FR2645178B1 - Procede de formation d'un film cristallin - Google Patents
Procede de formation d'un film cristallinInfo
- Publication number
- FR2645178B1 FR2645178B1 FR9004185A FR9004185A FR2645178B1 FR 2645178 B1 FR2645178 B1 FR 2645178B1 FR 9004185 A FR9004185 A FR 9004185A FR 9004185 A FR9004185 A FR 9004185A FR 2645178 B1 FR2645178 B1 FR 2645178B1
- Authority
- FR
- France
- Prior art keywords
- forming
- crystalline film
- crystalline
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45563—Gas nozzles
- C23C16/45565—Shower nozzles
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/24—Deposition of silicon only
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/46—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/46—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
- C23C16/463—Cooling of the substrate
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/10—Heating of the reaction chamber or the substrate
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/10—Heating of the reaction chamber or the substrate
- C30B25/105—Heating of the reaction chamber or the substrate by irradiation or electric discharge
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/02—Elements
- C30B29/06—Silicon
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1081106A JPH02258689A (ja) | 1989-03-31 | 1989-03-31 | 結晶質薄膜の形成方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2645178A1 FR2645178A1 (fr) | 1990-10-05 |
FR2645178B1 true FR2645178B1 (fr) | 1997-08-29 |
Family
ID=13737130
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR9004185A Expired - Fee Related FR2645178B1 (fr) | 1989-03-31 | 1990-04-02 | Procede de formation d'un film cristallin |
Country Status (5)
Country | Link |
---|---|
US (2) | US5213997A (fr) |
JP (1) | JPH02258689A (fr) |
CN (1) | CN1026599C (fr) |
DE (1) | DE4010595A1 (fr) |
FR (1) | FR2645178B1 (fr) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02258689A (ja) * | 1989-03-31 | 1990-10-19 | Canon Inc | 結晶質薄膜の形成方法 |
EP0468758B1 (fr) * | 1990-07-24 | 1997-03-26 | Semiconductor Energy Laboratory Co., Ltd. | Méthode de formation de films isolants, de capacités et de dispositifs semi-conducteurs |
US7335570B1 (en) | 1990-07-24 | 2008-02-26 | Semiconductor Energy Laboratory Co., Ltd. | Method of forming insulating films, capacitances, and semiconductor devices |
US5975912A (en) | 1994-06-03 | 1999-11-02 | Materials Research Corporation | Low temperature plasma-enhanced formation of integrated circuits |
US5665640A (en) | 1994-06-03 | 1997-09-09 | Sony Corporation | Method for producing titanium-containing thin films by low temperature plasma-enhanced chemical vapor deposition using a rotating susceptor reactor |
AU1745695A (en) | 1994-06-03 | 1996-01-04 | Materials Research Corporation | A method of nitridization of titanium thin films |
US5628829A (en) | 1994-06-03 | 1997-05-13 | Materials Research Corporation | Method and apparatus for low temperature deposition of CVD and PECVD films |
JP3421882B2 (ja) * | 1994-10-19 | 2003-06-30 | ソニー株式会社 | 多結晶半導体薄膜の作成方法 |
US7025831B1 (en) * | 1995-12-21 | 2006-04-11 | Fsi International, Inc. | Apparatus for surface conditioning |
US6970644B2 (en) * | 2000-12-21 | 2005-11-29 | Mattson Technology, Inc. | Heating configuration for use in thermal processing chambers |
US6780786B2 (en) * | 2001-11-26 | 2004-08-24 | The Regents Of The University Of California | Method for producing a porous silicon film |
US20110185969A1 (en) * | 2009-08-21 | 2011-08-04 | Varian Semiconductor Equipment Associates, Inc. | Dual heating for precise wafer temperature control |
US9206508B1 (en) * | 2010-10-16 | 2015-12-08 | Alleppey V. Hariharan | Laser assisted chemical vapor deposition of silicon |
KR102244494B1 (ko) * | 2013-02-09 | 2021-04-27 | 엘레멘탈 사이언티픽 레이저스 엘엘씨 | 챔버 내 유체 핸들링 시스템 및 이를 사용하여 유체를 핸들링하는 방법들 |
Family Cites Families (62)
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US3347701A (en) * | 1963-02-05 | 1967-10-17 | Fujitsu Ltd | Method and apparatus for vapor deposition employing an electron beam |
US3458368A (en) * | 1966-05-23 | 1969-07-29 | Texas Instruments Inc | Integrated circuits and fabrication thereof |
JPS56145198A (en) * | 1980-04-04 | 1981-11-11 | Hitachi Ltd | Forming method of single crystal silicon membrane and device therefor |
US4543512A (en) * | 1980-10-15 | 1985-09-24 | Tokyo Shibaura Denki Kabushiki Kaisha | Electron beam exposure system |
JPS59928A (ja) * | 1982-06-25 | 1984-01-06 | Ushio Inc | 光加熱装置 |
JPS59119849A (ja) * | 1982-12-27 | 1984-07-11 | Fujitsu Ltd | 半導体装置の製造方法 |
JPS6016413A (ja) * | 1983-07-08 | 1985-01-28 | 株式会社村田製作所 | 積層型ステップチップトリマコンデンサ |
US4683144A (en) * | 1984-04-16 | 1987-07-28 | Canon Kabushiki Kaisha | Method for forming a deposited film |
JPS60219729A (ja) * | 1984-04-16 | 1985-11-02 | Canon Inc | 堆積膜の形成法 |
JPS60219728A (ja) * | 1984-04-16 | 1985-11-02 | Canon Inc | 堆積膜の形成法 |
JPS60236216A (ja) * | 1984-05-09 | 1985-11-25 | Toshiba Mach Co Ltd | 気相成長装置 |
JPS6123760A (ja) * | 1984-07-09 | 1986-02-01 | Canon Inc | 電子写真感光体の製造方法 |
JPS6182428A (ja) * | 1984-09-29 | 1986-04-26 | Toshiba Corp | 電荷ビ−ム光学鏡筒のレンズ調整方法 |
US4759947A (en) * | 1984-10-08 | 1988-07-26 | Canon Kabushiki Kaisha | Method for forming deposition film using Si compound and active species from carbon and halogen compound |
US4657777A (en) * | 1984-12-17 | 1987-04-14 | Canon Kabushiki Kaisha | Formation of deposited film |
US4728528A (en) * | 1985-02-18 | 1988-03-01 | Canon Kabushiki Kaisha | Process for forming deposited film |
US4784874A (en) * | 1985-02-20 | 1988-11-15 | Canon Kabushiki Kaisha | Process for forming deposited film |
US4818563A (en) * | 1985-02-21 | 1989-04-04 | Canon Kabushiki Kaisha | Process for forming deposited film |
US4801468A (en) * | 1985-02-25 | 1989-01-31 | Canon Kabushiki Kaisha | Process for forming deposited film |
JPS61196515A (ja) * | 1985-02-26 | 1986-08-30 | Mitsubishi Electric Corp | 帯域溶融型半導体製造装置 |
JP2537175B2 (ja) * | 1985-03-27 | 1996-09-25 | キヤノン株式会社 | 機能性堆積膜の製造装置 |
EP0199585B1 (fr) * | 1985-04-23 | 1990-07-04 | Seiko Instruments Inc. | Appareil pour le dépôt d'un matériau électriquement conducteur et/ou isolant sur un substrat |
JPH0817159B2 (ja) * | 1985-08-15 | 1996-02-21 | キヤノン株式会社 | 堆積膜の形成方法 |
JPH0645882B2 (ja) * | 1985-10-23 | 1994-06-15 | キヤノン株式会社 | 堆積膜形成法 |
US4812325A (en) * | 1985-10-23 | 1989-03-14 | Canon Kabushiki Kaisha | Method for forming a deposited film |
CN1015008B (zh) * | 1985-10-23 | 1991-12-04 | 佳能株式会社 | 形成沉积膜的方法 |
JPS62136871A (ja) * | 1985-12-11 | 1987-06-19 | Canon Inc | 光センサ−、その製造方法及びその製造装置 |
JPH0746729B2 (ja) * | 1985-12-26 | 1995-05-17 | キヤノン株式会社 | 薄膜トランジスタの製造方法 |
JPH084072B2 (ja) * | 1986-01-14 | 1996-01-17 | キヤノン株式会社 | 堆積膜形成法 |
US4800173A (en) * | 1986-02-20 | 1989-01-24 | Canon Kabushiki Kaisha | Process for preparing Si or Ge epitaxial film using fluorine oxidant |
JPH0775157B2 (ja) * | 1986-03-13 | 1995-08-09 | 日本電気株式会社 | 電子ビ−ムアニ−ル装置 |
CA1337170C (fr) * | 1986-03-31 | 1995-10-03 | Jinsho Matsuyama | Methode pour l'obtention de pellicule cristallisee sous forme de depot |
US4877650A (en) * | 1986-03-31 | 1989-10-31 | Canon Kabushiki Kaisha | Method for forming deposited film |
JP2662388B2 (ja) * | 1986-04-11 | 1997-10-08 | キヤノン株式会社 | 堆積膜形成法 |
CA1329756C (fr) * | 1986-04-11 | 1994-05-24 | Yutaka Hirai | Methode de formation d'un depot cristallin |
JPH0639701B2 (ja) * | 1986-04-14 | 1994-05-25 | キヤノン株式会社 | 堆積膜形成法 |
JPS62240767A (ja) * | 1986-04-14 | 1987-10-21 | Canon Inc | 堆積膜形成法 |
JPS62243767A (ja) * | 1986-04-15 | 1987-10-24 | Canon Inc | 堆積膜形成法 |
US4918028A (en) * | 1986-04-14 | 1990-04-17 | Canon Kabushiki Kaisha | Process for photo-assisted epitaxial growth using remote plasma with in-situ etching |
JPH0639703B2 (ja) * | 1986-04-15 | 1994-05-25 | キヤノン株式会社 | 堆積膜形成法 |
JPH0830273B2 (ja) * | 1986-07-10 | 1996-03-27 | 株式会社東芝 | 薄膜形成方法及び装置 |
KR900005118B1 (ko) * | 1986-07-14 | 1990-07-19 | 미쓰비시전기주식회사 | 박막 형성장치 |
JPS6358818A (ja) * | 1986-08-29 | 1988-03-14 | Toshiba Corp | 気相成長装置 |
US4926793A (en) * | 1986-12-15 | 1990-05-22 | Shin-Etsu Handotai Co., Ltd. | Method of forming thin film and apparatus therefor |
JPS63200455A (ja) * | 1987-02-16 | 1988-08-18 | Nec Corp | 線状電子ビ−ム装置 |
US4755654A (en) * | 1987-03-26 | 1988-07-05 | Crowley John L | Semiconductor wafer heating chamber |
US4913929A (en) * | 1987-04-21 | 1990-04-03 | The Board Of Trustees Of The Leland Stanford Junior University | Thermal/microwave remote plasma multiprocessing reactor and method of use |
JPS6419668A (en) * | 1987-07-14 | 1989-01-23 | Nippon Steel Corp | Ion implanter |
NL8702570A (nl) * | 1987-10-29 | 1989-05-16 | Philips Nv | Geladen deeltjes bundel apparaat. |
US4843030A (en) * | 1987-11-30 | 1989-06-27 | Eaton Corporation | Semiconductor processing by a combination of photolytic, pyrolytic and catalytic processes |
JPH01172576A (ja) * | 1987-12-28 | 1989-07-07 | Mitsubishi Heavy Ind Ltd | 基板加熱方法 |
EP0394462B1 (fr) * | 1988-08-15 | 1995-05-24 | Nippon Telegraph and Telephone Corporation | Procede de formation d'un mince film semi-conducteur et appareil de realisation dudit procede |
EP0361460A3 (fr) * | 1988-09-29 | 1990-08-01 | Sony Corporation | Méthode pour la fabrication d'un motif |
JPH02225399A (ja) * | 1988-11-11 | 1990-09-07 | Fujitsu Ltd | エピタキシャル成長方法および成長装置 |
JPH02258689A (ja) * | 1989-03-31 | 1990-10-19 | Canon Inc | 結晶質薄膜の形成方法 |
JP2870858B2 (ja) * | 1989-09-27 | 1999-03-17 | 日本電気株式会社 | 線状電子ビーム照射方法とその装置 |
DE69032280T2 (de) * | 1989-12-04 | 1998-08-20 | Fujitsu Ltd | Verfahren zur Wahrnehmung und Justierung der Belichtungsbedingungen in einem Belichtungssystem mittels Ladungsträgern und ein solches System |
JPH0513355A (ja) * | 1991-07-05 | 1993-01-22 | Hitachi Ltd | ランプアニール装置 |
US5429730A (en) * | 1992-11-02 | 1995-07-04 | Kabushiki Kaisha Toshiba | Method of repairing defect of structure |
JPH06296675A (ja) * | 1993-04-16 | 1994-10-25 | Suzuki Yushi Kogyo Kk | 人体に用いる貼付剤 |
US5473165A (en) * | 1993-11-16 | 1995-12-05 | Stinnett; Regan W. | Method and apparatus for altering material |
US5452396A (en) * | 1994-02-07 | 1995-09-19 | Midwest Research Institute | Optical processing furnace with quartz muffle and diffuser plate |
-
1989
- 1989-03-31 JP JP1081106A patent/JPH02258689A/ja active Pending
-
1990
- 1990-03-30 US US07/501,484 patent/US5213997A/en not_active Expired - Lifetime
- 1990-03-31 CN CN90102669A patent/CN1026599C/zh not_active Expired - Lifetime
- 1990-04-02 FR FR9004185A patent/FR2645178B1/fr not_active Expired - Fee Related
- 1990-04-02 DE DE4010595A patent/DE4010595A1/de active Granted
-
1996
- 1996-06-25 US US08/671,806 patent/US5795396A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE4010595C2 (fr) | 1992-09-03 |
FR2645178A1 (fr) | 1990-10-05 |
DE4010595A1 (de) | 1990-10-04 |
US5795396A (en) | 1998-08-18 |
JPH02258689A (ja) | 1990-10-19 |
CN1047349A (zh) | 1990-11-28 |
US5213997A (en) | 1993-05-25 |
CN1026599C (zh) | 1994-11-16 |
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