HK1107594A1 - Laser processing system and its method - Google Patents

Laser processing system and its method

Info

Publication number
HK1107594A1
HK1107594A1 HK08101172.0A HK08101172A HK1107594A1 HK 1107594 A1 HK1107594 A1 HK 1107594A1 HK 08101172 A HK08101172 A HK 08101172A HK 1107594 A1 HK1107594 A1 HK 1107594A1
Authority
HK
Hong Kong
Prior art keywords
processing system
laser processing
laser
processing
Prior art date
Application number
HK08101172.0A
Inventor
Kazuma Kurihara
Takashi Nakano
Yuzo Yamakawa
Junji Tominaga
Osamu Nagumo
Masahiko Ujiie
Hirobumi Ikeya
Takayuki Hayashi
Original Assignee
Nat Inst Of Advanced Ind Scien
Pulstec Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nat Inst Of Advanced Ind Scien, Pulstec Ind Co Ltd filed Critical Nat Inst Of Advanced Ind Scien
Publication of HK1107594A1 publication Critical patent/HK1107594A1/en

Links

HK08101172.0A 2006-02-16 2008-01-30 Laser processing system and its method HK1107594A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006039850A JP5034015B2 (en) 2006-02-16 2006-02-16 Laser processing apparatus and processing method thereof

Publications (1)

Publication Number Publication Date
HK1107594A1 true HK1107594A1 (en) 2008-04-11

Family

ID=38494064

Family Applications (1)

Application Number Title Priority Date Filing Date
HK08101172.0A HK1107594A1 (en) 2006-02-16 2008-01-30 Laser processing system and its method

Country Status (4)

Country Link
JP (1) JP5034015B2 (en)
CN (1) CN101025576B (en)
HK (1) HK1107594A1 (en)
TW (1) TWI416267B (en)

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Publication number Priority date Publication date Assignee Title
JP2009082932A (en) * 2007-09-28 2009-04-23 Pulstec Industrial Co Ltd Laser beam machining apparatus and laser beam machining method
TWI417181B (en) 2008-01-25 2013-12-01 Asahi Kasei E Materials Corp The manufacturing method of seamless mold
JP4972015B2 (en) 2008-03-10 2012-07-11 富士フイルム株式会社 Mold processing method and manufacturing method
JP4911104B2 (en) * 2008-04-21 2012-04-04 パルステック工業株式会社 Laser processing apparatus and laser processing method
JP5181919B2 (en) * 2008-08-19 2013-04-10 パルステック工業株式会社 Laser processing apparatus and laser processing method
JP5336793B2 (en) 2008-08-29 2013-11-06 富士フイルム株式会社 Pattern forming body manufacturing method and electromagnetic beam processing apparatus
JP5111305B2 (en) 2008-08-29 2013-01-09 富士フイルム株式会社 Pattern forming body and manufacturing method thereof
EP2163339B1 (en) * 2008-09-11 2016-11-02 Bystronic Laser AG Laser cutting assembly for cutting a work piece with a laser beam with a variable cutting speed
JP4962508B2 (en) * 2009-02-24 2012-06-27 パルステック工業株式会社 Laser processing apparatus and pulse signal output method for laser driving in laser processing apparatus
CN102495534B (en) * 2011-12-12 2013-12-25 中国科学院上海光学精密机械研究所 Galvanometer type laser direct writing photoetching machine
JP6651123B2 (en) * 2015-01-08 2020-02-19 株式会社リコー Light source driving device, light source device, distance measuring device, moving body device, laser beam machine, and light source driving method
JP6392804B2 (en) * 2016-03-29 2018-09-19 ファナック株式会社 Laser processing apparatus that performs gap sensor correction and reflected light profile measurement simultaneously, and correlation table generation method for laser processing apparatus
US9835959B1 (en) * 2016-10-17 2017-12-05 Cymer, Llc Controlling for wafer stage vibration
CN106918920B (en) * 2017-04-20 2023-02-07 长春理工大学 Using polarized CO 2 Device and method for processing antifogging structure of lens by laser interference
CN109353011B (en) * 2018-10-30 2021-07-20 大族激光科技产业集团股份有限公司 Monitoring method of laser welding plastic
US11273520B2 (en) * 2019-01-31 2022-03-15 General Electric Company System and method for automated laser ablation
CN115635184A (en) * 2021-07-20 2023-01-24 展扬自动化(东莞)有限公司 Laser device with regulating function

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JPH0768396A (en) * 1993-09-02 1995-03-14 Hitachi Constr Mach Co Ltd Laser beam machine
JPH08174255A (en) * 1994-12-27 1996-07-09 Komatsu Ltd Focus detector for laser beam machine
JP3746555B2 (en) * 1996-02-06 2006-02-15 株式会社フジクラ Laser processing apparatus and laser processing method using the same
JPH10113781A (en) * 1996-10-09 1998-05-06 Hitachi Seiko Ltd Laser beam machining method
JP3745225B2 (en) * 1997-12-26 2006-02-15 三菱電機株式会社 Laser processing equipment
CN1124917C (en) * 1997-12-26 2003-10-22 三菱电机株式会社 Laser processing apparatus
JP2000292934A (en) * 1999-04-08 2000-10-20 Seiko Epson Corp Laser plotting system and laser plotting method
JP2001015017A (en) * 1999-06-30 2001-01-19 Toshiba Lighting & Technology Corp Fluorescent lamp and its manufacture
JP2001133987A (en) * 1999-11-04 2001-05-18 Seiko Epson Corp Method and device for laser plotting
TW478032B (en) * 1999-11-04 2002-03-01 Seiko Epson Corp Method and device for laser plotting, hologram master and the manufacturing method thereof
JP2001150171A (en) * 1999-11-26 2001-06-05 Nippon Sharyo Seizo Kaisha Ltd Focus adjustment method and apparatus for laser beam machine
JP2001208993A (en) * 2000-01-25 2001-08-03 Sumitomo Heavy Ind Ltd Laser plotting method and plotting device
JP4479065B2 (en) * 2000-06-22 2010-06-09 株式会社Ｉｈｉ Laser processing equipment

Also Published As

Publication number Publication date
TWI416267B (en) 2013-11-21
TW200801832A (en) 2008-01-01
CN101025576A (en) 2007-08-29
JP5034015B2 (en) 2012-09-26
CN101025576B (en) 2012-02-08
JP2007216263A (en) 2007-08-30

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20170216