ES385491A1 - Method of producing tin layers or tin alloy layers on copper or copper alloy wires by hot tin plating - Google Patents

Method of producing tin layers or tin alloy layers on copper or copper alloy wires by hot tin plating

Info

Publication number
ES385491A1
ES385491A1 ES385491A ES385491A ES385491A1 ES 385491 A1 ES385491 A1 ES 385491A1 ES 385491 A ES385491 A ES 385491A ES 385491 A ES385491 A ES 385491A ES 385491 A1 ES385491 A1 ES 385491A1
Authority
ES
Spain
Prior art keywords
tin
copper
layers
alloy
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES385491A
Other languages
Spanish (es)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of ES385491A1 publication Critical patent/ES385491A1/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/04—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the coating material
    • C23C2/08—Tin or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/14—Removing excess of molten coatings; Controlling or regulating the coating thickness
    • C23C2/22—Removing excess of molten coatings; Controlling or regulating the coating thickness by rubbing, e.g. using knives, e.g. rubbing solids

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Coating With Molten Metal (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

Device for the application of tin on copper wire, or layers of tin alloy on copper wire or copper alloy by means of fire tinning, with a uniform thickness on the periphery of the wire of 3 μ composed of a tin bath or of a tin alloy bath and of a heatable profiled spacer row, whose orifice section is limited by a wave train, the wave train passing between two concentric circles, characterized in that the radius of the inner concentric circle is 0, 5 to 2.5 μ greater than the upper tolerance limit for the radius of the wire, because between the radii of the concentric circles there is a difference of 10 to 50 μ and because each millimeter of circumference of the inner concentric circle corresponds approximately 3.5 to 15 half-waves of the wave train. (Machine-translation by Google Translate, not legally binding)
ES385491A 1969-11-13 1970-11-12 Method of producing tin layers or tin alloy layers on copper or copper alloy wires by hot tin plating Expired ES385491A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE1957031A DE1957031C3 (en) 1969-11-13 1969-11-13 Device for producing tin or tin alloy layers on wire made of copper or copper alloys by hot-dip tinning

Publications (1)

Publication Number Publication Date
ES385491A1 true ES385491A1 (en) 1975-09-16

Family

ID=5750956

Family Applications (1)

Application Number Title Priority Date Filing Date
ES385491A Expired ES385491A1 (en) 1969-11-13 1970-11-12 Method of producing tin layers or tin alloy layers on copper or copper alloy wires by hot tin plating

Country Status (9)

Country Link
US (1) US3692578A (en)
CA (1) CA935636A (en)
CH (1) CH570465A5 (en)
DE (1) DE1957031C3 (en)
ES (1) ES385491A1 (en)
FR (1) FR2069304A5 (en)
GB (1) GB1335053A (en)
SE (1) SE359320B (en)
ZA (1) ZA707658B (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2842201C2 (en) * 1978-09-28 1981-12-03 Felten & Guilleaume Carlswerk AG, 5000 Köln Device for manufacturing tinned copper wires
US5472739A (en) * 1990-09-20 1995-12-05 Totoku Electric Co., Ltd. Process of producing a hot dipped wire from a base wire, with the absence of iron-based, iron oxide-based and iron hydroxide-based minute particles on surfaces of the base wire
US5472740A (en) * 1990-10-11 1995-12-05 Totoku Electric Co., Ltd. Process of producing a hot dipped wire from a base wire, with the absence of iron-based, iron oxide-based and iron hydroxide-based minute particles on surfaces of the base wire
ITMI20022672A1 (en) * 2002-12-18 2004-06-19 Paolo Agostinelli ELECTRIC CONDUCTORS.
DE102006057178A1 (en) * 2006-12-03 2008-06-05 Waldemar Hoening Ohg network
JP5221231B2 (en) * 2008-07-18 2013-06-26 日立電線株式会社 Method for producing solar cell lead wire
CN112126879B (en) * 2020-09-24 2022-12-02 鹰潭市众鑫成铜业有限公司 Tinning method of copper wire
CN113235034B (en) * 2021-05-18 2022-07-26 江西富鸿金属有限公司 Tinning stack of copper line processing usefulness

Also Published As

Publication number Publication date
CH570465A5 (en) 1975-12-15
US3692578A (en) 1972-09-19
CA935636A (en) 1973-10-23
DE1957031B2 (en) 1974-01-31
SE359320B (en) 1973-08-27
DE1957031A1 (en) 1971-05-19
FR2069304A5 (en) 1971-09-03
GB1335053A (en) 1973-10-24
DE1957031C3 (en) 1974-09-05
ZA707658B (en) 1971-10-27

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