DK195987A - Fremgangsmaade til fremstilling af en aniosotropt ledende elastomer og anvendelse af denne - Google Patents

Fremgangsmaade til fremstilling af en aniosotropt ledende elastomer og anvendelse af denne

Info

Publication number
DK195987A
DK195987A DK195987A DK195987A DK195987A DK 195987 A DK195987 A DK 195987A DK 195987 A DK195987 A DK 195987A DK 195987 A DK195987 A DK 195987A DK 195987 A DK195987 A DK 195987A
Authority
DK
Denmark
Prior art keywords
aniosotropective
elastomes
preparing
procedure
preparing aniosotropective
Prior art date
Application number
DK195987A
Other languages
English (en)
Other versions
DK195987D0 (da
Inventor
James C K Lee
Richard Beck
Chune Lee
Edward Hu
Original Assignee
Digital Equipment Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Digital Equipment Corp filed Critical Digital Equipment Corp
Publication of DK195987D0 publication Critical patent/DK195987D0/da
Publication of DK195987A publication Critical patent/DK195987A/da

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0657—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/007—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for elastomeric connecting elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/0652—Bump or bump-like direct electrical connections from substrate to substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06527—Special adaptation of electrical connections, e.g. rewiring, engineering changes, pressure contacts, layout
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06579—TAB carriers; beam leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0281—Conductive fibers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0235—Laminating followed by cutting or slicing perpendicular to plane of the laminate; Embedding wires in an object and cutting or slicing the object perpendicular to direction of the wires
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/43—Electric condenser making
    • Y10T29/435—Solid dielectric type

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Combinations Of Printed Boards (AREA)
DK195987A 1986-04-17 1987-04-15 Fremgangsmaade til fremstilling af en aniosotropt ledende elastomer og anvendelse af denne DK195987A (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/853,313 US4778950A (en) 1985-07-22 1986-04-17 Anisotropic elastomeric interconnecting system

Publications (2)

Publication Number Publication Date
DK195987D0 DK195987D0 (da) 1987-04-15
DK195987A true DK195987A (da) 1987-10-18

Family

ID=25315701

Family Applications (1)

Application Number Title Priority Date Filing Date
DK195987A DK195987A (da) 1986-04-17 1987-04-15 Fremgangsmaade til fremstilling af en aniosotropt ledende elastomer og anvendelse af denne

Country Status (8)

Country Link
US (1) US4778950A (da)
EP (1) EP0242303B1 (da)
JP (1) JPS6313287A (da)
AU (1) AU594141B2 (da)
CA (1) CA1277380C (da)
DE (1) DE3787987T2 (da)
DK (1) DK195987A (da)
FI (1) FI871636A (da)

Families Citing this family (73)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4954873A (en) * 1985-07-22 1990-09-04 Digital Equipment Corporation Electrical connector for surface mounting
US4754546A (en) * 1985-07-22 1988-07-05 Digital Equipment Corporation Electrical connector for surface mounting and method of making thereof
EP0312802A3 (en) * 1987-09-24 1990-10-10 Elastomeric Technologies, Inc. Self-mounted chip carrier
DE68913318T2 (de) * 1988-03-11 1994-09-15 Ibm Elastomerische Verbinder für elektronische Bausteine und für Prüfungen.
US5213715A (en) * 1989-04-17 1993-05-25 Western Digital Corporation Directionally conductive polymer
US5147519A (en) * 1990-07-27 1992-09-15 Motorola, Inc. Method of manufacturing elastomers containing fine line conductors
US5528466A (en) * 1991-11-12 1996-06-18 Sunright Limited Assembly for mounting and cooling a plurality of integrated circuit chips using elastomeric connectors and a lid
JP2545675B2 (ja) * 1992-07-17 1996-10-23 信越ポリマー株式会社 エラスチックコネクタの製造方法
US5791654A (en) * 1992-08-19 1998-08-11 The Boeing Company Corrosion resistant gasket in combination with aircraft antenna
US6454276B2 (en) * 1992-08-19 2002-09-24 The Boeing Company Corrosion resistant gasket for aircraft
US20050062492A1 (en) * 2001-08-03 2005-03-24 Beaman Brian Samuel High density integrated circuit apparatus, test probe and methods of use thereof
US5371654A (en) * 1992-10-19 1994-12-06 International Business Machines Corporation Three dimensional high performance interconnection package
US5811982A (en) * 1995-11-27 1998-09-22 International Business Machines Corporation High density cantilevered probe for electronic devices
US5810607A (en) * 1995-09-13 1998-09-22 International Business Machines Corporation Interconnector with contact pads having enhanced durability
US5441690A (en) * 1993-07-06 1995-08-15 International Business Machines Corporation Process of making pinless connector
JP3578232B2 (ja) * 1994-04-07 2004-10-20 インターナショナル・ビジネス・マシーンズ・コーポレーション 電気接点形成方法、該電気接点を含むプローブ構造および装置
US5949029A (en) * 1994-08-23 1999-09-07 Thomas & Betts International, Inc. Conductive elastomers and methods for fabricating the same
US5599193A (en) * 1994-08-23 1997-02-04 Augat Inc. Resilient electrical interconnect
WO1996007924A1 (en) * 1994-09-09 1996-03-14 Micromodule Systems Membrane probing of circuits
JPH10506459A (ja) * 1994-09-09 1998-06-23 マイクロモジュール・システムズ 回路のメンブレンプローブ
US5506753A (en) * 1994-09-26 1996-04-09 International Business Machines Corporation Method and apparatus for a stress relieved electronic module
EP0788729A4 (en) * 1994-10-28 1998-06-03 Micromodule Systems Inc PROGRAMMABLE HIGH DENSITY ELECTRONIC TEST DEVICE
MY112945A (en) * 1994-12-20 2001-10-31 Ibm Electronic devices comprising dielectric foamed polymers
US5785538A (en) * 1995-11-27 1998-07-28 International Business Machines Corporation High density test probe with rigid surface structure
US5807767A (en) * 1996-01-02 1998-09-15 Micron Technology, Inc. Technique for attaching die to leads
JP2908747B2 (ja) * 1996-01-10 1999-06-21 三菱電機株式会社 Ｉｃソケット
US6403226B1 (en) 1996-05-17 2002-06-11 3M Innovative Properties Company Electronic assemblies with elastomeric members made from cured, room temperature curable silicone compositions having improved stress relaxation resistance
US5890915A (en) * 1996-05-17 1999-04-06 Minnesota Mining And Manufacturing Company Electrical and thermal conducting structure with resilient conducting paths
JP3420435B2 (ja) * 1996-07-09 2003-06-23 松下電器産業株式会社 基板の製造方法、半導体装置及び半導体装置の製造方法
AU3785097A (en) * 1996-08-09 1998-03-06 Advantest Corporation Semiconductor device testing apparatus
WO1998057341A1 (en) * 1997-06-10 1998-12-17 Usf Filtration And Separations Group, Inc. Capacitor and method of making
US6046091A (en) 1997-06-10 2000-04-04 Usf Filtration And Seperations Group, Inc. Capacitor and method of making
JP2001024150A (ja) * 1999-07-06 2001-01-26 Sony Corp 半導体装置
JP2003110237A (ja) * 2001-09-28 2003-04-11 Shinko Electric Ind Co Ltd 多層配線基板及び多層半導体装置
US7017260B2 (en) * 2002-01-08 2006-03-28 Weiss Roger E Method of making an elastomeric conductive sheet
US6945790B2 (en) * 2002-01-15 2005-09-20 Tribotek, Inc. Multiple-contact cable connector assemblies
BR0215519A (pt) * 2002-01-15 2005-03-22 Tribotek Inc Conector de contato múltiplo tramado
US7056139B2 (en) * 2002-01-15 2006-06-06 Tribotek, Inc. Electrical connector
US20040214454A1 (en) * 2002-01-15 2004-10-28 Tribotek, Inc. Method and apparatus for manufacturing woven connectors
US7083427B2 (en) * 2002-01-15 2006-08-01 Tribotek, Inc. Woven multiple-contact connectors
US6951465B2 (en) * 2002-01-15 2005-10-04 Tribotek, Inc. Multiple-contact woven power connectors
US7077662B2 (en) * 2002-01-15 2006-07-18 Tribotek, Inc. Contact woven connectors
JP4023166B2 (ja) * 2002-01-25 2007-12-19 ソニー株式会社 高周波モジュール用基板及び高周波モジュール
KR20040095297A (ko) * 2002-03-20 2004-11-12 니혼앗짜쿠단시세이소 가부시키가이샤 이방 도전 블럭 및 그 제조 방법
US7244127B2 (en) * 2002-03-20 2007-07-17 J.S.T. Mfg. Co., Ltd. Anisotropic conductive sheet and its manufacturing method
JPWO2003079495A1 (ja) * 2002-03-20 2005-07-21 日本圧着端子製造株式会社 柔軟性良導電層及びそれを用いた異方導電シート
ATE515078T1 (de) * 2003-01-17 2011-07-15 Jsr Corp Anisotroper leitfähiger verbinder und herstellungsverfahren dafür und untersuchungseinheit für eine schaltungseinrichtung
US8518304B1 (en) 2003-03-31 2013-08-27 The Research Foundation Of State University Of New York Nano-structure enhancements for anisotropic conductive material and thermal interposers
TWI239684B (en) * 2003-04-16 2005-09-11 Jsr Corp Anisotropic conductive connector and electric inspection device for circuit device
WO2005008703A1 (en) * 2003-07-11 2005-01-27 Tribotek, Inc. Multiple-contact woven electrical switches
US7097495B2 (en) * 2003-07-14 2006-08-29 Tribotek, Inc. System and methods for connecting electrical components
US7417197B2 (en) * 2003-09-19 2008-08-26 Medconx, Inc. Direct contact power transfer pad and method of making same
JP2005259475A (ja) * 2004-03-10 2005-09-22 Jst Mfg Co Ltd 異方導電性シート
US7130185B2 (en) * 2004-06-02 2006-10-31 Research In Motion Limited Handheld computing device having drop-resistant LCD display
US7140916B2 (en) * 2005-03-15 2006-11-28 Tribotek, Inc. Electrical connector having one or more electrical contact points
US7214106B2 (en) * 2005-07-18 2007-05-08 Tribotek, Inc. Electrical connector
US20070159753A1 (en) * 2006-01-09 2007-07-12 Randall Michael S System for EMI/RFI filtering and transient voltage suppression
TWI377624B (en) * 2008-05-13 2012-11-21 Ind Tech Res Inst Conducting film structure, fabrication method thereof, and conducting film type probe device for ic
TWI399812B (zh) * 2008-12-29 2013-06-21 Ind Tech Res Inst 導電膜結構及其製法與導電膜式積體電路針測裝置
CN102282637B (zh) * 2009-01-15 2014-02-12 日本小林株式会社 金属等网触点和开关及其制造方法
US8098079B2 (en) 2009-04-17 2012-01-17 Oracle America, Inc. Receive circuit for connectors with variable complex impedance
US8476749B2 (en) 2009-07-22 2013-07-02 Oracle America, Inc. High-bandwidth ramp-stack chip package
JP5931447B2 (ja) * 2012-01-11 2016-06-08 三菱航空機株式会社 航空機の窓、航空機、航空機の窓の組立方法。
JP5869147B2 (ja) * 2013-09-04 2016-02-24 オリンパス株式会社 超音波振動子の製造方法
US9435855B2 (en) 2013-11-19 2016-09-06 Teradyne, Inc. Interconnect for transmitting signals between a device and a tester
US9594114B2 (en) 2014-06-26 2017-03-14 Teradyne, Inc. Structure for transmitting signals in an application space between a device under test and test electronics
CN107689332B (zh) * 2014-10-15 2019-07-26 申宇慈 导线柱体集成体、功能性柱体及其集成体、以及功能性基板
KR20160046977A (ko) * 2014-10-20 2016-05-02 삼성디스플레이 주식회사 이방성 도전입자
US9977052B2 (en) 2016-10-04 2018-05-22 Teradyne, Inc. Test fixture
CN110582895B (zh) * 2017-05-18 2022-01-14 信越聚合物株式会社 电连接器及其制造方法
US10677815B2 (en) 2018-06-08 2020-06-09 Teradyne, Inc. Test system having distributed resources
US11363746B2 (en) 2019-09-06 2022-06-14 Teradyne, Inc. EMI shielding for a signal trace
US11862901B2 (en) 2020-12-15 2024-01-02 Teradyne, Inc. Interposer

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1289300B (de) * 1967-02-23 1969-02-13 Rost & Co H Gewebeeinlage fuer einen Foerdergurt oder Treibriemen
GB1387587A (en) * 1971-07-22 1975-03-19 Plessey Co Ltd Electrical interconnectors and connector assemblies
US3982320A (en) * 1975-02-05 1976-09-28 Technical Wire Products, Inc. Method of making electrically conductive connector
US4003621A (en) * 1975-06-16 1977-01-18 Technical Wire Products, Inc. Electrical connector employing conductive rectilinear elements
JPS5265892A (en) * 1975-11-26 1977-05-31 Shinetsu Polymer Co Nonnisotropic conductiveesheet type composite materials and method of manufacture thereof
JPS5915376B2 (ja) * 1977-10-18 1984-04-09 信越ポリマ−株式会社 電子回路部品
JPS5482699A (en) * 1977-12-15 1979-07-02 Shinetsu Polymer Co Pressure sensitive resistance element
JPS5555985U (da) * 1978-10-12 1980-04-16
US4252391A (en) * 1979-06-19 1981-02-24 Shin-Etsu Polymer Co., Ltd. Anisotropically pressure-sensitive electroconductive composite sheets and method for the preparation thereof
JPS568081U (da) * 1979-06-29 1981-01-23
JPS6038809B2 (ja) * 1979-11-20 1985-09-03 信越ポリマ−株式会社 異方導電性を有するエラスチツク構造体の製造方法
US4449774A (en) * 1981-02-05 1984-05-22 Shin-Etsu Polymer Co., Ltd. Electroconductive rubbery member and elastic connector therewith
NL8303447A (nl) * 1983-10-07 1985-05-01 Philips Nv Werkwijze voor het maken van meerlaags condensatoren.

Also Published As

Publication number Publication date
DK195987D0 (da) 1987-04-15
US4778950A (en) 1988-10-18
DE3787987T2 (de) 1994-05-19
EP0242303A2 (en) 1987-10-21
DE3787987D1 (de) 1993-12-09
EP0242303B1 (en) 1993-11-03
AU594141B2 (en) 1990-03-01
CA1277380C (en) 1990-12-04
FI871636A (fi) 1987-10-18
FI871636A0 (fi) 1987-04-14
JPH02830B2 (da) 1990-01-09
JPS6313287A (ja) 1988-01-20
AU7160087A (en) 1987-10-22
EP0242303A3 (en) 1989-10-18

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