GB1156777A - Manufacture of Semiconductor Elements. - Google Patents

Manufacture of Semiconductor Elements.

Info

Publication number
GB1156777A
GB1156777A GB2989167A GB2989167A GB1156777A GB 1156777 A GB1156777 A GB 1156777A GB 2989167 A GB2989167 A GB 2989167A GB 2989167 A GB2989167 A GB 2989167A GB 1156777 A GB1156777 A GB 1156777A
Authority
GB
United Kingdom
Prior art keywords
wafer
grooves
junction
semi
lines
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2989167A
Inventor
Godfrey Emanuel Collier
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Mobility Ltd
Original Assignee
Westinghouse Brake and Signal Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Westinghouse Brake and Signal Co Ltd filed Critical Westinghouse Brake and Signal Co Ltd
Priority to GB2989167A priority Critical patent/GB1156777A/en
Priority to NL6808992A priority patent/NL6808992A/xx
Priority to FR1570291D priority patent/FR1570291A/fr
Publication of GB1156777A publication Critical patent/GB1156777A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Dicing (AREA)

Abstract

1,156,777. Subdividing semi-conductor wafers. WESTINGHOUSE BRAKE & SIGNAL CO. Ltd. 29 May, 1968 [28 June, 1967], No. 29891/67. Heading H1K. A semi-conductor wafer 1 is provided with a pn-junction 2 parallel to its major faces, e.g. by diffusion, criss-cross grooves 5, 6 are formed in one major face 3 to a depth greater than that of the junction 2, and the wafer is then separated into discrete elements by breaking along the lines of the grooves 5, 6. The grooves 5, 6 may be formed by an oscillating cutter fed with abrasive material. After grooving the wafer is cleaned by etching and the exposed edges of the junction 2 are protected. The ungrooved face is then scored with a diamond cutter opposite the lines of the grooves 5, 6 and the wafer is broken.
GB2989167A 1967-06-28 1967-06-28 Manufacture of Semiconductor Elements. Expired GB1156777A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
GB2989167A GB1156777A (en) 1967-06-28 1967-06-28 Manufacture of Semiconductor Elements.
NL6808992A NL6808992A (en) 1967-06-28 1968-06-26
FR1570291D FR1570291A (en) 1967-06-28 1968-06-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB2989167A GB1156777A (en) 1967-06-28 1967-06-28 Manufacture of Semiconductor Elements.

Publications (1)

Publication Number Publication Date
GB1156777A true GB1156777A (en) 1969-07-02

Family

ID=10298862

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2989167A Expired GB1156777A (en) 1967-06-28 1967-06-28 Manufacture of Semiconductor Elements.

Country Status (3)

Country Link
FR (1) FR1570291A (en)
GB (1) GB1156777A (en)
NL (1) NL6808992A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2080712A1 (en) * 1970-02-24 1971-11-19 Rca Corp
FR2220877A1 (en) * 1973-03-09 1974-10-04 Thomson Csf PIN diodes collectively made from PIN chip - are formed between electrodes by etching parallel trenches in two stages followed by separation

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2080712A1 (en) * 1970-02-24 1971-11-19 Rca Corp
FR2220877A1 (en) * 1973-03-09 1974-10-04 Thomson Csf PIN diodes collectively made from PIN chip - are formed between electrodes by etching parallel trenches in two stages followed by separation

Also Published As

Publication number Publication date
FR1570291A (en) 1969-06-06
NL6808992A (en) 1968-12-30

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Legal Events

Date Code Title Description
PS Patent sealed
435 Patent endorsed 'licences of right' on the date specified (sect. 35/1949)
PCNP Patent ceased through non-payment of renewal fee