DE60301389D1 - Verbesserter schnittstellenklebstoff - Google Patents

Verbesserter schnittstellenklebstoff

Info

Publication number
DE60301389D1
DE60301389D1 DE60301389T DE60301389T DE60301389D1 DE 60301389 D1 DE60301389 D1 DE 60301389D1 DE 60301389 T DE60301389 T DE 60301389T DE 60301389 T DE60301389 T DE 60301389T DE 60301389 D1 DE60301389 D1 DE 60301389D1
Authority
DE
Germany
Prior art keywords
improved interface
interface adhesive
adhesive
improved
interface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60301389T
Other languages
English (en)
Other versions
DE60301389T2 (de
Inventor
B Wilson
H Hogan
L Owen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lord Corp
Original Assignee
Lord Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lord Corp filed Critical Lord Corp
Application granted granted Critical
Publication of DE60301389D1 publication Critical patent/DE60301389D1/de
Publication of DE60301389T2 publication Critical patent/DE60301389T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/54—Amino amides>
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/54—Inorganic substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Die Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE60301389T 2002-06-28 2003-06-19 Verbesserter schnittstellenklebstoff Expired - Lifetime DE60301389T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US184690 2002-06-28
US10/184,690 US6888257B2 (en) 2002-06-28 2002-06-28 Interface adhesive
PCT/US2003/019477 WO2004003066A1 (en) 2002-06-28 2003-06-19 Improved interface adhesive

Publications (2)

Publication Number Publication Date
DE60301389D1 true DE60301389D1 (de) 2005-09-29
DE60301389T2 DE60301389T2 (de) 2006-06-22

Family

ID=29779423

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60301389T Expired - Lifetime DE60301389T2 (de) 2002-06-28 2003-06-19 Verbesserter schnittstellenklebstoff

Country Status (6)

Country Link
US (1) US6888257B2 (de)
EP (1) EP1470181B1 (de)
JP (1) JP4611736B2 (de)
DE (1) DE60301389T2 (de)
TW (1) TWI258493B (de)
WO (1) WO2004003066A1 (de)

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US20070241303A1 (en) * 1999-08-31 2007-10-18 General Electric Company Thermally conductive composition and method for preparing the same
US7976941B2 (en) * 1999-08-31 2011-07-12 Momentive Performance Materials Inc. Boron nitride particles of spherical geometry and process for making thereof
JP2004063672A (ja) * 2002-07-26 2004-02-26 Oki Electric Ind Co Ltd 有機絶縁膜の形成方法、及び半導体装置の製造方法
US7058032B2 (en) * 2002-12-20 2006-06-06 Interdigital Technology Scheduling data transmission by medium access control (MAC) layer in a mobile network
US7034403B2 (en) * 2003-04-10 2006-04-25 3M Innovative Properties Company Durable electronic assembly with conductive adhesive
WO2004094550A1 (en) * 2003-04-10 2004-11-04 3M Innovative Properties Company Heat-activatable adhesive
US6979899B2 (en) * 2003-12-31 2005-12-27 Texas Instruments Incorported System and method for high performance heat sink for multiple chip devices
US20050277721A1 (en) * 2004-06-15 2005-12-15 Siemens Westinghouse Power Corporation High thermal conductivity materials aligned within resins
CN100549090C (zh) * 2004-07-09 2009-10-14 亨斯迈先进材料（瑞士）有限公司 胺组合物
US20090053850A1 (en) * 2005-03-25 2009-02-26 Fujifilm Corporation Method of manufacturing solid state imaging device
US20080039555A1 (en) * 2006-08-10 2008-02-14 Michel Ruyters Thermally conductive material
WO2008030910A1 (en) * 2006-09-08 2008-03-13 Lord Corporation Flexible microelectronics adhesive
US20080191729A1 (en) * 2007-02-09 2008-08-14 Richard Lidio Blanco Thermal interface for electronic chip testing
CN101245227B (zh) * 2007-02-13 2010-09-08 核工业第八研究所 一种led用环氧导电银胶及其制造方法
EP2139629B1 (de) * 2007-03-26 2018-09-05 LORD Corporation Verfahren zur herstellung heterogener verbundwerkstoffen
US20080237843A1 (en) * 2007-03-27 2008-10-02 Ashish Gupta Microelectronic package including thermally conductive sealant between heat spreader and substrate
TWI456707B (zh) * 2008-01-28 2014-10-11 Renesas Electronics Corp 半導體裝置及其製造方法
US7906373B1 (en) * 2008-03-26 2011-03-15 Pawel Czubarow Thermally enhanced electrically insulative adhesive paste
WO2010144770A1 (en) * 2009-06-12 2010-12-16 Lord Corporation Method for shielding a substrate from electromagnetic interference
KR101563042B1 (ko) * 2009-10-27 2015-10-23 헨켈 아이피 앤드 홀딩 게엠베하 에폭시화 너트쉘 오일을 포함하는 열전재
TWI475103B (zh) * 2009-12-15 2015-03-01 Ind Tech Res Inst 散熱結構
US9554422B2 (en) * 2011-05-17 2017-01-24 Canon U.S. Life Sciences, Inc. Systems and methods using external heater systems in microfluidic devices
US8492961B2 (en) 2011-09-19 2013-07-23 Osram Sylvania Inc. Heat sink assembly
US9200184B2 (en) * 2012-05-17 2015-12-01 Henkel IP & Holding GmbH Chain extended epoxy to improve adhesion of conductive die attach film
JP6333576B2 (ja) * 2013-03-01 2018-05-30 京セラ株式会社 熱硬化性樹脂組成物、半導体装置及び電気・電子部品
CN103665325A (zh) * 2013-11-25 2014-03-26 苏州宏泉高压电容器有限公司 环氧树脂及其制备方法
JP6418741B2 (ja) * 2014-01-16 2018-11-07 ソマール株式会社 液状エポキシ樹脂組成物及びこれを用いた接着剤
CN104673160A (zh) * 2014-06-30 2015-06-03 广东丹邦科技有限公司 填充表面改性碳化硅各向同性导热胶黏剂及制备方法
WO2016121806A1 (ja) * 2015-01-29 2016-08-04 住友ベークライト株式会社 ペースト状接着剤組成物、半導体装置、半導体装置の製造方法、および放熱板の接着方法
CN106009530B (zh) * 2016-06-27 2018-09-28 深圳先进技术研究院 氮化硼-银杂化粒子/环氧树脂复合材料及其制备方法
WO2020158259A1 (ja) * 2019-02-01 2020-08-06 富士フイルム株式会社 熱伝導材料形成用組成物、熱伝導材料
TWI742440B (zh) * 2019-10-02 2021-10-11 財團法人工業技術研究院 導電組成物及微型發光二極體顯示裝置的製造方法
KR20220119031A (ko) * 2019-12-19 2022-08-26 헨켈 아게 운트 코. 카게아아 반응성 희석제를 갖는 실리콘 무함유 열 계면 물질

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Also Published As

Publication number Publication date
JP2005531667A (ja) 2005-10-20
WO2004003066A1 (en) 2004-01-08
TWI258493B (en) 2006-07-21
DE60301389T2 (de) 2006-06-22
EP1470181A1 (de) 2004-10-27
US6888257B2 (en) 2005-05-03
US20040000712A1 (en) 2004-01-01
EP1470181B1 (de) 2005-08-24
JP4611736B2 (ja) 2011-01-12
TW200401801A (en) 2004-02-01

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Legal Events

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