GB1249317A - Semiconductor devices - Google Patents
Semiconductor devicesInfo
- Publication number
- GB1249317A GB1249317A GB5487868A GB5487868A GB1249317A GB 1249317 A GB1249317 A GB 1249317A GB 5487868 A GB5487868 A GB 5487868A GB 5487868 A GB5487868 A GB 5487868A GB 1249317 A GB1249317 A GB 1249317A
- Authority
- GB
- United Kingdom
- Prior art keywords
- resistor
- wafer
- impurities
- contact
- contact regions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 title abstract 4
- 239000012535 impurity Substances 0.000 abstract 10
- 230000007935 neutral effect Effects 0.000 abstract 5
- 238000000034 method Methods 0.000 abstract 3
- 239000013078 crystal Substances 0.000 abstract 2
- 229910052732 germanium Inorganic materials 0.000 abstract 2
- 150000002500 ions Chemical class 0.000 abstract 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 abstract 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 abstract 1
- 229910052796 boron Inorganic materials 0.000 abstract 1
- 239000000969 carrier Substances 0.000 abstract 1
- 239000002800 charge carrier Substances 0.000 abstract 1
- 239000004020 conductor Substances 0.000 abstract 1
- 230000008021 deposition Effects 0.000 abstract 1
- 238000005530 etching Methods 0.000 abstract 1
- 238000005468 ion implantation Methods 0.000 abstract 1
- 229910052745 lead Inorganic materials 0.000 abstract 1
- 238000012986 modification Methods 0.000 abstract 1
- 230000004048 modification Effects 0.000 abstract 1
- 229910052718 tin Inorganic materials 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/8605—Resistors with PN junctions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Semiconductor Integrated Circuits (AREA)
- Drying Of Semiconductors (AREA)
Abstract
1,249,317. Semi-conductor resistors. MULLARD Ltd. 19 Nov., 1968, No. 54878/68. Headings H1K and H1S. In a semi-conductor resistor comprising a body containing electrically active impurities to provide free charge carriers and electrically inactive impurities to reduce the temperature coefficient, the inactive impurities consist for a substantial part of neutral impurities. The neutral impurities may be elements such as Pb or Sn in Si, Ge or a mixed crystal of Si or Ge, or Al in GaAs. Alternatively the semi-conductor may contain a normally active impurity introduced in such a concentration and in such a way that a proportion of the atoms act as neutral impurities. Crystal dislocations produced by electron bombardment may also be used as neutral impurities. The resistor may be integrated in a wafer together with other devices such as transistors. In a first method an N-type Si wafer is provided with an oxide mask exposing a strip which is to form the resistor with an enlarged contact region at each end. Sn is diffused into the exposed area from the gas phase followed by a drive-in step. Boron is then diffused-in to form a P-type region. The wafer is then reoxidized, the contact regions are exposed and are provided with Al contacts to which conductors may be connected. In a second method an N-type Si wafer is provided with an oxide mask exposing contact areas for the resistor. B is diffused-in to form the contact regions and the resistor strip is exposed. Al is vapour deposited and processed to form contacts to the major portions of the contact regions. Ga<SP>69</SP> is then introduced into the resistor strip and also the non-contacted parts of the contact regions by ion implantation. The wafer is then annealed. A proportion of the implanted ions act as active impurities to provide the current carriers and the remainder act as neutral impurities. In a modification, after deposition of the Al layer the resistor strip is exposed by etching away the Al and oxide layers. Ga is then ion-implanted and the excess Al is etched away leaving the contact lands. In a further method an N-type Si wafer is provided with an oxide mask exposing contact lands for the resistor. B is diffused-in to form the contact regions, the oxide layer is removed and the wafer is reoxidized. Smaller apertures are formed in the oxide layer over the contact regions, Al is vapour deposited and the resistor strip is etched in the Al layer only. B<SP>11</SP> ions are then implanted through the oxide layer to form the resistor, the Al layer acting as a mask. The excess Al is then etched away leaving contact lands and the wafer is annealed.
Priority Applications (12)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB5487868A GB1249317A (en) | 1968-11-19 | 1968-11-19 | Semiconductor devices |
DE19691954445 DE1954445A1 (en) | 1968-11-19 | 1969-10-29 | Semiconductor component |
NL6917221A NL166820C (en) | 1968-11-19 | 1969-11-14 | SEMICONDUCTOR DEVICE EQUIPPED WITH RESISTANCE ELEMENT AND METHOD FOR MANUFACTURING IT. |
CH1700769A CH500570A (en) | 1968-11-19 | 1969-11-14 | Semiconductor device |
JP9115869A JPS4844064B1 (en) | 1968-11-19 | 1969-11-15 | |
BR21426069A BR6914260D0 (en) | 1968-11-19 | 1969-11-17 | SEMICONDUCTOR DEVICE AND ITS MANUFACTURING PROCESS |
SE1573569A SE361771B (en) | 1968-11-19 | 1969-11-17 | |
ES373627A ES373627A1 (en) | 1968-11-19 | 1969-11-17 | Semiconductor devices |
CA067595A CA937682A (en) | 1968-11-19 | 1969-11-17 | Temperature compensated semiconductor resistor containing neutral inactive impurities |
AT1071369A AT300961B (en) | 1968-11-19 | 1969-11-17 | Semiconductor device |
BE741870D BE741870A (en) | 1968-11-19 | 1969-11-18 | |
FR6939590A FR2023619A1 (en) | 1968-11-19 | 1969-11-18 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB5487868A GB1249317A (en) | 1968-11-19 | 1968-11-19 | Semiconductor devices |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1249317A true GB1249317A (en) | 1971-10-13 |
Family
ID=10472333
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB5487868A Expired GB1249317A (en) | 1968-11-19 | 1968-11-19 | Semiconductor devices |
Country Status (12)
Country | Link |
---|---|
JP (1) | JPS4844064B1 (en) |
AT (1) | AT300961B (en) |
BE (1) | BE741870A (en) |
BR (1) | BR6914260D0 (en) |
CA (1) | CA937682A (en) |
CH (1) | CH500570A (en) |
DE (1) | DE1954445A1 (en) |
ES (1) | ES373627A1 (en) |
FR (1) | FR2023619A1 (en) |
GB (1) | GB1249317A (en) |
NL (1) | NL166820C (en) |
SE (1) | SE361771B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2136213A (en) * | 1983-01-20 | 1984-09-12 | Bbc Brown Boveri & Cie | Method for producing a thin film resistor |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AU464038B2 (en) * | 1970-12-09 | 1975-08-14 | Philips Nv | Improvements in and relating to semiconductor devices |
FR2123179B1 (en) * | 1971-01-28 | 1974-02-15 | Commissariat Energie Atomique | |
FR2189876A1 (en) * | 1972-06-23 | 1974-01-25 | Anvar | Radiation resistant silicon wafers - and solar cells made therefrom for use in space |
JPS53148374U (en) * | 1977-04-27 | 1978-11-22 | ||
JPS53136980A (en) * | 1977-05-04 | 1978-11-29 | Nippon Telegr & Teleph Corp <Ntt> | Resistance value correction method for poly crystal silicon resistor |
DE2828607C3 (en) * | 1977-06-29 | 1982-08-12 | Tokyo Shibaura Denki K.K., Kawasaki, Kanagawa | Semiconductor device |
FR2396417A1 (en) * | 1977-06-29 | 1979-01-26 | Tokyo Shibaura Electric Co | SEMICONDUCTOR COMPONENT INCLUDING A RESISTOR |
JPS5439584A (en) * | 1977-07-14 | 1979-03-27 | Toshiba Corp | Semiconductor device |
JPS6014898A (en) * | 1983-07-05 | 1985-01-25 | 高田 継生 | Clothing closet equipped with dryer |
-
1968
- 1968-11-19 GB GB5487868A patent/GB1249317A/en not_active Expired
-
1969
- 1969-10-29 DE DE19691954445 patent/DE1954445A1/en active Pending
- 1969-11-14 NL NL6917221A patent/NL166820C/en not_active IP Right Cessation
- 1969-11-14 CH CH1700769A patent/CH500570A/en not_active IP Right Cessation
- 1969-11-15 JP JP9115869A patent/JPS4844064B1/ja active Pending
- 1969-11-17 CA CA067595A patent/CA937682A/en not_active Expired
- 1969-11-17 SE SE1573569A patent/SE361771B/xx unknown
- 1969-11-17 ES ES373627A patent/ES373627A1/en not_active Expired
- 1969-11-17 BR BR21426069A patent/BR6914260D0/en unknown
- 1969-11-17 AT AT1071369A patent/AT300961B/en not_active IP Right Cessation
- 1969-11-18 FR FR6939590A patent/FR2023619A1/fr not_active Withdrawn
- 1969-11-18 BE BE741870D patent/BE741870A/xx unknown
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2136213A (en) * | 1983-01-20 | 1984-09-12 | Bbc Brown Boveri & Cie | Method for producing a thin film resistor |
Also Published As
Publication number | Publication date |
---|---|
DE1954445A1 (en) | 1970-06-11 |
CA937682A (en) | 1973-11-27 |
SE361771B (en) | 1973-11-12 |
BR6914260D0 (en) | 1973-04-19 |
CH500570A (en) | 1970-12-15 |
NL166820B (en) | 1981-04-15 |
AT300961B (en) | 1972-08-10 |
BE741870A (en) | 1970-05-19 |
JPS4844064B1 (en) | 1973-12-22 |
FR2023619A1 (en) | 1970-08-21 |
ES373627A1 (en) | 1972-05-16 |
NL6917221A (en) | 1970-05-21 |
NL166820C (en) | 1981-09-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US3912546A (en) | Enhancement mode, Schottky-barrier gate gallium arsenide field effect transistor | |
US4078947A (en) | Method for forming a narrow channel length MOS field effect transistor | |
US4053925A (en) | Method and structure for controllng carrier lifetime in semiconductor devices | |
US4111719A (en) | Minimization of misfit dislocations in silicon by double implantation of arsenic and germanium | |
US3909306A (en) | MIS type semiconductor device having high operating voltage and manufacturing method | |
US3461361A (en) | Complementary mos transistor integrated circuits with inversion layer formed by ionic discharge bombardment | |
US4060427A (en) | Method of forming an integrated circuit region through the combination of ion implantation and diffusion steps | |
US3796929A (en) | Junction isolated integrated circuit resistor with crystal damage near isolation junction | |
US3660735A (en) | Complementary metal insulator silicon transistor pairs | |
US3607449A (en) | Method of forming a junction by ion implantation | |
EP0094482B1 (en) | Fabrication process for a shallow emitter, narrow intrinsic base transistor | |
JPH0697665B2 (en) | Method of manufacturing integrated circuit structure | |
GB1355806A (en) | Methods of manufacturing a semiconductor device | |
US4466171A (en) | Method of manufacturing a semiconductor device utilizing outdiffusion to convert an epitaxial layer | |
US3873372A (en) | Method for producing improved transistor devices | |
US3730778A (en) | Methods of manufacturing a semiconductor device | |
US3745070A (en) | Method of manufacturing semiconductor devices | |
GB1041681A (en) | Switching transistor structure and method of making same | |
GB1283133A (en) | Method of manufacturing semiconductor devices | |
US4057824A (en) | P+ Silicon integrated circuit interconnection lines | |
US3814992A (en) | High performance fet | |
GB1249317A (en) | Semiconductor devices | |
US4277882A (en) | Method of producing a metal-semiconductor field-effect transistor | |
US3883889A (en) | Silicon-oxygen-nitrogen layers for semiconductor devices | |
EP0118511B1 (en) | Integrated circuit contact fabrication process |