EP0027070B1 - Opto-electronic connector bit and method of assembling such a bit - Google Patents
Opto-electronic connector bit and method of assembling such a bit Download PDFInfo
- Publication number
- EP0027070B1 EP0027070B1 EP80401335A EP80401335A EP0027070B1 EP 0027070 B1 EP0027070 B1 EP 0027070B1 EP 80401335 A EP80401335 A EP 80401335A EP 80401335 A EP80401335 A EP 80401335A EP 0027070 B1 EP0027070 B1 EP 0027070B1
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- EP
- European Patent Office
- Prior art keywords
- fibre
- cover
- holder
- opto
- base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 230000005693 optoelectronics Effects 0.000 title claims description 18
- 238000000034 method Methods 0.000 title claims description 6
- 239000000835 fiber Substances 0.000 claims description 67
- 239000013307 optical fiber Substances 0.000 claims description 21
- 230000008878 coupling Effects 0.000 claims description 13
- 238000010168 coupling process Methods 0.000 claims description 13
- 238000005859 coupling reaction Methods 0.000 claims description 13
- 238000003466 welding Methods 0.000 claims description 10
- 229910000679 solder Inorganic materials 0.000 claims description 7
- 239000004065 semiconductor Substances 0.000 claims description 5
- 238000004026 adhesive bonding Methods 0.000 claims 1
- 230000005540 biological transmission Effects 0.000 description 11
- 230000003287 optical effect Effects 0.000 description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000003292 glue Substances 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 238000005553 drilling Methods 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 229910000531 Co alloy Inorganic materials 0.000 description 2
- 229910000640 Fe alloy Inorganic materials 0.000 description 2
- 229910000990 Ni alloy Inorganic materials 0.000 description 2
- 239000010941 cobalt Substances 0.000 description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 210000000056 organ Anatomy 0.000 description 2
- NYQDCVLCJXRDSK-UHFFFAOYSA-N Bromofos Chemical compound COP(=S)(OC)OC1=CC(Cl)=C(Br)C=C1Cl NYQDCVLCJXRDSK-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 241001415961 Gaviidae Species 0.000 description 1
- 241000287107 Passer Species 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 240000008042 Zea mays Species 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 235000021183 entrée Nutrition 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000010079 rubber tapping Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/421—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical component consisting of a short length of fibre, e.g. fibre stub
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4238—Soldering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Definitions
- the invention relates to an opto-electronic coupling head which can either be a transmission head or a reception (or detection) head.
- a complete link includes a link of the above type in each direction of transmission.
- the known embodiments are complex and of high manufacturing cost, especially with telecommunications fibers of a very small diameter (for example of the order of 100 microns), in particular due to the need to carry out a mounting of the fiber in the coupling head by checking, during assembly, the good quality of the optical transmission, according to the so-called "dynamic adjustment" method.
- a fiber holder pierced to the caliber of the optical fiber is used, the fiber holder being designed to be used as a protective cover for the head.
- this solution requires constituting the fiber holder using a material such as nickel or an alloy of iron, nickel and cobalt which can be welded to the base of the type used in semiconductor technology.
- these materials have the disadvantage of being extremely difficult to pierce over relatively long lengths compared to the diameter of the perforation, that is to say the diameter of a telecommunications optical fiber.
- a document of known art namely the patent specification FR-A-2 405 488 describes an optical device for a connector intended for transmission by fibers.
- This device comprises a fiber holder provided with a cavity in which is housed an opto-electronic device, said fiber holder being held by compression between a lower part and an upper part of the connector.
- the invention uses a standardized housing with cover and semiconductor base, avoiding the drawbacks of the previous embodiments.
- the opto-electronic coupling head is of the type comprising a support device for an opto-electronic component, the opto-electronic component itself, a device for positioning optical fiber, called a fiber holder, a section of optical fiber, finally an encapsulation device constituted by a conventional semiconductor package comprising a base and a cover pierced with a circular opening through which the fiber holder comes out of the housing, the fiber holder being held by compression between this base and this cover, this fiber holder comprising in the part bearing on the base a recess in which the optoelectronic component is housed, characterized in that the fiber holder further comprises in its opposite part, a shoulder, on the annular face which bears the edge of this circular opening of the cover made in a previously stamped part of the upper central part of this cover.
- a housing 1 of the standardized type for semiconductor device comprises a base 11, for example made of an alloy of iron, nickel and cobalt, with coefficient of expansion close to that of glass, and a metal cover 12.
- the base is crossed by insulating passages of electrical connections 111 and 112, of the “glass bead” type, intended to supply the opto-electronic component of the head.
- it is for example a light-emitting diode 13 mounted on a support 14.
- the latter is for example a metallic ceramic washer on two opposite faces, or on the only face which receives the diode , the ground connection 111 being welded on this last metallized face.
- the support 14 could also consist of a metallic copper washer intended to facilitate heat dissipation, which may be necessary in the case of a relatively powerful opto-electronic transmitter. In the latter case, the con nexion 111 would be useless, mass can be taken at any point on the base or cover. Finally, the support 14 can be of parallelepiped shape.
- FIG. 1 shows a fiber holder 16, the middle part of which has a shoulder 160 of diameter equal to the internal diameter of the cover, reduced by 0.01 mm, with a tolerance of the same order by default.
- This fiber holder encloses a fiber 15, immobilized by glue, resin or welding, in particular at the upper part of the fiber holder by a deposit 151.
- the shoulder 160 has a recess 170, thus providing a housing for the component and its connections, with a vertical clearance enabling the coupling of the component and the input face (or output in the case of a reception head) of the optical fiber to be adjusted as best as possible.
- the upper part of the fiber holder 16 emerges from the upper part of the cover 12 through a central opening whose edge 121 is inclined downward.
- a deposit 18 of glue, resin or solder is deposited around the fiber holder to seal the cover on the shoulder 160. The stage in which this deposit takes place is described below.
- the base 11 has a rim 110, which is thinner than the central part, in order to facilitate the electrical welding of the flared edge 122 of the cover 12 on the periphery of the base 11. This welding operation is described below.
- a tool 20 is used for this purpose (FIG. 2), comprising a reference plane 200 and a platform 201, the height of which is equal to the dimension of the photo-emitting or photo-receiving face of the component increased by an interval calculated in function of the optimal coupling already mentioned.
- the sealing of the cover at its central upper opening in the case where one uses a low temperature tin solder preform has the advantage of not melting the solder deposit 151 (FIG. 1) and of avoiding compromising the immobilization of the fiber.
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Optics & Photonics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Optical Couplings Of Light Guides (AREA)
- Led Device Packages (AREA)
- Semiconductor Lasers (AREA)
- Light Receiving Elements (AREA)
Description
L'invention concerne une tête de couplage op- to-électronique qui peut être soit une tête d'émission soit une tête de réception (ou détection).The invention relates to an opto-electronic coupling head which can either be a transmission head or a reception (or detection) head.
On sait qu'une liaison de télécommunication par fibre optique peut comporter:
- - une tête d'émission comportant un émetteur optique modulé par l'information à transmettre, émetteur qui est par exemple une diode électroluminescente ou une diode laser, couplé avec un tronçon de fibre optique;
- - au moins un connecteur couplant le tronçon de fibre optique avec une ou plusieurs fibres optiques;
- - au moins un câble optique comprenant un nombre variable de fibres dont une ou plusieurs sont affectuées à la transmission de l'information provenant de l'émetteur;
- - au moins un connecteur couplant la ou les fibres optiques intéressées par la transmission dont il s'agit avec un tronçon de fibre optique;
- - une tête de réception (ou de détection) comportant un tronçon de fibre optique couplé avec un récepteur (ou détecteur) optique (photodiode) restituant l'information sous forme électrique.
- a transmission head comprising an optical transmitter modulated by the information to be transmitted, a transmitter which is for example a light-emitting diode or a laser diode, coupled with a section of optical fiber;
- - at least one connector coupling the optical fiber section with one or more optical fibers;
- - at least one optical cable comprising a variable number of fibers, one or more of which are assigned to the transmission of information from the transmitter;
- - at least one connector coupling the optical fiber or fibers involved in the transmission in question with a section of optical fiber;
- - a reception (or detection) head comprising a section of optical fiber coupled with an optical receiver (or detector) (photodiode) restoring the information in electrical form.
Une liaison complète comporte une liaison du type ci-dessus dans chaque sens de transmission.A complete link includes a link of the above type in each direction of transmission.
La réalisation d'une tête d'émission ou de réception pose des problèmes:
- - d'ordre mécanique, car il faut assurer le positionnement et l'immobilisation dans la position optimale, du composant opto-électronique (émetteur ou récepteur) par rapport à la surface terminale (d'entrée ou de sortie) du tronçon de fibre optique;
- - d'ordre électrique et optique, en ce qui concerne notamment l'étanchéité des composants de manière à assurer et à présenter un bon isolement électrique des constituants de la tête, et les qualités optiques des organes optiques ou opto-électroniques.
- - mechanical, because it is necessary to ensure positioning and immobilization in the optimal position, of the opto-electronic component (transmitter or receiver) relative to the terminal surface (input or output) of the optical fiber section ;
- - of an electrical and optical order, with regard in particular to the sealing of the components so as to ensure and present good electrical insulation of the constituents of the head, and the optical qualities of the optical or opto-electronic organs.
Les réalisations connues sont complexes et d'un coût élevé de fabrication, surtout avec des fibres de télécommunications d'un très petit diamètre (par exemple de l'ordre de 100 microns), notamment par suite de la nécessité de procéder à un montage de la fibre dans la tête de couplage en contrôlant, en cours de montage, la bonne qualité de la transmission optique, suivant la méthode dite de «réglage dynamique».The known embodiments are complex and of high manufacturing cost, especially with telecommunications fibers of a very small diameter (for example of the order of 100 microns), in particular due to the need to carry out a mounting of the fiber in the coupling head by checking, during assembly, the good quality of the optical transmission, according to the so-called "dynamic adjustment" method.
Dans une réalisation plus simple, on utilise un porte-fibre percé au calibre de la fibre optique, le porte-fibre étant conçu pour être utilisé comme capot de protection de la tête. Mais cette solution exige de constituer le porte-fibre en utilisant un matériau tel que le nickel ou un alliage de fer, nickel et cobalt soudable à l'embase du type utilisé dans la technologie des semiconducteurs. Or ces matériaux présentent l'inconvénient d'être extrêmement difficiles à percer sur des longueurs relativement importantes par rapport au diamètre de la perforation, c'est-à-dire au diamètre d'une fibre optique de télécommunications.In a simpler embodiment, a fiber holder pierced to the caliber of the optical fiber is used, the fiber holder being designed to be used as a protective cover for the head. However, this solution requires constituting the fiber holder using a material such as nickel or an alloy of iron, nickel and cobalt which can be welded to the base of the type used in semiconductor technology. However, these materials have the disadvantage of being extremely difficult to pierce over relatively long lengths compared to the diameter of the perforation, that is to say the diameter of a telecommunications optical fiber.
Un document de l'art connu, à savoir le fascicule de brevet FR-A-2 405 488 décrit un dispositif optique pour connecteur destiné à la transmission par fibres.A document of known art, namely the patent specification FR-A-2 405 488 describes an optical device for a connector intended for transmission by fibers.
Ce dispositif comprend un porte-fibre muni d'une cavité dans laquelle vient se loger un dispositif opto-électronique, ledit porte-fibre étant maintenu par compression entre une partie inférieure et une partie supérieure du connecteur.This device comprises a fiber holder provided with a cavity in which is housed an opto-electronic device, said fiber holder being held by compression between a lower part and an upper part of the connector.
L'invention utilise un boîtier normalisé avec capot et embase de semiconducteur, en évitant les inconvénients des réalisations précédentes.The invention uses a standardized housing with cover and semiconductor base, avoiding the drawbacks of the previous embodiments.
La tête de couplage opto-électronique selon l'invention est du type comprenant un dispositif support d'un composant opto-électronique, le composant opto-électronique lui-même, un dispositif de positionnement de fibre optique, dit porte-fibre, un tronçon de fibre optique, enfin un dispositif d'encapsulation constitué par un boîtier classique de semiconducteur comprenant une embase et un capot percé d'une ouverture circulaire par laquelle le porte-fibre sort du boîtier, le porte-fibre étant maintenu par compression entre cette embase et ce capot, ce porte-fibre comportant dans la partie prenant appui sur l'embase un évidement dans lequel se loge le composant opto-électronique, caractérisé en ce que le porte-fibre comporte en outre dans sa partie opposée, un épaulement, sur la face annulaire duquel s'appuie le bord de cette ouverture circulaire du capot pratiquée dans une partie préalablement emboutie de la partie centrale supérieure de ce capot.The opto-electronic coupling head according to the invention is of the type comprising a support device for an opto-electronic component, the opto-electronic component itself, a device for positioning optical fiber, called a fiber holder, a section of optical fiber, finally an encapsulation device constituted by a conventional semiconductor package comprising a base and a cover pierced with a circular opening through which the fiber holder comes out of the housing, the fiber holder being held by compression between this base and this cover, this fiber holder comprising in the part bearing on the base a recess in which the optoelectronic component is housed, characterized in that the fiber holder further comprises in its opposite part, a shoulder, on the annular face which bears the edge of this circular opening of the cover made in a previously stamped part of the upper central part of this cover.
L'invention sera mieux comprise, et d'autres caractéristiques apparaîtront, au moyen de la description qui suit, et des dessins qui l'accompagnent, parmi lesquelles:
- La figure 1 est une coupe schématique d'une tête d'émission suivant l'invention;
- Les figures 2, 3 et 4 représentent diverses étapes de fabrication et/ou de montage de la tête représentée figure 1 ;
- La figure 5 représente une variante de l'invention.
- Figure 1 is a schematic section of a transmission head according to the invention;
- Figures 2, 3 and 4 show various stages of manufacturing and / or mounting the head shown in Figure 1;
- FIG. 5 represents a variant of the invention.
Dans le schéma de la figure 1, relatif à une tête d'émission, un boîtier 1, du type normalisé pour dispositif à semiconducteurs, comporte une embase 11, par exemple en alliage de fer, nickel et cobalt, de coefficient de dilatation proche de celui du verre, et un capot métallique 12. L'embase est traversée par des passages isolants de connexions électriques 111 et 112, du type «à perle de verre», destinés à alimenter le composant opto-électronique de la tête. Dans le cas de la figure 1, il s'agit par exemple d'une diode électroluminescente 13 montée sur un support 14. Ce dernier est par exemple une rondelle de céramique métallisée sur deux faces opposées, ou sur la seule face qui reçoit la diode, la connexion de masse 111 étant soudée sur cette dernière face métallisée. Le support 14 pourrait être aussi constitué par une rondelle métallique de cuivre destinée à faciliter la dissipation thermique, ce qui peut être nécessaire dans le cas d'un émetteur opto-électronique relativement puissant. Dans ce dernier cas, la connexion 111 serait inutile, la masse pouvant être prise en n'importe quel point de l'embase ou du capot. Enfin le support 14 peut être de forme parallélépipèdique.In the diagram of FIG. 1, relating to an emission head, a housing 1, of the standardized type for semiconductor device, comprises a
Dans le même schéma, on a représenté figure 1, un porte-fibre 16 dont la partie médiane comporte un épaulement 160 de diamètre égal au diamètre interne du capot, diminué de 0,01 mm, avec une tolérance du même ordre par défaut. Ce porte-fibre enserre une fibre 15, immobilisée par de la colle, résine ou soudure, notamment à la partie supérieure du porte-fibre par un dépôt 151. L'épaulement 160 comporte un évidement 170, fournissant ainsi un logement pour le composant et ses connexions, avec un jeu vertical permettant de régler au mieux le couplage du composant et de la face d'entrée (ou de sortie dans le cas d'une tête de réception) de la fibre optique.In the same diagram, FIG. 1 shows a
La partie supérieure du porte-fibre 16 émerge de la partie supérieure du capot 12 par une ouverture centrale dont le bord 121 est incliné vers le bas. Un dépôt 18 de colle, de résine ou de soudure est déposé autour du porte-fibre pour sceller le capot sur l'épaulement 160. On décrit plus loins l'étape où s'effectue ce dépôt.The upper part of the
En outre l'embase 11 comporte un rebord 110, de moindre épaisseur que la partie centrale, afin de faciliter la soudure électrique du bord évasé 122 du capot 12 sur la périphérie de l'embase 11. Cette opération de soudure est décrite plus loins.In addition, the
Le procédé de fabrication et de montage du porte-fibre et de l'ensemble de la tête comporte par exemple les étapes suivantes:
- a) Fabrication au tour du porte-fibre, comportant notamment l'usinage de l'épaulement 160, d'un épaulement supplémentaire 2 servant à fournir un plan de référence de la position des faces terminales du tronçon de fibre optique, et comprenant en outre le perçage d'un orifice axial;
- b) Fixation de la fibre dans la perforation centrale du porte-fibre de manière à placer l'une des faces terminales de la fibre dans le plan correspondant au couplage optimal de cette face et du composant opto-électronique.
- a) Manufacture in turn of the fiber holder, comprising in particular the machining of the
shoulder 160, of an additional shoulder 2 serving to provide a reference plane of the position of the end faces of the section of optical fiber, and further comprising drilling an axial hole; - b) Fixing of the fiber in the central perforation of the fiber holder so as to place one of the end faces of the fiber in the plane corresponding to the optimal coupling of this face and the opto-electronic component.
On utilise à cet effet un outillage 20 (figure 2), comportant un plan de référence 200 et une plateforme 201 dont la hauteur est égale à la cote de la face photo-émettrice ou photo-réceptrice du composant augmentée d'un intervalle calculé en fonction du couplage optimal déjà mentionné.A
On fait coulisser le tronçon 15 dans la perforation centrale du porte-fibre 16 jusqu'à ce qu'il bute contre la plateforme 201, puis on immobilise la fibre en remplissant de colle, résine ou soudure une partie élargie 161 de la perforation centrale, située par exemple à la partie supérieure de celle-ci.
- c) Rodage et plissage de la partie supérieure du porte-fibre et de la fibre elle-même en utilisant un
outillage 30 comportant un plan d'appui 300, servant à supporter au cours de cette étape la partie inférieure 160 du porte-fibre, et comportant en outre uncollier 31 prenant appui sur l'épaulement 2 du porte-fibre et dont la face supérieure 310 définit un plan-limite du rodage et du polissage; - d) Emboutissage et perçage du capot en utilisant des moyens classiques auxquels sont adjoints des outillages adaptés aux dimensions du
capot 12; - e) Scellement du capot en utilisant des moyens de soudure électrique comportant des électrodes façonnées pour s'adapter à la tête. En effet les électrodes doivent comprimer l'épaulement 160 du porte-fibre contre le bord circulaire 121 du
capot 12 pendant l'opération. On a représenté partiellement, figure 4, lesélectrodes 41 et 42 de la machine à souder électrique utilisée dans cette opération. L'électrode 42 appuie sur l'embase 11; elle comporte une ouverture circulaire 420 destinée à laisser passer lesconnexions 111 et 112 afin d'eviter leur écrasement. L'électrode 41 comporte unecavité 410 destinée à recevoir lecapot 12 embouti et percé préalablement. La profondeur de cette cavité est asses grande pour laisser libre lesommet 16 du porte-fibre 160 pendant l'opération de soudure électrique. On a représenté entre le capot et l'épaulement 160 une préforme de soudure à basse température destinée à jouer le rôle dudépôt 18 de la figure 1.
- c) lapping and pleating of the upper part of the fiber holder and of the fiber itself using a
tool 30 comprising asupport plane 300, serving to support during this step thelower part 160 of the fiber holder, and further comprising acollar 31 bearing on the shoulder 2 of the fiber holder and theupper face 310 of which defines a limit plane for lapping and polishing; - d) Stamping and drilling of the cover using conventional means to which are added tools adapted to the dimensions of the
cover 12; - e) Sealing of the cover using electric welding means comprising electrodes shaped to adapt to the head. Indeed, the electrodes must compress the
shoulder 160 of the fiber holder against thecircular edge 121 of thecover 12 during the operation. FIG. 4 partially shows the 41 and 42 of the electric welding machine used in this operation. Theelectrodes electrode 42 presses on thebase 11; it has acircular opening 420 intended to allow the 111 and 112 to pass in order to avoid their crushing. Theconnections electrode 41 includes acavity 410 intended to receive the stamped and previously piercedcover 12. The depth of this cavity is large enough to leave free the top 16 of thefiber holder 160 during the electric welding operation. There is shown between the cover and the shoulder 160 a low temperature welding preform intended to play the role of thedeposit 18 of FIG. 1.
L'invention a plusieurs variantes, portant notamment sur le porte-fibre. On a représenté figure 5, un porte-fibre présentant des particularités correspondant aux variantes ci-après:
- 1) La partie supérieure 16 du porte-fibre comporte en complèment d'un centreur mécanique 17 de forme cylindrique
un filetage 162 permettant de constituer un connecteur démontable pour fibre optique en combinant la tête opto-électronique et un embout de fibre optique comportant lui-même un taraudage adapté. - 2) L'orifice axial du porte-fibre est complexe: il comporte par exemple trois parties de diamètres internes inégaux. La première partie 51 a un diamètre interne supérieur à celui de la fibre optique pour permettre l'immobilisation de celle-ci par un dépôt de soudure, résine ou colle. La deuxième partie 52, de faible longueur pour permettre le perçage précis de trous de petits diamètres (300), a sensiblement le même diamètre que la fibre optique, mais doit pouvoir cependant laisser celle-ci coulisser librement. La troisième partie 53 comporte un cylindre beaucoup plus large et
loge un manchon 54 coulissant à force dans le cylindre. Ce manchon, destiné à être traversé par la fibre, comporte une partie 541 au diamètre de celle-ci, et une partie 542 de plus grand diamètre. Ceci afin de permettre l'usinage de trous de très petit diamètre, impossibles à réaliser économiquement sur de grandes longueurs. - 3) La partie inférieure du porte-fibre
comporte une entaille 55 destinée à laisser libres les connexions despassages 111et 112 de l'embase. Cette entaille est nécessaire lorsque lespassages 111et 112 sont situés très près de la périphérie de l'embase, comme cela se présente dans certains mo- déles (T018 T046). - 4) L'intérieur du boîtier peut être rempli de gaz neutre avant d'opérer la soudure du capot.
- 1) The
upper part 16 of the fiber holder comprises, in addition to amechanical centralizer 17 of cylindrical shape, athread 162 making it possible to constitute a removable connector for optical fiber by combining the opto-electronic head and a fiber optic tip comprising itself even a suitable tapping. - 2) The axial opening of the fiber holder is complex: it comprises for example three parts of unequal internal diameters. The
first part 51 has an internal diameter greater than that of the optical fiber to allow immobilization thereof by a deposit of solder, resin or glue. Thesecond part 52, of short length to allow precise drilling of holes of small diameters (300), has substantially the same diameter as the optical fiber, but must however be able to let the latter slide freely. Thethird part 53 has a much wider cylinder and houses asleeve 54 sliding by force in the cylinder. This sleeve, intended to be traversed by the fiber, comprises apart 541 with the diameter of the latter, and apart 542 of larger diameter. This is to allow the machining of holes of very small diameter, impossible to achieve economically over long lengths. - 3) The lower part of the fiber holder has a
notch 55 intended to leave free the connections of 111 and 112 of the base. This notch is necessary when thepassages 111 and 112 are located very close to the periphery of the base, as occurs in certain models (T018 T046).passages - 4) The inside of the housing can be filled with neutral gas before welding the cover.
Le scellement du capot au niveau de son ouverture supérieure centrale, dans le cas où l'on utilise une préforme de soudure à l'étain à basse température, présente l'avantage de ne pas faire fondre le dépôt de soudure 151( figure 1) et d'éviter de compromettre l'immobilisation de la fibre.The sealing of the cover at its central upper opening, in the case where one uses a low temperature tin solder preform has the advantage of not melting the solder deposit 151 (FIG. 1) and of avoiding compromising the immobilization of the fiber.
Claims (6)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7924892A FR2466784A1 (en) | 1979-10-05 | 1979-10-05 | OPTO-ELECTRONIC COUPLING HEAD, AND METHOD OF MOUNTING SUCH A HEAD |
FR7924892 | 1979-10-05 |
Publications (2)
Publication Number | Publication Date |
---|---|
EP0027070A1 EP0027070A1 (en) | 1981-04-15 |
EP0027070B1 true EP0027070B1 (en) | 1983-04-06 |
Family
ID=9230385
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP80401335A Expired EP0027070B1 (en) | 1979-10-05 | 1980-09-19 | Opto-electronic connector bit and method of assembling such a bit |
Country Status (5)
Country | Link |
---|---|
US (1) | US4386821A (en) |
EP (1) | EP0027070B1 (en) |
JP (1) | JPS5658276A (en) |
DE (1) | DE3062633D1 (en) |
FR (1) | FR2466784A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1840973A2 (en) * | 2006-03-29 | 2007-10-03 | Stmicroelectronics Sa | Semi-conductor case with sliding cage. |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2492542A1 (en) * | 1980-09-23 | 1982-04-23 | Thomson Csf | METHOD FOR ALIGNING A GLASS FIBER THAT IS PART OF AN OPTICAL TRANSMISSION CABLE WITH AN OPTOELECTRONIC COMPONENT, ADAPTER, AND COUPLING HEAD COMPRISING THE USE OF THE METHOD |
DE3338315A1 (en) * | 1983-10-21 | 1985-05-02 | Standard Elektrik Lorenz Ag, 7000 Stuttgart | OPTOELECTRIC COUPLING |
US4787695A (en) * | 1985-12-24 | 1988-11-29 | Herzl Laor | Optical fiber connector and assembly method thereof |
US4845052A (en) * | 1986-02-07 | 1989-07-04 | Harris Corporation | Method of packaging a non-contact I/O signal transmission integrated circuit |
US4839885A (en) * | 1987-06-22 | 1989-06-13 | E. I. Dupont De Nemours And Company | Star configured local area network |
US4839886A (en) * | 1987-06-22 | 1989-06-13 | E. I. Du Pont De Nemours And Company | Star configured local area network having priority allocation |
US5011254A (en) * | 1989-11-30 | 1991-04-30 | At&T Bell Laboratories | Coupling of optical devices to optical fibers by means of microlenses |
US5231686A (en) * | 1992-07-17 | 1993-07-27 | Honeywell Inc. | Optical connector configured to facilitate active alignment of a photoelectric device with an optical fiber |
EP0592746B1 (en) * | 1992-10-14 | 1997-03-19 | International Business Machines Corporation | Encapsulated light emitting diode and method for encapsulating the same |
WO1997032344A1 (en) * | 1996-02-28 | 1997-09-04 | The Whitaker Corporation | Packaging for optoelectronic device |
DE19626080B4 (en) * | 1996-06-28 | 2005-12-29 | The Whitaker Corp., Wilmington | Arrangement for fixing an optical waveguide |
US5812571A (en) * | 1996-10-25 | 1998-09-22 | W. L. Gore & Associates, Inc. | High-power vertical cavity surface emitting laser cluster |
US6296400B1 (en) * | 1999-05-19 | 2001-10-02 | Trw Inc. | Integrated fiber optic bulkhead receptacle |
US6538901B1 (en) * | 2002-03-05 | 2003-03-25 | Chen-Hung Hung | Optical transceiver module |
WO2003088286A2 (en) * | 2002-04-16 | 2003-10-23 | Xloom Photonics Ltd. | Electro-optical circuitry having integrated connector and methods for the production thereof |
US20040021214A1 (en) * | 2002-04-16 | 2004-02-05 | Avner Badehi | Electro-optic integrated circuits with connectors and methods for the production thereof |
DE10321137B4 (en) * | 2003-05-09 | 2010-03-11 | Molex Inc., Lisle | Method for producing an arrangement of a waveguide section and a component |
US7538358B2 (en) | 2003-10-15 | 2009-05-26 | Xloom Communications, Ltd. | Electro-optical circuitry having integrated connector and methods for the production thereof |
US20050129372A1 (en) * | 2003-12-11 | 2005-06-16 | Tieyu Zheng | Method and apparatus for manufacturing a transistor-outline (TO) can having a ceramic header |
US20090093137A1 (en) * | 2007-10-08 | 2009-04-09 | Xloom Communications, (Israel) Ltd. | Optical communications module |
TWI602267B (en) * | 2014-06-13 | 2017-10-11 | 矽品精密工業股份有限公司 | Package structure and manufacturing method thereof |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3570804A (en) * | 1969-04-21 | 1971-03-16 | Acf Ind Inc | Hydraulic valve operator having manual override mechanism |
US4144541A (en) * | 1977-01-27 | 1979-03-13 | Electric Power Research Institute, Inc. | Light-activated semiconductor device package unit |
FR2405488A1 (en) * | 1977-10-07 | 1979-05-04 | Radiotechnique Compelec | OPTICAL DEVICE FOR A CONNECTOR INTENDED FOR TRANSMISSION BY FIBERS AND ITS EMBODIMENT METHOD |
CA1108899A (en) * | 1978-08-17 | 1981-09-15 | Paul P. Webb | Light detector housing for fiber optic applications |
US4255015A (en) * | 1978-09-01 | 1981-03-10 | Rockwell International Corporation | Means for coupling a fiber optic cable with an electro-optic transducer |
FR2446497A1 (en) * | 1979-01-09 | 1980-08-08 | Thomson Csf | Opto-electronic coupling head - mounted in transistor type housing for accurate orientation w.r.t. fibre=optic cable |
-
1979
- 1979-10-05 FR FR7924892A patent/FR2466784A1/en active Granted
-
1980
- 1980-09-19 DE DE8080401335T patent/DE3062633D1/en not_active Expired
- 1980-09-19 EP EP80401335A patent/EP0027070B1/en not_active Expired
- 1980-10-01 JP JP13593180A patent/JPS5658276A/en active Pending
- 1980-10-02 US US06/193,019 patent/US4386821A/en not_active Expired - Lifetime
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1840973A2 (en) * | 2006-03-29 | 2007-10-03 | Stmicroelectronics Sa | Semi-conductor case with sliding cage. |
FR2899384A1 (en) * | 2006-03-29 | 2007-10-05 | St Microelectronics Sa | SLIDING CAGE SEMICONDUCTOR HOUSING |
US7326968B2 (en) | 2006-03-29 | 2008-02-05 | Stmicroelectronics S.A. | Semiconductor packaging unit with sliding cage |
EP1840973A3 (en) * | 2006-03-29 | 2012-06-27 | STMicroelectronics SA | Semi-conductor case with sliding cage. |
Also Published As
Publication number | Publication date |
---|---|
JPS5658276A (en) | 1981-05-21 |
FR2466784A1 (en) | 1981-04-10 |
EP0027070A1 (en) | 1981-04-15 |
DE3062633D1 (en) | 1983-05-11 |
US4386821A (en) | 1983-06-07 |
FR2466784B1 (en) | 1983-01-21 |
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