DE602006002900D1 - Wässrige Dispersion zum chemisch-mechanischen Polieren, Kit zu deren Herstellung und chemisch-mechanisches Polierverfahren - Google Patents

Wässrige Dispersion zum chemisch-mechanischen Polieren, Kit zu deren Herstellung und chemisch-mechanisches Polierverfahren

Info

Publication number
DE602006002900D1
DE602006002900D1 DE602006002900T DE602006002900T DE602006002900D1 DE 602006002900 D1 DE602006002900 D1 DE 602006002900D1 DE 602006002900 T DE602006002900 T DE 602006002900T DE 602006002900 T DE602006002900 T DE 602006002900T DE 602006002900 D1 DE602006002900 D1 DE 602006002900D1
Authority
DE
Germany
Prior art keywords
mechanical polishing
chemical
kit
preparation
aqueous dispersion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602006002900T
Other languages
English (en)
Inventor
Kazuhito Uchikura
Masayuki Hattori
Nobuo Kawahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JSR Corp
Original Assignee
JSR Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JSR Corp filed Critical JSR Corp
Publication of DE602006002900D1 publication Critical patent/DE602006002900D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/32115—Planarisation
    • H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
    • A—HUMAN NECESSITIES
    • A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
    • A47K—SANITARY EQUIPMENT NOT OTHERWISE PROVIDED FOR; TOILET ACCESSORIES
    • A47K1/00—Wash-stands; Appurtenances therefor
    • A47K1/08—Accessories for toilet tables, e.g. glass plates, supports therefor
    • A47K1/09—Holders for drinking glasses, tooth brushes, hair brushes, or the like
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • A—HUMAN NECESSITIES
    • A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
    • A47K—SANITARY EQUIPMENT NOT OTHERWISE PROVIDED FOR; TOILET ACCESSORIES
    • A47K2201/00—Details of connections of bathroom accessories, e.g. fixing soap or towel holder to a wall
    • A47K2201/02—Connections to a wall mounted support

Landscapes

  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Organic Chemistry (AREA)
  • Dentistry (AREA)
  • Public Health (AREA)
  • General Health & Medical Sciences (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
DE602006002900T 2005-03-09 2006-03-07 Wässrige Dispersion zum chemisch-mechanischen Polieren, Kit zu deren Herstellung und chemisch-mechanisches Polierverfahren Active DE602006002900D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005064754 2005-03-09

Publications (1)

Publication Number Publication Date
DE602006002900D1 true DE602006002900D1 (de) 2008-11-13

Family

ID=36581675

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602006002900T Active DE602006002900D1 (de) 2005-03-09 2006-03-07 Wässrige Dispersion zum chemisch-mechanischen Polieren, Kit zu deren Herstellung und chemisch-mechanisches Polierverfahren

Country Status (6)

Country Link
US (1) US20060201914A1 (de)
EP (1) EP1700893B1 (de)
KR (1) KR101248708B1 (de)
CN (1) CN1831076A (de)
DE (1) DE602006002900D1 (de)
TW (1) TWI387642B (de)

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WO2007116770A1 (ja) * 2006-04-03 2007-10-18 Jsr Corporation 化学機械研磨用水系分散体および化学機械研磨方法、ならびに化学機械研磨用水系分散体を調製するためのキット
JP5013732B2 (ja) * 2006-04-03 2012-08-29 Ｊｓｒ株式会社 化学機械研磨用水系分散体、化学機械研磨方法、化学機械研磨用キット、および化学機械研磨用水系分散体を調製するためのキット
US7824568B2 (en) * 2006-08-17 2010-11-02 International Business Machines Corporation Solution for forming polishing slurry, polishing slurry and related methods
EP2090400A4 (de) * 2006-09-15 2010-11-03 Hitachi Chemical Co Ltd Mittel zum chemisch-mechanischen polieren (cmp), additivlösung für die cmp-poliermittel und verfahren zum polieren eines substrats durch verwendung des poliermittels und der additivlösung
CN101490814A (zh) * 2006-10-06 2009-07-22 Jsr株式会社 化学机械研磨用水系分散体及半导体装置的化学机械研磨方法
JP2008117807A (ja) * 2006-10-31 2008-05-22 Fujimi Inc 研磨用組成物及び研磨方法
JP4614981B2 (ja) * 2007-03-22 2011-01-19 Ｊｓｒ株式会社 化学機械研磨用水系分散体および半導体装置の化学機械研磨方法
US8349207B2 (en) * 2007-03-26 2013-01-08 Jsr Corporation Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method for semiconductor device
JP5327427B2 (ja) * 2007-06-19 2013-10-30 Ｊｓｒ株式会社 化学機械研磨用水系分散体調製用セット、化学機械研磨用水系分散体の調製方法、化学機械研磨用水系分散体および化学機械研磨方法
WO2008156054A1 (ja) * 2007-06-20 2008-12-24 Asahi Glass Co., Ltd. 研磨用組成物および半導体集積回路装置の製造方法
CN102352187B (zh) * 2007-07-05 2015-03-18 日立化成株式会社 金属膜用研磨液及研磨方法
JPWO2009031389A1 (ja) * 2007-09-03 2010-12-09 Jsr株式会社 化学機械研磨用水系分散体およびその調製方法、化学機械研磨用水系分散体を調製するためのキット、ならびに半導体装置の化学機械研磨方法
KR100970094B1 (ko) * 2007-10-10 2010-07-16 제일모직주식회사 구리 배선 연마용 ｃｍｐ 슬러리 조성물 및 이를 이용한연마 방법
US8506359B2 (en) * 2008-02-06 2013-08-13 Jsr Corporation Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method
KR101461261B1 (ko) * 2008-02-18 2014-11-12 제이에스알 가부시끼가이샤 화학 기계 연마용 수계 분산체 및 화학 기계 연마 방법
WO2009104517A1 (ja) * 2008-02-18 2009-08-27 Jsr株式会社 化学機械研磨用水系分散体および化学機械研磨方法
JP5207002B2 (ja) * 2008-02-27 2013-06-12 Ｊｓｒ株式会社 化学機械研磨用水系分散体およびそれを用いた化学機械研磨方法、化学機械研磨用水系分散体の再生方法
JP5472585B2 (ja) 2008-05-22 2014-04-16 Ｊｓｒ株式会社 化学機械研磨用水系分散体および化学機械研磨方法
JP5361306B2 (ja) * 2008-09-19 2013-12-04 Ｊｓｒ株式会社 化学機械研磨用水系分散体および化学機械研磨方法
CN101724347A (zh) * 2008-10-10 2010-06-09 安集微电子（上海）有限公司 一种化学机械抛光液
US8480920B2 (en) * 2009-04-02 2013-07-09 Jsr Corporation Chemical mechanical polishing aqueous dispersion, method of preparing the same, chemical mechanical polishing aqueous dispersion preparation kit, and chemical mechanical polishing method
US8192644B2 (en) 2009-10-16 2012-06-05 Fujifilm Planar Solutions, LLC Highly dilutable polishing concentrates and slurries
CN101993662B (zh) * 2010-12-13 2012-11-07 西安北方捷瑞光电科技有限公司 一种铈基抛光粉悬浮液的制备方法
KR101340550B1 (ko) * 2010-12-31 2013-12-11 제일모직주식회사 화학기계적연마 조성물 및 연마 방법
CN103146306B (zh) * 2011-12-07 2016-12-28 安集微电子（上海）有限公司 一种tsv阻挡层抛光液
CN103173127B (zh) * 2011-12-23 2016-11-23 安集微电子（上海）有限公司 一种用于硅通孔阻挡层平坦化的化学机械抛光液
US9358659B2 (en) 2013-03-04 2016-06-07 Cabot Microelectronics Corporation Composition and method for polishing glass
CN106796878B (zh) * 2014-11-13 2021-02-09 三菱瓦斯化学株式会社 抑制了包含钨的材料的损伤的半导体元件的清洗液、及使用其的半导体元件的清洗方法
US10507563B2 (en) 2015-04-22 2019-12-17 Jsr Corporation Treatment composition for chemical mechanical polishing, chemical mechanical polishing method, and cleaning method
KR102699885B1 (ko) * 2016-12-01 2024-08-29 솔브레인 주식회사 화학적 기계적 연마를 위한 슬러리 조성물 및 이를 이용한 연마 방법
CN114829538B (zh) * 2019-12-26 2024-04-26 霓达杜邦股份有限公司 研磨用浆料

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JP4866503B2 (ja) * 1998-12-28 2012-02-01 日立化成工業株式会社 金属用研磨液材料及び金属用研磨液
JP3736249B2 (ja) 2000-01-12 2006-01-18 Ｊｓｒ株式会社 半導体装置の製造に用いる化学機械研磨用水系分散体
JP2002050595A (ja) * 2000-08-04 2002-02-15 Hitachi Ltd 研磨方法、配線形成方法及び半導体装置の製造方法
JP3768401B2 (ja) * 2000-11-24 2006-04-19 Ｎｅｃエレクトロニクス株式会社 化学的機械的研磨用スラリー
US6568997B2 (en) * 2001-04-05 2003-05-27 Rodel Holdings, Inc. CMP polishing composition for semiconductor devices containing organic polymer particles
JP2004533115A (ja) * 2001-04-12 2004-10-28 ロデール　ホールディングス　インコーポレイテッド 界面活性剤を有する研磨用組成物
JP5017574B2 (ja) * 2001-05-25 2012-09-05 エア プロダクツ アンド ケミカルズ インコーポレイテッド 酸化セリウム研磨剤及び基板の製造方法
US7279119B2 (en) * 2001-06-14 2007-10-09 Ppg Industries Ohio, Inc. Silica and silica-based slurry
US6821897B2 (en) * 2001-12-05 2004-11-23 Cabot Microelectronics Corporation Method for copper CMP using polymeric complexing agents
US20040162011A1 (en) * 2002-08-02 2004-08-19 Jsr Corporation Aqueous dispersion for chemical mechanical polishing and production process of semiconductor device
KR100891612B1 (ko) * 2002-12-20 2009-04-08 주식회사 동진쎄미켐 구리 배선 공정에 대한 연마 효율 및 선택비가 우수한화학-기계적 연마 슬러리 조성물
TWI291987B (en) * 2003-07-04 2008-01-01 Jsr Corp Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method
US7419911B2 (en) * 2003-11-10 2008-09-02 Ekc Technology, Inc. Compositions and methods for rapidly removing overfilled substrates

Also Published As

Publication number Publication date
TW200643156A (en) 2006-12-16
CN1831076A (zh) 2006-09-13
EP1700893A1 (de) 2006-09-13
KR20060097633A (ko) 2006-09-14
TWI387642B (zh) 2013-03-01
EP1700893B1 (de) 2008-10-01
US20060201914A1 (en) 2006-09-14
KR101248708B1 (ko) 2013-03-28

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