GB1056353A - Gold plating - Google Patents
Gold platingInfo
- Publication number
- GB1056353A GB1056353A GB34167/63A GB3416763A GB1056353A GB 1056353 A GB1056353 A GB 1056353A GB 34167/63 A GB34167/63 A GB 34167/63A GB 3416763 A GB3416763 A GB 3416763A GB 1056353 A GB1056353 A GB 1056353A
- Authority
- GB
- United Kingdom
- Prior art keywords
- solution
- gold
- gold plating
- sulphuric
- hydrofluoric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000010931 gold Substances 0.000 title abstract 5
- 229910052737 gold Inorganic materials 0.000 title abstract 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title abstract 3
- 238000007747 plating Methods 0.000 title 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 abstract 3
- DDFHBQSCUXNBSA-UHFFFAOYSA-N 5-(5-carboxythiophen-2-yl)thiophene-2-carboxylic acid Chemical compound S1C(C(=O)O)=CC=C1C1=CC=C(C(O)=O)S1 DDFHBQSCUXNBSA-UHFFFAOYSA-N 0.000 abstract 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 abstract 1
- 229910001369 Brass Inorganic materials 0.000 abstract 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 abstract 1
- 229910000990 Ni alloy Inorganic materials 0.000 abstract 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 abstract 1
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 abstract 1
- 239000000908 ammonium hydroxide Substances 0.000 abstract 1
- 239000010951 brass Substances 0.000 abstract 1
- 229910052804 chromium Inorganic materials 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- WBTCZEPSIIFINA-MSFWTACDSA-J dipotassium;antimony(3+);(2r,3r)-2,3-dioxidobutanedioate;trihydrate Chemical compound O.O.O.[K+].[K+].[Sb+3].[Sb+3].[O-]C(=O)[C@H]([O-])[C@@H]([O-])C([O-])=O.[O-]C(=O)[C@H]([O-])[C@@H]([O-])C([O-])=O WBTCZEPSIIFINA-MSFWTACDSA-J 0.000 abstract 1
- 229910052732 germanium Inorganic materials 0.000 abstract 1
- 238000007654 immersion Methods 0.000 abstract 1
- QPJSUIGXIBEQAC-UHFFFAOYSA-N n-(2,4-dichloro-5-propan-2-yloxyphenyl)acetamide Chemical compound CC(C)OC1=CC(NC(C)=O)=C(Cl)C=C1Cl QPJSUIGXIBEQAC-UHFFFAOYSA-N 0.000 abstract 1
- 229910052759 nickel Inorganic materials 0.000 abstract 1
- XTFKWYDMKGAZKK-UHFFFAOYSA-N potassium;gold(1+);dicyanide Chemical compound [K+].[Au+].N#[C-].N#[C-] XTFKWYDMKGAZKK-UHFFFAOYSA-N 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 229910052709 silver Inorganic materials 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 abstract 1
- 239000010935 stainless steel Substances 0.000 abstract 1
- 229910001220 stainless steel Inorganic materials 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
- 239000001117 sulphuric acid Substances 0.000 abstract 1
- 235000011149 sulphuric acid Nutrition 0.000 abstract 1
- 229910052715 tantalum Inorganic materials 0.000 abstract 1
- 229910052719 titanium Inorganic materials 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
- C23C18/44—Coating with noble metals using reducing agents
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/922—Static electricity metal bleed-off metallic stock
- Y10S428/9335—Product by special process
- Y10S428/934—Electrical process
- Y10S428/935—Electroplating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/922—Static electricity metal bleed-off metallic stock
- Y10S428/9335—Product by special process
- Y10S428/936—Chemical deposition, e.g. electroless plating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/922—Static electricity metal bleed-off metallic stock
- Y10S428/9335—Product by special process
- Y10S428/938—Vapor deposition or gas diffusion
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12674—Ge- or Si-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12889—Au-base component
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Abstract
A surface of e.g. Si, Ge, Cu, Ni, Fe-Cu- Ni alloy, solder, Ag, Ti, Cr brass, stainless steel, Ta, and Au is gold plated by immersion in a solution containing potassium gold cyanide (67% gold content) the solution being acidified to a pH of 2.0 to 3.5 with hydrofluoric, hydrochloric, nitric, sulphuric or acetic acid or ammonium fluoride. The pH may be adjusted with ammonium hydroxide. The temperature of the solution is 70 to 100 DEG C. In an example, the solution may contain potassium antimonyl tartrate to deposit Sb-Au on a Ge substrate. The layer may be subsequently sintered.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US223239A US3214292A (en) | 1962-09-12 | 1962-09-12 | Gold plating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1056353A true GB1056353A (en) | 1967-01-25 |
Family
ID=22835656
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB34167/63A Expired GB1056353A (en) | 1962-09-12 | 1963-08-29 | Gold plating |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US3214292A (en) |
| GB (1) | GB1056353A (en) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3454473A (en) * | 1963-12-07 | 1969-07-08 | Matsushita Electric Ind Co Ltd | Method for the manufacture of titanium anodic oxidation film capacitors having non-electrolytically plated cathode |
| DE1213921B (en) * | 1964-08-25 | 1966-04-07 | Bosch Gmbh Robert | Method for manufacturing a semiconductor device |
| GB1045728A (en) * | 1964-10-01 | 1966-10-19 | Ferranti Ltd | Improvements relating to the deposition of gold on a tin nickel surface |
| US3502548A (en) * | 1966-10-24 | 1970-03-24 | Ernest H Lyons Jr | Method of electroplating gold on chromium |
| US3645774A (en) * | 1969-09-15 | 1972-02-29 | Amp Inc | Gold coating by salt decomposition |
| US3890455A (en) * | 1972-06-23 | 1975-06-17 | Ibm | Method of electrolessly plating alloys |
| US4005472A (en) * | 1975-05-19 | 1977-01-25 | National Semiconductor Corporation | Method for gold plating of metallic layers on semiconductive devices |
| US4188438A (en) * | 1975-06-02 | 1980-02-12 | National Semiconductor Corporation | Antioxidant coating of copper parts for thermal compression gang bonding of semiconductive devices |
| US4082908A (en) * | 1976-05-05 | 1978-04-04 | Burr-Brown Research Corporation | Gold plating process and product produced thereby |
| US4162337A (en) * | 1977-11-14 | 1979-07-24 | Bell Telephone Laboratories, Incorporated | Process for fabricating III-V semiconducting devices with electroless gold plating |
| US4374876A (en) * | 1981-06-02 | 1983-02-22 | Occidental Chemical Corporation | Process for the immersion deposition of gold |
| US4474838A (en) * | 1982-12-01 | 1984-10-02 | Omi International Corporation | Electroless direct deposition of gold on metallized ceramics |
| NO304746B1 (en) | 1989-05-04 | 1999-02-08 | Ad Tech Holdings Ltd | Object that resists microbiological growth consisting of a non-conductive substrate coated with a funnel coated with a method of depositing |
| BRPI0607914A2 (en) | 2005-02-25 | 2010-03-23 | Nova Chem Inc | composite building panel, method for building a building, building, method for doing business between a composite building panel manufacturer and a customer, and, frame rafter |
| MX2007009959A (en) | 2005-02-25 | 2007-09-26 | Nova Chem Inc | Lightweight compositions and articles containing such. |
| EP1861559B1 (en) | 2005-03-22 | 2011-07-06 | Nova Chemicals Inc. | Lightweight concrete compositions |
| KR20060128739A (en) * | 2005-06-10 | 2006-12-14 | 엔쏜 인코포레이티드 | Method for direct metallization of non-conducting substrates |
| US8048219B2 (en) * | 2007-09-20 | 2011-11-01 | Nova Chemicals Inc. | Method of placing concrete |
| US20090078161A1 (en) * | 2007-09-20 | 2009-03-26 | Nova Chemicals Inc. | Methods of minimizing concrete cracking and shrinkage |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2836515A (en) * | 1953-04-30 | 1958-05-27 | Westinghouse Electric Corp | Gold immersion solution for treating silver and method of applying same |
| US2814589A (en) * | 1955-08-02 | 1957-11-26 | Bell Telephone Labor Inc | Method of plating silicon |
| US2937962A (en) * | 1957-03-20 | 1960-05-24 | Texas Instruments Inc | Transistor devices |
| US3013955A (en) * | 1959-04-29 | 1961-12-19 | Fairchild Camera Instr Co | Method of transistor manufacture |
| US2983854A (en) * | 1960-04-05 | 1961-05-09 | Bell Telephone Labor Inc | Semiconductive device |
| US3032436A (en) * | 1960-11-18 | 1962-05-01 | Metal Proc Co Inc | Method and composition for plating by chemical reduction |
-
1962
- 1962-09-12 US US223239A patent/US3214292A/en not_active Expired - Lifetime
-
1963
- 1963-08-29 GB GB34167/63A patent/GB1056353A/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| US3214292A (en) | 1965-10-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| GB1056353A (en) | Gold plating | |
| GB1074974A (en) | Semiconductor device manufacture | |
| US2734837A (en) | Surface treatment of titanium or | |
| GB1528015A (en) | Electroless plating | |
| GB1386375A (en) | Nickel-plating of metals | |
| SE7711108L (en) | PROCEDURE FOR ELECTROLYTICAL PAINTING OF METALS ON ZIRCONIUM MATERIAL I | |
| EP0190465A3 (en) | Process for electroplating amorphous alloys | |
| GB955781A (en) | Electroless plating process | |
| ES462907A1 (en) | Process for electrolytic deposition of metals on zirconium materials | |
| GB1413810A (en) | Methods of depositing a metal on a substrate | |
| GB1365172A (en) | Chemical plating composition | |
| GB833828A (en) | Improvements in or relating to methods of applying metallic coatings to the surfaces of semiconductor and metal bodies | |
| GB1321963A (en) | Plating bath | |
| GB1383850A (en) | Rhodium-platinum electro-plating bath | |
| GB1075634A (en) | Electrolytic treatment of titanium surfaces | |
| GB1007252A (en) | Electroplating on aluminium and its alloys | |
| JPS5484835A (en) | Surface treatment of al and al alloy for soldering | |
| GB1387333A (en) | Surface treatment of titanium | |
| JPS5596662A (en) | Electronic component member | |
| GB872785A (en) | Immersion plating with noble metals | |
| JPS54110140A (en) | Plating method | |
| GB992368A (en) | Memory apparatus | |
| GB1017402A (en) | Method for electroplating on aluminium and its alloys | |
| GB1518301A (en) | Deposition of copper | |
| GB1124684A (en) | Nickel alloy article with improved properties and method of making same |