GB2594105B - Apparatus to provide improved cooling of data signal processing apparatus - Google Patents
Apparatus to provide improved cooling of data signal processing apparatus Download PDFInfo
- Publication number
- GB2594105B GB2594105B GB2011894.9A GB202011894A GB2594105B GB 2594105 B GB2594105 B GB 2594105B GB 202011894 A GB202011894 A GB 202011894A GB 2594105 B GB2594105 B GB 2594105B
- Authority
- GB
- United Kingdom
- Prior art keywords
- signal processing
- data signal
- provide improved
- improved cooling
- processing apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000001816 cooling Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
- H05K7/1427—Housings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GBGB2005524.0A GB202005524D0 (en) | 2020-04-16 | 2020-04-16 | Improving cooling of data signal processing apparatus |
Publications (3)
Publication Number | Publication Date |
---|---|
GB202011894D0 GB202011894D0 (en) | 2020-09-16 |
GB2594105A GB2594105A (en) | 2021-10-20 |
GB2594105B true GB2594105B (en) | 2024-04-03 |
Family
ID=70860135
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GBGB2005524.0A Ceased GB202005524D0 (en) | 2020-04-16 | 2020-04-16 | Improving cooling of data signal processing apparatus |
GB2011894.9A Active GB2594105B (en) | 2020-04-16 | 2020-07-30 | Apparatus to provide improved cooling of data signal processing apparatus |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GBGB2005524.0A Ceased GB202005524D0 (en) | 2020-04-16 | 2020-04-16 | Improving cooling of data signal processing apparatus |
Country Status (1)
Country | Link |
---|---|
GB (2) | GB202005524D0 (en) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5616421A (en) * | 1991-04-08 | 1997-04-01 | Aluminum Company Of America | Metal matrix composites containing electrical insulators |
WO2000067541A1 (en) * | 1999-04-30 | 2000-11-09 | Pacific Aerospace And Electronics, Inc. | Composite electronics packages and methods of manufacture |
US20100046172A1 (en) * | 2008-08-20 | 2010-02-25 | H-Tech, Llc | Electronics package including heat sink in the housing and related methods |
CN106852068A (en) * | 2016-12-05 | 2017-06-13 | 广东欧珀移动通信有限公司 | Housing, radiating subassembly and mobile terminal |
US20170215271A1 (en) * | 2014-09-29 | 2017-07-27 | Hitachi Automotive Systems, Ltd. | In-Vehicle Controller |
-
2020
- 2020-04-16 GB GBGB2005524.0A patent/GB202005524D0/en not_active Ceased
- 2020-07-30 GB GB2011894.9A patent/GB2594105B/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5616421A (en) * | 1991-04-08 | 1997-04-01 | Aluminum Company Of America | Metal matrix composites containing electrical insulators |
WO2000067541A1 (en) * | 1999-04-30 | 2000-11-09 | Pacific Aerospace And Electronics, Inc. | Composite electronics packages and methods of manufacture |
US20100046172A1 (en) * | 2008-08-20 | 2010-02-25 | H-Tech, Llc | Electronics package including heat sink in the housing and related methods |
US20170215271A1 (en) * | 2014-09-29 | 2017-07-27 | Hitachi Automotive Systems, Ltd. | In-Vehicle Controller |
CN106852068A (en) * | 2016-12-05 | 2017-06-13 | 广东欧珀移动通信有限公司 | Housing, radiating subassembly and mobile terminal |
Also Published As
Publication number | Publication date |
---|---|
GB202011894D0 (en) | 2020-09-16 |
GB202005524D0 (en) | 2020-06-03 |
GB2594105A (en) | 2021-10-20 |
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