1986-02-28
LU70349A1 (it)	1974-10-17
IE39514B1 (en)	1978-10-25
NL7408158A (it)	1974-12-24
YU286980A (en)	1982-10-31
NO139021C (no)	1978-12-20
ATA476974A (de)	1977-08-15
IE39514L (en)	1974-12-20
CA1007382A (en)	1977-03-22
SE405052B (sv)	1978-11-13
DE2331586B2 (de)	1976-11-25
NO742086L (it)	1975-01-13
AT342733B (de)	1978-04-25

Publication	Publication Date	Title
IL45045A (en)	1977-04-29	Thin-film electrical circuit
US4410867A (en)	1983-10-18	Alpha tantalum thin film circuit device
US3256588A (en)	1966-06-21	Method of fabricating thin film r-c circuits on single substrate
US4251326A (en)	1981-02-17	Fabricating an RC network utilizing alpha tantalum
US4434544A (en)	1984-03-06	Multilayer circuit and process for manufacturing the same
US4358748A (en)	1982-11-09	Thin film circuit
SE7513853L (sv)	1976-06-11	Forfarande for framstellning av elektriska ledare pa ett isolerande substrat
GB1125394A (en)	1968-08-28	Thin-film electrical components
JPS6329961A (ja)	1988-02-08	薄膜受動回路の製造方法とその方法によって製造される薄膜受動回路
US3781610A (en)	1973-12-25	Thin film circuits and method for manufacture
US3337426A (en)	1967-08-22	Process for fabricating electrical circuits
US3616282A (en)	1971-10-26	Method of producing thin-film circuit elements
GB1354956A (en)	1974-06-05	Process for making a thin film network
JP4984855B2 (ja)	2012-07-25	薄膜チップ抵抗器、薄膜チップコンデンサおよび薄膜チップインダクタの製造方法
US3387952A (en)	1968-06-11	Multilayer thin-film coated substrate with metallic parting layer to permit selectiveequential etching
US4496435A (en)	1985-01-29	Method of manufacturing thin film circuits
US3997411A (en)	1976-12-14	Method for the production of a thin film electric circuit
US4456506A (en)	1984-06-26	Superconducting circuit fabrication
US3485665A (en)	1969-12-23	Selective chemical deposition of thin-film interconnections and contacts
US3778689A (en)	1973-12-11	Thin film capacitors and method for manufacture
US3365378A (en)	1968-01-23	Method of fabricating film-forming metal capacitors
US3867193A (en)	1975-02-18	Process of producing a thin film circuit
US3487522A (en)	1970-01-06	Multilayered thin-film intermediates employing parting layers to permit selective,sequential etching
US3398032A (en)	1968-08-20	Method of making cermet resistors by etching
US4200502A (en)	1980-04-29	Method for producing an electrical thin layer circuit