FI121592B - Förfarande för framställning av kretskortslaminat, särskilt rfid-antennlaminat och kretskortslaminat - Google Patents

Förfarande för framställning av kretskortslaminat, särskilt rfid-antennlaminat och kretskortslaminat Download PDF

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Publication number
FI121592B
FI121592B FI20085244A FI20085244A FI121592B FI 121592 B FI121592 B FI 121592B FI 20085244 A FI20085244 A FI 20085244A FI 20085244 A FI20085244 A FI 20085244A FI 121592 B FI121592 B FI 121592B
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FI
Finland
Prior art keywords
base material
metal foil
conductive layer
adhesive
areas
Prior art date
Application number
FI20085244A
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English (en)
Finnish (fi)
Other versions
FI20085244A0 (sv
FI20085244A (sv
Inventor
Tom Marttila
Original Assignee
Tecnomar Oy
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Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=39269539&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=FI121592(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Tecnomar Oy filed Critical Tecnomar Oy
Priority to FI20085244A priority Critical patent/FI121592B/sv
Publication of FI20085244A0 publication Critical patent/FI20085244A0/sv
Priority to EP09724134.3A priority patent/EP2259921B1/en
Priority to US12/922,253 priority patent/US9079382B2/en
Priority to BRPI0906179A priority patent/BRPI0906179B1/pt
Priority to PCT/FI2009/050226 priority patent/WO2009118455A1/en
Priority to RU2010143478/07A priority patent/RU2458492C2/ru
Priority to CN2009801108237A priority patent/CN101980870B/zh
Priority to ES09724134.3T priority patent/ES2509190T3/es
Priority to JP2011501257A priority patent/JP5427880B2/ja
Publication of FI20085244A publication Critical patent/FI20085244A/sv
Publication of FI121592B publication Critical patent/FI121592B/sv
Application granted granted Critical
Priority to US14/724,242 priority patent/US10212815B2/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G08—SIGNALLING
    • G08B—SIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
    • G08B13/00—Burglar, theft or intruder alarms
    • G08B13/22—Electrical actuation
    • G08B13/24—Electrical actuation by interference with electromagnetic field distribution
    • G08B13/2402—Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting
    • G08B13/2428—Tag details
    • G08B13/2437—Tag layered structure, processes for making layered tags
    • G08B13/244—Tag manufacturing, e.g. continuous manufacturing processes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2310/00—Treatment by energy or chemical effects
    • B32B2310/08—Treatment by energy or chemical effects by wave energy or particle radiation
    • B32B2310/0806—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation
    • B32B2310/0843—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation using laser
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1284—Application of adhesive
    • B32B37/1292—Application of adhesive selectively, e.g. in stripes, in patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0386—Paper sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0284—Paper, e.g. as reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0382—Continuously deformed conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0522—Using an adhesive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1377—Protective layers
    • H05K2203/1388—Temporary protective conductive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1377—Protective layers
    • H05K2203/1394—Covering open PTHs, e.g. by dry film resist or by metal disc
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Security & Cryptography (AREA)
  • Electromagnetism (AREA)
  • Automation & Control Theory (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)
  • Credit Cards Or The Like (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Structure Of Printed Boards (AREA)

Claims (10)

1. Förfarande för framställning av ledande mönster innehällande kretskortslaminat, i vilket förfarande följande steg utförs: 5 i) ett ledande skikt, säsom en metallfolie (3) ansluts till basmaterialet (1) selektivt sä, att den slutliga produktens önskade ledande fält (3a) och de smala fälten mellan den slutliga produktens ledande fält omfattande andelen av det ledande skiktet, säsom metallfolien (3) ansluts tili basmaterialet (1) med en bindning (2), och de för 10 avdragning avsedda vidare fälten av det ledande skiktet, t.ex. metallfolien (3b), lämnas väsentligen ofästa vid basmaterialet (1) sä, att fältet (3b), som skall avdras, är fast i basmaterialet (1) högst med den i det följaden steget ii) mönstrade andelen och eventuellt vid punkter, som förhindrar lösgöringen av fälten, som skall avdras, före steget iii), 15 kännetecknat av följande steg: ii) materialet mönstras genom att avdra det ledande skiktet, säsom metallfolien (3) frän de önskade ledande fältens (3a) smala mellanrum och frän periferin tili fälten (3b), som skall avdras; iii) de vidare fälten (3b) avdras frän det ledande skiktet, säsom metallfolien (3) i fast 20 form efter det att det ledande skiktets fält, som avdragits frän periferin tili fältet, som skall avdras, inte mera häller fast de vidare ledande skikten (3b).
2. Förfarande enligt patentkravet 1, kännetecknat därav, att basmaterialet (1) är böjligt och framställningen sker frän rulle tili rulle. 25 o
3. Förfarande enligt patentkravet 1 eller 2, kännetecknat därav, att för anslutning ^ av det ledande skiktet (3) tili basmaterialet (1) i steg i) används lim. g
4. Förfarande enligt patentkravet 3, kännetecknat därav, att det ledande skiktet, x 30 säsom metallfolien (3), ansluts tili basmaterialet (1) selektivt med ett limmönster, som utbreds med tryck- eller bläcksträlsteknik. sj- (M tn
§ 5. Förfarande enligt patentkravet 3, kännetecknat därav, att det ledande skiktet o «m (3) ansluts selektivt genom att aktivera eller deaktivera en del av limmet, det ledan- de skiktet eller basmaterialet (1) före eller efter anslutningen av det ledande skiktet (3) tili exempel med UV-strälning, ett skyddsskikt, tryck eller värme.
6. Förfarande enligt nägot av föregäende patentkrav, kännetecknat därav, att det 5 ledande skiktet (3) mönstras ätminstone genom etsning eller förängning.
7. Förfarande enligt nägot av föreglende patentkrav, kännetecknat därav, att basmaterialet (1) är papper, och för mönstring av det ledande materialet används ätminstone laser. 10
8. Ledande kretsmönster innehällande laminat eller del av laminat, där i) varje ledande kretsmönster (3a) och basmaterial (1) förenas sinsemellan av ett limmönster (2) eller annan bindning, vars storlek och form i Stora drag motsvarar det ledande kretsmönstrets huvudkonturer, 15 kännetecknat därav, att ii) det ledande kretsmönstrets interna exakta mönster, säsom tunna linjeroch de tunna linjernas mellanrum mönstrats pä limskiktet eller annan bindning genom att avlägsna det ledande skiktet, säsom metallfoliet (3) frän de önskade ledande fältens (3a) smala mellanrum sä, att rester av bindning kan finnas i mellanrummen; 20 iii) utanför de ledande kretsmönstrens huvudkonturer är basmaterialet väsentligen fri frän limmet eller annan bindning, som binder med det ledande kretsmönstret med undantag för huvudkonturernas randpartier.
9. Laminat enligt patentkravet 8, kännetecknat därav, att laminatet därtill om-25 fattar ett tillsatsskikt, som anslutits som en del av laminatet sl, att tillsatsskiktets o laminering tili basmaterialet (1) och det ledande fältet (3a) är väsentligen fri frän ^ rester av tili det ledande kretsmönstrets basmaterial anslutande limskikt (2) med ^ undantag för eventuella smala fält runt eller mellan de ledande mönstren (3a). i O) o x 30
10. RFID-dekal eller -laminat, som innehäller ett laminat enligt patentkravet 8 eller £ 9. CM LO 00 O O CM
FI20085244A 2008-03-26 2008-03-26 Förfarande för framställning av kretskortslaminat, särskilt rfid-antennlaminat och kretskortslaminat FI121592B (sv)

Priority Applications (10)

Application Number Priority Date Filing Date Title
FI20085244A FI121592B (sv) 2008-03-26 2008-03-26 Förfarande för framställning av kretskortslaminat, särskilt rfid-antennlaminat och kretskortslaminat
JP2011501257A JP5427880B2 (ja) 2008-03-26 2009-03-25 積層回路基板の製造方法
EP09724134.3A EP2259921B1 (en) 2008-03-26 2009-03-25 Method for manufacturing laminated circuit board
US12/922,253 US9079382B2 (en) 2008-03-26 2009-03-25 Method for manufacturing laminated circuit board
BRPI0906179A BRPI0906179B1 (pt) 2008-03-26 2009-03-25 método para fabricar uma placa de circuito impresso e utilização de um método para fabricar uma placa de circuito impresso
PCT/FI2009/050226 WO2009118455A1 (en) 2008-03-26 2009-03-25 Method for manufacturing laminated circuit board
RU2010143478/07A RU2458492C2 (ru) 2008-03-26 2009-03-25 Способ изготовления многослойной печатной платы
CN2009801108237A CN101980870B (zh) 2008-03-26 2009-03-25 制造层叠的电路板的方法
ES09724134.3T ES2509190T3 (es) 2008-03-26 2009-03-25 Método para fabricar una placa de circuito laminada
US14/724,242 US10212815B2 (en) 2008-03-26 2015-05-28 Laminate including conductive circuit patterns

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20085244A FI121592B (sv) 2008-03-26 2008-03-26 Förfarande för framställning av kretskortslaminat, särskilt rfid-antennlaminat och kretskortslaminat
FI20085244 2008-03-26

Publications (3)

Publication Number Publication Date
FI20085244A0 FI20085244A0 (sv) 2008-03-26
FI20085244A FI20085244A (sv) 2009-09-27
FI121592B true FI121592B (sv) 2011-01-31

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Family Applications (1)

Application Number Title Priority Date Filing Date
FI20085244A FI121592B (sv) 2008-03-26 2008-03-26 Förfarande för framställning av kretskortslaminat, särskilt rfid-antennlaminat och kretskortslaminat

Country Status (9)

Country Link
US (2) US9079382B2 (sv)
EP (1) EP2259921B1 (sv)
JP (1) JP5427880B2 (sv)
CN (1) CN101980870B (sv)
BR (1) BRPI0906179B1 (sv)
ES (1) ES2509190T3 (sv)
FI (1) FI121592B (sv)
RU (1) RU2458492C2 (sv)
WO (1) WO2009118455A1 (sv)

Cited By (2)

* Cited by examiner, † Cited by third party
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EP2671664A2 (en) 2012-06-08 2013-12-11 Tecnomar Oy Laser process alignment measuring method
US8931166B2 (en) 2011-05-19 2015-01-13 Tecnomar Oy Manufacturing method of electrical bridges suitable for reel to reel mass manufacturing

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8786510B2 (en) 2006-01-24 2014-07-22 Avery Dennison Corporation Radio frequency (RF) antenna containing element and methods of making the same
DE102010011504A1 (de) * 2010-03-16 2012-06-14 Mühlbauer Ag Verfahren zur Herstellung einer Transponderantenne, Transponderinlay mit einer derartigen Transponderantenne
CN102668241B (zh) * 2010-03-24 2015-01-28 株式会社村田制作所 Rfid系统
US9941569B2 (en) 2010-06-14 2018-04-10 Avery Dennison Retail Information Services, Llc Method of manufacturing a radio frequency identification device
US20120211272A1 (en) * 2011-02-17 2012-08-23 Changshu Sunrex Technology Co., Ltd. Thin film circuit board device
KR101604175B1 (ko) * 2011-12-12 2016-03-16 에베 그룹 에. 탈너 게엠베하 개별적으로 코딩된 읽기 패턴구조체를 생성하기 위한 방법 및 장치
DE102012209328A1 (de) 2012-06-01 2013-12-05 3D-Micromac Ag Verfahren und Anlage zum Herstellen eines Mehrschichtelements sowie Mehrschichtelement
RU2507301C1 (ru) * 2012-08-16 2014-02-20 Закрытое акционерное общество "Галилео Нанотех" Способ изготовления rfid-антенн, работающих в диапазоне ультравысокой частоты
US20140097003A1 (en) * 2012-10-05 2014-04-10 Tyco Electronics Amp Gmbh Electrical components and methods and systems of manufacturing electrical components
WO2014135742A1 (en) * 2013-03-07 2014-09-12 Walki Group Circuit board and a manufacturing method thereon
CN105378759B (zh) * 2013-06-03 2018-11-09 威凯集团 具有用于防止产品伪造的导电特征的密封标签及其制造方法
DE102013215706A1 (de) 2013-08-08 2015-02-12 Bielomatik Leuze Gmbh + Co. Kg Transfer-Stanzen
DE102013217348A1 (de) * 2013-08-30 2015-03-05 3D-Micromac Ag Verfahren und System zum Herstellen eines Mehrschichtelements sowie Mehrschichtelement
US9554472B2 (en) * 2013-12-19 2017-01-24 Intel Corporation Panel with releasable core
US9522514B2 (en) 2013-12-19 2016-12-20 Intel Corporation Substrate or panel with releasable core
US10192849B2 (en) 2014-02-10 2019-01-29 Infineon Technologies Ag Semiconductor modules with semiconductor dies bonded to a metal foil
WO2017095332A1 (en) * 2015-11-30 2017-06-08 Linxens Holding Method of manufacturing a laminated substrate for smart cards
RU2636575C1 (ru) * 2016-07-01 2017-11-24 Федеральное государственное автономное образовательное учреждение высшего образования "Национальный исследовательский университет "Московский институт электронной техники" (МИЭТ) Способ изготовления пластичных радиоэлектронных узлов и межсоединений
US10176905B2 (en) 2016-12-08 2019-01-08 Kitty Hawk Corporation Electrically conductive and insulative composite
BR112020013124A2 (pt) 2017-12-28 2020-12-01 Avery Dennison Retail Information Services, Llc etiquetas rfid usando construções de múltiplas camadas para durabilidade melhorada
JP7353985B2 (ja) * 2018-02-01 2023-10-02 サトーホールディングス株式会社 回路パターン、ｒｆｉｄインレイ、ｒｆｉｄラベル及びｒｆｉｄ媒体
RU187798U1 (ru) * 2018-11-06 2019-03-19 Виктор Игоревич Павлов Устройство, выполняющее функцию бесконтактной смарт-карты
RU187799U1 (ru) * 2018-11-06 2019-03-19 Виктор Игоревич Павлов Устройство, выполняющее функцию бесконтактной смарт-карты
RU186530U1 (ru) * 2018-11-06 2019-01-23 Виктор Игоревич Павлов Устройство, выполняющее функцию бесконтактной смарт-карты
RU187797U1 (ru) * 2018-11-06 2019-03-19 Виктор Игоревич Павлов Устройство, выполняющее функцию бесконтактной смарт-карты
FR3101748A1 (fr) 2019-10-07 2021-04-09 Centiloc Procédé de fabrication d’un circuit imprimé et circuit imprimé
EP4124449A1 (de) 2021-07-28 2023-02-01 Samson Agro A/S Etikett, etikettenband und verfahren zum herstellen von etiketten

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB869076A (en) 1957-05-14 1961-05-31 Heberlein & Co Ag Improvements in or relating to the treatment of surfaces
JPS5828895A (ja) * 1981-08-12 1983-02-19 新藤電子工業株式会社 スルホ−ルプリント配線基板の製造方法
DE4000372A1 (de) 1990-01-09 1991-07-11 Aei Gmbh Verfahren zur erstellung einer leiterstruktur auf einem platten- oder folienfoermigen, isolierenden traeger
JP3096069B2 (ja) * 1990-08-06 2000-10-10 チェックポイント・マニュファクチュアリング・ジャパン株式会社 共振タグ及びその製造方法
JPH07100793A (ja) 1993-09-30 1995-04-18 Nippon Carbide Ind Co Inc 金属箔パターン形成用積層物およびその加工方法
EP0704863B1 (en) 1994-09-30 1999-02-03 Mitsubishi Cable Industries, Ltd. Method of manufacturing flat wiring body
US5800724A (en) * 1996-02-14 1998-09-01 Fort James Corporation Patterned metal foil laminate and method for making same
HUP9903550A3 (en) * 1996-07-18 2000-09-28 Nagraid Sa Method for producing electronic module containing at least one electronic component, and electonic module formed as a chip card produced by the method
TNSN97123A1 (fr) * 1996-07-18 1999-12-31 Droz Francois Procede de fabrication de transpondeurs et transpondeur fabrique selon ce procede
US6618939B2 (en) * 1998-02-27 2003-09-16 Kabushiki Kaisha Miyake Process for producing resonant tag
JP2001043328A (ja) * 1999-07-30 2001-02-16 Toppan Forms Co Ltd データ受発信記録体のアンテナ破壊方法
JP4334704B2 (ja) 1999-10-25 2009-09-30 リンテック株式会社 回路基板の製造方法
US6320556B1 (en) * 2000-01-19 2001-11-20 Moore North America, Inc. RFID foil or film antennas
JP4502090B2 (ja) 2000-01-26 2010-07-14 Ｔｄｋ株式会社 電子部品及びその製造方法
JP2002094200A (ja) * 2000-09-18 2002-03-29 Matsushita Electric Ind Co Ltd 回路基板用電気絶縁材と回路基板およびその製造方法
US6717359B2 (en) * 2001-01-29 2004-04-06 Semiconductor Energy Laboratory Co., Ltd. Light emitting device and manufacturing method thereof
US6988666B2 (en) 2001-09-17 2006-01-24 Checkpoint Systems, Inc. Security tag and process for making same
DE10145749A1 (de) * 2001-09-17 2003-04-24 Infineon Technologies Ag Verfahren zur Herstellung einer strukturierten Metallschicht auf einem Trägerkörper und Trägerkörper mit einer strukturierten Metallschicht
CA2460840C (en) * 2001-09-18 2011-12-20 Nagraid S.A. Thin electronic label and method for making same
US7071422B2 (en) * 2001-10-01 2006-07-04 Nagraid S.A. Electronic circuit comprising conductive bridges and method for making such bridges
US7051945B2 (en) * 2002-09-30 2006-05-30 Nanosys, Inc Applications of nano-enabled large area macroelectronic substrates incorporating nanowires and nanowire composites
US7440255B2 (en) 2003-07-21 2008-10-21 Micron Technology, Inc. Capacitor constructions and methods of forming
US7384496B2 (en) * 2004-02-23 2008-06-10 Checkpoint Systems, Inc. Security tag system for fabricating a tag including an integrated surface processing system
JP4545022B2 (ja) * 2005-03-10 2010-09-15 三洋電機株式会社 回路装置およびその製造方法
US7685706B2 (en) * 2005-07-08 2010-03-30 Semiconductor Energy Laboratory Co., Ltd Method of manufacturing a semiconductor device
JP4779556B2 (ja) * 2005-10-07 2011-09-28 大日本印刷株式会社 非接触型データキャリア用導電部材の製造方法及び装置
US20070130754A1 (en) 2005-12-14 2007-06-14 Michael Fein Laser ablation prototyping of RFID antennas
US8786510B2 (en) * 2006-01-24 2014-07-22 Avery Dennison Corporation Radio frequency (RF) antenna containing element and methods of making the same
US7497004B2 (en) 2006-04-10 2009-03-03 Checkpoint Systems, Inc. Process for making UHF antennas for EAS and RFID tags and antennas made thereby
TW200811717A (en) 2006-08-25 2008-03-01 Advanced Connectek Inc Method for fabricating antenna units in continuous manner
US20090056989A1 (en) * 2007-08-27 2009-03-05 Intel Corporation Printed circuit board and method for preparation thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8931166B2 (en) 2011-05-19 2015-01-13 Tecnomar Oy Manufacturing method of electrical bridges suitable for reel to reel mass manufacturing
EP2671664A2 (en) 2012-06-08 2013-12-11 Tecnomar Oy Laser process alignment measuring method

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WO2009118455A1 (en) 2009-10-01
ES2509190T3 (es) 2014-10-17
EP2259921B1 (en) 2014-08-13
EP2259921A1 (en) 2010-12-15
FI20085244A0 (sv) 2008-03-26
US20150264812A1 (en) 2015-09-17
FI20085244A (sv) 2009-09-27
EP2259921A4 (en) 2012-12-26
WO2009118455A9 (en) 2010-06-17
US20110005821A1 (en) 2011-01-13
BRPI0906179B1 (pt) 2019-08-13
JP5427880B2 (ja) 2014-02-26
JP2011518429A (ja) 2011-06-23
RU2458492C2 (ru) 2012-08-10
CN101980870A (zh) 2011-02-23
BRPI0906179A2 (pt) 2015-06-30
US9079382B2 (en) 2015-07-14
US10212815B2 (en) 2019-02-19
CN101980870B (zh) 2013-12-04

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