EP3078120A1 - Resonant concentrator for improving the coupling between a chip card body and its electronic module - Google Patents

Resonant concentrator for improving the coupling between a chip card body and its electronic module

Info

Publication number
EP3078120A1
EP3078120A1 EP14825360.2A EP14825360A EP3078120A1 EP 3078120 A1 EP3078120 A1 EP 3078120A1 EP 14825360 A EP14825360 A EP 14825360A EP 3078120 A1 EP3078120 A1 EP 3078120A1
Authority
EP
European Patent Office
Prior art keywords
concentrator
antenna
resonant
capacitance
turns
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP14825360.2A
Other languages
German (de)
French (fr)
Inventor
BAUMGARTNER Stefan DANLER
Benjamin Mear
Deborah Teboul
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Smart Packaging Solutions SAS
Original Assignee
Smart Packaging Solutions SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Smart Packaging Solutions SAS filed Critical Smart Packaging Solutions SAS
Publication of EP3078120A1 publication Critical patent/EP3078120A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B5/00—Near-field transmission systems, e.g. inductive or capacitive transmission systems
    • H04B5/20—Near-field transmission systems, e.g. inductive or capacitive transmission systems characterised by the transmission technique; characterised by the transmission medium
    • H04B5/24—Inductive coupling
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07794—Antenna details the record carrier comprising a booster or auxiliary antenna in addition to the antenna connected directly to the integrated circuit

Definitions

  • the invention relates to antennas of the type used for contactless smart cards and electronic passports, and more specifically the so-called amplification antennas.
  • "Booster” in English terminology and which are (interface electromagnetically between the antenna of the electronic module of the smart card and the antenna of the smart card reader.
  • a system of two antennas in the smart card body namely a standard format antenna called ID1, called ID1 antenna, intended to be electromagnetically coupled with an external reader, and a concentrator antenna (still more simply designated as the concentrator) close to the format of an electronic module for a smart card, arranged in the card body or on a cover page of an electronic passport booklet.
  • This concentrator antenna is intended to be coupled electromagnetically magnetically with the antenna of the module, and it is connected directly with the antenna ID1.
  • Antenna system therefore means the antenna ID1, the concentrator antenna, and the adjustable capacity for adjusting the resonance frequency of the assembly.
  • the above-mentioned antenna system is electromagnetically coupled to an electronic module which also has an antenna disposed at the periphery of the electronic module and called the antenna of the module, whether it be for example the electronic module of a card smart contactless, or that of a passport electronic.
  • the antenna of the module is limited in terms of the number of turns, the reduced size of the module, it must also receive an electronic chip and possibly galvanic contacts ISO 7816-2 type, for example for so-called dual cards , with contact and non-contact operation.
  • This known antenna system works and is a clear progress, especially compared to smart cards without concentrator. However, it is still possible to improve the performance of the system, by seeking to minimize radiofrequency energy losses between the module and the concentrator.
  • the performance of the antenna system is sensitive to the value of the capacity of the chip used, which varies from one component to another, some chips having a low capacity.
  • the antenna of the module being limited in number of turns, its inductance will be relatively low, and the resonance frequency which is determined by the inductance of the antenna of the module and by the capacity of the chip, will then be far from the operating frequency of the card body antenna system.
  • the product whether it is a contactless smart card or an ePassport, may not meet the standards in force (ISO 14443 and 10373-6).
  • Document EP 1 385 120 A1 discloses a resonant system in another application context. It has a single capacitance whose value is chosen to obtain a target resonant frequency, but this system has only one resonance frequency.
  • a general object of the invention is therefore to provide an improved antenna system structure, particularly for the body of a contactless smart card or for an electronic passport, and which has the aforementioned disadvantages.
  • Another more specific object of the invention is to compensate for the loss of energy due to the increasing distance between the two resonance frequencies, namely the resonant frequency of the antenna of the module, and the resonant frequency of the system. antennas of the card body, and therefore consequently to improve the operating performance of the overall system.
  • a capacitance is added at the terminals of the concentrator, which makes it possible to improve the communication performances, and in particular the quality of the electromagnetic coupling between the antenna system of the card body. and the antenna of the module, the value of this additional capacity is calculated so that the concentrator resonates at a frequency close to that of the antenna of the electronic module.
  • the capacitance C of the chip is measured for a given type of chip, the inductance L of the electronic module which will contain this chip, which gives a resonance frequency Fo of the electronic module which is given by the formula: Fo - 1 / 2I1VLC.
  • the resonant frequency of the antenna system is calculated similarly, with an inductance corresponding to the overall inductance of the antenna ID1 and the concentrator, and a low capacitance which is that of the antenna system.
  • the invention therefore consists in creating, by adding a capacitor in parallel with the concentrator, a second resonant frequency of the antenna system of the card body, calculated to be close to the resonance frequency of the the antenna of the module, which significantly improves the communication performance.
  • the concentrator is in fact made up of two concentrators situated facing each other, and the added capacity is then that which is formed by these two concentrators situated facing one of the other.
  • the offsets of the two concentrator surfaces due to the manufacturing process are neutralized by means of an additional compensating capacitor, which can be implemented in the form of a compensation pad connected to the terminals of these two concentrators.
  • this compensation pad is for example made by two facing surfaces, and the surface is calculated in such a way that the resulting capacity allows to compensate for the frequency offset.
  • the invention therefore more precisely relates to an inductively coupled device, in particular a contactless smart card, comprising on the one hand an electronic module with contactless operation having a resonant frequency of the module (F 0 ), and comprising on the other hand a support provided with an antenna system (L1, L2) constituted by an antenna (L1) in the ID1 format and a concentrator antenna (L2), this antenna system (L1, L2) having a primary resonance frequency (Fop), characterized in that it comprises a resonant capacitance (C2) connected in parallel across the concentrator antenna (L2), so as to create a second resonant frequency of the concentrator antenna (L2 ), called secondary resonant frequency (Foc), closest to the resonance frequency (F 0) of the electronic module, in this manner / the hub itself is resonant at a resonant frequency close to the frequency of re module sound.
  • the resonant capacitance (C2) of the concentrator (L2) is
  • the metal surfaces that form the added capacitor correspond to the surfaces of two partially superposed concentrators, that is to say that the concentrator antenna (L2) is in the form of conductive turns arranged on two sides of the support and the resonance capacitance (C2) of the concentrator is formed by the superposition of turns of the concentrator antenna (L2).
  • the invention provides that the offsets in the positioning of these two concentrators under the effect of tolerances of the manufacturing process can be neutralized by means of a compensation capacity.
  • a portion for example a half of the surface of the turns of the concentrator antenna (L2), is arranged in staggered relation with another part, for example the other half turns.
  • the latter is constituted by a compensation pad whose surface and shape are designed so that a drift of the capacitance resonant in one direction due to an offset of turns, is compensated by a drift of this capacity of the same amplitude in the other direction due to the compensation pad.
  • FIG. 1 illustrates the equivalent diagram of a conventional system of
  • FIG. 2 represents the frequency response of the system of FIG. 3 illustrates the equivalent diagram of the resonant concentrator system according to the invention
  • FIG. 4 represents the frequency response of the system according to
  • FIG. 5 illustrates a real embodiment of a system according to the invention, corresponding to the equivalent diagram of FIG. 3;
  • FIGS. 6A and 6B show two concentrators with turns
  • FIG. 7 represents a cross-section of the frequency adjustment capacity of the concentrator of the system of FIG. 5;
  • FIG. 8 represents a cross-section of the adjustment capacity achieved using the two concentrators of FIG. 6.
  • the smart card 1. comprises a card body 2 and an electronic module 3.
  • the card body 2 comprises an antenna system, namely an antenna 4 in ID1 format, equivalent to a capacitor C in series with an inductor L1. , and an antenna 5 or concentrator, equivalent to an inductor L2.
  • the electronic module 3 comprises a chip 6 having a resistor R and a capacitance C, and at the terminals of the chip, the antenna 7 of the module, equivalent to an inductor L3,
  • the module 3 has a resonance frequency F, for example 32 Mhz in the example shown.
  • the antenna system of the card body is equivalent to an antenna ID1 in the form of an inductance inductance L1, connected in series with a concentrator antenna in the form of a inductance inductor L2, and with an adjustable capacitance C1.
  • Capacity adjustment is done in particular by a known method of material removal, known as "trimming", which makes it possible to precisely adjust the capacitance C1 and consequently the resonance frequency F 0p of the antenna system 4,5. , knowing that or
  • the antenna system 4.5 of the card body 2 has a resonance frequency, called primary resonance frequency, noted Fo Pf typically quite remote (for example 14 Mhz) of the resonance frequency F 0M of the module, for the reasons explained above.
  • FIG. 3 only the equivalent diagram of the antenna system 4.5 of the card body corresponding to the invention is shown. It differs from the previous one in that a capacity 8, of value C2, connected in parallel with the antenna 5 of the concentrator which has an impedance L2, has been added.
  • the antenna system 4.5 now has two resonance peaks, namely the peak corresponding to the previous FOP primary resonance frequency, and a second peak corresponding to a secondary resonant frequency Foc (36 Mhz in the example shown) much closer to the resonance frequency FOM of the module 3.
  • the new resonant frequency of the concentrator denoted Foc
  • Foc the new resonant frequency of the concentrator
  • the value C2 of the resonant capacitance 8 is chosen so that the secondary resonance peak Foc is close to the resonance frequency of the module 3.
  • the electronic module 3 and the card body 2 now resonating at close frequencies, the performance of contactless communication of the smart card with a remote reader finds improved.
  • this added capacitor C2 can be made for example by adding two conductive surfaces 10, 11 opposite one another on both sides of the support 9 when it is a question of a concentrator single-sided These surfaces 10, 11 are then connected to the terminals of the concentrator 5,
  • this capacitor C2 can be made by superimposing tracks 12, 13 of the concentrator 5 on one face with respect to the other, in the case of a double-sided concentrator.
  • the capacitance C2 formed by the superposition of the tracks 12, 13 depends on the superposition surface.
  • the tracks 12, 13 are superimposed, and in the right half of the concentrator 5, the tracks 12, 13 are offset in staggered rows. In this way, if during the manufacturing process of the concentrator antennas of several successive devices, the alignments of the turns 12, 13 of the left part vary, the alignments of the right part will vary in opposite directions, so that the capacitor C2 will be substantially constant.
  • a means for compensating for the capacitance variation C2 in the form of a compensation pad 17, the shape and surface of which are designed in such a way that derives from the resonant capacitance C2 in one direction due to a shift of turns of the concentrator 5, or compensated by a drift of this capacitance of the same amplitude in the other direction.
  • the resonant capacitance 8 is configured to be adjustable towards a target value, in particular by removal of material, which makes it possible to further optimize the value of the secondary resonance frequency Foc,
  • the embodiment with single-sided concentrator is easier to industrialize but with poorer performance, and the embodiment with a double-sided concentrator is more difficult to industrialize because the tracks are superimposed, with positioning tolerances of turns which can generate variations of capacity from one product to another.
  • a compensation pad as diagrammatically in FIG. 6, or the use of an adjustable capacity 8, makes it possible to control the offset of the tracks of one face with respect to the tracks of the other face.
  • the shape of the compensation pad is obtained by simulation of offsets of the two sets of tracks relative to each other in all directions in the plane of the card. By iterations from the most usual offsets (in frequency of occurrence and in amplitude), we obtain a form of compensation pad that minimizes the total capacitance variations, that is to say the variations due to both the offset of the tracks and variations in the opposite direction due to the compensation pad.
  • the invention makes it possible to achieve the goals set. In addition, it reduces the time needed to test the feasibility of an antenna system or to industrialize a system already tested.
  • the radiofrequency performance of the assembly consisting of the concentrator of the card body and the antenna of the electronic module are increased thanks to the resonant concentrator.
  • the proposed solution combines the advantages of smart card technology without a physical connection between the module and the antenna, with the possibility of obtaining optimal radio frequency performance, approaching those of wired technology.
  • the device according to the invention offers the possibility of limiting the frequency shifts from one component to the other, which are generally due to the lamination of the components. The result is an easier industrialization.

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  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Signal Processing (AREA)
  • Near-Field Transmission Systems (AREA)

Abstract

The invention relates to an inductive coupling device, in particular a chip card with contactless operation, comprising on the one hand an electronic module with contactless operation exhibiting a resonant frequency of the module (Fo), and comprising on the other hand a support provided with a system of antennas (L1,L2) consisting of an antenna (Ll) in the ID1 format and a concentrator antenna (L2), this system of antennas (L1,L2) exhibiting a primary resonant frequency (Fop), characterized in that it comprises a resonant capacitor (C2) connected in parallel across the terminals of the concentrator antenna (L2), in such a way as to create a secondary resonant frequency (Foc) of the concentrator antenna (L2), which is close to the resonant frequency (Fo) of the electronic module

Description

Concentrateur résonant pour améliorer le couplage entre un corps de carte à puce et son module électronique L'invention concerne les antennes du type de celles utilisées pour les cartes à puce à fonctionnement sans contact et passeports électroniques, et plus spécifiquement les antennes d'amplification dites « booster » en terminologie anglo-saxonne et qui font (interface d'un point de vue électromagnétique entre l'antenne du module électronique de la carte è puce et l'antenne du lecteur de carte à puce.  The invention relates to antennas of the type used for contactless smart cards and electronic passports, and more specifically the so-called amplification antennas. "Booster" in English terminology and which are (interface electromagnetically between the antenna of the electronic module of the smart card and the antenna of the smart card reader.
Etat de la technique il existe déjà dans l'état de la technique, un concentrateur standard, réalisé par une inductance disposée dans le corps de la carte à puce. State of the art there already exists in the state of the art, a standard concentrator, made by an inductor arranged in the body of the smart card.
On a alors un système de deux antennes dans le corps de carte à puce, à savoir une antenne au format normalisé dit ID1, dite antenne ID1, destinée à être couplée électro magnétiquement avec un lecteur externe, et une antenne concentrateur (encore désigné plus simplement comme le concentrateur) proche du format d'un module électronique pour carte à puce, disposée dans le corps de carte ou sur une page de couverture d'un livret de passeport électronique. Cette antenne concentrateur est destinée à être couplée électro magnétiquement avec l'antenne du module, et elle est connectée directement avec l'antenne ID1.  There is then a system of two antennas in the smart card body, namely a standard format antenna called ID1, called ID1 antenna, intended to be electromagnetically coupled with an external reader, and a concentrator antenna (still more simply designated as the concentrator) close to the format of an electronic module for a smart card, arranged in the card body or on a cover page of an electronic passport booklet. This concentrator antenna is intended to be coupled electromagnetically magnetically with the antenna of the module, and it is connected directly with the antenna ID1.
Un réseau de capacités ajustables branchées en série avec les deux antennes précitées permet de faire résonner l'ensemble du système d'antennes à une fréquence de fonctionnement déterminée. On entend donc par système d'antennes, l'antenne ID1, l'antenne concentrateur, et la capacité ajustable permettant d'ajuster la fréquence de résonnance de l'ensemble.  A network of adjustable capacitors connected in series with the two aforementioned antennas makes it possible to resonate the entire antenna system at a determined operating frequency. Antenna system therefore means the antenna ID1, the concentrator antenna, and the adjustable capacity for adjusting the resonance frequency of the assembly.
Le système d'antennes précité est couplé électro magnétiquement à un module électronique disposant lui aussi d'une antenne, disposée à la périphérie du module électronique et appelée antenne du module, qu'il s'agisse par exemple du module électronique d'une carte à puce sans contact, ou de celui d'un passeport électronique. L'antenne du module est limitée en terme de nombre de tours, par la taille réduite du module, celui-ci devant en outre recevoir une puce électronique et éventuellement des contacts galvaniques de type ISO 7816-2, par exemple pour les cartes dites duales, à fonctionnement à contact et sans contact. The above-mentioned antenna system is electromagnetically coupled to an electronic module which also has an antenna disposed at the periphery of the electronic module and called the antenna of the module, whether it be for example the electronic module of a card smart contactless, or that of a passport electronic. The antenna of the module is limited in terms of the number of turns, the reduced size of the module, it must also receive an electronic chip and possibly galvanic contacts ISO 7816-2 type, for example for so-called dual cards , with contact and non-contact operation.
Ce système d'antennes connu fonctionne et constitue un net progrès, notamment par rapport aux cartes à puce dépourvues de concentrateur. Cependant il est encore possible d'améliorer les performances du système, en cherchant à minimiser les pertes d'énergie radiofréquenœ entre le module et le concentrateur.  This known antenna system works and is a clear progress, especially compared to smart cards without concentrator. However, it is still possible to improve the performance of the system, by seeking to minimize radiofrequency energy losses between the module and the concentrator.
En outre, la performance du système d'antennes est sensible à la valeur de la capacité de la puce utilisée, qui varie d'un composant à l'autre, certaines puces présentant une faible capacité. En effet, l'antenne du module étant limitée en nombre de tours, son inductance va être relativement faible, et la fréquence de résonnance qui est déterminée par l'inductance de l'antenne du module et par la capacité de la puce, va alors être très éloignée de la fréquence de fonctionnement du système d'antennes du corps de carte. Dans le pire des cas, le produit, qu'il s'agisse notamment d'une carte à puce sans contact ou d'un passeport électronique, peut ne pas répondre aux normes en vigueur (ISO 14443 et 10373- 6).  In addition, the performance of the antenna system is sensitive to the value of the capacity of the chip used, which varies from one component to another, some chips having a low capacity. Indeed, the antenna of the module being limited in number of turns, its inductance will be relatively low, and the resonance frequency which is determined by the inductance of the antenna of the module and by the capacity of the chip, will then be far from the operating frequency of the card body antenna system. In the worst case, the product, whether it is a contactless smart card or an ePassport, may not meet the standards in force (ISO 14443 and 10373-6).
On connaît de par le document EP 1 385 120 Al, un système résonant dans un autre contexte applicatif. Il comporte une seule capacité dont la valeur est choisie pour obtenir une fréquence de résonance cible, mais ce système ne comporte qu'une seule fréquence de résonance.  Document EP 1 385 120 A1 discloses a resonant system in another application context. It has a single capacitance whose value is chosen to obtain a target resonant frequency, but this system has only one resonance frequency.
Une autre motif de recherche d'amélioration tient dans le fait que la tendance du marché va vers l'utilisation de modules microélectroniques simple face et de plus petite taille, ce qui réduit la place disponible pour l'antenne du module, et par conséquent réduit le nombre de tours ou de spires de cette antenne. Le décalage entre la fréquence de résonnance de l'antenne du module et la fréquence de résonnance du système d'antennes du corps de carte peut entraîner des pertes d'énergie dans la transmission, et un mauvais couplage entre le système d'antennes du corps de carte, et l'antenne du module électronique. On décrira l'invention en référence à la terminologie habituelle des composants d'une carte à puce sans contact ou d'une carte à puce duale, étant entendu qu'elle est transposable sans limitation à d'autres produits de format différent, comme les passeports électroniques. Another reason for the search for improvement is that the market trend is towards the use of single-sided microelectronic modules of smaller size, which reduces the space available for the antenna of the module, and therefore reduces the number of turns or turns of this antenna. The difference between the resonance frequency of the antenna of the module and the resonance frequency of the antenna system of the card body can cause energy losses in the transmission, and a poor coupling between the antenna system of the body card, and the antenna of the electronic module. The invention will be described with reference to the usual terminology of the components of a contactless smart card or of a dual smart card, it being understood that it can be transposed without limitation to other products of different format, such as electronic passports.
Buts de l'invention Goals of the invention
Un but général de l'invention est par conséquent de proposer une structure améliorée de système d'antennes, notamment pour le corps d'une carte à puce sans contact ou pour un passeport électronique, et qui soit dépourvue des Inconvénients précités. A general object of the invention is therefore to provide an improved antenna system structure, particularly for the body of a contactless smart card or for an electronic passport, and which has the aforementioned disadvantages.
Un autre but plus spécifique de l'invention est de compenser la perte d'énergie due à l'éloignement grandissant entre les deux fréquences de résonnance, à savoir la fréquence de résonnante de l'antenne du module, et la fréquence de résonnance du système d'antennes du corps de carte, et donc par conséquent d'améliorer la performance de fonctionnement du système global.  Another more specific object of the invention is to compensate for the loss of energy due to the increasing distance between the two resonance frequencies, namely the resonant frequency of the antenna of the module, and the resonant frequency of the system. antennas of the card body, and therefore consequently to improve the operating performance of the overall system.
Résumé de l'invention Selon le principe de l'invention, on rajoute une capacité aux bornes du concentrateur, ce qui permet d'améliorer les performances de communication, et notamment la qualité du couplage électromagnétique entre le système d'antennes du corps de carte et l'antenne du module, La valeur de cette capacité supplémentaire est calculée de manière que le concentrateur résonne à une fréquence proche de celle de l'antenne du module électronique. SUMMARY OF THE INVENTION According to the principle of the invention, a capacitance is added at the terminals of the concentrator, which makes it possible to improve the communication performances, and in particular the quality of the electromagnetic coupling between the antenna system of the card body. and the antenna of the module, the value of this additional capacity is calculated so that the concentrator resonates at a frequency close to that of the antenna of the electronic module.
En pratique, on mesure la capacité C de la puce pour un type de puce donné, l'inductance L du module électronique qui va contenir cette puce, ce qui donne une fréquence de résonnance Fo du module électronique qui est donnée par la formule : Fo - 1/2I1VLC. La fréquence de résonnance du système d'antennes se calcule de façon similaire, avec une inductance correspondant à l'inductance globale de l'antenne ID1 et du concentrateur, et une capacité faible qui est celle du système d'antennes. Ces deux fréquences de résonnance sont, pour les raisons évoquées précédemment, décalées, ce qui nuit à la performance de communication du produit In practice, the capacitance C of the chip is measured for a given type of chip, the inductance L of the electronic module which will contain this chip, which gives a resonance frequency Fo of the electronic module which is given by the formula: Fo - 1 / 2I1VLC. The resonant frequency of the antenna system is calculated similarly, with an inductance corresponding to the overall inductance of the antenna ID1 and the concentrator, and a low capacitance which is that of the antenna system. These two resonance frequencies are, for reasons previously mentioned, offset, which affects the communication performance of the product
Dans son principe de base, l'invention consiste donc à créer, par ajout d'une capacité en parallèle du concentrateur, une seconde fréquence de résonnance du système d'antennes du corps de carte, calculée pour être proche de la fréquence de résonnance de l'antenne du module, ce qui améliore sensiblement la performance de communication.  In its basic principle, the invention therefore consists in creating, by adding a capacitor in parallel with the concentrator, a second resonant frequency of the antenna system of the card body, calculated to be close to the resonance frequency of the the antenna of the module, which significantly improves the communication performance.
Dans une variante avantageuse de l'invention, le concentrateur est constitué en fait de deux concentrateurs situés en regard l'un de l'autre, et la capacité ajoutée est alors celle qui est formée par ces deux concentrateurs situés en regard l'un de l'autre. En outre, les décalages des deux surfaces de concentrateurs dues au procédé de fabrication sont neutralisés à l'aide d'une capacité de compensation supplémentaire, qui peut être réalisée sous la forme d'un plot de compensation connecté aux bornes de ces deux concentrateurs, ce plot de compensation est donc par exemple réalisé par deux surfaces en regard, et dont la surface est calculée de telle manière que la capacité qui en résulte permette de compenser le décalage de fréquence.  In an advantageous variant of the invention, the concentrator is in fact made up of two concentrators situated facing each other, and the added capacity is then that which is formed by these two concentrators situated facing one of the other. In addition, the offsets of the two concentrator surfaces due to the manufacturing process are neutralized by means of an additional compensating capacitor, which can be implemented in the form of a compensation pad connected to the terminals of these two concentrators. this compensation pad is for example made by two facing surfaces, and the surface is calculated in such a way that the resulting capacity allows to compensate for the frequency offset.
L'invention a donc plus précisément pour objet un dispositif à couplage Inductif, notamment carte à puce à fonctionnement sans contact, comportant d'une part un module électronique à fonctionnement sans contact présentant une fréquence de résonnance du module (F0), et comportant d'autre part un support pourvu d'un système d'antennes (Ll,L2) constitué par une antenne (Ll) au format IDl et une antenne de concentrateur (L2), ce système d'antennes (L1,L2) présentant une fréquence de résonnance primaire (Fop), caractérisé en qu'il comporte une capacité résonnante (C2) connectée en parallèle aux bornes de l'antenne concentrateur (L2), de manière à créer une seconde fréquence de résonnance de l'antenne concentrateur (L2), dite fréquence de résonnance secondaire (Foc), proche de la fréquence de résonnance (F0) du module électronique, De cette manière/ le concentrateur est lui-même résonnant, à une fréquence de résonnance proche de la fréquence de résonnance du module. Selon un premier mode de réalisation de l'invention, la capacité résonnante (C2) du concentrateur (L2) est réalisée par deux surfaces métalliques au moins partiellement en regard, connectées aux bornes du concentrateur (L2). The invention therefore more precisely relates to an inductively coupled device, in particular a contactless smart card, comprising on the one hand an electronic module with contactless operation having a resonant frequency of the module (F 0 ), and comprising on the other hand a support provided with an antenna system (L1, L2) constituted by an antenna (L1) in the ID1 format and a concentrator antenna (L2), this antenna system (L1, L2) having a primary resonance frequency (Fop), characterized in that it comprises a resonant capacitance (C2) connected in parallel across the concentrator antenna (L2), so as to create a second resonant frequency of the concentrator antenna (L2 ), called secondary resonant frequency (Foc), closest to the resonance frequency (F 0) of the electronic module, in this manner / the hub itself is resonant at a resonant frequency close to the frequency of re module sound. According to a first embodiment of the invention, the resonant capacitance (C2) of the concentrator (L2) is formed by two metal surfaces at least partially facing each other, connected to the terminals of the concentrator (L2).
Dans une variante améliorée de l'invention, les surfaces métalliques qui forment la capacité rajoutée, correspondent aux surfaces de deux concentrateurs partiellement superposés, c'est-à-dire que l'antenne concentrateur (L2) est réalisée sous forme de spires conductrices disposées sur deux faces du support et la capacité de résonnance (C2) du concentrateur est réalisée par la superposition de spires de l'antenne concentrateur (L2).  In an improved variant of the invention, the metal surfaces that form the added capacitor correspond to the surfaces of two partially superposed concentrators, that is to say that the concentrator antenna (L2) is in the form of conductive turns arranged on two sides of the support and the resonance capacitance (C2) of the concentrator is formed by the superposition of turns of the concentrator antenna (L2).
En outre, l'invention prévoit que les décalages dans le positionnement de ces deux concentrateurs sous l'effet des tolérances du procédé de fabrication peuvent être neutralisés à l'aide d'une capacité de compensation.  In addition, the invention provides that the offsets in the positioning of these two concentrators under the effect of tolerances of the manufacturing process can be neutralized by means of a compensation capacity.
Selon un premier mode de réalisation du moyen de compensation de capacité, on dispose en quinconce une partie, par exemple une moitié de la surface des spires de l'antenne de concentrateur (L2), et en vis à vis une autre partie, par exemple l'autre moitié des spires.  According to a first embodiment of the capacity compensation means, a portion, for example a half of the surface of the turns of the concentrator antenna (L2), is arranged in staggered relation with another part, for example the other half turns.
Selon un autre mode de réalisation du moyen de compensation de capacité, celui-ci est constitué par un plot de compensation dont la surface et la forme sont conçues de manière à ce qu'une dérive de la capacité résonnante dans un sens due à un décalage de spires, soit compensée par une dérive de cette capacité de même amplitude dans l'autre sens due au plot de compensation.  According to another embodiment of the capacity compensation means, the latter is constituted by a compensation pad whose surface and shape are designed so that a drift of the capacitance resonant in one direction due to an offset of turns, is compensated by a drift of this capacity of the same amplitude in the other direction due to the compensation pad.
D'autres caractéristiques et avantages de l'invention apparaîtront à la lecture de la description détaillée et des dessins annexés dans lesquels : Other features and advantages of the invention will appear on reading the detailed description and the accompanying drawings in which:
- la figure 1 illustre le schéma équivalent d'un système classique de FIG. 1 illustrates the equivalent diagram of a conventional system of
technologie à couplage inductif ;  inductively coupled technology;
la figure 2 représente la réponse en fréquence du système de la figure la figure 3 illustre le schéma équivalent du système de concentrateur résonnant selon l'invention ;  FIG. 2 represents the frequency response of the system of FIG. 3 illustrates the equivalent diagram of the resonant concentrator system according to the invention;
la figure 4 représente la réponse en fréquence du système selon  FIG. 4 represents the frequency response of the system according to
l'invention, faisant apparaître deux pics de résonnance ; la figure 5 illustre un mode de réalisation réel d'un système selon l'invention, correspondant au schéma équivalent de la figure 3 ; the invention, showing two resonance peaks; FIG. 5 illustrates a real embodiment of a system according to the invention, corresponding to the equivalent diagram of FIG. 3;
les figures 6A et 6B représentent deux concentrateurs à spires  FIGS. 6A and 6B show two concentrators with turns
superposées, pourvus d'un plot de compensation, dans deux états différents ; - la figure 7 représente une coupe transversale de la capacité d'ajustement de fréquence du concentrateur du système de la figure 5 ; superimposed, provided with a compensation pad, in two different states; FIG. 7 represents a cross-section of the frequency adjustment capacity of the concentrator of the system of FIG. 5;
la figure 8 représente une coupe transversale de la capacité d'ajustement réalisée à l'aide des deux concentrateurs de la figure 6. Description détaillée  FIG. 8 represents a cross-section of the adjustment capacity achieved using the two concentrators of FIG. 6. Detailed description
On se réfère à la figure 1. On a représenté dans cette figure le schéma électrique équivalent d'une carte à puce 1 connue à fonctionnement sans contact pourvue d'un concentrateur. La carte à puce 1. comporte un corps de carte 2 et un module électronique 3. Le corps de carte 2 comporte un système d'antennes, à savoir une antenne 4 au format ID1, équivalente à une capacité C en série avec une inductance Ll, et une antenne 5 ou concentrateur, équivalente à une inductance L2.  Referring to FIG. 1, there is shown the equivalent electrical diagram of a known smart card 1 with contactless operation provided with a concentrator. The smart card 1. comprises a card body 2 and an electronic module 3. The card body 2 comprises an antenna system, namely an antenna 4 in ID1 format, equivalent to a capacitor C in series with an inductor L1. , and an antenna 5 or concentrator, equivalent to an inductor L2.
Le module électronique 3 comporte une puce 6 présentant une résistance R et une capacité C, et aux bornes de la puce, l'antenne 7 du module, équivalente à une inductance L3,  The electronic module 3 comprises a chip 6 having a resistor R and a capacitance C, and at the terminals of the chip, the antenna 7 of the module, equivalent to an inductor L3,
Comme représenté en figure 2, le module 3 présente une fréquence de résonnance F , par exemple de 32 Mhz dans l'exemple représenté. As shown in FIG. 2, the module 3 has a resonance frequency F, for example 32 Mhz in the example shown.
Le système d'antennes du corps de carte équivaut à une antenne ID1 sous la forme d'une self Inductance Ll, connectée en série avec une antenne de concentrateur sous la forme d'une self inductance L2, et avec une capacité ajustable Cl. L'ajustement de capacité se fait notamment par une méthode connue d'enlèvement de matière, dite « trimming », qui permet d'ajuster précisément la capacité Cl et par conséquent la fréquence de résonnance F0p du système d'antennes 4,5. , sachant que oùThe antenna system of the card body is equivalent to an antenna ID1 in the form of an inductance inductance L1, connected in series with a concentrator antenna in the form of a inductance inductor L2, and with an adjustable capacitance C1. Capacity adjustment is done in particular by a known method of material removal, known as "trimming", which makes it possible to precisely adjust the capacitance C1 and consequently the resonance frequency F 0p of the antenna system 4,5. , knowing that or
Le système d'antennes 4,5 du corps de carte 2 présente une fréquence de résonnance, dite fréquence de résonance primaire, notée FoPf typiquement assez éloignée (par exemple de 14 Mhz) de la fréquence de résonance F0M du module, pour les raisons expliquées plus haut. The antenna system 4.5 of the card body 2 has a resonance frequency, called primary resonance frequency, noted Fo Pf typically quite remote (for example 14 Mhz) of the resonance frequency F 0M of the module, for the reasons explained above.
Comme expliqué plus haut, ce décalage entre la fréquence de résonnance de l'antenne du module et la fréquence de résonance du système d'antennes du corps de carte entraine des pertes d'énergie dans la transmission, et un mauvais couplage entre le système d'antennes du corps de carte, et l'antenne du module électronique.  As explained above, this difference between the resonance frequency of the antenna of the module and the resonant frequency of the antenna system of the card body causes energy losses in the transmission, and a poor coupling between the transmission system and the transmission system. antennas of the card body, and the antenna of the electronic module.
En figure 3, on a représenté uniquement le schéma équivalent du système d'antennes 4,5 du corps de carte, correspondant à l'invention. Il diffère du précédent dans la mesure où on a ajouté une capacité 8, de valeur C2, connectée en parallèle avec l'antenne 5 du concentrateur qui présente une impédance L2.  In FIG. 3, only the equivalent diagram of the antenna system 4.5 of the card body corresponding to the invention is shown. It differs from the previous one in that a capacity 8, of value C2, connected in parallel with the antenna 5 of the concentrator which has an impedance L2, has been added.
Comme on le voit sur la réponse en fréquence du système de la figure 3» représentée en figure 4, le système d'antennes 4,5 a maintenant deux pics de résonance, à savoir le pic correspondant à la fréquence de résonance primaire FOP précédente, et un second pic correspondant à une fréquence de résonance secondaire Foc, (36 Mhz dans l'exemple représenté) beaucoup plus proche de la fréquence de résonance FOM du module 3.  As can be seen in the frequency response of the system of FIG. 3 "represented in FIG. 4, the antenna system 4.5 now has two resonance peaks, namely the peak corresponding to the previous FOP primary resonance frequency, and a second peak corresponding to a secondary resonant frequency Foc (36 Mhz in the example shown) much closer to the resonance frequency FOM of the module 3.
Grâce à l'ajout de la capacité C2, La nouvelle fréquence de résonnance du concentrateur, notée Foc, est ramenée au voisinage de la fréquence de résonnance du module. Elle se situe maintenant au voisinage de 35 Mhz, l'écart avec la fréquence de résonnance du module n'étant maintenant plus que de 3 Mhz.  Thanks to the addition of the capacitor C2, the new resonant frequency of the concentrator, denoted Foc, is brought close to the resonance frequency of the module. It is now in the vicinity of 35 MHz, the difference with the resonance frequency of the module is now only 3 MHz.
La valeur C2 de la capacité résonante 8 est choisie de manière que le pic de résonance secondaire Foc soit proche de la fréquence de résonance du module 3. Le module électronique 3 et le corps de carte 2 résonnant maintenant à des fréquences proches, la performance de communication sans contact de la carte à puce avec un lecteur distant d'en trouve améliorée.  The value C2 of the resonant capacitance 8 is chosen so that the secondary resonance peak Foc is close to the resonance frequency of the module 3. The electronic module 3 and the card body 2 now resonating at close frequencies, the performance of contactless communication of the smart card with a remote reader finds improved.
On se réfère aux figures 5 à 8 pour expliquer les modes de réalisation de la capacité C2.  Referring to Figures 5 to 8, the embodiments of the C2 capability are explained.
Comme représenté en figures 5 et 7, cette capacité C2 ajoutée peut être réalisée par exemple par l'ajout de deux surfaces conductrices 10, 11 en regard l'une de l'autre des deux côtés du support 9 lorsqu'il s'agit d'un concentrateur simple face. Ces surfaces 10,11 sont alors connectées aux bornes du concentrateur 5, As shown in FIGS. 5 and 7, this added capacitor C2 can be made for example by adding two conductive surfaces 10, 11 opposite one another on both sides of the support 9 when it is a question of a concentrator single-sided These surfaces 10, 11 are then connected to the terminals of the concentrator 5,
Alternativement, comme représenté en figures 6 et 8, cette capacité C2 peut être réalisée par la superposition de pistes 12,13 du concentrateur 5 d'une face par rapport à l'autre, dans le cas d'un concentrateur double face. Dans ce cas, la capacité C2 formée par la superposition des pistes 12, 13 dépend de la surface de superposition. Afin de compenser les variations de la surface de superposition, dues par exemple aux tolérances des procédés de fabrication, on peut prévoir que dans une partie du concentrateur (par exemple la moitié gauche dans l'exemple représenté, à gauche de l'axe de symétrie M), les pistes 12,13 sont superposées, et dans la moitié droite du concentrateur 5, les pistes 12, 13 sont décalées en quinconce. De cette manière, si au cours du procédé de fabrication des antennes concentrateurs de plusieurs dispositifs successifs, les alignements des spires 12,13 de la partie gauche varient, les alignements de la partie droite varieront en sens contraire, de sorte que la capacité C2 sera sensiblement constante.  Alternatively, as shown in FIGS. 6 and 8, this capacitor C2 can be made by superimposing tracks 12, 13 of the concentrator 5 on one face with respect to the other, in the case of a double-sided concentrator. In this case, the capacitance C2 formed by the superposition of the tracks 12, 13 depends on the superposition surface. In order to compensate for the variations of the superposition surface, due for example to the tolerances of the manufacturing processes, it may be provided that in a part of the concentrator (for example the left half in the example shown, to the left of the axis of symmetry M), the tracks 12, 13 are superimposed, and in the right half of the concentrator 5, the tracks 12, 13 are offset in staggered rows. In this way, if during the manufacturing process of the concentrator antennas of several successive devices, the alignments of the turns 12, 13 of the left part vary, the alignments of the right part will vary in opposite directions, so that the capacitor C2 will be substantially constant.
En plus ou à la place de cette mesure, on peut prévoir un moyen de compensation de la variation de capacité C2, sous la forme d'un plot de compensation 17, dont la forme et la surface sont conçues de manière à ce qu'une dérive de la capacité résonnante C2 dans un sens due à un décalage de spires du concentrateur 5, soit compensée par une dérive de cette capacité de même amplitude dans l'autre sens.  In addition to or instead of this measurement, provision may be made for a means for compensating for the capacitance variation C2, in the form of a compensation pad 17, the shape and surface of which are designed in such a way that derives from the resonant capacitance C2 in one direction due to a shift of turns of the concentrator 5, or compensated by a drift of this capacitance of the same amplitude in the other direction.
Dans une autre variante de réalisation avantageuse, la capacité résonante 8 est configurée pour être ajustable vers une valeur cible, notamment par enlèvement de matière, ce qui permet encore d'optimiser davantage la valeur de la fréquence de résonance secondaire Foc,  In another advantageous variant embodiment, the resonant capacitance 8 is configured to be adjustable towards a target value, in particular by removal of material, which makes it possible to further optimize the value of the secondary resonance frequency Foc,
Il est à noter que le mode de réalisation avec concentrateur à simple face est plus facile à industrialiser mais avec de moins bonnes performances, et le mode de réalisation avec un concentrateur à double face est plus difficile à industrialiser car les pistes sont superposées, avec des tolérances de positionnement des spires qui peuvent générer des variations de capacité d'un produit à l'autre. Mais la mise en œuvre d'un plot de compensation, comme schématisé en figure 6, ou l'utilisation d'une capacité 8 ajustable, permet de maîtriser le décalage des pistes d'une face par rapport aux pistes de l'autre face. It should be noted that the embodiment with single-sided concentrator is easier to industrialize but with poorer performance, and the embodiment with a double-sided concentrator is more difficult to industrialize because the tracks are superimposed, with positioning tolerances of turns which can generate variations of capacity from one product to another. But the implementation of a compensation pad, as diagrammatically in FIG. 6, or the use of an adjustable capacity 8, makes it possible to control the offset of the tracks of one face with respect to the tracks of the other face.
La forme du plot de compensation est obtenue par simulation de décalages des deux ensembles de pistes l'un par rapport à l'autre dans toutes les directions dans le plan de la carte. Par itérations à partir des décalages les plus usuels (en fréquence d'apparition et en amplitude), on obtient une forme de plot de compensation qui minimise les variations de capacité totales, c'est à dire les variations dues à la fois au décalage des pistes et aux variations en sens contraire dues au plot de compensation.  The shape of the compensation pad is obtained by simulation of offsets of the two sets of tracks relative to each other in all directions in the plane of the card. By iterations from the most usual offsets (in frequency of occurrence and in amplitude), we obtain a form of compensation pad that minimizes the total capacitance variations, that is to say the variations due to both the offset of the tracks and variations in the opposite direction due to the compensation pad.
Avantages de l'invention Advantages of the invention
En définitive, l'invention permet d'atteindre les buts fixés. En outre, elle permet de réduire les délais nécessaires pour tester la faisabilité d'un système d'antennes ou pour industrialiser un système déjà testée.  Ultimately, the invention makes it possible to achieve the goals set. In addition, it reduces the time needed to test the feasibility of an antenna system or to industrialize a system already tested.
Les performances radiofréquence de l'ensemble constitué par le concentrateur du corps de carte et l'antenne du module électronique sont augmentées grâce au concentrateur résonnant.  The radiofrequency performance of the assembly consisting of the concentrator of the card body and the antenna of the electronic module are increased thanks to the resonant concentrator.
La solution proposée combine les avantages de la technologie de carte à puce dépourvue d'une connexion physique entre le module et l'antenne, avec la possibilité d'obtenir des performances radiofréquence optimales, se rapprochant de celles de la technologie filaire.  The proposed solution combines the advantages of smart card technology without a physical connection between the module and the antenna, with the possibility of obtaining optimal radio frequency performance, approaching those of wired technology.
En outre, le dispositif selon l'invention offre la possibilité de limiter les décalages de fréquence d'un composant à l'autre, qui sont généralement dus à la lamination des composants. Il en découle une industrialisation facilitée.  In addition, the device according to the invention offers the possibility of limiting the frequency shifts from one component to the other, which are generally due to the lamination of the components. The result is an easier industrialization.

Claims

REVENDICATIONS
1 - Dispositif à couplage inductif, notamment carte à puce à fonctionnement sans contact, comportant d'une part un module électronique à fonctionnement sans contact présentant une fréquence de résonnance du module (Fo), et: comportant d'autre part un support pourvu d'un système d'antennes (L1,L2) constitué par une antenne (Ll) au format ID1 et une antenne de concentrateur (L2), ce système d'antennes (Ll,L2) présentant une fréquence de résonnance primaire (FoP), caractérisé en qu'il comporte une capacité résonnante (C2) connectée en parallèle aux bornes de l'antenne concentrateur (L2), apte à créer une seconde fréquence de résonnance de l'antenne concentrateur (12), dite fréquence de résonnance secondaire (Foc), proche de la fréquence de résonnance (FOM) du module électronique 1 - Inductively coupled device, in particular a contactless smart card, comprising on the one hand a non-contact electronic module having a resonant frequency of the module (Fo), and on the other hand comprising a support provided with an antenna system (L1, L2) consisting of an antenna (L1) in ID1 format and a concentrator antenna (L2), this antenna system (L1, L2) having a primary resonant frequency (Fo P ) , characterized in that it comprises a resonant capacitance (C2) connected in parallel across the concentrator antenna (L2), able to create a second resonant frequency of the concentrator antenna (12), called secondary resonance frequency ( Foc), close to the resonance frequency (FOM) of the electronic module
2 - Dispositif selon la revendication 1, caractérisé en ce que ledit concentrateur est constitué de deux concentrateurs situés en regard l'un de l'autre, et en ce que ladite capacité résonante est formée par la capacité équivalente desdits deux concentrateurs, 2 - Device according to claim 1, characterized in that said concentrator consists of two concentrators located opposite one another, and in that said resonant capacitance is formed by the equivalent capacity of said two concentrators,
3 - Dispositif selon la revendication 2, caractérisé en ce que la capacité résonnante (C2) du concentrateur (L2) est réalisée par deux surfaces métalliques au moins partiellement en regard, connectées aux bornes du concentrateur (L2). 3 - Device according to claim 2, characterized in that the resonant capacitance (C2) of the concentrator (L2) is formed by two metal surfaces at least partially opposite, connected to the terminals of the concentrator (L2).
4 - Dispositif selon l'une quelconque des revendications 1 à 3r caractérisé en ce que l'antenne de concentrateur (L2) est réalisée sous forme de spires conductrices disposées sur deux faces du support et en ce que la capacité de résonnance (C2) du concentrateur est réalisée par la superposition de spires de l'antenne concentrateur (L2). 5 - Dispositif selon la revendication 4, caractérisé en ce qu'il comporte un moyen de compensation de capacité (16) apte à compenser des variations de la fréquence de résonnance secondaire (F0c) d'un dispositif à l'autre sous l'effet du procédé de fabrication, 4 - Device according to any one of claims 1 to 3 r characterized in that the concentrator antenna (L2) is formed as conductive turns disposed on two sides of the support and in that the resonance capacitance (C2) concentrator is achieved by the superposition of turns of the concentrator antenna (L2). 5 - Device according to claim 4, characterized in that it comprises a capacitance compensation means (16) adapted to compensate for variations of the secondary resonance frequency (F 0c ) from one device to another under the effect of the manufacturing process,
6 - Dispositif selon la revendication 5, caractérisé en ce que ledit moyen de compensation de capacité (16) consiste en une disposition en quinconce d'une partie de la surface des spires de l'antenne concentrateur (L2), et une disposition en vis à vis d'une autre partie de la surface des spires de l'antenne œncentrateur (L2). 6 - Device according to claim 5, characterized in that said capacity compensation means (16) consists of a staggered arrangement of a portion of the surface of the turns of the concentrator antenna (L2), and a provision screw with respect to another part of the surface of the turns of the antenna -concentrator (L2).
7 - Dispositif selon la revendication 5, caractérisé en ce que le moyen de compensation de capacité (16 ) est constitué par un plot de compensation (17) conçu de manière à ce qu'une dérive de la capacité résonante (C2) dans un sens due à un décalage de spires du concentrateur (L2), soit compensée par une dérive de cette capacité de même amplitude dans l'autre sens. 7 - Device according to claim 5, characterized in that the capacity compensation means (16) is constituted by a compensation pad (17) designed so that a drift of the resonant capacitor (C2) in one direction due to a shift of turns of the concentrator (L2), is compensated by a drift of this capacitance of the same amplitude in the other direction.
8 - Dispositif selon la revendication 5, caractérisé en ce que le moyen de compensation de capacité (16 ) est constitué par l'usage d'une capacité résonante (C2) ajustable connectée en parallèle aux bornes de l'antenne concentrateur. 8 - Device according to claim 5, characterized in that the capacity compensation means (16) is constituted by the use of an adjustable resonant capacitor (C2) connected in parallel across the concentrator antenna.
EP14825360.2A 2013-12-05 2014-12-03 Resonant concentrator for improving the coupling between a chip card body and its electronic module Withdrawn EP3078120A1 (en)

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FR1302841A FR3016491B1 (en) 2013-12-05 2013-12-05 RESONANT CONCENTRATOR FOR IMPROVING COUPLING BETWEEN A CHIP CARD BODY AND ITS ELECTRONIC MODULE
PCT/FR2014/000259 WO2015082781A1 (en) 2013-12-05 2014-12-03 Resonant concentrator for improving the coupling between a chip card body and its electronic module

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