GB8518145D0 - Etching of copper films on circuit boards - Google Patents

Etching of copper films on circuit boards

Info

Publication number
GB8518145D0
GB8518145D0 GB858518145A GB8518145A GB8518145D0 GB 8518145 D0 GB8518145 D0 GB 8518145D0 GB 858518145 A GB858518145 A GB 858518145A GB 8518145 A GB8518145 A GB 8518145A GB 8518145 D0 GB8518145 D0 GB 8518145D0
Authority
GB
United Kingdom
Prior art keywords
etching
circuit boards
copper films
films
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB858518145A
Other versions
GB2163101A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HOELLMUELLER MASCHBAU H
Original Assignee
HOELLMUELLER MASCHBAU H
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HOELLMUELLER MASCHBAU H filed Critical HOELLMUELLER MASCHBAU H
Publication of GB8518145D0 publication Critical patent/GB8518145D0/en
Publication of GB2163101A publication Critical patent/GB2163101A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/46—Regeneration of etching compositions
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/32—Alkaline compositions
    • C23F1/34—Alkaline compositions for etching copper or alloys thereof

Landscapes

  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Catalysts (AREA)
  • Chemically Coating (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Manufacturing Of Printed Wiring (AREA)
GB08518145A 1984-08-14 1985-07-18 Etching of copper films on circuit boards Withdrawn GB2163101A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19843429902 DE3429902A1 (en) 1984-08-14 1984-08-14 METHOD FOR ETCHING COPPER FILMS ON BOARDS UNDER ELECTROLYTIC RECOVERY OF COPPER FROM THE ACET SOLUTION

Publications (2)

Publication Number Publication Date
GB8518145D0 true GB8518145D0 (en) 1985-08-21
GB2163101A GB2163101A (en) 1986-02-19

Family

ID=6243027

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08518145A Withdrawn GB2163101A (en) 1984-08-14 1985-07-18 Etching of copper films on circuit boards

Country Status (10)

Country Link
JP (1) JPS61106782A (en)
AT (1) AT387590B (en)
BE (1) BE903054A (en)
BR (1) BR8503833A (en)
DE (1) DE3429902A1 (en)
FR (1) FR2569205A1 (en)
GB (1) GB2163101A (en)
IT (1) IT1185341B (en)
NL (1) NL8502245A (en)
SE (1) SE8503594L (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT395177B (en) * 1990-07-05 1992-10-12 Provera Gmbh RESOLUTION
US5431776A (en) * 1993-09-08 1995-07-11 Phibro-Tech, Inc. Copper etchant solution additives
CH689018A5 (en) * 1994-09-08 1998-07-31 Ecochem Ag A method of electrowinning of heavy metals.
DE102006036888A1 (en) * 2005-11-10 2007-05-16 Eve Recycling Sarl Regenerable etching solution
WO2012171209A1 (en) * 2011-06-17 2012-12-20 Empire Technology Development Llc Reclaiming metal from articles

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3324450A1 (en) * 1983-07-07 1985-01-17 ELO-CHEM Ätztechnik GmbH, 7758 Meersburg AMMONIUM SULFATE-CONTAINING ETCH SOLUTION AND METHOD FOR REGENERATING THE ETCH SOLUTION
DE3340342A1 (en) * 1983-11-08 1985-05-15 ELO-CHEM Ätztechnik GmbH, 7758 Meersburg METHOD AND PLANT FOR REGENERATING AN AMMONIA ACID SOLUTION

Also Published As

Publication number Publication date
DE3429902A1 (en) 1986-02-27
SE8503594D0 (en) 1985-07-25
FR2569205A1 (en) 1986-02-21
ATA235785A (en) 1988-07-15
BE903054A (en) 1985-12-02
JPS61106782A (en) 1986-05-24
BR8503833A (en) 1986-05-27
AT387590B (en) 1989-02-10
GB2163101A (en) 1986-02-19
NL8502245A (en) 1986-03-03
IT1185341B (en) 1987-11-12
SE8503594L (en) 1986-02-15
IT8521796A0 (en) 1985-07-31

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)