GB1418169A - Resist image formation process and resin compositions and materials for use in said process - Google Patents
Resist image formation process and resin compositions and materials for use in said processInfo
- Publication number
- GB1418169A GB1418169A GB903473A GB903473A GB1418169A GB 1418169 A GB1418169 A GB 1418169A GB 903473 A GB903473 A GB 903473A GB 903473 A GB903473 A GB 903473A GB 1418169 A GB1418169 A GB 1418169A
- Authority
- GB
- United Kingdom
- Prior art keywords
- formula
- epoxy resin
- compound
- feb
- bis
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000015572 biosynthetic process Effects 0.000 title 1
- 239000000463 material Substances 0.000 title 1
- 239000011342 resin composition Substances 0.000 title 1
- 150000001875 compounds Chemical class 0.000 abstract 4
- 239000000203 mixture Substances 0.000 abstract 4
- 239000003822 epoxy resin Substances 0.000 abstract 3
- 229920000647 polyepoxide Polymers 0.000 abstract 3
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 abstract 2
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 abstract 2
- 229920001897 terpolymer Polymers 0.000 abstract 2
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 abstract 1
- 239000002253 acid Substances 0.000 abstract 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 abstract 1
- HFBMWMNUJJDEQZ-UHFFFAOYSA-N acryloyl chloride Chemical compound ClC(=O)C=C HFBMWMNUJJDEQZ-UHFFFAOYSA-N 0.000 abstract 1
- WNLRTRBMVRJNCN-UHFFFAOYSA-L adipate(2-) Chemical compound [O-]C(=O)CCCCC([O-])=O WNLRTRBMVRJNCN-UHFFFAOYSA-L 0.000 abstract 1
- 125000000217 alkyl group Chemical group 0.000 abstract 1
- 150000001412 amines Chemical class 0.000 abstract 1
- 125000003118 aryl group Chemical group 0.000 abstract 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 abstract 1
- 229920001577 copolymer Polymers 0.000 abstract 1
- -1 glycidyl ester Chemical class 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 239000013034 phenoxy resin Substances 0.000 abstract 1
- 229920006287 phenoxy resin Polymers 0.000 abstract 1
- 229920002120 photoresistant polymer Polymers 0.000 abstract 1
- 229920000642 polymer Polymers 0.000 abstract 1
- 230000000379 polymerizing effect Effects 0.000 abstract 1
- 239000000126 substance Substances 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/031—Organic compounds not covered by group G03F7/029
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/38—Treatment before imagewise removal, e.g. prebaking
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Epoxy Resins (AREA)
Abstract
1418169 Photocurable compositions; nitrobenzyl acrylate copolymers HITACHI CHEMICAL CO Ltd 23 Feb 1973 [25 Feb 1972 6 March 1972] 9034/73 Headings C3B and C3P [Also in Division G2] A photocurable composition useful in producing photoresists comprises an epoxy resin and a compound containing at least two groups represented by one of the formula wherein R<SP>1</SP>, R<SP>2</SP> and R<SP>3</SP> are H, alkyl or aryl. Specified compounds are bis-(o-nitrodiphenylmethyl)adipate and N,N<SP>1</SP>-bis-(o-nitrodiphenylmethyloxycarbonyl)hexamethylene diamine which on exposure to light produce a carboxylic acid or an amine which on heating cures the epoxy resin. The composition may also contain a phenoxy resin. Alternatively the compound can be produced by polymerizing acrylic acid chloride with a compound of formula wherein R 1 is as above. Alternatively a polymer of a glycidyl ester of an unsaturated acid also containing at least 2 groups of Formula I may be used as the photocurable composition, e.g. a glycidyl methacrylate/o-nitrobenzyl acrylate/methyl methacrylate terpolymer prepared as set out in Example 3. Acrylic terpolymers containing glycidyl methacrylate may also be used as the epoxy resin (c.f. Example 4).
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1894072A JPS5146159B2 (en) | 1972-02-25 | 1972-02-25 | |
| JP47022252A JPS5228370B2 (en) | 1972-03-06 | 1972-03-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1418169A true GB1418169A (en) | 1975-12-17 |
Family
ID=26355704
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB903473A Expired GB1418169A (en) | 1972-02-25 | 1973-02-23 | Resist image formation process and resin compositions and materials for use in said process |
Country Status (1)
| Country | Link |
|---|---|
| GB (1) | GB1418169A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2140929A (en) * | 1983-04-29 | 1984-12-05 | American Telephone & Telegraph | Process for making semiconductors devices |
| US5356755A (en) * | 1989-05-17 | 1994-10-18 | Asahi Kasei Kogyo Kabushiki Kaisha | Method for producing printed circuit board using photocurable resin laminate |
| CN112955429A (en) * | 2018-11-20 | 2021-06-11 | 优迈特株式会社 | Novel urethane compound and acrylic rubber composition containing the same |
-
1973
- 1973-02-23 GB GB903473A patent/GB1418169A/en not_active Expired
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2140929A (en) * | 1983-04-29 | 1984-12-05 | American Telephone & Telegraph | Process for making semiconductors devices |
| US5356755A (en) * | 1989-05-17 | 1994-10-18 | Asahi Kasei Kogyo Kabushiki Kaisha | Method for producing printed circuit board using photocurable resin laminate |
| CN112955429A (en) * | 2018-11-20 | 2021-06-11 | 优迈特株式会社 | Novel urethane compound and acrylic rubber composition containing the same |
| CN112955429B (en) * | 2018-11-20 | 2022-01-07 | 优迈特株式会社 | Novel urethane compound and acrylic rubber composition containing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| DE2309062A1 (en) | 1973-09-13 |
| DE2309062B2 (en) | 1976-11-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| GB1476528A (en) | Highly reactive resin compositions hardenable by uv-light | |
| JPS5666841A (en) | Photographic material | |
| DE3069448D1 (en) | Photocrosslinkable copolymers, photosensitive recording material containing them, its utilisation in the production of photographic pictures and process for the production of photographic pictures | |
| GB1406467A (en) | Photosensitizers for radiation curable compositions | |
| ES458112A1 (en) | Novel inversion process | |
| JPS56141321A (en) | Photosetting resin composition | |
| FR2332290A1 (en) | ACRYLIC ESTERS BASED MASSES, POLYMERIZABLE BY MEANS OF ULTRA-VIOLET RAYS | |
| JPS56129212A (en) | Photosensitive polyamide resin composition | |
| JPS6428630A (en) | Resin composition cross linkable by photopolymerization | |
| GB1489830A (en) | Acrylic powder paint compositions | |
| GB1418169A (en) | Resist image formation process and resin compositions and materials for use in said process | |
| SE7614315L (en) | PHOTOPOLYMERIZABLE MATERIAL | |
| JPS55149331A (en) | Modifier for synthetic resin | |
| JPS5643353A (en) | Hardening method of gelatine | |
| JPS5611920A (en) | Polymerizable composition | |
| JPS6448059A (en) | Photoresist composition | |
| GB1401768A (en) | Polymerisable unsaturated oxazolidines and tetrahydro-1,3-oxa zines and polymers thereof | |
| KR950000789A (en) | Curing System of Polyacrylic Acid Rubber | |
| JPS55116782A (en) | Antiblock agent and its use | |
| JPS5614232A (en) | Negative type resist resin | |
| JPS55153936A (en) | Storage-stabilized photosensitive resin composition for flexographic plate | |
| JPS5690874A (en) | Adhesive composition for pvc/steel plate bonding | |
| JPS5394343A (en) | Coating composition | |
| ES452378A1 (en) | Stabilization of vinyl chloride polymers by means of lactone compounds | |
| JPS55110249A (en) | Lithographic printing plate requiring no wetting water |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed | ||
| PE20 | Patent expired after termination of 20 years |
Effective date: 19930222 |