GB1258514A - - Google Patents

Info

Publication number
GB1258514A
GB1258514A GB1258514DA GB1258514A GB 1258514 A GB1258514 A GB 1258514A GB 1258514D A GB1258514D A GB 1258514DA GB 1258514 A GB1258514 A GB 1258514A
Authority
GB
United Kingdom
Prior art keywords
finishing
ring
receiver
workpieces
carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of GB1258514A publication Critical patent/GB1258514A/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002Preparing wafers
    • H01L21/02005Preparing bulk and homogeneous wafers
    • H01L21/02008Multistep processes
    • H01L21/0201Specific process step
    • H01L21/02013Grinding, lapping
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00Other grinding machines or devices
    • B24B27/0023Other grinding machines or devices grinding machines with a plurality of working posts
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/04Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

1,258,514. Grinding. INTERNATIONAL BUSINESS MACHINES CORP. 20 Feb., 1969 [22 March, 1968], No. 9128/69. Heading B3D. Apparatus for finishing a surface of a workpiece 12, Fig. 3, e.g. a silicon wafer, comprises a receiver 60 for maintaining the surface to be finished against a plane finishing surface 11, rotatable drive means for causing the receiver and workpiece cyclically to describe a closed path over the surface 11, and means for simultaneously causing additional relative rectilinear movement between the receiver and the surface 11. The drive means is displaceable along its axis of rotation and is connected to the receiver by a joint 62 which is adapted to communicate axial displacement while permitting the receiver to assume an angular position relative to the axis determined by the position adopted by a workpiece received thereby, as pressure is applied by displacement of the drive means towards the surface 11. As described, workpieces 12 are held in apertures 69 of a floating ring 68 by spring-loaded discs 66 adjustably mounted on a housing ring 61. The ring 61 is eccentrically mounted by the ball joint 62 on a rotatable mount 43 supported for rotational and limited axial movement within a carrier 40. The ring 61 is so supported by springs 73 secured to pads 72 fixed to the carrier 40 that as the mount 43 is rotated the workpieces are moved in closed paths relative to the carrier. Alternatively, the movement of the ring is controlled by a link which is fixed thereto and has a pin-and-slot connection with a fixed part of the carrier. The weight of the mount 43 urges the workpieces against the surface 11 until a pin 48 engages the top edge 50A of a slot therein when the workpieces reach the desired size. A plurality of carriers 40, Fig. 1, is provided and each is moved rectilinearly along the surface 11 by rotation of a threaded rod 78, the carriers being guided by guides 77. The mounts 43 may be rotated by a double-V-belt 47, or each carrier 40 may include its own drive motor, the speed of which may be varied. A plurality of finishing surfaces may be provided which may be separated by cleaning surfaces. The finishing surfaces may be impregnated with diamond dust or an abrasive, lapping, or polishing slurry may be supplied thereto either by spraying or via openings 80 in the surface 11. The slurry may comprise water or oil together with silicon carbide, boron or nitride particles, or silicon oxide or cupric acid. The finishing surfaces may be parts of movable belts which may be shifted when a fresh finishing surface is required. When the finishing operation is completed, a flange 70 on the ring 68, Fig. 3, engages rails 91 which cause it to be raised so that the workpieces can be removed from the discs 66 by a knife.
GB1258514D 1968-03-22 1969-02-20 Expired GB1258514A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US71535068A 1968-03-22 1968-03-22

Publications (1)

Publication Number Publication Date
GB1258514A true GB1258514A (en) 1971-12-30

Family

ID=24873677

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1258514D Expired GB1258514A (en) 1968-03-22 1969-02-20

Country Status (4)

Country Link
US (1) US3550325A (en)
DE (1) DE1914082C3 (en)
FR (1) FR1600784A (en)
GB (1) GB1258514A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2144354A (en) * 1983-07-15 1985-03-06 Helical Springs Limited Grinding apparatus

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4680893A (en) * 1985-09-23 1987-07-21 Motorola, Inc. Apparatus for polishing semiconductor wafers
US5534106A (en) * 1994-07-26 1996-07-09 Kabushiki Kaisha Toshiba Apparatus for processing semiconductor wafers
DE19756536A1 (en) * 1997-12-18 1999-07-01 Wacker Siltronic Halbleitermat Polishing disc-shaped workpieces, such as semiconductor discs secured on support plates
DE10004578C1 (en) * 2000-02-03 2001-07-26 Wacker Siltronic Halbleitermat Production of a semiconductor wafer comprises polishing the edges of the wafer with a cloth with the continuous introduction of an alkaline polishing agent using polishing plates, wetting with a film and cleaning and drying
US20040157539A1 (en) * 2002-07-26 2004-08-12 Stenftenagel John R. Scuffing machine for finishing wood products
CN110216574B (en) * 2019-07-23 2020-11-13 浙江浦江三菱制锁有限公司 Intelligent lock shell processing equipment
CN110918338A (en) * 2019-10-17 2020-03-27 福清市海威钓具有限公司 Environment-friendly fishing rod paint spraying device and paint spraying process
CN112123197B (en) * 2020-09-24 2024-03-22 郑州方铭高温陶瓷新材料有限公司 Double-track slide plate brick plane grinding machine
CN113997176B (en) * 2021-10-21 2023-02-28 西安银马实业发展有限公司 Grinding head self-floating stone grinding and polishing machine

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2144354A (en) * 1983-07-15 1985-03-06 Helical Springs Limited Grinding apparatus

Also Published As

Publication number Publication date
DE1914082C3 (en) 1980-03-13
DE1914082A1 (en) 1969-10-02
FR1600784A (en) 1970-07-27
DE1914082B2 (en) 1979-07-05
US3550325A (en) 1970-12-29

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee