EP4327243A1 - Dispositif rfid extensible et modulaire - Google Patents

Dispositif rfid extensible et modulaire

Info

Publication number
EP4327243A1
EP4327243A1 EP21729622.7A EP21729622A EP4327243A1 EP 4327243 A1 EP4327243 A1 EP 4327243A1 EP 21729622 A EP21729622 A EP 21729622A EP 4327243 A1 EP4327243 A1 EP 4327243A1
Authority
EP
European Patent Office
Prior art keywords
antenna
antenna structure
auxiliary
rfid
inlay member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP21729622.7A
Other languages
German (de)
English (en)
Inventor
Mohammed RAMZAN
Daniel Smith
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sml Brand Identification Solutions Ltd
Original Assignee
Sml Brand Identification Solutions Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sml Brand Identification Solutions Ltd filed Critical Sml Brand Identification Solutions Ltd
Publication of EP4327243A1 publication Critical patent/EP4327243A1/fr
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07794—Antenna details the record carrier comprising a booster or auxiliary antenna in addition to the antenna connected directly to the integrated circuit
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/0723—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
    • G06K19/0724—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs the arrangement being a circuit for communicating at a plurality of frequencies, e.g. for managing time multiplexed communication over at least two antennas of different types
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07766—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
    • G06K19/07767—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the first and second communication means being two different antennas types, e.g. dipole and coil type, or two antennas of the same kind but operating at different frequencies

Definitions

  • the present invention relates to an RFID device and more particularly such an RFID including an RFID inlay and an auxiliary antenna structure to make the device extensible and modular.
  • RFID Radio Frequency Identification
  • RFID uses radio waves for communication between an RFID substrate and an RFID reader (or interrogator).
  • the RFID substrate includes a microchip attached to an antenna, which is commonly referred to as an RFID inlay.
  • the reader is capable of reading data from and writing data to the RFID substrate.
  • the RFID substrate may be affixed directly on a surface of the product or its packaging as in the case of a label, or it may be affixed to the product as in the case of a hangtag or card.
  • RFID substrates are inexpensive and they can be read quickly and with radio frequencies that can penetrate through many non-metallic materials. When products leave production in a shipping box, tracking labeling on the shipping box is required. Using RFID, each shipping box can be tracked using an RFID substrate, even if the label is not visible.
  • an RFID device comprising an inlay member with an RFID transponder electrically interconnected to a first antenna structure and having a first performance characteristic.
  • a first auxiliary antenna module including a second antenna structure.
  • the second antenna structure of the first auxiliary antenna module is electrically coupled to the first antenna structure of the inlay member, thereby providing the RFID device with a second performance characteristic, different from the first performance characteristic.
  • a second auxiliary antenna module including a third antenna structure; wherein, in a first configuration, the second antenna structure of the first auxiliary antenna module is electrically coupled to the first antenna structure of the inlay member and the third antenna structure of the second auxiliary antenna may be electrically de-coupled from the first antenna structure of the inlay member, thereby providing the RFID device with the second performance characteristic, different from the first performance characteristic.
  • the third antenna structure of the second auxiliary antenna module may be electrically coupled to the first antenna structure of the inlay member and the second antenna structure of the first auxiliary antenna module may be electrically de-coupled from the first antenna structure of the inlay member, thereby providing the RFID device with a third performance characteristic, different from the first and second performance characteristics.
  • the second performance characteristic and the third performance characteristic may differ by one of read range, read frequency band, or read angles in three- dimensional space.
  • the second antenna structure of the first auxiliary antenna module may be electrically coupled to the first antenna structure of the inlay member by disposing second antenna structure adjacent to the first antenna structure and in a second configuration the third antenna structure of the second auxiliary antenna module may be electrically coupled to the first antenna structure of the inlay member by disposing third antenna structure adjacent to the first antenna structure.
  • the first antenna structure may include a first antenna portion and a second antenna portion
  • the second antenna structure may include a first coupling portion spaced from a second coupling portion
  • the third antenna structure may include a third coupling portion spaced from a fourth coupling portion.
  • the second antenna structure of the first auxiliary antenna module may be electrically coupled to the first antenna structure of the inlay member by disposing the first antenna portion and the second antenna portion of the first antenna structure respectively over the first coupling portion and second coupling portion of the second antenna structure.
  • the third antenna structure of the second auxiliary antenna module may be electrically coupled to the first antenna structure of the inlay member by disposing the first antenna portion and the second antenna portion of the first antenna structure, respectively, over the third coupling portion and the fourth coupling portion of the third antenna structure.
  • a second auxiliary antenna module including a third antenna structure; wherein, in a first configuration, the second antenna structure of the first auxiliary antenna module may be electrically coupled to the first antenna structure of the inlay member and the third antenna structure of the second auxiliary antenna may be electrically de-coupled from the first antenna structure of the inlay member; and wherein the RFID transponder of the inlay member includes an RFID chip of a first chip type.
  • the third antenna structure of the second auxiliary antenna module may be electrically coupled to the first antenna structure of the inlay member and the second antenna structure of the first auxiliary antenna module is electrically de-coupled from the first antenna structure of the inlay member and wherein the RFID transponder of the inlay member includes an RFID chip of a second chip type.
  • the second antenna structure of the first auxiliary antenna module may be electrically coupled to the first antenna structure of the inlay member by disposing second antenna structure adjacent to the first antenna structure.
  • the first antenna structure may include a first antenna portion and a second antenna portion and the second antenna structure may include a first coupling portion spaced from a second coupling portion.
  • the second antenna structure of the first auxiliary antenna module may be electrically coupled to the first antenna structure of the inlay member by disposing the first antenna portion and the second antenna portion of the first antenna structure, respectively, over the first coupling portion and the second coupling portion of the second antenna structure.
  • the first antenna structure may include a first antenna portion and a second antenna portion and the second antenna structure may include a first coupling portion spaced from a second coupling portion and a third coupling portion spaced from a fourth coupling portion.
  • the second antenna structure of the first auxiliary antenna module may be electrically coupled to the first antenna structure of the inlay member by disposing the first antenna portion and the second antenna portion of the first antenna structure, respectively, over the first coupling portion and the second coupling portion of the second antenna structure.
  • the second antenna structure of the first auxiliary antenna module may be electrically coupled to the first antenna structure of the inlay member by disposing the first antenna portion and the second antenna portion of the first antenna structure, respectively, over the third coupling portion and the fourth coupling portion of the second antenna structure.
  • the second performance characteristic may be provided and in the second configuration the third performance characteristic may be provided.
  • the first performance characteristics may differ by one of read range, read frequency band, or read angles in three- dimensional space.
  • the first configuration the RFID transponder of the inlay member may include an RFID chip of a first chip type and in the second configuration the RFID transponder of the inlay member may include an RFID chip of a second chip type.
  • the inlay member and the first auxiliary antenna module may be disposed on a first substrate.
  • the inlay member may be disposed on a first substrate and the first auxiliary antenna module may be disposed on a second substrate.
  • the first substrate may overlay the second substrate.
  • the inlay member, the first auxiliary antenna module, and the second auxiliary antenna module may be disposed on a first substrate.
  • the inlay member may be disposed on a first substrate and the first auxiliary antenna module and the second auxiliary antenna module may be disposed on a second substrate.
  • the first substrate may overlay the second substrate. wherein at least a portion of the second antenna structure of the first auxiliary antenna module form a visual design pattern or logo.
  • an RFID device comprising an inlay member having an RFID transponder electrically interconnected to a first antenna structure and having a first performance characteristic.
  • a first auxiliary antenna module including a second antenna structure and a second auxiliary antenna module including a third antenna structure.
  • the second antenna structure of the first auxiliary antenna module is electrically coupled to the first antenna structure of the inlay member and the third antenna structure of the second auxiliary antenna is electrically de-coupled from the first antenna structure of the inlay member, thereby providing the RFID device with a second performance characteristic, different from the first performance characteristic.
  • the third antenna structure of the second auxiliary antenna module is electrically coupled to the first antenna structure of the inlay member and the second antenna structure of the first auxiliary antenna module is electrically de-coupled from the first antenna structure of the inlay member, thereby providing the RFID device with a third performance characteristic, different than the first and second performance characteristics.
  • an RFID device including an inlay member including an RFID transponder electrically interconnected to a first antenna structure and having a first performance characteristic.
  • a first auxiliary antenna module including a second antenna structure.
  • the second antenna structure of the first auxiliary antenna module is electrically coupled to the first antenna structure of the inlay member and the first antenna structure includes a first antenna portion and a second antenna portion.
  • the second antenna structure includes a first coupling portion spaced from a second coupling portion and a third coupling portion spaced from a fourth coupling portion.
  • the second antenna structure of the first auxiliary antenna module is electrically coupled to the first antenna structure of the inlay member by disposing the first antenna portion and the second antenna portion of the first antenna structure, respectively, over the first coupling portion and the second coupling portion of the second antenna structure.
  • the second antenna structure of the first auxiliary antenna module is electrically coupled to the first antenna structure of the inlay member by disposing the first antenna portion and the second antenna portion of the first antenna structure, respectively, over the third coupling portion and the fourth coupling portion of the second antenna structure.
  • FIG. 1 A shows an exploded perspective view of a portion of a prior art RFID hangtag with a bottom cardboard substrate on which is disposed and RFID inlay;
  • Fig. IB shows an exploded perspective view of the prior art hang tag of Fig.
  • FIG. 2A shows a top view of a substrate and auxiliary antenna modules in accordance with an embodiment of the present invention
  • Fig. 2B shows a top view of a substrate, auxiliary antenna modules, and an RFID inlay member in accordance with an embodiment of the present invention
  • Fig. 2C shows a top view of an RFID inlay member encapsulated between two substrates in accordance with an embodiment of the present invention
  • FIG. 3 shows an RFID inlay member and auxiliary antenna modules in accordance with an embodiment of the present invention
  • FIG. 4A shows a first configuration of an RFID inlay member and auxiliary antenna modules in accordance with an embodiment of the present invention
  • Fig. 4B shows a second configuration of an RFID inlay member and auxiliary antenna modules in accordance with an embodiment of the present invention
  • Fig. 4C shows an alternative embodiment of an RFID inlay member and auxiliary antenna modules in accordance with the present invention
  • Fig. 4D shows another embodiment of an RFID inlay member and auxiliary antenna module in accordance with the present invention
  • Fig. 4E shows yet another embodiment of an RFID inlay member and auxiliary antenna module in accordance with the present invention
  • FIG. 5 A shows an RFID inlay member in accordance with another embodiment of the present invention.
  • Fig. 5B shows a configuration of the RFID inlay member of Fig. 5 A in combination with auxiliary antenna modules in accordance with an embodiment of the present invention
  • Fig. 5C shows an alternative configuration of RFID inlay member and auxiliary antenna module in accordance with an embodiment of the present invention .
  • Fig. 5D shows cross-sectional views of RFID inlay member, substrates, and auxiliary antenna module in accordance with embodiments of the present invention.
  • electrically coupled includes direct electric coupling via a direct physical connection and indirect electric coupling, such as capacitive and inductive coupling.
  • RFID substrate includes labels, tags (including hang tags), cards, and any other type of substrate containing an RFID inlay and any or all of these terms may be used interchangeably herein.
  • substrate includes labels, tags, cards, and any other type of substrate which may be applied, affixed or attached to a product or other object, and any or all of these terms may be used interchangeably herein.
  • Fig. 1 A shows an exploded perspective view of a portion of a prior art RFID hangtag 100 with a bottom cardboard substrate 102 on which is disposed an RFID inlay 104.
  • the RFID inlay 104 may be in the form of a label including an adhesive to adhere the inlay to the bottom cardboard structure 102.
  • the RFID inlay 104 may include an RFID transponder 106 electrically interconnected to an antenna structure 108, which may be formed of aluminum.
  • the antenna structure 108 may comprise a central or base antenna portion 110 having a desired pattern/shape/configuration, which may be interconnected to one or more antenna extension portions 112/114 also having a desired pattern/shape/configuration.
  • the base antenna portion 110 and the one or more antenna extension portions 112/114 of RFD inlay 100 may be configured to meet certain performance requirements; however, once the RFID inlay 100 is manufactured, its performance characteristics cannot be changed or extended. Therefore, RFID inlays are typically manufactured in various configurations to meet different performance requirements.
  • Fig. IB shows an exploded perspective view of the full prior art RFID hangtag 100, including the bottom cardboard substrate 102 on which is disposed an RFID inlay 104 and a top cardboard substrate 120 which is disposed over the bottom cardboard substrate 102 to encapsulate the RFID inlayl04.
  • the combination of bottom substrate 102, RFID inlay 104, and top substrate 120 together form RFID hangtag 100 which may, for example, be used as a hangtag that is attached to a product in a retail store.
  • a perforation 122 in top substrate 120 and a perforation 124 in bottom substrate 102 may be provided so that a fastener may be fed there through to affix RFID hangtag 100 to a retail product.
  • Fig. 2A shows a top view of a substrate 202 and auxiliary antenna modules 204 and 206 in accordance with an embodiment of the present invention.
  • Substrate 202 which may be in the form of a rectangular (or any other desired shape) piece of cardboard (or other non-metallic material) for use in a hangtag for a retail product, is shown to include first auxiliary antenna module 204 and second auxiliary antenna module 206.
  • the antenna modules may be of different patterns/shapes/configurations for different desired performance levels or characteristics.
  • the first and second auxiliary antenna modules 204 and 206 include antenna structures that are made of metallic foil printed on the substrate 202.
  • the metallic foils may be formed of copper, aluminum, or other desired metal or alloy.
  • the antenna structures of the auxiliary antenna modules may be manufactured from other conductive materials or composites. Further, the auxiliary antenna modules may be disposed on the substrate in a manner different than printing, such as by being applied as a label with adhesive. In addition, while two auxiliary antenna modules are depicted, it is expressly contemplated that the substrate may include only one auxiliary antenna module or more than two auxiliary antenna modules.
  • an RFID inlay member 200 is disposed on the substrate 202.
  • the inlay member 200 includes, for example, an RFID transponder 210 and an antenna structure 212.
  • the RFID transponder 210 is electrically interconnected to the antenna structure 212 at base antenna portion 214, which is in turn interconnected to antenna extension portions 216 and 218.
  • the antenna structure 212 may be made, for example, from aluminum and is designed to offer a basic performance characteristic in this initial state, i.e., the RFID inlay member 200 may function on its on as an RFID substrate without any additional structures, as is the case with RFID inlay 104 of Figs. 1A and IB.
  • base antenna portion 214 and antenna extension portions 216 and 218 may be designed in various configurations to meet a desired performance characteristic (i.e. a first performance characteristic).
  • RFID inlay member 200 advantageously allows its performance characteristics to be extended to, for example, maximize its (read-range) performance at one or more particular RFID bands and/or to increase its RF performance at other angles in three-dimensional space by electrically coupling its antenna structure 212 with one of the first or second auxiliary antenna modules 204 and 206.
  • the extensibility of the RFID inlay member 200 is accomplished by the exact placement (position and orientation) relative to one or more auxiliary antenna structures, such as the antenna structures of first and second auxiliary antenna modules 204 and 206.
  • the auxiliary antenna structures may be realized with a printed metallic foil pattern.
  • the performance characteristic of the RFID inlay member 200 can be extended to have a second performance characteristic which is different from the first performance characteristic.
  • the antenna structure 212 of RFID inlay member 200 may be electrically coupled to the other auxiliary antenna structure, i.e. 204, and the performance characteristic of the RFID inlay member 200 can be altered to have a third performance characteristic which is different from the first and second performance characteristics.
  • Fig. 2C shows a top view of the RFID inlay member 200 encapsulated between two substrates, a top substrate 220 and a bottom substrate 202.
  • the RFID inlay member 200 and auxiliary antenna modules 204 and 206 are therefore integrated inside the cardboard and not visible, thereby forming an RFID hangtag 222.
  • cardboard substrates 202 and 220 have half the thickness of a conventional hangtag without RFID technology.
  • the thickness of cardboard substrates 202 and 220 may be about 10 microns each.
  • the thickness of RFID inlay member 200 may be 50 microns.
  • the RFID inlay member 200 is affixed to substrate 202 such that antenna extension portion 218 of antenna structure 212 is adjacent to and electrically coupled to auxiliary antenna module 206 , forming an extended RFID inlay member 200 having a second performance characteristic different from the first or original performance characteristic.
  • hangtag 222 may carry more than one auxiliary antenna pattern (in the form of modules 204 and 206), producing different RFID performance characteristics, it is readily reconfigurable, based on the performance characteristics needed.
  • the antenna structure 212 of the inlay member 200 is electrically coupled to the correct auxiliary antenna module that provides the selected RFID performance characteristic by aligning the antenna structure of RFID inlay member with the antenna structure of the appropriate antenna module.
  • the material of the substrate that includes the auxiliary antenna modules is not limited to cardboard and hang tags are not the only type of RFID device that may use the design of this disclosure.
  • the auxiliary antenna modules can also be included inside a sticker (label), in which case the inlay member is either placed directly on top and converted into an RFID enabled label; or, the inlay member is disposed on another substrate of a multi-substrate RFID label. In this case, the inlay member is placed on a different, but adjacent and overlapping, substrate than the auxiliary antenna modules that it is electrically or magnetically coupled to, necessitating an indirect connection, such as a capacitive, inductive, or magnetic connection.
  • the inlay member when used in a multi-substrate RFID label, the inlay member may occupy the top-most substrate and the auxiliary antenna module may occupy the next substrate down, adjacent to and overlapping with the top-most substrate.
  • the exact relative positioning of the respective antenna structures of the inlay member and the auxiliary antenna module results in a high (read range) performance RFID label.
  • the advantageous use of the RFID inlay member electrically or magnetically coupled to an auxiliary antenna module results in a large combination of possible RFID performance profiles or performance characteristics.
  • Selecting the correct auxiliary antenna module extends the performance of the inlay member, which results in a high performance RFID enabled hangtag, label, card or other type of substrate at a target RFID band.
  • the use of a specific inlay member with the correct auxiliary antenna module can result in optimized RFID read range performance of an RFID substrate in the European RFID band (ETSI) or the American RFID band (FCC), depending on in which geographical region the product is being sold.
  • ETSI European RFID band
  • FCC American RFID band
  • the RFID substrate can result in good read range across both RFID regions.
  • Fig. 3 depicts the above described example use of RFID inlay member 200.
  • RFID inlay 200 may be electrically coupled to either auxiliary antenna modules 302 or 304 in accordance with an embodiment of the invention.
  • the performance characteristics of RFID inlay member 200 can be configured to conform to different requirements.
  • auxiliary antenna module 302 is designed to configure the performance characteristic of inlay member 200 to conform to the requirements of the Federal Communications Commission (FCC) in the US.
  • auxiliary antenna module 304 is designed to configure the performance characteristic of inlay member 200 to conform to the requirements of the European Telecommunications Standards Institute (ETSI).
  • ETSI European Telecommunications Standards Institute
  • a specific desired performance characteristic can be selected by electrically coupling the antenna structure of inlay member 200 to the appropriate auxiliary antenna module.
  • Fig. 4 A shows a first configuration of RFID inlay member 200 and auxiliary antenna modules 302 and 304 disposed on an exemplary hangtag substrate 400 for a product to be sold in Europe.
  • the antenna structure of inlay 200 is electrically coupled to auxiliary antenna module 304.
  • antenna extension portion 218 of antenna structure 212 is disposed adjacent to and is electrically coupled to auxiliary antenna module 304.
  • This coupling configures the inlay member 200 to have a performance characteristic that conforms to ETSI requirements or optimizes performance in the ETSI frequency band.
  • the antenna structure of inlay member 200 is electrically decoupled from auxiliary antenna module 302.
  • Fig. 4B shows a second configuration of RFID inlay 200 and auxiliary antenna modules 302 and 306 each having a particular antenna structure disposed on an exemplary hangtag substrate 402 for a product to be sold in the US.
  • the antenna structure of inlay 200 is electrically coupled to auxiliary antenna module 302.
  • antenna extension portion 218 of antenna structure 212 is disposed adjacent to and is electrically coupled to auxiliary antenna module 302. This coupling configures the inlay member 200 to have a performance characteristic that conforms to FCC requirements or optimizes performance in the FCC frequency band.
  • the antenna structure of inlay member 2020 is electrically decoupled from auxiliary antenna module 304.
  • Fig. 4C shows an alternative embodiment in accordance with the present invention of RFID inlay 200A and auxiliary antenna modules 302A and 304A.
  • auxiliary antenna modules 302A and 304A are disposed on an exemplary hangtag substrate 404.
  • Auxiliary antenna modules 302A and 304A provide different performance characteristics for products to be sold in Europe or in the US.
  • the RFID inlay 200A is configured to be electrically coupled to one of auxiliary antenna modules 302A or 304A, depending on where the product is being sold.
  • the RFID inlay 200 A may include an RFID chip 201 A and two metallic structures 20 IB and 201C configured to couple to an auxiliary antenna module.
  • the metallic structures 20 IB and 201C may exemplarily be made from aluminum.
  • metallic structures 20 IB and 201C serve as the antenna structure of RFID inlay 200A.
  • a more sophisticated antenna structure such as the one shown in Figs. 4A and 4B, is used with RFID inlay 200 A to couple to auxiliary antenna modules 302 A and 304 A.
  • Configuration (b) in Fig. 4C is an alternative configuration of RFID inlay 200A and auxiliary antenna modules 302A and 304A disposed on an exemplary hangtag substrate 406 for a product to be sold in Europe.
  • the antenna structure of inlay member 200A is electrically coupled to auxiliary antenna module 304A. This coupling configures the inlay member 200A to have a performance characteristic that conforms to ETSI requirements or optimizes performance in the ETSI frequency band.
  • the antenna structure of inlay member 200A is electrically decoupled from auxiliary antenna module 302A.
  • Configuration (c) in Fig. 4C is an alternative configuration of RFID inlay 200A and auxiliary antenna modules 302A and 304A disposed on an exemplary hangtag substrate 408 for a product to be sold in the US.
  • the antenna structure of inlay member 200A is electrically coupled to auxiliary antenna module 302A. This coupling configures the inlay member 200A to have a performance characteristic that conforms to FCC requirements or optimizes performance in the FCC frequency band.
  • the antenna structure of inlay member 200 A is electrically decoupled from auxiliary antenna module 304 A.
  • Fig. 4D shows yet another alternative embodiment in accordance with the present invention of RFID inlay 200A and a single auxiliary antenna module 412.
  • auxiliary antenna module 412 is disposed on an exemplary hangtag substrate 410.
  • the auxiliary antenna module 412 includes connection points 414A and 414B and connection points 416A and 416B. These connection points provide different performance characteristics of auxiliary antenna module 412 for products to be sold in Europe or in the US.
  • the RFID inlay 200A is configured to be electrically coupled to connections points 414A and 414B or to connection points 416A and 416B, depending on where the product is being sold.
  • Configuration (b) in Fig. 4D is an alternative configuration of RFID inlay 200A and auxiliary antenna module 412 disposed on an exemplary hangtag substrate 418 for a product to be sold in Europe.
  • the antenna structure of inlay member 200A is electrically coupled to connection points 414A and 414B of auxiliary antenna module 412. This coupling configures the inlay member 200A to have a performance characteristic that conforms to ETSI requirements or optimizes performance in the ETSI frequency band.
  • the antenna structure of inlay member 200A is electrically decoupled from connection points 416A and 416B of auxiliary antenna module 412.
  • Configuration (c) in Fig. 4D is an alternative configuration of RFID inlay 200A and auxiliary antenna module 412 disposed on an exemplary hangtag substrate 420 for a product to be sold in the US.
  • the antenna structure of inlay member 200A is electrically coupled to connection points 416A and 416B of auxiliary antenna module 412. This coupling configures the inlay member 200A to have a performance characteristic that conforms to FCC requirements or optimizes performance in the FCC frequency band.
  • the antenna structure of inlay member 200A is electrically decoupled from connection points 414A and 414B of auxiliary antenna module 412.
  • Fig. 4E shows another alternative embodiment in accordance with the present invention of RFID inlays 430 and 432 and auxiliary antenna module 424.
  • RFID inlays 430 and 432 may be from different vendors, have different chip types, and/or have different antenna requirements for a desired performance characteristic.
  • the RFID inlays 430 and 432 may be an NXP UCODE 8 and an Impinj R6P, respectively.
  • auxiliary antenna module 424 is disposed on an exemplary hangtag substrate 422.
  • the auxiliary antenna module 424 includes connection points 426 A and 426B and connection points 428 A and 428B. These connection points provide different performance characteristics of auxiliary antenna module 424 adapted to different RFID inlay chip types. This allows RFID chips or RFID inlays from various vendors to be used with a single auxiliary antenna module.
  • the RFID inlay 430 is configured to be electrically coupled to connection points 426A and 426B
  • the RFID inlay 432 is configured to be electrically coupled to connection points 428A and 428B.
  • the performance of auxiliary antenna module 424 is therefore optimized for RFID inlay 430 if coupled to connection points 426 A and 426B and for RFID inlay 432 if coupled to connection points 428A and 428B.
  • the performance of auxiliary antenna module 424 may be optimized for the same frequency band, regardless whether an RFID inlay is coupled to connection points 426A and 426B or to connection points 428 A and 428B.
  • the performance of auxiliary antenna module 424 may also be optimized for different chip and types and different frequency bands, depending on which pair of connection points is used.
  • Configuration (b) in Fig. 4E depicts the antenna structure of inlay member 430 electrically coupled to connection points 426 A and 426B of auxiliary antenna module 424. This coupling configures auxiliary antenna module to be optimized for the inlay member 430.
  • the antenna structure of inlay member 430 is electrically decoupled from connection points 428A and 428B of auxiliary antenna module 424.
  • Configuration (c) in Fig. 4E depicts the antenna structure of inlay member 432 electrically coupled to connection points 428A and 428B of auxiliary antenna module 424. This coupling configures auxiliary antenna module 424 to be optimized for the inlay member 432.
  • the antenna structure of inlay member 432 is electrically decoupled from connection points 426A and 426B of auxiliary antenna module 424.
  • Fig. 5A shows an RFID inlay member 500 in accordance with a related embodiment of the disclosure.
  • RFID inlay member 500 includes an RFID transponder 504 and antenna structures 502A and 502B. Similar to what is described above in reference to Fig. 2B, the antenna structures 502A and 502B may be made, for example, from aluminum and are designed to offer basic performance characteristics in this initial state. In other words, the RFID inlay member 500 may function as an RFID label without any additional structures.
  • Fig. 5B shows a sample configuration of RFID inlay 500 used in connection with an auxiliary antenna module 506 for a retail setting.
  • the antenna structures 502A and 502B are each electrically coupled to discrete portions of the auxiliary antenna module 506 which has a particular antenna structure desired for the application.
  • the auxiliary antenna module may be a metallic foil pattern printed on a substrate.
  • the foil pattern of the antenna structure of the auxiliary antenna module 506 may be designed to be visible to the consumer. In this case, at least a portion of the foil pattern may take the form of a selected visual design pattern or brand logo.
  • the overall antenna pattem/shape/configuration may be selected to produce the desired performance characteristic of the RFID inlay 500.
  • the auxiliary antenna module may be manufactured from any metal, alloy or other conductive material or composite. Further, the auxiliary antenna module may be disposed on the substrate by printing or by being applied as a label with adhesive. There may be more than one auxiliary antenna module and, for a particular design/performance characteristic only one of the two antenna structures 502A or 502B may be electrically coupled to the antenna module(s).
  • Fig. 5C shows an alternative embodiment in accordance with the present invention of RFID inlay 508 used with an auxiliary antenna module 514 for a retail setting.
  • the RFID inlay 508 has an antenna structure 510 configured to be electrically coupled to an auxiliary antenna module.
  • Configuration (a) shows an exemplary hangtag substrate 512 with auxiliary antenna module 514.
  • the auxiliary antenna module 514 may be a metallic foil pattern printed on the substrate 512.
  • the foil pattern of the antenna structure of the auxiliary antenna module 514 may be designed to be visible to the consumer and may take the form of a selected visual design pattern or brand logo.
  • Configuration (b) of Fig. 5C shows the RFID inlay 508 affixed to exemplary hangtag substrate 516.
  • the antenna structure 510 of RFID inlay 508 is electrically coupled to the auxiliary antenna module 514 printed on hangtag substrate 516.
  • the overall antenna pattern/shape/configuration of the auxiliary antenna module 514 may be selected to produce the desired performance characteristic of the RFID inlay 508.
  • Fig. 5D shows a cross-sectional view of two exemplary configurations (a) and (b) in accordance with embodiments of the present invention.
  • the embodiment shown in Fig. 2 is configured as in configuration (b).
  • the embodiments shown in Figs. 4A-E may be configured as in configuration (a) or as in configuration (b).
  • the embodiments shown in Figs. 5B and 5C would typically be configured as in configuration (a) as the foil pattern of the antenna structure of the auxiliary antenna module may take the form of a selected visual design pattern or brand logo, since the foil pattern of the antenna structure is designed to be visible.
  • RFID inlay member 524 is encapsulated between two substrates, a top substrate 522 and a bottom substrate 526.
  • Auxiliary antenna module 520 is disposed on top of top substrate 522.
  • the auxiliary antenna module may illustratively be a metallic foil printed on top substrate 522.
  • the RFID inlay member 524 is integrated inside the cardboard substrates and not visible, but the auxiliary antenna module 520 is visible to the consumer.
  • Auxiliary antenna module 520, top substrate 522, RFID inlay member 524, and bottom substrate 526 form an RFID hangtag 518.
  • the RFID inlay member 524 is affixed to top substrate 522 and/or bottom substrate 526 such that the antenna structure (not shown) of the RFID inlay member 524 is electrically coupled to auxiliary antenna module 520.
  • RFID inlay member 534 and auxiliary antenna module 532 are encapsulated between two substrates, a top substrate 530 and a bottom substrate 536.
  • the RFID inlay member 534 and auxiliary antenna modules 532 are integrated inside the cardboard substrates and not visible, thereby forming an RFID hangtag 528.
  • the RFID inlay member 534 is affixed to top substrate 530 and/or bottom substrate 536 such that the antenna structure (not shown) of the RFID inlay member 534 is electrically coupled to auxiliary antenna module 532.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Details Of Aerials (AREA)

Abstract

Un dispositif RFID, comprenant un élément d'incrustation comprenant un transpondeur RFID interconnecté électriquement à une première structure d'antenne et ayant une première caractéristique de performance. Il existe un premier module d'antenne auxiliaire comprenant une seconde structure d'antenne. La seconde structure d'antenne du premier module d'antenne auxiliaire est électriquement couplée à la première structure d'antenne de l'élément d'incrustation, ce qui permet d'obtenir le dispositif RFID avec une seconde caractéristique de performance, différente de la première caractéristique de performance.
EP21729622.7A 2021-04-22 2021-04-22 Dispositif rfid extensible et modulaire Pending EP4327243A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/IB2021/000262 WO2022224002A1 (fr) 2021-04-22 2021-04-22 Dispositif rfid extensible et modulaire

Publications (1)

Publication Number Publication Date
EP4327243A1 true EP4327243A1 (fr) 2024-02-28

Family

ID=76250381

Family Applications (1)

Application Number Title Priority Date Filing Date
EP21729622.7A Pending EP4327243A1 (fr) 2021-04-22 2021-04-22 Dispositif rfid extensible et modulaire

Country Status (2)

Country Link
EP (1) EP4327243A1 (fr)
WO (1) WO2022224002A1 (fr)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006301827A (ja) * 2005-04-19 2006-11-02 Aruze Corp 非接触ｉｃカードシステム、並びに非接触ｉｃカードの取付体
JP4755921B2 (ja) * 2006-02-24 2011-08-24 富士通株式会社 Ｒｆｉｄタグ
WO2007116830A1 (fr) * 2006-04-03 2007-10-18 Aruze Corp. Balise ic radio
DE102007017864A1 (de) * 2007-04-13 2008-10-16 ASTRA Gesellschaft für Asset Management mbH & Co. KG Verfahren und Vorrichtung zum Schutz gegen Fernauslesen von Warenkennzeichnungsdaten
DE102007041752A1 (de) * 2007-09-04 2009-03-05 Bielomatik Leuze Gmbh + Co Kg Chipmodul für ein RFID-System
US10176422B2 (en) * 2015-06-09 2019-01-08 Assa Abloy Ab RIFD tag with a tunable antenna
DE102018212594B4 (de) * 2018-07-27 2021-11-18 Textilma Ag Dualbandtransponder und textiles Etikett mit Dualbandtransponder

Also Published As

Publication number Publication date
WO2022224002A1 (fr) 2022-10-27

Similar Documents

Publication Publication Date Title
AU750290B2 (en) Radio frequency identification tag having a printed antenna and method
RU2386169C2 (ru) Изделие с модулем электромагнитной связи
US7075435B2 (en) RFID tag assembly and system
US7274297B2 (en) RFID tag and method of manufacture
US8072334B2 (en) RFID tag with enhanced readability
US9172130B2 (en) RFID inlay incorporating a ground plane
US7323977B2 (en) Tunable RFID tag for global applications
EP2245578B1 (fr) Dispositifs et procédés à rfid pour des objets superposés
EP1710734A2 (fr) Etiquette RFID
US20080068175A1 (en) Antenna Arrangements for Radio Frequency Identification (RFID) Tags
AU2001283216A1 (en) Rfid tag assembly and system
CA2615486A1 (fr) Antenne solenoide
JP2012520517A (ja) ユニバーサルｒｆｉｄタグおよび製造方法
US20070182559A1 (en) Rfid antenna on multiple sides of 3-d packaging
KR20050094082A (ko) Ｒｆｉｄ용 아일렛
EP4327243A1 (fr) Dispositif rfid extensible et modulaire
JP5061712B2 (ja) 非接触ｉｃタグの製造方法
JP2022029374A (ja) Ｒｆタグ付き物品およびｒｆタグ付き物品の載置方法
JP3146542U (ja) 無線識別素子付の紙製物体、無線識別素子付の樹脂製物体、アンテナ要素付の紙製若しくは樹脂製物体及び無線識別素子付の紙製若しくは樹脂製物体
JP2009123058A (ja) 非接触型ｉｃタグ及び非接触型ｉｃタグの製造方法
KR100633583B1 (ko) Ｒｆｉｄ용 아일렛
US20240054313A1 (en) Multi-purpose rfid label
KR100633582B1 (ko) Ｒｆｉｄ용 아일렛 및 그 제조방법
WO2023156918A1 (fr) Antennes pour étiquettes d'identification par radiofréquence (rfid) façonnées
EP3115938A1 (fr) Emballage multicouche comprenant une étiquette radiofréquence et procédé de fabrication de celui-ci

Legal Events

Date Code Title Description
STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: UNKNOWN

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE

PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE

17P Request for examination filed

Effective date: 20231121

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DAV Request for validation of the european patent (deleted)
DAX Request for extension of the european patent (deleted)