GB0919724D0 - Mems switches and the packaging thereof - Google Patents

Mems switches and the packaging thereof

Info

Publication number
GB0919724D0
GB0919724D0 GBGB0919724.5A GB0919724A GB0919724D0 GB 0919724 D0 GB0919724 D0 GB 0919724D0 GB 0919724 A GB0919724 A GB 0919724A GB 0919724 D0 GB0919724 D0 GB 0919724D0
Authority
GB
United Kingdom
Prior art keywords
packaging
mems switches
mems
switches
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
GBGB0919724.5A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BAE Systems PLC
Original Assignee
BAE Systems PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BAE Systems PLC filed Critical BAE Systems PLC
Priority to GBGB0919724.5A priority Critical patent/GB0919724D0/en
Publication of GB0919724D0 publication Critical patent/GB0919724D0/en
Priority to GB1016803A priority patent/GB2475370A/en
Priority to PCT/GB2010/051874 priority patent/WO2011058354A1/en
Priority to EP10775878.1A priority patent/EP2499648B1/en
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00301—Connecting electric signal lines from the MEMS device with external electrical signal lines, e.g. through vias
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/007—Interconnections between the MEMS and external electrical signals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H59/00—Electrostatic relays; Electro-adhesion relays
    • H01H59/0009—Electrostatic relays; Electro-adhesion relays making use of micromechanics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/10—Auxiliary devices for switching or interrupting
    • H01P1/12—Auxiliary devices for switching or interrupting by mechanical chopper
    • H01P1/127—Strip line switches
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/01—Switches
    • B81B2201/012—Switches characterised by the shape
    • B81B2201/018—Switches not provided for in B81B2201/014 - B81B2201/016
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/09—Packages
    • B81B2207/091—Arrangements for connecting external electrical signals to mechanical structures inside the package
    • B81B2207/094—Feed-through, via
    • B81B2207/096—Feed-through, via through the substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Micromachines (AREA)
GBGB0919724.5A 2009-11-11 2009-11-11 Mems switches and the packaging thereof Ceased GB0919724D0 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
GBGB0919724.5A GB0919724D0 (en) 2009-11-11 2009-11-11 Mems switches and the packaging thereof
GB1016803A GB2475370A (en) 2009-11-11 2010-10-06 RF MEMS device packaging
PCT/GB2010/051874 WO2011058354A1 (en) 2009-11-11 2010-11-10 Mems packaging
EP10775878.1A EP2499648B1 (en) 2009-11-11 2010-11-10 Mems packaging

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB0919724.5A GB0919724D0 (en) 2009-11-11 2009-11-11 Mems switches and the packaging thereof

Publications (1)

Publication Number Publication Date
GB0919724D0 true GB0919724D0 (en) 2009-12-30

Family

ID=41509184

Family Applications (2)

Application Number Title Priority Date Filing Date
GBGB0919724.5A Ceased GB0919724D0 (en) 2009-11-11 2009-11-11 Mems switches and the packaging thereof
GB1016803A Withdrawn GB2475370A (en) 2009-11-11 2010-10-06 RF MEMS device packaging

Family Applications After (1)

Application Number Title Priority Date Filing Date
GB1016803A Withdrawn GB2475370A (en) 2009-11-11 2010-10-06 RF MEMS device packaging

Country Status (1)

Country Link
GB (2) GB0919724D0 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112993569B (en) * 2019-12-18 2022-08-26 京信通信技术(广州)有限公司 Feed network and antenna

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6512300B2 (en) * 2001-01-10 2003-01-28 Raytheon Company Water level interconnection
AU2002365151A1 (en) * 2001-11-07 2003-07-09 The Board Of Trustees Of The University Of Arkansas Structure and process for packaging rf mems and other devices
US7463125B2 (en) * 2002-09-24 2008-12-09 Maxim Integrated Products, Inc. Microrelays and microrelay fabrication and operating methods
US6822326B2 (en) * 2002-09-25 2004-11-23 Ziptronix Wafer bonding hermetic encapsulation
US7605466B2 (en) * 2007-10-15 2009-10-20 General Electric Company Sealed wafer packaging of microelectromechanical systems
US7824997B2 (en) * 2008-03-27 2010-11-02 Emag Technologies, Inc. Membrane suspended MEMS structures

Also Published As

Publication number Publication date
GB201016803D0 (en) 2010-11-17
GB2475370A (en) 2011-05-18

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Legal Events

Date Code Title Description
AT Applications terminated before publication under section 16(1)