EP2329917A1 - Electrically conductive grinder - Google Patents

Electrically conductive grinder Download PDF

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Publication number
EP2329917A1
EP2329917A1 EP10187723A EP10187723A EP2329917A1 EP 2329917 A1 EP2329917 A1 EP 2329917A1 EP 10187723 A EP10187723 A EP 10187723A EP 10187723 A EP10187723 A EP 10187723A EP 2329917 A1 EP2329917 A1 EP 2329917A1
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EP
European Patent Office
Prior art keywords
grinding tool
abrasive particles
electrically conductive
rubber
base body
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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EP10187723A
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German (de)
French (fr)
Inventor
Marcus Hlavac
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Robert Bosch GmbH
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Robert Bosch GmbH
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Publication of EP2329917A1 publication Critical patent/EP2329917A1/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties
    • B24D3/342—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties incorporated in the bonding agent

Definitions

  • the present invention relates to an electrically conductive abrasive tool and a material removal method for machining and electrochemically abrading material with such a grinding tool.
  • Abrasive tools for machining components made of metal, ceramic or other materials usually have abrasive particles (abrasive grains) embedded in a binding matrix. The distribution of the abrasive particles within the binding matrix is almost homogeneous.
  • the abrasive matrix incorporating bonding matrix can be formed to Schleiftechnikmaschinegeometrie. Metals, ceramic sintered materials or polymers, in particular based on phenolic resin, can be used as the material for the bonding matrix.
  • Conventional abrasive tools with a polymeric binding matrix are not electrically conductive.
  • abrasive tools with a metallic bonding matrix are electrically conductive, with the conductivity usually being restricted to the bonding matrix and the abrasive particles being non-conductive.
  • Electrically conductive abrasive tools with a metallic bond matrix can be used for so-called hybrid machining processes.
  • these hybrid processing processes the removal of material takes place on a likewise electrically conductive workpiece by means of a simultaneously taking place cutting and electrically removing mechanism of action.
  • the grinding tool is connected as the cathode and the workpiece as the anode, so that material can be removed from the workpiece by the principle of anodic dissolution.
  • electrically conductive Abrasive tools with a metal binding matrix are conditioned by electrically abrading techniques such as electrochemical sharpening, such as ELID, spark erosive dressing, or contactless dressing. That is, by an electrically working material removal, the metallic binding matrix material can be removed.
  • the abrasive particle supernatant can be selectively increased, worn abrasive particles removed from the bond matrix, new abrasive particles lifted from the grinding wheel and the geometry of the grinding tool or the grinding wheel profile reworked.
  • Electrically conductive abrasive tools with a metallic bond matrix are characterized by a high hardness, but are difficult to dress and for the high-precision, ultra-fine, finish and / or polishing grinding of hard, especially metallic or ceramic components, such as high-strength steels, only can be used to a limited extent.
  • the present invention is an electrically conductive grinding tool, in particular a grinding wheel, for example, for a cutting and electrochemical material removal process, which abrasive particles (abrasive grains) and an electrically conductive bonding matrix, wherein the abrasive particles are incorporated into the bonding matrix.
  • abrasive particles abrasive grains
  • an electrically conductive bonding matrix wherein the abrasive particles are incorporated into the bonding matrix.
  • the bonding matrix is electrically conductive, wherein the abrasive particles may be electrically conductive or non-electrically conductive, in particular not electrically conductive.
  • the binding matrix comprises at least one electrically self-conducting polymer and / or at least one polymer which has at least one electrically conductive additive.
  • the binding matrix can be formed from at least one electrically self-conducting polymer and / or at least one polymer which has at least one electrically conductive additive.
  • at least some of the abrasive particles project partially out of the binding matrix.
  • the grinding tool according to the invention has the advantage that it can be used on the one hand for a cutting and electrochemical material removal process (hybrid processing process) and on the other hand may be softer and better damping properties may have as electrically conductive grinding tools with a metallic bonding matrix, whereby a higher surface quality of the machined workpiece achieved can be.
  • the grinding tool according to the invention can be used for high-precision, ultra-fine, finish or polishing grinding.
  • a grinding tool according to the invention is good to dress and has a self-sharpening effect in the grinding process, so that it must be less or not dressed in contrast to grinding tools with other binding materials after the beginning of use.
  • the grinding tool according to the invention can be designed in particular for a hybrid material removal method for machining and electrochemical removal of material, in particular for high-precision, ultra-fine, finish and / or polishing grinding of hard, in particular metallic or ceramic, components, for example of high-strength steels ,
  • the abrasive particles are homogeneously distributed in the binding matrix are involved.
  • the binding matrix is elastic.
  • the abrasive particles are selected from the group consisting of aluminum oxide particles (corundum), silicon carbide particles, boron nitride particles, in particular cubic boron nitride particles (CBN), boron carbide particles, diamond particles and mixtures thereof.
  • the electrically self-conducting polymer is selected from the group consisting of polyacetylene, in particular cis-polyacetylene and trans-polyacetylene, polypyrrole, polythiophene, polyaniline, poly (para-phenylene), poly (para-phenylene-vinylene) and mixtures thereof.
  • the additive comprising polymer is selected from the group consisting of synthetic resins, in particular phenolic resins, Imide resins, epoxy resins, polyester resins, polyurethane resins, polyolefins, elastomeric silicones, natural rubber (NR), styrene-butadiene rubber (SBR), butyl rubber (IIR), ethylene-propylene rubber (EPDM), nitrile rubber (NBR), hydrogenated nitrile rubber (HNBR ), Chloroprene rubber (CR), chlorosulfonated polyethylene (CSM), acrylate rubber (ACM), polyurethane rubber (PU), silicone rubber (MVQ), fluorosilicone rubber (MFQ), fluororubber (FPM), and mixtures thereof.
  • the polymer comprising the additive may also be an electrically self-conducting polymer.
  • the electrically conductive additive is preferably likewise distributed homogeneously in the polymer or the binding matrix.
  • the electrically conductive additive is selected from the group consisting of carbon black, metal powders and mixtures thereof.
  • the grinding tool is in the form of a rotationally symmetrical body, for example a cylinder, in particular a disk.
  • the grinding tool further comprises a base body, on which the abrasive particles binding binding matrix is applied.
  • the binding matrix incorporating the abrasive particles can have a layer thickness (d) of ⁇ 1 mm to ⁇ 50 mm, in particular front 5 mm to ⁇ 10 mm.
  • the main body can be formed from a metal.
  • the base body may be in the form of a rotationally symmetrical body, for example a cylinder, in particular a disk.
  • the base body is designed in the form of a rotationally symmetrical body, wherein the abrasive particles incorporating binding matrix is applied to the lateral surface of the base body and / or on one or both top surfaces of the base body.
  • the main body is designed in the form of a disk, wherein the abrasive particles have binding bonding matrix the lateral surface of the disc is applied.
  • the abrasive matrix incorporating bonding matrix can in particular have a layer thickness (d) of ⁇ 5 mm to ⁇ 10 mm.
  • Another object of the invention relates to a Materialabtragungs compiler for machining and electrochemical removal of material, which comprises at least one process step: a) Zerspanendes and electrochemical removal of material from a, in particular electrically conductive, workpiece with a grinding tool according to the invention.
  • the grinding tool according to the invention advantageously a higher component precision and an improved component quality can be achieved than with a grinding tool with a metallic bonding matrix.
  • the grinding tool according to the invention advantageously manufacturing times and costs can be reduced.
  • the method according to the invention can be a hybrid material removal method for machining and electrochemical removal of material, in particular for the high-precision, ultra-fine, finish and / or polishing grinding of hard, in particular metallic or ceramic, components, for example of high-strength steels.
  • the grinding tool can be rotated against the workpiece, wherein an electrolytic liquid is introduced between the grinding tool and the workpiece, wherein the workpiece is connected as an anode and the grinding tool as a cathode.
  • the workpiece can also be rotated.
  • the abrasive particles can wear out.
  • the grinding tool can be reconditioned, in particular by grinding and / or grinding with a conditioning tool. That is, by a separating process, the polymeric binding material can be removed. This can be targeted the abrasive particle supernatant increases, worn abrasive particles are removed from the bond matrix, new abrasive particles are lifted from the grinding tool and / or the geometry of the grinding tool or the grinding wheel profile is revised.
  • the method therefore further comprises at least one process step: b) conditioning, in particular grinding and / or grinding of the grinding tool, for example with a sharpening stone, for example of a porous ceramic or a soft steel, or with a grinding tool with ceramic Abrasive particles, in particular aluminum oxide particles (corundum) or silicon carbide particles, or with a, for example standing or rotating, diamond tool.
  • a sharpening stone for example of a porous ceramic or a soft steel
  • Abrasive particles in particular aluminum oxide particles (corundum) or silicon carbide particles, or with a, for example standing or rotating, diamond tool.
  • worn abrasive particles can be removed.
  • the polymer is partially removed by the particles formed during conditioning and / or by the abrasive particles used and / or by the conditioning tool used, so that underlying, unspiked abrasive particles are exposed.
  • the method steps a) and b) are preferably carried out alternately, in particular until the consumption of the grinding tool.
  • valve needles, bolts and nozzle body for injection systems, hydraulic components or wind power components can be produced.
  • the workpieces may be formed of hardened steels or hard metallic materials.
  • FIG. 1 shows that the grinding tool comprises abrasive particles 1 and an electrically conductive bonding matrix 2, wherein the abrasive particles 1 are incorporated into the bonding matrix 2.
  • the bonding matrix 2 comprises at least one electrically self-conducting polymer and / or at least one polymer which has at least one electrically conductive additive 3.
  • FIG. 1 illustrates that the abrasive particles 1 and the electrically conductive additive 3 are integrated homogeneously distributed in the binding matrix 2.
  • FIG. 1 further illustrates that the grinding tool in the context of in FIG. 1 shown, first embodiment in the form of a rotationally symmetrical body, in particular a disc is formed.
  • the grinding tool further comprises a base body 4, on which the abrasive particles 1 einbindende binding matrix 2 is applied.
  • the base body 4 is designed in particular in the form of a disk, wherein the abrasive particle 1 incorporating bonding matrix 2 is applied to the jacket surface M of the disk-shaped base body 4 and has a layer thickness d.
  • the two top surfaces D of the disc-shaped main body 4 have no binding matrix 2 applied thereto which includes abrasive particles 1.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)

Abstract

The electrically conductive grinding tool comprises abrasive particles (1), an electrically conductive bonding matrix (2), where the abrasive particles are integrated into the bonding matrix, which comprises an electrically conductive polymer and/or a polymer, and a base body on which the abrasive particles are applied to integrated bonding matrix. The polymer has an electrically conductive additive (3). The abrasive particles are integrated in homogeneous distributed into the bonding matrix, which is elastic. The grinding tool is formed in the form of a rotational symmetric body. The electrically conductive grinding tool comprises abrasive particles (1), an electrically conductive bonding matrix (2), where the abrasive particles are integrated into the bonding matrix, which comprises an electrically conductive polymer and/or a polymer, and a base body on which the abrasive particles are applied to integrated bonding matrix. The polymer has an electrically conductive additive (3). The abrasive particles are integrated in homogeneous distributed into the bonding matrix, which is elastic. The grinding tool is formed in the form of a rotational symmetric body. The base body is formed in the form of a rotational symmetric body, where the abrasive particles are applied to integrated bonding matrix on the lateral surface the base body and/or one or two top surfaces of the base body. The base body is formed in the form of a disk, where the abrasive particles are applied to integrated bonding matrix on the lateral surface of the disk. An independent claim is included for a material removal process for machining and electrochemical removal of material.

Description

Die vorliegende Erfindung betrifft ein elektrisch leitfähiges Schleifwerkzeug und ein Materialabtragungsverfahren zum zerspanenden und elektrochemischen Abtragen von Material mit einem derartigen Schleifwerkzeug.The present invention relates to an electrically conductive abrasive tool and a material removal method for machining and electrochemically abrading material with such a grinding tool.

Stand der TechnikState of the art

Schleifwerkzeuge für die spanende Bearbeitung von Bauteilen aus Metall, Keramik oder anderen Materialien weisen meist in eine Bindungsmatrix eingebundene Abrasivpartikel (Schleifkörner) auf. Die Verteilung der Abrasivpartikel innerhalb der Bindungsmatrix ist dabei nahezu homogen. Die Abrasivpartikel einbindende Bindungsmatrix kann dabei zur Schleifwerkzeuggeometrie ausgeformt sein. Als Material für die Bindungsmatrix können Metalle, keramische Sinterwerkstoffe oder Polymere, insbesondere auf Phenolharzbasis, eingesetzt werden. Herkömmliche Schleifwerkzeuge mit einer polymeren Bindungsmatrix sind nicht elektrisch leitfähig. Schleifwerkzeuge mit einer metallischen Bindungsmatrix sind hingegen elektrisch leitfähig, wobei die Leitfähigkeit meist auf die Bindungsmatrix beschränkt ist und die Abrasivpartikel nicht leitfähig sind.Abrasive tools for machining components made of metal, ceramic or other materials usually have abrasive particles (abrasive grains) embedded in a binding matrix. The distribution of the abrasive particles within the binding matrix is almost homogeneous. The abrasive matrix incorporating bonding matrix can be formed to Schleifwerkzeuggeometrie. Metals, ceramic sintered materials or polymers, in particular based on phenolic resin, can be used as the material for the bonding matrix. Conventional abrasive tools with a polymeric binding matrix are not electrically conductive. On the other hand, abrasive tools with a metallic bonding matrix are electrically conductive, with the conductivity usually being restricted to the bonding matrix and the abrasive particles being non-conductive.

Elektrisch leitfähige Schleifwerkzeuge mit einer metallischen Bindungsmatrix können für so genannte Hybridbearbeitungsprozesse eingesetzt werden. Bei diesen Hybridbearbeitungsprozessen erfolgt der Materialabtrag an einem ebenfalls elektrisch leitfähigen Werkstück durch einen zeitgleich stattfindenden spanenden und elektrisch abtragenden Wirkmechanismus. Bei einem elektrochemischen Abtragen ist dabei das Schleifwerkzeug als Kathode und das Werkstück als Anode geschaltet, so dass durch das Prinzip der anodischen Auflösung Material am Werkstück entfernt werden kann. Darüber hinaus können elektrisch leitfähige Schleifwerkzeuge mit einer metallischen Bindungsmatrix durch elektrisch abtragende Verfahren, wie elektrochemisches Schärfen, beispielsweise ELID, funkenerosives Abrichten oder kontakterosives Abrichten, konditioniert werden. Das heißt, durch einen elektrisch arbeitenden Materialabtrag kann das metallische Bindungsmatrixmaterial entfernt werden. Dadurch kann gezielt der Abrasivpartikelüberstand erhöht, verschlissene Abrasivpartikel aus der Bindungsmatrix entfernt, neue Abrasivpartikel aus der Schleifscheibe vorgehoben und die Geometrie des Schleifwerkzeuges beziehungsweise das Schleifscheibenprofil überarbeitet werden. Elektrisch leitfähige Schleifwerkzeuge mit einer metallischen Bindungsmatrix zeichnen sich durch eine hohe Härte aus, sind jedoch schwierig abzurichten und für die Hochpräzisions-, Feinst-, Finish- und/oder Polierschleifbearbeitung von harten, insbesondere metallischen oder keramischen, Komponenten, beispielsweise aus hochfesten Stählen, nur im beschränkten Maße einsetzbar.Electrically conductive abrasive tools with a metallic bond matrix can be used for so-called hybrid machining processes. In these hybrid processing processes, the removal of material takes place on a likewise electrically conductive workpiece by means of a simultaneously taking place cutting and electrically removing mechanism of action. In the case of electrochemical ablation, the grinding tool is connected as the cathode and the workpiece as the anode, so that material can be removed from the workpiece by the principle of anodic dissolution. In addition, electrically conductive Abrasive tools with a metal binding matrix are conditioned by electrically abrading techniques such as electrochemical sharpening, such as ELID, spark erosive dressing, or contactless dressing. That is, by an electrically working material removal, the metallic binding matrix material can be removed. As a result, the abrasive particle supernatant can be selectively increased, worn abrasive particles removed from the bond matrix, new abrasive particles lifted from the grinding wheel and the geometry of the grinding tool or the grinding wheel profile reworked. Electrically conductive abrasive tools with a metallic bond matrix are characterized by a high hardness, but are difficult to dress and for the high-precision, ultra-fine, finish and / or polishing grinding of hard, especially metallic or ceramic components, such as high-strength steels, only can be used to a limited extent.

Offenbarung der ErfindungDisclosure of the invention

Gegenstand der vorliegenden Erfindung ist ein elektrisch leitfähiges Schleifwerkzeug, insbesondere eine Schleifscheibe, beispielsweise für ein spanendes und elektrochemisches Materialabtragungsverfahren, welches Abrasivpartikel (Schleifkörner) und eine elektrisch leitfähige Bindungsmatrix umfasst, wobei die Abrasivpartikel in die Bindungsmatrix eingebunden sind.The present invention is an electrically conductive grinding tool, in particular a grinding wheel, for example, for a cutting and electrochemical material removal process, which abrasive particles (abrasive grains) and an electrically conductive bonding matrix, wherein the abrasive particles are incorporated into the bonding matrix.

Da wird unter einem "elektrisch leitfähigen Schleifwerkzeug" insbesondere verstanden, dass die Bindungsmatrix elektrisch leitfähig ist, wobei die Abrasivpartikel elektrisch leitfähig oder nicht elektrisch leitfähig, insbesondere nicht elektrisch leitfähig, sein können.As an "electrically conductive grinding tool" is understood in particular that the bonding matrix is electrically conductive, wherein the abrasive particles may be electrically conductive or non-electrically conductive, in particular not electrically conductive.

Erfindungsgemäß umfasst die Bindungsmatrix dabei mindestens ein elektrisch selbstleitendes Polymer und/oder mindestens ein Polymer, welches mindestens ein elektrisch leitendes Additiv aufweist. Insbesondere kann die Bindungsmatrix aus mindestens einem elektrisch selbstleitenden Polymer und/oder mindestens einem Polymer, welches mindestens ein elektrisch leitendes Additiv aufweist, ausgebildet sein. Vorzugsweise ragt dabei zumindest ein Teil der Abrasivpartikel aus der Bindungsmatrix teilweise heraus.According to the invention, the binding matrix comprises at least one electrically self-conducting polymer and / or at least one polymer which has at least one electrically conductive additive. In particular, the binding matrix can be formed from at least one electrically self-conducting polymer and / or at least one polymer which has at least one electrically conductive additive. Preferably, at least some of the abrasive particles project partially out of the binding matrix.

Das erfindungsgemäße Schleifwerkzeug hat den Vorteil, dass es einerseits für ein spanendes und elektrochemisches Materialabtragungsverfahren (Hybridbearbeitungsprozess) eingesetzt werden kann und andererseits weicher sein kann und bessere Dämpfungseigenschaften aufweisen kann als elektrisch leitfähige Schleifwerkzeuge mit einer metallischen Bindungsmatrix, wodurch eine höhere Oberflächengüte des damit bearbeiteten Werkstücks erzielt werden kann. Insbesondere kann das erfindungsgemäße Schleifwerkzeug zur Hochpräzisions-, Feinst-, Finish- beziehungsweise Polierschleifbearbeitung eingesetzt werden. Darüber hinaus ist ein erfindungsgemäße Schleifwerkzeug gut abzurichten und verfügt über einen selbstschärfenden Effekt im Schleifprozess, so dass es im Gegensatz zu Schleifwerkzeugen mit anderen Bindungsmaterialien nach Einsatzbeginn seltener oder sogar nicht abgerichtet werden muss.The grinding tool according to the invention has the advantage that it can be used on the one hand for a cutting and electrochemical material removal process (hybrid processing process) and on the other hand may be softer and better damping properties may have as electrically conductive grinding tools with a metallic bonding matrix, whereby a higher surface quality of the machined workpiece achieved can be. In particular, the grinding tool according to the invention can be used for high-precision, ultra-fine, finish or polishing grinding. In addition, a grinding tool according to the invention is good to dress and has a self-sharpening effect in the grinding process, so that it must be less or not dressed in contrast to grinding tools with other binding materials after the beginning of use.

Das erfindungsgemäße Schleifwerkzeug kann insbesondere für ein Hybrid-Materialabtragungsverfahren zum zerspanenden und elektrochemischen Abtragen von Material, insbesondere für die Hochpräzisions-, Feinst-, Finish- und/oder Polierschleifbearbeitung von harten, insbesondere metallischen oder keramischen, Komponenten, beispielsweise aus hochfesten Stählen, ausgebildet sein.The grinding tool according to the invention can be designed in particular for a hybrid material removal method for machining and electrochemical removal of material, in particular for high-precision, ultra-fine, finish and / or polishing grinding of hard, in particular metallic or ceramic, components, for example of high-strength steels ,

Im Rahmen einer Ausführungsform sind die Abrasivpartikel homogen verteilt in die Bindungsmatrix eingebunden sind.In one embodiment, the abrasive particles are homogeneously distributed in the binding matrix are involved.

Im Rahmen einer weiteren Ausführungsform ist die Bindungsmatrix elastisch.In another embodiment, the binding matrix is elastic.

Im Rahmen einer weiteren Ausführungsform sind die Abrasivpartikel ausgewählt, aus der Gruppe bestehend aus Aluminiumoxidpartikeln (Korund), Siliciumcarbidpartikeln, Bornitridpartikeln, insbesondere kubischen Bornitridpartikeln (CBN), Borcarbidpartikeln, Diamantpartikeln und Mischungen davon.Within the scope of a further embodiment, the abrasive particles are selected from the group consisting of aluminum oxide particles (corundum), silicon carbide particles, boron nitride particles, in particular cubic boron nitride particles (CBN), boron carbide particles, diamond particles and mixtures thereof.

Im Rahmen einer weiteren Ausführungsform ist das elektrisch selbstleitenden Polymer ausgewählt, aus der Gruppe, bestehend aus Polyacetylen, insbesondere cis-Polyacetylen und trans-Polyacetylen, Polypyrrol, Polythiophen, Polyanilin, Poly(para-phenylen), Poly(para-phenylen-vinylen) und Mischungen davon.In a further embodiment, the electrically self-conducting polymer is selected from the group consisting of polyacetylene, in particular cis-polyacetylene and trans-polyacetylene, polypyrrole, polythiophene, polyaniline, poly (para-phenylene), poly (para-phenylene-vinylene) and mixtures thereof.

Im Rahmen einer weiteren Ausführungsform ist das Additiv umfassende Polymer ausgewählt, aus der Gruppe bestehend aus Kunstharzen, insbesondere Phenolharzen, Imidharzen, Epoxidharzen, Polyesterharzen, Polyurethanharzen, Polyolefinen, elastomeren Silikonen, Naturkautschuk (NR), Styrol-Butadien-Kautschuk (SBR), Butylkautschuk (IIR), Ethylen-Propylen-Kautschuk (EPDM), Nitrilkautschuk (NBR), hydrierter Nitrilkautschuk (HNBR), Chloroprenekautschuk (CR), chlorsulfoniertes Polyethylen (CSM), Acrylatkautschuk (ACM), Polyurethankautschuk (PU), Silikonkautschuk (MVQ), Fluorsilikonkautschuk (MFQ), Fluorkautschuk (FPM) und Mischungen davon. Gegebenenfalls kann das Additiv umfassende Polymer auch ein elektrisch selbstleitendes Polymer sein.In a further embodiment, the additive comprising polymer is selected from the group consisting of synthetic resins, in particular phenolic resins, Imide resins, epoxy resins, polyester resins, polyurethane resins, polyolefins, elastomeric silicones, natural rubber (NR), styrene-butadiene rubber (SBR), butyl rubber (IIR), ethylene-propylene rubber (EPDM), nitrile rubber (NBR), hydrogenated nitrile rubber (HNBR ), Chloroprene rubber (CR), chlorosulfonated polyethylene (CSM), acrylate rubber (ACM), polyurethane rubber (PU), silicone rubber (MVQ), fluorosilicone rubber (MFQ), fluororubber (FPM), and mixtures thereof. Optionally, the polymer comprising the additive may also be an electrically self-conducting polymer.

Das elektrisch leitende Additiv ist vorzugsweise ebenfalls homogen verteilt in dem Polymer beziehungsweise der Bindungsmatrix eingebunden.The electrically conductive additive is preferably likewise distributed homogeneously in the polymer or the binding matrix.

Im Rahmen einer weiteren Ausführungsform ist das elektrisch leitende Additiv ausgewählt, aus der Gruppe, bestehend aus Leitruß, Metallpulvern und Mischungen davon.In another embodiment, the electrically conductive additive is selected from the group consisting of carbon black, metal powders and mixtures thereof.

Im Rahmen einer weiteren Ausführungsform ist das Schleifwerkzeug in Form eines rotationssymmetrischen Körpers, beispielsweise eines Zylinders, insbesondere einer Scheibe, ausgebildet.In the context of another embodiment, the grinding tool is in the form of a rotationally symmetrical body, for example a cylinder, in particular a disk.

Im Rahmen einer weiteren Ausführungsform umfasst das Schleifwerkzeug weiterhin einen Grundkörper, auf den die Abrasivpartikel einbindende Bindungsmatrix aufgebracht ist. Die Abrasivpartikel einbindende Bindungsmatrix kann dabei eine Schichtdicke (d) von ≥ 1 mm bis ≤ 50 mm, insbesondere vorn ≥ 5 mm bis ≤ 10 mm, aufweisen. Der Grundkörper kann dabei aus einem Metall ausgebildet sein. Insbesondere kann der Grundkörper in Form eines rotationssymmetrischen Körpers, beispielsweise eines Zylinders, insbesondere einer Scheibe, ausgebildet sein.In a further embodiment, the grinding tool further comprises a base body, on which the abrasive particles binding binding matrix is applied. In this case, the binding matrix incorporating the abrasive particles can have a layer thickness (d) of ≥ 1 mm to ≦ 50 mm, in particular front 5 mm to ≦ 10 mm. The main body can be formed from a metal. In particular, the base body may be in the form of a rotationally symmetrical body, for example a cylinder, in particular a disk.

Im Rahmen einer weiteren Ausführungsform ist der Grundkörper in Form eines rotationssymmetrischen Körpers ausgebildet, wobei die Abrasivpartikel einbindende Bindungsmatrix auf der Mantelfläche des Grundkörpers und/oder auf einer oder beiden Deckflächen des Grundkörpers aufgebracht ist.Within the scope of a further embodiment, the base body is designed in the form of a rotationally symmetrical body, wherein the abrasive particles incorporating binding matrix is applied to the lateral surface of the base body and / or on one or both top surfaces of the base body.

Im Rahmen einer weiteren Ausführungsform ist der Grundkörper in Form einer Scheibe ausgebildet, wobei die Abrasivpartikel einbindende Bindungsmatrix auf der Mantelfläche der Scheibe aufgebracht ist. Die Abrasivpartikel einbindende Bindungsmatrix kann dabei insbesondere eine Schichtdicke (d) von ≥ 5 mm bis ≤ 10 mm aufweisen.In the context of a further embodiment, the main body is designed in the form of a disk, wherein the abrasive particles have binding bonding matrix the lateral surface of the disc is applied. The abrasive matrix incorporating bonding matrix can in particular have a layer thickness (d) of ≥ 5 mm to ≤ 10 mm.

Ein weiterer Gegenstand der Erfindung betrifft ein Materialabtragungsverfahren zum zerspanenden und elektrochemischen Abtragen von Material, welches mindestens einen Verfahrensschritt: a) Zerspanendes und elektrochemisches Abtragen von Material von einem, insbesondere elektrisch leitfähigen, Werkstück mit einem erfindungsgemäßen Schleifwerkzeug, umfasst.Another object of the invention relates to a Materialabtragungsverfahren for machining and electrochemical removal of material, which comprises at least one process step: a) Zerspanendes and electrochemical removal of material from a, in particular electrically conductive, workpiece with a grinding tool according to the invention.

Durch das erfindungsgemäße Schleifwerkzeug kann vorteilhafterweise eine höhere Bauteilpräzision und eine verbesserte Bauteilqualität als mit einem Schleifwerkzeug mit einer metallischen Bindungsmatrix erzielt werden. Darüber hinaus können durch das erfindungsgemäße Schleifwerkzeug vorteilhafterweise Fertigungszeiten und -kosten reduziert werden. Hinsichtlich weiterer Vorteile wird auf die Erläuterungen im Zusammenhang mit dem erfindungsgemäßen Schleifwerkzeug verwiesen.By means of the grinding tool according to the invention, advantageously a higher component precision and an improved component quality can be achieved than with a grinding tool with a metallic bonding matrix. In addition, by the grinding tool according to the invention advantageously manufacturing times and costs can be reduced. With regard to further advantages, reference is made to the explanations in connection with the grinding tool according to the invention.

Das erfindungsgemäße Verfahren kann insbesondere ein Hybrid-Materialabtragungsverfahren zum zerspanenden und elektrochemischen Abtragen von Material, insbesondere für die Hochpräzisions-, Feinst-, Finish- und/oder Polierschleifbearbeitung von harten, insbesondere metallischen oder keramischen, Komponenten, beispielsweise aus hochfesten Stählen, ausgebildet sein.In particular, the method according to the invention can be a hybrid material removal method for machining and electrochemical removal of material, in particular for the high-precision, ultra-fine, finish and / or polishing grinding of hard, in particular metallic or ceramic, components, for example of high-strength steels.

Insbesondere kann zum zerspanenden und elektrochemischen Abtragen von Material, das Schleifwerkzeug an dem Werkstück anliegend gedreht werden, wobei zwischen dem Schleifwerkzeug und dem Werkstück eine Elektrolytflüssigkeit eingebracht wird, wobei das Werkstück als Anode und das Schleifwerkzeug als Kathode geschaltet wird. Das Werkstück kann dabei ebenfalls gedreht werden.In particular, for machining and electrochemical removal of material, the grinding tool can be rotated against the workpiece, wherein an electrolytic liquid is introduced between the grinding tool and the workpiece, wherein the workpiece is connected as an anode and the grinding tool as a cathode. The workpiece can also be rotated.

Mit der Zeit können die Abrasivpartikel verschleißen. In diesem Fall kann das Schleifwerkzeug neu konditioniert, insbesondere durch Ein- und/oder Abschleifen mit einem Konditionierwerkzeug, werden. Das heißt, durch ein trennendes Verfahren kann das polymere Bindungsmaterial entfernt werden. Dadurch kann gezielt der Abrasivpartikelüberstand erhöht, verschlissene Abrasivpartikel aus der Bindungsmatrix entfernt, neue Abrasivpartikel aus dem Schleifwerkzeug vorgehoben und/oder die Geometrie des Schleifwerkzeuges beziehungsweise das Schleifscheibenprofil überarbeitet werden.Over time, the abrasive particles can wear out. In this case, the grinding tool can be reconditioned, in particular by grinding and / or grinding with a conditioning tool. That is, by a separating process, the polymeric binding material can be removed. This can be targeted the abrasive particle supernatant increases, worn abrasive particles are removed from the bond matrix, new abrasive particles are lifted from the grinding tool and / or the geometry of the grinding tool or the grinding wheel profile is revised.

Im Rahmen einer weiteren Ausführungsform umfasst das Verfahren daher weiterhin mindestens einen Verfahrensschritt: b) Konditionieren, insbesondere Ein- und/oder Abschleifen des Schleifwerkzeugs, zum Beispiel mit einem Schärfstein, beispielsweise aus einer poröser Keramik oder einem weichen Stahl, oder mit einem Schleifwerkzeug mit keramischen Abrasivpartikeln, insbesondere Aluminiumoxidpartikeln (Korund) oder Siliciumcarbidpartikeln, oder mit einem, beispielsweise stehenden oder rotierenden, Diamantwerkzeug. Auf diese Weise können verschlissene Abrasivpartikel entfernt werden. Beim Entfernen der verschlissenen Abrasivpartikel wird zudem das Polymer durch die beim Konditionieren entstehenden Partikel und/oder durch die eingesetzten Abrasivpartikel und/oder durch das eingesetzte Konditionierwerkzeug teilweise entfernt, sodass darunter liegende, unverschlissene Abrasivpartikel freigelegt werden.In a further embodiment, the method therefore further comprises at least one process step: b) conditioning, in particular grinding and / or grinding of the grinding tool, for example with a sharpening stone, for example of a porous ceramic or a soft steel, or with a grinding tool with ceramic Abrasive particles, in particular aluminum oxide particles (corundum) or silicon carbide particles, or with a, for example standing or rotating, diamond tool. In this way, worn abrasive particles can be removed. When the worn abrasive particles are removed, moreover, the polymer is partially removed by the particles formed during conditioning and / or by the abrasive particles used and / or by the conditioning tool used, so that underlying, unspiked abrasive particles are exposed.

Vorzugsweise werden die Verfahrensschritte a) und b), insbesondere bis zum Verbrauch des Schleifwerkzeugs, alternierend durchgeführt.The method steps a) and b) are preferably carried out alternately, in particular until the consumption of the grinding tool.

Durch das erfindungsgemäße Verfahren können beispielsweise Ventilnadeln, Bolzen und Düsenkörper für Einspritzsysteme, Hydraulikkomponenten oder Windkraftkomponenten hergestellt werden. Dabei können die Werkstücke aus gehärteten Stählen oder harten metallischen Materialien ausgebildet sein.By the method according to the invention, for example, valve needles, bolts and nozzle body for injection systems, hydraulic components or wind power components can be produced. The workpieces may be formed of hardened steels or hard metallic materials.

Zeichnungendrawings

Weitere Vorteile und vorteilhafte Ausgestaltungen der erfindungsgemäßen Gegenstände werden durch die Zeichnungen veranschaulicht und in der nachfolgenden Beschreibung erläutert. Dabei ist zu beachten, dass die Zeichnungen nur beschreibenden Charakter haben und nicht dazu gedacht sind, die Erfindung in irgendeiner Form einzuschränken. Es zeigen

Fig. 1
eine Draufsicht auf eine erste Ausführungsform eines erfindungsgemäßen Schleifwerkzeugs; und
Fig. 2
eine Draufsicht auf eine zweite Ausführungsform eines erfindungsgemäßen Schleifwerkzeugs.
Further advantages and advantageous embodiments of the subject invention are illustrated by the drawings and explained in the following description. It should be noted that the drawings have only descriptive character and are not intended to limit the invention in any way. Show it
Fig. 1
a plan view of a first embodiment of a grinding tool according to the invention; and
Fig. 2
a plan view of a second embodiment of a grinding tool according to the invention.

Figur 1 zeigt, dass das Schleifwerkzeug Abrasivpartikel 1 und eine elektrisch leitfähige Bindungsmatrix 2 umfasst, wobei die Abrasivpartikel 1 in die Bindungsmatrix 2 eingebunden sind. Dabei umfasst die Bindungsmatrix 2 erfindungsgemäß mindestens ein elektrisch selbstleitendes Polymer und/oder mindestens ein Polymer, welches mindestens ein elektrisch leitendes Additiv 3 aufweist. Figur 1 illustriert, dass die Abrasivpartikel 1 und das elektrisch leitende Additiv 3 homogen verteilt in die Bindungsmatrix 2 eingebunden sind. Figur 1 illustriert ferner, dass das Schleifwerkzeug im Rahmen der in Figur 1 gezeigten, ersten Ausführungsform in Form eines rotationssymmetrischen Körpers, insbesondere einer Scheibe, ausgebildet ist. FIG. 1 shows that the grinding tool comprises abrasive particles 1 and an electrically conductive bonding matrix 2, wherein the abrasive particles 1 are incorporated into the bonding matrix 2. According to the invention, the bonding matrix 2 comprises at least one electrically self-conducting polymer and / or at least one polymer which has at least one electrically conductive additive 3. FIG. 1 illustrates that the abrasive particles 1 and the electrically conductive additive 3 are integrated homogeneously distributed in the binding matrix 2. FIG. 1 further illustrates that the grinding tool in the context of in FIG. 1 shown, first embodiment in the form of a rotationally symmetrical body, in particular a disc is formed.

Die in Figur 2 gezeigte, zweite Ausführungsform unterscheidet sich im Wesentlichen dadurch von der in Figur 1 gezeigten, ersten Ausführungsform, dass das Schleifwerkzeug weiterhin einen Grundkörper 4 umfasst, auf den die Abrasivpartikel 1 einbindende Bindungsmatrix 2 aufgebracht ist. Der Grundkörper 4 ist dabei insbesondere in Form einer Scheibe ausgebildet ist, wobei die Abrasivpartikel 1 einbindende Bindungsmatrix 2 auf der Mantelfläche M des scheibenförmigen Grundkörpers 4 aufgebracht ist und eine Schichtdicke d aufweist. Die beiden Deckflächen D des scheibenförmigen Grundkörpers 4 weisen dabei keine darauf aufgebrachte, Abrasivpartikel 1 einbindende Bindungsmatrix 2 auf.In the FIG. 2 The second embodiment shown differs essentially from that in FIG FIG. 1 shown, the first embodiment that the grinding tool further comprises a base body 4, on which the abrasive particles 1 einbindende binding matrix 2 is applied. In this case, the base body 4 is designed in particular in the form of a disk, wherein the abrasive particle 1 incorporating bonding matrix 2 is applied to the jacket surface M of the disk-shaped base body 4 and has a layer thickness d. The two top surfaces D of the disc-shaped main body 4 have no binding matrix 2 applied thereto which includes abrasive particles 1.

Claims (10)

Elektrisch leitfähiges Schleifwerkzeug, umfassend - Abrasivpartikel (1) und - eine elektrisch leitfähige Bindungsmatrix (2),
wobei die Abrasivpartikel (1) in die Bindungsmatrix (2) eingebunden sind, dadurch gekennzeichnet, dass
die Bindungsmatrix (2) mindestens ein elektrisch selbstleitendes Polymer und/oder mindestens ein Polymer, welches mindestens ein elektrisch leitendes Additiv (3) aufweist, umfasst. Electrically conductive grinding tool, comprising - Abrasive particles (1) and an electrically conductive bonding matrix (2),
wherein the abrasive particles (1) are incorporated into the binding matrix (2), characterized in that
the binding matrix (2) comprises at least one electrically self-conducting polymer and / or at least one polymer which has at least one electrically conductive additive (3). Schleifwerkzeug nach Anspruch 1, dadurch gekennzeichnet, dass die Abrasivpartikel (1) homogen verteilt in die Bindungsmatrix (2) eingebunden sind.Grinding tool according to claim 1, characterized in that the abrasive particles (1) homogeneously distributed in the binding matrix (2) are involved. Schleifwerkzeug nach Anspruch 1 oder 2, dadurch gekennzeichnet, dass die Bindungsmatrix (2) elastisch ist.Grinding tool according to claim 1 or 2, characterized in that the binding matrix (2) is elastic. Schleifwerkzeug nach einem der Ansprüche 1 bis 3, dadurch gekennzeichnet, dass - die Abrasivpartikel (1) ausgewählt sind, aus der Gruppe bestehend aus Aluminiumoxidpartikeln, Siliciumcarbidpartikeln, Bornitridpartikeln, Borcarbidpartikeln, Diamantpartikeln und Mischungen davon, und/oder - das elektrisch selbstleitende Polymer ausgewählt ist, aus der Gruppe, bestehend aus Polyacetylen, Polypyrrol, Polythiophen, Polyanilin, Poly(paraphenylen), Poly(para-phenylen-vinylen) und Mischungen davon, und/oder - das Additiv (3) aufweisende Polymer ausgewählt ist, aus der Gruppe bestehend aus Kunstharzen, Polyolefinen, elastomeren Silikonen, Naturkautschuk, Styrol-Butadien-Kautschuk, Butylkautschuk, Ethylen-Propylen-Kautschuk, Nitrilkautschuk, hydrierter Nitrilkautschuk, Chloroprenekautschuk, chlorsulfoniertes Polyethylen, Acrylatkautschuk, Polyurethankautschuk, Silikonkautschuk, Fluorsilikonkautschuk, Fluorkautschuk und Mischungen davon, und/oder - das elektrisch leitende Additiv (3) ausgewählt ist, aus der Gruppe, bestehend aus Leitruß, Metallpulvern und Mischungen davon. Grinding tool according to one of claims 1 to 3, characterized in that the abrasive particles (1) are selected from the group consisting of aluminum oxide particles, silicon carbide particles, boron nitride particles, boron carbide particles, diamond particles and mixtures thereof, and / or the electrically self-conducting polymer is selected from the group consisting of polyacetylene, polypyrrole, polythiophene, polyaniline, poly (paraphenylene), poly (para-phenylene-vinylene) and mixtures thereof, and / or polymer comprising the additive (3) is selected from the group consisting of synthetic resins, polyolefins, elastomeric silicones, natural rubber, styrene-butadiene rubber, butyl rubber, ethylene-propylene rubber, nitrile rubber, hydrogenated nitrile rubber, chloroprene rubber, chlorosulfonated polyethylene, acrylate rubber , Urethane rubber, silicone rubber, fluorosilicone rubber, fluororubber and mixtures thereof, and / or - The electrically conductive additive (3) is selected from the group consisting of Leitruß, metal powders and mixtures thereof. Schleifwerkzeug nach einem der Ansprüche 1 bis 4, dadurch gekennzeichnet, dass das Schleifwerkzeug in Form eines rotationssymmetrischen Körpers ausgebildet ist.Grinding tool according to one of claims 1 to 4, characterized in that the grinding tool is designed in the form of a rotationally symmetrical body. Schleifwerkzeug nach einem der Ansprüche 1 bis 5, dadurch gekennzeichnet, dass das Schleifwerkzeug weiterhin einen Grundkörper (4) umfasst, auf den die Abrasivpartikel (1) einbindende Bindungsmatrix (2) aufgebracht ist.Grinding tool according to one of claims 1 to 5, characterized in that the grinding tool further comprises a base body (4) on which the abrasive particles (1) binding binding matrix (2) is applied. Schleifwerkzeug nach einem der Ansprüche 1 bis 6, dadurch gekennzeichnet, dass der Grundkörper (4) in Form eines rotationssymmetrischen Körpers ausgebildet ist, wobei die Abrasivpartikel (1) einbindende Bindungsmatrix (2) auf der Mantelfläche (M) des Grundkörpers (4) und/oder auf einer oder beiden Deckflächen (D) des Grundkörpers (4) aufgebracht ist.Grinding tool according to one of claims 1 to 6, characterized in that the base body (4) is designed in the form of a rotationally symmetrical body, wherein the abrasive particles (1) incorporating binding matrix (2) on the lateral surface (M) of the base body (4) and / or on one or both top surfaces (D) of the base body (4) is applied. Schleifwerkzeug nach einem der Ansprüche 1 bis 7, dadurch gekennzeichnet, dass der Grundkörper (4) in Form einer Scheibe ausgebildet ist, wobei die Abrasivpartikel (1) einbindende Bindungsmatrix (2) auf der Mantelfläche (M) der Scheibe aufgebracht ist.Grinding tool according to one of claims 1 to 7, characterized in that the base body (4) is designed in the form of a disc, wherein the abrasive particles (1) binding binding matrix (2) on the outer surface (M) of the disc is applied. Materialabtragungsverfahren zum zerspanenden und elektrochemischen Abtragen von Material, umfassend mindestens einen Verfahrensschritt: a) Zerspanendes und elektrochemisches Abtragen von Material von einem Werkstück mit einem Schleifwerkzeug nach einem der Ansprüche 1 bis 8. Material removal process for the cutting and electrochemical removal of material, comprising at least one process step: a) machining and electrochemical removal of material from a workpiece with a grinding tool according to one of claims 1 to 8. Materialabtragungsverfahren nach Anspruch 9, dadurch gekennzeichnet, dass das Verfahren weiterhin mindestens einen Verfahrensschritt: b) Konditionieren des Schleifwerkzeugs, umfasst. Material removal method according to claim 9, characterized in that the method further comprises at least one method step: b) conditioning the grinding tool comprises.
EP10187723A 2009-12-07 2010-10-15 Electrically conductive grinder Withdrawn EP2329917A1 (en)

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