GB1160314A - Acidified Hydrogen Peroxide Solutions for Dissolving Metals - Google Patents
Acidified Hydrogen Peroxide Solutions for Dissolving MetalsInfo
- Publication number
- GB1160314A GB1160314A GB4949/67A GB494967A GB1160314A GB 1160314 A GB1160314 A GB 1160314A GB 4949/67 A GB4949/67 A GB 4949/67A GB 494967 A GB494967 A GB 494967A GB 1160314 A GB1160314 A GB 1160314A
- Authority
- GB
- United Kingdom
- Prior art keywords
- hydrogen peroxide
- composition
- acid
- sulphathiazole
- feb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 title abstract 7
- 229910052751 metal Inorganic materials 0.000 title abstract 2
- 239000002184 metal Substances 0.000 title abstract 2
- 150000002739 metals Chemical class 0.000 title abstract 2
- 239000000203 mixture Substances 0.000 abstract 3
- 150000003839 salts Chemical class 0.000 abstract 3
- -1 silver ions Chemical class 0.000 abstract 3
- LUBJCRLGQSPQNN-UHFFFAOYSA-N 1-Phenylurea Chemical compound NC(=O)NC1=CC=CC=C1 LUBJCRLGQSPQNN-UHFFFAOYSA-N 0.000 abstract 2
- 239000002253 acid Substances 0.000 abstract 2
- 239000000654 additive Substances 0.000 abstract 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 abstract 2
- 238000005530 etching Methods 0.000 abstract 2
- 229910052709 silver Inorganic materials 0.000 abstract 2
- 239000004332 silver Substances 0.000 abstract 2
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 abstract 2
- 239000000126 substance Substances 0.000 abstract 2
- JNMRHUJNCSQMMB-UHFFFAOYSA-N sulfathiazole Chemical compound C1=CC(N)=CC=C1S(=O)(=O)NC1=NC=CS1 JNMRHUJNCSQMMB-UHFFFAOYSA-N 0.000 abstract 2
- 229960001544 sulfathiazole Drugs 0.000 abstract 2
- GWEHVDNNLFDJLR-UHFFFAOYSA-N 1,3-diphenylurea Chemical compound C=1C=CC=CC=1NC(=O)NC1=CC=CC=C1 GWEHVDNNLFDJLR-UHFFFAOYSA-N 0.000 abstract 1
- 239000005711 Benzoic acid Substances 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 abstract 1
- 230000000996 additive effect Effects 0.000 abstract 1
- 239000007864 aqueous solution Substances 0.000 abstract 1
- 235000010233 benzoic acid Nutrition 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 238000007598 dipping method Methods 0.000 abstract 1
- 229910052739 hydrogen Inorganic materials 0.000 abstract 1
- 239000001257 hydrogen Substances 0.000 abstract 1
- 150000005165 hydroxybenzoic acids Chemical class 0.000 abstract 1
- 238000003801 milling Methods 0.000 abstract 1
- 238000005498 polishing Methods 0.000 abstract 1
- 229910001961 silver nitrate Inorganic materials 0.000 abstract 1
- 239000000243 solution Substances 0.000 abstract 1
- 235000011149 sulphuric acid Nutrition 0.000 abstract 1
- 239000001117 sulphuric acid Substances 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/18—Acidic compositions for etching copper or alloys thereof
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/02—Local etching
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
- Weting (AREA)
Abstract
1,160,314. Etching. ALLIED CHEMICAL CORP. 1 Feb., 1967 [3 Feb., 1966], No. 4949/67. Heading B6J. [Also in Division C7] A composition for dissolving metals com. prises an acidified aqueous hydrogen peroxide solution containing at least 30 parts per million of at least one additive selected from phenylurea, diphenylurea, benzoic acid and its salts and the hydroxybenzoic acids and their salts. A sulphathiazole or a salt thereof and/or silver ions (as silver nitrate) may also be present. The solution preferably contains 2-12% by weight of hydrogen peroxide and 0À45-5À5 grams per litre of hydrogen ions. The acidifying acid may be 2-23% by weight sulphuric acid. The composition may be prepared by adding acid and water to a concentrated aqueous solution containing: 20-70% of hydrogen peroxide, at least one of the additives in a total amount of 200-20,000 parts per million, and optionally sulphathiazole and/or silver ions. The composition is suitable for etching copper, chemical milling, graining and bright dipping or polishing.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US524836A US3407141A (en) | 1966-02-03 | 1966-02-03 | Dissolution of metal with acidified hydrogen peroxide solutions |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1160314A true GB1160314A (en) | 1969-08-06 |
Family
ID=24090857
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB4949/67A Expired GB1160314A (en) | 1966-02-03 | 1967-02-01 | Acidified Hydrogen Peroxide Solutions for Dissolving Metals |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US3407141A (en) |
| DE (1) | DE1621419B2 (en) |
| FR (1) | FR1515282A (en) |
| GB (1) | GB1160314A (en) |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3537926A (en) * | 1967-06-19 | 1970-11-03 | Lancy Lab | Chemical brightening of iron-containing surfaces of workpieces |
| US3668131A (en) * | 1968-08-09 | 1972-06-06 | Allied Chem | Dissolution of metal with acidified hydrogen peroxide solutions |
| US4174253A (en) * | 1977-11-08 | 1979-11-13 | Dart Industries Inc. | Dissolution of metals utilizing a H2 O2 -H2 SO4 solution catalyzed with hydroxy substituted cycloparaffins |
| JPS58197277A (en) * | 1982-05-08 | 1983-11-16 | Mitsubishi Gas Chem Co Inc | Treating liquid for dissolving metal chemically |
| US4401509A (en) * | 1982-09-07 | 1983-08-30 | Fmc Corporation | Composition and process for printed circuit etching using a sulfuric acid solution containing hydrogen peroxide |
| GB8522046D0 (en) * | 1985-09-05 | 1985-10-09 | Interox Chemicals Ltd | Stabilisation |
| EP0265578A1 (en) * | 1986-10-30 | 1988-05-04 | Jan-Olof Eriksson | A non-abrasive polish or cleaning composition and process for its preparation |
| US4859281A (en) * | 1987-06-04 | 1989-08-22 | Pennwalt Corporation | Etching of copper and copper bearing alloys |
| US4875972A (en) * | 1988-07-27 | 1989-10-24 | E. I. Du Pont De Nemours And Company | Hydrogen peroxide compositions containing a substituted oxybenzene compound |
| US4915781A (en) * | 1988-07-27 | 1990-04-10 | E. I. Du Pont De Nemours And Company | Stabilized hydrogen peroxide compositions |
| GB8922504D0 (en) * | 1989-10-05 | 1989-11-22 | Interox Chemicals Ltd | Hydrogen peroxide solutions |
| GB9117823D0 (en) * | 1991-08-17 | 1991-10-09 | Laporte Industries Ltd | Hydrofluoric acid compositions |
| US6117250A (en) * | 1999-02-25 | 2000-09-12 | Morton International Inc. | Thiazole and thiocarbamide based chemicals for use with oxidative etchant solutions |
| US6444140B2 (en) | 1999-03-17 | 2002-09-03 | Morton International Inc. | Micro-etch solution for producing metal surface topography |
| US20030178391A1 (en) * | 2000-06-16 | 2003-09-25 | Shipley Company, L.L.C. | Composition for producing metal surface topography |
| US20040099637A1 (en) * | 2000-06-16 | 2004-05-27 | Shipley Company, L.L.C. | Composition for producing metal surface topography |
| JP3932193B2 (en) * | 2000-12-27 | 2007-06-20 | 荏原ユージライト株式会社 | MICRO ETCHING AGENT FOR COPPER AND COPPER ALLOY AND METHOD OF FINE Roughening of COPPER OR COPPER ALLOY USING THE SAME |
| JP3930732B2 (en) * | 2000-12-27 | 2007-06-13 | 荏原ユージライト株式会社 | MICRO ETCHING AGENT FOR COPPER AND COPPER ALLOY AND METHOD OF FINE Roughening of COPPER OR COPPER ALLOY USING THE SAME |
| JP3930885B2 (en) * | 2000-12-27 | 2007-06-13 | 荏原ユージライト株式会社 | Microetching agents for copper and copper alloys |
| US6803354B2 (en) * | 2002-08-05 | 2004-10-12 | Henkel Kormanditgesellschaft Auf Aktien | Stabilization of hydrogen peroxide in acidic baths for cleaning metals |
| CA2716144A1 (en) | 2009-10-02 | 2011-04-02 | University Of Windsor | Method of surface treatment of aluminum foil and its alloy and method of producing immobilized nanocatalyst of transition metal oxides and their alloys |
| CN102762770B (en) * | 2010-02-15 | 2014-07-16 | 三菱瓦斯化学株式会社 | Etching solution for multilayer thin film having copper layer and molybdenum layer contained therein |
| WO2018052130A1 (en) * | 2016-09-16 | 2018-03-22 | 日産化学工業株式会社 | Composition for forming protective film |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE580351A (en) * | 1958-07-10 | |||
| NL130705C (en) * | 1961-06-22 | |||
| BE657099A (en) * | 1963-12-30 | |||
| BE663291A (en) * | 1964-05-04 |
-
1966
- 1966-02-03 US US524836A patent/US3407141A/en not_active Expired - Lifetime
-
1967
- 1967-01-31 DE DE19671621419 patent/DE1621419B2/en active Pending
- 1967-02-01 FR FR93379A patent/FR1515282A/en not_active Expired
- 1967-02-01 GB GB4949/67A patent/GB1160314A/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| DE1621419B2 (en) | 1971-12-23 |
| US3407141A (en) | 1968-10-22 |
| DE1621419A1 (en) | 1971-12-23 |
| FR1515282A (en) | 1968-03-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed [section 19, patents act 1949] | ||
| PLNP | Patent lapsed through nonpayment of renewal fees |