HK1255949A1 - 半導體器件 - Google Patents
半導體器件Info
- Publication number
- HK1255949A1 HK1255949A1 HK18115022.0A HK18115022A HK1255949A1 HK 1255949 A1 HK1255949 A1 HK 1255949A1 HK 18115022 A HK18115022 A HK 18115022A HK 1255949 A1 HK1255949 A1 HK 1255949A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- semiconductor device
- semiconductor
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B62—LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
- B62D—MOTOR VEHICLES; TRAILERS
- B62D5/00—Power-assisted or power-driven steering
- B62D5/04—Power-assisted or power-driven steering electrical, e.g. using an electric servo-motor connected to, or forming part of, the steering gear
- B62D5/0403—Power-assisted or power-driven steering electrical, e.g. using an electric servo-motor connected to, or forming part of, the steering gear characterised by constructional features, e.g. common housing for motor and gear box
- B62D5/0406—Power-assisted or power-driven steering electrical, e.g. using an electric servo-motor connected to, or forming part of, the steering gear characterised by constructional features, e.g. common housing for motor and gear box including housing for electronic control unit
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US10356926B1 (en) * | 2017-12-28 | 2019-07-16 | Deere & Company | Electronic assembly with enhanced high power density |
US10714418B2 (en) * | 2018-03-26 | 2020-07-14 | Texas Instruments Incorporated | Electronic device having inverted lead pins |
CN110323273A (zh) | 2018-03-30 | 2019-10-11 | 富士电机株式会社 | 半导体装置、半导体封装、半导体模块及半导体电路装置 |
JP7144112B2 (ja) | 2018-09-19 | 2022-09-29 | ローム株式会社 | 半導体装置 |
JP7266508B2 (ja) | 2019-10-21 | 2023-04-28 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
TWI716238B (zh) * | 2019-12-26 | 2021-01-11 | 財團法人工業技術研究院 | 高功率模組 |
CN211908640U (zh) * | 2020-05-19 | 2020-11-10 | 阳光电源股份有限公司 | 一种功率变换装置 |
CN112040718B (zh) * | 2020-07-28 | 2023-05-16 | 湖北清江水电开发有限责任公司 | 一种灌胶防水型火灾探测器终端盒 |
US20230402354A1 (en) * | 2020-10-20 | 2023-12-14 | Rohm Co., Ltd. | Semiconductor device |
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US6319755B1 (en) * | 1999-12-01 | 2001-11-20 | Amkor Technology, Inc. | Conductive strap attachment process that allows electrical connector between an integrated circuit die and leadframe |
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US9324646B2 (en) * | 2010-12-13 | 2016-04-26 | Infineon Technologies America Corp. | Open source power quad flat no-lead (PQFN) package |
JP5821949B2 (ja) * | 2011-04-18 | 2015-11-24 | 三菱電機株式会社 | 半導体装置及びこれを備えたインバータ装置、並びにこれらを備えた車両用回転電機 |
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JP6633859B2 (ja) * | 2015-07-31 | 2020-01-22 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
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KR20200067233A (ko) | 2020-06-12 |
JP2018121035A (ja) | 2018-08-02 |
US10204849B2 (en) | 2019-02-12 |
TWI762535B (zh) | 2022-05-01 |
TW201828448A (zh) | 2018-08-01 |
US20180218969A1 (en) | 2018-08-02 |
KR102378192B1 (ko) | 2022-03-24 |
EP3355350A1 (en) | 2018-08-01 |
CN108364942B (zh) | 2023-04-18 |
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