HK1038439A1 - Semiconductor device and a process for forming the semiconductor device - Google Patents

Semiconductor device and a process for forming the semiconductor device

Info

Publication number
HK1038439A1
HK1038439A1 HK02100095.2A HK02100095A HK1038439A1 HK 1038439 A1 HK1038439 A1 HK 1038439A1 HK 02100095 A HK02100095 A HK 02100095A HK 1038439 A1 HK1038439 A1 HK 1038439A1
Authority
HK
Hong Kong
Prior art keywords
semiconductor device
forming
semiconductor
Prior art date
Application number
HK02100095.2A
Other languages
Chinese (zh)
Inventor
斯圖爾特‧E‧格裏爾
Original Assignee
自由度半導體公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 自由度半導體公司 filed Critical 自由度半導體公司
Publication of HK1038439A1 publication Critical patent/HK1038439A1/en

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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides

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HK02100095.2A 2000-01-03 2002-01-07 Semiconductor device and a process for forming the semiconductor device HK1038439A1 (en)

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US09/476,810 US6346469B1 (en) 2000-01-03 2000-01-03 Semiconductor device and a process for forming the semiconductor device

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SG90219A1 (en) 2002-07-23
CN100355065C (en) 2007-12-12
JP2001196409A (en) 2001-07-19
JP4698826B2 (en) 2011-06-08
KR20010070397A (en) 2001-07-25
US6346469B1 (en) 2002-02-12
KR100762111B1 (en) 2007-10-02
TW473956B (en) 2002-01-21

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