IL254468A0 - Optical die to database inspection - Google Patents

Optical die to database inspection

Info

Publication number
IL254468A0
IL254468A0 IL254468A IL25446817A IL254468A0 IL 254468 A0 IL254468 A0 IL 254468A0 IL 254468 A IL254468 A IL 254468A IL 25446817 A IL25446817 A IL 25446817A IL 254468 A0 IL254468 A0 IL 254468A0
Authority
IL
Israel
Prior art keywords
optical die
database inspection
inspection
database
die
Prior art date
Application number
IL254468A
Other languages
Hebrew (he)
Other versions
IL254468B (en
Original Assignee
Kla Tencor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kla Tencor Corp filed Critical Kla Tencor Corp
Publication of IL254468A0 publication Critical patent/IL254468A0/en
Publication of IL254468B publication Critical patent/IL254468B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/0006—Industrial image inspection using a design-rule based approach
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/0008—Industrial image inspection checking presence/absence
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/06—Illumination; Optics
    • G01N2201/061—Sources
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/06—Illumination; Optics
    • G01N2201/061—Sources
    • G01N2201/06113—Coherent sources; lasers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/06—Illumination; Optics
    • G01N2201/068—Optics, miscellaneous
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Quality & Reliability (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
IL254468A 2015-04-03 2017-09-13 Optical die to database inspection IL254468B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201562142926P 2015-04-03 2015-04-03
US15/088,081 US10012599B2 (en) 2015-04-03 2016-03-31 Optical die to database inspection
PCT/US2016/025715 WO2016161370A1 (en) 2015-04-03 2016-04-01 Optical die to database inspection

Publications (2)

Publication Number Publication Date
IL254468A0 true IL254468A0 (en) 2017-11-30
IL254468B IL254468B (en) 2021-06-30

Family

ID=57006409

Family Applications (1)

Application Number Title Priority Date Filing Date
IL254468A IL254468B (en) 2015-04-03 2017-09-13 Optical die to database inspection

Country Status (6)

Country Link
US (1) US10012599B2 (en)
KR (1) KR102341973B1 (en)
CN (1) CN107454980B (en)
IL (1) IL254468B (en)
TW (1) TWI665445B (en)
WO (1) WO2016161370A1 (en)

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US10012599B2 (en) * 2015-04-03 2018-07-03 Kla-Tencor Corp. Optical die to database inspection
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US9916965B2 (en) 2015-12-31 2018-03-13 Kla-Tencor Corp. Hybrid inspectors
US9915625B2 (en) * 2016-01-04 2018-03-13 Kla-Tencor Corp. Optical die to database inspection
JP6591348B2 (en) * 2016-06-03 2019-10-16 株式会社ニューフレアテクノロジー Inspection method
US11580398B2 (en) * 2016-10-14 2023-02-14 KLA-Tenor Corp. Diagnostic systems and methods for deep learning models configured for semiconductor applications
JP6833027B2 (en) * 2016-10-17 2021-02-24 ケーエルエー コーポレイション Optimization of training sets used to set up inspection-related algorithms
KR102011628B1 (en) * 2016-12-06 2019-08-16 미쓰비시덴키 가부시키가이샤 Inspection device and inspection method
US10692690B2 (en) * 2017-03-27 2020-06-23 Kla-Tencor Corporation Care areas for improved electron beam defect detection
TWI751329B (en) * 2017-05-15 2022-01-01 美商克萊譚克公司 High accuracy of relative defect locations for repeater analysis
US10209615B2 (en) 2017-05-26 2019-02-19 Xtal, Inc. Simulating near field image in optical lithography
US10713534B2 (en) * 2017-09-01 2020-07-14 Kla-Tencor Corp. Training a learning based defect classifier
CN111837226B (en) * 2018-03-05 2024-03-08 科磊股份有限公司 Visualization of three-dimensional semiconductor structures
US10794839B2 (en) 2019-02-22 2020-10-06 Kla Corporation Visualization of three-dimensional semiconductor structures
US10599951B2 (en) * 2018-03-28 2020-03-24 Kla-Tencor Corp. Training a neural network for defect detection in low resolution images
KR102630568B1 (en) 2018-06-15 2024-01-29 삼성전자주식회사 Method for manufacturing semiconductor device
KR20210021369A (en) * 2018-07-13 2021-02-25 에이에스엠엘 네델란즈 비.브이. SEM image enhancement methods and systems
JP7215882B2 (en) * 2018-11-15 2023-01-31 株式会社ニューフレアテクノロジー PATTERN INSPECTION APPARATUS AND PATTERN INSPECTION METHOD
KR20210011278A (en) * 2019-07-22 2021-02-01 삼성전자주식회사 Inspection method based on IE(Imaging Ellipsometry), and method for fabricating semiconductor device using the inspection method
US11501424B2 (en) * 2019-11-18 2022-11-15 Stmicroelectronics (Rousset) Sas Neural network training device, system and method
US11901232B2 (en) * 2020-06-22 2024-02-13 Applied Materials, Inc. Automatic kerf offset mapping and correction system for laser dicing
CN114551263A (en) * 2020-11-26 2022-05-27 中国移动通信有限公司研究院 Chip or chip module detection method and device
US20220301133A1 (en) * 2021-03-16 2022-09-22 Kla Corporation Segmentation of design care areas with a rendered design image
TWI794899B (en) * 2021-07-21 2023-03-01 國立高雄大學 Chip surface detecting system
JP7465307B2 (en) 2021-10-01 2024-04-10 キヤノン株式会社 Simulation device, method for controlling simulation device, and program
CN115018068B (en) * 2022-05-30 2023-02-17 福建天甫电子材料有限公司 Automatic batching system and batching method for production of photoresist cleaning solution

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US6966047B1 (en) * 2002-04-09 2005-11-15 Kla-Tencor Technologies Corporation Capturing designer intent in reticle inspection
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Also Published As

Publication number Publication date
US20160290934A1 (en) 2016-10-06
KR20170136566A (en) 2017-12-11
KR102341973B1 (en) 2021-12-23
CN107454980B (en) 2022-07-01
WO2016161370A1 (en) 2016-10-06
TWI665445B (en) 2019-07-11
TW201702587A (en) 2017-01-16
US10012599B2 (en) 2018-07-03
CN107454980A (en) 2017-12-08
IL254468B (en) 2021-06-30

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