DE69410204D1 - Vorrichtung zum Polieren des Umfangs eines Wafers - Google Patents

Vorrichtung zum Polieren des Umfangs eines Wafers

Info

Publication number
DE69410204D1
DE69410204D1 DE69410204T DE69410204T DE69410204D1 DE 69410204 D1 DE69410204 D1 DE 69410204D1 DE 69410204 T DE69410204 T DE 69410204T DE 69410204 T DE69410204 T DE 69410204T DE 69410204 D1 DE69410204 D1 DE 69410204D1
Authority
DE
Germany
Prior art keywords
polishing
wafer
circumference
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69410204T
Other languages
English (en)
Other versions
DE69410204T2 (de
Inventor
Fumihiko Hasegawa
Tatsuo Ohtani
Yasuyoshi Kuroda
Koichiro Ichikawa
Yasuo Inada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujikoshi Machinery Corp
Shin Etsu Handotai Co Ltd
Original Assignee
Fujikoshi Machinery Corp
Shin Etsu Handotai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikoshi Machinery Corp, Shin Etsu Handotai Co Ltd filed Critical Fujikoshi Machinery Corp
Publication of DE69410204D1 publication Critical patent/DE69410204D1/de
Application granted granted Critical
Publication of DE69410204T2 publication Critical patent/DE69410204T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/002—Machines or devices using grinding or polishing belts; Accessories therefor for grinding edges or bevels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/004—Machines or devices using grinding or polishing belts; Accessories therefor using abrasive rolled strips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D9/00—Wheels or drums supporting in exchangeable arrangement a layer of flexible abrasive material, e.g. sandpaper
    • B24D9/04—Rigid drums for carrying flexible material
    • B24D9/06—Rigid drums for carrying flexible material able to be stripped-off from a built-in delivery spool

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
DE69410204T 1993-09-30 1994-08-18 Vorrichtung zum Polieren des Umfangs eines Wafers Expired - Fee Related DE69410204T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5268096A JP2832138B2 (ja) 1993-09-30 1993-09-30 ウェーハ外周部の研磨装置

Publications (2)

Publication Number Publication Date
DE69410204D1 true DE69410204D1 (de) 1998-06-18
DE69410204T2 DE69410204T2 (de) 1999-02-11

Family

ID=17453841

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69410204T Expired - Fee Related DE69410204T2 (de) 1993-09-30 1994-08-18 Vorrichtung zum Polieren des Umfangs eines Wafers

Country Status (5)

Country Link
US (1) US5476413A (de)
EP (1) EP0646436B1 (de)
JP (1) JP2832138B2 (de)
DE (1) DE69410204T2 (de)
MY (1) MY111302A (de)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5938504A (en) * 1993-11-16 1999-08-17 Applied Materials, Inc. Substrate polishing apparatus
JPH0885051A (ja) * 1994-09-14 1996-04-02 Komatsu Electron Metals Co Ltd 半導体シリコン基板の面取り部研磨方法
JPH08168946A (ja) * 1994-12-13 1996-07-02 Shin Etsu Handotai Co Ltd ウェーハ外周部の研磨装置
TW303487B (de) * 1995-05-29 1997-04-21 Shinetsu Handotai Co Ltd
KR100189970B1 (ko) * 1995-08-07 1999-06-01 윤종용 웨이퍼 연마장치
US5928066A (en) * 1995-12-05 1999-07-27 Shin-Etsu Handotai Co., Ltd. Apparatus for polishing peripheral portion of wafer
US5861066A (en) * 1996-05-01 1999-01-19 Ontrak Systems, Inc. Method and apparatus for cleaning edges of contaminated substrates
JP3336866B2 (ja) * 1996-08-27 2002-10-21 信越半導体株式会社 気相成長用シリコン単結晶基板の製造方法
JP3620679B2 (ja) * 1996-08-27 2005-02-16 信越半導体株式会社 遊離砥粒によるウエーハの面取装置及び面取方法
US8092707B2 (en) 1997-04-30 2012-01-10 3M Innovative Properties Company Compositions and methods for modifying a surface suited for semiconductor fabrication
JPH11156684A (ja) * 1997-11-28 1999-06-15 Komatsu Koki Kk 半導体ウエハの鏡面加工装置
JPH11320363A (ja) * 1998-05-18 1999-11-24 Tokyo Seimitsu Co Ltd ウェーハ面取り装置
US6475070B1 (en) 1999-02-04 2002-11-05 Applied Materials, Inc. Chemical mechanical polishing with a moving polishing sheet
US6241583B1 (en) 1999-02-04 2001-06-05 Applied Materials, Inc. Chemical mechanical polishing with a plurality of polishing sheets
US6244935B1 (en) 1999-02-04 2001-06-12 Applied Materials, Inc. Apparatus and methods for chemical mechanical polishing with an advanceable polishing sheet
US6491570B1 (en) 1999-02-25 2002-12-10 Applied Materials, Inc. Polishing media stabilizer
US6135859A (en) * 1999-04-30 2000-10-24 Applied Materials, Inc. Chemical mechanical polishing with a polishing sheet and a support sheet
US6419554B2 (en) 1999-06-24 2002-07-16 Micron Technology, Inc. Fixed abrasive chemical-mechanical planarization of titanium nitride
US6685539B1 (en) 1999-08-24 2004-02-03 Ricoh Company, Ltd. Processing tool, method of producing tool, processing method and processing apparatus
US6626744B1 (en) 1999-12-17 2003-09-30 Applied Materials, Inc. Planarization system with multiple polishing pads
US6358851B1 (en) * 2000-04-04 2002-03-19 Taiwan Semiconductor Manufacturing Company Sputter PM procedures with polish tool to effectively remove metal defects from target surface nodules (residue)
JP2001308039A (ja) * 2000-04-25 2001-11-02 Speedfam Co Ltd 積層膜除去装置及びその使用方法
US6419559B1 (en) 2000-07-10 2002-07-16 Applied Materials, Inc. Using a purge gas in a chemical mechanical polishing apparatus with an incrementally advanceable polishing sheet
US6520841B2 (en) 2000-07-10 2003-02-18 Applied Materials, Inc. Apparatus and methods for chemical mechanical polishing with an incrementally advanceable polishing sheet
US6561884B1 (en) * 2000-08-29 2003-05-13 Applied Materials, Inc. Web lift system for chemical mechanical planarization
US6592439B1 (en) 2000-11-10 2003-07-15 Applied Materials, Inc. Platen for retaining polishing material
US6503131B1 (en) 2001-08-16 2003-01-07 Applied Materials, Inc. Integrated platen assembly for a chemical mechanical planarization system
US7115023B1 (en) * 2005-06-29 2006-10-03 Lam Research Corporation Process tape for cleaning or processing the edge of a semiconductor wafer
JP5147417B2 (ja) * 2008-01-08 2013-02-20 株式会社ディスコ ウェーハの研磨方法および研磨装置
DE102009030294B4 (de) * 2009-06-24 2013-04-25 Siltronic Ag Verfahren zur Politur der Kante einer Halbleiterscheibe
US9857680B2 (en) * 2014-01-14 2018-01-02 Taiwan Semiconductor Manufacturing Company, Ltd. Cleaning module, cleaning apparatus and method of cleaning photomask
CN106670938A (zh) * 2015-11-10 2017-05-17 有研半导体材料有限公司 一种硅片边缘抛光装置
USD834075S1 (en) 2016-08-05 2018-11-20 Ebara Corporation Pressing member for substrate polishing apparatus
CN117655898A (zh) * 2023-12-07 2024-03-08 佛山市顺德区顺崇机械制造有限公司 一种靶材侧边自动抛光装置及其使用方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2258733A (en) * 1940-08-30 1941-10-14 Gen Motors Corp Sanding machine
US3806956A (en) * 1970-06-19 1974-04-30 Norton Co Process for using coated abrasive products
JPS5114718U (de) * 1974-07-22 1976-02-03
FR2321981A1 (fr) * 1975-08-26 1977-03-25 Emain Jean Perfectionnement aux roues de polissage
JPS5925443B2 (ja) * 1976-08-31 1984-06-18 東洋紡績株式会社 レ−ザ光による加撚走行糸条の撚角測定法
JPS57184662A (en) * 1981-05-09 1982-11-13 Hitachi Ltd Chamfering method and device of wafer
JPH01101758U (de) * 1987-12-28 1989-07-10
US5148639A (en) * 1988-07-29 1992-09-22 Canon Kabushiki Kaisha Surface roughening method for organic electrophotographic photosensitive member
US5117590A (en) * 1988-08-12 1992-06-02 Shin-Etsu Handotai Co., Ltd. Method of automatically chamfering a wafer and apparatus therefor
US5209027A (en) * 1989-10-13 1993-05-11 Tdk Corporation Polishing of the rear surface of a stamper for optical disk reproduction
JP2571477B2 (ja) * 1991-06-12 1997-01-16 信越半導体株式会社 ウエーハのノッチ部面取り装置
US5185965A (en) * 1991-07-12 1993-02-16 Daito Shoji Co., Ltd. Method and apparatus for grinding notches of semiconductor wafer
JPH0590234A (ja) * 1991-09-30 1993-04-09 Emutetsuku Kk 半導体ウエーハの端面研摩方法及び装置
JP2559650B2 (ja) * 1991-11-27 1996-12-04 信越半導体株式会社 ウエーハ面取部研磨装置
JP2628424B2 (ja) * 1992-01-24 1997-07-09 信越半導体株式会社 ウエーハ面取部の研磨方法及び装置

Also Published As

Publication number Publication date
US5476413A (en) 1995-12-19
JPH07100748A (ja) 1995-04-18
EP0646436B1 (de) 1998-05-13
MY111302A (en) 1999-10-30
EP0646436A1 (de) 1995-04-05
DE69410204T2 (de) 1999-02-11
JP2832138B2 (ja) 1998-12-02

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee