GB2314973B - Semiconductor device and its manufacturing method - Google Patents

Semiconductor device and its manufacturing method

Info

Publication number
GB2314973B
GB2314973B GB9713545A GB9713545A GB2314973B GB 2314973 B GB2314973 B GB 2314973B GB 9713545 A GB9713545 A GB 9713545A GB 9713545 A GB9713545 A GB 9713545A GB 2314973 B GB2314973 B GB 2314973B
Authority
GB
United Kingdom
Prior art keywords
manufacturing
semiconductor device
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9713545A
Other versions
GB9713545D0 (en
GB2314973A (en
Inventor
Jae Kap Kim
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SK Hynix Inc
Original Assignee
Hyundai Electronics Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hyundai Electronics Industries Co Ltd filed Critical Hyundai Electronics Industries Co Ltd
Publication of GB9713545D0 publication Critical patent/GB9713545D0/en
Publication of GB2314973A publication Critical patent/GB2314973A/en
Application granted granted Critical
Publication of GB2314973B publication Critical patent/GB2314973B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/10Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
    • H01L29/1025Channel region of field-effect devices
    • H01L29/1029Channel region of field-effect devices of field-effect transistors
    • H01L29/1033Channel region of field-effect devices of field-effect transistors with insulated gate, e.g. characterised by the length, the width, the geometric contour or the doping structure
    • H01L29/1041Channel region of field-effect devices of field-effect transistors with insulated gate, e.g. characterised by the length, the width, the geometric contour or the doping structure with a non-uniform doping structure in the channel region surface
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/10Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
    • H01L29/1025Channel region of field-effect devices
    • H01L29/1029Channel region of field-effect devices of field-effect transistors
    • H01L29/1033Channel region of field-effect devices of field-effect transistors with insulated gate, e.g. characterised by the length, the width, the geometric contour or the doping structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Thin Film Transistor (AREA)
GB9713545A 1996-06-29 1997-06-26 Semiconductor device and its manufacturing method Expired - Fee Related GB2314973B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019960026296A KR100233558B1 (en) 1996-06-29 1996-06-29 Manufacturing method of a semiconductor device

Publications (3)

Publication Number Publication Date
GB9713545D0 GB9713545D0 (en) 1997-09-03
GB2314973A GB2314973A (en) 1998-01-14
GB2314973B true GB2314973B (en) 2001-09-19

Family

ID=19465048

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9713545A Expired - Fee Related GB2314973B (en) 1996-06-29 1997-06-26 Semiconductor device and its manufacturing method

Country Status (6)

Country Link
JP (1) JPH1070272A (en)
KR (1) KR100233558B1 (en)
CN (1) CN1136613C (en)
DE (1) DE19727491A1 (en)
GB (1) GB2314973B (en)
TW (1) TW416113B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7304354B2 (en) 2004-02-17 2007-12-04 Silicon Space Technology Corp. Buried guard ring and radiation hardened isolation structures and fabrication methods
WO2007061531A2 (en) 2005-10-14 2007-05-31 Silicon Space Technology Corporation Radiation hardened isolation structures and fabrication methods
JP4288355B2 (en) * 2006-01-31 2009-07-01 国立大学法人北陸先端科学技術大学院大学 Ternary logic function circuit
WO2007108104A1 (en) * 2006-03-20 2007-09-27 Fujitsu Limited Semiconductor device and its fabrication process
JP2009267027A (en) * 2008-04-24 2009-11-12 Seiko Epson Corp Semiconductor device, and method for manufacturing thereof
US10038058B2 (en) 2016-05-07 2018-07-31 Silicon Space Technology Corporation FinFET device structure and method for forming same

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2084794A (en) * 1980-10-03 1982-04-15 Philips Electronic Associated Methods of manufacturing insulated gate field effect transistors
EP0164449A2 (en) * 1984-03-16 1985-12-18 Hitachi, Ltd. Process for producing a semiconductor integrated circuit device including a MISFET
EP0208935A1 (en) * 1985-06-19 1987-01-21 Fujitsu Limited Narrow channel width fet
EP0239250A2 (en) * 1986-02-28 1987-09-30 Kabushiki Kaisha Toshiba Short channel MOS transistor
US5396096A (en) * 1992-10-07 1995-03-07 Matsushita Electric Industrial Co., Ltd. Semiconductor device and manufacturing method thereof
US5432107A (en) * 1992-11-04 1995-07-11 Matsushita Electric Industrial Co., Ltd. Semiconductor fabricating method forming channel stopper with diagonally implanted ions
US5447875A (en) * 1993-04-22 1995-09-05 Texas Instruments Incorporated Self-aligned silicided gate process

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6425438A (en) * 1987-07-21 1989-01-27 Sony Corp Manufacture of semiconductor device
JPH0235778A (en) * 1988-07-26 1990-02-06 Seiko Epson Corp Semiconductor device
US5525823A (en) * 1992-05-08 1996-06-11 Sgs-Thomson Microelectronics, Inc. Manufacture of CMOS devices

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2084794A (en) * 1980-10-03 1982-04-15 Philips Electronic Associated Methods of manufacturing insulated gate field effect transistors
EP0164449A2 (en) * 1984-03-16 1985-12-18 Hitachi, Ltd. Process for producing a semiconductor integrated circuit device including a MISFET
EP0208935A1 (en) * 1985-06-19 1987-01-21 Fujitsu Limited Narrow channel width fet
EP0239250A2 (en) * 1986-02-28 1987-09-30 Kabushiki Kaisha Toshiba Short channel MOS transistor
US5396096A (en) * 1992-10-07 1995-03-07 Matsushita Electric Industrial Co., Ltd. Semiconductor device and manufacturing method thereof
US5432107A (en) * 1992-11-04 1995-07-11 Matsushita Electric Industrial Co., Ltd. Semiconductor fabricating method forming channel stopper with diagonally implanted ions
US5447875A (en) * 1993-04-22 1995-09-05 Texas Instruments Incorporated Self-aligned silicided gate process

Also Published As

Publication number Publication date
CN1173739A (en) 1998-02-18
GB9713545D0 (en) 1997-09-03
TW416113B (en) 2000-12-21
JPH1070272A (en) 1998-03-10
GB2314973A (en) 1998-01-14
DE19727491A1 (en) 1998-01-02
CN1136613C (en) 2004-01-28
KR100233558B1 (en) 1999-12-01
KR980006490A (en) 1998-03-30

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Legal Events

Date Code Title Description
732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20090626