GB1409737A - Through-hole plated printed circuits - Google Patents

Through-hole plated printed circuits

Info

Publication number
GB1409737A
GB1409737A GB4515872A GB4515872A GB1409737A GB 1409737 A GB1409737 A GB 1409737A GB 4515872 A GB4515872 A GB 4515872A GB 4515872 A GB4515872 A GB 4515872A GB 1409737 A GB1409737 A GB 1409737A
Authority
GB
United Kingdom
Prior art keywords
hole
layers
over
layer
holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4515872A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EXACTA CIRCUITS Ltd
Original Assignee
EXACTA CIRCUITS Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EXACTA CIRCUITS Ltd filed Critical EXACTA CIRCUITS Ltd
Priority to GB4515872A priority Critical patent/GB1409737A/en
Publication of GB1409737A publication Critical patent/GB1409737A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/243—Reinforcing the conductive pattern characterised by selective plating, e.g. for finish plating of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0505—Double exposure of the same photosensitive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

1409737 Printed circuits EXACTA CIRCUITS Ltd 28 Sept 1973 [29 Sept 1972] 45158/72 Heading H1R A substrate of GRP is coated on each exposed face with a first layer of copper, and a hole or holes extends through the substrate and incumbent layers. In fabrication of a through hole printed circuit two additional layers are plated over the copper and the wall of each hole; one being thin and electrolessly deposited and the other being thicker and electroplated on using the one as an electrode. The first layer and the additional layers may be of Cu. A layer of positive photo-resist is applied over the metal layers but not over the walls of the holes, and selectively illuminated round the holes over a photo-mask enabling the exposed portions to be developed and dissolved out, leaving the metallic layers selectively uncovered. A layer of Sn-Pb alloy or gold or other noble metal is electroplated on the exposed portions surrounding the holes and the walls thereof. The photoresist is again exposed over another mask to define and isolate the required tracks; the layers being etched out where unprotected by the photo-resist or Sn-Pb alloy to produce a through hole printed circuit with a Sn-Pb pad surrounding each hole. The remaining photoresist is then removed, and the boards are profiled, cleaned, and coated with epoxy solder resisting lacquer.
GB4515872A 1972-09-29 1972-09-29 Through-hole plated printed circuits Expired GB1409737A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB4515872A GB1409737A (en) 1972-09-29 1972-09-29 Through-hole plated printed circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB4515872A GB1409737A (en) 1972-09-29 1972-09-29 Through-hole plated printed circuits

Publications (1)

Publication Number Publication Date
GB1409737A true GB1409737A (en) 1975-10-15

Family

ID=10436117

Family Applications (1)

Application Number Title Priority Date Filing Date
GB4515872A Expired GB1409737A (en) 1972-09-29 1972-09-29 Through-hole plated printed circuits

Country Status (1)

Country Link
GB (1) GB1409737A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2502444A1 (en) * 1981-03-18 1982-09-24 Licentia Gmbh PROCESS FOR PRODUCING PRINTED CIRCUITS
US4572925A (en) * 1983-03-15 1986-02-25 Standard Telephones And Cables Public Limited Company Printed circuit boards with solderable plating finishes and method of making the same
GB2305299A (en) * 1995-09-12 1997-04-02 Irish Circuits Ltd Printed circuit board production process
GB2307351A (en) * 1995-11-16 1997-05-21 Marconi Gec Ltd Printed circuit boards and their manufacture
WO2007131477A1 (en) * 2006-05-13 2007-11-22 Conti Temic Microelectronic Gmbh Method for producing a carrier plate for a circuit, carrier plate produced according to such a method, and circuit comprising such a carrier plate
CN112291941A (en) * 2019-07-24 2021-01-29 北大方正集团有限公司 Printed circuit board and preparation method thereof

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2502444A1 (en) * 1981-03-18 1982-09-24 Licentia Gmbh PROCESS FOR PRODUCING PRINTED CIRCUITS
US4572925A (en) * 1983-03-15 1986-02-25 Standard Telephones And Cables Public Limited Company Printed circuit boards with solderable plating finishes and method of making the same
GB2305299A (en) * 1995-09-12 1997-04-02 Irish Circuits Ltd Printed circuit board production process
GB2307351A (en) * 1995-11-16 1997-05-21 Marconi Gec Ltd Printed circuit boards and their manufacture
WO2007131477A1 (en) * 2006-05-13 2007-11-22 Conti Temic Microelectronic Gmbh Method for producing a carrier plate for a circuit, carrier plate produced according to such a method, and circuit comprising such a carrier plate
CN112291941A (en) * 2019-07-24 2021-01-29 北大方正集团有限公司 Printed circuit board and preparation method thereof
CN112291941B (en) * 2019-07-24 2022-02-18 北大方正集团有限公司 Printed circuit board and preparation method thereof

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Legal Events

Date Code Title Description
PS Patent sealed
435 Patent endorsed 'licences of right' on the date specified (sect. 35/1949)
436 Application for cancellation of endorsement 'licences of right' (sect. 36/1949)
436C Endorsement for 'licences of right' cancelled (sect. 36/1949)
732 Registration of transactions, instruments or events in the register (sect. 32/1977)
PCNP Patent ceased through non-payment of renewal fee